Temperature-controllable liquid cooling plate structure
By designing fin combination flow channel systems with various widths and shapes, the problem of liquid cooling plates being unable to control the temperature in local areas was solved, achieving efficient heat dissipation of the motor controller, meeting the temperature requirements of different areas, and improving heat dissipation efficiency and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-25
- Publication Date
- 2026-03-20
AI Technical Summary
Existing liquid cooling plates cannot reliably control the temperature of transistors in local areas, resulting in insufficient heat dissipation performance of the motor controller when operating at high power, and failing to meet the temperature requirements of different areas.
A temperature-adjustable liquid cooling plate structure was designed. By setting fin combinations of different widths and shapes, multiple flow channels are formed. By utilizing the combination and arrangement of fin structures, controllable heat dissipation of local area temperature can be achieved. The combination of upper cover plate, lower cover plate, stacked fins and folded fins forms a complex flow channel system, ensuring uniform liquid distribution and efficient heat exchange.
It achieves precise control of transistor temperature in local areas of the motor controller, improves heat dissipation efficiency, meets the temperature requirements of different areas, reduces voltage drop, and improves overall heat dissipation effect.
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Figure CN117042417B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of liquid cooling plate structure, and particularly to a temperature-controllable liquid cooling plate structure. BACKGROUND
[0002] With the development of science and technology, new energy vehicles gradually enter our life, and vehicles have become a "standard" for every family. The existing technology uses an electric drive system as a power source for a new energy vehicle, and the motor controller as the main power conversion and transmission component will generate a lot of heat during vehicle driving. Whether the motor controller and the vehicle can work normally depends on whether the heat can be effectively cooled. Insulated gate bipolar transistor (hereinafter referred to as IGBT) is the core component in the motor controller, and the operating temperature is a key factor affecting its performance and reliability.
[0003] With the increasing demand for power of new energy vehicles, the power requirement of the motor controller is getting higher and higher, and the IGBT needs to achieve higher working current. Accordingly, the transistor will generate more heat. The IGBT water-cooled cold plate needs to be strictly designed to meet the heat dissipation requirements of the high-power motor controller. The space of the motor and the motor controller is limited, and it is a long rectangular structure with a relatively small size in the longitudinal direction and a relatively large size in the transverse direction.
[0004] The existing liquid cooling plate is internally provided with a flow channel in a certain form. In actual use, the cooling liquid flows through the flow channel to take away the heat generated by the transistor. Since the flow channel has the same form, the heat dissipation performance in all areas is basically the same in actual use, and the temperature of the transistor in a certain local area cannot be reliably controlled. With the working condition requirement of the transistor temperature in different areas, it is urgent to develop a structure for controlling the temperature of the local area of the equipment and then controlling the temperature of the entire water-cooled plate. SUMMARY
[0005] In view of the above problems, the present application provides a temperature-controllable liquid cooling plate structure, which can control the temperature range of the transistor in a certain local area when multiple transistors need to be cooled at the same time, thereby achieving the effect of controlling the temperature of the water-cooled plate.
[0006] A temperature-controllable liquid cooling plate structure, characterized in that it comprises:
[0007] an upper cover plate comprising a central upper convex portion;
[0008] a lower cover plate;
[0009] a first group of stacked fins;
[0010] a second group of folded fins;
[0011] a third group of stacked fins;
[0012] liquid inlet;
[0013] and liquid outlet;
[0014] The upper cover plate sealing cover is arranged on the upper surface of the lower cover plate, and the upper convex part and the lower cover plate combine to form a cooling cavity, which is sequentially provided with a liquid inlet area, a first group of stacked fins, a first transition area, a second group of folded fins, a second transition area, a third group of stacked fins, and a liquid outlet area along the length direction;
[0015] The length direction of the upper plate of the upper convex part is respectively provided with a liquid inlet and a liquid outlet, and the first fins of the first group of stacked fins are sequentially and spaced arranged along the width direction of the cooling cavity to form a plurality of groups of first flow channels;
[0016] The second fins of the second group of folded fins are sequentially and spaced arranged along the width direction of the cooling cavity to form a plurality of groups of second flow channels, and the transverse width of the second flow channels is different from that of the first flow channels;
[0017] The third fins of the third group of stacked fins are sequentially and spaced arranged along the width direction of the cooling cavity to form a plurality of groups of third flow channels, and the transverse width of the third flow channels is different from that of the second flow channels;
[0018] The first transition area is arranged between the first group of stacked fins and the second group of folded fins, and the second transition area is arranged between the second group of folded fins and the third group of stacked fins;
[0019] The lower area of the cooling cavity corresponding to the liquid inlet is the liquid inlet area, and the width of the liquid inlet area covers all the first flow channels of the first group of stacked fins. The lower area of the cooling cavity corresponding to the liquid outlet is the liquid outlet area, and the width of the liquid outlet area covers all the third flow channels of the third group of stacked fins.
[0020] Further features are:
[0021] The second fins of the second group of folded fins include vertical fins formed in a wave shape along the length direction of the cooling cavity. The vertical fins combine the upper horizontal fins and the lower horizontal fins to form the second flow channels with a wave shape. The width of the second flow channels is arranged according to the heat dissipation setting temperature of the corresponding area, and the length of the second group of folded fins is arranged according to the length of the corresponding heat dissipation area;
[0022] The first group of stacked fins and the third group of stacked fins are both right-angled stacked heat exchange fins that are spliced and combined to form corresponding flow channels;
[0023] The first group of stacked fins and the third group of stacked fins have the same fin structure, so that they can be installed alternately and the manufacturing cost is reduced;
[0024] The surface area of the lower cover plate is larger than that of the upper cover plate, and a plurality of locking holes are arranged around the surface area of the lower cover plate which is larger than that of the upper cover plate, which facilitates the assembly of the whole structure and the corresponding heat dissipation device;
[0025] The liquid inlet is provided with a liquid inlet nozzle, and the liquid outlet is provided with a liquid outlet nozzle.
[0026] After the application is used, under the driving of the pump, the low-temperature liquid enters from the liquid inlet, flows into the liquid inlet area, and then spreads to the inlet of each first flow channel of the first group of stacked fins, the first stacked fin can eliminate the vortex generated by the liquid inlet to make the liquid uniform laminar flow distribution, the fin spacing adjusts the fluid velocity and pressure drop, the fluid passes through the first buffer area to effectively reduce the pressure drop; secondly, the liquid passes through the folded fin of the second group of folded fins, so that the liquid turbulent flow is reduced to obtain the maximum heat exchange, the fluid passes through the second buffer area to effectively reduce the pressure drop, then the liquid passes through the third flow channel corresponding to the third group of stacked fins again, and the liquid is distributed in a laminar flow again, the liquid flow rate in the fin is increased, the heat is quickly taken away, and finally the liquid absorbing heat in the whole process is output from the liquid outlet, so that heat is transferred to the environment with lower temperature at a remote end to release heat, and the work is repeated; the heat conduction mode is stacked fin-folding fin-stacked fin, which can adjust and match different fin structure combinations according to the temperature demand of the required area to exchange heat in multiple directions, and the heat absorption efficiency is high; when many transistors need to be cooled at the same time, the temperature of the transistors in a certain area stage can be controlled to be high or low, so that the effect of controlling the temperature of the water cooling plate can be achieved. BRIEF DESCRIPTION OF DRAWINGS
[0027] Figure 1 It is a perspective view of the present application;
[0028] Figure 2 It is a front view of the present application;
[0029] Figure 3 It is a top view of the present application (the upper convex part is in an open state);
[0030] Figure 4 It is Figure 3 A-A sectional structure schematic view of the present application;
[0031] Figure 5 It is Figure 3 B-B sectional structure schematic view of the present application;
[0032] Figure 6 It is an exploded perspective view of the present application;
[0033] Figure 7 It is an enlarged schematic view of the first group of stacked fins of the present application;
[0034] Figure 8An enlarged schematic view of the second set of folded fins of the present application;
[0035] The names corresponding to the numbers in the figure are as follows:
[0036] The upper cover plate 10, the upper convex portion 11, the lower cover plate 20, the water cooling plate locking hole 21, the first set of stacked fins 30, the first flow channel 31, the second set of folded fins 40, the second flow channel 41, the vertical fin 42, the upper horizontal fin 43, the lower horizontal fin 44, the third set of stacked fins 50, the third flow channel 51, the liquid inlet 60, the liquid inlet nozzle 61, and the liquid outlet 70, the liquid outlet nozzle 71, the cooling cavity 80, the liquid inlet area 81, the first transition area 82, the second transition area 83, and the liquid outlet area 84. DETAILED DESCRIPTION
[0037] A temperature-controllable liquid cooling plate structure, as shown in Figures 1-8 , comprises an upper cover plate 10, a lower cover plate 20, a first set of stacked fins 30, a second set of folded fins 40, a third set of stacked fins 50, a liquid inlet 60, and a liquid outlet 70.
[0038] The upper cover plate 10 comprises a central upper convex portion 11; the upper plate of the upper convex portion 11 is provided with a liquid inlet 60 and a liquid outlet 70 at the lengthwise ends, respectively,
[0039] The upper cover plate 10 is sealed and covered on the upper surface of the lower cover plate 20, and the upper convex portion 11 and the lower cover plate 20 are combined to form a cooling cavity 80, which is sequentially provided with a liquid inlet area 81, a first set of stacked fins 30, a first transition area 82, a second set of folded fins 40, a second transition area 83, a third set of stacked fins 50, and a liquid outlet area 84 along the lengthwise direction.
[0040] The first fins of the first set of stacked fins 30 are sequentially and spacedly arranged along the width direction of the cooling cavity 80 to form a plurality of first flow channels 31;
[0041] The second fins of the second set of folded fins 40 are sequentially and spacedly arranged along the width direction of the cooling cavity 80 to form a plurality of second flow channels 41, and the transverse width of the second flow channels 41 is different from that of the first flow channels 31.
[0042] The third fins of the third set of stacked fins 50 are sequentially and spacedly arranged along the width direction of the cooling cavity 80 to form a plurality of third flow channels 51, and the transverse width of the third flow channels 51 is different from that of the second flow channels 41.
[0043] The first transition area 82 is provided between the first set of stacked fins 30 and the second set of folded fins 40, and the second transition area 83 is provided between the second set of folded fins 40 and the third set of stacked fins 50.
[0044] The lower area of the cooling cavity 80 corresponding to the liquid inlet 60 is a liquid inlet area 81, the width of the liquid inlet area 81 covers all the first flow channels 31 of the first group of stacked fins 30, and the lower area of the cooling cavity 80 corresponding to the liquid outlet 70 is a liquid outlet area 84, the width of the liquid outlet area 84 covers all the third flow channels 51 of the third group of stacked fins 50.
[0045] In specific implementation, the second fins of the second group of folded fins 40 include vertical fins 42 formed in a wavy shape along the length direction of the cooling cavity, the vertical fins 42 are combined with the upper horizontal fins 43 and the lower horizontal fins 44 to form the second flow channels 41 in a wavy shape, the width of the second flow channels 41 is arranged according to the heat dissipation setting temperature of the corresponding area, and the length of the second group of folded fins 40 is arranged according to the length of the corresponding heat dissipation area.
[0046] In specific implementation, the first group of stacked fins 30 and the third group of stacked fins 50 are both right-angle stacked heat exchange fin splicing combinations forming corresponding flow channels.
[0047] The first group of stacked fins 30 and the third group of stacked fins 50 are the same fin structure, which ensures that they can be installed alternately and reduces the manufacturing cost.
[0048] The width of the second flow channels 41 is greater than the width of the first flow channels 31 and the third flow channels 51.
[0049] In specific implementation, the surface area of the lower cover plate 20 is greater than the surface area of the upper cover plate 10, and the surface area of the lower cover plate 20 is greater than the surface area of the upper cover plate 10 on each side along the length direction, respectively, and three water cooling plate locking holes 21 are arranged, a total of six water cooling plate locking holes 21, which facilitates the assembly of the entire structure and the corresponding heat dissipation device; the liquid inlet 60 is provided with a liquid inlet nozzle 61, and the liquid outlet 70 is provided with a liquid outlet nozzle 71.
[0050] The working principle is as follows: under the driving of the pump, the low-temperature liquid enters from the liquid inlet, flows into the liquid inlet area, and then spreads to the inlet of each first flow channel of the first group of stacked fins, the first stacked fin can eliminate the vortex generated by the liquid inlet to make the liquid uniform laminar flow distribution, the fin spacing adjustment controls the fluid velocity and pressure drop, the fluid passes through the first buffer area, effectively reducing the pressure drop; secondly, the liquid passes through the folded fins of the second group of folded fins, so that the liquid turbulent flow is reduced, the water flow velocity is maximized, the fluid passes through the second buffer area, effectively reducing the pressure drop, then the liquid passes through the third flow channel corresponding to the third group of stacked fins, and is distributed again, the liquid flow velocity in the fin is increased, the heat is quickly absorbed, and finally the liquid absorbing heat in the whole process is output from the liquid outlet, so that heat is transferred to the environment with lower temperature at a remote end to release heat, and the work is repeated; the heat conduction mode is stacked fins-folding fins-stacked fins, which can adjust and match different fin structure combinations according to the temperature demand of the required area to exchange heat in multiple directions, and the heat absorption efficiency is high; when many transistors need to be cooled at the same time, the temperature of the transistors in a certain area stage can be controlled to be high or low, so that the effect of controlling the temperature of the water cooling plate can be achieved.
[0051] It will be obvious to a person skilled in the art that the application is not limited to the details of the above-described exemplary embodiments, and the application can be implemented in other specific forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the application is defined by the appended claims rather than the above description, and it is intended to encompass all variations falling within the meaning and scope of the equivalent elements of the claims. Any reference signs in the claims should not be regarded as limiting the claims involved.
[0052] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.
Claims
1. A temperature-adjustable liquid cooling plate structure, characterized in that, It includes: The top cover plate includes a central upwardly protruding portion; Lower cover plate; First set of stacked fins; The second set of folding fins; The third set of stacked fins; liquid inlet; and the liquid outlet; The upper cover is sealed on the upper surface of the lower cover. The upper convex part and the lower cover are combined to form a cooling cavity. The cooling cavity is provided with a liquid inlet area, a first set of stacked fins, a first transition area, a second set of folded fins, a second transition area, a third set of stacked fins, and a liquid outlet area in sequence along the length direction. The upper plate of the convex portion is provided with an inlet and an outlet at both ends along the length direction. The first fins of the first set of stacked fins are arranged sequentially at intervals along the width direction of the cooling cavity to form several sets of first flow channels. The second fins of the second group of folded fins are arranged sequentially at intervals along the width direction of the cooling cavity to form several groups of second flow channels. The lateral width of the second flow channel is different from that of the first flow channel. The third fins of the third set of stacked fins are arranged sequentially at intervals along the width direction of the cooling cavity to form several sets of third flow channels. The lateral width of the third flow channel is different from that of the second flow channel. A first transition zone is provided between the first group of stacked fins and the second group of folded fins, and a second transition zone is provided between the second group of folded fins and the third group of stacked fins; The area below the liquid inlet of the cooling cavity is the liquid inlet area, and the width of the liquid inlet area covers all the first flow channels of the first group of stacked fins. The area below the liquid outlet of the cooling cavity is the liquid outlet area, and the width of the liquid outlet area covers all the third flow channels of the third group of stacked fins. The second set of folded fins includes vertical fins that form a wave shape along the length of the cooling cavity. The vertical fins are combined with upper and lower horizontal fins to form a second flow channel with a wave shape. The width of the second flow channel is arranged according to the heat dissipation setting temperature of the corresponding area, and the length of the second set of folded fins is arranged according to the length of the corresponding heat dissipation area. The first and third sets of stacked fins are both right-angle stacked heat exchange fins spliced together to form corresponding flow channels; The first group of stacked fins and the third group of stacked fins have the same fin structure; The width of the second flow channel is greater than the width of the first and third flow channels.
2. The temperature-adjustable liquid cooling plate structure as described in claim 1, characterized in that: The area of the lower cover plate is larger than that of the upper cover plate, and a number of locking holes for locking water-cooling plates are provided around the area of the lower cover plate that is larger than that of the upper cover plate.
3. The temperature-adjustable liquid cooling plate structure as described in claim 1, characterized in that: A liquid inlet nozzle is installed on the liquid inlet, and a liquid outlet nozzle is installed on the liquid outlet.
Citation Information
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