Semiconductor thermoelectric water generator and method

Abstract

A kind of semiconductor temperature difference sheet water device and method, including fan, fin, semiconductor temperature difference sheet, condensing device, shell and collection device;Fan, fin, semiconductor temperature difference sheet and condensing device are installed in shell, and collection device is arranged below shell;Fan and fin are coaxially arranged, and one side of fin is connected with hot end of semiconductor temperature difference sheet, and cold end of semiconductor temperature difference sheet is connected with condensing device.The present application lets air first pass through hot end and then pass through cold end, which improves water vapor proportion, increases temperature difference, makes water production efficiency higher, and system is simple, and space occupied is also very small.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor thermocouple application technology, and specifically relates to a semiconductor thermocouple water production device and method. Background Technology

[0002] When a semiconductor thermocouple is in operation, it forms a cold end and a hot end, and water vapor in the air condenses into small water droplets after being cooled.

[0003] Most existing air-to-water generators use air compression and refrigeration to produce water. This method is complex and requires a large device. Some water generators that use semiconductor thermocouples only utilize the cold end for water production and do not make full use of the semiconductor thermocouple. Summary of the Invention

[0004] In view of the technical problems existing in the background art, the semiconductor thermoelectric water production device and method provided by the present invention allows air to pass through the hot end first and then through the cold end, which increases the proportion of water vapor and increases the temperature difference, making the water production efficiency higher. Moreover, the system is simple and occupies very little space.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A water production device and method using a semiconductor thermoelectric plate includes a fan, a heat sink, a semiconductor thermoelectric plate, a condenser, a housing, and a collection device. The fan, heat sink, semiconductor thermoelectric plate, and condenser are installed inside the housing, and the collection device is located below the housing. The fan and heat sink are coaxially arranged, with one side of the heat sink connected to the hot end of the semiconductor thermoelectric plate, and the cold end of the semiconductor thermoelectric plate connected to the condenser.

[0007] In a preferred embodiment, the fan, heat sink, semiconductor thermocouple, condenser, housing, and collection device are all provided with shaft holes in the middle. The shaft holes are provided with rotating shafts, one end of which is connected to the fan, and the other end of which is used to connect to the drive device.

[0008] In a preferred embodiment, the heat sink includes a first ring body with a plurality of guide vanes on the first ring body; the first ring body includes a first upper surface and a first lower surface, each guide vane protruding axially from the first upper surface of the first ring body, and the plurality of guide vanes are evenly arranged circumferentially on the first upper surface to form a plurality of first air guiding zones with the same flow area.

[0009] In a preferred embodiment, the condensation device includes a second ring body, on which multiple guide vanes and multiple hollow copper tubes are provided, and multiple layered fins are provided on the multiple hollow copper tubes.

[0010] In a preferred embodiment, the second annulus includes a third upper surface and a third lower surface. Each guide vane protrudes axially from the third lower surface of the second annulus. Multiple guide vanes are evenly spaced circumferentially on the third lower surface to form multiple second air-guiding zones with the same flow area. Multiple fins are evenly spaced axially and connected by hollow copper tubes. Multiple hollow copper tubes connect the second annulus and each fin.

[0011] In a preferred embodiment, the outer shell includes an upper shell, a lower shell, and a layered platform. The upper shell is a hollow cylinder, the lower shell is a hollow frustum with a gradually increasing diameter, and the layered platform is located at the junction of the upper and lower shells. The layered platform is a concave ring extending radially inward.

[0012] In a preferred embodiment, the flow area of ​​the first air guiding zone formed by the guide vanes of the heat sink is smaller than the flow area of ​​the second air guiding zone formed by the guide vanes of the condenser.

[0013] In a preferred embodiment, the surface of the condensation device and the inner wall of the outer shell are coated with a hydrophilic material.

[0014] In a preferred embodiment, an axial gap is provided between the outer shell and the collecting device.

[0015] Preferably, the method of using the semiconductor temperature difference water purification device includes the following steps:

[0016] Step 1: The hot end of the semiconductor thermocouple contacts the heat sink ring, and the cold end of the semiconductor thermocouple contacts the condenser ring.

[0017] Step 2: During operation, the hot end of the semiconductor thermocouple transfers heat to the heat sink, raising its temperature. The cold end of the semiconductor thermocouple transfers cold to the condenser ring, lowering its temperature. Then, the heat is conducted to each layer of fins through a hollow copper tube, lowering the fin temperature.

[0018] Step 3: During operation, the fan rotates, causing the air to be heated through the air guide area of ​​the heat sink and then enter the gap between the heat sink and the outer shell. The hot air then flows downward to the air guide area of ​​the condenser and enters the condenser. The water droplets formed in the first air guide area are thrown to the inner wall of the upper shell under the action of centrifugal force and then slide onto the fins through the layering platform. The uncondensed hot air condenses after contacting the low-temperature layered fins in the condenser and forms water droplets that adhere to the surface of the fins and hollow copper tubes.

[0019] Step 4: By rotating the shell, centrifugal force is used to rotate the water droplets out through the gaps between the layered fins, so that they adhere to the hydrophilic material on the inner wall of the shell and slide down the lower shell into the collection device. The remaining gas is discharged from the gap between the shell and the collection device.

[0020] The present invention can achieve the following beneficial effects:

[0021] In this invention, air passes through the hot end first and then the cold end, which increases the proportion of water vapor and the temperature difference, resulting in higher water production efficiency. The rotation direction of the fan blades and the guide vanes on the upper and lower surfaces of the heat sink takes into account the fluid flow pattern, improving gas flow efficiency. Copper tubes are used in the condensation device for heat conduction, resulting in better heat conduction and higher condensation efficiency. Multiple layered fins allow hot air to condense in layers, thus achieving full condensation and liquefaction. The radius of the lower shell gradually increases to ensure that the remaining gas after condensation can continue to flow downwards, avoiding blockage and gas backflow. The interior of the lower shell is coated with a hydrophilic material, improving liquid collection efficiency. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0023] Figure 1 This is a structural diagram of the present invention;

[0024] Figure 2 This is a diagram showing the connection structure of the fan, heat sink, semiconductor thermocouple, and condenser of the present invention.

[0025] Figure 3 This is a structural diagram of the fan of the present invention;

[0026] Figure 4 This is a structural diagram of the heat sink of the present invention;

[0027] Figure 5 This is a structural diagram of the semiconductor thermocouple of the present invention;

[0028] Figure 6 This is a structural diagram of the condensation device of the present invention;

[0029] Figure 7 This is a structural diagram of the outer casing of the present invention;

[0030] Figure 8 This is a structural diagram of the collection device of the present invention;

[0031] Figure 9 This is a schematic diagram of the installation of the drive device of the present invention.

[0032] In the figure: Fan 1, upper surface 11, lower surface 12, blade 13, heat sink 2, guide vane 21, first ring 22, first upper surface 221, first lower surface 222, semiconductor thermocouple 3, second side surface 31, second lower surface 32, condenser 4, second ring 41, third upper surface 411, third lower surface 412, guide vane 42, fin 43, hollow copper tube 44, outer shell 5, upper half shell 51, lower half shell 52, layering platform 53, collection device 6, drive device 7. Detailed Implementation

[0033] Example 1:

[0034] Preferred solutions include Figures 1 to 9 As shown, a semiconductor thermoelectric water production device includes a fan 1, a heat sink 2, a semiconductor thermoelectric plate 3, a condenser 4, a housing 5, and a collection device 6. The fan 1, heat sink 2, semiconductor thermoelectric plate 3, and condenser 4 are installed inside the housing 5, and the collection device 6 is located below the housing 5. The fan 1 and heat sink 2 are coaxially arranged, one side of the heat sink 2 is connected to the hot end of the semiconductor thermoelectric plate 3, and the cold end of the semiconductor thermoelectric plate 3 is connected to the condenser 4.

[0035] The fan 1 includes an upper surface 11, a lower surface 12, and blades 13; the diameter of the fan 1 is smaller than the inner diameter of the ring formed by the circumferential arrangement of the heat sink guide blades 21.

[0036] The fan, heat sink, semiconductor thermocouple, and condenser are arranged concentrically along the axis from top to bottom; the semiconductor thermocouple 3 includes a second side surface 31 and a second lower side surface 32; the collecting device 6 is a hollow cylinder with an open top.

[0037] Furthermore, the fan 1, heat sink 2, thermoelectric plate 3, condenser 4, housing 5, and collecting device 6 are all provided with shaft holes in their middle sections. A rotating shaft is installed in each shaft hole, with one end connected to the fan 1 and the other end used to connect to a drive device. The diameters of the first ring 22 of the heat sink, the thermoelectric plate 3, and the second ring 41 of the condenser are equal. The first lower surface 222 of the heat sink ring coincides with the second surface 31 of the thermoelectric plate; the second lower surface 32 of the thermoelectric plate coincides with the third upper surface 411 of the condenser ring. The diameter of the cylindrical portion of the upper shell 51 of the housing is larger than the diameters of the first ring 22 of the heat sink, the thermoelectric plate 3, and the second ring 41 of the condenser.

[0038] Furthermore, the heat sink 2 includes a first ring body 22, on which a plurality of guide vanes 21 are provided; the first ring body 22 includes a first upper surface 221 and a first lower surface 222, each guide vane 21 protruding axially from the first upper surface 221 of the first ring body 22, and the plurality of guide vanes 21 are evenly arranged circumferentially on the first upper surface 221 to form a plurality of first air guiding zones with the same flow area.

[0039] The condensation device 4 includes a second ring body 41, on which multiple guide vanes 42 and multiple hollow copper tubes 44 are provided, and multiple layered fins 43 are provided on the multiple hollow copper tubes 44.

[0040] The flow area of ​​the first air guiding zone formed by the guide vane 21 of the heat sink 2 is smaller than the flow area of ​​the second air guiding zone formed by the guide vane 42 of the condenser 4.

[0041] The flow area of ​​the first air guiding zone formed by the guide vanes 21 of the heat sink is smaller than the flow area of ​​the second air guiding zone formed by the guide vanes 42 of the condenser. The orientation of the fan blades 13 and the heat sink guide vanes 21 should be such that air is expelled outward under the action of centrifugal force when the equipment is operating.

[0042] Furthermore, the second annular body 41 includes a third upper surface 411 and a third lower surface 412. Each guide vane 42 protrudes axially from the third lower surface 412 of the second annular body 41. Multiple guide vanes 42 are evenly spaced circumferentially on the third lower surface 412, forming multiple second air-guiding zones with the same flow area. Multiple fins 43 are evenly spaced axially and connected by hollow copper tubes 44. Multiple hollow copper tubes 44 connect the second annular body 41 and each fin 43. The orientation of the fan blades 13 and the heat sink guide vanes 21 should allow air to be exhausted outward under centrifugal force during equipment operation. During equipment operation, the fan 1 rotates at high speed; the heat sink 2, semiconductor thermocouple 3, and condenser 4 rotate at low speed; the outer casing 5 and the collection device 6 do not rotate.

[0043] Specifically, the outer shell 5 includes an upper shell 51, a lower shell 52, and a layered platform 53. The upper shell 51 is a hollow cylinder, the lower shell 52 is a hollow frustum with a gradually increasing diameter, and the layered platform 53 is located at the junction of the upper shell 51 and the lower shell 52. The layered platform 53 is a concave ring extending radially inward.

[0044] The surface of the condenser and the inner wall of the outer shell are coated with a hydrophilic material.

[0045] An axial gap is left between the outer casing 5 and the collecting device 6.

[0046] A method of using a semiconductor thermoelectric water purification device includes the following steps:

[0047] Step 1: The hot end of the semiconductor thermocouple contacts the heat sink ring, and the cold end of the semiconductor thermocouple contacts the condenser ring.

[0048] Step 2: During operation, the hot end of the semiconductor thermocouple transfers heat to the heat sink, raising its temperature. The cold end of the semiconductor thermocouple transfers cold to the condenser ring, lowering its temperature. Then, the heat is conducted to each layer of fins through a hollow copper tube, lowering the fin temperature.

[0049] Step 3: During operation, the fan rotates, causing the air to be heated through the air guide area of ​​the heat sink and then enter the gap between the heat sink and the outer shell. The hot air then flows downward to the air guide area of ​​the condenser and enters the condenser. The water droplets formed in the first air guide area are thrown to the inner wall of the upper shell under the action of centrifugal force and then slide onto the fins through the layering platform. The uncondensed hot air condenses after contacting the low-temperature layered fins in the condenser and forms water droplets that adhere to the surface of the fins and hollow copper tubes.

[0050] Step 4: By rotating the shell, centrifugal force is used to rotate the water droplets out through the gaps between the layered fins, so that they adhere to the hydrophilic material on the inner wall of the shell and slide down the lower shell into the collection device. The remaining gas is discharged from the gap between the shell and the collection device.

[0051] The above embodiments are merely preferred technical solutions of the present invention and should not be considered as limitations on the present invention. The scope of protection of the present invention should be limited to the technical solutions described in the claims, including equivalent substitutions of the technical features described in the claims. That is, equivalent substitutions and improvements within this scope are also within the scope of protection of the present invention.

Claims

1. A semiconductor thermoelectric water purification device, characterized in that: It includes a fan (1), a heat sink (2), a semiconductor thermocouple (3), a condenser (4), a housing (5), and a collection device (6); the fan (1), the heat sink (2), the semiconductor thermocouple (3), and the condenser (4) are installed inside the housing (5), and the collection device (6) is located below the housing (5); the fan (1) and the heat sink (2) are coaxially arranged, one side of the heat sink (2) is connected to the hot end of the semiconductor thermocouple (3), and the cold end of the semiconductor thermocouple (3) is connected to the condenser (4); The heat sink (2) includes a first ring body (22), and a plurality of guide vanes (21) are provided on the first ring body (22); the first ring body (22) includes a first upper surface (221) and a first lower surface (222), and each guide vane (21) protrudes axially from the first upper surface (221) of the first ring body (22), and the plurality of guide vanes (21) are evenly arranged circumferentially on the first upper surface (221) to form a plurality of first air guiding zones with the same flow area; The condensation device (4) includes a second ring body (41), on which multiple guide vanes (42) and multiple hollow copper tubes (44) are provided, and multiple layered fins (43) are provided on the multiple hollow copper tubes (44). The second annular body (41) includes a third upper surface (411) and a third lower surface (412). Each guide vane (42) protrudes axially from the third lower surface (412) of the second annular body (41). Multiple guide vanes (42) are evenly spaced circumferentially on the third lower surface (412) to form multiple second air guiding zones with the same flow area. Multiple fins (43) are evenly spaced axially and connected by hollow copper tubes (44). Multiple hollow copper tubes (44) connect the second annular body (41) and each fin (43). The method of using the aforementioned semiconductor temperature difference water purification device includes the following steps: Step 1: The hot end of the semiconductor thermocouple contacts the heat sink ring, and the cold end of the semiconductor thermocouple contacts the condenser ring. Step 2: During operation, the hot end of the semiconductor thermocouple transfers heat to the heat sink, raising its temperature. The cold end of the semiconductor thermocouple transfers cold to the condenser ring, lowering its temperature. Then, the heat is conducted to each layer of fins through a hollow copper tube, lowering the fin temperature. Step 3: During operation, the fan rotates, causing the air to be heated through the air guide area of ​​the heat sink and then enter the gap between the heat sink and the outer shell. The hot air then flows downward to the air guide area of ​​the condenser and enters the condenser. The water droplets formed in the first air guide area are thrown to the inner wall of the upper shell under the action of centrifugal force and then slide onto the fins through the layering platform. The uncondensed hot air condenses after contacting the low-temperature layered fins in the condenser and forms water droplets that adhere to the surface of the fins and hollow copper tubes. Step 4: By rotating the shell, centrifugal force is used to rotate the water droplets out through the gaps between the layered fins, so that they adhere to the hydrophilic material on the inner wall of the shell and slide down the lower shell into the collection device. The remaining gas is discharged from the gap between the shell and the collection device.

2. The semiconductor thermoelectric water purification device according to claim 1, characterized in that: The fan (1), heat sink (2), semiconductor thermocouple (3), condenser (4), housing (5) and collection device (6) are all provided with shaft holes in the middle. The shaft holes are provided with rotating shafts. One end of the rotating shaft is connected to the fan (1), and the other end of the rotating shaft is used to connect to the drive device.

3. The semiconductor thermoelectric water purification device according to claim 1, characterized in that: The outer shell (5) includes an upper shell (51), a lower shell (52) and a layered platform (53). The upper shell (51) is a hollow cylinder, and the lower shell (52) is a hollow frustum with a gradually increasing diameter. The layered platform (53) is located at the junction of the upper shell (51) and the lower shell (52). The layered platform (53) is a concave ring extending radially inward.

4. The semiconductor thermoelectric water purification device according to claim 3, characterized in that: The flow area of ​​the first air guiding zone formed by the guide vane (21) of the heat sink (2) is smaller than the flow area of ​​the second air guiding zone formed by the guide vane (42) of the condenser (4).

5. The semiconductor thermoelectric water purification device according to claim 1, characterized in that: The surface of the condenser and the inner wall of the outer shell are coated with a hydrophilic material.

6. The semiconductor thermoelectric water purification device according to claim 1, characterized in that: An axial gap is left between the outer shell (5) and the collecting device (6).

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