Chip, integrated circuit and LED driving system

Abstract

The application provides a chip, an integrated circuit and an LED driving system. The chip comprises a first base island and a second base island. The first base island is provided with a first wafer, and a grounding end of the first wafer is connected with a first reference ground. The second base island is provided with a second wafer, and a grounding end of the second wafer is connected with a second reference ground. The second base island is arranged in a spaced mode with the first base island. Two edges of the first base island adjacent to the second base island are adjacent edges, an edge of the first base island away from the adjacent edges is an away edge, and an edge between the adjacent edges and the away edge is a pin edge. At least one first claw is arranged on the pin edge of the first base island, and at least one second claw is arranged on the pin edge of the second base island. The application solves the problem that the integrated circuit made of different circuit control modules cannot be packaged on a single base island chip frame, and the packaging frame of the existing chip has poor stability, is not conducive to wire bonding packaging of semiconductor wafers, and is easy to affect the quality of chip packaging.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED driving circuit, in particular to a chip, an integrated circuit and an LED driving system. BACKGROUND

[0002] At present, LED lighting usually uses a linear constant current driving circuit to provide a stable power supply current for an LED device, and a constant current control chip in the linear constant current driving circuit is packaged in a package form with a heat dissipation function. A metal base island of the chip package is exposed on the bottom of the chip and can transmit the heat of the chip to a circuit board.

[0003] The linear constant current driving circuit includes a plurality of different circuit control modules, and the integrated circuits made of different circuit control modules cannot be packaged in a single base island chip frame. Therefore, a double base island packaging frame is used to package the integrated circuits made of different circuit control modules, and the existing double base island packaging frame only splits one base island into two base islands. Since one base island is fixed and stable by the claws at both ends, when it is split into two long and narrow base islands on the upper and lower sides, the stability is reduced, and it is not conducive to wire bonding packaging of a semiconductor wafer, which can easily affect the quality of chip packaging. SUMMARY

[0004] The embodiments of the present application provide a chip, an integrated circuit and an LED driving system, which solve the problems that the integrated circuits made of different circuit control modules cannot be packaged in a single base island chip frame, and the stability of the existing chip packaging frame is poor, which is not conducive to wire bonding packaging of a semiconductor wafer and can easily affect the quality of chip packaging.

[0005] The present application is implemented in the following manner. A chip includes a first base island and a second base island. A first wafer is arranged on the first base island, and a ground end of the first wafer is connected to a first reference ground. A second wafer is arranged on the second base island, and a ground end of the second wafer is connected to a second reference ground. The second base island is arranged in a spaced manner with the first base island. Two edges adjacent to the first base island are adjacent edges, an edge away from the adjacent edges is an away edge, and an edge connected between the adjacent edges and the away edge is a pin edge. At least one first claw is arranged on the pin edge of the first base island. At least one second claw is arranged on the pin edge of the second base island.

[0006] In one of the embodiments, a plurality of chip pins are arranged on the outside of the pin edge in a spaced manner, and the plurality of chip pins include a first chip pin and a second chip pin. Each of the first claws and each of the second claws is connected to one of the first chip pins. The second chip pin is electrically connected to the first wafer and the second wafer through a metal connecting line.

[0007] In one of the embodiments, the ground end of the first wafer is electrically connected with the first base island, and the first chip pin connected with any of the first claw is used to connect the first reference ground;

[0008] The ground end of the second wafer is electrically connected with the second base island, and the first chip pin connected with any of the second claw is used to connect the second reference ground.

[0009] In one of the embodiments, the first claw and the first chip pin connected with each other are integrally formed;

[0010] The second claw and the first chip pin connected with each other are integrally formed.

[0011] In one of the embodiments, the ground end of the first wafer is electrically connected with one of the second chip pin, and the second chip pin electrically connected with the ground end of the first wafer is used to connect the first reference ground;

[0012] The ground end of the second wafer is electrically connected with one of the second chip pin, and the second chip pin electrically connected with the ground end of the second wafer is used to connect the second reference ground.

[0013] In one of the embodiments, the first base island and the second base island are made of conductive material, and the side surface of the first base island away from the first wafer and the side surface of the second base island away from the second wafer are used to contact the circuit board.

[0014] The embodiments of the present application further provide an integrated circuit, which comprises a power supply, a charge-discharge unit, a chip as described in any of the above embodiments, a first LED lamp group and a second LED lamp group. The power supply has a power supply output end. The charge-discharge unit is electrically connected with the power supply output end through a first diode. The chip comprises a power supply input port, a first ground port, a first reference voltage port, a second reference voltage port, a second ground port, a first current input controlled port and a second current input controlled port. The power supply input port and the second current input controlled port are connected with the power supply output end, and the first current input controlled port is connected with the charge-discharge unit. The anode of the first LED lamp group is connected with the first ground port, the anode of the first LED lamp group is connected with the first reference voltage port through a first resistor, and the cathode of the first LED lamp group is connected with the second reference voltage port. The anode of the second LED lamp group is connected with the second ground port, the anode of the second LED lamp group is connected with the cathode of the first LED lamp group through a second resistor, and the cathode of the second LED lamp group is grounded.

[0015] The embodiment of the present application further provides an integrated circuit, comprising a power supply, a charge-discharge unit, a chip as described in any of the above embodiments, a first LED lamp group and a second LED lamp group, the power supply having a power supply output end; the charge-discharge unit being electrically connected to the power supply output end through a first diode; the chip comprising a first reference voltage port, a first ground port, a second reference voltage port, a second current input controlled port, a first current input controlled port, a second ground port, an input voltage collection port and a power supply input port; the first reference voltage port being connected to the first ground port through a first resistor, the second reference voltage port being connected to the second ground port through a second resistor, the power supply input port being connected to the charge-discharge unit, and the input voltage collection port being connected to the power supply output end; an anode of the first LED lamp group being connected to the power supply input port, and a cathode of the first LED lamp group being connected to the first current input controlled port; an anode of the second LED lamp group being connected to the cathode of the first LED lamp group, and a cathode of the second LED lamp group being connected to the second current input controlled port.

[0016] The embodiment of the present application further provides an LED driving system, applied to the integrated circuit as described in the above embodiments, comprising a power supply unit, a charge-discharge unit, a first constant current control unit, a second constant current control unit, a third constant current control unit and an LED light emitting unit; the charge-discharge unit being electrically connected to the power supply unit; the first constant current control unit being electrically connected to the charge-discharge unit, and the first constant current control unit being connected to a first reference ground; the second constant current control unit being electrically connected to the power supply unit and the first constant current control unit, and the second constant current control unit being connected to the first reference ground; the third constant current control unit being electrically connected to the charge-discharge unit, and the third constant current control unit being connected to a second reference ground; the LED light emitting unit comprising a first LED lamp group and a second LED lamp group, an anode of the first LED lamp group being connected to the first reference ground, a cathode of the first LED lamp group being electrically connected to the third constant current control unit, the cathode of the first LED lamp group being electrically connected to an anode of the second LED lamp group through a second resistor, and an anode of the second LED lamp group being connected to the second reference ground.

[0017] The embodiment of the present application further provides an LED driving system, which is applied to the integrated circuit as described in the above embodiment, and comprises a power supply unit, a charge and discharge unit, a sampling signal unit, a first constant current control unit, a second constant current control unit and an LED light emitting unit; the charge and discharge unit is electrically connected with the power supply unit through a first diode; the sampling signal unit is electrically connected with the power supply unit, and has a first signal control end and a second signal control end; the first constant current control unit is electrically connected with the first signal control end, and comprises a first constant current source and a second constant current source, and the first constant current source and the second constant current source are both connected with a first reference ground; the second constant current control unit is electrically connected with the second signal control end and the first constant current control unit, and comprises a third constant current source and a fourth constant current source, and the third constant current source and the fourth constant current source are both connected with a second reference ground; the LED light emitting unit comprises a first LED lamp group and a second LED lamp group which are connected in series, an anode of the first LED lamp group is electrically connected with the charge and discharge unit, a cathode of the first LED lamp group is electrically connected with the first constant current source and the fourth constant current source, and a cathode of the second LED lamp group is electrically connected with the second constant current source and the third constant current source.

[0018] The chip, the integrated circuit and the LED driving system provided by the present application have the following beneficial effects: compared with the prior art, the chip of the present application adopts double base islands during packaging, the double base islands are arranged side by side and spaced apart, so that the integrated circuits made of different circuit control modules can be packaged on one chip frame; the base island is provided with a jaw connected with the chip pin at the pin edge on the two sides perpendicular to the arrangement direction of the double base islands to fix the base island, which greatly improves the stability of the base island, and one wafer is arranged on each base island, the wafer is connected with the chip pin arranged on the outer periphery of the pin edge, different wafers are connected with different reference grounds, which is beneficial to wire bonding packaging of the wafer and improves the quality of chip packaging. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 FIG. 1 is a structural schematic diagram of a chip in the related art;

[0020] Figure 2 FIG. 2 is a structural schematic diagram of a chip provided by the embodiment one of the present application; Figure 1 ;

[0021] Figure 3 FIG. 3 is a structural schematic diagram of a chip provided by the embodiment one of the present application; Figure 2 ;

[0022] Figure 4 FIG. 4 is a schematic diagram of a jaw arranged on the pin edge of the base island of the chip provided by the embodiment one of the present application; Figure 1 ;

[0023] Figure 2Fig. 1 is a schematic diagram of a chip provided by an embodiment of the present application, showing a first base island and a second base island; Figure 6 ;

[0024] Figure 3 Fig. 1 is a schematic diagram of a chip provided by an embodiment of the present application, showing a first base island and a second base island; Figure 7 ;

[0025] Figure 4 Fig. 1 is a schematic diagram of a chip provided by an embodiment of the present application, showing a first base island and a second base island; Figure 8 ;

[0026] Figure 5 Fig. 1 is a schematic diagram of a chip provided by an embodiment of the present application, showing a first base island and a second base island; Figure 9 ;

[0027] Figure 10 Fig. 2 is a circuit diagram of an integrated circuit provided by an embodiment of the present application;

[0028] Figure 11 Fig. 3 is a circuit diagram of an integrated circuit in the related art;

[0029] Figure 12 Fig. 4 is a circuit diagram of an integrated circuit provided by an embodiment of the present application;

[0030] Figure 13 Fig. 5 is a schematic diagram of an LED driving system provided by an embodiment of the present application;

[0031] Figures 2-3 Fig. 6 is a schematic diagram of an LED driving system provided by an embodiment of the present application.

[0032] Fig. 1 is a schematic diagram of a chip provided by an embodiment of the present application, showing a first base island and a second base island;

[0033] Fig. 1 is a schematic diagram of a chip provided by an embodiment of the present application, showing a first base island and a second base island;

[0034] Fig. 1 is a schematic diagram of a chip provided by an embodiment of the present application, showing a first base island and a second base island;

[0035] Fig. 1 is a schematic diagram of a chip provided by an embodiment of the present application, showing a first base island and a second base island; DETAILED DESCRIPTION

[0036] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0037] It should be noted that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.

[0038] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0039] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0040] It should also be noted that the same reference signs in the embodiments of the present application represent the same component or the same part, and for the same parts in the embodiments of the present application, only one part or component may be labeled with reference signs in the drawings, and it should be understood that the reference signs are also applicable to other identical parts or components.

[0041] The embodiments of the present application provide a chip, an integrated circuit and an LED driving system, which solve the problem that the integrated circuits made of different circuit control modules cannot be packaged in a single base island chip frame, and the packaging frame of the existing chip has poor stability, is not conducive to wire bonding packaging of semiconductor wafers, and is easy to affect the quality of chip packaging.

[0042] Embodiment one

[0043] Reference Figure 1The chip provided in Embodiment 1 of this application includes a first base island 1 and a second base island 2. A first wafer 10 is disposed on the first base island 1, and the ground terminal of the first wafer 10 is connected to a first reference ground. A second wafer 20 is disposed on the second base island 2, and the ground terminal of the second wafer 20 is connected to a second reference ground. The second base island 2 is spaced apart from the first base island 1. The two adjacent sides of the second base island 2 and the first base island 1 are adjacent sides 21, and the side away from the adjacent sides 21 is a away side 22. The side connecting the adjacent sides 21 and the away side 22 is a pin side 23. At least one first claw 31 is disposed on the pin side 23 of the first base island 1. At least one second claw 32 is disposed on the pin side 23 of the second base island 2.

[0044] In this embodiment, the pin edges 23 of the first base island 1 and the second base island 2 are both parallel to the arrangement direction of the first base island 1 and the second base island 2. Compared to... Figures 2-3 In the prior art dual-base island packaging frame, the pin edges 23 of the two base islands are perpendicular to the arrangement direction of the two base islands, so that each base island has only one pin edge 23. In this way, after setting the claws 3 on the pin edges 23, the two base islands will be pulled in opposite directions, resulting in poor stability of the existing dual-base island packaging frame. In the embodiment of this application, the first base island 1 has two pin edges 23, and the second base island 2 also has two pin edges 23. In this way, setting the claws 3 on the pin edges 23 will not widen the gap between the first base island 1 and the second base island 2, thereby ensuring that the first base island 1 and the second base island 2 are set more firmly and the chip packaging frame has better stability.

[0045] Furthermore, in related technologies, when the ground terminals of different circuit modules are connected to different reference grounds, the integrated circuits fabricated from these modules cannot be directly packaged within the same base island chip frame due to their different reference grounds. Therefore, different circuit modules need to be packaged on different chips, forming an integrated circuit comprising at least two chips. This results in a large overall PCB board size and numerous discrete components for the LED driver circuit board made using this integrated circuit. When the ground terminals of different circuit modules are connected to the same reference ground, different components on the circuit modules can be manufactured on the same wafer technology. This can lead to the integrated circuit fabricated from these circuit modules generating negative voltages during certain stages of system application, affecting normal operation. Alternatively, depending on the manufacturing process attributes of different circuit modules, they can be packaged into multiple IC or electronic devices in various package forms before being applied in the solution. However, LED driver solutions using multiple chips or multiple devices have low integration levels, affecting production efficiency, production costs, and production consistency.

[0046] In the embodiment of the present application, the first wafer 10 and the second wafer 20 are arranged on different base islands, and the ground end of the first wafer 10 is connected to the first reference ground, and the ground end of the second wafer 20 is connected to the second reference ground, so that two circuit modules connected to different reference grounds can be packaged together to form a chip, thereby reducing the volume of the chip package, facilitating the connection of multiple different circuit modules in the integrated circuit, and making the integrated circuit made of the chip of the present application have higher integration, the PCB board of the LED driving circuit made of the integrated circuit has smaller overall size, the integration of the LED driving circuit is improved, and the influence on production efficiency, production cost and production consistency is reduced.

[0047] In some embodiments, referring to Figure 2 , a plurality of chip pins 4 are arranged outside the pin edge 23, the plurality of chip pins 4 include first chip pins and second chip pins, each first claw 31 and each second claw 32 are connected to a first chip pin, and the second chip pin is electrically connected to the first wafer 10 and the second wafer 20 through a metal connecting line 41. In this way, the first base island 1 and the second base island 2 can be arranged more firmly, and the stability of the chip packaging frame is better, and the respective wiring ends of the first wafer 10 and the second wafer 20 can be led to the periphery of the chip. After the chip is packaged, the electrical connection with the first wafer 10 and the second wafer 20 can be achieved only by connecting the chip pins 4, which greatly reduces the connection difficulty of different circuit modules in the integrated circuit and improves the manufacturing efficiency of the integrated circuit.

[0048] Specifically, the number of chip pins 4 is not limited, in the embodiment of the present application, two chip pins 4 are arranged outside each pin edge 23, and there are a total of 8 chip pins 4, referring to Figure 3 , the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin, the seventh pin and the eighth pin are arranged from the upper right corner in a counterclockwise direction, the first claw 31 arranged on the pin edge 23 of the first base island 1 is connected to the second pin, the second claw 32 arranged on the pin edge 23 of the second base island 2 is connected to the fifth pin, and the first pin, the third pin, the fourth pin, the sixth pin, the seventh pin and the eighth pin are not directly connected to the base island. Direct connection refers to integral molding connection or other mechanical or other communication methods. During packaging, the electrical connection between the pins and the chip can be achieved by wire bonding. Of course, if necessary or required by the process, the corresponding first pin, third pin, fourth pin, sixth pin, seventh pin and eighth pin can be selectively connected to the base island. The corresponding claws integrally formed as pins can also be increased in number according to requirements. Referring to Figures 2-3The first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin, the seventh pin and the eighth pin are arranged from the top right corner in a counterclockwise direction, respectively; the first claw 31 arranged on the pin edge 23 of the first base island 1 is connected with the second pin, and the second claw 32 arranged on the pin edge 23 of the second base island 2 is connected with the sixth pin; the first pin, the third pin, the fourth pin, the fifth pin, the seventh pin and the eighth pin are not directly connected with the base island.

[0049] In some embodiments, referring to Figure 2 , the ground end of the first wafer 10 is electrically connected with the first base island 1, and the first chip pin connected with any one of the at least one first claw 31 is used to connect the first reference ground; the ground end of the second wafer 20 is electrically connected with the second base island 2, and the first chip pin connected with any one of the at least one second claw 32 is used to connect the second reference ground.

[0050] In the embodiments of the present application, the ground end of the first wafer 10 is connected with the first base island 1, and the first chip pin connected with the first claw 31 arranged on the pin edge 23 of the first base island 1 is used to connect the first reference ground; similarly, the ground end of the second wafer 20 is connected with the second base island 2, and the first chip pin connected with the second claw 32 arranged on the pin edge 23 of the second base island 2 is used to connect the second reference ground; that is, the ground end of the first wafer 10 is shifted to the outer periphery of the first base island 1, and the ground end of the second wafer 20 is shifted to the outer periphery of the second base island 2; thus, when the chip is packaged, the first base island 1 and the second base island 2 can be normally packaged together, and the purpose of connecting each terminal of the first wafer 10 and the second wafer 20 can be achieved by connecting each pin of the chip, which is beneficial to wire bonding packaging of the chip, thereby improving the quality of chip packaging; moreover, the two circuit modules connected with different reference grounds are packaged together to form a chip, which can also reduce the volume of chip packaging, is beneficial to connection of multiple different circuit modules in an integrated circuit, makes the integrated circuit made of the chip of the present application have higher integration, and makes the PCB board of the LED driving circuit made of the integrated circuit have smaller overall size, higher integration of the LED driving circuit, and reduced influence on production efficiency, production cost and production consistency.

[0051] In some embodiments, the first claw 31 and the first chip pin connected with each other are integrally formed; and the second claw 32 and the first chip pin connected with each other are integrally formed. In this way, the first claw 31 is directly arranged on the pin edge 23 of the first base island 1 to complete the arrangement of the chip pin 4, and similarly, the second claw 32 is arranged on the pin edge 23 of the second base island 2 to complete the arrangement of the chip pin 4, so that when other chip pins 4 are arranged, the number of arranged pins is reduced, and the arrangement efficiency of the chip pin is improved.

[0052] In some embodiments, the ground end of the first wafer 10 is electrically connected to a second chip pin, and the second chip pin electrically connected to the ground end of the first wafer 10 is used to connect the first reference ground; the ground end of the second wafer 20 is electrically connected to a second chip pin, and the second chip pin electrically connected to the ground end of the second wafer 20 is used to connect the second reference ground. That is, the ground end of the first wafer 10 is directly connected to the chip pin 4 used to connect the first reference ground, and similarly, the ground end of the second wafer 20 is directly connected to the chip pin 4 used to connect the second reference ground. In this way, all the terminals of the first wafer 10 and all the terminals of the second wafer 20 can be connected to different chip pins 4 through metal leads 41 at one time, which is convenient for the operator to connect and operate.

[0053] In the embodiments of the present application, the first base island 1 and the second base island 2 are arranged to be spaced apart, in order to arrange two different wafers, so that the integrated circuit made of different circuit control modules can be packaged in a chip frame. Therefore, the shape and area of the first base island 1 and the second base island 2 are not strictly limited, that is, the shape and area of the first base island 1 and the second base island 2 can be the same or different.

[0054] In some embodiments, the first base island 1 and the second base island 2 are arranged symmetrically with respect to each other, and the shape and area of the first base island 1 and the second base island 2 are the same. In this way, the first base island 1 and the second base island 2 can be easily made, greatly improving the efficiency of chip making.

[0055] It should be noted that the first base island 1 and the second base island 2 are arranged symmetrically and spaced apart, and the smaller the spacing distance, the smaller the size of the chip can be made, but it is necessary to ensure that the first base island 1 and the second base island 2 are isolated, and the insulation performance between the first base island 1 and the second base island 2 cannot be affected by being too close.

[0056] In some embodiments, referring to Figure 3 and Figures 4-8 At least one third claw 33 is arranged on the away edge 22. In this way, claws can be arranged on the pin edge 23 and the away edge 22 of the first base island 1 and the second base island 2, and the first base island 1 and the second base island 2 are fixed from multiple directions, so that the frame of the chip package is more stable, which is beneficial to the wire bonding packaging of the chip.

[0057] It should be noted that the first island 1 is provided with a first claw 31 on the pin edge 23, the second island 2 is provided with a second claw 32 on the pin edge 23, and the third claw 33 is provided on the away edge 22. The claw and the island can be integrally formed, the claw extends to the outside of the island as the pin of the chip, and the setting of the claw ensures that the corresponding island is firm. Each claw forms an angle with the edge of the corresponding island, that is, the first claw 31 forms an angle with the pin edge 23, the second claw 32 forms an angle with the pin edge 23, and the third claw 33 forms an angle with the away edge 22. The angle of the angle can be 90°.

[0058] In some embodiments, the first island 1 and the second island 2 are made of conductive material, and the side surface of the first island 1 away from the first wafer 10 and the side surface of the second island 2 away from the second wafer 20 are used to contact the circuit board.

[0059] It should be noted that when the chip is applied in an integrated circuit, the chip needs to be mounted on a PCB board. At this time, the side surface of the first island 1 away from the first wafer 10 and the side surface of the second island 2 away from the second wafer 20 contact the PCB board, so that the first wafer 10 and the second wafer 20 can be electrically connected to the PCB board. In addition, the heat generated by the first wafer 10 and the second wafer 20 during operation can also be transmitted to the PCB board through the first island 1 and the second island 2, thereby enhancing the heat dissipation efficiency of the first wafer 10 and the second wafer 20.

[0060] Reference Figures 4-8 In the embodiment of the present application, two chip pins 4 are arranged on the outer periphery of each pin edge 23 of the first island 1, and a first claw 31 is arranged on one of the pin edges 23 of the first island 1, and a second claw 32 is arranged on one of the pin edges 23 of the second island 2. The pin edge 23 where the first claw 31 is located and the pin edge 23 where the second claw 32 is located are arranged in a first direction, and the first direction is perpendicular to the arrangement direction of the first island 1 and the second island 2. The first claw 31 arranged on the pin edge 23 of the first island 1 can be connected with any one of the chip pins 4 arranged around the first island 1, and the second claw 32 arranged on the pin edge 23 of the second island 2 can be connected with any one of the chip pins 4 arranged around the second island 2. In this way, the packaging frame of the chip can have various implementation manners, such as Figure 9 The chip structure diagram is shown.

[0061] Embodiment two

[0062] Reference Figure 10Embodiment 2 of this application provides an integrated circuit, including a power supply 100, a charging / discharging unit 102, a chip 200 as described in Embodiment 1 above, a first LED lamp group 301, and a second LED lamp group 302. The power supply 100 has a power output terminal; the charging / discharging unit 102 is electrically connected to the power output terminal through a first diode D1; the chip 200 includes a power input port VT, a first ground port GND1, a first reference voltage port REXT1, a second reference voltage port REXT2, a second ground port GND2, a first current input controlled port OUT1, and a second current input controlled port OUT2; the power input port VT and the second ground port GND2 are connected to the power output terminal via a first diode D1. The current input controlled port OUT2 is connected to the power output terminal, and the first current input controlled port OUT1 is connected to the charging and discharging unit 102; the anode of the first LED lamp group 301 is connected to the first ground port GND1, the anode of the first LED lamp group 301 is connected to the first reference voltage port REXT1 through the first resistor R1, and the cathode of the first LED lamp group 301 is connected to the second reference voltage port REXT2; the anode of the second LED lamp group 302 is connected to the second ground port GND2, the anode of the second LED lamp group 302 is connected to the cathode of the first LED lamp group 301 through the second resistor R2, and the cathode of the second LED lamp group 302 is grounded.

[0063] The first reference voltage port REXT1 is used to adjust the current of the first LED group 301 and the second LED group 302, the second reference voltage port REXT2 is used to adjust the current of the second LED group 302, and the power input port VT is used to detect fluctuations in the input voltage in order to adjust the reference voltage of the first reference voltage port REXT1.

[0064] It should be noted that, Figure 10 It is a circuit diagram of an integrated circuit in related technologies. Figure 9 It uses two chips 200, each chip 200 containing one wafer, and Figure 9 The middle version uses the chip 200 from the first embodiment described above, encapsulating two wafers within a single chip 200. (Comparison) Figure 10 and Figure 11 It can be clearly seen that the PCB traces, layout, and size of the integrated circuit in Embodiment 2 of this application have been greatly improved.

[0065] Example 3

[0066] refer to Figure 12The embodiment three of the application provides an integrated circuit, which comprises a power supply 100, a charge-discharge unit 102, a chip 200 as any of the above embodiments, a first LED lamp group 301 and a second LED lamp group 302, the power supply 100 has a power supply output end; the charge-discharge unit 102 is electrically connected to the power supply output end through a first diode D1; the chip 200 comprises a first reference voltage port REXT1, a first ground port GND1, a second reference voltage port REXT2, a second current input controlled port OUT2, a first current input controlled port OUT1, a second ground port GND2, an input voltage collection port SEN and a power supply input port VIN; the first reference voltage port REXT1 is connected to the first ground port GND1 through a first resistor R1, the second reference voltage port REXT2 is connected to the second ground port GND2 through a second resistor R2, the power supply input port VIN is connected to the charge-discharge unit 102, and the input voltage collection port SEN is connected to the power supply output end; an anode of the first LED lamp group 301 is connected to the power supply input port VIN, and a cathode of the first LED lamp group 301 is connected to the first current input controlled port OUT1; an anode of the second LED lamp group 302 is connected to the cathode of the first LED lamp group 301, and a cathode of the second LED lamp group 302 is connected to the second current input controlled port OUT2.

[0067] The detailed structure of the chip 200 can refer to the above embodiments, and details are not described herein again; it can be understood that, since the chip 200 is used in the integrated circuit of the application, the embodiment of the integrated circuit of the application comprises all the technical solutions of all the embodiments of the chip 200, and can achieve the technical effects achieved by the above technical solutions.

[0068] Embodiment four

[0069] Reference Figure 12Embodiment 4 of this application provides an LED driving system applied to the integrated circuit of Embodiment 2 above, including a power supply unit 101, a charging and discharging unit 102, a first constant current control unit 201, a second constant current control unit 202, a third constant current control unit 203, and an LED light-emitting unit 300; the charging and discharging unit 102 is electrically connected to the power supply unit 101; the first constant current control unit 201 is electrically connected to the charging and discharging unit 102, and the first constant current control unit 201 is connected to a first reference ground GND1; the second constant current control unit 202 is electrically connected to the power supply unit 101 and the first constant current control unit 201, and the second constant current control unit 203 is connected to the first reference ground GND1. Unit 202 is connected to the first reference ground GND1; the third constant current control unit 203 is electrically connected to the charging and discharging unit 102 and the third constant current control unit 203 is connected to the second reference ground GND2; the LED light-emitting unit 300 includes a first LED lamp group 301 and a second LED lamp group 302. The anode of the first LED lamp group 301 is connected to the first reference ground GND1, the cathode of the first LED lamp group 301 is electrically connected to the third constant current control unit 203, the cathode of the first LED lamp group 301 is electrically connected to the anode of the second LED lamp group 302 through the second resistor R2, and the anode of the second LED lamp group 302 is connected to the second reference ground GND2.

[0070] It should be noted that the first constant current control unit 201 and the second constant current control unit 202 are fabricated together as the first wafer 10, and the third constant current control unit 203 is fabricated as the second wafer 20. The first reference ground GND1 connected to the first wafer 10 and the second reference ground GND2 connected to the second wafer 20 are... Figure 2 Since they are not at the same reference point, the chip 200 of Embodiment 1 of this application can be used to package the first wafer 10 and the second wafer 20. (Reference) Figure 2 The first wafer 10, fabricated together with the first constant current control unit 201 and the second constant current control unit 202, is placed in... Figure 2 The first base island 1 shown, and the second wafer 20 fabricated by the third constant current control unit 203 are placed on the first base island 1. Figure 12 The second base island 2 is shown. The GND1 PAD of the first wafer 10 is wired to the first base island 1. The pin edge 23 of the first base island 1 is led to the second pin of the chip 200. At this time, the electrical attribute of the second pin is GND1 of the first wafer 10. The GND2 PAD of the second wafer 20 is wired to the second base island 2. The pin edge 23 of the second base island 2 is led to the fifth pin of the chip 200. At this time, the electrical attribute of the fifth pin is GND2 of the second wafer 20.

[0071] The first LED light group 301 and the second LED light group 302 can be formed by connecting multiple LED strings in parallel.

[0072] The working principle of the LED driving system provided in Embodiment Four of the present application is as follows: the alternating voltage passes through the power supply unit 101, which is composed of four diodes. There is a controlled and controlled mechanism between the first constant current control unit 201 and the second constant current control unit 202. After the alternating voltage is rectified, in a single line network cycle, when the real-time voltage output by the power supply unit 101 is greater than the turn-on voltage of the LED light-emitting unit 300, the second constant current control unit 202 works, the first constant current control unit 201 is closed, and at the same time, the bus voltage charges the charge-discharge unit 102. The first constant current control unit 201 and the second constant current control unit 202 are connected to the same reference ground GND1.

[0073] When the first LED lamp group 301 and the second LED lamp group 302 of the LED light-emitting unit 300 have current flowing through, the second resistor R2 has current flowing through, which will cause a voltage difference between the two ends of R2. One end of the second resistor R2 in the LED light-emitting unit 300 is connected to the third constant current control unit 203, and the other end of the second resistor R2 is connected to the second reference ground GND2 of the third constant current control unit 203. The voltage difference generated by the second resistor R2 is provided as a detection signal to the third constant current control unit 203, and at this time, the third constant current control unit 203 stops working.

[0074] After the alternating voltage is rectified, in a single line network cycle, when the real-time voltage output by the power supply unit 101 is less than the turn-on voltage of the LED light-emitting unit 300, the second constant current control unit 202 cannot work. At this time, the voltage on the charge-discharge unit 102 is greater than the turn-on voltage of the LED light-emitting unit 300, the charge-discharge unit 102 is in a discharging state, the first constant current control unit 201 works, and the first LED lamp group 301 and the second LED lamp group 302 of the LED light-emitting unit 300 have a continuous current flowing through, realizing the continuous and stable light-emitting of the LED lamp beads of the first LED lamp group 301 and the second LED lamp group 302, and solving the problem of frequency flashing. In the normal working state, the first constant current control unit 201 and the second constant current control unit 202 work alternately in the line network cycle, and the charge-discharge unit 102 is in a continuous charging and discharging state.

[0075] The LED driving system of the present application can realize the beneficial effect of input wide voltage working, such as Figure 13As shown, when the line voltage decreases, the line input voltage is less than the turn-on voltage of the LED light unit 300, and the first constant current control unit 201 and the second constant current control unit 202 cannot work normally. At this time, the voltage difference on the second resistor R2 decreases, and the detection signal provided to the third constant current control unit 203 informs the third constant current control unit 203 to start working. Since the GND2 port of the third constant current control unit 203 is connected to the input end of the second LED lamp group 302, the current passes through the second LED lamp group 302, and the second LED lamp group 302 is lit, so that the line voltage decreases and the light emission can be realized, and the wide voltage working is realized.

[0076] Embodiment five

[0077] Reference Figure 13 Embodiment five of the present application provides an LED driving system applied to the integrated circuit of the above-mentioned embodiment three, which comprises a power supply unit 101, a charge-discharge unit 102, a sampling signal unit 103, a first constant current control unit 201, a second constant current control unit 202, and an LED light unit 300. The charge-discharge unit 102 is electrically connected to the power supply unit 101 through a first diode. The sampling signal unit 103 is electrically connected to the power supply unit 101, and the sampling signal unit 103 has a first signal control end EN1 and a second signal control end EN2. The first constant current control unit 201 is electrically connected to the first signal control end EN1, and the first constant current control unit 201 comprises a first constant current source 2011 and a second constant current source 2012, both of which are connected to a first reference ground GND1. The second constant current control unit 202 is electrically connected to the second signal control end EN2 and the first constant current control unit 201, and the second constant current control unit 202 comprises a third constant current source 2021 and a fourth constant current source 2022, both of which are connected to a second reference ground GND2. The LED light unit 300 comprises a first LED lamp group 301 and a second LED lamp group 302 connected in series, the anode of the first LED lamp group 301 is electrically connected to the charge-discharge unit 102, the cathode of the first LED lamp group 301 is electrically connected to the first constant current source 2011 and the fourth constant current source 2022, and the cathode of the second LED lamp group 302 is electrically connected to the second constant current source 2012 and the third constant current source 2021.

[0078] It should be noted that the sampling signal unit 103 and the first constant current control unit 201 are made into a first wafer 10, and the second constant current control unit 202 is made into a second wafer 20. The first reference ground GND1 connected to the first wafer 10 and the second reference ground GND2 connected to the second wafer 20 are not at the same reference point on the chip 200, and the chip 200 of the embodiment one of the present application can be used to package the first wafer 10 and the second wafer 20. Figure 13 It should be noted that the sampling signal unit 103 and the first constant current control unit 201 are made into a first wafer 10, and the second constant current control unit 202 is made into a second wafer 20. The first reference ground GND1 connected to the first wafer 10 and the second reference ground GND2 connected to the second wafer 20 are not at the same reference point on the chip 200, and the chip 200 of the embodiment one of the present application can be used to package the first wafer 10 and the second wafer 20. Figure 3, the first wafer 10 made by the sampling signal unit 103 and the first constant current control unit 201 is placed on the first base island 1 as shown in Figure 3 , the second wafer 20 made by the second constant current control unit 202 is placed on the second base island 2 as shown in Figure 13 . The GND1 PAD of the first wafer 10 is wired to the first base island 1, and the pin edge 23 of the first base island 1 is wired to the second pin of the chip 200, at which time the electrical property of the second pin is the GND1 of the first wafer 10. The GND2 PAD of the second wafer 20 is wired to the second base island 2, and the pin edge 23 of the second base island 2 is wired to the sixth pin of the packaging sheet, at which time the electrical property of the sixth pin is the GND2 of the second wafer 20.

[0079] In some embodiments, referring to Figure 13 , the power supply unit 101 includes a rectifier bridge or four diodes, and the power supply unit 101 is used to connect to alternating current. The LED light-emitting unit 300 includes a first LED light group 301 and a second LED light group 302, which can be multiple strings of LED light strings connected together in parallel. The first constant current control unit 201 includes a first constant current source 2011 and a second constant current source 2012, and the second constant current control unit 202 includes a third constant current source 2021 and a fourth constant current source 2022. The charge and discharge unit 102 includes an energy storage capacitor C1 and a diode D2, and the charge and discharge unit 102 is connected to the first reference ground GND1 of the first constant current control unit 201 and the second reference ground GND2 of the second constant current control unit 202. There is a controlled and controlled mechanism between the first constant current control unit 201 and the second constant current control unit 202.

[0080] The working principle of the LED driving system provided by Embodiment Five of the present application is that after the alternating current is rectified, in a single line network period, when the real-time voltage output by the power supply unit 101 is greater than the turn-on voltage of the LED light-emitting unit 300, the third constant current source 2021 of the second constant current control unit 202 works, the first constant current control unit 201 is closed, and at the same time the bus voltage charges the charge and discharge unit 102. As shown in ​ , the constant current sources of the first constant current control unit 201 and the second constant current control unit 202 do not belong to the same reference ground.

[0081] When the AC power is rectified, in a single line net cycle, when the real-time voltage outputted by the power supply unit 101 is less than the turn-on voltage of the LED light unit 300, the third constant current source 2021 of the second constant current control unit 202 cannot work, at this time, the voltage on the charge and discharge unit 102 is greater than the turn-on voltage of the LED light unit 300, the charge and discharge unit 102 is in the discharging state, the second constant current source 2012 of the first constant current control unit 201 works, and the LED lamp beads of the first LED lamp group 301 and the second LED lamp group 302 have a continuous current flowing thereon. The continuous and stable light emission of the lamp beads is realized, and the problem of frequency flicker is solved.

[0082] When the line net voltage decreases, the line net input voltage is greater than the voltage of the first LED lamp group 301 of the LED light unit 300, and less than the sum of the voltages of the first LED lamp group 301 and the second LED lamp group 302, the second constant current source 2012 of the first constant current control unit 201 and the third constant current source 2021 of the second constant current control unit 202 cannot normally work. At this time, in a single line net cycle, the first LED lamp group 301 and the first constant current source 2011 form a power-on loop or the first LED lamp group 301 and the second constant current source 2012 form a power-on loop. The current passes through the first LED lamp group 301, lights up the first LED lamp group 301, so that the line net voltage decrease can also realize light emission, and wide voltage operation is realized.

[0083] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An integrated circuit, characterized by The integrated circuit comprises: a power supply (100) having a power supply output end; a charge-discharge unit (102) electrically connected to the power supply output end through a first diode; a chip (200) comprising a power supply input port, a first ground port, a first reference voltage port, a second reference voltage port, a second ground port, a first current input controlled port, and a second current input controlled port; the power supply input port and the second current input controlled port are connected to the power supply output end, and the first current input controlled port is connected to the charge-discharge unit (102); a first LED lamp group (301), the anode of the first LED lamp group (301) is connected to the first ground port, the anode of the first LED lamp group (301) is connected to the first reference voltage port through a first resistor, and the cathode of the first LED lamp group (301) is connected to the second reference voltage port; a second LED lamp group (302), the anode of the second LED lamp group (302) is connected to the second ground port, the anode of the second LED lamp group (302) is connected to the cathode of the first LED lamp group (301) through a second resistor, and the cathode of the second LED lamp group (302) is grounded; the chip (200) comprises a first base island (1) and a second base island (2), the first base island (1) is provided with a first wafer (10), and the ground end of the first wafer (10) is connected to a first reference ground; the second base island (2) is provided with a second wafer (20), and the ground end of the second wafer (20) is connected to a second reference ground; the second base island (2) is arranged in a spaced manner with the first base island (1), two edges adjacent to the first base island (1) of the second base island (2) are adjacent edges (21), an edge away from the adjacent edges (21) is an away edge (22), and an edge connected between the adjacent edges (21) and the away edge (22) is a pin edge (23); at least one first claw (31) is arranged on the pin edge (23) of the first base island (1); and at least one second claw (32) is arranged on the pin edge (23) of the second base island (2).

2. The integrated circuit according to claim 1, wherein: a plurality of chip pins (4) are arranged on the outside of the pin edge (23) in a spaced manner, and the plurality of chip pins (4) comprise first chip pins and second chip pins; each first claw (31) and each second claw (32) is connected to a first chip pin; the second chip pins are electrically connected to the first wafer (10) and the second wafer (20) through a metal connecting line (41).

3. The integrated circuit according to claim 2, wherein: The ground end of the first wafer (10) is electrically connected with the first base island (1), the first chip pin connected with any one of the at least one first claw (31) is used for connecting the first reference ground, the ground end of the second wafer (20) is electrically connected with the second base island (2), and the first chip pin connected with any one of the at least one second claw (32) is used for connecting the second reference ground. Alternatively, the ground end of the first wafer (10) is electrically connected with one of the second chip pins, the second chip pin electrically connected with the ground end of the first wafer (10) is used for connecting the first reference ground, and the ground end of the second wafer (20) is electrically connected with one of the second chip pins, the second chip pin electrically connected with the ground end of the second wafer (20) is used for connecting the second reference ground.

4. The integrated circuit of claim 2, wherein: The first claw (31) and the first chip pin connected with each other are integrally formed, and the second claw (32) and the first chip pin connected with each other are integrally formed; And / or, the first base island (1) and the second base island (2) are made of conductive material, and the side surface of the first base island (1) away from the first wafer (10) and the side surface of the second base island (2) away from the second wafer (20) are used for contacting a circuit board.

5. An integrated circuit, characterized by Comprising: A power supply (100) having a power supply output end; A charge-discharge unit (102) electrically connected with the power supply output end through a first diode; A chip (200) comprising a first reference voltage port, a first ground port, a second reference voltage port, a second current input controlled port, a first current input controlled port, a second ground port, an input voltage collection port and a power input port; The first reference voltage port is connected with the first ground port through a first resistor, the second reference voltage port is connected with the second ground port through a second resistor, the power input port is connected with the charge-discharge unit (102), and the input voltage collection port is connected with the power supply output end; A first LED lamp group (301), an anode of the first LED lamp group (301) is connected with the power input port, and a cathode of the first LED lamp group (301) is connected with the first current input controlled port; A second LED lamp group (302), an anode of the second LED lamp group (302) is connected with the cathode of the first LED lamp group (301), and a cathode of the second LED lamp group (302) is connected with the second current input controlled port; The chip (200) comprises a first base island (1) and a second base island (2), the first base island (1) is provided with a first wafer (10), and a ground end of the first wafer (10) is connected to a first reference ground; the second base island (2) is provided with a second wafer (20), and a ground end of the second wafer (20) is connected to a second reference ground; the second base island (2) is arranged apart from the first base island (1), two edges of the second base island (2) adjacent to the first base island (1) are adjacent edges (21), an edge of the second base island (2) away from the adjacent edges (21) is an away edge (22), and an edge connected between the adjacent edges (21) and the away edge (22) is a pin edge (23); at least one first claw (31) is arranged on the pin edge (23) of the first base island (1); and at least one second claw (32) is arranged on the pin edge (23) of the second base island (2).

6. The integrated circuit of claim 5, wherein, a plurality of chip pins (4) are arranged outside the pin edge (23) and spaced apart from each other, and the plurality of chip pins (4) comprise first chip pins and second chip pins; each of the first claws (31) and each of the second claws (32) is connected to one of the first chip pins; the second chip pins are electrically connected to the first wafer (10) and the second wafer (20) through metal connecting lines (41).

7. The integrated circuit of claim 6, wherein, a ground end of the first wafer (10) is electrically connected to the first base island (1), any one of the first chip pins connected to any one of the at least one first claw (31) is used to connect the first reference ground, a ground end of the second wafer (20) is electrically connected to the second base island (2), and any one of the first chip pins connected to any one of the at least one second claw (32) is used to connect the second reference ground; or a ground end of the first wafer (10) is electrically connected to one of the second chip pins, the second chip pin electrically connected to the ground end of the first wafer (10) is used to connect the first reference ground, a ground end of the second wafer (20) is electrically connected to one of the second chip pins, and the second chip pin electrically connected to the ground end of the second wafer (20) is used to connect the second reference ground.

8. The integrated circuit of claim 6, wherein, the first claws (31) and the first chip pins connected to each other are integrally formed, and the second claws (32) and the first chip pins connected to each other are integrally formed; and / or, the first base island (1) and the second base island (2) are made of conductive material, and a side surface of the first base island (1) away from the first wafer (10) and a side surface of the second base island (2) away from the second wafer (20) are used to contact a circuit board. The application is applied to the integrated circuit of any one of claims 1-4, comprising:

9. An LED driving system, characterized by, a power supply unit (101). ​ a charging and discharging unit (102) electrically connected to the power supply unit (101); a first constant current control unit (201) electrically connected to the charging and discharging unit (102), and the first constant current control unit (201) is connected to a first reference ground; a second constant current control unit (202) electrically connected to the power supply unit (101) and the first constant current control unit (201), and the second constant current control unit (202) is connected to the first reference ground; a third constant current control unit (203) electrically connected to the charging and discharging unit (102), and the third constant current control unit (203) is connected to a second reference ground; an LED light emitting unit (300) comprising a first LED lamp group (301) and a second LED lamp group (302), an anode of the first LED lamp group (301) is connected to the first reference ground, a cathode of the first LED lamp group (301) is electrically connected to the third constant current control unit (203), the cathode of the first LED lamp group (301) is electrically connected to an anode of the second LED lamp group (302) through a second resistor, and the anode of the second LED lamp group (302) is connected to the second reference ground.

10. An LED driving system, characterized by, The integrated circuit is applied to any one of claims 5-8, comprising: a power supply unit (101); a charging and discharging unit (102) electrically connected to the power supply unit (101) through a first diode; a sampling signal unit (103) electrically connected to the power supply unit (101), and the sampling signal unit (103) has a first signal control end and a second signal control end; a first constant current control unit (201) electrically connected to the first signal control end, and the first constant current control unit (201) comprises a first constant current source (2011) and a second constant current source (2012), and the first constant current source (2011) and the second constant current source (2012) are both connected to a first reference ground; a second constant current control unit (202) electrically connected to the second signal control end and the first constant current control unit (201), and the second constant current control unit (202) comprises a third constant current source (2021) and a fourth constant current source (2022), and the third constant current source (2021) and the fourth constant current source (2022) are both connected to a second reference ground; an LED light emitting unit (300) comprising a first LED lamp group (301) and a second LED lamp group (302) connected in series, an anode of the first LED lamp group (301) is electrically connected to the charging and discharging unit (102), a cathode of the first LED lamp group (301) is electrically connected to the first constant current source (2011) and the fourth constant current source (2022), and a cathode of the second LED lamp group (302) is electrically connected to the second constant current source (2012) and the third constant current source (2021).

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