Signal generator, quantum chip driver, and quantum control system

Abstract

The application provides a signal generating device, a quantum chip driving control device and a quantum control system, comprising: a signal output module, a signal amplification module and a signal output port connected in sequence, and a first signal processing module connected to the output end of the signal output module, used for performing first impedance matching processing on a quantum driving signal output by the signal output module and outputting the quantum driving signal to the input end of the signal amplification module; wherein the quantum driving signal is used for driving a plurality of qubits on a quantum chip to perform a logic gate operation; a second signal processing module connected to the output end of the signal amplification module, used for performing second impedance matching processing on the quantum driving signal processed by the signal amplification module and outputting the quantum driving signal through the signal output port. The quantum driving signal output by the signal generating device of the application has higher precision.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of quantum information, especially the field of quantum computing technology, and particularly relates to a signal generating device, a quantum chip driving device and a quantum control system. BACKGROUND

[0002] A quantum computer is a physical device that performs high-speed mathematical and logical operations, stores and processes quantum information in accordance with the laws of quantum mechanics. The quantum computer has the characteristics of fast operation, strong information processing capacity and wide application range. Compared with general computers, the more information processing capacity, the more advantageous the quantum computer is in operation, and the more accurate the operation can be ensured.

[0003] The core of the quantum computer is a quantum chip, and the quantum chip integrates a plurality of qubits. The interconnected qubits can cooperatively perform quantum computing. When the interconnected qubits cooperatively perform quantum computing, two-bit logic gate driving signals or multi-bit logic gate driving signals need to be applied to the qubits, and these driving signals need to be applied within the decoherence time of the qubits to ensure the accuracy of quantum computing.

[0004] However, the decoherence time of the qubits is limited, so the number of driving signals applied within the decoherence time is limited, that is, the operation efficiency of the quantum chip is limited. In order to improve the operation efficiency of the quantum chip, it is necessary to improve the operation rate of the two-bit logic gate driving signals or multi-bit logic gate driving signals applied to the qubits. These driving signals are provided by corresponding signal sources, and the operation rate of the two-bit logic gate driving signals or multi-bit logic gate driving signals applied to the qubits can be improved by increasing the frequency bandwidth of the driving signals output by the signal sources. In addition, the driving signals output by the signal sources also need to be amplified, and the driving signals after amplification are applied to the quantum chip. Generally, a signal source with high frequency bandwidth and an operational amplifier with high gain are selected to realize the two-bit logic gate driving signals or multi-bit logic gate driving signals with high operation rate required by the qubits. However, the signal source with high frequency bandwidth and the operational amplifier with high gain will distort the signal due to impedance matching when working, which will distort the two-bit logic gate driving signals or multi-bit logic gate driving signals output to the qubits and reduce the accuracy of quantum computing. How to improve the accuracy of the two-bit logic gate driving signals or multi-bit logic gate driving signals is a technical problem that needs to be solved. SUMMARY

[0005] The purpose of the present application is to provide a signal generating device, a quantum chip driving device and a quantum control system to solve the problem of low accuracy of quantum driving signals in the prior art, and the present application can improve the accuracy of quantum driving signals.

[0006] The technical solution of this application is as follows:

[0007] On one hand, the present application provides a signal generating device, comprising: a signal output module, a signal amplification module, and a signal output port connected in sequence; and a first signal processing module connected to the output end of the signal output module, configured to perform a first impedance matching process on a quantum drive signal output by the signal output module, and output the signal to the input end of the signal amplification module; wherein the quantum drive signal is used to drive a number of qubits on a quantum chip to perform a logic gate operation; and a second signal processing module connected to the output end of the signal amplification module, configured to perform a second impedance matching process on the quantum drive signal after amplification by the signal amplification module, and output the signal through the signal output port.

[0008] In the signal generating device as described above, preferably, the quantum driving signal output by the signal output module is a current signal.

[0009] As for the signal generating device as described above, preferably, the signal output module includes a first output end and a second output end, the first output end outputs a first current signal, and the second output end outputs a second current signal; wherein, the first current signal and the second current signal are differential current signals.

[0010] In the signal generating device as described above, preferably, the first processing module includes a first resistor, a second resistor, and a third resistor;

[0011] The first end and the second end of the first resistor are connected to the first output end of the signal output module and the first input end of the signal amplification module respectively;

[0012] The first end and the second end of the second resistor are connected to the second output end of the signal output module and the second input end of the signal amplification module respectively;

[0013] A first end of the third resistor is connected to the second input end of the signal amplifying module, and a second end of the third resistor is grounded.

[0014] In the signal generating device as described above, preferably, the second processing module includes a fourth resistor, a first capacitor, and a fifth resistor connected in parallel;

[0015] The first end of the fourth resistor and the first capacitor is connected to the ground, and the second end of the fourth resistor and the first capacitor is connected to the signal output port;

[0016] A first end of the fifth resistor is connected to the output end of the signal amplifying module, and a second end of the fifth resistor is connected to the signal output port.

[0017] The signal generating device as described above preferably further includes a signal conversion module, which is connected to the first output end and the second output end of the signal output module, and is used to process the differential current signal into a differential voltage signal and output it to the first processing module.

[0018] In the signal generating device as described above, preferably, the signal conversion module includes a sixth resistor and a second capacitor connected in parallel, and a seventh resistor and a third capacitor connected in parallel;

[0019] The first ends of the sixth resistor and the second capacitor are connected to the first output terminal of the signal output module, and the second ends of the sixth resistor and the second capacitor are connected to the ground;

[0020] The first ends of the seventh resistor and the third capacitor are connected to the second output end of the signal output module, and the second ends of the seventh resistor and the third capacitor are connected to the ground.

[0021] On the other hand, the present application provides a quantum chip driving device, including a PCB and the above-mentioned signal generating device integrated on the PCB, wherein the signal generating device outputs a quantum driving signal for driving the quantum chip.

[0022] In the quantum chip driving device as described above, preferably, the signal conversion module and the signal output module are arranged adjacent to each other on the PCB.

[0023] In the quantum chip driving device as described above, preferably, the signal output port and the second processing module are arranged adjacent to each other on the PCB.

[0024] On the other hand, the present application provides a quantum control system, including several of the above-mentioned quantum chip driving devices.

[0025] Compared to the prior art, the signal generating device of the present application includes a signal output module, a signal amplification module, and a signal output port connected in sequence, as well as a first signal processing module connected to the output of the signal output module and configured to perform a first impedance matching process on the quantum drive signal output by the signal output module and output it to the input of the signal amplification module; wherein the quantum drive signal is used to drive several qubits on a quantum chip to perform logic gate operations; and a second signal processing module connected to the output of the signal amplification module and configured to perform a second impedance matching process on the quantum drive signal amplified by the signal amplification module and output it through the signal output port. The first processing module matches the impedance between the signal output module and the signal amplification module, thereby improving the accuracy of the signal to be amplified entering the signal amplification module; further, the second processing module matches the impedance between the signal amplification module and the signal output port, thereby improving the accuracy of the quantum drive signal output through the signal output port. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 This is a schematic diagram of the components of a signal generating device provided in an embodiment of the present application;

[0028] Figure 2 This is a circuit diagram of a signal generating device provided in an embodiment of the present application;

[0029] Figure 3 This is a schematic structural diagram of a quantum chip driving device provided in an embodiment of the present application;

[0030] Figure 4 This is a schematic diagram of the structure of a quantum control system provided in an embodiment of the present application.

[0031] 1-Signal generator, 2-Quantum chip driver 2, 3-Quantum control system, 4-Quantum chip,

[0032] 11-Signal output module, 12-First signal processing module, 13-Signal amplification module, 14-Second signal processing module, 15-Signal output port, 16-Signal conversion module, 21-PCB,

[0033] 121 - first resistor, 122 - second resistor, 123 - third resistor, 141 - fourth resistor, 142 - first capacitor, 143 - fifth resistor, 161 - sixth resistor, 162 - second capacitor, 163 - seventh resistor, 164 - third capacitor. DETAILED DESCRIPTION

[0034] The following detailed description is illustrative only and is not intended to limit the application or uses of the embodiments and / or embodiments. In addition, there is no intention to be bound by any express or implied information presented in the previous "Background Technology" or "Summary of the Invention" section or "Detailed Description of the Invention" section.

[0035] To make the purpose, technical solutions, and advantages of the embodiments of the present application clearer, one or more embodiments are now described with reference to the accompanying drawings, wherein similar reference numerals are used throughout the text to refer to similar components. In the following description, for the purpose of explanation, many specific details are set forth in order to provide a more thorough understanding of one or more embodiments. However, it is obvious that in various cases, one or more embodiments can be practiced without these specific details, and the various embodiments can be combined and referenced with each other without contradiction.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in a sequence other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0037] The quantum chip is the core of a quantum computer. It integrates multiple qubits, interconnected by a network of qubits that can collaboratively perform quantum computations. The number of qubits and the number of connections between them directly impact the computing power and efficiency of a quantum computer. To coordinate quantum computations, two-bit or multi-bit logic gate drive signals must be applied to these qubits. These drive signals must be applied within the qubit's decoherence time to ensure accurate quantum computations.

[0038] As we all know, the decoherence time of a quantum bit is limited, so the number of drive signals applied within the decoherence time is limited, that is, the computing efficiency of the quantum chip is limited. In order to improve the operating efficiency of the quantum chip, it is necessary to increase the operating rate of the two-bit logic gate drive signal or the multi-bit logic gate drive signal applied to the quantum bit. These drive signals are provided by the corresponding signal source, and the operating rate of the two-bit logic gate drive signal or the multi-bit logic gate drive signal applied to the quantum bit can be increased by increasing the frequency bandwidth of the drive signal output by the signal source. In addition, the drive signal output by the signal source also needs to be amplified and applied to the quantum chip through the amplified drive signal.

[0039] Typically, high-frequency bandwidth signal sources and high-gain op amps are used to achieve the high-speed, two-bit logic gate drive signals or multi-bit logic gate drive signals required by qubits. However, these high-frequency bandwidth signal sources and high-gain op amps can cause signal distortion due to impedance matching, which can distort the output signals to the qubits and reduce the accuracy of quantum computing. Improving the accuracy of these signals while ensuring the high-frequency bandwidth and high-gain requirements is a pressing issue in the field of quantum computing.

[0040] Based on this, Figure 1 As shown, this embodiment provides a signal generating device 1, comprising a signal output module 11, a signal amplification module 13, a signal output port 15, and a first signal processing module 12 connected in sequence. The first signal processing module 12 is connected to the output end of the signal output module 11, and is used to perform a first impedance matching process on the quantum drive signal output by the signal output module 11, and output it to the input end of the signal amplification module 13; wherein the quantum drive signal is used to drive a number of qubits on a quantum chip to perform a logic gate operation; and a second signal processing module 14, the second signal processing module 14 is connected to the output end of the signal amplification module 13, and is used to perform a second impedance matching process on the quantum drive signal after amplification by the signal amplification module 13, and output it through the signal output port 15.

[0041] Among them, the frequency range of the quantum drive signal output by the signal output module 11 selected in this application is DC-500MHz, and the gain of the signal amplification module 13 selected at the same time is ±4V, ensuring that the quantum drive signal output through the signal output port 15 is a signal with high frequency and high gain parameters, thereby improving the operation speed and computing efficiency of the quantum bits on the quantum chip. It should be supplemented that the quantum drive signal of this application is a pulse signal. The signal output module 11 of the embodiment of this application can be a DAC chip, and the signal amplification module 13 can be an op amp chip.

[0042] As basic electronics knowledge indicates, signal transmission lines have lead resistance, lead inductance, and stray capacitance, making pulse signals prone to overshoot and ringing during transmission. Furthermore, changes in impedance can cause reflections during transmission. This signal can originate from the driver or be reflected from the far end. Multiple reflections between the driver and the far end load can also cause signal ringing.

[0043] The quantum drive signal output by the signal output module 11 of the present application is a pulse signal in the high-frequency band, and the signal overshoot and signal ringing phenomena are particularly obvious. By setting a first signal processing module 12 between the signal output module 11 and the signal amplification module 13, the quantum drive signal output by the signal output module 11 is impedance matched, that is, the impedance of the signal output module 11 and the signal amplification module 13 are matched. When the quantum drive signal is transmitted to the input end of the signal amplification module 13, the signal overshoot and signal ringing amplitude are extremely low, thereby ensuring the accuracy of the signal to be amplified.

[0044] In addition, a second signal processing module 14 is provided between the signal amplification module 13 and the signal output port 15 to perform impedance matching on the amplified quantum drive signal, that is, to match the impedance of the signal amplification module 13 and the signal output port 15, thereby also reducing signal overshoot and signal ringing, and can also reduce signal noise and improve the accuracy of the amplified quantum drive signal output through the signal output port 15. When the quantum drive signal is output to the quantum chip 4 through the signal output port 15, the accuracy of the quantum drive signal output to the quantum chip 4 is ensured. It should be noted that the signal output port 15 can be a specific signal connector, such as an SMA connector, an SMP connector, etc.

[0045] As one embodiment of the present application, the quantum drive signal output by the signal output module 11 is a current signal. The signal output module 11 can be a signal source device, such as a current source, a voltage source, or other source device that outputs a pulse signal. In contrast, a current source is less affected by load nonlinearity and has stable performance.

[0046] Quantum chips are usually installed in refrigeration equipment, especially superconducting quantum chips 4, whose operating temperature reaches 10mK and needs to be set at the lowest temperature of the dilution refrigerant. At the same time, the signal source device that provides the drive signal for the quantum chip is usually set outside the refrigeration equipment. It is conceivable that the connecting cable between the signal generating device 1 and the quantum chip is relatively long, and there are also multiple electronic devices for signal attenuation, signal filtering and other functions between the signal generating device 1 and the quantum chip. Relative to the signal generating device 1, these connecting cables and electronic devices can be regarded as load elements, and the parameter fluctuations of these load elements will affect the stability of the signal generating device 1. When implementing this application, a current source is used, that is, the quantum drive signal output by the signal output module 11 is a current signal, which improves the performance stability of the signal output module 11.

[0047] like Figure 2 As shown, as an implementation method of an embodiment of the present application, the signal output module 11 includes a first output end and a second output end, the first output end outputs a first current signal, and the second output end outputs a second current signal; wherein, the first current signal and the second current signal are differential current signals.

[0048] Specifically, the first output terminal and the second output terminal of the signal output module 11 respectively output the first current signal and the second current signal to form a differential current signal, i.e., a quantum drive signal. Compared with the single-ended output quantum drive signal, the anti-interference ability of the quantum drive signal can be improved, thereby ensuring the accuracy of the quantum drive signal.

[0049] like Figure 2 As shown, as an implementation method of an embodiment of the present application, the first processing module includes a first resistor 121, a second resistor 122, and a third resistor 123; the first end and the second end of the first resistor 121 are respectively connected to the first output end of the signal output module 11 and the first input end of the signal amplification module 13; the first end and the second end of the second resistor 122 are respectively connected to the second output end of the signal output module 11 and the second input end of the signal amplification module 13; the first end of the third resistor 123 is connected to the second input end of the signal amplification module 13, and the second end of the third resistor 123 is grounded.

[0050] Specifically, the quantum drive signal output by the signal output module 11 is a differential signal, and a matching resistor is connected in series on each path. That is, a first resistor 121 is connected in series between the first end of the signal output module 11 and the first input end of the signal amplification module 13, and a second resistor 122 is connected in series between the second end of the signal output module 11 and the second input end of the signal amplification module 13. Impedance matching is performed by the first resistor 121 and the second resistor 122, and noise is reduced. In addition, a third resistor 123 is also connected to the second input end of the signal amplification unit, and the other end of the third resistor 123 is grounded. The third resistor 123 has the same function as the second resistor 122 and is also used to impedance match one signal in the differential signal. Among them, the resistance values ​​of the first resistor 121, the second resistor 122, and the third resistor 123 can be selected to have the same parameters.

[0051] In addition, if Figure 3 As shown, the input end of the signal amplification module 13 is distinguished by positive and negative, wherein positive is forward input, negative is reverse input, forward input is positive proportional amplification, and negative input is inverse proportional amplification. As known from the basic knowledge of the electronic field, the impedance, interference, and suppression ratio of the forward input and the reverse input are different. The signal output by the signal generating device of the present application needs to act on the quantum chip, the load impedance is very large, and the voltage amplitude of the quantum drive signal required by the quantum chip is very large and the current is very small, that is, the power consumption is very low. Therefore, the signal amplification module 13 of the embodiment of the present application adopts the method of forward input. In order to reduce the interference of the forward input, the analog ground and the digital ground physical space can be separated to enhance the suppression of common mode interference.

[0052] Continue as Figure 2 As shown, as an implementation method of an embodiment of the present application, the second processing module includes a fourth resistor 141 and a first capacitor 142, and a fifth resistor 143 connected in parallel; the first ends of the fourth resistor 141 and the first capacitor 142 are connected to the ground, and the second ends of the fourth resistor 141 and the first capacitor 142 are connected to the signal output port 15; the first end of the fifth resistor 143 is connected to the output end of the signal amplification module 13, and the second end of the fifth resistor 143 is connected to the signal output port 15.

[0053] Specifically, the output of the signal amplification module 13 outputs an amplified quantum drive signal. A fifth resistor 143 is connected in series between the output of the signal amplification module 13 and the signal output port 15 to achieve impedance matching. Furthermore, the parallel connection of the fourth resistor 141 and the first capacitor 142 can absorb noise in the amplified quantum drive signal, improving signal accuracy. The resistance value of the fifth resistor 143 can be selected to be the same as that of the first resistor 121.

[0054] It should be added that Figure 2The signal amplification module 13 is marked with only the first input terminal and the second input terminal for receiving the signal to be amplified, and the output terminal for outputting the amplified signal. This does not mean that the signal amplification module 13 only has these three signal ports. It also includes other ports, such as a power port, a ground port, a feedback port, etc., which are determined according to the instruction manual of the specific signal amplification module 13.

[0055] As an implementation method of an embodiment of the present application, the signal generating device 1 further includes a signal conversion module 16, which is connected to the first output terminal and the second output terminal of the signal output module 11 and is configured to process the differential current signal into a differential voltage signal and output it to the first processing module. As described above, the signal output module 11 of the embodiment of the present application is a current source, and the output signal is a differential current signal. The signal conversion module 16 is connected to the first output terminal and the second output terminal of the signal output module 11 to convert the differential current signal into a differential voltage signal for amplification processing by the signal amplification module 13.

[0056] As an implementation method of an embodiment of the present application, the signal conversion module 16 includes a sixth resistor 161 and a second capacitor 162 connected in parallel, and a seventh resistor 163 and a third capacitor 164 connected in parallel; the first end of the sixth resistor 161 and the second capacitor 162 is connected to the first output end of the signal output module 11, and the second end of the sixth resistor 161 and the second capacitor 162 is connected to the ground; the first end of the seventh resistor 163 and the third capacitor 164 is connected to the second output end of the signal output module 11, and the second end of the seventh resistor 163 and the third capacitor 164 is connected to the ground.

[0057] Specifically, the first output terminal and the second output terminal of the signal output module 11 are connected to each other through the sixth resistor 161 and the seventh resistor 163, respectively, for impedance matching, and the current signal is converted into a voltage signal. Furthermore, the second capacitor 162 and the third capacitor 164, respectively connected in parallel with the sixth resistor 161 and the seventh resistor 163, reduce the signal overshoot, thereby increasing the accuracy of the converted differential voltage signal. The sixth resistor 161 and the seventh resistor 163 can have the same resistance value, and the second capacitor 162 and the third capacitor 164 can have the same capacitance value.

[0058] like Figure 3As shown, based on the same application concept, the embodiment of the present application provides a quantum chip driving device 2, including a PCB 21, and a signal generating device integrated on the PCB 21, the signal generating device outputting a quantum driving signal for driving the quantum chip. The signal generating devices in the embodiment of the present application are all electronic devices. By integrating various electronic devices on the PCB 21, the quantum driving signal is output through the signal output port 15. The quantum chip driving device 2 is assembled by integrating the signal generating device on the PCB 21, which is easier to integrate in the quantum computer system.

[0059] Continue as Figure 3 As shown, as an implementation method of an embodiment of the present application, the signal conversion module 16 and the signal output module 11 are adjacently arranged on the PCB 21. The signal output port 15 and the second processing module are adjacently arranged on the PCB 21. Specifically, by arranging the signal conversion module 16 and the signal output module 11 adjacently on the PCB 21, that is, the corresponding electronic components are close to each other in physical position, so that the impedance matching effect of the differential current signal output after conversion by the signal conversion module 16 is better, which is conducive to improving the accuracy of the quantum drive signal. In addition, by arranging the signal output port 15 and the second processing module adjacently on the PCB 21, the impedance matching effect of the quantum drive signal processed by the signal amplification module 13 is better when it is output through the signal output port 15, which is also conducive to improving the accuracy of the quantum drive signal.

[0060] like Figure 4 As shown, based on the same application concept, the embodiment of the present application provides a quantum control system 3, including several of the above-mentioned quantum chip drive devices. With the development of quantum computing technology, the number of qubits on the quantum chip 4 is increasing, and each qubit requires a corresponding quantum drive signal, so the number of output channels of the corresponding quantum chip drive device increases accordingly. By adopting multiple quantum chip drive devices and integrating the corresponding PCB21 through a board or backplane, the drive requirements of more quantum chips 4 are achieved, and the integration is high.

[0061] The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A signal generating device, characterized in that: It includes a signal output module, a first signal processing module, a signal amplification module, a second signal processing module and a signal output port connected in sequence; wherein: The signal output module includes a first output terminal and a second output terminal; The first signal processing module includes a first resistor, a second resistor, and a third resistor. The first ends of the first resistor and the second resistor are electrically connected to the first output end and the second output end, respectively, to perform first impedance matching processing on the two quantum drive signals. The second ends of the first resistor and the second resistor are connected to the first input end and the second input end of the signal amplification module, respectively, to output the quantum drive signal after the first impedance matching processing to the signal amplification module; the first end of the third resistor is connected to the second input end of the signal amplification module, and the second end of the third resistor is grounded. The quantum drive signal is used to drive a plurality of qubits on the quantum chip to perform logic gate operations; The second signal processing module is connected to the output end of the signal amplification module and is used to perform a second impedance matching process on the quantum driving signal after amplification by the signal amplification module, and output the signal through the signal output port.

2. The signal generating device according to claim 1, wherein: The quantum driving signal output by the signal output module is a current signal.

3. The signal generating device according to claim 2, wherein: The first output terminal outputs a first current signal, and the second output terminal outputs a second current signal; wherein the first current signal and the second current signal are differential current signals.

4. The signal generating device according to claim 1, wherein: The second signal processing module includes a fourth resistor, a first capacitor, and a fifth resistor connected in parallel; The first end of the fourth resistor and the first capacitor is connected to the ground, and the second end of the fourth resistor and the first capacitor is connected to the signal output port; A first end of the fifth resistor is connected to the output end of the signal amplifying module, and a second end of the fifth resistor is connected to the signal output port.

5. The signal generating device according to claim 3, wherein: It also includes a signal conversion module, which is connected to the first output end and the second output end of the signal output module, and is used to process the differential current signal into a differential voltage signal and output it to the first signal processing module.

6. The signal generating device according to claim 5, wherein: The signal conversion module includes a sixth resistor and a second capacitor connected in parallel, and a seventh resistor and a third capacitor connected in parallel; The first ends of the sixth resistor and the second capacitor are connected to the first output terminal of the signal output module, and the second ends of the sixth resistor and the second capacitor are connected to the ground; The first ends of the seventh resistor and the third capacitor are connected to the second output end of the signal output module, and the second ends of the seventh resistor and the third capacitor are connected to the ground.

7. A quantum chip driving device, characterized in that: The device comprises a PCB, and a signal generating device according to any one of claims 1 to 6 integrated on the PCB, wherein the signal generating device outputs a quantum driving signal for driving a quantum chip.

8. The quantum chip driving device according to claim 7, characterized in that: The signal conversion module and the signal output module are adjacently arranged on the PCB.

9. The quantum chip driving device according to claim 7, characterized in that: The signal output port and the second signal processing module are adjacently arranged on the PCB.

10. A quantum control system, characterized in that: Comprising several quantum chip driving devices as described in claim 7.

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