Cyclic dust removal type wafer moving device

Abstract

The application provides a circulating dust removal type wafer moving device, which comprises a base, a support for mounting a conveying device, a wafer placed on the conveying device, and a support rotationally connected to the base through a bottom plate, two dust removal bins symmetrically arranged on both sides of the height direction of the support, the conveying device arranged between the two dust removal bins, and the wafer driven by the conveying device to displace along the height direction of the support; the support comprises a bottom plate and a top plate, the top ends and the bottom ends of the two dust removal bins are fixed to the top plate and the bottom plate respectively, a plurality of first dust removal fans are arranged on the side of each of the two dust removal bins close to the conveying device, two dust removal openings are symmetrically arranged on the bottom plate, and the two dust removal openings are located in the two dust removal bins; the sides away from each other of the two dust removal bins are provided with two arc-shaped plates with the same radius, and the length of the conveying device is less than the width of the arc-shaped plates. The application is used to solve the problem that the particles in the air without dust removal adhere to the surface of the wafer due to air turbulence in the prior art, and even the wafer is scrapped subsequently.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and particularly relates to a circulating dust removal type wafer moving device. BACKGROUND

[0002] A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit. After high-purity polysilicon is dissolved and added to a silicon crystal seed, a cylindrical single crystal silicon is formed by slowly pulling out the silicon crystal rod. The silicon crystal rod is ground and polished and then sliced to form a wafer. The wafer is finally processed into a finished wafer by using a mechanical hand or the like to move the wafer between processes.

[0003] In the wafer process, the cleanliness of the environment is very high. In the process of batch or single wafer handling, the dust generated by slight wear of the handling mechanism or the tiny impurities existing in the air of the production area can become a pollutant that causes the wafer surface to be contaminated and scrapped. Therefore, dust removal is required during wafer handling to avoid the problem of particles such as dust and air impurities adhering to the wafer surface. Since the stations of the two processes before and after the wafer conveying are often not in the same straight line, the handling mechanism needs to drive the wafer to rotate through a certain angle, and then drive the wafer to translate, or place the wafer into the next device by the self-provided mechanical hand of the device. In the process of driving the wafer to rotate, the handling mechanism causes the gas around the handling mechanism to be turbulent, so that the undusted air directly contacts the wafer to cause the particulate impurities existing in the undusted air to adhere to the wafer surface, resulting in poor dust removal effect and causing the particles to adhere to the wafer surface and possibly causing the wafer to be scrapped in the subsequent process.

[0004] Therefore, it is necessary to improve the wafer moving device in the prior art to solve the above problems. SUMMARY

[0005] The present application aims to disclose a circulating dust removal type wafer moving device to solve the problem that the wafer is rotated by the existing wafer moving device to cause air turbulence, causing the particulate impurities existing in the undusted air to adhere to the wafer surface and even causing the wafer to be scrapped in the subsequent process.

[0006] To achieve the above-mentioned purpose, the present application provides a circulating dust removal type wafer moving device, comprising: a base and a support for installing a conveying device, a wafer is placed on the conveying device, the support is rotationally connected to the base through a bottom plate, two dust removal bins are symmetrically distributed on both sides of the height direction of the support, the conveying device is arranged between the two dust removal bins, and the conveying device drives the wafer to displace along the height direction of the support.

[0007] The support comprises a bottom plate and a top plate, the top end and the bottom end of the two dust removal bins are fixed with the top plate and the bottom plate respectively, a plurality of first dust removal fans are arranged on the side close to the conveying device of the two dust removal bins respectively, two dust removal openings are symmetrically arranged on the bottom plate, and the two dust removal openings are located in the two dust removal bins.

[0008] The side away from each other of the two dust removal bins is provided with two arc-shaped plates with the same radius, and the length of the conveying device is less than the width of the arc-shaped plates.

[0009] As a further improvement of the application, the side close to each other of the two dust removal bins is connected with an installation chamber respectively, a lifting assembly for driving the conveying device to displace along the height direction of the support is arranged in the installation chamber along the height direction of the support, and the conveying device is connected with the lifting assembly through a connecting assembly.

[0010] As a further improvement of the application, the conveying assembly comprises a wafer supporting part and a translation device, the translation device comprises a mounting plate and a translation conveying belt, the mounting plate is fixedly connected to the top surface of the connecting assembly, the translation conveying belt is arranged along the length direction of the mounting plate, the wafer supporting part is connected with the translation conveying belt through a connecting piece, and the wafer supporting part is located above the mounting plate.

[0011] The connecting assembly comprises a first connecting plate, a second connecting plate and two reinforcing plates, the first connecting plate and the second connecting plate are parallel to each other, the two reinforcing plates are fixed perpendicularly at both ends of the first connecting plate and the second connecting plate, and the first connecting plate and the second connecting plate are connected with the lifting assembly respectively.

[0012] As a further improvement of the application, the first connecting plate and the second connecting plate are connected with a second dust removal fan respectively, the two second dust removal fans are located between the two reinforcing plates, a plurality of ventilation openings are arranged on the mounting plate, a plurality of third dust removal fans are connected to the bottom plate below the lifting assembly, the third dust removal fans are located in the installation chamber, and the second dust removal fans and the third dust removal fans are started to make the air mixed with particulate pollutants discharged from the support through the ventilation openings, between the two reinforcing plates and the installation chamber.

[0013] As a further improvement of the application, the lifting assembly comprises a driving mechanism and a transmission mechanism, the driving mechanism comprises a driving motor, a first driving wheel, a second driving wheel, a third driving wheel and a fourth driving wheel, the first driving wheel is coaxially fixed with the driving end of the driving motor, the first driving wheel drives the second driving wheel to rotate at the same speed through a first transmission belt, the second driving wheel is coaxially fixed with the third driving wheel, the fourth driving wheel is arranged directly above the third driving wheel, and the second transmission belt is wound between the fourth driving wheel and the third driving wheel.

[0014] The transmission mechanism comprises a first lifting belt and a second lifting belt in the same direction as the length of the second transmission belt, the first lifting belt and the second lifting belt are arranged on both sides of the second transmission belt respectively, the second transmission belt is fixedly connected with a transmission member, the transmission member is fixed with a first connecting plate, and the first connecting plate and a second connecting plate are connected with the first lifting belt and the second lifting belt respectively.

[0015] As a further improvement of the present application, a supporting belt is arranged in the mounting chamber, the supporting belt is arranged in the same direction as the first lifting belt, the supporting belt is arranged parallel to the second transmission belt, the first connecting plate extends to form a supporting plate away from the side of the first lifting belt, and the supporting plate is connected with the supporting belt.

[0016] As a further improvement of the present application, the base comprises a mounting body and a first mounting part and a second mounting part formed on both sides of the mounting body, the bottom plate is connected to the midpoint of the mounting body through a rotary motor, four fourth dust removal fans are arranged around the rotary motor, and the mounting body is vertically fixed with a partition plate between the first mounting part and the second mounting part.

[0017] As a further improvement of the present application, the wafer supporting part and the translation conveying belt are arranged in two groups, the two groups of translation conveying belts are symmetrically distributed along the length direction of the mounting plate, and the two groups of wafer supporting parts are connected with a translation conveying belt through a connecting member respectively.

[0018] As a further improvement of the present application, the conveying assembly further comprises a dustproof shell, the mounting plate and the two groups of translation conveying belts are arranged in the dustproof shell, two accommodation openings are symmetrically arranged in the length direction of the dustproof shell, and the two connecting members are slid through the accommodation openings.

[0019] As a further improvement of the present application, the first lifting belt and the second lifting belt are arranged with a first sliding rail and a second sliding rail away from each other along the height direction of the support, and the first connecting plate and the second connecting plate are slidably connected with the first sliding rail and the second sliding rail through sliding blocks respectively.

[0020] Compared with the prior art, the wafer moving device is composed of a support and a base, the wafer placed on the conveying device is rotated by the rotation connection of the support and the base, the conveying device is displaced along the height direction of the support to drive the wafer to ascend and descend. Two dust removal bins are distributed on both sides of the support, a plurality of first dust removal fans are distributed along the height direction in each dust removal bin, when the conveying device is used to convey the wafer, the plurality of first dust removal fans are started at the same time, the first dust removal fans can suck the particulate matter generated due to the wear of the cooperation between the components and the particulate pollutants contained in the air of the working area into the dust removal bin, the particulate matter falls in the dust removal bin and is discharged from the dust removal bin through the dust removal port. Further, the outer side of the dust removal bin is provided with an arc-shaped plate with a width greater than the length of the conveying device, the conveying device is always located in the coverage range of the two dust removal bins when the whole support rotates, thereby effectively avoiding the gas disturbance caused by rotation and avoiding the problem of wafer pollution caused by gas disturbance.

[0021] Secondly, the conveying assembly composed of the wafer supporting part and the translation device, the wafer is placed on the wafer supporting device, the conveying assembly drives the wafer to translate along the height direction perpendicular to the support to achieve the purpose of conveying the wafer within a certain length range, at the same time, the first connecting plate and the second connecting plate are connected with one second dust removal fan respectively through the first connecting plate, the second connecting plate and the two reinforcing plates connected between the first connecting plate and the second connecting plate, the second dust removal fan always removes the particulate impurities contained in the air around the wafer during the supporting and conveying of the wafer, and the third dust removal fan is started to make the particulate impurities discharged through the third dust removal fan, thereby achieving better dust removal effect.

[0022] Finally, the lifting assembly composed of the driving mechanism and the transmission mechanism, the transmission mechanism drives the first connecting plate and the second connecting plate to displace along the height direction of the support, combined with the rotation cooperation of the bottom plate and the base and the horizontal displacement of the wafer driven by the conveying assembly, thereby achieving the purpose of driving the wafer to displace in three directions, and having good effect of removing particulate matter. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a structure schematic view for embodying the whole in the present application;

[0024] Figure 2 It is Figure 1 F-F in the present application, the structure schematic view for embodying the lifting assembly and the supporting belt is cut along the support, the mounting chamber and the dust removal bin;

[0025] Figure 3 It is a structure schematic view for embodying the driving mechanism in the present application;

[0026] Figure 4Structure diagram for embodying the matching relationship between the fourth driving wheel and the second transmission belt in the application;

[0027] Figure 5 For Figure 2 Enlarged view of A part in the middle;

[0028] Figure 6 For Figure 2 Enlarged view of B part in the middle;

[0029] Figure 7 Structure diagram for embodying the wafer supporting part and the translation device in the application;

[0030] Figure 8 For Figure 3 Enlarged view of C part in the middle. DETAILED DESCRIPTION

[0031] The application will be described in detail below in connection with the embodiments shown in the drawings, but it should be noted that these embodiments are not a limitation on the application, and equivalent transformations or substitutions of function, method, or structure made by those of ordinary skill in the art based on these embodiments are within the protection scope of the application.

[0032] Please refer to Figures 1 to 8 The disclosed circular dust removal type wafer moving device is composed of a base 3 and a bracket 1 for installing a conveying device 2, wherein the conveying device 2 is rotationally matched with the base 3, and the conveying device 2 is displaced along the height direction of the bracket 1, so as to drive the wafer to move longitudinally and rotate. The dust removal bins 12 formed on both sides of the bracket 1 are connected with the first dust removal fans 121, which simultaneously remove the particulate pollutants in the air when the conveying device 2 supports the wafer. The particulate matter falls to the bottom of the dust removal bin 12 under the gravity and is discharged from the dust removal bin 12 through the dust removal port 122. At the same time, the structure of the first dust removal bin 12 connected to both sides of the bracket 1 is designed, the outer side of the dust removal bin 12 is composed of an arc-shaped plate 123, and the length of the conveying device 2 is less than the width of the arc-shaped plate 123. In the process of driving the wafer to rotate by the bracket 1, the wafer is within the coverage range of the two dust removal bins 12, so as to effectively avoid the external air from contacting the wafer and causing the particulate pollutants to adhere to the surface of the wafer due to the turbulence of the external air caused by the rotation of the bracket 1, and effectively avoid the problem of scrapping caused by the existence of the particulate pollutants on the surface of the wafer.

[0033] Referring to Figures 1 to 8As shown, in the present embodiment, the circulating dust removal type wafer moving device (hereinafter referred to as wafer moving device) comprises a base 3 and a support 1 for mounting a conveying device 2, a wafer is placed at the conveying device 2, the support 1 is rotatably connected with the base 3 through a bottom plate 11, two dust removal bins 12 are symmetrically distributed on both sides of the height direction of the support 1, the conveying device 2 is arranged between the two dust removal bins 12, and the conveying device 2 drives the wafer to displace along the height direction of the support 1; the support 1 comprises the bottom plate 11 and a top plate 13, the top ends and the bottom ends of the two dust removal bins 12 are respectively fixed with the top plate 13 and the bottom plate 12, a plurality of first dust removal fans 121 are respectively arranged on the side close to the conveying device 2 of the two dust removal bins 12, two dust removal openings 122 are symmetrically formed in the bottom plate 11, and the two dust removal openings 122 are respectively located in the two dust removal bins 12; the sides away from each other of the two dust removal bins 12 are provided with two arc-shaped plates 123 with the same radius, and the length of the conveying device 2 is less than the width of the arc-shaped plates 123.

[0034] Referring to Figures 1 to 4As shown, the base 3 comprises a mounting body 31, a first mounting portion 32 and a second mounting portion 33 formed on both sides of the mounting body 31, and the bottom plate 11 is connected to the midpoint of the mounting body 31 through a rotating motor 312, four fourth dust removal fans 311 are arranged around the rotating motor 312 of the mounting body 31, and the mounting body 31 is vertically fixed with the first mounting portion 32 and the second mounting portion 33. It should be noted that in the embodiment, the first mounting portion 32 and the second mounting portion 33 are respectively used for mounting a cold plate module (not shown) and a hot plate module (not shown) in a wafer process. In the embodiment, the base 3 and the support 1 are located between a glue coating and developing module (not shown) and a factory interface (not shown), and the lengthwise sides of the base 3 are adjacent to the glue coating and developing module (not shown) and the length interface (not shown). It should be noted that the support 1 and the conveying device 2 have no obstacles with the factory interface (not shown) and do not perform pick-and-place actions, and the support 1 and the conveying device 2 perform pick-and-place actions of wafers between the cold plate module (not shown), the glue coating and developing module (not shown), and the hot plate module (not shown). The base 3 is arranged in the mounting body 31 through the rotating motor 312, and the support 1 is located at the midpoint of the mounting body 31. The rotating motor 312 drives the rotation of the support 1 to change the orientation of the support 1, so that the support 1 drives the conveying device 2 connected thereto to rotate between the above-mentioned three stations, i.e., to transfer the wafer in the hot plate module (not shown) to the glue coating and developing module (not shown), and to take out the wafer after the glue coating and developing process of the wafer is completed and transfer the wafer to the cold plate module (not shown). Since the wafer needs to be cooled and heated multiple times in the glue coating and developing process, the above-mentioned transfer steps are reversible and can be repeated multiple times. When the support 1 drives the conveying device 2 connected thereto to rotate to the corresponding station, the conveying device 2 is displaced along the height direction of the support to the specified placement height of the wafer, and then the wafer is placed in the corresponding process station through the mechanical hand of the station or any other way. In the embodiment, the conveying device 2 is displaced in the straight line direction perpendicular to the height direction of the support 1 to achieve the purpose of placing the wafer in the specified process station.

[0035] It should be noted that in the embodiment, the bottom plate 11 is provided as a circular plate, the top plate 13 is provided as a waist-shaped plate with a length equal to the diameter of the bottom plate 11, the curvature of the two ends of the top plate 13 is consistent with the curvature of the bottom plate, and two dust removal bins 12 are symmetrically distributed between the bottom plate 11 and the top plate 13. In addition to the purpose of removing a certain amount of mixed particulate pollutants in the air in the support 1 by the first dust removal fan 121, the dust removal bin 12 also serves to support the bottom plate 11 and the top plate 13. During the process of rotating the motor 312 to drive the support 1 to face the three process stations respectively, due to the structure of the bottom plate 11, the top plate 13 and the arc-shaped plate 123 constituting the outer side of the dust removal bin 12, the overall support 1 is columnar during rotation, which can maximize the avoidance of the problem of particulate pollutants in the air outside the support 1 adhering to the wafer due to the disturbance of the rotation of the support 1, and the multiple first dust removal fans 121 of the two symmetrically distributed dust removal bins 12 are simultaneously started to remove particulate matter. The removed particulate matter is discharged from the dust removal bin 12 through the dust removal port 122, so that the two dust removal bins 12 achieve good dust removal effect.

[0036] Referring to Figures 3 to 8 As shown, the two dust removal bins 12 are connected to one mounting chamber 14 on the side close to each other, one mounting chamber 14 is provided with a lifting assembly 4 driving the conveying device 2 to displace along the height direction of the support 1, and the conveying device 2 is connected to the lifting assembly 4 through a connecting assembly 23. The conveying assembly 2 includes a wafer supporting part 21 and a translation device 22, the translation device 22 includes a mounting plate 221 and a translation conveying belt 222, the mounting plate 221 is fixedly connected to the top surface of the connecting assembly 23, the translation conveying belt 222 is arranged along the length direction of the mounting plate 221, the wafer supporting part 21 is connected to the translation conveying belt 222 through a connecting piece 211, and the wafer supporting part 21 is located above the mounting plate 221; the connecting assembly 23 includes a first connecting plate 231, a second connecting plate 232 and two reinforcing plates 233, the first connecting plate 231 and the second connecting plate 232 are parallel to each other, the two ends of the two reinforcing plates 233 are fixedly connected to the first connecting plate 231 and the second connecting plate 232, and the first connecting plate 231 and the second connecting plate 232 are connected to the lifting assembly 4 respectively. The first connecting plate 231 and the second connecting plate 232 are connected to a second dust removal fan 234 respectively, the two second dust removal fans 234 are located between the two reinforcing plates 233, the mounting plate 221 is provided with multiple ventilation openings 2211, the bottom plate 11 is connected to multiple third dust removal fans 141 below the lifting assembly 4, the third dust removal fans 141 are located in the mounting chamber 14, and the second dust removal fans 234 and the third dust removal fans 141 are started to make the air mixed with particulate pollutants pass through the ventilation openings 2211, between the two reinforcing plates 233 and the mounting chamber 14, and then be discharged from the support 1.

[0037] Referring to Figures 2 to 8As shown, the wafer supporting portions 21 and the translation conveyors 222 are both provided in two groups, the two groups of translation conveyors 222 are symmetrically distributed along the length direction of the mounting plate 221, and the two groups of wafer supporting portions 21 are connected to the two groups of translation conveyors 222 respectively through a connecting member 211, wherein the two groups of wafer supporting portions 21 are distributed in up and down and the axes coincide. The conveying assembly 2 further comprises a dustproof shell 24, the mounting plate 221 and the two groups of translation conveyors 222 are arranged in the dustproof shell 24, the dustproof shell 24 is symmetrically provided with two letting-in openings 241 along the length direction, and the two connecting members 211 are slidably arranged through the letting-in openings 241. Specifically, the two groups of translation conveyors 222 are arranged in the dustproof shell 24 through the two letting-in openings 241, and the two groups of wafer supporting portions 21 are arranged in the dustproof shell 24 through the two letting-in openings 241. Figure 7 As shown, in the embodiment, the motors (not labeled) of the two groups of translation conveyors 222 are arranged below the mounting plate 221, the driving shafts of the two motors (not labeled) are oppositely arranged and coaxially connected to a tension pulley (not labeled) respectively, and the mounting plate 221 is provided with another two tension pulleys (not labeled) for each group of translation conveyors 222, each group of translation conveyors 222 is wound around the corresponding three tension pulleys (not labeled) after passing through the mounting plate 221, and the two wafer supporting portions 21 are connected to a group of translation conveyors 222 through a connecting member 211 respectively, and the two wafer supporting portions 21 are driven to move along the length direction of the mounting plate 221 by the translation conveyors 222 after the motors (not labeled) are started. It should be noted that, since the two groups of translation conveyors 222 are driven by one motor (not labeled) respectively, the translation speeds of the two wafer supporting portions 21 can be inconsistent, and the axes can also not coincide.

[0038] It should be noted that during the process of placing the wafer on the wafer supporting part 21, two second dust removal fans 234 are started respectively, and the two second dust removal fans 234 can remove dust from the air around the wafer, that is, the air containing particulate impurities is sucked into the dustproof housing 24 through the gap 241 by the second dust removal fan, and the gas enters between the first connecting plate 231 and the second connecting plate 232 through the air vent 2211 provided on the mounting 221, and is discharged to the outside of the first connecting plate 231 and the second connecting plate 232 by the two second dust removal fans 234. During the process of starting the two second dust removal fans 234, the third dust removal fans 141 connected to the bottom of the mounting chamber 14 are started at the same time, and the air containing particulate impurities discharged by the second dust removal fan 234 from the inside of the first connecting plate 231 and the second connecting plate 232, and the air containing particulate impurities in the bracket 1 are simultaneously sucked into the mounting chamber 14 and finally discharged from the mounting chamber 14. It should be noted that in the present embodiment, the bottoms of the two mounting chambers 14 are respectively connected to three third dust removal fans 141. During the process of starting the second dust removal fan 234 and the third dust removal fan 141, four fourth dust removal fans 311 arranged around the rotary motor 312 are started at the same time, and the fourth dust removal fan 311 further achieves the purpose of discharging the air containing particulate impurities in the bracket 1. In the present embodiment, through the above-mentioned first dust removal fan 121, second dust removal fan 234, third dust removal fan 141 and fourth dust removal fan 311, the air distributed around the wafer in the bracket 1 is removed in multiple directions, which maximizes the cleanliness of the air around the wafer, thereby effectively avoiding the situation that the wafer is damaged and scrapped due to the attachment of particulate pollutants on the surface in the later stage.

[0039] Referring to Figures 3 to 8As shown, the lifting assembly 4 comprises a driving mechanism 41 and a transmission mechanism 42. The driving mechanism 41 comprises a driving motor 411, a first driving wheel 412, a second driving wheel 413, a third driving wheel 414 and a fourth driving wheel 415. The first driving wheel 412 is coaxially fixed with a driving end of the driving motor 411. The first driving wheel 412 drives the second driving wheel 413 to rotate at the same speed through a first transmission belt 416. The second driving wheel 413 is coaxially fixed with the third driving wheel 414. The fourth driving wheel 415 is arranged directly above the third driving wheel 414. The fourth driving wheel 415 is connected with the third driving wheel 414 through a second transmission belt 417. The transmission mechanism 42 comprises a first lifting belt 421 and a second lifting belt 422 which are consistent with the length direction of the second transmission belt 417. The first lifting belt 421 and the second lifting belt 422 are arranged on the two sides of the second transmission belt 417 respectively. The second transmission belt 417 is fixedly connected with a transmission member 423. The transmission member 423 is fixed with a first connecting plate 231. The first connecting plate 231 and a second connecting plate 232 are connected with the first lifting belt 421 and the second lifting belt 422 respectively. The first lifting belt 421 and the second lifting belt 422 are arranged with a first sliding rail 424 and a second sliding rail 425 along the height direction of the support 1 on the sides away from each other. The first connecting plate 231 and the second connecting plate 232 are slidably connected with the first sliding rail 424 and the second sliding rail 425 through sliding blocks 426 respectively.

[0040] In particular Figures 3 to 5As shown, when the driving motor 411 is started, the first driving wheel 412 fixed coaxially with the driving motor 411 rotates and drives the second driving wheel 413 through the first transmission belt 416, and the third driving wheel 414 fixed coaxially with the second driving wheel 413 rotates and drives the fourth driving wheel 415 through the second transmission belt 417, and the second transmission belt 417 drives the transmission member 423 to ascend or descend. Since the transmission member 423 is fixed with the first connecting plate 231, and the first connecting plate 231 is fixed with the second connecting plate 232 through the reinforcing plate 233, the connecting assembly 23 ascends and descends as a whole with the second transmission belt 417. In the embodiment, the first connecting plate 231 and the second connecting plate 232 are connected with the first lifting belt 421 and the second lifting belt 422 respectively, so that the first lifting belt 421 and the second lifting belt 422 ascend and descend synchronously under the driving of the connecting assembly 23 during the ascending and descending of the connecting assembly 23 as a whole. Compared with the mode of supporting and driving the conveying device 2 as a whole through the second transmission belt 417, the first lifting belt 421 and the second lifting belt 422 support and ascend and descend with the first connecting plate 231 and the second connecting plate 232 respectively, thereby sharing the supporting pressure of the second transmission belt 417, prolonging the service life of the device as a whole and stabilizing the ascending and descending process of the conveying device 2. Meanwhile, the first connecting plate 231 and the second connecting plate 232 are slidably connected with the first sliding rail 424 and the second sliding rail 425 through the sliding blocks 426. Since the second transmission belt 417, the first lifting belt 421 and the second lifting belt 422 are soft in nature, they are prone to deformation and affect the stability of the ascending and descending of the conveying device 2. The first sliding rail 424 and the second sliding rail 425 provide a rigid guide for the ascending and descending of the conveying device 2, thereby stabilizing the ascending and descending process of the conveying device 2.

[0041] Referring to Figure 2 and Figure 6 As shown, the support belt 5 is arranged in the other installation chamber 14 and arranged in the same direction as the first lifting belt 421, and arranged parallel to the second transmission belt 417. The first connecting plate 231 extends to form a support plate 2311 on the side away from the first lifting belt 421, and the support plate 2311 is connected with the support belt 5. During the ascending and descending of the conveying device 2 as a whole with the second transmission belt 417, the support plate 2311 connected with the first connecting plate 231 on the side away from the first lifting belt 421 drives the support belt 5 to ascend and descend, thereby supporting the side of the conveying device 2 away from the second transmission belt 417, and stabilizing the ascending and descending process of the conveying device 2 as a whole.

[0042] The above detailed description merely illustrates feasible implementation manners of the present application, and is not intended to limit the protection scope of the present application. Equivalent implementation manners or changes made without departing from the spirit of the present application shall be included in the protection scope of the present application.

[0043] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0044] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be properly combined to form other embodiments which can be understood by those skilled in the art.

Claims

1. A circulating dust removal wafer mobile device, characterized in that, The application relates to a base and a support for mounting a conveying device, a wafer being placed at the conveying device, the support being rotationally connected with the base through a bottom plate, two dust removal bins being symmetrically arranged on both sides of the support in the height direction, the conveying device being arranged between the two dust removal bins, and the conveying device driving the wafer to move along the height direction of the support. The support comprises a bottom plate and a top plate, the top ends and the bottom ends of the two dust removal bins being fixed with the top plate and the bottom plate respectively, a plurality of first dust removal fans being arranged on the side of the two dust removal bins close to the conveying device, two dust removal openings being symmetrically arranged on the bottom plate, and the two dust removal openings being located in the two dust removal bins. The side of the two dust removal bins away from each other is provided with two arc-shaped plates with the same radius, and the length of the conveying device is smaller than the width of the arc-shaped plates. The side of the two dust removal bins close to each other is respectively connected with an installation chamber, a lifting assembly driving the conveying device to move along the height direction of the support being arranged in the installation chamber along the height direction of the support, and the conveying device being connected with the lifting assembly through a connecting assembly. The conveying device comprises a wafer supporting part and a translation device, the translation device comprising a mounting plate and a translation conveying belt, the mounting plate being fixedly connected to the top surface of the connecting assembly, the translation conveying belt being arranged along the length direction of the mounting plate, the wafer supporting part being connected with the translation conveying belt through a connecting piece, and the wafer supporting part being located above the mounting plate. The connecting assembly comprises a first connecting plate, a second connecting plate and two reinforcing plates, the first connecting plate and the second connecting plate being parallel to each other, the two reinforcing plates being fixedly arranged at the two ends of the first connecting plate and the second connecting plate, and the first connecting plate and the second connecting plate being respectively connected with the lifting assembly. The first connecting plate and the second connecting plate are respectively connected with a second dust removal fan, the two second dust removal fans being located between the two reinforcing plates, the mounting plate being provided with a plurality of ventilation openings, the bottom plate being connected with a plurality of third dust removal fans below the lifting assembly, the third dust removal fans being located in the installation chamber, and the second dust removal fans and the third dust removal fans being started to make the air mixed with particulate pollutants to be discharged from the support through the ventilation openings, between the two reinforcing plates and the installation chamber. The lifting assembly comprises a driving mechanism and a transmission mechanism, the driving mechanism comprising a driving motor, a first driving wheel, a second driving wheel, a third driving wheel and a fourth driving wheel, the first driving wheel being coaxially fixed with the driving end of the driving motor, the first driving wheel driving the second driving wheel to rotate at the same speed through a first transmission belt, the second driving wheel being coaxially fixed with the third driving wheel, the fourth driving wheel being arranged directly above the third driving wheel, and a second transmission belt being wound between the fourth driving wheel and the third driving wheel.

2. The cyclic dust-removing wafer transfer apparatus according to claim 1, wherein The transmission mechanism comprises a first lifting belt and a second lifting belt consistent with the length direction of the second transmission belt, the first lifting belt and the second lifting belt being arranged on both sides of the second transmission belt respectively, the second transmission belt being fixedly connected with a transmission piece, the transmission piece being fixed with the first connecting plate, and the first connecting plate and the second connecting plate being respectively connected with the first lifting belt and the second lifting belt. ​ 3. The cyclic dust removal wafer transfer apparatus according to claim 2, wherein Another installation chamber is provided with a supporting belt, which is arranged in the same direction as the first lifting belt and parallel to the second transmission belt, and the first connecting plate extends away from the side of the first lifting belt to form a supporting plate connected with the supporting belt.

4. The cyclic dust removal wafer transfer apparatus according to claim 3, wherein The base comprises a mounting body, a first mounting part and a second mounting part formed on both sides of the mounting body, and the bottom plate is connected to the midpoint of the mounting body through a rotary motor, four fourth dust removal fans are arranged around the rotary motor, and the mounting body is vertically fixed with the partition plates between the first mounting part and the second mounting part.

5. The cyclic dust removal wafer transfer apparatus according to claim 1, wherein The wafer supporting parts and the translation conveyors are arranged in two groups, the two groups of translation conveyors are symmetrically distributed along the length direction of the mounting plate, and the two groups of wafer supporting parts are respectively connected with a translation conveyor through a connecting piece.

6. The cyclic dust removal wafer transfer apparatus according to claim 5, wherein The conveying device further comprises a dustproof shell, the mounting plate and the two groups of translation conveyors are arranged in the dustproof shell, two accommodation openings are symmetrically formed in the length direction of the dustproof shell, and the two connecting pieces are slid out of the accommodation openings.

7. The cyclic dust removal wafer transfer apparatus according to claim 4, wherein The first lifting belt and the second lifting belt are respectively provided with a first sliding rail and a second sliding rail along the height direction of the support away from each other, and the first connecting plate and the second connecting plate are respectively slidably connected with the first sliding rail and the second sliding rail through sliding blocks.

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