An aluminum-doped zinc oxide transparent conductive film preparation device

Abstract

The present invention belongs to the technical field of chemical coating, and specifically relates to a device for preparing an aluminum-doped zinc oxide transparent conductive film, which includes a coating reaction kettle. The coating reaction kettle includes a kettle body, a top cover is installed on the top of the kettle body, a liquid inlet pipe is provided on the side wall of the kettle body, a liquid outlet pipe is arranged on the side wall of the bottom of the reaction chamber, and the liquid outlet pipe passes through the side wall of the kettle body to communicate with the outside; a quick-dissolving component is arranged at the bottom of the reaction chamber of the kettle body to accelerate the dissolution of the precipitated solute at the bottom of the reaction chamber; in the present invention, by starting the driving device located at the bottom of the reaction kettle slowly at regular intervals, the driving device will drive the stirring disk to rotate in the installation groove, acting on the precursor solution near the bottom inside the reaction chamber, accelerating the shedding of the solid solute adhered to the surface and redissolving it into the precursor solution, thereby reducing the fixed solute redeposited inside the reaction chamber, ensuring the concentration of the effective components in the precursor solution, making the substrate coating process smoother, and reducing the rejection rate.

Description

Technical Field

[0001] The present invention belongs to the technical field of chemical coating, and specifically relates to a device for preparing an aluminum-doped zinc oxide transparent conductive film. Background Art

[0002] As an important branch of thin film materials, transparent conductive films have quite extensive uses due to their good optoelectronic properties. A transparent conductive film refers to a film with high transmittance and high conductivity for visible light wavelengths λ in the range of 380 nm to 760 nm. Transparency means that the material has a large bandgap width Eg > 3 eV and few free electrons; on the other hand, materials with high conductivity often have many free electrons like metals and thus are not transparent. Only materials that meet both of these conditions can be applied to transparent conductive films. Currently, the main types of transparent conductive films are: metal films, metal oxide films, other oxide films, polymer films, composite films, etc. Among them, the first two are the most widely used. Metal oxide films have three major systems: In2O3, SnO2, and ZnO.

[0003] ZnO thin film is a new type of II-VI group wide-bandgap semiconductor material, with excellent lattice, optoelectronic, piezoelectric, and dielectric properties, non-toxicity, easily available and inexpensive raw materials, and a relatively low epitaxial growth temperature, which is beneficial to reducing equipment costs, suppressing solid-phase external diffusion, improving film quality, and is also easy to implement doping. Therefore, in recent decades, ZnO thin films have become a popular research material for metal oxide transparent conductive films.

[0004] The existing process technology for preparing aluminum-doped zinc oxide transparent conductive films by the solvothermal method has low requirements for equipment and processing environment, low production costs, and has good development prospects; in the specific preparation process, a precursor solution is pre-prepared and mixed with a substrate in a high-temperature and high-pressure environment in a reaction kettle, so that a colloidal film is formed on the surface of the substrate, and then cleaning and drying treatments are carried out to solidify the colloidal film, thereby forming an aluminum-doped zinc oxide transparent conductive film on the surface of the substrate.

[0005] As a kind of metal oxide transparent conductive film, in the process of preparing an aluminum-doped zinc oxide transparent conductive film, when obtaining the precursor solution, inorganic aluminum salts and other solutes need to be dissolved, but during the change of reaction temperature and pressure, the already dissolved solutes may precipitate and accumulate on the bottom of the reaction kettle to form a layer; on the one hand, this will reduce the content of effective components inside the precursor solution and affect the coating quality; on the other hand, the precipitated solutes condense and adhere to the side wall of the reaction kettle, and these adhering layers will affect the heating of the precursor solution by the side wall of the reaction kettle and also increase the workload for cleaning the inner wall of the reaction kettle in the later stage. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art and solve the above technical problems, the present invention proposes a device for preparing an aluminum-doped zinc oxide transparent conductive film.

[0007] The technical solution adopted by the present invention to solve its technical problems is: The present invention proposes a device for preparing an aluminum-doped zinc oxide transparent conductive film, including a coating reaction kettle. The coating reaction kettle includes a kettle body. A top cover is installed on the top of the kettle body. A liquid inlet pipe is provided on the side wall of the kettle body. The liquid inlet pipe passes through the side wall of the kettle body and communicates with the internal reaction chamber. A liquid outlet pipe is provided on the side wall of the bottom of the reaction chamber. The liquid outlet pipe passes through the side wall of the kettle body and communicates with the outside.

[0008] A control body is provided on the outer surface of the side wall of the kettle body. Support rods are provided at the bottom of the kettle body. Fixing members are installed inside the reaction chamber. The fixing members are used to fix the substrate that receives the coating inside the reaction chamber. A rapid dissolution component is provided at the bottom of the reaction chamber to accelerate the dissolution of the precipitated solute at the bottom of the reaction chamber. The rapid dissolution component includes:

[0009] A driving shaft, the driving shaft is rotatably arranged at the bottom of the reaction chamber and is connected to a driving device installed at the bottom of the kettle body.

[0010] A stirring disc, the stirring disc is arranged on the outer surface of the side wall of the driving shaft and is embedded in an installation groove provided at the bottom of the reaction chamber. The stirring disc is slidably connected to the installation groove.

[0011] Stirring plates are uniformly arranged on the upper surface of the stirring disc. The stirring plates are distributed in a ring around the driving shaft.

[0012] Preferably, a protective layer is provided on the inner wall of the reaction chamber. The protective layer is made of polytetrafluoroethylene material.

[0013] Preferably, a partition is provided in the reaction chamber between the fixing member and the driving shaft. An exchange hole is provided in the middle of the partition. The area above the partition inside the reaction chamber is the coating area, and the area below the partition is the dissolution area.

[0014] Preferably, the exchange hole is conical, and the large end of the exchange hole is located at the upper surface of the partition.

[0015] Preferably, upper flow pipes are uniformly provided near the edge above the partition. The bottom opening of the upper flow pipe extends to the lower surface of the partition, and the bottom opening of the upper flow pipe is conical.

[0016] A guide plate is provided in the dissolution area below the bottom opening of the upper flow pipe. The guide plate is inclined and is connected to the side wall of the driving shaft through a connecting rod.

[0017] Preferably, liquid outlet holes are uniformly arranged on the side wall of the upstream pipe, and the liquid outlet holes point to the gap between adjacent upstream pipes.

[0018] Preferably, a scouring pipe is arranged at a position on the side wall of the upstream pipe facing the upper surface of the partition plate. The scouring pipe is of a conical pipe structure, and the opening part of the scouring pipe is inclined and points to the upper surface of the partition plate.

[0019] Preferably, the fixing member includes a fixing outer ring and a fixing inner ring. The fixing outer ring is clamped on an annular block arranged on the inner wall of the reaction chamber. The fixing inner ring is located below the middle part of the fixing outer ring, and the fixing inner ring and the fixing outer ring are connected by uniformly arranged fixing rods. A fixing groove is arranged at the upper end of the fixing rod, and an observation port is arranged in the middle part of the top cover.

[0020] Preferably, the upper surface of the fixing outer ring is connected to a telescopic device arranged on the top cover, and the telescopic device is controlled by the control body; an observation pipe is arranged at the observation port, the bottom of the observation pipe is closed and is located above the fixing member;

[0021] The part of the side wall of the observation pipe close to the bottom is made of a transparent material, and a camera is arranged inside the observation pipe.

[0022] Preferably, a suspension rod is arranged inside the observation pipe, and an installation ball is arranged at the bottom of the suspension rod; the cameras are uniformly installed on the outer surface of the installation ball and are distributed in a ring around the central axis of the suspension rod.

[0023] The beneficial effects of the present invention are as follows.

[0024] 1. For the aluminum-doped zinc oxide transparent conductive film preparation equipment described in the present invention, by starting the driving device located at the bottom of the reaction kettle slowly at regular intervals, the driving device will drive the stirring disk to rotate in the installation groove, and the rotating stirring disk will drive the stirring plate to rotate, acting on the precursor solution near the bottom inside the reaction chamber, so that the friction between the upper surface of the stirring disk and the precursor solution is enhanced, accelerating the shedding of the solid solute adhered to the surface and re-dissolving it into the precursor solution.

[0025] 2. In the preparation equipment for an aluminum-doped zinc oxide transparent conductive film according to the present invention, while the stirring plate rotates, it further stirs the precursor solution at the bottom, increasing the flow rate and intensifying the mixing, prompting the re-dissolution of the precipitated fixed solute; moreover, while the stirring plate rotates, the flow rate of the precursor solution increases between the gaps of the stirring plate, repeatedly flushing the surface part of the gaps, decelerating the shedding of the adhered solute and fully mixing it with the precursor solution; in this way, the re-precipitated fixed solute inside the reaction chamber is reduced, the concentration of the effective components in the precursor solution is ensured, the coating process of the substrate becomes smoother, the rejection rate is reduced, and the amount of solute adhered to the inner wall of the reaction chamber is also reduced, reducing the workload of later cleaning, reducing the maintenance cost, and ensuring the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below with reference to the accompanying drawings.

[0027] Figure 1 is a perspective view of the present invention.

[0028] Figure 2 is a half-sectional view in the front view direction of the present invention.

[0029] Figure 3 is Figure 2 a partial enlarged view at A in

[0030] Figure 4 is a perspective view of the stirring plate and the drive shaft in the present invention.

[0031] Figure 5 is a perspective view of the partition plate and the upper flow pipe in the present invention.

[0032] Figure 6 is a perspective view of the fixing member in the present invention.

[0033] Figure 7 is a perspective view of the camera in the present invention.

[0034] In the figure: kettle body 1, top cover 11, liquid inlet pipe 12, reaction chamber 13, coating area 131, dissolution area 132, annular block 133, liquid outlet pipe 14, control body 15, support rod 16, observation port 17, observation pipe 171, camera 172, mounting ball 173, suspension rod 174, telescopic device 18, fixing member 2, fixing outer ring 21, fixing inner ring 22, fixing rod 23, fixing groove 231, instant dissolution assembly 3, drive shaft 31, stirring disk 32, stirring plate 321, partition plate 33, exchange hole 331, upper flow pipe 34, liquid outlet hole 341, flushing pipe 342, guide plate 35, connecting rod 351. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0036] Embodiment 1

[0037] For an aluminum-doped zinc oxide transparent conductive film preparation device, in the existing process technology of preparing an aluminum-doped zinc oxide transparent conductive film by the solvothermal method, the requirements for equipment and processing environment are low, the production cost is low, and it has good development prospects. In the specific preparation process, a precursor solution is pre-prepared and mixed with a substrate in a high-temperature and high-pressure environment in a reaction kettle, so that a colloidal film is formed on the surface of the substrate, and then cleaning and drying treatments are carried out to solidify the colloidal film, thereby forming an aluminum-doped zinc oxide transparent conductive film on the surface of the substrate.

[0038] As a kind of metal oxide transparent conductive film, in the process of preparing an aluminum-doped zinc oxide transparent conductive film, when obtaining the precursor solution, solutes such as inorganic aluminum salts need to be dissolved. However, during the change of reaction temperature and pressure, the dissolved solutes may precipitate and accumulate to form a layer at the bottom of the reaction kettle. On the one hand, this will reduce the content of effective components inside the precursor solution and affect the coating quality. On the other hand, the precipitated solutes condense and adhere to the side wall of the reaction kettle, and these adhesion layers will affect the heating of the precursor solution by the side wall of the reaction kettle and also increase the workload for cleaning the inner wall of the reaction kettle in the later stage.

[0039] To effectively solve the above problems, as shown in the accompanying drawings of the specification Figure 1-7 shown, an aluminum-doped zinc oxide transparent conductive film preparation device includes a coating reaction kettle. The coating reaction kettle includes a kettle body 1, a top cover 11 is installed on the top of the kettle body 1, and a liquid inlet pipe 12 passes through the side wall of the kettle body 1 and communicates with the internal reaction chamber 13 for introducing the precursor solution. The inner cavity of the kettle body 1 is the reaction chamber 13, and a heating device is arranged on the side wall of the reaction chamber 13, which is composed of components configured for heating in the existing reaction kettle. A liquid outlet pipe 14 is arranged on the bottom side wall of the reaction chamber 13, and the liquid outlet pipe 14 passes through the side wall of the kettle body 1 and communicates with the outside. The liquid outlet pipe 14 is connected to a pump to discharge the internal waste liquid to a dedicated recovery and treatment device for harmless treatment after the processing is completed.

[0040] On the outer surface of the side wall of the kettle body 1, a control body 15 is provided. The control body 15 here is provided with a display interface and a control interface. The operation of each component of the device can be controlled through the control interface, and the operation status of each component of the device can be displayed on the display interface. At the bottom of the kettle body 1, a support rod 16 is provided. Inside the reaction chamber 13, a fixing member 2 is installed. The fixing member 2 is used to fix the substrate to be coated located inside the reaction chamber 13. The fixing member 2 can be a structural component for fixing the substrate during the existing substrate coating process. At the bottom of the reaction chamber 13, a rapid dissolution component 3 is provided to accelerate the dissolution of the precipitated solute at the bottom of the reaction chamber. The rapid dissolution component 3 includes:

[0041] A drive shaft 31, which is rotatably arranged at the bottom of the reaction chamber 13 and is connected to a drive device installed at the bottom of the kettle body 1. The drive device here can be a drive motor or other devices and is controlled by the control body 15. A stirring disk 32, which is arranged on the outer surface of the side wall of the drive shaft 31 and is embedded in an installation groove provided at the bottom of the reaction chamber 13. The stirring disk 32 is slidably connected to the installation groove. On the upper surface of the stirring disk 32, stirring plates 321 are evenly arranged, and the stirring plates 321 are distributed in a ring around the drive shaft 31.

[0042] Specific working process: Prepare the precursor solution required during the processing in advance, and then place the substrate on the fixing member 2. The substrate here can be a substrate or a wafer and serves as the raw material for subsequent processing into various electronic components. Place the fixing member 2 into the reaction chamber 13, and then close the top cover 11. After locking, the inside of the reaction chamber 13 is in a relatively closed environment. Input the precursor solution into the reaction chamber 13 through the liquid inlet pipe 12 so that the precursor solution completely covers the fixing member 2, and the substrate on it can fully contact the precursor solution.

[0043] Through the control body 15, start the heating device and adjust the temperature inside the reaction chamber 13 according to the processing requirements to facilitate the formation of a film on the surface of the substrate and ensure the quality of the coating process. During this process, due to temperature changes, some aluminum salt solutes may precipitate and adhere to the bottom of the reaction chamber 13 under the action of gravity, affecting the normal processing process. Therefore, a rapid dissolution component 3 is provided. Since the stirring disk 32 is embedded in the installation groove at the bottom of the reaction chamber 13 and acts as the bottom of the reaction chamber 13, the falling solid solute will fall onto the pre-set stirring disk 32 at the bottom and adhere to the surface of the stirring plate 321 and the gap between the stirring plates 321 on the upper surface of the stirring disk 32. In this way, it will not directly adhere to the inner wall and bottom wall of the reaction chamber 13, reducing the workload of later cleaning.

[0044] Timingly and slowly start the driving device located at the bottom of the reactor. The driving device will drive the stirring disk 32 to rotate in the installation groove. The rotating stirring disk 32 drives the stirring plate 321 to rotate, acting on the precursor solution near the bottom inside the reaction chamber 13, enhancing the friction between the upper surface of the stirring disk 32 and the precursor solution, accelerating the shedding of the solid solute adhered to the surface, and redissolving it into the precursor solution;

[0045] Furthermore, while the stirring plate 321 is rotating, it further stirs the precursor solution at the bottom, increasing the flow rate and intensifying the mixing, promoting the redissolution of the precipitated fixed solute; and while the stirring plate 321 is rotating, the flow rate of the precursor solution increases between the gaps of the stirring plate 321, repeatedly flushing the surface part of the gap, slowing down the shedding of the adhered solute and fully mixing it with the precursor solution;

[0046] This reduces the fixed solute redeposited inside the reaction chamber 13, ensures the concentration of the effective components in the precursor solution, makes the substrate coating process smoother, reduces the rejection rate, and also reduces the amount of solute adhered to the inner wall of the reaction chamber 13, reducing the workload of later cleaning, reducing the maintenance cost, and ensuring the processing efficiency.

[0047] Example Two

[0048] On the basis of Example One, as shown in the accompanying drawings of the specification Figure 1 - Figure 2 A protective layer is provided on the inner wall of the reaction chamber 13. The protective layer is the part on the inner wall of the kettle body 1 that is close to and directly contacts the precursor solution, and is prepared from polytetrafluoroethylene material;

[0049] Specific working process: On the basis of the specific working process in Example One, by setting the part of the inner wall of the reaction chamber 13 close to the precursor solution to be made of polytetrafluoroethylene material, using its characteristics of acid and alkali resistance and high temperature and high pressure resistance, the corrosion of the inner wall of the reaction chamber 13 by the solution during the reaction is reduced, the quality of the inner wall of the reaction chamber 13 is ensured, thus ensuring the service life of the reactor, and making the coating process of the substrate smoother.

[0050] Example Three

[0051] On the basis of Example One, as shown in the accompanying drawings of the specification Figure 2 - Figure 5 A partition plate 33 is provided at the part between the fixing member 2 and the driving shaft 31 inside the reaction chamber 13. An exchange hole 331 is provided in the middle part of the partition plate 33; the area above the partition plate 33 inside the reaction chamber 13 is the coating area 131, and the area below the partition plate 33 is the dissolution area 132; the exchange hole 331 is conical, and the large end of the exchange hole 331 is located at the upper surface part of the partition plate 33;

[0052] Specific working process: Based on the specific working process in the first embodiment, the operation of the stirring plate 321 can accelerate the re-dissolution of the solute solids accumulated at the bottom into the precursor solution. However, if the stirred precursor solution is relatively violent, resulting in an accelerated flow of the precursor solution inside the reaction chamber 13 and the impact acting upward, it may cause a strong scouring effect on the solution in contact with the substrate, affecting the film coating process on the substrate surface;

[0053] Therefore, a partition plate 33 is provided to separate the area where the substrate receives the film coating from the area where the stirring plate 321 acts. In this way, after the precipitated and solidified solute falls to the bottom of the reaction chamber 13 through the exchange holes 331, the stirring of the stirring plate 321 intensifies the flow of the solution inside the dissolution area 132, promoting the accelerated dissolution of the solid solute into the solution; while the blocking effect of the partition plate 33 slows down the transfer of the stirring effect in the dissolution area 132 to the upper film coating area 131, making the solution in the film coating area 131 relatively stable, so that the substrate on the film coating area 131 is in stable contact with the solution, and a film is successfully formed on the substrate surface; the exchange holes 331 realize the solution exchange between the dissolution area 132 and the film coating area 131, enabling the solutions in the two areas to be fully mixed, with similar effective component concentrations, thereby ensuring the smooth progress of the substrate film coating;

[0054] Moreover, the upper side of the exchange hole 331 is the large end, facilitating the downward entry of the solution into the dissolution area 132, while the lower side is the small end, and the upward entry of the solution in the dissolution area 132 into the film coating area 131 is more blocked. During the process of passing through the exchange hole 331, the kinetic energy of the solution is consumed, reducing the stirring effect on the solution inside the film coating area 131 and having less impact on the film coating process.

[0055] Embodiment Four

[0056] Based on the third embodiment, as shown in the accompanying drawings of the specification Figure 2 - Figure 5 As shown, upward flow pipes 34 are uniformly arranged at the upper side of the partition plate 33 near the edge. The bottom opening of the upward flow pipe 34 extends to the lower surface part of the partition plate 33, and the bottom opening of the upward flow pipe 34 is conical;

[0057] A deflector plate 35 is arranged at the part below the bottom opening of the upward flow pipe 34 inside the dissolution area 132. The deflector plate 35 is inclined, and the deflector plate 35 is connected to the side wall of the drive shaft 31 through a connecting rod 351; liquid outlet holes 341 are uniformly arranged on the side wall of the upward flow pipe 34, and the liquid outlet holes 341 point to the gap between adjacent upward flow pipes 34; a scouring pipe 342 is arranged at the part of the side wall of the upward flow pipe 34 facing the upper surface of the partition plate 33. The scouring pipe 342 is a conical pipe structure, and the opening part of the scouring pipe 342 is inclined and points to the upper surface of the partition plate 33;

[0058] Specific working process: Based on the specific working process in Embodiment 3, when the drive shaft 31 rotates, the guide plate 35 is driven to rotate through the connecting rod 351. The guide plate 35 is located below the upstream pipe 34. Therefore, when the guide plate 35 rotates, it pushes the contacting solution, causing the solution to be guided upward and then enter the upstream pipe 34, flowing out from the liquid outlet holes 341 and the flushing pipes 342 on the side wall of the upstream pipe 34; the liquid outlet holes 341 point to the gaps between the upstream pipes 34, avoiding the area where the substrate is located in the middle part, reducing the flow condition of the solution in the area where the substrate is located; while the openings of the flushing pipes 342 are inclined and point to the upper surface of the partition plate 33, so that the solution flowing directly out from the flushing pipes 342 can flush the upper surface of the partition plate 33, reducing the attachment of some solute solids on the upper surface of the partition plate 33 and also promoting the mixing of this part of the solute into the solution to accelerate its dissolution;

[0059] Furthermore, since the guide plate 35 does not extend to the lower side position where the exchange holes 331 are located, it reduces the influence of the upward flowing solution guided by the guide plate 35 on the downward flow of the upper side solution from the exchange holes 331. In this way, the solution exchange between the coating area 131 and the dissolution area 132 on both sides of the partition plate 33 belongs to a fixed trajectory, that is, after flowing downward from the exchange holes 331, it is stirred in the dissolution area 132 and fully mixed with the solid solute to promote its dissolution. Subsequently, the solution flows upward from the upstream pipes 34 at the edge part, promoting the smooth exchange of the solution on both sides of the coating area 131 and the dissolution area 132, and reducing the adverse impact on the substrate coating during the exchange process.

[0060] Embodiment 5

[0061] Based on Embodiment 4, as shown in the accompanying drawings of the specification Figure 2 、 Figure 6 shown, here is provided one possible technical solution of Embodiment 6. The fixing member 2 includes a fixing outer ring 21 and a fixing inner ring 22. The fixing outer ring 21 is clamped on the annular block 133 arranged on the inner wall of the reaction chamber 13. The fixing inner ring 22 is located below the middle part of the fixing outer ring 21, and the fixing inner ring 22 and the fixing outer ring 21 are connected by evenly arranged fixing rods 23. The upper end of the fixing rod 23 is provided with a fixing groove 231. The middle part of the top cover 11 is provided with an observation port 17;

[0062] Specific working process: On the basis of the specific working process in the first embodiment, during the installation of the base material, a plate-shaped or sheet-shaped base material is embedded into the fixing groove 231 on the upper side of the fixing rod 23, so that the embedded part of the base material is clamped and limitedly fixed. In this way, the base material is in a vertical state and is arranged in a ring around the central axis area. Subsequently, the fixing part 2 is embedded into the interior of the reaction chamber 13, and the fixing outer ring 21 is stuck on the upper side of the annular stopper 133, so that the whole fixing part 2 is limited. During the coating process, the base material is driven to remain stable, so that the surface of the base material can smoothly and successfully contact the surface of the precursor solution, realizing the coating process on the surface of the base material; Further, an observation port 17 is arranged in the middle of the top cover 11, which is convenient for observing the coating condition of the internal base material and adjusting parameters such as temperature according to the coating condition, so as to make the coating process smoother.

[0063] Example Six

[0064] On the basis of the fifth embodiment, as shown in the accompanying drawings of the specification Figure 2 , Figure 6 - Figure 7 shown, the upper surface of the fixing outer ring 21 is connected to the telescopic device 18 arranged on the top cover 11. Here, the telescopic device 18 can adopt devices such as electric telescopic rods, and the telescopic device 18 is controlled by the control body 15; An observation tube 171 is arranged at the observation port 17. The bottom of the observation tube 171 is closed and is located above the fixing part 2; The part of the side wall of the observation tube 171 near the bottom is made of transparent material, and a camera 172 is arranged inside the observation tube 171;

[0065] A suspension rod 174 is arranged inside the observation tube 171. The top of the suspension rod 174 is connected to the electric telescopic rod at the top of the observation tube 171, which is convenient for adjusting the vertical position of the camera 172. An installation ball 173 is arranged at the bottom of the suspension rod 174; The cameras 172 are evenly installed on the outer surface of the installation ball 173 and are distributed in a ring around the central axis of the suspension rod 174.

[0066] Specific working process: On the basis of the specific working process in the fifth embodiment, the main body of the telescopic device 18 and the observation tube 171 are both located inside the reaction kettle and are always located above the liquid surface of the precursor solution during the processing, without direct contact with the solution, so as to avoid the corrosive effect of the precursor solution from damaging components such as the main body of the telescopic device 18 and the observation tube 171 and affecting its normal processing;

[0067] When it is necessary to continue observing the substrate on the fixing member 2, the telescopic device 18 is activated to drive the fixing outer ring 21 to move upward, so that the entire fixing member 2 drives the substrate to move upward and separate from the precursor solution therein. At this time, the bottom of the observation tube 171 is embedded inside the upward-moving fixing inner ring 22, so that the transparent observation part on the inner wall side of the observation tube 171 is directly opposite to the position of the substrate on the fixing rod 23; the operator can control the electric telescopic rod to adjust the vertical position of the suspension rod 174, thereby adjusting the vertical position of the mounting ball 173, and observing the transparency of the substrate surface through the transparent part of the observation tube 171 from different vertical positions;

[0068] The camera 172 on the mounting ball 173 uses an industrial camera 172, which has high observation accuracy and is annularly distributed around the central axis of the mounting ball 173. It can more comprehensively and effectively and accurately observe the substrate distributed around the observation tube 171, assist the operator in judging the processing condition of the substrate, and thus adjust the inside of the reaction kettle to improve the success rate of substrate coating.

[0069] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. An aluminum-doped zinc oxide transparent conductive film preparation device, including a coating reaction kettle, the coating reaction kettle includes a kettle body (1), a top cover (11) is installed on the top of the kettle body (1), a liquid inlet pipe (12) is provided on the side wall of the kettle body (1), and the liquid inlet pipe (12) passes through the side wall of the kettle body (1) and communicates with the internal reaction chamber (13); a liquid outlet pipe (14) is provided on the side wall of the bottom of the reaction chamber (13), and the liquid outlet pipe (14) passes through the side wall of the kettle body (1) and communicates with the outside; A control body (15) is provided on the outer surface of the side wall of the kettle body (1), a support rod (16) is provided at the bottom of the kettle body (1), and a fixing member (2) is installed inside the reaction chamber (13). The fixing member (2) is used to fix the substrate to be coated inside the reaction chamber (13); characterized in that: A quick-dissolving component (3) is arranged at the bottom of the reaction chamber (13) to accelerate the dissolution of the precipitated solute at the bottom of the reaction chamber (13); the quick-dissolving component (3) includes: A drive shaft (31), the drive shaft (31) is rotatably arranged at the bottom of the reaction chamber (13) and is connected to a drive device installed at the bottom of the kettle body (1); A stirring disc (32), the stirring disc (32) is arranged on the outer surface of the side wall of the drive shaft (31) and is embedded in an installation groove provided at the bottom of the reaction chamber (13), and the stirring disc (32) is slidably connected to the installation groove; Stirring plates (321) are uniformly arranged on the upper surface of the stirring disc (32), and the stirring plates (321) are distributed in a ring around the drive shaft (31); A partition plate (33) is arranged at the position between the fixing member (2) and the drive shaft (31) inside the reaction chamber (13), and an exchange hole (331) is arranged in the middle of the partition plate (33); the area above the partition plate (33) inside the reaction chamber (13) is a coating area (131), and the area below the partition plate (33) is a dissolution area (132); The fixing member (2) includes a fixing outer ring (21) and a fixing inner ring (22), the fixing outer ring (21) is clamped on a ring-shaped block (133) provided on the inner wall of the reaction chamber (13), the fixing inner ring (22) is located below the middle part of the fixing outer ring (21), and the fixing inner ring (22) and the fixing outer ring (21) are connected by uniformly arranged fixing rods (23), and a fixing groove (231) is arranged at the upper end of the fixing rod (23).

2. The preparation device of an aluminum-doped zinc oxide transparent conductive film according to claim 1, characterized in that: A protective layer is arranged on the inner wall of the reaction chamber (13), and the protective layer is prepared from polytetrafluoroethylene material.

3. The preparation device of an aluminum-doped zinc oxide transparent conductive film according to claim 1, characterized in that: The exchange hole (331) is conical, and the large end of the exchange hole (331) is located at the upper surface part of the partition plate (33).

4. The preparation device of an aluminum-doped zinc oxide transparent conductive film according to claim 3, characterized in that: Upflow pipes (34) are uniformly arranged at the part near the edge above the partition plate (33), the bottom opening of the upflow pipe (34) extends to the lower surface part of the partition plate (33), and the bottom opening of the upflow pipe (34) is conical; A guide plate (35) is arranged at the part below the bottom opening of the upflow pipe (34) inside the dissolution area (132), the guide plate (35) is inclined, and the guide plate (35) is connected to the side wall of the drive shaft (31) through a connecting rod (351).

5. The preparation device of an aluminum-doped zinc oxide transparent conductive film according to claim 4, wherein: The side wall of the upstream pipe (34) is evenly provided with liquid outlet holes (341), and the liquid outlet holes (341) point to the gap between adjacent upstream pipes (34).

6. The preparation equipment for an aluminum-doped zinc oxide transparent conductive film according to claim 5, characterized in that: A flushing pipe (342) is provided at a position on the side wall of the upstream pipe (34) facing the upper surface of the partition plate (33). The flushing pipe (342) has a conical pipe structure, and the opening of the flushing pipe (342) is inclined to point to the upper surface of the partition plate (33).

7. The preparation equipment for an aluminum-doped zinc oxide transparent conductive film according to claim 1, characterized in that: An observation port (17) is provided at the middle part of the top cover (11).

8. The preparation device for an aluminum-doped zinc oxide transparent conductive film according to claim 7, characterized in that: The upper side surface of the fixed outer ring (21) is connected to a telescopic device (18) provided on the top cover (11), and the telescopic device (18) is controlled by the control body (15); an observation pipe (171) is provided at the observation port (17), the bottom of the observation pipe (171) is closed and is located above the fixing member (2); The part of the side wall of the observation pipe (171) near the bottom is made of a transparent material, and a camera (172) is provided inside the observation pipe (171).

9. The preparation device of an aluminum-doped zinc oxide transparent conductive film according to claim 8, wherein: A suspension rod (174) is provided inside the observation pipe (171), and a mounting ball (173) is provided at the bottom of the suspension rod (174); the cameras (172) are evenly mounted on the outer surface of the mounting ball (173) and are distributed in a ring around the central axis of the suspension rod (174).

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