A clamping device for polishing wafers

Abstract

The present invention relates to a wafer picking device. The present invention relates to a picking device for clamping wafer polishing. It includes a fixing device and a clamping device arranged at the bottom of the fixing device, the fixing device includes a fixing mechanism, the fixing mechanism includes a fixing cylinder, the bottom of the fixing cylinder is fixedly connected to a fixing frame, and the clamping device includes a clamping mechanism. When the present invention picks up the wafer, the hydraulic rod drives the clamping rod to slide, and when the clamping rod slides, the telescopic rod drives the positioning sleeve to slide in the direction away from the fixing cylinder through the cooperation of the inclined surface and the wedge block, thereby causing the clamping rod and the clamping groove to slide. When the clamping rod slides to the bottommost position, the clamping groove and the wedge block cooperate to cause the clamping rod and the scraping rod to press the wafer tightly on the fixing frame, completing the clamping and fixing of the wafer, and while fixing the wafer, scraping off larger particles on the surface of the wafer to avoid affecting the overall quality of the wafer during polishing.

Description

Technical Field

[0001] The present invention relates to a wafer picking device, in particular to a clamping type wafer picking device for polishing. Background Art

[0002] A wafer refers to a silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single crystal silicon. After the silicon crystal rod is ground, polished, and sliced, it forms a silicon wafer, also known as a wafer. Before grinding the single crystal silicon wafer, it needs to be etched. In order to ensure uniform etching effect on both sides of the single crystal silicon wafer, the single crystal silicon wafer is placed vertically. Therefore, a device that can pick up the single crystal silicon wafer and place it on the grinding table is required. However, the current common picking device has a very simple function. It cannot position the single crystal silicon wafer during grinding. After the single crystal silicon wafer is polished, it cannot clean the surface particles and polishing fluid of the single crystal silicon wafer. Therefore, a single crystal silicon wafer positioning device needs to be installed when grinding the single crystal silicon wafer. After the single crystal silicon wafer is polished, a single crystal silicon wafer cleaning device needs to be added, which increases a lot of production costs and processes and reduces production efficiency. Summary of the Invention

[0003] The object of the present invention is to provide a clamping type wafer polishing device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, a clamping device for polishing wafers is provided, including a fixing device and a clamping device arranged at the bottom of the fixing device, the fixing device including a fixing mechanism, the fixing mechanism including a fixing cylinder, the bottom of the fixing cylinder is fixedly connected to a fixing frame, the clamping device including a clamping mechanism, the clamping mechanism including a clamping rod, scraping mechanisms are provided on both sides of the clamping rod, the scraping mechanism includes a scraping rod, the scraping rod and one end of the clamping rod are hinged, a control structure is provided inside the fixing cylinder, when the clamping rod slides, the control structure drives the clamping rod to move, a synchronization structure is provided on one side of the scraping rod, when the clamping rod slides, the synchronization structure drives the scraping rod to slide on the surface of the wafer, when the clamping rod slides to a position away from the wafer, the synchronization structure drives the scraping rod to position the wafer.

[0005] As a further improvement of this technical solution, a placement groove is provided inside the fixing cylinder, one end of the placement groove passes through the fixing cylinder, a hydraulic rod is provided inside the placement groove, and the piston rod of the hydraulic rod is fixedly connected to one end of the clamping rod.

[0006] As a further improvement of the present technical solution, a sliding frame is fixedly connected to one side of the hydraulic rod, a placement groove is provided inside the placement groove, and the sliding frame is slidably arranged inside the placement groove.

[0007] As a further improvement of the present technical solution, the control structure includes a control mechanism, which includes a wedge block. A sliding groove is provided on one side of the fixed cylinder, one end of the sliding groove passes through the fixed cylinder, and the wedge block is slidably arranged inside the sliding groove. One end of the wedge block is fixedly connected to a control spring, and one end of the control spring is fixedly connected to the fixed cylinder.

[0008] As a further improvement of the present technical solution, a rotating frame is provided on one side of the wedge block, a rotating groove is opened inside the fixed cylinder, the rotating frame is rotatably arranged inside the rotating groove, a sliding block is hinged at one end of the rotating frame, and the sliding block and the wedge block are slidably connected.

[0009] As a further improvement of the present technical solution, the other end of the rotating frame is hingedly connected to a control frame, one end of the control frame is slidably connected to a telescopic rod, one end of the telescopic rod passes through a fixed tube, one end of the telescopic rod is fixedly connected to a positioning sleeve, and the clamping rod and the positioning sleeve are plugged into each other.

[0010] As a further improvement of the present technical solution, a bevel is provided at one end of the clamping rod. Before the clamping rod clamps and fixes the wafer, the bevel and one end of the wedge block are in contact. A clamping groove is provided near the middle of the other end of the clamping rod. When the clamping rod clamps and fixes the wafer, the clamping groove prevents the wedge block from being compressed.

[0011] As a further improvement of the present technical solution, the synchronization structure includes a sleeve rod, one end of the sleeve rod is engaged with the positioning sleeve and is hinged, the other end of the sleeve rod is plugged into and matched with the insertion rod, the sleeve rod is used to drive the insertion rod to rotate, one end of the insertion rod is hinged to one end of the scraping rod, the other end of the insertion rod is fixedly connected to a thrust spring, the thrust spring is used to give the insertion rod a thrust, and one end of the thrust spring is fixedly connected to the sleeve rod.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. In the clamping type wafer polishing picking device, when picking up the wafer, the hydraulic rod drives the clamping rod to slide. When the clamping rod slides, the cooperation of the inclined surface and the wedge block causes the telescopic rod to drive the positioning sleeve to slide in the direction away from the fixed cylinder, thereby causing the clamping rod and the clamping groove to slide. When the clamping rod slides to the bottom position, the clamping groove and the wedge block cooperate to enable the clamping rod and the scraping rod to press the wafer tightly on the fixed frame, completing the clamping and fixing of the wafer. While fixing the wafer, larger particles on the surface of the wafer are scraped off to avoid affecting the overall quality of the wafer during polishing.

[0014] 2. In the clamping type wafer polishing picking device, when the wafer is polished, the clamping rod drives the scraping rod to move, and under the influence of the synchronous structure, the scraping rod tightly fixes the wafer on the polishing table to prevent the wafer from shaking and causing damage during polishing. When the wafer is re-clamped and fixed after polishing, the scraping rod scrapes off the particles and polishing liquid on the surface of the wafer to avoid damage to the wafer or unsatisfactory polishing effect when polishing the other side of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is one of the overall structural diagrams of the present invention;

[0016] Figure 2 This is the second schematic diagram of the overall structure of the present invention;

[0017] Figure 3 It is a structural schematic diagram of the fixing device of the present invention;

[0018] Figure 4 It is a structural schematic diagram of the fixing mechanism of the present invention;

[0019] Figure 5 It is a structural schematic diagram of the control mechanism of the present invention;

[0020] Figure 6 It is a structural schematic diagram of the clamping device of the present invention;

[0021] Figure 7 It is a structural schematic diagram of the clamping mechanism of the present invention;

[0022] Figure 8 It is a structural schematic diagram of the scraping mechanism of the present invention;

[0023] Figure 9 It is a schematic structural diagram of the clamping rod of the wafer during polishing according to the present invention.

[0024] The meaning of each number in the figure is:

[0025] 1. Fixing device;

[0026] 11. Fixing mechanism; 111. Fixing cylinder; 112. Fixing frame; 113. Placement slot; 114. Placement slot; 115. Rotation slot; 116. Sliding slot; 117. Sliding frame; 118. Hydraulic rod; 12. Control mechanism; 121. Wedge block; 122. Control spring; 123. Rotating frame; 124. Control frame; 125. Telescopic rod; 126. Positioning sleeve; 127. Sliding block;

[0027] 2. Clamping device;

[0028] 21. Clamping mechanism; 211. Clamping rod; 212. Clamping groove; 213. Inclined surface; 22. Scraping mechanism; 221. Scraping rod; 222. Sleeve rod; 223. Insert rod; 224. Thrust spring. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention. Example 1

[0031] See also Figures 1-8 As shown, the purpose of this embodiment is to provide a clamping type wafer polishing picking device, including a fixing device 1 and a clamping device 2 arranged at the bottom of the fixing device 1, the fixing device 1 includes a fixing mechanism 11, the fixing mechanism 11 includes a fixing cylinder 111, the bottom of the fixing cylinder 111 is fixedly connected to a fixing frame 112, the fixing cylinder 111 is used to drive the fixing frame 112 to move, and the fixing frame 112 is used to drive the wafer to move, the clamping device 2 includes a clamping mechanism 21, the clamping mechanism 21 includes a clamping rod 211, and the clamping rod 211 is used to cooperate with the fixing frame 112 to clamp and fix the wafer. A scraping mechanism 22 is provided on both sides of the clamping rod 211. The scraping mechanism 22 includes a scraping rod 221. One side of the scraping rod 221 is in contact with the wafer. The scraping rod 221 is hinged to one end of the clamping rod 211. A control structure is provided inside the fixed cylinder 111. When the clamping rod 211 slides, the control structure drives the clamping rod 211 to move. A synchronization structure is provided on one side of the scraping rod 221. When the clamping rod 211 slides, the synchronization structure drives the scraping rod 221 to slide on the surface of the wafer. When the clamping rod 211 slides to a position away from the wafer, the synchronization structure drives the scraping rod 221 to position the wafer.

[0032] A placement groove 113 is provided inside the fixing cylinder 111. One end of the placement groove 113 passes through the fixing cylinder 111. A hydraulic rod 118 is provided inside the placement groove 113. The placement groove 113 is used to place the hydraulic rod 118. The piston rod of the hydraulic rod 118 is fixedly connected to one end of the clamping rod 211.

[0033] A sliding frame 117 is fixedly connected to one side of the hydraulic rod 118. The sliding frame 117 is used to determine the movement trajectory of the hydraulic rod 118. A placement groove 114 is opened inside the placement groove 113. The placement groove 114 is used to determine the movement trajectory of the sliding frame 117. The sliding frame 117 is slidably arranged inside the placement groove 114.

[0034] When taking the vertically placed wafer, the hydraulic rod 118 drives the clamping rod 211 to slide downward. When the clamping rod 211 slides, it is affected by the control structure to move in the direction away from the fixed cylinder 111. The clamping rod 211 drives the scraping rod 221 to slide downward. When the clamping rod 211 moves to the bottom position, it is affected by the control structure to drive the scraping rod 221 to press the wafer tightly against one side of the fixed frame 112. In the process of the clamping rod 211 moving downward, one side of the scraping rod 221 and the surface of the wafer are always kept in contact. When the clamping rod 211 is away from the fixed cylinder 111, the placement groove 114 and the sliding frame 117 cooperate to make the hydraulic rod 118 and the clamping rod 211 slide synchronously, thereby achieving the effect of clamping the wafer.

[0035] The control structure includes a control mechanism 12, which includes a wedge block 121. A sliding groove 116 is formed on one side of a fixed cylinder 111. One end of the sliding groove 116 passes through the fixed cylinder 111. The sliding groove 116 is used to determine the movement trajectory of the wedge block 121. The wedge block 121 is slidably arranged inside the sliding groove 116. One end of the wedge block 121 is fixedly connected to a control spring 122. The control spring 122 is used to provide a thrust to the wedge block 121. One end of the control spring 122 is fixedly connected to the fixed cylinder 111.

[0036] A rotating frame 123 is provided on one side of the wedge block 121. A rotating groove 115 is provided inside the fixed cylinder 111. The rotating groove 115 is used to accommodate the rotating frame 123 for rotation. The rotating frame 123 is rotatably arranged inside the rotating groove 115. A sliding block 127 is hingedly connected to one end of the rotating frame 123. The sliding block 127 is used to drive the rotating frame 123 to rotate. The sliding block 127 is slidably connected to the wedge block 121, and the wedge block 121 is used to drive the sliding block 127 to slide.

[0037] The other end of the rotating frame 123 is hinged to a control frame 124, one end of which is slidably connected to a telescopic rod 125. The control frame 124 is used to drive the telescopic rod 125 to slide. One end of the telescopic rod 125 passes through the fixed cylinder 111. One end of the telescopic rod 125 is fixedly connected to a positioning sleeve 126. The telescopic rod 125 is used to drive the positioning sleeve 126 to move. The clamping rod 211 and the positioning sleeve 126 are plugged together.

[0038] One end of the clamping rod 211 is provided with an inclined surface 213, which is used to push the wedge block 121 to move. Before the clamping rod 211 clamps and fixes the wafer, the inclined surface 213 and one end of the wedge block 121 are in contact. A clamping groove 212 is provided near the middle of the other end of the clamping rod 211. When the clamping rod 211 clamps and fixes the wafer, the clamping groove 212 prevents the wedge block 121 from being compressed. In order to enable the inclined surface 213 and the clamping groove 212 to drive the wedge block 121 to slide when the clamping rod 211 slides, the wedge block 121 is set to be wedge-shaped;

[0039] Before taking the wafer, the control spring 122 pushes the wedge block 121 so that one end of the wedge block 121 is in contact with the inclined surface 213. At this time, the telescopic rod 125 is retracted inside the fixed cylinder 111.

[0040] When the wafer is clamped and fixed, the hydraulic rod 118 drives the clamping rod 211 to slide downward, and the inclined surface 213 also gradually moves downward. The wedge block 121 fits one side of the clamping rod 211, and the clamping rod 211 makes the wedge block 121 overcome the elastic force of the control spring 122 and slide toward the inside of the sliding groove 116. When sliding, the wedge block 121 cooperates with the sliding block 127 to drive the rotating frame 123 to rotate, and the rotating frame 123 drives the control frame 124 to move. The control frame 124 drives the telescopic rod 125 to move toward the outside of the fixed cylinder 111, and the telescopic rod 125 drives the positioning sleeve 1 26 slides, and the positioning sleeve 126 drives the clamping rod 211 to slide in the direction away from the fixed cylinder 111. When the clamping rod 211 moves to the bottom position, the wedge block 121 is in the position of the clamping groove 212. The wedge block 121 is no longer subjected to the pressure force at this time. The control spring 122 provides a thrust to the wedge block 121, and then through the cooperation of the rotating frame 123, the sliding block 127, the control frame 124 and the telescopic rod 125, the positioning sleeve 126 is subjected to a pulling force, so that the clamping rod 211 and the scraping rod 221 are tightly attached to one side of the wafer, completing the clamping and fixation of the wafer.

[0041] The synchronization structure includes a sleeve rod 222, one end of which engages with the positioning sleeve 126 and is hinged, and the other end of the sleeve rod 222 is plugged with an insertion rod 223. The sleeve rod 222 is used to drive the insertion rod 223 to rotate. One end of the insertion rod 223 is hinged to one end of the scraping rod 221, and the other end of the insertion rod 223 is fixedly connected to a thrust spring 224. The thrust spring 224 is used to give the insertion rod 223 a thrust, and one end of the thrust spring 224 is fixedly connected to the sleeve rod 222;

[0042] When taking a wafer placed vertically, the clamping rod 211 drives the sleeve rod 222 to move downward, and the scraping rod 221 drives the sleeve rod 222 to rotate through the insertion rod 223. At the same time, the scraping rod 221 drives the insertion rod 223 to slide inside the sleeve rod 222. When the clamping rod 211 moves to the bottom position, the scraping rod 221 cooperates with the clamping rod 211 to press the wafer firmly on the fixing frame 112. The scraping rod 221 increases the contact area with the wafer, thereby improving the effect of clamping and fixing the wafer. At the same time, in the process of the scraping rod 221 moving downward, larger particles on one side of the wafer are cleaned off;

[0043] When placing the wafer on the polishing table, the clamping rod 211 and the fixing cylinder 111 are rotated to a horizontal state, and the wafer is placed on the polishing table. Figure 9 When the end of the clamping rod 211 is in contact with the fixed cylinder 111, the scraping rod 221 is moved and the sliding of the scraping rod 221 is carried out, thereby preventing the wafer from sliding during polishing.

[0044] When the wafer polishing is completed, the clamping rod 211 and the scraping rod 221 re-clamp and fix the wafer. During the clamping and fixing process, the scraping rod 221 scrapes the surface of the wafer to preliminarily clean the particles and polishing liquid on the surface of the wafer to avoid inconsistent horizontal height or damage to the wafer when the other side is polished later.

[0045] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A clamping type wafer polishing device, characterized in that: The invention comprises a fixing device (1) and a clamping device (2) arranged at the bottom of the fixing device (1), wherein the fixing device (1) comprises a fixing mechanism (11), the fixing mechanism (11) comprises a fixing cylinder (111), the bottom of the fixing cylinder (111) is fixedly connected to a fixing frame (112), the clamping device (2) comprises a clamping mechanism (21), the clamping mechanism (21) comprises a clamping rod (211), and scraping mechanisms (22) are provided on both sides of the clamping rod (211), and the scraping mechanism (22) comprises a scraping rod (22 1), the scraping rod (221) and one end of the clamping rod (211) are hinged, a control structure is provided inside the fixed cylinder (111), and when the clamping rod (211) slides, the control structure drives the clamping rod (211) to move, and a synchronization structure is provided on one side of the scraping rod (221), and when the clamping rod (211) slides, the synchronization structure drives the scraping rod (221) to slide on the surface of the wafer, and when the clamping rod (211) slides to a position away from the wafer, the synchronization structure drives the scraping rod (221) to position the wafer.

2. The clamping wafer polishing device according to claim 1, characterized in that: A placement groove (113) is provided inside the fixing cylinder (111), one end of the placement groove (113) passes through the fixing cylinder (111), a hydraulic rod (118) is provided inside the placement groove (113), and a piston rod of the hydraulic rod (118) is fixedly connected to one end of the clamping rod (211).

3. The clamping wafer polishing device according to claim 2, characterized in that: A sliding frame (117) is fixedly connected to one side of the hydraulic rod (118), a placement groove (114) is provided inside the placement groove (113), and the sliding frame (117) is slidably arranged inside the placement groove (114).

4. The clamping wafer polishing device according to claim 1, wherein: The control structure includes a control mechanism (12), the control mechanism (12) includes a wedge block (121), a sliding groove (116) is provided on one side of the fixed cylinder (111), one end of the sliding groove (116) passes through the fixed cylinder (111), the wedge block (121) is slidably arranged inside the sliding groove (116), one end of the wedge block (121) is fixedly connected to a control spring (122), and one end of the control spring (122) is fixedly connected to the fixed cylinder (111).

5. The clamping type wafer polishing device according to claim 4, characterized in that: A rotating frame (123) is provided on one side of the wedge block (121), a rotating groove (115) is provided inside the fixed cylinder (111), and the rotating frame (123) is rotatably arranged inside the rotating groove (115). A sliding block (127) is hingedly connected to one end of the rotating frame (123), and the sliding block (127) and the wedge block (121) are slidably connected.

6. The clamping type wafer polishing device according to claim 5, characterized in that: The other end of the rotating frame (123) is hinged to a control frame (124), one end of the control frame (124) is slidably connected to a telescopic rod (125), one end of the telescopic rod (125) passes through a fixed cylinder (111), one end of the telescopic rod (125) is fixedly connected to a positioning sleeve (126), and the clamping rod (211) and the positioning sleeve (126) are plug-fitted.

7. The clamping type wafer polishing device according to claim 6, characterized in that: One end of the clamping rod (211) is provided with an inclined surface (213). Before the clamping rod (211) clamps and fixes the wafer, the inclined surface (213) and one end of the wedge block (121) are in contact. A clamping groove (212) is provided near the middle of the other end of the clamping rod (211). When the clamping rod (211) clamps and fixes the wafer, the clamping groove (212) prevents the wedge block (121) from being compressed.

8. The clamping type wafer polishing device according to claim 1, characterized in that: The synchronization structure includes a sleeve rod (222), one end of the sleeve rod (222) is engaged with the positioning sleeve (126) and is hinged, the other end of the sleeve rod (222) is plugged with the insertion rod (223), the sleeve rod (222) is used to drive the insertion rod (223) to rotate, one end of the insertion rod (223) is hinged to one end of the scraping rod (221), the other end of the insertion rod (223) is fixedly connected to a thrust spring (224), the thrust spring (224) is used to give the insertion rod (223) a thrust, and one end of the thrust spring (224) is fixedly connected to the sleeve rod (222).

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