Touch layer structure and manufacturing method

Abstract

A touch layer structure includes a first conductive layer, a first patterned layer, a second patterned layer, a second conductive layer, an adhesive layer, and a transparent panel. The first conductive layer has a first pattern. The first patterned layer is formed with a second pattern complementary to the first pattern. The second patterned layer is formed with a third pattern on at least one of the first conductive layer and the first patterned layer, and does not completely obscure the first conductive layer. The second conductive layer is formed with a fourth pattern complementary to the third pattern on at least one of the first conductive layer and the first patterned layer. The second conductive layer is at least partially in contact with the first conductive layer. This touch layer structure can have a very thin thickness and can realize a three-dimensional sensing circuit configuration and a patterned appearance.

Description

Technical Field

[0001] This invention relates to a touch layer structure, and more particularly to a touch layer structure comprising a first conductive layer and a second conductive layer and its manufacturing method. Background Technology

[0002] Electronic products with touch functionality allow users to operate them by touching or pressing with their fingers. The touch area needs to be equipped with sensing circuitry to realize the sensing and transmission of touch signals.

[0003] Taiwan's TW I711957B discloses a touch-sensitive decorative film comprising a decorative layer, a printed layer, a touch-sensitive layer, and an adhesive layer. The printed layer is independently formed on the decorative layer to produce a patterned appearance, and the touch-sensitive layer is independently formed to achieve the touch-sensitive function. Therefore, the thickness of this touch-sensitive decorative film is difficult to further reduce, and it is difficult to achieve a three-dimensional sensing circuit configuration. Summary of the Invention

[0004] The primary objective of this invention is to provide a touch layer structure that overcomes the shortcomings of the aforementioned background technology.

[0005] The touch layer structure of the present invention includes a first conductive layer, a first pattern layer, a second pattern layer, a second conductive layer, an adhesive layer, and a transparent panel. The first conductive layer has a first pattern. The first conductive layer is formed of conductive ink. The first pattern layer is formed with a second pattern complementary to the first pattern and is located on the same plane as the first conductive layer. The first pattern layer is formed of UV-curable ink. The second pattern layer is formed with a third pattern on at least one of the first conductive layer and the first pattern layer, and does not completely obscure the first conductive layer. The second pattern layer is formed of UV-curable ink. The second conductive layer is formed with a fourth pattern complementary to the third pattern on at least one of the first conductive layer and the first pattern layer, and is located on the same plane as the second pattern layer. The second conductive layer is at least partially in contact with the first conductive layer and is formed of conductive ink. The adhesive layer is located on the second pattern layer and the second conductive layer and is formed of conductive adhesive. The transparent panel is attached to the adhesive layer.

[0006] The touch layer structure of the present invention includes a conductive ink comprising a UV-curable coating and a conductive material, wherein the conductive material is selected from conductive carbon materials, metal powders, conductive polymers or combinations thereof.

[0007] The touch layer structure of the present invention includes a conductive adhesive comprising a UV-curable adhesive and a conductive material, wherein the conductive material is selected from conductive carbon materials, metal powders, conductive polymers or combinations thereof.

[0008] In the touch layer structure of the present invention, the adhesive layer is formed on the second pattern layer and the second conductive layer.

[0009] The touch layer structure of the present invention uses a transparent panel made of polycarbonate, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate or a combination thereof.

[0010] The second objective of this invention is to provide a method for manufacturing a touch layer structure, comprising the following steps:

[0011] (a) A first conductive layer formed of conductive ink is formed on a thin film substrate layer in a first pattern.

[0012] (b) A first pattern layer formed of UV-curable ink is formed on the thin film substrate layer with a second pattern complementary to the first pattern, the first pattern layer being located on the same plane as the first conductive layer.

[0013] (c) A second pattern layer formed of UV-curable ink is formed on at least one of the first conductive layer and the first pattern layer with a third pattern, the second pattern layer not completely obscuring the first conductive layer.

[0014] (d) A second conductive layer formed of conductive ink is formed on at least one of the first conductive layer and the first pattern layer with a fourth pattern complementary to the third pattern, the second conductive layer and the second pattern layer being located on the same plane, and the second conductive layer being at least partially in contact with the first conductive layer.

[0015] (e) An adhesive layer formed of conductive adhesive is formed above the second patterned layer and the second conductive layer.

[0016] (f) A transparent panel is attached to the adhesive layer.

[0017] (g) Irradiate the first conductive layer, the first patterned layer, the second patterned layer, the second conductive layer, and the adhesive layer with ultraviolet light.

[0018] (h) Remove the thin film substrate layer from the first conductive layer and the first pattern layer to obtain the touch layer structure.

[0019] In the method for manufacturing the touch layer structure of the present invention, in step (e), the adhesive layer is formed on the second pattern layer and the second conductive layer.

[0020] The method for manufacturing the touch layer structure of the present invention further includes step (f′): prior to step (f), a plurality of perforations penetrating the transparent panel are formed inside the transparent panel by laser, and a groove connecting at least two perforations is formed on the surface of the transparent panel by laser.

[0021] The method for manufacturing the touch layer structure of the present invention further includes step (i): after step (f′), forming a conductive element in the groove to connect the at least two through holes.

[0022] The method for manufacturing the touch layer structure of the present invention wherein the material of the thin film substrate layer is selected from polyvinyl alcohol, acrylonitrile-butadiene-styrene copolymer, nylon, polymethylpentene, polyethylene terephthalate, polybutylene terephthalate, polyvinylpyrrolidone, polyethylene, polypropylene, or combinations thereof.

[0023] The beneficial effects of the present invention are that the touch layer structure can have a very thin thickness and can realize a three-dimensional sensing circuit configuration and a patterned appearance. Attached Figure Description

[0024] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:

[0025] Figure 1 This is a cross-sectional schematic diagram illustrating the steps (a) of the manufacturing method of the first embodiment of the touch layer structure of the present invention;

[0026] Figure 2 This is a cross-sectional schematic diagram illustrating step (b) of the manufacturing method of the first embodiment;

[0027] Figure 3 This is a cross-sectional schematic diagram illustrating step (c) of the manufacturing method of the first embodiment;

[0028] Figure 4 This is a cross-sectional schematic diagram illustrating step (d) of the manufacturing method of the first embodiment;

[0029] Figure 5 This is a cross-sectional schematic diagram illustrating the steps (e) of the manufacturing method of the first embodiment;

[0030] Figure 6 This is a cross-sectional schematic diagram illustrating the steps (f) of the manufacturing method of the first embodiment;

[0031] Figure 7 This is a cross-sectional schematic diagram illustrating the steps (h) of the manufacturing method of the first embodiment;

[0032] Figure 8 This is a cross-sectional schematic diagram illustrating the steps (f′) of manufacturing a second embodiment of the touch layer structure of the present invention; and

[0033] Figure 9 This is a cross-sectional schematic diagram illustrating the steps (i) of the manufacturing method of the second embodiment. Detailed Implementation

[0034] Before the invention is described in detail, it should be noted that similar elements are represented by the same numbers in the following description.

[0035] The present invention will be further described with reference to the following embodiments, but it should be understood that the embodiments are for illustrative purposes only and should not be construed as limiting the implementation of the present invention.

[0036] The method for manufacturing the touch layer structure according to the first embodiment of the present invention includes the following steps:

[0037] Step (a): See Figure 1 A first conductive layer 2, consisting of conductive ink [containing UV-curable coating (WA-Clear gold oil produced by Daqin Chemical Co., Ltd.) and conductive material (silver powder)], is formed on a thin film substrate layer 1 by printing a first pattern 20. The material of the thin film substrate layer 1 can be polyvinyl alcohol (PVA), acrylonitrile-butadiene-styrene copolymer (ABS), nylon, polymethylpentene (PMP), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyvinylpyrrolidone (PVP), polyethylene (PE), polypropylene (PP), or a combination thereof. In this embodiment, the material of the thin film substrate layer 1 is polyvinyl alcohol (PVA). The conductive material can be conductive carbon material (e.g., carbon black, carbon nanotubes), metal powder (e.g., silver powder, copper powder), conductive polymer (e.g., PEDOT), or a combination thereof.

[0038] Step (b): See Figure 2 A first pattern layer 3, formed of UV-curable ink (WA-K ink produced by Daqin Chemical Co., Ltd.), is printed on the thin film substrate layer 1 with a second pattern 30 complementary to the first pattern 20. The first pattern layer 3 and the first conductive layer 2 are located on the same plane. In a specific embodiment, the first pattern layer 3 is formed on the thin film substrate layer 1 in stages by various UV-curable inks (such as WA-K, WA-C, WA-M, and WA-Y inks produced by Daqin Chemical Co., Ltd.) (not shown in the figure).

[0039] Step (c): See Figure 3A second pattern layer 4, formed of UV-curable ink (WA-C ink produced by Daqin Chemical Co., Ltd.), is printed on at least one of the first conductive layer 2 and the first pattern layer 3 using a third pattern 40. This second pattern layer 4 does not completely obscure the first conductive layer 2. In this embodiment, the second pattern layer 4 is formed on a portion of the first conductive layer 2 and a portion of the first pattern layer 3. In a specific embodiment, the second pattern layer 4 is formed in stages on a portion of the first conductive layer 2 and a portion of the first pattern layer 3 using various UV-curable inks (such as WA-K, WA-C, WA-M, and WA-Y inks produced by Daqin Chemical Co., Ltd.) (not shown in the figures).

[0040] Step (d): See Figure 4 A second conductive layer 5 is formed on at least one of the first conductive layer 2 and the first pattern layer 3 by printing a fourth pattern 50 complementary to the third pattern 40. The second conductive layer 5 is formed of conductive ink [containing UV-curable coating (WA-Clear gold oil) and conductive material (silver powder)]. The second conductive layer 5 is located on the same plane as the second pattern layer 4, and the second conductive layer 5 is at least in contact with the first conductive layer 2.

[0041] Step (e): See Figure 5 An adhesive layer 6 is formed on the second patterned layer 4 and the second conductive layer 5, consisting of a conductive adhesive [containing a UV-curable adhesive (UE010 adhesive produced by Daqin Chemical Co., Ltd.) and a conductive material (silver powder)]. The conductive material may be a conductive carbon material (e.g., carbon black, carbon nanotubes), a metal powder (e.g., silver powder, copper powder), a conductive polymer (e.g., PEDOT), or a combination thereof.

[0042] Step (f): See Figure 6 A transparent panel 7 is then attached to the adhesive layer 6 to obtain the touch layer structure. The transparent panel 7 may be made of polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), or a combination thereof.

[0043] Step (g): Irradiate the first conductive layer 2, the first patterned layer 3, the second patterned layer 4, the second conductive layer 5 and the adhesive layer 6 with ultraviolet light to cure them.

[0044] Step (h): See Figure 7 The thin film substrate layer 1 is removed from the first conductive layer 2 and the first pattern layer 3 to obtain the touch layer structure of the first embodiment.

[0045] See Figure 7The touch layer structure of the first embodiment includes a first conductive layer 2, a first pattern layer 3, a second pattern layer 4, a second conductive layer 5, an adhesive layer 6, and a transparent panel 7.

[0046] The first conductive layer 2 has a first pattern 20 and is formed by conductive ink [containing UV-curable coating (WA-Clear gold oil) and conductive material (silver powder)].

[0047] The first pattern layer 3 is formed on the thin film substrate layer 1 with a second pattern 30 complementary to the first pattern 20, and is located on the same plane as the first conductive layer 2. The first pattern layer 3 is formed with UV-curable ink (WA-K ink).

[0048] The second pattern layer 4 is formed on at least one of the first conductive layer 2 and the first pattern layer 3 with a third pattern 40, and does not completely cover the first conductive layer 2. The second pattern layer 4 is formed of UV-curable ink (WA-C ink). In this embodiment, the second pattern layer 4 is formed on a portion of the first conductive layer 2 and a portion of the first pattern layer 3.

[0049] The second conductive layer 5 is formed on at least one of the first conductive layer 2 and the first pattern layer 3 with a fourth pattern 50 complementary to the third pattern 40, and is located on the same plane as the second pattern layer 4. The second conductive layer 5 is at least partially in contact with the first conductive layer 2, and is formed of conductive ink [containing UV-curable coating (WA-Clear gold oil) and conductive material (silver powder)].

[0050] The adhesive layer 6 is formed on the second pattern layer 4 and the second conductive layer 5, and is formed by conductive adhesive [containing UV-curable adhesive (UE010 adhesive) and conductive material (silver powder)].

[0051] The transparent panel 7 is attached to the adhesive layer 6. In this embodiment, the transparent panel 7 is a polycarbonate transparent panel 7.

[0052] The method for manufacturing the touch layer structure according to the second embodiment of the present invention includes all the steps of the first embodiment described above, and further includes the following steps:

[0053] Step (f′): See Figure 8 Prior to step (f), a plurality of perforations 8 penetrating the transparent panel 7 are formed inside the transparent panel 7 by laser, and a groove 71 connecting at least two perforations 8 is formed on the surface of the transparent panel 7 by laser.

[0054] Step (i): See Figure 9Following this step (f′), a conductive element 9 is formed in the groove 71 to connect the at least two through holes 8. In this embodiment, the conductive element 9 is a three-dimensional printing conductor.

[0055] In summary, the touch layer structure of the present invention can have a very thin thickness, and a three-dimensional sensing circuit configuration and patterned appearance can be achieved through the first pattern layer 3, the first conductive layer 2, the second conductive layer 5 and the second pattern layer 4, so the purpose of the present invention can indeed be achieved.

[0056] The above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the present invention shall still fall within the scope of the present invention.

Claims

1. A touch layer structure, characterized in that: The touch layer structure includes: A first conductive layer having a first pattern is formed of conductive ink; A first patterned layer is formed with a second pattern complementary to the first pattern and located on the same plane as the first conductive layer, and is formed with a UV-curable ink; A second patterned layer is formed on at least one of the first conductive layer and the first patterned layer with a third pattern, and does not completely cover the first conductive layer, and is formed by UV-curable ink; A second conductive layer is formed on at least one of the first conductive layer and the first pattern layer with a fourth pattern complementary to the third pattern, and is located on the same plane as the second pattern layer. The second conductive layer is at least partially in contact with the first conductive layer and is formed of conductive ink. An adhesive layer, located on the second patterned layer and the second conductive layer, and formed of conductive adhesive; and A transparent panel is attached to the adhesive layer.

2. The touch layer structure according to claim 1, characterized in that: The conductive ink includes a UV-curable coating and a conductive material, wherein the conductive material is selected from conductive carbon materials, metal powders, conductive polymers, or combinations thereof.

3. The touch layer structure according to claim 1, characterized in that: The conductive adhesive includes a UV-curable adhesive and a conductive material, which is selected from conductive carbon materials, metal powders, conductive polymers, or combinations thereof.

4. The touch layer structure according to claim 1, characterized in that: The adhesive layer is formed on the second patterned layer and the second conductive layer.

5. The touch layer structure according to claim 1, characterized in that: The material of the transparent panel is selected from polycarbonate, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate or a combination thereof.

6. A method for manufacturing a touch layer structure, characterized in that: The method for manufacturing this touch layer structure includes the following steps: (a) A first conductive layer formed of conductive ink is formed on a thin film substrate layer in a first pattern; (b) A first pattern layer formed of UV-curable ink is formed on the thin film substrate layer with a second pattern complementary to the first pattern, the first pattern layer being located on the same plane as the first conductive layer; (c) A second pattern layer formed of UV-curable ink is formed on at least one of the first conductive layer and the first pattern layer with a third pattern, wherein the second pattern layer does not completely cover the first conductive layer. (d) A second conductive layer formed of conductive ink is formed on at least one of the first conductive layer and the first pattern layer with a fourth pattern complementary to the third pattern, the second conductive layer and the second pattern layer being located on the same plane, and the second conductive layer being at least partially in contact with the first conductive layer; (e) An adhesive layer formed of conductive adhesive is formed above the second patterned layer and the second conductive layer; (f) A transparent panel is attached to the adhesive layer; (g) Irradiating the first conductive layer, the first patterned layer, the second patterned layer, the second conductive layer, and the adhesive layer with ultraviolet light; and (h) Remove the thin film substrate layer from the first conductive layer and the first pattern layer to obtain the touch layer structure.

7. The method for manufacturing the touch layer structure according to claim 6, characterized in that: In step (e), the adhesive layer is formed on the second patterned layer and the second conductive layer.

8. The method for manufacturing the touch layer structure according to claim 6, characterized in that: The method for manufacturing the touch layer structure also includes step (f′): prior to step (f), a plurality of perforations penetrating the transparent panel are formed inside the transparent panel by laser, and a groove connecting at least two perforations is formed on the surface of the transparent panel by laser.

9. The method for manufacturing the touch layer structure according to claim 8, characterized in that: The method for manufacturing the touch layer structure further includes step (i): after step (f′), forming a conductive element in the groove to connect the at least two through holes.

10. The method for manufacturing the touch layer structure according to claim 6, characterized in that: The material of the film substrate layer is selected from polyvinyl alcohol, acrylonitrile-butadiene-styrene copolymer, nylon, polymethylpentene, polyethylene terephthalate, polybutylene terephthalate, polyvinylpyrrolidone, polyethylene, polypropylene, or combinations thereof.

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