A packaging structure of a radio frequency module

Abstract

The application discloses a packaging structure of a radio frequency module, which comprises a carrier plate, a chip module, an isolation film and a plastic sealing layer, the chip module is arranged on the carrier plate, the isolation film is arranged on the surface of the carrier plate and the chip module, and the plastic sealing layer is arranged on the isolation film and covers the carrier plate and the chip module; wherein the chip module comprises a filter chip and at least one to-be-filled chip, the bottom of the filter chip and the to-be-filled chip is respectively provided with a first gap and a second gap on the surface of the carrier plate, the isolation film encloses the first gap to form a closed cavity, the isolation film is provided with a plurality of notches which are communicated with the second gap, and the plastic sealing layer fills the second gap through the notches. The application fills the plastic sealing material in the required area through the notches of the hollow structure, meets the requirement of the integrated packaging of the filter chip and other chips, and improves the reliability.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor packaging, and particularly relates to a packaging structure of a radio frequency module. BACKGROUND

[0002] In order to meet the requirement of high packaging integration, the filter chip and other different chips / devices need to be put into the same packaging body for packaging to realize the application terminal of light and thin. The working principle of the surface acoustic wave (SAW) filter is that the input end IDT receives the voltage signal to make the piezoelectric material produce mechanical pressure and propagate in the form of acoustic wave along the surface, and the acoustic wave in the vertical direction rapidly decays, and the output end IDT receives the horizontal acoustic wave and converts it into an electric signal. Therefore, the IDT surface (i.e. functional area) cannot be in contact with other substances, and a sufficient cavity needs to be ensured for normal operation. The other types of chips need to be completely filled with plastic sealing material to ensure the reliability.

[0003] The existing integrated packaging method of the radio frequency front-end module is to first adopt the isolation film for coating to realize the cavity structure of the filter chip, and then to perform plastic sealing of the plastic sealing material to isolate the influence of the external environment and impurities on the chip circuit. Due to the coating of the isolation film, the bottom of the other types of chips also forms a cavity, and in the subsequent plastic sealing process, the plastic sealing material cannot realize the filling of the bottom of the other types of chips, which will affect the reliability of the module. SUMMARY

[0004] The present application provides a packaging structure of a radio frequency module in view of the deficiencies of the prior art.

[0005] In order to achieve the above purpose, the technical scheme of the present application is as follows:

[0006] A packaging structure of a radio frequency module, comprising a carrier plate, a chip module, an isolation film and a plastic sealing layer, the chip module is arranged on the carrier plate, the isolation film is arranged on the surface of the carrier plate and the chip module, and the plastic sealing layer is arranged on the isolation film and covers the carrier plate and the chip module; wherein the chip module comprises a filter chip and at least one to-be-filled chip, the filter chip has a functional surface facing the carrier plate, and a first gap is formed between the functional surface and the carrier plate; the to-be-filled chip has a lower surface facing the carrier plate, and a second gap is formed between the lower surface and the carrier plate; the isolation film encloses the first gap to form a closed cavity, the isolation film is provided with at least two notches in communication with the second gap, and the plastic sealing layer fills the second gap through the notches.

[0007] Optionally, the at least two notches are located on adjacent two sides, opposite two sides or multiple sides of the to-be-filled chip.

[0008] Optionally, the to-be-filled chip is arranged adjacent to the filter chip and has a nearest side close to the filter chip, and the notch is arranged outside the nearest side.

[0009] Optionally, the filter chip includes at least two filter chips, the two filter chips are arranged on different sides of the to-be-filled chip and have a first distance and a second distance from the to-be-filled chip respectively, the second distance is greater than the first distance, and the notch is arranged on the side with the second distance.

[0010] Optionally, a plurality of notches are arranged outside the bottom of the to-be-filled chip and are arranged at intervals around the to-be-filled chip.

[0011] Optionally, the interval of the notch is 40-60 μm.

[0012] Optionally, the length of the notch is not greater than the length of the side of the to-be-filled chip.

[0013] Optionally, the width of the notch is 20-40 μm.

[0014] Optionally, the notch is formed by laser point cutting.

[0015] Optionally, the isolation film is attached to the surface of the carrier plate and the chip module, the position of the notch is located at a distance L1 of the extension of the isolation film from the top edge of the to-be-filled chip, and the thickness of the to-be-filled chip is less than L1 and L1 is less than (the thickness of the to-be-filled chip + the second gap height).

[0016] Optionally, the isolation film is an epoxy resin, a polyimide, a thermoplastic resin or a thermosetting resin film.

[0017] Optionally, the thickness of the isolation film is 10-50 μm.

[0018] Optionally, the carrier plate is provided with a connection line, the filter chip is connected to the connection line of the carrier plate through a first bump arranged at the bottom and forms the first gap, and the to-be-filled chip is connected to the connection line of the carrier plate through a second bump arranged at the bottom and forms the second gap.

[0019] Optionally, the to-be-filled chip includes other functional chips and / or passive devices.

[0020] A communication device has the packaging structure of the radio frequency module.

[0021] The present application has the following advantages:

[0022] 1. The gap at the bottom of the filter chip is sealed by an isolation film to form a cavity, completely isolating it from the subsequent molding compound layer. The gap at the bottom of the chip to be filled is filled with molding compound in the required area through a perforated structure. This meets the requirements of integrated packaging of the filter chip and other chips, improving reliability. The isolation film remains an integral structure with a stable bond, ensuring the airtightness of the cavity and the encapsulation effect of the chip.

[0023] 2. The point cutting method minimizes the heat-affected zone on the dry film, enabling smaller chip spacing, higher product density and integration. It has no requirements for chip arrangement, has a wide range of applications, improves production efficiency, and reduces product costs. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the carrier plate in Example 1;

[0025] Figure 2 This is a schematic diagram of the structure of the carrier board and chip module combined in Example 1;

[0026] Figure 3 This is a schematic diagram of the pre-coated film structure in Example 1;

[0027] Figure 4 This is a schematic diagram of the structure after the protective layer has been peeled off in Example 1;

[0028] Figure 5 This is a schematic diagram of the laser dot cutting process in Example 1;

[0029] Figure 6 This is a top view of the structure obtained after laser spot cutting in Example 1;

[0030] Figure 7 This is a schematic diagram of the structure after secondary coating in Example 1. Figure 6 (Cross-sectional view along the a-a' direction);

[0031] Figure 8 This is another structural diagram of Example 1 after secondary coating. Figure 6 (Cross-sectional view in the b-b' direction);

[0032] Figure 9 This is a schematic diagram of the packaging structure of the radio frequency module in Example 1;

[0033] Figure 10 This is a schematic diagram of the structure of the carrier board and chip module combined in Example 2;

[0034] Figure 11 This is a schematic diagram of the pre-coated film structure in Example 2;

[0035] Figure 12This is a schematic diagram of the structure after the protective layer has been peeled off in Example 2;

[0036] Figure 13 This is a schematic diagram of the laser cutting process in Example 2;

[0037] Figure 14 This is a schematic diagram of the structure after secondary coating in Example 2;

[0038] Figure 15 This is a top view of the structure after secondary coating in Example 2;

[0039] Figure 16 This is a schematic diagram of the packaging structure of the radio frequency module in Example 2;

[0040] Figure 17 This is a schematic diagram of the laser cutting process in Example 3;

[0041] Figure 18 This is a schematic diagram of the packaging structure of the radio frequency module in Example 3;

[0042] Figure 19 This is a top view schematic diagram of a laser cutting process in Example 4;

[0043] Figure 20 This is a top view schematic diagram of another laser cutting process in Example 4. Detailed Implementation

[0044] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments. The accompanying drawings are merely illustrative to facilitate understanding of the invention, and their specific proportions can be adjusted according to design requirements. The vertical relationships of relative elements and the definitions of front / back in the graphics described herein should be understood by those skilled in the art to refer to the relative positions of the components; therefore, they can all be flipped to present the same component, and all of this should fall within the scope disclosed in this specification.

[0045] Example 1

[0046] The following combination Figures 1 to 9 The packaging method of the radio frequency module in Example 1 will be explained.

[0047] refer to Figure 1 A carrier board 1 is provided. The carrier board 1 has connection lines for realizing circuit connection, rewiring, and circuit lead-out, and can be, for example, a multilayer PCB board or a glass-based or ceramic-based packaging substrate. According to the layout of the chip module, a solder mask layer 12 is provided on the non-layout area of ​​the surface of the carrier board 1.

[0048] refer to Figure 2The surface mounting technology is used to realize the combination of the chip module including the surface acoustic wave filter chip 2 and other chips and the carrier plate 1. The other chips include other functional chips and / or passive devices. The other functional chips are, for example, switch chips, low noise amplifier (LNA) chips and the like. The passive devices are, for example, capacitors, resistors, inductors and the like. The other chips include a to-be-filled chip. In the embodiment, a to-be-filled chip 3A is taken as an example for description. The surface acoustic wave filter chip 2 and the to-be-filled chip 3A are arranged on the carrier plate 1 and are bonded to the carrier plate 1 through the first bottom bump 21 and the second bottom bump 31 respectively. The functional area of the surface acoustic wave filter chip 2 is flush with the first bump 21. Then, the surface acoustic wave filter chip 2 has a first gap 2a with the height of the first bump 21 between the surface acoustic wave filter chip 2 and the surface of the carrier plate 1. The first gap 2a makes the functional area of the surface acoustic wave filter chip 2 not contact the surface of the carrier plate. The to-be-filled chip 3A has a second gap 3a with the height of the second bump 31 between the to-be-filled chip 3A and the surface of the carrier plate 1. Due to the difference in size and structure of the chips, the heights of the bumps of different chips can be the same, partially the same or different.

[0049] Referring to Figure 3 , the pre-coating film is performed. The dry film 4 is coated on the carrier plate 1 as a separation film, which covers the surface acoustic wave filter chip 2 and the to-be-filled chip 3A on the surface of the carrier plate 1. The dry film 4 is an epoxy resin, polyimide, thermoplastic resin or thermosetting resin film with a thickness ranging from 10 to 50 μm, for example, 20 μm, 30 μm, 40 μm or any value between them. Before the pre-coating film, the surface of the dry film away from the chip is provided with a protective layer 41. After the pre-coating film is performed, the dry film 4 is arranged on the top surface of each chip and presents a natural state of gravity between adjacent chips or between the chip and the surface of the carrier plate.

[0050] Referring to Figure 4 , the protective layer 41 is peeled off.

[0051] Referring to Figure 5 and Figure 6 , the dry film 4 around the to-be-filled chip 3A is point-cut to form a plurality of discrete and spaced gaps 4a by using a laser point-cut process. The cutting position is designed on the premise that the gap 4a is connected to the second gap 3a after the vacuum coating film is stretched. The plurality of gaps 4a are preferably arranged at equal intervals around the top surface of the to-be-filled chip 3A, so as to form a hollow structure on the integrated dry film. For example, for the dry film with a thickness of 20 μm, a 355 nanosecond ultraviolet laser with a power of 15-30 W is used to point-cut at a preset height position by adjusting the focal length of the laser and moving the light spot horizontally around the periphery of the to-be-filled chip 3A.

[0052] Referring to Figures 7-8, the second film coating is performed by vacuum film coating process, the pressure for the film coating is 0.9-1.0 MPa, the temperature is 100-110 ℃, and the pressure time is 45-60 s. During the film coating process, the dry film 4 is stretched and attached to the surface of the surface acoustic wave filter chip 2, the to-be-filled chip 3A and the carrier plate 1 under the action of vacuum and pressure, so that the closed cavity V is formed at the first gap 2a of the first bump 21; for the to-be-filled chip 3A, the gap 4a after the adsorption is located at the second gap 3a of the second bump 31 to form a hollow structure, so that the second gap 3a between the to-be-filled chip 3A and the surface of the substrate 1 has a window communicating with the space outside the dry film 4, wherein the width d1 of the gap 4a is about 20-40 um, and the interval d2 is about 40-60 um. Specifically, the thickness of the to-be-filled chip 3A is h1, the height of the second bump 31 is h2, and the gap position is at a distance L1 of the dry film 4 extending outward from the top surface edge of the to-be-filled chip 3A, so h1 < L1 < (h1 + h2).

[0053] Reference Figure 9 , the plastic sealing is performed to form a plastic sealing layer 5. During the plastic sealing process, the plastic sealing material fills the second gap 3a between the to-be-filled chip 3A and the surface of the substrate 1 through the gap 4a, which improves the reliability of the device. The closed cavity V is retained due to the sealing and blocking effect of the dry film 4, and the bottom surface of the surface acoustic wave filter chip 2 has a functional area, which is located in the closed cavity V to ensure normal work.

[0054] The obtained packaging structure of the radio frequency module includes a carrier plate 1, one or more surface acoustic wave filter chips 2, one or more other chips (for example, the to-be-filled chip 3A), a dry film 4 and a plastic sealing layer 5. The non-layout area of the surface of the carrier plate 1 is provided with a solder resist layer 12, the surface acoustic wave filter chip 2 and the other chips including the to-be-filled chip 3A are arranged on the carrier plate 1, and the surface acoustic wave filter chip 2 and the other chips including the to-be-filled chip 3A are respectively connected with the carrier plate 1 through the bottom first bump 21 / second bump 31, wherein the surface acoustic wave filter chip 2 and the carrier plate 1 have a first gap 2a with a height of the thickness of the first bump 21, and the to-be-filled chip 3A and the carrier plate 1 have a second gap 3a with a height of the thickness of the second bump 31. The dry film 4 covers the surface acoustic wave filter chip 2, the other chips including the to-be-filled chip 3A and the carrier plate 1, and the dry film 4 and the surface acoustic wave filter chip 2 and the carrier plate 1 form a closed cavity V corresponding to the first gap 2a, the dry film 4 is provided with a plurality of spaced gaps 4a at the second gap 3a, and the plastic sealing layer 5 covers the carrier plate 1, the surface acoustic wave filter chip 2 and the other chips including the to-be-filled chip 3A, wherein the dry film 4 isolates the cavity V from the plastic sealing layer 5, and the plastic sealing material fills into the second gap 3a between the to-be-filled chip 3A and the surface of the carrier plate 1 through the gap 4a.

[0055] For other chips which have gaps with the surface of the carrier plate 1 and need to be covered by plastic sealing, the above-mentioned method can also be used to form a hollow structure in the periphery of the required chip to realize the filling of the subsequent plastic sealing layer.

[0056] In this embodiment, on the one hand, the film is pre-coated before laser cutting, and the laser position is adjusted to the preset height position of the film. Since the film is not attached to the surface of the carrier plate and the sidewall of the chip between adjacent chips or between the chip and the surface of the carrier plate, the laser cutting does not damage the surface of the carrier plate and the sidewall of the chip. On the other hand, the laser point cutting method has a small heat-affected zone on the dry film, can realize smaller chip spacing, higher product density and integration, has no requirement for the arrangement of the chip, has a wide application range, improves the production efficiency and reduces the product cost. On the other hand, the plastic sealing material in the required area is filled through the gap of the hollow structure, the dry film is still an integral structure, has stable combination, ensures the sealing effect of the cavity and the coating effect of the chip.

[0057] Embodiment 2

[0058] The packaging method of the radio frequency module in Embodiment 2 is described below with reference to Figures 10 to 15

[0059] Referring to Figure 10 , a carrier plate 1 is provided, and the non-disposed area of the surface of the carrier plate 1 is provided with a solder resist layer 12. The surface mount technology is used to realize the combination of the surface acoustic wave filter chip 2 and other chips with the carrier plate 1. In this embodiment, the other chips are exemplified by LNA chips or switch chips as the to-be-filled chip 3B and the passive device 3C. The surface acoustic wave filter chip 2 is bonded and connected to the carrier plate 1 through the bottom first bump 21 and has a first gap 2b. The to-be-filled chip 3B is connected to the surface of the carrier plate 1 through the second bump 32 and has a second gap 3b. The to-be-filled chip 3B is disposed between the passive device 3C and the surface acoustic wave filter chip 2.

[0060] Step 3, referring to Figure 11 , pre-coat the film. The dry film 4 is coated on the carrier plate 1, which covers the surface acoustic wave filter chip 2, the to-be-filled chip 3B and the passive device 3C on the surface of the carrier plate 1. The surface of the dry film 4 away from the chip is provided with a protective layer 41. After pre-coating the film, the dry film 4 is placed on the top surface of each chip and presents a natural state of gravity between adjacent chips.

[0061] Step 4, referring to Figure 12 , the protective layer 41 is peeled off.

[0062] Step 5, referring to Figure 13 ​, laser cutting process is adopted to cut the dry film 4 covering the to-be-filled chip 3B, and the cutting position meets the following two conditions: 1. After vacuum film stretching, the second gap 3b is communicated with the outside; 2. After vacuum film stretching, the first gap 2b of the adjacent surface acoustic wave filter chip 2 forms a sealed cavity. Considering the chip structure, chip distance and other factors, the cutting position can be based on the top surface edge of the to-be-filled chip 3B, and the first length of the isolation film is moved inward to the top surface or the second length of the isolation film is moved outward to meet the above conditions. In this embodiment, it is the first length of the isolation film moved inward to the top surface, that is, the cutting position is located on the top surface of the to-be-filled chip 3B.

[0063] In this embodiment, the laser line cutting method is adopted to cut the dry film 4 around the to-be-filled chip 3B. For example, for a dry film with a thickness of 20 μm, a 15-30 W power ultraviolet 355 nanosecond laser is used to adjust the laser to a preset height position for horizontal moving line cutting, so that the dry film covering the top surface of the to-be-filled chip 3B is separated from other parts at the second gap 3b.

[0064] Referring to Figure 14 , a vacuum film coating process is adopted for secondary coating. The pressure for coating is 0.9-1.0 MPa, the temperature is 100-110°C, and the pressure time is 45-60 s. During the coating process, under the action of vacuum and pressure, the dry film 4 is stretched and tightly attached to the surface of each structure. The second gap 3b is communicated with the outside due to the disconnection of the dry film, and the first gap 2b forms a sealed cavity V. The top view is shown in Figure 15 . The above cut isolation film 4 is separated to form a first part 4a and a second part 4b. The cutting edge of the first part 4a is located on the top surface of the to-be-filled chip 3B. The above first length is designed such that the cutting edge of the second part 4b is located on the surface of the carrier plate between the to-be-filled chip 3B and the adjacent chip after vacuum coating. This embodiment is especially suitable for the case that the to-be-filled chip and the adjacent chip have a small distance or a small height difference, so that the dry film has a small length between the adjacent devices after pre-coating. When the adjacent chip is a surface acoustic wave filter chip 2, the formation of the cavity can be ensured.

[0065] Wherein, the distance between the top surface of the to-be-filled chip 3B and the carrier plate is H1, the distance between the top surface of the filter chip 2 and the carrier plate is H2, and the distance between the to-be-filled chip 3B and the filter chip 2 is D1, then D1:(D1+H1+H2)≥1:5. The length of the second part 4b extending on the surface of the carrier plate close to the to-be-filled chip 3B is D2, D2≥20 μm and D2

[0066] Referring to Figure 16 , plastic packaging is performed to form a plastic packaging layer 5. During the plastic packaging process, the plastic packaging material fills the second gap 3b, and the sealed cavity V is preserved due to the sealing blocking effect of the dry film 4.

[0067] The dry film covering the top surface of the chip to be filled 3B is separated from the dry film of other parts at the second gap 3b, and the plastic sealing material is filled into the second gap 3b. The dry film covering the top surface of the chip to be filled 3B can cover part of the top surface, the entire top surface, or extend downward from the top surface to cover the sidewall of the chip to be filled 3B.

[0068] In this embodiment, the laser position is adjusted to the preset height position of the film for cutting, and the laser focal length does not need to be adjusted, which is less demanding on precision and easier to operate. When the module has multiple other devices that need to be filled with plastic sealing material, the dry film covering each of the other devices can be cut according to the above process, and then vacuum plastic sealing is performed after cutting is completed.

[0069] Embodiment 3

[0070] Reference Figure 17 Embodiment 3 is different from embodiment 2 in that the cutting position is designed to move the top edge of the chip to be filled 3B outward by the second length of the isolation film when laser cutting is performed, that is, the cutting position is located on the side of the chip to be filled 3B. Reference Figure 18 The above cutting separates the isolation film 4 into a first part 4c and a second part 4d, and the above second length is designed such that the cutting edge of the first part 4c after vacuum film covering is located on the sidewall of the chip to be filled 3B to avoid affecting the second gap 3b. This embodiment is particularly suitable for the case where the chip to be filled and the adjacent chip have a large distance or a large height difference, so that the dry film 4 between the adjacent devices has a large length after pre-film covering.

[0071] Similarly, the chip height and the distance therebetween need to satisfy the relationship described in embodiment 2.

[0072] Embodiment 4

[0073] The packaging method of the radio frequency module of embodiment 4 refers to the steps of embodiment 1. Figures 1-4

[0074] Reference Figure 19 In the laser cutting process, the dry film 4 surrounding the chip to be filled 3A is cut to form two notches 4b. In this embodiment, the chip to be filled 3A is a square structure, and filter chips 2 are arranged on both sides adjacent to each other, so that the two notches 4b are located on the other two sides where no filter chips are arranged to avoid affecting the packaging of the filter chips. Reference Figure 20 ​In another embodiment, the two adjacent filter chips 2 on the two sides are respectively at a first distance D3 and a second distance D4 from the chip 3A to be filled, and D4>D3. The two notches 4b are arranged on opposite sides, and one of the notches 4b is arranged on the side with the second distance D4. The notches are arranged on opposite sides to obtain a more ideal underfill effect of the plastic encapsulant. The notches are arranged as far away from the filter chip as possible in the structural design to avoid affecting the packaging of the filter chip. The subsequent vacuum film coating and plastic encapsulation process is the same as that in Embodiment 1.

[0075] The laser cutting process used in this embodiment can be point cutting or line cutting. The length of a single notch is, for example, not more than the length of one side of a square chip structure. More than two notches can also be arranged as needed to ensure that the notch is a hollow structure after vacuum film coating.

[0076] The above embodiments are described by taking the laser cutting process as an example. In addition, other precise cutting technologies such as ion cutting technology can also be used.

[0077] The packaging method and packaging structure of the present application can be applied to the packaging of surface acoustic wave filter radio frequency modules and ultimately applied to communication equipment. With the development of radio frequency front-end modules and the demand for thinness of application terminals, the corresponding packaging integration is also increasing. High-integration radio frequency front-end modules need to place different types of chips / devices in the same packaging body. The technical solution of the present application solves the problems of large size and high cost of existing CSP, WLP and other device packaging methods, and promotes the application of radio frequency modules.

[0078] The above embodiments are only used to further illustrate a radio frequency module packaging structure of the present application, but the present application is not limited to the embodiments. Any simple modification, equivalent change and modification made according to the technical essence of the present application to the above embodiments all fall within the protection scope of the technical solution of the present application.

Claims

1. A package structure of a radio frequency module, characterized by: The package structure comprises a carrier plate, a chip module, a separation film and a plastic sealing layer, the chip module is arranged on the carrier plate, the separation film is arranged on the surface of the carrier plate and the chip module, and the plastic sealing layer is arranged on the separation film and covers the carrier plate and the chip module. The chip module comprises a filter chip and at least one to-be-filled chip, the filter chip has a functional surface facing the carrier plate, and a first gap is formed between the functional surface and the carrier plate; the to-be-filled chip has a lower surface facing the carrier plate, and a second gap is formed between the lower surface and the carrier plate; the separation film encloses the first gap to form a closed cavity, the separation film is provided with a plurality of notches in communication with the second gap, and the plastic sealing layer fills the second gap through the notches; the plurality of notches are located outside the bottom of the to-be-filled chip and are arranged at intervals around the to-be-filled chip; the interval of the notches is 40-60 μm, the length of the notches does not exceed the length of the side of the to-be-filled chip, and the width of the notches is 20-40 μm.

2. The package structure of a radio frequency module according to claim 1, wherein: The notches are formed by laser point cutting.

3. The package structure of a radio frequency module according to claim 1, wherein: The separation film is attached to the surface of the carrier plate and the chip module, the position of the notches is located at a distance L1 extending outward from the top edge of the to-be-filled chip, and the thickness of the to-be-filled chip is less than L1 and L1 is less than (the thickness of the to-be-filled chip + the height of the second gap).

4. The package structure of a radio frequency module according to claim 1, wherein: The separation film is an epoxy resin, a polyimide, a thermoplastic resin or a thermosetting resin film.

5. The package structure of a radio frequency module according to claim 1, wherein: The thickness of the separation film is 10-50 μm.

6. The package structure of a radio frequency module according to claim 1, wherein: The carrier plate is provided with a connection circuit, the filter chip is connected to the connection circuit of the carrier plate through a first bump arranged at the bottom and forms the first gap, and the to-be-filled chip is connected to the connection circuit of the carrier plate through a second bump arranged at the bottom and forms the second gap.

7. The package structure of a radio frequency module according to claim 1, wherein: The to-be-filled chip comprises other functional chips and / or passive devices.

8. A communication device, characterized by: A package structure with a radio frequency module as claimed in any one of claims 1-7.

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