A single wafer automatic boron coating apparatus and method

Abstract

The application provides a single wafer automatic boron coating device and method, which comprises a coating box, a first electric push rod fixedly connected inside the coating box, a mounting plate fixedly connected to the top of the output end of the first electric push rod, a first motor fixedly connected to the top of the mounting plate, and a rotating plate fixedly connected to the top of the output shaft of the first motor. The first electric push rod, the mounting plate, the mounting rod, the first motor, the rotating plate, the hollow groove, the rotating joint, the suction hole, the supporting rod, the supporting plate and the ball are arranged to take and place the single wafer from the first U-shaped clamping plate or the second U-shaped clamping plate, and to limit the single wafer, so that the subsequent boron coating is facilitated. The sealing plate, the fixed frame, the second motor, the screw rod, the threaded block, the liquid injection block and the nozzle are arranged to facilitate the automatic coating of the single wafer, so that the operator does not need to coat the single wafer with liquid boron source on one side and constantly check the heating time and temperature on the other side.

Description

Technical Field

[0001] This invention relates to the field of single-wafer processing equipment technology, and in particular to an automatic boron coating apparatus and method for single-wafers. Background Technology

[0002] A single crystal wafer is a material used to make semiconductors. When molten elemental silicon solidifies, silicon atoms arrange themselves into many crystal nuclei in a diamond lattice. If these crystal nuclei grow into grains with the same crystal orientation, these grains combine in parallel to crystallize into single crystal silicon. In the field of solar photovoltaics, P-type solar cells have become the mainstream in the market due to their mature process technology. P-type solar cells are made by doping silicon materials with boron, and liquid boron source is spin-coated onto the single crystal wafer.

[0003] In existing technologies, after coating a single wafer with a liquid boron source, it still needs to be sent to a heating device for heating treatment. During the heating treatment, nitrogen gas is circulated as a protective gas, and the temperature needs to be kept constant at different times. This requires operators to coat the single wafer with liquid boron source while checking the heating time and temperature, or additional operators may be needed for dual-station operation, resulting in high labor costs. Therefore, we propose an automatic boron coating device and method for single wafers to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art by proposing an automatic boron coating device and method for single wafers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An automatic boron coating device for single-wafer crystals includes a coating box. A first electric push rod is fixedly connected inside the coating box. A mounting plate is fixedly connected to the top of the output end of the first electric push rod. A first motor is fixedly connected to the top of the mounting plate. A rotating plate is fixedly connected to the top of the output shaft of the first motor. The outer wall of the rotating plate has a slot, and the top of the rotating plate has multiple suction holes communicating with the slot. A rotary joint is fixedly installed on the outer wall of the output shaft of the first motor. An auxiliary support mechanism is provided on the top of the mounting plate. A hollow sealing plate is fixedly connected to the top of the coating box. A lead screw is rotatably connected inside the sealing plate. A fixing frame is fixedly connected to the outer wall of the coating box. The interior of the fixing frame is fixed... A second motor is fixedly connected to the coating box. One end of the output shaft of the second motor is fixedly connected to one end of the lead screw. A threaded block is threaded onto the outer wall of the lead screw. A hollow liquid injection block is fixedly connected to the bottom of the threaded block. A nozzle is fixedly connected to the bottom of the liquid injection block. An L-shaped bracket is fixedly connected to the outer wall of the coating box. A support plate is fixedly connected to the outer wall of the L-shaped bracket. One end of the support plate is fixedly connected to the outer wall of the coating box. A second electric push rod is fixedly connected to the outer wall of the L-shaped bracket. A T-shaped plate is fixedly connected to the outer wall of the output end of the second electric push rod. A hollow assembly plate is fixedly connected to the top of the T-shaped plate. A third motor is fixedly connected inside the assembly plate. A feeding mechanism is provided on the outer wall of the support plate.

[0007] Preferably, the auxiliary support mechanism includes three support rods, the bottom of each of the three support rods is fixedly connected to the top of the mounting plate, and the top of each of the three support rods is fixedly connected to a support block. The support block and the outer wall of the rotating plate are both provided with annular grooves, and the inner wall of the annular grooves is slidably connected with balls. When the rotating plate rotates, the balls slide in the annular grooves, and the support rods and support blocks provide auxiliary support for the rotating block.

[0008] Preferably, the feeding mechanism includes a shifting plate, the top of the output shaft of the third motor is fixedly connected to the bottom of the shifting plate, two vertical plates are fixedly connected to the top of the shifting plate, a first U-shaped clamping plate and a second U-shaped clamping plate are fixedly connected to the outer walls of the two vertical plates respectively, the same I-shaped block is fixedly connected between the first U-shaped clamping plate and the second U-shaped clamping plate, a rectangular groove is opened on the outer wall of the coating box, and the second U-shaped clamping plate is sleeved on the outer wall of the rotating plate, and the single crystal is supported by the first U-shaped clamping plate and the second U-shaped clamping plate.

[0009] Preferably, the outer wall of the mounting plate has four mounting holes, and the inner wall of each of the four mounting holes is slidably connected to a mounting rod. The bottom of the mounting rod is fixedly connected to the inner wall of the coating box. The mounting rod slides through the mounting holes and assists the mounting plate in moving up and down.

[0010] Preferably, the outer wall of the coating box has a circular hole, and the inner wall of the circular hole is rotatably connected to the outer wall of the output shaft of the second motor. The operation of the second motor causes the lead screw to rotate.

[0011] Preferably, the bottom of the sealing plate is provided with an elongated groove, the inner wall of which is slidably connected to the outer wall of the threaded block, and the elongated groove assists the threaded block in moving left and right.

[0012] Preferably, the outer wall of the support plate is provided with a sliding groove, and the inner wall of the sliding groove is slidably connected to the outer wall of the T-shaped plate.

[0013] Preferably, the outer wall of the assembly plate is slidably connected to the outer wall of the support plate, and a through hole is provided at the top of the assembly plate. The inner wall of the through hole is rotatably connected to the outer wall of the output shaft of the third motor. By setting the third motor, the shift plate is rotated, thereby causing the two vertical plates to rotate.

[0014] Preferably, the rotary joint is interconnected with the empty slot, an air pipe is fixedly connected to the outer wall of the rotary joint, a vacuum pump is fixedly connected to one end of the air pipe, a flexible tube is fixedly connected to the outer wall of the injection block, and a pump body is fixedly connected to one end of the flexible tube.

[0015] A method for using an automated boron coating apparatus for single wafers includes the following specific steps:

[0016] S1. The second electric push rod operates, causing the T-shaped plate to move the assembly plate to the left. The first U-shaped clamp and the second U-shaped clamp move with it, and the robot arm places the single lens on the first U-shaped clamp.

[0017] S2. The third motor operates to swap the first U-shaped clamp and the second U-shaped clamp via the switching plate; the second electric push rod operates to reset the T-shaped plate, and the first U-shaped clamp is located inside the coating box.

[0018] S3. The first electric push rod operates to support the single crystal from the first U-shaped clamp through the mounting plate, and the vacuum pump operates to adsorb the single crystal onto the rotating plate.

[0019] S4. The first motor rotates the rotating plate and the single crystal, and the second motor moves the liquid injection block and the nozzle left and right to automatically coat the single crystal.

[0020] S5. After coating the single crystal chip, the coated single crystal chip is sent out by the operation of the second electric push rod and the third motor, and the single crystal chip to be coated is sent into the coating box.

[0021] Compared with the prior art, the advantages of the present invention are as follows:

[0022] This solution uses a first electric push rod, mounting plate, mounting rod, first motor, rotating plate, empty slot, rotary joint, suction hole, support rod, support plate, and ball bearings to pick up and place single crystal wafers from the first or second U-shaped clamping plate and limit the positioning of the single crystal wafers for subsequent boron coating. By setting up a sealing plate, fixing frame, second motor, lead screw, threaded block, liquid injection block, and nozzle, it facilitates automatic coating of single crystal wafers, eliminating the need for operators to continuously monitor heating time and temperature while coating single crystal wafers with liquid boron source.

[0023] By setting up an L-shaped bracket, a support plate, a second electric push rod, a T-shaped plate, an assembly plate, a third motor, a transposition plate, a vertical plate, an I-shaped block, a first U-shaped clamping plate, a second U-shaped clamping plate, and a rectangular groove, the first U-shaped clamping plate and the second U-shaped clamping plate can be interchanged, making it convenient to feed and take out single crystal wafers. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural schematic diagram of an automatic boron coating device for a single wafer proposed in this invention;

[0025] Figure 2 This is a schematic cross-sectional view of an automated boron coating device for single wafers proposed in this invention.

[0026] Figure 3 This invention proposes an automated boron coating device for single wafers. Figure 2 A magnified structural diagram of part A in the diagram;

[0027] Figure 4 This invention proposes an automated boron coating device for single wafers. Figure 2 A magnified structural diagram of part B in the diagram;

[0028] Figure 5 This is a partial three-dimensional structural diagram of an automatic boron coating device for single wafers proposed in this invention.

[0029] In the diagram: 1. Coating box; 2. First electric push rod; 3. Mounting plate; 4. Mounting rod; 5. First motor; 6. Rotating plate; 7. Empty slot; 8. Rotary joint; 9. Suction hole; 10. Support rod; 11. Support block; 12. Ball bearing; 13. Sealing plate; 14. Fixing frame; 15. Second motor; 16. Lead screw; 17. Threaded block; 18. Injection block; 19. Nozzle; 20. L-shaped bracket; 21. Support plate; 22. Second electric push rod; 23. T-shaped plate; 24. Assembly plate; 25. Third motor; 26. Transposition plate; 27. Vertical plate; 28. I-shaped block; 29. ​​First U-shaped clamp; 30. Second U-shaped clamp; 31. Rectangular slot. Detailed Implementation

[0030] Depend on Figures 1-5As shown, an automatic boron coating device and method for a single crystal wafer includes a coating box 1. A first electric push rod 2 is fixedly connected inside the coating box 1. A mounting plate 3 is fixedly connected to the top of the output end of the first electric push rod 2. The operation of the first electric push rod 2 causes the mounting plate 3 to move upward. The outer wall of the mounting plate 3 has four mounting holes. The inner walls of the four mounting holes are slidably connected to mounting rods 4. The bottom of the mounting rods 4 is fixedly connected to the inner wall of the coating box 1. When the mounting plate 3 moves up and down, the mounting rods 4 slide through the mounting holes and assist the mounting plate 3 in moving up and down.

[0031] A first motor 5 is fixedly connected to the top of the mounting plate 3. A rotating plate 6 is fixedly connected to the top of the output shaft of the first motor 5. A slot 7 is opened on the outer wall of the rotating plate 6. Multiple suction holes 9 are opened on the top of the rotating plate 6. The suction holes 9 communicate with the slot 7. A rotary joint 8 is fixedly installed on the outer wall of the output shaft of the first motor 5. The rotary joint 8 communicates with the slot 7. An air pipe is fixedly connected to the outer wall of the rotary joint 8. A vacuum pump is fixedly connected to one end of the air pipe. When the vacuum pump operates, it generates suction force to draw the air out of the slot 7 through the air pipe, so that a negative pressure is generated in the slot 7. The single crystal is adsorbed onto the rotating plate 6 through the suction holes 9.

[0032] The top of the mounting plate 3 is provided with an auxiliary support mechanism. The top of the coating box 1 is fixedly connected with a hollow sealing plate 13. The inside of the sealing plate 13 is rotatably connected with a lead screw 16. The outer wall of the coating box 1 is fixedly connected with a fixing frame 14. The inside of the fixing frame 14 is fixedly connected with a second motor 15. The outer wall of the coating box 1 has a round hole. The inner wall of the round hole is rotatably connected to the outer wall of the output shaft of the second motor 15. The operation of the second motor 15 causes the lead screw 16 to rotate.

[0033] One end of the output shaft of the second motor 15 is fixedly connected to one end of the lead screw 16. The outer wall of the lead screw 16 is threaded with a threaded block 17. The rotation of the lead screw 16 causes the threaded block 17 to move left and right. The bottom of the sealing plate 13 is provided with a long groove. The inner wall of the long groove is slidably connected to the outer wall of the threaded block 17. The bottom of the threaded block 17 is fixedly connected with a hollow liquid injection block 18. The left and right movement of the threaded block 17 causes the liquid injection block 18 and the nozzle 19 to move left and right, which facilitates automatic coating of the single crystal wafer.

[0034] A flexible tube is fixedly connected to the outer wall of the injection block 18, and a pump body is fixedly connected to one end of the flexible tube. A nozzle 19 is fixedly connected to the bottom of the injection block 18. The pump body operates to deliver liquid boron source into the injection block 18 and sprays it onto the surface of the single crystal through the nozzle 19. An L-shaped bracket 20 is fixedly connected to the outer wall of the coating box 1. A support plate 21 is fixedly connected to the outer wall of the L-shaped bracket 20. The L-shaped bracket 20 supports the support plate 21. One end of the support plate 21 is fixedly connected to the outer wall of the coating box 1. The support plate 21 assists in the movement of the assembly plate 24.

[0035] The outer wall of the L-shaped bracket 20 is fixedly connected to a second electric push rod 22. The outer wall of the output end of the second electric push rod 22 is fixedly connected to a T-shaped plate 23. The outer wall of the support plate 21 is provided with a sliding groove. The inner wall of the sliding groove is slidably connected to the outer wall of the T-shaped plate 23. The top of the T-shaped plate 23 is fixedly connected to a hollow assembly plate 24.

[0036] The assembly plate 24 is internally fixedly connected to a third motor 25. The outer wall of the assembly plate 24 is slidably connected to the outer wall of the support plate 21. A through hole is provided on the top of the assembly plate 24. The inner wall of the through hole is rotatably connected to the outer wall of the output shaft of the third motor 25. The outer wall of the support plate 21 is provided with a feeding mechanism.

[0037] The auxiliary support mechanism includes three support rods 10. The bottom of each of the three support rods 10 is fixedly connected to the top of the mounting plate 3. Each of the three support rods 10 has a support block 11 fixedly connected to its top. The support block 11 and the outer wall of the rotating plate 6 are both provided with annular grooves. The inner wall of the annular groove is slidably connected with a ball bearing 12. When the rotating plate 6 rotates, the ball bearing 12 slides in the annular groove. The support rods 10 and the support block 11 provide auxiliary support for the rotating plate 6.

[0038] The feeding mechanism includes a shift plate 26. The top of the output shaft of the third motor 25 is fixedly connected to the bottom of the shift plate 26. Two vertical plates 27 are fixedly connected to the top of the shift plate 26. The outer walls of the two vertical plates 27 are respectively fixedly connected to a first U-shaped clamping plate 29 and a second U-shaped clamping plate 30. The operation of the third motor 25 causes the shift plate 26 to rotate slowly. The rotation of the shift plate 26 causes the two vertical plates 27 to rotate. The same I-shaped block 28 is fixedly connected between the first U-shaped clamping plate 29 and the second U-shaped clamping plate 30. The I-shaped block 28 increases the connection strength between the first U-shaped clamping plate 29 and the second U-shaped clamping plate 30. A rectangular groove 31 is opened on the outer wall of the coating box 1. The second U-shaped clamping plate 30 is sleeved on the outer wall of the rotating plate 6.

[0039] A method for using an automated boron coating apparatus for single wafers includes the following specific steps:

[0040] S1. The second electric push rod 22 operates, causing the T-shaped plate 23 to move the assembly plate 24 to the left. The first U-shaped clamp 29 and the second U-shaped clamp 30 move together, and the robot arm places the single lens on the first U-shaped clamp 29.

[0041] S2, the third motor 25 operates to swap the first U-shaped clamp 29 and the second U-shaped clamp 30 via the switching plate 26; the second electric push rod 22 operates to reset the T-shaped plate 23, and the first U-shaped clamp 29 is located inside the coating box 1.

[0042] S3. The first electric push rod 2 operates to support the single crystal from the first U-shaped clamp 29 through the mounting plate 3, and the vacuum pump operates to adsorb the single crystal onto the rotating plate 6.

[0043] S4. The first motor 5 rotates the rotating plate 6 and the single crystal, and the second motor 15 moves the liquid injection block 18 and the nozzle 19 left and right to automatically coat the single crystal.

[0044] S5. After coating the single crystal chip, the coated single crystal chip is sent out by the operation of the second electric push rod 22 and the third motor 25, and the single crystal chip to be coated is sent into the coating box 1.

[0045] Working principle: During use, the second electric push rod 22 moves the T-shaped plate 23 to the left, which in turn moves the assembly plate 24 to the left. The assembly plate 24 then moves the first U-shaped clamp 29 and the second U-shaped clamp 30 to the left, moving the first U-shaped clamp 29 a certain distance. A robotic arm then places the single crystal onto the first U-shaped clamp 29. The third motor 25 rotates the switching plate 26 slowly, swapping the positions of the first U-shaped clamp 29 and the second U-shaped clamp 30. The second electric push rod 22 moves the T-shaped plate 23 at a constant speed, feeding the single crystal from the rectangular slot 31 into the coating box 1. The first U-shaped clamp 29 is located at the edge of the rotating plate 6. The first electric push rod 22 moves the mounting plate 3 upward, which in turn moves the rotating plate 6 upward, moving the single crystal from the first U-shaped clamp 29 into the coating box 1. A U-shaped clamp 29 supports the wafer, while a vacuum pump generates negative pressure in the slot 7 via a rotary joint 8. The single wafer is then adsorbed onto the rotating plate 6 by suction and suction holes 9, fixing its position. The first motor 5 rotates the rotating plate 6 and the single wafer. The support rod 10 and the support block 11 assist the rotating plate 6 in rotating via ball bearings 12. The pump delivers liquid boron source to the injection block 18, which is then sprayed onto the surface of the single wafer through a nozzle 19. As the single wafer rotates, the liquid boron source is coated onto its surface. Simultaneously, the second motor 15 rotates the lead screw 16, which moves the threaded block 17 left and right. This movement of the threaded block 17 moves the injection block 18 and the nozzle 19 left and right, facilitating automatic coating of the single wafer. The operator does not need to continuously monitor the heating time and temperature while coating the single wafer with liquid boron source.

[0046] The above description is only a preferred embodiment of this practice, but the scope of protection of this embodiment is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the scope of the technology disclosed in this embodiment, based on the technical solution and inventive concept of this embodiment, should be covered within the scope of protection of this embodiment.

Claims

1. An automatic boron coating device for single wafers, comprising a coating box (1), characterized in that, The coating box (1) is fixedly connected to a first electric push rod (2). The top of the output end of the first electric push rod (2) is fixedly connected to a mounting plate (3). The top of the mounting plate (3) is fixedly connected to a first motor (5). The top of the output shaft of the first motor (5) is fixedly connected to a rotating plate (6). The outer wall of the rotating plate (6) is provided with a slot (7). The top of the rotating plate (6) is provided with multiple suction holes (9). The suction holes (9) communicate with the slot (7). The outer wall of the output shaft of the first motor (5) is fixedly installed with a rotary joint (8). The top of the mounting plate (3) is provided with an auxiliary support mechanism. The top of the coating box (1) is fixedly connected to a hollow sealing plate (13). The inside of the sealing plate (13) is rotatably connected to a lead screw (16). The outer wall of the coating box (1) is fixedly connected to a fixing frame (14). The inside of the fixing frame (14) is fixedly connected to a second motor (15). One end of the output shaft of the motor (15) is fixedly connected to one end of the lead screw (16). The outer wall of the lead screw (16) is threaded with a threaded block (17). The bottom of the threaded block (17) is fixedly connected to a hollow liquid injection block (18). The bottom of the liquid injection block (18) is fixedly connected to a nozzle (19). The outer wall of the coating box (1) is fixedly connected to an L-shaped bracket (20). The outer wall of the L-shaped bracket (20) is fixedly connected to a support plate (21). One end of the support plate (21) is fixedly connected to the outer wall of the coating box (1). The outer wall of the L-shaped bracket (20) is fixedly connected to a second electric push rod (22). The outer wall of the output end of the second electric push rod (22) is fixedly connected to a T-shaped plate (23). The top of the T-shaped plate (23) is fixedly connected to a hollow assembly plate (24). The inside of the assembly plate (24) is fixedly connected to a third motor (25). The outer wall of the support plate (21) is provided with a feeding mechanism. The feeding mechanism includes a shift plate (26), the top of the output shaft of the third motor (25) is fixedly connected to the bottom of the shift plate (26), the top of the shift plate (26) is fixedly connected to two vertical plates (27), the outer walls of the two vertical plates (27) are respectively fixedly connected to a first U-shaped clamp (29) and a second U-shaped clamp (30), the first U-shaped clamp (29) and the second U-shaped clamp (30) are fixedly connected to the same I-shaped block (28), the outer wall of the coating box (1) is provided with a rectangular groove (31), and the second U-shaped clamp (30) is sleeved on the outer wall of the rotating plate (6); The outer wall of the support plate (21) is provided with a sliding groove, and the inner wall of the sliding groove is slidably connected to the outer wall of the T-shaped plate (23).

2. The automatic boron coating device for a single wafer according to claim 1, characterized in that, The auxiliary support mechanism includes three support rods (10), the bottom of each of the three support rods (10) is fixedly connected to the top of the mounting plate (3), and the top of each of the three support rods (10) is fixedly connected to a support block (11). The support block (11) and the outer wall of the rotating plate (6) are both provided with annular grooves, and the inner wall of the annular groove is slidably connected with a ball (12).

3. The automatic boron coating device for a single wafer according to claim 1, characterized in that, The outer wall of the mounting plate (3) has four mounting holes, and the inner walls of the four mounting holes are slidably connected to mounting rods (4). The bottom of the mounting rods (4) is fixedly connected to the inner wall of the coating box (1).

4. The automatic boron coating device for a single wafer according to claim 1, characterized in that, The outer wall of the coating box (1) is provided with a circular hole, and the inner wall of the circular hole is rotatably connected to the outer wall of the output shaft of the second motor (15).

5. The automatic boron coating apparatus for a single wafer according to claim 1, characterized in that, The bottom of the sealing plate (13) is provided with a long groove, and the inner wall of the long groove is slidably connected to the outer wall of the threaded block (17).

6. The automatic boron coating apparatus for a single wafer according to claim 1, characterized in that, The outer wall of the assembly plate (24) is slidably connected to the outer wall of the support plate (21). The top of the assembly plate (24) has a through hole, and the inner wall of the through hole is rotatably connected to the outer wall of the output shaft of the third motor (25).

7. The automatic boron coating apparatus for a single wafer according to claim 1, characterized in that, The rotary joint (8) is interconnected with the empty groove (7). An air pipe is fixedly connected to the outer wall of the rotary joint (8), and a vacuum pump is fixedly connected to one end of the air pipe. A hose is fixedly connected to the outer wall of the liquid injection block (18), and a pump body is fixedly connected to one end of the hose.

8. A method of using the automatic boron coating apparatus for a single wafer according to any one of claims 1-7, characterized in that, The specific steps include the following: S1. The second electric push rod (22) operates, causing the T-shaped plate (23) to drive the assembly plate (24) to move to the left. The first U-shaped clamp (29) and the second U-shaped clamp (30) move together, and the robot arm places the single lens on the first U-shaped clamp (29). S2, the third motor (25) operates and through the switching plate (26) the first U-shaped clamp (29) and the second U-shaped clamp (30) are switched; the second electric push rod (22) operates and the T-shaped plate (23) is reset, and the first U-shaped clamp (29) is located in the coating box (1); S3, the first electric push rod (2) operates to lift the single crystal from the first U-shaped clamp (29) through the mounting plate (3), and the vacuum pump operates to adsorb the single crystal onto the rotating plate (6); S4. The first motor (5) rotates the rotating plate (6) and the single crystal, and the second motor (15) moves the liquid injection block (18) and the nozzle (19) left and right to automatically coat the single crystal. S5. After coating the single crystal, the coated single crystal is sent out by the operation of the second electric push rod (22) and the third motor (25), and the single crystal to be coated is sent into the coating box (1).

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