LED high-bay light

Abstract

The embodiment of the present application discloses a LED high-bay lamp, which comprises a light source assembly and a lamp body, the light source assembly is detachably connected below the lamp body and has a light-emitting surface facing away from the lamp body, a first coil is arranged on the surface of the light source assembly facing the lamp body, a second coil is arranged on the surface of the lamp body facing the light source assembly, the first coil and the second coil are separated by a distance and can generate electromagnetic induction between each other. In the LED high-bay lamp, electromagnetic power supply is adopted between the light source assembly and the lamp body, no wire connection is needed, local replacement and maintenance are easy, maintenance efficiency is improved, and the use and maintenance cost of the lamp are reduced.

Description

Technical Field

[0001] The embodiments of the present invention belong to the field of lighting technology, specifically, they relate to an LED high bay light. Background Technology

[0002] LED high bay lights, also known as LED industrial and mining lights, are an important component of modern industrial lighting. Their advantages, such as directional light emission, low power consumption, good driving characteristics, fast response speed, high shock resistance, long service life, and environmental friendliness, have gradually brought them into the public eye, making them the best choice for energy-saving lighting retrofits in traditional large industrial plants.

[0003] However, current LED high bay lights are non-replaceable fixtures. If a single component malfunctions, the entire light fixture needs to be replaced or repaired. Repairing is extremely inconvenient due to their high installation location, while replacing the entire fixture would inevitably lead to a waste of resources. In short, the non-replaceable structure of current LED high bay lights easily results in excessively high usage and maintenance costs. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide an LED high bay light to solve at least one technical problem existing in current LED high bay lights.

[0005] This invention provides an LED high bay light, which includes a lamp body and a light source assembly;

[0006] The light source assembly is detachably connected to the lower part of the lamp body and has a light-emitting surface facing away from the lamp body;

[0007] The light source assembly has a first coil on the side facing the lamp body;

[0008] The lamp body has a second coil on the side facing the light source assembly;

[0009] The first coil and the second coil are separated by a gap, and electromagnetic induction can be generated between them.

[0010] Furthermore, the light source assembly includes a light source base plate, a PCB board, and multiple LED beads;

[0011] The light source base plate is detachably connected to the bottom of the lamp body by screws, and the first coil is located on the side of the light source base plate facing the lamp body;

[0012] The PCB board is connected to the side of the light source base plate opposite to the first coil, and the multiple LED beads are arranged in an array on the side of the PCB board opposite to the light source base plate to form the light-emitting surface.

[0013] Furthermore, the light source assembly also includes a lens disposed on the side of the PCB board facing away from the light source base plate;

[0014] The lens is detachably connected to the outer edge of the light source base plate via multiple snap fasteners on its outer edge, so as to cover the PCB board therein.

[0015] Furthermore, the light source assembly also includes a sealing ring disposed around the periphery of the PCB board, the sealing ring being sandwiched between the lens and the light source base plate.

[0016] Furthermore, the LED high bay light also includes a first plastic cover for enclosing the first coil therein, the first plastic cover being connected to the side of the light source base plate facing away from the PCB board.

[0017] Furthermore, the base plate of the light source is made of a material that is a good conductor of heat.

[0018] Furthermore, the lamp body has a mounting groove on the side facing the light source assembly, and the second coil is disposed in the mounting groove and electrically connected to an external circuit through a conductive wire at the bottom of the groove.

[0019] Furthermore, the LED high bay light also includes a power supply installed in the mounting slot, the power supply being located between the bottom of the slot and the second coil;

[0020] The second coil is electrically connected to the power source, which is electrically connected to an external circuit through the conductive wire.

[0021] Furthermore, the LED high bay light also includes a second plastic cover for enclosing the second coil therein, the second plastic cover being detachably attached to the side of the lamp body facing the light source assembly.

[0022] Furthermore, the lamp body has multiple heat dissipation fins on the side facing away from the light source assembly.

[0023] According to an embodiment of the present invention, the LED high bay light has a light source assembly detachably connected to the bottom of the lamp body and has a light-emitting surface facing away from the lamp body; a first coil is provided on the side of the light source assembly facing the lamp body; a second coil is provided on the side of the lamp body facing the light source assembly; wherein, the first coil and the second coil are separated by a gap and can generate electromagnetic induction between them; the light source assembly and the lamp body are powered by electromagnetic power, eliminating the need for wire connection, facilitating partial replacement and repair, improving maintenance efficiency, and reducing the use and maintenance costs of the lamp. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is an exploded three-dimensional structural diagram of an LED high bay light provided in an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of a modular installation for an LED high bay light, provided as an embodiment of the present invention.

[0027] Figure 3 An exploded three-dimensional structural diagram of a lamp body module for an LED high bay light provided in an embodiment of the present invention;

[0028] Figure 4 An exploded three-dimensional structural diagram of a light source module for an LED high bay light provided in an embodiment of the present invention;

[0029] Figure 5 This is another exploded three-dimensional structural diagram of an LED high bay light provided in an embodiment of the present invention. Detailed Implementation

[0030] The following will describe in detail the implementation of the present invention with reference to the accompanying drawings and embodiments, so as to fully understand how the present invention uses technical means to solve technical problems and achieve technical effects and to implement it accordingly.

[0031] Certain terms are used in the specification and claims to refer to specific components. Those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components by differences in name, but by differences in function. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Substantially" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error. Furthermore, the terms "coupled" or "electrically connected" herein include any direct and indirect electrical coupling means. Therefore, if a first device is described as coupled to a second device, it means that the first device can be directly electrically coupled to the second device, or indirectly electrically coupled to the second device through other devices or coupling means. The following descriptions are preferred embodiments for carrying out the invention; however, these descriptions are for the purpose of illustrating the general principles of the invention and are not intended to limit the scope of the invention. The scope of protection of this invention is determined by the appended claims.

[0032] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes said element. Specific Implementation

[0034] Please refer to Figure 1 The above is an exploded three-dimensional structural diagram of an LED high-bay light according to an embodiment of the present invention. The LED high-bay light includes a lamp body 10 and a light source assembly 20.

[0035] The light source assembly 20 is detachably connected to the lower part of the lamp body 10 and has a light-emitting surface 210 facing away from the lamp body 10;

[0036] The light source assembly 20 is provided with a first coil 220 on the side facing the lamp body 10;

[0037] The lamp body 10 is provided with a second coil 110 on the side facing the light source assembly 20;

[0038] The first coil 220 and the second coil 110 are separated by a gap, and electromagnetic induction can be generated between them.

[0039] Specifically, the lamp body 10 is a disc-shaped or square structure, with one side relatively flat for connecting the light source assembly 20, and the other side provided with a heat sink for dissipating heat from the LED high bay light; the shape of the light source assembly 20 matches the lamp body 10, including but not limited to a disc-shaped or square structure, and the light source assembly 20 is detachably connected to the lower part of the lamp body 10, and the specific connection method includes but is not limited to screw connection or snap-fit ​​connection, and the side facing away from the lamp body 10 is the light-emitting surface 210, which is used to project light to the outside.

[0040] The first coil 220 is provided on the upper part of the light source assembly 20, and the second coil 110 is provided below the lamp body 10. The first coil 220 and the second coil 110 are matched with each other and are separated by a gap, which can generate electromagnetic induction. Specifically, the power output current on the lamp body 10 is converted into a magnetic field by the second coil 110, and is received by the first coil 220 on the light source assembly 20. It is then converted back into current by the magnetic field, and then converted into a constant current used by the LED light source by the components on the light source assembly 20, thereby driving the LED light source to work.

[0041] like Figure 2 As shown, the second coil 110 is mounted on the lamp body 10 to form the first module of the lamp, while the first coil 220 is mounted on the light source assembly 20 to form the second module of the lamp. The two modules are electrically connected through the magnetic field of the coils, eliminating the need for electrical connection wires. This makes the installation, use, and subsequent maintenance safer for operators, eliminating the risk of incorrect wiring, electric shock, or short circuits. Furthermore, modularization allows for targeted management of module materials, reducing the number of materials to be controlled and preventing delays in the entire product due to stockouts of certain long-lead-time materials.

[0042] In summary, the light source component and lamp body of this embodiment of the invention adopt modular electromagnetic power supply, which eliminates the need for wire connection. This facilitates local replacement and repair during use, improves maintenance efficiency, and reduces the use and maintenance costs of the lamp.

[0043] Please combine Figure 3-5 In other preferred embodiments of the present invention, the light source assembly 20 includes a light source base plate 201, a PCB board 202, and a plurality of LED beads 203;

[0044] The light source base plate 201 is detachably connected to the lower part of the lamp body 10 by screws, and the first coil 220 is disposed on the side of the light source base plate 201 facing the lamp body 10;

[0045] The PCB board 202 is connected to the side of the light source base plate 201 opposite to the first coil 220, and the plurality of LED beads 203 are arranged in an array on the side of the PCB board 202 opposite to the light source base plate 201 to form the light-emitting surface 210.

[0046] Specifically, the first coil 220, the light source base plate 201, and the PCB board 202 are stacked in layers. The light source base plate 201 is located in the middle and is connected to the lamp body 10 below by a detachable connection method such as screws. The first coil 220 is located above the light source base plate 201 and opposite to the lamp body 10. The PCB board 202 is located below the light source base plate 201, and multiple LED beads 203 are arranged in an array on the side of the PCB board away from the light source base plate 201. When these LED beads 203 are lit, they can form the light-emitting surface 210.

[0047] Furthermore, the light source assembly 20 also includes a lens 204 disposed on the side of the PCB board 202 facing away from the light source base plate 201;

[0048] The lens 204 is detachably connected to the outer edge of the light source base plate 201 via multiple snap fasteners 2041 on its outer edge, so as to cover the PCB board 202 therein.

[0049] Specifically, the lens 204 is provided with a plurality of fasteners 2041 on its outer edge. The lens 204 is fastened to the outer edge of the light source base plate 201 by the plurality of fasteners 2041. When the lens 204 is connected to the light source base plate 201, it can cover the PCB board 202 and the plurality of LED beads 203 arranged on it to protect them. At the same time, it can also distribute light and make the light more uniform.

[0050] Furthermore, the light source assembly 20 also includes a sealing ring 205 disposed around the PCB board 202, the sealing ring 205 being sandwiched between the lens 204 and the light source base plate 201.

[0051] Specifically, the sealing ring 205 surrounds the periphery of the PCB board 202 and is sandwiched between the lens 204 and the light source base plate 202. In this way, the PCB board 202 and the multiple LED beads 203 arranged on it are in a relatively closed space, which helps to improve lighting safety and extend the service life of the LED beads 203.

[0052] In addition, in other preferred embodiments of the present invention, the LED high bay light further includes a first plastic cover 2201 for covering the first coil 220 therein, the first plastic cover 2201 being connected to the side of the light source base plate 201 facing away from the PCB board 202.

[0053] Specifically, the first plastic cover 2201 has a flat groove structure, with its groove opening fastened to the side of the light source base plate 201 facing away from the PCB board 202, and fixedly connected to the top of the light source base plate 201 by screws, thereby covering the first coil 220 and protecting it.

[0054] Furthermore, the light source base plate 201 is made of a material that is a good conductor of heat. By using a material that is a good conductor of heat, the light source base plate 201 has excellent thermal conductivity, enabling it to quickly and thoroughly transfer the heat generated by the light source assembly 20 below it to the lamp body 10. The heat is then dissipated through ventilation by the heat sink on the upper part of the lamp body 10, thereby rapidly cooling the light source assembly 20 and improving its service life.

[0055] In addition, the lamp body 10 is provided with a mounting groove 101 on the side facing the light source assembly 20, and the second coil 110 is disposed in the mounting groove 101 and electrically connected to the external circuit through the conductive line at the bottom of the groove.

[0056] Specifically, the mounting groove 101 is formed by the lamp body 10 being recessed inwards towards the light source assembly 20. The second coil 110 is disposed in the mounting groove 101 and generates electromagnetic induction with the first coil 220 outside the mounting groove 101. The second coil 110 is connected to an external circuit through a conductive wire disposed at the bottom of the mounting groove 101 to obtain the current required to convert the magnetic field.

[0057] Furthermore, the LED power supply also includes a power supply 102 installed in the mounting slot 101, the power supply 102 being located between the bottom of the slot and the second coil 110;

[0058] The second coil 110 is electrically connected to the power supply 102, and the power supply 102 is electrically connected to an external circuit through the conductive wire.

[0059] Specifically, the LED power supply also includes the power supply 102, which provides the current required for the conversion of the magnetic field to the second coil 110. The power supply 102 is disposed at the bottom of the mounting groove 101, while the second coil 110 is disposed below the power supply 102. The two are electrically connected by a conductive wire or an electrical connector. At the same time, the power supply 102 is electrically connected to an external circuit through a conductive wire passing through the bottom of the groove.

[0060] Furthermore, the LED high bay light also includes a second plastic cover 103 for covering the second coil 110 therein, the second plastic cover 103 being detachably connected to the lamp body 10 on the side facing the light source assembly 20.

[0061] Specifically, the second plastic cover 103 also has a flat groove structure, with its groove opening fastened to the side of the lamp body 10 facing the light source assembly 20. In a preferred embodiment of this invention, the second plastic cover 103 is fastened to the groove opening of the mounting groove 101 and is fixedly connected to the bottom of the lamp body 10 by screws, so as to cover the second coil 110 and provide it with good protection.

[0062] It should be noted that both the first plastic cover 2201 and the second plastic cover 103 are made of plastic material. This material ensures that the electromagnetic wire can pass through smoothly, and that a strong electromagnetic induction can be generated between the first coil 220 and the second coil 110.

[0063] In other preferred embodiments of the present invention, the lamp body 10 is provided with a plurality of heat dissipation fins 104 on the side opposite to the light source assembly 20.

[0064] Specifically, the plurality of heat dissipation fins 104 are regularly arranged on the side of the lamp body 10 facing away from the light source assembly 20. A heat dissipation channel is formed between two adjacent heat dissipation fins 104, which leads directly to the center of the lamp body 10. This facilitates the flow of cold air around the lamp body within the heat dissipation channel, thereby exchanging heat with the lamp body 10 and improving the ventilation and heat dissipation effect of the lamp body 10, thus ensuring the service life of the LED high bay light.

[0065] It should be understood that the terminology used in the embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” used in the embodiments of the invention and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise; “multiple” generally includes at least two, but does not exclude the inclusion of at least one.

[0066] It should be understood that the term "and / or" used in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, "first component and / or second component" can represent: the first component existing alone, the first component and the second component existing simultaneously, or the second component existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0067] It should be understood that although the terms first, second, third, etc., may be used to describe certain components in the embodiments of the present invention, these components should not be limited to these terms alone. These terms are only used to distinguish the components from each other. For example, without departing from the scope of the embodiments of the present invention, a first component may also be referred to as a second component, and similarly, a second component may also be referred to as a first component.

[0068] Depending on the context, the words “if” or “suppose” as used here can be interpreted as “when” or “in response to determination” or “in response to monitoring.” Similarly, depending on the context, the phrases “if determination” or “if monitoring (the stated condition or event)” can be interpreted as “when determination” or “in response to determination” or “when monitoring (the stated condition or event)” or “in response to monitoring (the stated condition or event).”

[0069] In embodiments of the present invention, terms such as "generally equal to," "generally perpendicular to," and "generally symmetrical" mean that the macroscopic dimensional or relative positional relationship between the two features is very close to the stated relationship. However, those skilled in the art will understand that due to the existence of objective factors such as errors and tolerances, the positional relationship of objects is difficult to be precisely constrained at a small scale or even a microscopic angle. Therefore, even if there are slight errors in the dimensional or positional relationship between the two, it will not have a significant impact on the realization of the technical effect of the present invention.

[0070] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes said element.

[0071] In the various embodiments described above, although the methods are illustrated and described as a series of actions for the sake of simplicity, those skilled in the art should understand and appreciate that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but which may be understood by those skilled in the art.

[0072] Those skilled in the art will understand that information, signals, and data can be represented using any of a variety of different techniques and arts. For example, the data, instructions, commands, information, signals, bits, symbols, and chips described throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0073] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, units, circuits, and algorithmic steps described in conjunction with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this hardware-software interchangeability, the various illustrative components, blocks, modules, units, circuits, and steps are described above in a generalized manner in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the invention.

[0074] It should also be noted that those skilled in the art will understand that many technical details have been presented in the embodiments of the present invention to enable readers to better understand the invention. However, even without these technical details and various changes and modifications based on the above embodiments, the technical solutions claimed in the claims of the present invention can be substantially achieved. Therefore, in practical applications, various changes can be made to the above embodiments in form and detail without departing from the spirit and scope of the present invention.

[0075] Furthermore, those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0076] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. An LED high bay light, characterized in that, Including the lamp body and the light source assembly; The light source assembly is detachably connected to the lower part of the lamp body and has a light-emitting surface facing away from the lamp body; The light source assembly has a first coil on the side facing the lamp body; The lamp body has a second coil on the side facing the light source assembly; The first coil and the second coil are separated by a gap, and electromagnetic induction can be generated between them; The light source assembly includes a light source base plate, a PCB board, multiple LED beads, and a first plastic cover for enclosing the first coil therein; The light source base plate is detachably connected to the bottom of the lamp body by screws, and the first coil is located on the side of the light source base plate facing the lamp body; The PCB board is connected to the side of the light source base plate away from the first coil, and the multiple LED beads are arranged in an array on the side of the PCB board away from the light source base plate to form the light-emitting surface; The first plastic cover is attached to the side of the light source base plate opposite to the PCB board; The lamp body has a mounting groove on the side facing the light source assembly, and the second coil is disposed in the mounting groove and electrically connected to an external circuit through a conductive wire at the bottom of the groove; It also includes a power supply installed in the mounting slot, the power supply being located between the bottom of the slot and the second coil; The second coil is electrically connected to the power source, which is electrically connected to an external circuit through the conductive wire.

2. The LED high bay light according to claim 1, characterized in that, The light source assembly also includes a lens disposed on the side of the PCB board facing away from the light source base plate; The lens is detachably connected to the outer edge of the light source base plate via multiple snap fasteners on its outer edge, so as to cover the PCB board therein.

3. The LED high bay light according to claim 2, characterized in that, The light source assembly also includes a sealing ring disposed around the periphery of the PCB board, the sealing ring being sandwiched between the lens and the light source base plate.

4. The LED high bay light according to claim 1, characterized in that, The base plate of the light source is made of a material that is a good conductor of heat.

5. The LED high bay light according to claim 1, characterized in that, It also includes a second plastic cover for housing the second coil therein, the second plastic cover being detachably attached to the lamp body on the side facing the light source assembly.

6. The LED high bay light according to claim 1, characterized in that, The lamp body has multiple heat dissipation fins on the side facing away from the light source assembly.

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