A laser drying method and apparatus

Abstract

The application discloses a laser drying method and equipment, relates to the technical field of coating production, and the drying equipment comprises a laser drying module, a position sensor, a sensor module and a control system; the laser drying module comprises a semiconductor laser unit; the semiconductor laser unit is arranged in an array and is electrically connected with the control system; the sensor module comprises a sensor and a sensor driving unit; the sensor is installed on the sensor driving unit and is in sliding connection with the sensor driving unit; the sensor driving unit is located on one side of the laser drying module; and the position sensor is arranged on the edge of a strip and is used for detecting the edge position of the strip. The application has the beneficial effects that the drying precision is effectively ensured, and the production safety is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of coating production, and more particularly to a laser drying method and equipment. Background Art

[0002] During the production process, after coating, the electrode or diaphragm needs to be dried in an oven. Existing ovens primarily use hot air or infrared lamps to achieve this drying effect. However, these drying methods can only regulate the heating power across the entire electrode surface. It is difficult to precisely control the heating power and, consequently, the drying degree in specific areas. For example, the thinned areas at the edge of the coating, the ceramic areas at the edge of the positive electrode coating, and the blank areas of striped coating require different heating power than the interior of the coating. Using the same heating power will cause these areas to dry too quickly or too slowly, resulting in drying defects.

[0003] Furthermore, NMP, the solvent used in cathode slurry, is an explosive gas and can explode at high concentrations or temperatures. Infrared lamps emit infrared light at high temperatures, so their surface temperatures are high, posing a safety hazard when used to dry cathodes. Summary of the Invention

[0004] In order to overcome the shortcomings of the existing technology, the present invention provides a laser drying method and equipment, which solves the current problems of the inability to accurately control the drying area and the safety hazards caused by the excessively high temperature of infrared light, effectively ensuring the drying accuracy and production safety.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a laser drying device, the improvement of which is that the drying device includes: a laser drying module, a position sensor, a sensor module and a control system;

[0006] The laser drying module includes semiconductor laser units; the semiconductor laser units are arranged in an array and are electrically connected to the control system;

[0007] The sensor module includes a sensor and a sensor driving unit; the sensor is mounted on the sensor driving unit and is slidably connected to the sensor driving unit; the sensor driving unit is located on one side of the laser drying module;

[0008] The position sensor is placed at the edge of the strip and is used to detect the edge position of the strip.

[0009] In the above structure, the laser drying module further includes a heat dissipation pipe, a laser cable pipe, a quartz glass plate and a shell; the heat dissipation pipe is installed on the surface of the shell away from the coating; the quartz glass plate is installed on the side of the shell close to the coating; and the laser cable pipe is arranged around the heat dissipation pipe.

[0010] In the above structure, the semiconductor laser unit is installed between the quartz glass plate and the shell.

[0011] In the above structure, the sensor driving unit comprises a sliding guide rail and a driving motor, the sliding guide rail is slidably connected with the sensor and is arranged on one side of the laser drying module; the driving motor is installed at one end of the sliding guide rail and is drivingly connected with the sliding guide rail.

[0012] In the above structure, the sliding guide rail comprises a chain, a sliding groove, a first transmission gear and a second transmission gear; the chain is arranged around the sliding groove; the sliding guide rail comprises the chain and the sliding groove, the chain is arranged around the sliding groove, one end of the chain is rotatably connected with the first transmission gear and the other end is rotatably connected with the second transmission gear; a T-shaped sliding block is installed at the connection between the sliding guide rail and the sensor, the horizontal tip of the T-shaped sliding block is arranged between the sliding groove and the chain away from the laser drying module; the first transmission gear is drivingly connected with the output shaft of the driving motor.

[0013] A laser drying method, which is improved in that the laser drying method is applied to the laser drying device in the above structure, and the laser drying method comprises:

[0014] S10, establishing a coordinate system and numbering each semiconductor laser unit of the laser drying module;

[0015] S20, establishing a mapping relationship between each region of the pole piece and each semiconductor laser unit;

[0016] S30, collecting the drying degree of each region of the pole piece by the sensor module and delivering it to the control system;

[0017] S40, calculating the difference between the drying degree of each region of the pole piece and the expected drying degree, and calculating the adjustment amount of each semiconductor laser unit of each region according to the difference through a closed-loop control algorithm;

[0018] S50, the control system queries the number of the corresponding semiconductor laser unit of each region through the mapping relationship between each region of the pole piece and each semiconductor laser unit, delivers the adjustment amount of each semiconductor laser unit of each region to the corresponding numbered semiconductor laser unit, and adjusts the output power of each semiconductor laser unit;

[0019] S60, repeating steps S30-S50 to realize the regional closed-loop control of the pole piece.

[0020] Further, in step S10, the numbering method is that each semiconductor laser unit is numbered with the axis of the laser drying module as the starting point in the X direction and the upper edge or the lower edge of the laser drying module as the starting point in the Y direction.

[0021] Furthermore, in step S20, the mapping relationship is established in the following manner: a rectangular coordinate system is established with the axis of the pole piece as the X-axis and the upper edge or lower edge of the pole piece as the Y-axis, and the width range of each area of ​​the pole piece is input. When the axis of the pole piece and the axis of the light output width of the light drying module are aligned, the mapping relationship between each area of ​​the pole piece and the semiconductor laser unit is obtained according to the length and width of the light spot of the semiconductor laser unit and the width range of each area of ​​the pole piece.

[0022] Furthermore, before step S40 , the method further includes: correcting the mapping relationship between each region of the pole piece and each semiconductor laser unit according to the pole piece offset obtained by measuring the position sensor.

[0023] Furthermore, in step S40, the closed-loop control algorithm is a PID closed-loop control algorithm.

[0024] The beneficial effects of the present invention are as follows: this solution uses sensors to detect the dryness of different areas of the coating, and controls the laser drying module through a control system to dry the areas of the coating that need to be dried, thereby achieving precise drying of the coating. In addition, the semiconductor laser unit is dissipated through a heat dissipation pipe and the output power of the semiconductor laser unit is adjusted through a control system to prevent the semiconductor laser unit from overheating and causing safety hazards; thereby effectively ensuring both the drying accuracy and the production safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the overall structure of a laser drying device of the present invention. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of the overall structure of a laser drying device of the present invention. Figure 2 ;

[0027] Figure 3 This is a schematic structural diagram of a laser drying module of a laser drying device of the present invention;

[0028] Figure 4 This is a schematic structural diagram of a sensor module of a laser drying device of the present invention;

[0029] Figure 5 A schematic diagram of a semiconductor laser unit of a laser drying device of the present invention Figure 1 ;

[0030] Figure 6 Schematic diagram of a semiconductor laser unit of a laser drying device of the present invention Figure 2 ;

[0031] Figure 7 A schematic diagram of a semiconductor laser unit of a laser drying device of the present inventionFigure 3 ;

[0032] Figure 8 Flow chart of a laser drying method according to the present application. DETAILED DESCRIPTION

[0033] The application will be further described below in conjunction with the drawings and embodiments.

[0034] The concept, specific structure and technical effects of the present application will be described clearly and completely in conjunction with the embodiments and drawings, so as to fully understand the purpose, features and effects of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application. In addition, all the coupling / connection relations involved in the patent do not mean that the components are directly connected, but means that a better coupling structure can be composed by adding or reducing coupling accessories according to the specific implementation. The technical features in the present application can be combined interactively without mutual contradiction and conflict.

[0035] Referring to Figures 1 to 3 The present application discloses a laser drying device, which comprises a laser drying module 3, a position sensor 4, a sensor module 5 and a control system. The laser drying module 3 comprises a semiconductor laser unit 31, a laser cable pipe 32, a heat dissipation pipe 33, a quartz glass plate 34 and a shell 35. The semiconductor laser unit 31 is arranged in an array and is electrically connected with the control system. The heat dissipation pipe 33 is installed on the surface of the shell 35 away from the coating 2. The quartz glass plate 34 is installed on the surface of the shell 35 close to the coating 2. The semiconductor laser unit 31 is installed between the quartz glass plate 34 and the shell 35. The laser cable pipe 32 is arranged around the heat dissipation pipe 33. The sensor module 5 comprises a sensor 51 and a sensor driving unit. The sensor 51 is installed on the sensor driving unit and is in sliding connection with the sensor driving unit. The sensor driving unit is located on one side of the laser drying module 3. The position sensor is arranged on the edge of the strip 1 and is used for detecting the edge position of the strip 1.

[0036] In the embodiment, the laser drying device drives the sensor 51 to slide on the sliding guide rail 52 through the driving motor 53, realizes the detection of the drying degree of different positions of the coating 2 by the sensor 51, and transmits the signal to the control system. The sensor 51 reflects the drying degree of different areas of the pole piece by detecting the temperature or humidity of different positions of the pole piece, thereby reflecting the drying speed. Therefore, the sensor 51 can adopt a temperature sensor 51 or a humidity sensor 51. The temperature sensor 51 can adopt an infrared temperature measuring instrument or a thermal imaging camera. The humidity sensor 51 preferably adopts an inductive moisture meter, such as a near-infrared moisture meter or a microwave moisture meter. The control system controls the semiconductor laser unit 31 to realize accurate drying of the coating 2 according to the drying degree of different positions of the coating 2. After the semiconductor laser unit 31 is powered on, it radiates infrared light to dry the coating 2 through the quartz glass plate 34. The quartz glass plate 34 is used to seal the semiconductor laser unit 31 to prevent the laser from being corroded and damaged by the steam generated during drying. In addition, the laser cable pipeline 32 serves as a wiring channel for the connection between the semiconductor laser unit 31 and the control system. The heat dissipation pipeline 33 dissipates heat for the semiconductor laser unit 31 to control the temperature of the semiconductor laser unit 31 and ensure the safety of production. Since the pole piece may deviate during the drying process, causing the actual irradiation position of each semiconductor laser unit 31 of the laser to deviate from the expected position, the position sensor 4 is arranged on one side of the laser drying module 3. The position sensor 4 detects the position of the coating 2 and transmits the position signal to the control system. If the pole piece deviates, the control system can correct the mapping relationship between each semiconductor laser unit 31 and the actual area of the pole piece. In addition, the coating 2 is a negative electrode paste coated on the substrate 1. The coating 2 includes at least a coating 2 edge thinning area and a coating 2 internal area. The coating 2 edge thinning area is thinner than the coating 2 internal area. In some embodiments, the coating 2 can also include a ceramic paste edge area or a blank area.

[0037] As a preferred embodiment, continuing to refer to Figure 3As shown, the sensor drive unit includes a sliding guide rail 52 and a drive motor 53. The sliding guide rail 52 is slidably connected to the sensor 51 and is placed on one side of the laser drying module 3. The drive motor 53 is installed at one end of the sliding guide rail 52 and is transmission-connected to the sliding guide rail 52. The sliding guide rail 52 includes a chain 521, a slide groove 522, a first transmission gear 523 and a second transmission gear 524. The chain 521 is arranged around the slide groove 522. One end of the chain 521 is rotationally connected to the first transmission gear 523, and the other end is rotationally connected to the second transmission gear 524. A T-shaped slider 56 is installed at the connection between the sliding guide rail 52 and the sensor 51. The horizontal tip of the T-shaped slider 56 is set in the slide groove 522. and the chain 521 is located between the sides away from the laser drying module 3; the first transmission gear 523 is connected to the output shaft of the driving motor 53; the sensor module 5 also includes a coupling 54 and a transmission shaft 55; the coupling 54 is rotatably connected to the output shaft of the driving electrical appliance; the first transmission gear 523 is rotatably connected to the coupling 54 and is located at one end of the chain 521; the second transmission gear 524 is placed at the other end of the chain 521, and the second transmission gear 524 is sleeved on the transmission shaft 55; the first transmission gear 523 and the coupling are both sleeved on the output shaft of the driving motor 53 to achieve coaxial rotation; the first transmission gear 523 and the second transmission gear 524 are both engaged with the chain 521. The drive motor 53 drives the chain 521 to rotate, and the chain 521 drives the sensor 51 to slide along the slide groove 522 to detect the dryness degree of different positions of the coating 2. Among them, the coupling 54, the first transmission gear 523 and the second transmission gear 524 serve as transmission components for the drive motor 53 to drive the chain 521 to rotate.

[0038] Reference Figures 1 to 8 As shown, the present invention also discloses a laser drying method, which is applied to the laser drying device described in the above embodiment; the laser drying method includes:

[0039] S10: Establish a coordinate system and number each semiconductor laser unit 31 of the laser drying module 3. The numbering method is: use the axis of the laser drying module 3 as the starting point in the X direction and the upper edge or lower edge of the laser drying module 3 as the starting point in the Y direction. In this embodiment, the horizontal coordinates of each column from the center line to the left are L1-L29, and the horizontal coordinates of each column from the center line to the right are R1-R29.

[0040] S20, a mapping relationship between each region of the polar sheet and each semiconductor laser unit 31 is established; the mapping relationship is established in the following manner: a rectangular coordinate system is established with the axis of the polar sheet as the X axis and the upper or lower edge of the polar sheet as the Y axis, the width range of each region of the polar sheet is input, and in the case where the axis of the polar sheet is aligned with the axis of the light-emitting surface of the laser drying module, the mapping relationship between each region of the polar sheet and the semiconductor laser unit is obtained according to the spot length and width of the semiconductor laser unit and the width range of each region of the polar sheet; wherein, since the scattering angle of the laser is very small, in the case where the laser drying module 3 is not far from the polar sheet, the laser can be considered to have no scattering, and the spot area can be considered to be the light-emitting surface area of the semiconductor laser unit 31; whether the length and width range of each spot falls within the width and length range of a certain region of the polar sheet is compared to determine whether the corresponding semiconductor laser unit 31 corresponds to the region;

[0041] In this embodiment, the spots of the semiconductor laser units 31 in the L1 to L3 and R1 to R3 columns fall within the blank region, and the semiconductor laser units 31 in the L1 to L3 and R1 to R3 columns correspond to the blank region of the polar sheet; in this scheme, the semiconductor laser units 31 that fall within two regions of the polar sheet at the same time are attributed to the region with higher drying degree requirement, so as to ensure that the relatively wet region can be completely dried, for example, the L4 and R4 columns correspond to the edge thinning region of the polar sheet, and L5, R5, L21 and R21 are attributed to the coating 2 region. It can be understood that the smaller the spot area of the semiconductor laser unit 31, the higher the resolution of the laser drying module 3, and the higher the accuracy of the sub-regional drying control of each region of the polar sheet.

[0042] S30, the drying degree of each region of the polar sheet is collected by the sensor module 5 and transmitted to the control system;

[0043] S40, the difference between the drying degree of each region of the polar sheet and the expected drying degree is collected by the sensor module 5, and the adjustment amount of each semiconductor laser unit 31 in each region is calculated by a closed-loop control algorithm; the closed-loop control algorithm is a closed-loop control algorithm of pid and its variants. In addition, when the polar sheet is offset, the mapping relationship between each region of the polar sheet and the semiconductor laser unit 31 changes, and the initial mapping relationship between each region of the polar sheet and the semiconductor laser unit 31 needs to be corrected according to the polar sheet offset amount measured by the position sensor 4. Assuming that the position sensor 4 detects that the polar sheet is offset to the left by a distance d, the initial width coordinate range of each region of the polar sheet is reduced by d, and then the region where the spot coordinate of each semiconductor laser unit 31 falls is re-determined, and the mapping relationship is corrected. Since the position of the polar sheet relative to the sensor module 5 also changes when the polar sheet is offset, the difference should also be calculated according to the position of each region of the polar sheet relative to the sensor module 5 after the polar sheet is offset.

[0044] S50, the control system inquires the number of the semiconductor laser unit 31 corresponding to each region of the pole piece according to the mapping relationship between each region of the pole piece and each semiconductor laser unit 31, and delivers the adjustment amount of each region of the semiconductor laser unit 31 to the semiconductor laser unit 31 with the corresponding number, so as to adjust the output power of each semiconductor laser unit 31; when the pole piece is deflected, the mapping relationship between each region of the pole piece and each semiconductor laser unit 31 is corrected according to the pole piece deflection amount obtained by the position sensor 4 before step S40.

[0045] S60, repeat steps S30-S50 to realize the regional closed-loop control of the pole piece.

[0046] The above is a specific description of the preferred embodiment of the present application, but the present application is not limited to the described embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A laser drying device, characterized in that: The drying equipment includes: a laser drying module, a position sensor, a sensor module and a control system; The laser drying module includes semiconductor laser units; the semiconductor laser units are arranged in an array and are electrically connected to the control system; The sensor module includes a sensor and a sensor driving unit; the sensor is mounted on the sensor driving unit and is slidably connected to the sensor driving unit; the sensor driving unit is located on one side of the laser drying module; The position sensor is placed at the edge of the strip and is used to detect the edge position of the strip; The sensor drive unit includes a sliding guide rail and a drive motor. The sliding guide rail is slidably connected to the sensor and is placed on one side of the laser drying module. The drive motor is installed at one end of the sliding guide rail and is in transmission connection with the sliding guide rail. The sliding guide rail includes a chain, a slide groove, a first transmission gear and a second transmission gear; the chain is arranged around the slide groove; the sliding guide rail includes a chain and a slide groove, the chain is arranged around the slide groove, and one end of the chain is rotatably connected to the first transmission gear, and the other end is rotatably connected to the second transmission gear; a T-shaped slider is installed at the connection between the sliding guide rail and the sensor, and the horizontal end of the T-shaped slider is arranged between the slide groove and the side of the chain away from the laser drying module; the first transmission gear is in driving connection with the output shaft of the drive motor; The laser drying module also includes a heat dissipation pipe, a laser cable pipe, a quartz glass plate and a shell; the heat dissipation pipe is installed on the surface of the shell away from the coating; the quartz glass plate is installed on the side of the shell close to the coating; the laser cable pipe is arranged around the heat dissipation pipe.

2. The laser drying equipment according to claim 1, characterized in that: The semiconductor laser unit is installed between the quartz glass plate and the housing.

3. A laser drying method, characterized in that: The laser drying method is applied to the laser drying equipment according to any one of claims 1-2, and the laser drying method comprises: S10, establishing a coordinate system and numbering each semiconductor laser unit of the laser drying module; S20, establishing a mapping relationship between each region of the pole piece and each semiconductor laser unit; S30, collecting the dryness of each area of ​​the electrode through the sensor module and transmitting it to the control system; S40, calculating the difference between the dryness of each region of the electrode and the desired dryness, and calculating the adjustment amount of the semiconductor laser unit in each region through a closed-loop control algorithm based on the difference; S50, the control system queries the number of the semiconductor laser unit corresponding to each area through the mapping relationship between each area of ​​the pole piece and each semiconductor laser unit, transmits the adjustment amount of the semiconductor laser unit in each area to the semiconductor laser unit with the corresponding number, and adjusts the output power of each semiconductor laser unit; S60, repeating steps S30-S50 to implement regional closed-loop control of the electrode.

4. A laser drying method according to claim 3, characterized in that: In step S10 , the numbering method is: numbering each semiconductor laser unit with the axis of the laser drying module as the starting point in the X direction and the upper edge or the lower edge of the laser drying module as the starting point in the Y direction.

5. A laser drying method according to claim 4, characterized in that: In step S20, the mapping relationship is established in the following manner: a rectangular coordinate system is established with the axis of the pole piece as the X-axis and the upper edge or lower edge of the pole piece as the Y-axis, and the width range of each area of ​​the pole piece is input. When the axis of the pole piece and the axis of the light output width of the light drying module are aligned, the mapping relationship between each area of ​​the pole piece and the semiconductor laser unit is obtained according to the length and width of the light spot of the semiconductor laser unit and the width range of each area of ​​the pole piece.

6. A laser drying method according to claim 3, characterized in that: Before step S40 , the method further includes: correcting the mapping relationship between each region of the pole piece and each semiconductor laser unit according to the pole piece offset obtained by measurement by the position sensor.

7. A laser drying method according to claim 3, characterized in that: In step S40, the closed-loop control algorithm is a PID closed-loop control algorithm.

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