Automated teaching enclosure system

Abstract

An auto-teach enclosure system includes a plurality of surfaces that at least partially enclose an interior volume of the auto-teach enclosure system. The auto-teach enclosure system further includes an auto-teach pin disposed at least partially within the interior volume. The auto-teach pin is a scannable feature having a fixed position within the auto-teach enclosure system. The auto-teach enclosure system further includes a front interface coupled to one or more surfaces of the plurality of surfaces to engage the auto-teach enclosure system with a substantially vertical portion of a load port of a wafer processing system. The auto-teach pin enables an auto-teach operation of a robotic arm of the wafer processing system. The auto-teach operation is an operation to auto-teach the fixed position within the auto-teach enclosure system to the robotic arm of the wafer processing system.

Description

[0001] This application is a divisional application of the invention patent application filed on December 9, 2020, with application number 202080085353.X and invention title "Automatic Teaching Shell System". Technical Field

[0002] Embodiments of this disclosure relate to housing systems (such as those used in wafer processing systems), and particularly to housing systems configured to perform automated teaching operations. Background Technology

[0003] In semiconductor processing and other electronic processing, platforms are frequently used that employ robotic arms to transport objects (such as wafers) between processing chambers, from storage areas (e.g., front-opening standard compartments (FOUPs)) to processing chambers, and from processing chambers to storage areas, etc. Processing systems (such as wafer processing systems) have one or more processing chambers for processing wafers. Gases can be used to etch wafers within the processing chambers (e.g., wafers can be etched simultaneously with electrostatic clamping in the etching chamber). A robotic arm picks up an object from a specific location and transports it to another location. Summary of the Invention

[0004] The following is a simplified overview of this disclosure to provide a basic understanding of certain aspects of it. This overview is not a comprehensive summary of this disclosure. It is not intended to identify key or essential elements of this disclosure, nor is it intended to depict any scope of a particular implementation of this disclosure or any scope of the claims. Its sole purpose is to present some concepts of this disclosure in a simplified form as a prelude to the more detailed description that follows.

[0005] In one aspect of this disclosure, an automated teaching housing system includes: a plurality of surfaces that at least partially surround an internal volume of the automated teaching housing system. The automated teaching housing system further includes an automated teaching pin at least partially disposed within the internal volume. The automated teaching pin is a scannable feature having a fixed position within the automated teaching housing system. The automated teaching housing system further includes a front interface coupled to one or more of the plurality of surfaces to engage a substantially vertical portion of a loading port of a wafer processing system. The automated teaching pin enables automated teaching operations of a robotic arm of the wafer processing system. The automated teaching operation is the operation of automatically teaching a fixed position within the automated teaching housing system to the robotic arm of the wafer processing system.

[0006] In another aspect of this disclosure, a method includes the step of engaging a front interface of an automated teaching housing system with a substantially vertical portion of the loading port of a factory interface of a wafer processing system to establish a sealed environment comprising an internal volume of the automated teaching housing system and the interior of the factory interface. The method further includes the step of scanning automated teaching pins disposed within the internal volume of the automated teaching housing system using a robotic arm of the factory interface, while maintaining the sealed environment. The method further includes the step of determining a fixed position associated with the automated teaching housing system based on the scanning results. Contents are then transferred by the robotic arm based on the fixed position.

[0007] In another aspect of this disclosure, a housing system includes a plurality of surfaces that at least partially surround an internal volume of the housing system. The housing system further includes a plurality of support structures disposed within the internal volume. The housing system further includes a calibration substrate disposed on the plurality of support structures within the internal volume. The calibration substrate includes calibration pins. The housing system further includes one or more front interfaces coupled to the plurality of surfaces. The front interfaces are configured to engage a substantially vertical portion of a loading port of a wafer processing system. The calibration substrate enables calibration operations of a robotic arm of the wafer processing system to automatically determine robotic arm errors. Attached Figure Description

[0008] This disclosure is illustrated by way of example and not limitation in the accompanying drawings, in which the same reference numerals indicate similar elements. It should be noted that different references to “an” or “one” in this disclosure do not necessarily refer to the same embodiment, and such references imply at least one.

[0009] Figure 1 A processing system according to certain implementations is shown.

[0010] Figure 2A A front view of an automated teaching shell system according to certain embodiments is shown.

[0011] Figure 2B An exploded perspective view of an automated teaching shell system according to certain embodiments is shown.

[0012] Figure 2C A perspective view is shown of a calibration substrate disposed in an automated teaching housing system according to certain embodiments.

[0013] Figure 3A A front view of the automatic teaching pin of an automatic teaching housing system according to certain embodiments is shown.

[0014] Figure 3BA top view of the automatic teaching pin of an automatic teaching housing system according to certain embodiments is shown.

[0015] Figure 4A A top view of a robotic arm according to some embodiments is shown.

[0016] Figure 4B A top view of a robotic arm according to some embodiments is shown.

[0017] Figure 4C A method for performing calibration operations using an automated teaching shell system, according to certain embodiments, is shown.

[0018] Figures 5A-5D Methods for performing one or more automated teaching operations, calibration operations, or diagnostic operations using an automated teaching shell system according to certain embodiments are shown.

[0019] Figure 6 It is a block diagram showing a computer system according to certain implementations. Detailed Implementation

[0020] The embodiments described herein relate to an automated teaching housing system. A robotic arm (e.g., an atmospheric robot, a factory interface robot, etc.) is positioned inside the factory interface of a wafer processing system and moves wafers within the wafer processing system. A housing system (e.g., a FOUP or other substrate housing system) is used to transport objects such as wafers. The housing system provides a sealed environment during transport. The housing system engages with the wafer processing system (e.g., docking, sealing, etc.) to form a sealed environment comprising the internal volume of the housing system and the internal volume of the factory interface. During operation, the robotic arm removes objects from and / or inserts objects into the housing system, and once the wafer in the housing system has been processed, the housing system is closed and removed from the wafer processing system (e.g., sealed and undocked using a door). The robotic arm picks up a wafer from a specific location in the housing system and places the wafer in a specific location within the housing system.

[0021] Errors in a robotic arm can damage wafers, housing systems, and / or the robotic arm itself. Robotic arm errors are related to teaching, calibration, and / or component diagnostics. Teaching refers to teaching the robotic arm to the position of the housing system (e.g., a reference point). For example, the reference point could be the center of the housing system. Calibration involves identifying errors in the robotic arm's movement (e.g., joint motion errors, joint hysteresis, and joint backlash) and adjusting the robotic arm's settings to compensate for the identified errors. Diagnostics involves determining whether a component of the robotic arm has malfunctioned. For example, a robotic arm's end effector has a flat upper surface, protrusions (e.g., tooth cusps) extending upward from the flat upper surface, and a plunger positioned above the flat upper surface. The end effector is configured to grip a substrate positioned on the flat upper surface by actuating the plunger to hold the substrate between the actuated plunger and the protrusion at its distal end. Diagnostics can be performed to determine whether the robotic arm's plunger has malfunctioned (e.g., the plunger did not extend far enough to hold the substrate, the plunger did not actuate fast enough, etc.).

[0022] If the robotic arm has not been taught the position of the housing system (e.g., the center position of the housing system), it will attempt to pick up the wafer from the wrong position and / or place it in the wrong position. Picking up the wafer from the wrong position and / or placing it in the wrong position can damage the wafer, the housing system, and / or the robotic arm. Furthermore, even if the robotic arm is instructed to pick up and place the wafer in the correct position, it will typically not actually achieve this if it is not calibrated. If the robotic arm is not calibrated, movement errors due to this lack of calibration can cause it to pick up the wafer from the wrong position and / or place it in the wrong position, thereby damaging the wafer, the housing system, and / or the robotic arm. Additionally, even if the robotic arm has been taught the center or zero position of the housing system and has been calibrated, it may still malfunction, damaging the wafer, the housing system, and / or the robotic arm. Therefore, in some implementations, diagnostics are performed to determine if the robotic arm has malfunctioned and / or to determine how it has malfunctioned. Errors resulting from incorrect positioning of the robotic arm teaching housing system, uncalibrated robotic arm movement, and / or improper diagnosis of faulty robotic arm components may further lead to improper chip processing.

[0023] Typically, teaching the robotic arm to its position, calibrating its movements, and diagnosing faulty components (e.g., determining errors, identifying speed drops below a threshold) are done manually. This manual process involves technicians opening the wafer processing system (exposing the sealed environment within the factory interface to the atmosphere), manually operating the robotic arm (potentially introducing contaminants), and manually performing teaching, calibration, and diagnostics. After opening the wafer processing system, it undergoes a lengthy recertification process during which it cannot be used to process wafers. This recertification process impacts production line output, scheduling, quality, user time, and energy consumption.

[0024] The apparatus, systems, and methods disclosed herein provide an automated teaching housing system (e.g., a FOUP) to enable one or more automated teaching operations, calibration operations, or diagnostic operations. In one embodiment, the automated teaching housing system includes a surface (e.g., a top surface, side surface, bottom surface, rear surface, etc.) that at least partially surrounds an internal volume of the automated teaching housing system. An automated teaching pin is at least partially disposed within the internal volume. The automated teaching pin is a scannable feature (e.g., a cylindrical feature scannable by a robotic arm) having a fixed position within the automated teaching housing system. A front interface (e.g., a door frame) coupled to one or more surfaces (e.g., side surfaces, top surface, bottom surface, etc.) engages (e.g., seals) a substantially vertical portion of a loading port of a wafer processing system with the automated teaching housing system. The automated teaching housing system includes a base plate fixed to a bottom surface (e.g., a bottom wall) of a surface (e.g., a wall) of the automated teaching housing system. The automated teaching pin is fixed to the base plate and extends through the bottom surface into the internal volume. The base plate engages a substantially horizontal portion of the automated teaching housing system with the loading port. The basic horizontal section includes kinematic devices (e.g., kinematic pins, kinematic flanges, etc.) to position the automated teaching housing system in the correct location (e.g., the same location each time the automated teaching housing system engages with the loading port). A robotic arm scans the automated teaching pins to perform automated teaching operations. An automated teaching operation is an operation used to automatically determine the fixed position (e.g., center) of one or more of the automated teaching housing system, the basic horizontal section of the loading port, the kinematic devices, or the like (e.g., based on the position of the automated teaching pins). The robotic arm uses the determined fixed position to remove objects from other housing systems engaged with the loading port and / or insert objects into other housing systems.

[0025] In some embodiments, a calibration substrate is disposed on a support structure within the internal volume of an automated teaching housing system. The calibration substrate is substantially horizontal and includes calibration pins fixed to its upper surface. A robotic arm uses the calibration substrate to perform calibration operations. The robotic arm scans the calibration pins to determine a first position of the calibration substrate (e.g., the calibration pins), removes the calibration substrate from the support structure (e.g., removes the calibration substrate from the automated teaching housing system), is instructed to place the calibration substrate at the first position on the support structure, scans the calibration pins to determine a second position of the calibration substrate, and determines a robotic arm error based on the difference between the first and second positions.

[0026] In one embodiment, a robotic arm is used by a calibration substrate to perform diagnostic operations. The calibration substrate has a first width in a first orientation and a second width in a second orientation. In some examples, the periphery of the calibration substrate includes a notch. The robotic arm is moved to position itself below the calibration substrate in the first orientation, actuating a plunger of the robotic arm to secure the calibration substrate in the first orientation, and determining whether a first error occurs while securing the calibration substrate in the first orientation. The same process is repeated in the second orientation to determine whether a second error occurs while securing the calibration substrate in the second orientation. In some embodiments, the first or second error includes one or more plungers taking more than a threshold amount of time to secure to the calibration substrate, the plunger extending a distance not equal to the distance between the robotic arm and the calibration substrate, or the like.

[0027] The apparatus, systems, and methods disclosed herein offer advantages over conventional solutions. An automated teaching housing system engages with the loading port of a wafer processing system and performs one or more automated teaching operations, automated calibration operations, and / or automated component diagnostic operations without opening the wafer processing system (e.g., without opening the wafer processing system's factory interface) and without subsequent recertification processing of the wafer processing system (e.g., performing operations while maintaining a sealed environment). The loading port is configured to accept different types of housing systems, such as front-opening standard chambers (FOUPs). The loading port is sealed to the front interface of the automated teaching housing system to prevent contamination from the wafer processing system (factory interface), prevent harmful gases from escaping the wafer processing system (factory interface), and / or maintain an inert environment within the factory interface. The automated teaching housing system includes automated teaching pins to enable automated teaching operations. In some embodiments, the automated teaching housing system includes a calibration substrate to enable one or more calibration or diagnostic operations. The automated teaching housing system is used to learn fixed positions relative to the loading port, robotic arm errors, and / or robotic arm problems to control the robotic arm to remove the wafer from the correct position and place the wafer in the correct location. In this way, the automated teaching shell system reduces errors in the wafer and minimizes damage to the robotic arm, shell system, and / or wafer handling system. Compared to traditional solutions, using an automated teaching shell system has a smaller impact on production line output, scheduling, quality, user time, and energy consumption.

[0028] The automated teaching enclosure system used for automated teaching operations is for illustrative purposes and not for limitation. In some embodiments, the automated teaching enclosure system is used for one or more of calibration operations, diagnostic operations, or automated teaching operations. In some embodiments, the automated teaching enclosure system is not used for automated teaching operations (e.g., for calibration and / or diagnostic operations without automated teaching operations).

[0029] Figure 1 A processing system 100 (e.g., a wafer processing system) according to certain embodiments is shown. The processing system 100 includes a factory interface 101 and loading ports (e.g., loading ports 128A-128D). In some embodiments, loading ports 128A-128D are directly mounted to (e.g., sealed against) the factory interface 101. Housing systems 130A-130D (e.g., cartridges, FOUPs, processing kit housing systems, automated teaching housing systems, or the like) are configured to be movably coupled to (e.g., docked) to loading ports 128A-128D. Reference Figure 1Housing system 130A is coupled to loading port 128A, housing system 130B is coupled to loading port 128B, housing system 130C is coupled to loading port 128C, and housing system 130D is coupled to loading port 128D. In some embodiments, one or more housing systems are coupled to loading ports for transferring wafers and / or other substrates into and out of processing system 100. Each housing system may be sealed against a corresponding loading port. In some embodiments, housing system 130A is docked to loading port 128A (e.g., a robotic arm for teaching, calibration, and / or diagnostic factory interface 101). Once one or more such operations have been performed, housing system 130A is then removed from loading port 128A, and a second housing system (e.g., a FOUP containing a wafer) is then docked to the same loading port 128A. In some embodiments, the housing system (e.g., housing system 130A) is one or more automated teaching housing systems for performing automated teaching, calibration, or diagnostic operations. In some implementations, the housing system (e.g., housing system 130B) is a processing kit housing system for conveying contents 110 (such as a processing kit ring) into or out of the processing system 100.

[0030] In some embodiments, the loading port includes a front interface forming a vertical opening (or a substantially vertical opening). The loading port also includes a horizontal surface for supporting a housing system (e.g., a cartridge, an automated teaching housing system). Each housing system (e.g., a wafer FOUP, an automated teaching housing system, a processing kit housing system) has a front interface forming a vertical opening. The front interface of the housing system is sized to engage (e.g., seal to the front interface) with the front interface of the loading port (e.g., the size of the vertical opening of the housing system is substantially the same as the size of the vertical opening of the loading port). The housing system is placed on the horizontal surface of the loading port, and the vertical opening of the housing system is aligned with the vertical opening of the loading port. The front interface of the housing system interconnects with the front interface of the loading port (e.g., clamps to, secures to, seals to the front interface of the loading port). The base plate (e.g., a base plate) of the housing system 130 has features that engage with the horizontal surface of the loading port (e.g., loading features (such as recesses or sockets) that engage with loading port movement pin features, loading port features for pin clearance, and / or housing system docking tray latching clamping features). The same loading port is used for different types of housing systems (e.g., automated teaching housing systems, processing kit housing systems, cassettes containing wafers, etc.).

[0031] In some embodiments, the housing system (e.g., an automated teaching housing system) includes automated teaching pins for performing automated teaching operations. In some embodiments, the housing system includes one or more calibration substrates (e.g., including calibration pins) for performing calibration or diagnostic operations. Therefore, the housing system may include both automated teaching pins and calibration substrates.

[0032] In some embodiments, the housing system 130B (e.g., a processing kit housing system) includes one or more contents 110 (e.g., a processing kit ring, an empty processing kit ring carrier, a processing kit ring disposed on the processing kit ring carrier, a verification chip, etc.). In some examples, the housing system 130B is coupled to a factory interface 101 (e.g., via a loading port) to enable the automatic transfer of a processing kit ring from the processing kit ring carrier to the processing system 100 to replace a used processing kit ring.

[0033] In some embodiments, the processing system 100 further includes first vacuum ports 103a, 103b that couple the factory interface 101 to the respective degassing chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to the respective degassing chambers 104a, 104b and are disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate the transfer of wafers and contents 110 (e.g., processing kit rings) into the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers and a corresponding number of vacuum ports (e.g., the processing system 100 includes a single degassing chamber, a single first vacuum port, and a single second vacuum port). The transfer chamber 106 includes a plurality of processing chambers 107 disposed around and coupled thereto (e.g., four processing chambers 107, six processing chambers 107, etc.). Processing chamber 107 is coupled to transfer chamber 106 via a corresponding port 108 (such as a slit valve or the like). In some embodiments, plant interface 101 is at a higher pressure (e.g., atmospheric pressure), while transfer chamber 106 is at a lower pressure (e.g., vacuum). Each degassing chamber (e.g., a loading lock, a pressure chamber) has a first door (e.g., a first vacuum port) for sealing the degassing chamber to plant interface 101 and a second door (e.g., a second vacuum port) for sealing the degassing chamber to transfer chamber 106. When the first door is opened and the second door is closed, contents are transferred from plant interface 101 to the degassing chamber, the first door closes, the pressure in the degassing chamber decreases to match transfer chamber 106, the second door opens, and contents are transferred out of the degassing chamber. Local center finding (LCF) devices are used to align the contents in transfer chamber 106 (e.g., before the contents enter processing chamber 107 and after the contents leave processing chamber 107).

[0034] In some embodiments, the processing chamber 107 includes one or more of an etching chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced deposition of the above), an annealing chamber, or the like.

[0035] Factory interface 101 includes factory interface robot 111. Factory interface robot 111 includes a robotic arm, such as a selective compliance assembly robot arm (SCARA) robot. Examples of SCARA robots include 2-link SCARA robots, 3-link SCARA robots, 4-link SCARA robots, etc. Factory interface robot 111 includes an end effector at one end of the robotic arm. The end effector is configured to pick up and handle specific objects, such as wafers. Alternatively or additionally, the end effector is configured to handle objects (such as calibration substrates and handling kit rings (edge ​​rings)). The end effector is also configured to scan objects (e.g., automatic teaching pins, calibration pins, etc.), which will be described in more detail below (e.g., Figures 4A-4C The robotic arm has one or more links or components (e.g., wrist component, upper arm component, forearm component, etc.) that are configured to move to move the end effector to different positions along different orientations.

[0036] The factory interface robot 111 is configured to transfer objects between the housing system (e.g., a case, FOUP) and the degassing chambers 104a, 104b (or loading ports). While conventional systems are associated with operator-operated opening (e.g., disassembly, breach of seals, contamination) of the processing system 100 (e.g., the factory interface 101) to teach, calibrate, and / or diagnose malfunctions of the robotic arm (e.g., the robotic arm of the factory interface robot), the processing system 100 is configured to facilitate automated teaching, calibration, and / or diagnostics without operator-operated opening (e.g., disassembly, breach of seals, contamination). Therefore, in this embodiment, a sealed environment comprising the internal volumes of the housing system and the factory interface 101 can be maintained during automated teaching, calibration, and / or diagnostic operations.

[0037] In some embodiments, a housing system (e.g., an automated teaching pin of an automated teaching housing system) is used to teach the factory interface robot 111 a fixed position relative to the loading port. In one embodiment, the fixed position corresponds to the center position of a housing system 130A (e.g., an automated teaching housing system) placed at a particular loading port, which in other embodiments also corresponds to the center position of a housing system 130B (e.g., a substrate holder) placed at a particular loading port. Alternatively, the fixed position may correspond to other fixed positions within the housing system, such as the front or rear of the housing system. In some embodiments, a housing system (e.g., an automated teaching pin and / or a calibration substrate of an automated teaching housing system) is used to calibrate the factory interface robot 111. In some embodiments, a housing system (e.g., a calibration substrate of an automated teaching housing system) is used to diagnose the factory interface robot 111.

[0038] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robotic arm with an end effector at one end. The end effector is configured to handle specific objects, such as wafers. In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in other embodiments, the transfer chamber robot 112 may have fewer links and / or fewer degrees of freedom compared to the factory interface robot 111.

[0039] Controller 109 controls various aspects of processing system 100. Controller 109 is and / or includes computing devices such as personal computers, server computers, programmable logic controllers (PLCs), microcontrollers, etc. Controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices (such as microprocessors, central processing units, or the like). More specifically, in some embodiments, the processing device is a Complex Instruction Set Computing (CISC) microprocessor, a Reduced Instruction Set Computing (RISC) microprocessor, a Very Long Instruction Word (VLIW) microprocessor, or a processor implementing other instruction sets or combinations of instruction sets. In some embodiments, the processing device is one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, or the like. In some embodiments, controller 109 includes data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, network interfaces, and / or other components. In some embodiments, controller 109 executes instructions to perform any or more of the methods or processes described herein. Instructions are stored on a computer-readable storage medium, including one or more of main memory, static memory, auxiliary memory, and / or processing devices (during instruction execution). In some embodiments, controller 109 receives signals from and sends control to factory interface robot 111 and wafer transfer chamber robot 112.

[0040] Figure 1The schematic diagram illustrates the transfer of contents 110 (e.g., a processing kit ring coupled to a processing kit ring carrier) into processing chamber 107. According to one aspect of this disclosure, contents 110 are removed from processing kit housing system 130B via a factory interface robot 111 located in factory interface 101. Factory interface robot 111 transfers contents 110 through one of first vacuum ports 103a, 103b into corresponding degassing chambers 104a, 104b. Transfer chamber robot 112, located in transfer chamber 106, removes contents 110 from one of degassing chambers 104a, 104b through a second vacuum port 105a or 105b. Transfer chamber robot 112 moves contents 110 into transfer chamber 106, where contents 110 are transferred to processing chamber 107 through a corresponding port 108. Although not shown for clarity... Figure 1 In this process, the transfer of contents 110 includes the transfer of the processing kit ring on the processing kit ring carrier, the transfer of the empty processing kit ring carrier, and the transfer of the placement of the verification chip.

[0041] Figure 1An example of the transfer of contents 110 is shown; however, other examples are conceivable. In some examples, it is conceivable that the processing kit housing system 130B is coupled to the transfer chamber 106 (e.g., via a loading port mounted to the transfer chamber 106). The contents 110 are loaded from the transfer chamber 106 into the processing chamber 107 via the transfer chamber robot 112. Alternatively, in some embodiments, the contents 110 are loaded in a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned to communicate with a factory interface 101, which is opposite to the SSP shown. The processed contents 110 (e.g., a used processing kit ring) are removed from the processing system 100 in a manner contrary to any of the methods described herein. When multiple housing systems 130B or a combination of housing systems 130B and SSPs are used, in some embodiments, one SSP or housing system 130B will be used for unprocessed contents 110 (e.g., a new processing kit ring), while another SSP or housing system 130B will be used to receive processed contents 110 (e.g., a used processing kit ring). Before transferring contents 110 via a robotic arm, housing system 130A is used to perform one or more of the automated teaching, calibration, or diagnostic operations of the robotic arm (e.g., for factory interface robot 111, transfer chamber robot 112, etc.). One or more of the automated teaching, calibration, or diagnostic operations enable the robotic arm to correctly remove an object from a specific location in housing system 130B and correctly place the object in a specific location in housing system 130B (e.g., once housing system 130B is docked to the same loading port previously docked with housing system 130A).

[0042] Processing system 100 includes chambers, such as factory interface 101 (e.g., device front-end module (EFEM)) and adjacent chambers (e.g., loading ports, housing systems, SSPs, degassing chambers, such as loading locks, or the like). One or more chambers are sealed (e.g., each chamber is sealed). Adjacent chambers are sealed to factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided to one or more chambers (e.g., factory interface 101 and / or adjacent chambers) to provide one or more inert environments. In some examples, factory interface 101 is an inert EFEM that maintains an inert environment within factory interface 101 (e.g., an inert EFEM miniature environment) such that a user does not need to enter factory interface 101 (e.g., processing system 100 is configured to be inaccessible to manual access within factory interface 101).

[0043] In some embodiments, an airflow (e.g., inert gas, nitrogen) is supplied to one or more chambers (e.g., plant interface 101) of the processing system 100. In some embodiments, the airflow is greater than leakage through one or more chambers to maintain positive pressure within one or more chambers. In some embodiments, the inert gas within plant interface 101 is recirculated. In some embodiments, a portion of the inert gas is vented. In some embodiments, the flow rate of non-recirculated gas entering plant interface 101 is greater than the vented airflow and gas leakage to maintain positive pressure of the inert gas within plant interface 101. In some embodiments, plant interface 101 is coupled to one or more valves and / or pumps to provide airflow into and out of plant interface 101. A processing device (e.g., controller 109) controls the airflow into and out of plant interface 101. In embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensor, humidity sensor, motion sensor, door actuation sensor, temperature sensor, pressure sensor, etc.) and determines the flow rate of the inert gas flowing into and / or out of plant interface 101 based on the sensor data.

[0044] The housing system allows for the teaching, calibration, and / or diagnostics (e.g., of a factory interface robot) of a robotic arm without opening the sealed environment within the factory interface 101 and adjacent chambers. The teaching, calibration, and diagnostics of the robotic arm will be discussed in detail below. The housing system seals to the loading port in response to docking with it. The housing system provides a purge port pathway, allowing the interior of the housing system to be purged before opening to minimize interference from the inert environment within the factory interface 101.

[0045] Figure 2A An automated teaching shell system 200 according to certain embodiments is shown (e.g., Figure 1 The front view of the enclosure system. The automatic teaching enclosure system 200 is configured to perform one or more automatic teaching operations, calibration operations, or diagnostic operations.

[0046] The automated teaching enclosure system 200 includes surfaces (e.g., walls, sidewalls, substantially planar structures, etc.) that at least partially surround (e.g., form a cavity or chamber) an internal volume 202. In some embodiments, the internal volume 202 is a small environment (e.g., a sealed environment). In some embodiments, the internal volume 202 remains substantially particulate-free (e.g., substantially uncontaminated). In some embodiments, the automated teaching enclosure system 200 includes a fan (e.g., at the top surface) to suppress any particles in the internal volume 202. In some embodiments, the internal volume is substantially free (or completely free) of one or more of the following: moisture, oxygen, particles (such as dust), or the like.

[0047] The surfaces include sidewall surfaces 210A-210B (e.g., sidewalls), a bottom surface 212 (e.g., bottom wall), a top surface 214 (e.g., top wall), and a rear surface 216 (e.g., rear wall). In some embodiments, the surfaces form a clampable tub. One or more of the surfaces (e.g., sidewall surfaces 210A-210B, bottom surface 212, top surface 214, etc.) form a front interface. The front interface is configured to engage (e.g., seal) a door for transporting the automated teaching housing system 200. The front interface is configured to engage (e.g., seal) a substantially vertical portion of a loading port of a wafer processing system. In response to sealing the front interface to a door or loading port, the automated teaching housing system 200 creates a sealed environment (e.g., gases and / or particles do not leave or enter the automated teaching housing system 200 from the surrounding environment outside the wafer processing system).

[0048] In some embodiments, the automated teaching housing system 200 includes a base plate 220 (e.g., an adapter plate) coupled to a bottom surface 212. The base plate 220 is configured to engage a horizontal portion of a loading port. The base plate 220 has features (e.g., recesses, receptacles, motion interfaces) for receiving a movement mechanism (e.g., a movement pin, a precision-positioning pin) of the horizontal portion of the loading port. In some embodiments, the base plate 220 is secured to the bottom surface 212 before the automated teaching housing system 200 is engaged with the loading port. In some embodiments, the base plate 220 is secured to the loading port, and then the bottom surface 212 is secured to the base plate 220. In some embodiments, the automated teaching housing system 200 has a seal (e.g., a crushable seal, a gasket) for sealing an opening in the bottom surface 212 through which the automated teaching pin 230 extends.

[0049] In some embodiments, one or more of the overhead transport (OHT) flange 222 or at least one handle are coupled to one or more surfaces of the automated teaching housing system 200 for transport of the automated teaching housing system 200 (e.g., automated transport, manual transport, etc.). In some embodiments, the OHT flange 222 is coupled to the top surface 214. In some embodiments, a first handle 224A is disposed on a first sidewall surface 210A, and a second handle 224B is disposed on a second sidewall surface 210B.

[0050] In some embodiments, the automatic teaching pin 230 is at least partially disposed within the internal volume 202. In some embodiments, the automatic teaching pin 230 is coupled to the base plate 220, and at least a portion of the automatic teaching pin extends through an opening in the bottom surface 212 into the internal volume 202. The automatic teaching pin 230 enables automated teaching operations (e.g., see...). Figure 5C Method 540). In some embodiments, the automatic teaching pin 230 is located at the center of the base plate 220.

[0051] In some embodiments, calibration substrate 240 is disposed within internal volume 202. Calibration substrate 240 is a flat object (e.g., a wafer) that the end effector can grasp and move. Calibration substrate 240 is semi-fixed (e.g., a floating semi-fixed calibration substrate 240) for performing sensor calibration (e.g., a calibration operation).

[0052] In some embodiments, calibration pin 242 is disposed (e.g., fixed to) the upper surface of calibration substrate 240. In some embodiments, calibration substrate 240 is disposed on one or more support structures within the internal volume 202 (e.g., on three to four support structures). In some embodiments, calibration substrate 240 is disposed on a first support structure 244A and a second support structure 244B in one or more support structures, the first support structure 244A and the second support structure 244B being disposed near the rear surface 216. In some embodiments, calibration substrate 240 is disposed on a support structure adjacent to the front interface in one or more support structures (e.g., as a supplement to the first support structure 244A and the second support structure 244B). In some embodiments, collar 246 is disposed on automatic teaching pin 230, and calibration substrate 240 is disposed on collar 246 (e.g., as a supplement to support structures 244A-244B). In some embodiments, support structures are disposed on the bottom surface 212 (e.g., extending from the bottom surface 212 to the calibration substrate 240). In some embodiments, the support structure is disposed on one or more of the sidewall surfaces 210A, 210B, or rear surface 216. The calibration substrate 240 enables calibration operations (e.g., see...). Figure 5B Method 520) or diagnostic procedures (e.g., see [link to relevant documentation]). Figure 5D Method 560) is one or more of the following.

[0053] In some embodiments, the automated teaching housing system 200 includes a single automated teaching pin 230 (e.g., the automated teaching housing system 200 may or may not include a calibration pin 242). Alternatively, the automated teaching housing system 200 includes multiple automated teaching pins 230. In some embodiments, the automated teaching housing system 200 includes a single calibration pin 242 (e.g., the automated teaching housing system 200 may or may not include an automated teaching pin 230). In some embodiments, the automated teaching housing system 200 includes both an automated teaching pin 230 and a calibration pin 242. In some embodiments, the automated teaching pin 230 and the calibration pin 242 are a single pin (e.g., a single pin can be used for both automated teaching and calibration).

[0054] In some embodiments, the automated teaching housing system 200 includes pins (e.g., automated teaching pin 230 and / or calibration pin 242), wherein at least a portion of the pin is shaped (e.g., trapezoidal) to provide calibration and angle detection. In some examples, the trapezoidal portion of the pin provides both calibration and angle detection and is easily machined into a turnable part. In some embodiments, the corners of the trapezoidal portion are positioned via press-fit pins (e.g., the four corners may be press-fit pins instead of a single machined feature) to improve accuracy.

[0055] In some implementations, to provide calibration, at least a portion of the pin has a skewed or asymmetrical shape (e.g., trapezoidal) around a central pin (e.g., a cylindrical portion of the pin). Calibration is performed by comparing the symmetry of the first portion of the pin (e.g., the cylindrical portion of the pin) with the asymmetry of the second portion of the pin (e.g., the trapezoidal portion of the pin). A robotic arm performs a movement (e.g., up or down) in the z-direction to scan the first portion (e.g., cylindrical) and the second portion (e.g., trapezoidal) of the pin for comparison. The robotic arm performs a rotational movement about a single joint to measure the second portion (e.g., the trapezoidal) from a first angle and a second angle for comparison. The robotic arm performing the movement allows for comparison of joint angles in the same approximate area without requiring the robot to completely change its joint pose to scan another object. In some implementations, for angle detection, a set of offset features (e.g., the sides or edges of the trapezoidal portion) is used, which are spaced increasing or decreasing based on the scanned angle.

[0056] In some embodiments, the automated teaching housing system 200 has two or more automated teaching pins 230 and / or two or more calibration pins 242. In some embodiments, the automated teaching housing system 200 includes two or more pins, each of which can be used for one or more of automated teaching and / or calibration. In some embodiments, one or more pins extend from the bottom surface 212. In some embodiments, one or more pins extend from a surface of the automated teaching housing system 200 (e.g., sidewall surface 210A, sidewall surface 210B, top surface 214, rear surface 216, or the like) into the internal volume of the automated teaching housing system 200. In some embodiments, one or more pins extend from a structure (e.g., calibration substrate 240) within the internal volume of the automated teaching housing system 200. In some embodiments, a first pin extends from a first structure within the automated teaching housing system 200 (e.g., a first calibration substrate, which is movable by a robotic arm), and a second pin extends from a second structure within the automated teaching housing system 200 (e.g., a second calibration substrate, which is movable by a robotic arm).

[0057] Figure 2BAn exploded perspective view of an automated teaching shell system 200 according to certain embodiments is shown.

[0058] The surfaces (e.g., walls, sidewalls) of the automated instruction housing system 200 include sidewall surfaces 210A-210B, a bottom surface 212, a top surface 214, and a rear surface 216. In some embodiments, the automated instruction housing system 200 includes a base plate 220, and an automated instruction pin 230 is disposed on the base plate 220. The bottom surface 212 forms one or more openings. The base plate 220 is fixed to the bottom surface 212, and the automated instruction pin 230 extends through the opening in the bottom surface 212 into the internal volume 202 of the automated instruction housing system 200. The automated instruction pin 230 provides a seal (e.g., provides a sealed environment) at the opening in the bottom surface 212.

[0059] In some embodiments, one or more purification adapters 250 are configured to insert into an opening formed in the bottom surface 212. The purification adapters 250 are used to: fill the automated teaching housing system 200 with a gas (e.g., nitrogen (N2)), remove a gas from the automated teaching housing system, allow gas to pass through the automated teaching housing system 200, or the like. Each purification adapter 250 provides a seal (e.g., to provide a sealed environment) at a corresponding opening in the bottom surface 212. In some embodiments, the automated teaching housing system 200 is sealed to a loading port in response to docking to a loading port. The internal volume of the automated teaching housing system 200 is configured to be purified via one or more purification adapters 250 before the automated teaching housing system 200 is opened.

[0060] One or more surfaces of the automated teaching enclosure system 200 provide a front interface. The automated teaching enclosure system 200 includes a door 252. The door 252 is sealed to the front interface of the automated teaching enclosure system 200 to provide a sealed environment. The door 252 is connected to a calibration substrate (e.g., see...). Figure 2B (e.g., clamping the calibration substrate in place, pressing it against the calibration substrate) to prevent the calibration substrate from moving during transportation.

[0061] In some embodiments, the automated teaching housing system 200 includes handles 224A-224B and / or an OHT flange 222 for transporting the automated teaching housing system 200.

[0062] Figure 2C A perspective view of an automated teaching shell system 200 according to some embodiments is shown.

[0063] In some embodiments, a base plate 220 is fixed to a bottom surface 212, and an automatic teaching pin 230 extends through the bottom surface 212 into the internal volume 202 of the automatic teaching housing system. A purification adapter 250 is disposed in the bottom surface 212 and extends through the base plate 220 to be fluidly coupled to one or more gas or vacuum lines (e.g., for purifying the automatic teaching housing system 200, for creating a vacuum in the automatic teaching housing system 200, for filling the automatic teaching housing system 200 with gas, etc.). In some embodiments, a handle and an OHT flange 222 are fixed to corresponding surfaces of the automatic teaching housing system 200. In some embodiments, a calibration substrate 240 is disposed on one or more support structures within the internal volume 202 of the automatic teaching housing system 200. The calibration substrate 240 includes a calibration pin 242 fixed to its upper surface. The calibration substrate 240 includes a first width in a first orientation and a second width in a second orientation. In some embodiments, the calibration substrate 240 has a notch or recess. The calibration substrate 240 has a first width from a first position at its periphery to a second position at its periphery (e.g., neither the first nor the second position includes a notch or recess), and a second width from a third position at the periphery of a notch or recess to a fourth position at the periphery. The second width is shorter than the first width in response to the third position being a recess or inward notch. The first and second widths are used to perform diagnostic operations on a robotic arm (e.g., determining whether an end effector can grasp the calibration substrate 240 within a threshold amount of time for the first and second widths). The calibration substrate 240 and the support structure are sized such that the calibration substrate 240 can be lifted by the robotic arm from a first position (e.g., grasped by the teeth and plungers of the end effector of the robotic arm) and placed in a second position on the support structure different from the first position (e.g., for determining robotic arm error). The calibration pin 242 is sized and positioned such that the robotic arm (e.g., the end effector) can scan the calibration pin 242 to determine its position (e.g., for determining robotic arm error). The automatic teaching pin 230 is sized and positioned so that the robotic arm (e.g., an end effector) can scan the automatic teaching pin 230 to determine the position of the automatic teaching pin 230 (e.g., the center position of the automatic teaching housing system 200 and / or the loading port for teaching).

[0064] Figures 3A-3B An automated teaching shell system according to certain embodiments is shown (e.g., Figure 1 Automated teaching shell system and / or Figure 2A-2C The automatic teaching pin 300 (e.g., the automatic teaching shell system 200) of the automatic teaching shell system 200 Figure 2A-2C Automatic teaching pin 230). Figure 3A Displays the front view of the automatic teaching pin 300, while Figure 3B Showing a top view of the automatic teaching pin 300. In some embodiments, one or more portions of the calibration pin (e.g., Figure 2A-2B The calibration pin 242 is similar to the corresponding portion of the automatic teaching pin 300. In some examples, the calibration pin has both cylindrical and trapezoidal portions.

[0065] The automated teaching pin 300 includes a cylindrical portion 302 (e.g., a first portion having cylindrical sidewalls). The robotic arm uses the cylindrical portion 302 to perform automated teaching operations to position the automated teaching housing system and / or loading port in a fixed position (e.g., xy position).

[0066] The automated teaching pin 300 includes a trapezoidal portion 304 (e.g., a second portion including flat sidewalls). The robotic arm uses the trapezoidal portion 304 to be able to calibrate robotic arm errors. In some embodiments, the trapezoidal portion 304 has a perimeter that is elliptical or polygonal (e.g., trapezoidal, square, rectangular, triangular, etc.) to allow the robotic arm to scan the trapezoidal portion from different angles to measure different lengths (e.g., depths) to calibrate the robotic arm.

[0067] In some embodiments, the automatic teaching pin 300 includes a base 306, which is fixed to a base plate 320 (e.g., Figure 2A-2C The base plate 220 has a protruding portion 324. One or more base fasteners (e.g., bolts, screws, etc.) couple the base 306 to the protruding portion 324 of the base plate 320.

[0068] The bottom surface of the automated teaching housing system includes openings for the automated teaching pin (e.g., cylindrical portion 302, trapezoidal portion 304, and base 306) and openings for the clamp fastener 330. The base plate 320 includes a base flange 322 and a protrusion 324. A seal 326 is disposed on the base flange 322, and the base 306 is secured to the protrusion 324. The base plate 320 is secured to the bottom surface of the automated teaching housing system such that at least a portion of the automated teaching pin 300 extends through the openings in the bottom surface into the internal volume of the automated teaching housing system. In some examples, at least a portion of the cylindrical portion 302, trapezoidal portion 304, and base 306 extends into the internal volume. In some embodiments, the base flange 322 matches the slope (e.g., a non-horizontal slope) of the bottom surface of the automated teaching housing system. The bottom surface is disposed on the seal 326, which is disposed on the base flange 322. The clamp 308 is disposed on the bottom surface and surrounds the base 306. The clamp fastener 330 engages with the base flange 322 by extending through the clamp 308, the bottom surface, and the seal 326, thereby securing the clamp 308 to the base flange. The base flange 322, the seal 326, the bottom surface, and the clamp 308 are substantially parallel to each other, and the clamp fastener 330 is substantially perpendicular to the base flange 322, the seal 326, the bottom surface, and the clamp 308.

[0069] The top surface of the cylindrical portion 302 represents a first wafer transfer plane. The top surface of the trapezoidal portion 304 represents an alternative wafer transfer plane. The distal end of the cylindrical portion 302 near the top surface is configured as a support collar for supporting a calibration substrate.

[0070] The cylindrical portion 302 has a circular circumference and a precisely controlled surface for scanning by the robotic arm. The diameter of the cylindrical portion 302 varies as a programmable parameter. The cylindrical portion 302 indicates the xy-center (e.g., the center of the loading port) of a motion device (e.g., a motion pin) relative to the loading port (e.g., the basic horizontal portion of the loading port). The cylindrical portion 302 is used for automated teaching operations.

[0071] The trapezoidal section 304 is capable of recoil calibration and calibration of two additional robotic arm linear positions (e.g., +10 degrees and -10 degrees) to provide a total of six scannable positions. The trapezoidal section 304 is used for recoil calibration of specific joints on the robotic arm. The trapezoidal section 304 provides different scan depths when approached from different angles. The trapezoidal section allows for isolation of recoil in individual joints (e.g., general errors in the joints).

[0072] Figure 4AA top view of a robotic arm 400 according to some embodiments is shown. The robotic arm 400 is configured to perform one or more automated teaching, calibration, or diagnostic operations using an automated teaching housing system. The robotic arm 400 includes an end effector 408, a wrist member 436, a beam sensor 450, a light source 452, and a light receiver 454. An optical transmission fiber 456A is routed through the wrist member 436 and the end effector 408 and terminates at a first end 458A of the end effector 408. An optical receiving fiber 456B is routed through the wrist member 436 and the end effector 408 and terminates at a second end 458B of the end effector 408. The first end 458A and the second end 458B of the end effector 408 are spaced apart across a gap 460, which forms a relief region for certain types of processing, including the peripheral edge of a detection substrate, an automated teaching pin, a calibration pin, or the like.

[0073] Optical transmission fiber 456A terminates at a first optical path opening 462A near the first end 458A. Similarly, optical receiving fiber 456B terminates at a second optical path opening 462B near the second end 458B. The first optical path opening 462A and the second optical path opening 462B face each other and form an optical transmission path 464 (e.g., a light beam) for detecting the presence or absence of the peripheral edge of an object (e.g., an automatic teaching pin, a calibration pin, a substrate, etc.). The optical transmission path 464 extends between the first end 458A and the second end 458B (e.g., between two points), which enables the detection of objects in the gap 460.

[0074] The beam sensor 450 also includes a light transmission / reception module 466, which detects the degree of light transmission between the light transmission fiber 456A and the light receiving fiber 456B. In response to an object blocking the light transmission path 464, the light transmission / reception module 466 senses the outer edge of the object located between the first light path opening 462A and the second light path opening 462B. The output signal generated by the light transmission / reception module 466 is provided to the controller via a conductor passing through the robotic arm 400.

[0075] During the operation of the robotic arm 400, the controller (e.g., Figure 1The controller 109 transmits signals to the robotic arm 400, causing the end effector 408 to move to certain positions. In some examples, the controller generates signals that move one or more parts of the robotic arm (e.g., the upper arm, forearm, wrist member 436) to specific positions, such as positions within a factory interface of a wafer processing system or within a transfer chamber. The controller generates signals to move the end effector 408 based on a fixed position relative to the robotic arm 400. For example, the robotic arm 400 performs automated teaching operations (e.g., during operation, the robotic arm 400 determines the coordinates of a fixed position), calibration operations (e.g., during operation, the robotic arm 400 determines robotic arm errors), and / or diagnostic operations (e.g., during operation, the robotic arm 400 determines errors or malfunctions in the robotic arm 400). The controller then generates signals to move one or more parts of the robotic arm 400 (e.g., the upper arm, forearm, wrist member 436) to move the end effector 408 to a specific position relative to the fixed position (e.g., given robotic arm errors, etc.).

[0076] In some implementations, one or more errors in the mechanics of the robotic arm 400 cause positioning errors in the end effector 408. For example, errors or play in one or more joints (e.g., between the upper arm, forearm, and wrist member 436) can lead to positional errors. These positional errors reduce the accuracy of automated teaching operations performed by the robotic arm 400. Errors in one or more joints include joint motion errors, joint hysteresis, and joint backlash. Joint motion errors (e.g., joint error) are the result of a joint not rotating as instructed. For example, a joint is instructed to rotate to a specific angle, but it rotates to a different angle. Joint backlash occurs when a joint rotates clockwise or counterclockwise and the position varies reproducibly. Joint hysteresis relates to the hysteresis observed during clockwise and counterclockwise rotation of a joint. Other errors analyzed include the comparison between the actual length of one or more parts of the robotic arm (e.g., the upper arm, forearm, and wrist member 436) and their lengths stored in the controller.

[0077] The accuracy of automated teaching can be improved by repeatedly orienting the end effector 408 to a fixed position using different robot poses. A robot pose refers to the position of one or more parts of the robotic arm (e.g., upper arm, forearm, wrist component 436). The robotic arm 400 determines different coordinates of the fixed position, which vary due to robotic arm errors (e.g., joint errors and other errors).

[0078] Figure 4BA top view of a robotic arm 400 according to some embodiments is shown. The robotic arm 400 is configured to perform one or more automated teaching, calibration, or diagnostic operations using an automated teaching housing system. The robotic arm 400 includes an end effector 408, a wrist member 436, a first optical path opening 462A (e.g., an optical fiber transmitter) coupled to a light source 452, and a second optical path opening 462B (e.g., an optical fiber receiver) coupled to a light receiver 454. An optical transmission path 464 (e.g., a light beam, a beam triggering path) is disposed between the first optical path opening 462A and the second optical path opening 462B.

[0079] The robotic arm 400 has a robotic wrist center 410 corresponding to the actual wafer center 412. A characteristic error 414 (e.g., robotic arm error) of the robotic arm 400 is the distance or angle between a centerline and an error line. The centerline lies between the robotic wrist center 410 and the actual wafer center 412. The error line is perpendicular to the optical transmission path 464 (e.g., at an angle 416 of 90 degrees). In some embodiments, the robotic arm 400 determines the characteristic error 414 via a calibration operation.

[0080] Figure 4C A method 470 for performing calibration operations using an automated teaching shell system according to certain embodiments is shown. Although shown in a specific sequence or order, the order of processes may be modified unless otherwise stated. Therefore, the illustrated embodiments should be understood as examples only, and the illustrated processes may be performed in different orders, and some processes may be performed in parallel. In addition, one or more processes may be omitted in various embodiments. Therefore, not all processes are required in every embodiment.

[0081] Reference Figure 4C In method 470, at step 472, the robotic arm 400 places a calibration substrate (e.g., a pinned wafer) including calibration pins on a first position (e.g., Tx0, Ty0) on a support structure of the automated teaching housing system (e.g., in response to docking and sealing to the loading port of the automated teaching housing system). In some embodiments, the calibration substrate is placed at the first position before docking with the automated teaching housing system.

[0082] At step 474, the robotic arm 400 performs a first scan (e.g., an automated teaching scan) on the calibration pin in the automated teaching housing system. The robotic arm 400 determines that the calibration pin is in a first position. To perform the scan, the robotic arm 400 rotates left and right about the wrist center 410.

[0083] At step 476, the robotic arm 400 lifts the calibration substrate and is instructed to move it to a second position (e.g., Tx1, Ty1) on the support structure of the automated teaching housing system. In some embodiments, the second position is the same as the first position. In some embodiments, the second position is different from the first position.

[0084] At step 478, the robotic arm 400 performs a second scan (e.g., an automated teaching scan) to determine, at block 480, the calibration pin is in a third position (e.g., Tx2, Ty2) within the automated teaching housing system. To perform the scan, the robotic arm 400 rotates left and right about the wrist center 410.

[0085] The robotic arm 400 determines its error based on two or more of a first position, a second position, or a third position. In one example, the robotic arm error is the difference between the third position (e.g., the actual position) and the second position (e.g., the orientation position). Therefore, the robotic arm uses the robotic arm error to determine the actual position of the object.

[0086] In some implementations, the robotic arm performs method 470 for each component of the robotic arm (e.g., wrist component, upper arm, forearm) to determine the robotic arm error for each component. In some examples, the robotic arm performs method 470 by rotating the forearm center while keeping other components stationary to determine forearm-specific robotic arm errors.

[0087] Figures 5A-5D Methods for performing one or more automated teaching, calibration, or diagnostic operations (e.g., while maintaining a sealed environment) using an automated teaching enclosure system according to certain embodiments are shown. One or more automated teaching, calibration, or diagnostic operations are automatically performed in response to user input (e.g., pressing a button on a factory interface). Although shown in a specific sequence or order, the order of processes may be modified unless otherwise stated. Therefore, the shown embodiments should be understood as examples only, and the shown processes may be performed in different orders, and some processes may be performed in parallel. Furthermore, one or more processes may be omitted in various embodiments. Therefore, not all processes are required in every embodiment.

[0088] Reference Figure 5A In method 500, at block 502, the front interface of the automated teaching housing system engages with a fundamental vertical portion of the loading port of the wafer processing system. The front interface is sealed to the fundamental vertical portion of the loading port. In some examples, the front interface is clamped to the fundamental vertical portion of the loading port, and a sealing member (e.g., a gasket) is disposed between the front interface and the fundamental vertical portion of the loading port.

[0089] At block 504, the base plate of the automated teaching housing engages with the basic horizontal portion of the loading port. The base plate includes features (e.g., recesses or sockets) that engage with a movement mechanism (e.g., a moving pin) of the basic horizontal portion of the loading port. Features of the base plate (e.g., cones) engage with movement features (e.g., moving pins) of the loading port to position the automated teaching housing system relative to the loading port in a specific location. The movement features of the loading port engage with features of other housing systems (e.g., a processing kit ring housing system) to position the other housing systems relative to the loading port in the same specific location as the automated teaching housing system.

[0090] At box 506, the robotic arm is used to perform automated teaching operations (e.g., see...). Figure 5C Method 540), calibration operation (for example, see Figure 5B Method 520) or diagnostic procedures (e.g., see [link to relevant documentation]). Figure 5D Method 560) is one or more of the following.

[0091] In some implementations, automated teaching operations are used to teach the robotic arm a fixed position (e.g., the center of the housing system or the center of the loading port in the xy plane) such that during a pick-up operation, the robotic arm can be positioned below the center of each wafer, and during a placement (e.g., lowering) operation, each wafer is delivered to the correct position.

[0092] In some implementations, the calibration operation is used to determine and compensate for the movement error of the robotic arm. For example, in response to determining that the wrist of the robotic arm has rotated by a first angular amount less than an indicated angular amount, the controller will indicate the sum of the first angular amount of wrist rotation and the indicated angular amount (e.g., to compensate for the rotation error).

[0093] The robotic arm's wrist rotation has a 1-degree error.

[0094] In some implementations, diagnostic operations are used to determine whether components of the robotic arm are functioning properly (e.g., appropriate speed, appropriate measurement, appropriate chip fixation, etc.).

[0095] Each of the automated teaching, calibration, and diagnostic operations will be performed using the automated teaching housing system without opening the factory interface.

[0096] Figure 5BA method 520 is shown for performing calibration operations (e.g., while maintaining a sealed environment) using an automated teaching enclosure system according to certain embodiments. In some embodiments, the calibration operation is performed at the factory under one or more of the following conditions: after replacing one or more parts of a robotic arm (e.g., controllers, components, joints, etc.), after manipulating one or more parts of the robot, after damaging the robotic arm, or once previous robotic arm error data (e.g., data obtained from the factory) is lost, or the like. The calibration operation provides information on the robot joint errors of the robotic arm, which is not specific to any particular station (e.g., a robotic arm applicable to any loading port of a wafer fabrication system).

[0097] Reference Figure 5B In method 520, at box 522, the calibration substrate is positioned above the automatic teaching pin on the support structure within the internal volume of the automatic teaching housing system.

[0098] At box 524, the robotic arm scans the calibration pins of the calibration substrate to determine a first position of the calibration substrate. The robotic arm scans the calibration pins by moving left and right around the center of a component of the robotic arm (e.g., around the wrist center). The robotic arm scans the calibration pins by moving only one component of the robotic arm (e.g., the wrist component) while keeping the other components of the robotic arm stationary. The robotic arm stores the first position.

[0099] At box 526, the robotic arm removes the calibration substrate from the support structure. The robotic arm positions its end effector below the calibration substrate. The robotic arm actuates the plunger (e.g., a pneumatic plunger) of the end effector to grip the calibration substrate between the plunger and a pad (e.g., a tooth tip) at the distal end of the end effector. In some embodiments, the robotic arm uses only one component to lift and move the calibration substrate while keeping the other components of the robotic arm stationary. In some embodiments, the robotic arm removes the calibration substrate from an automated teaching housing system.

[0100] At box 528, the robotic arm is instructed to place the calibration substrate at a first position. The robotic arm retrieves the first position from memory and attempts to place the calibration at the first position. The robotic arm uses the same components of the robotic arm (e.g., the wrist component) used to remove the calibration substrate from the support structure (e.g., to isolate identified robotic arm errors to a single component).

[0101] At box 530, the robotic arm scans the calibration pins on the calibration substrate again to determine the second position of the calibration substrate.

[0102] At box 532, the robotic arm error is determined based on the difference between the first position and the second position. The robotic arm error is used for any operation of the housing system (e.g., automated teaching operation, calibration operation of other components of the robotic arm, diagnostic operation, etc.) and / or subsequent operation of other housing systems that will dock at the same loading port as the automated teaching housing system (e.g., transfer of wafers, carriers, processing kit rings, placement of verification wafers, etc.).

[0103] Figure 5C A method 540 is shown for performing automated teaching operations (e.g., while maintaining a sealed environment) using an automated teaching housing system according to certain embodiments. In some embodiments, the automated teaching operation is performed when one of the following occurs: at startup (e.g., when a tool of a wafer fabrication system is started), periodically (e.g., annually), once a value received from a robotic arm drifts, when the robotic arm ages, after a part of the robotic arm is replaced, etc. The automated teaching operation provides a specific location for the automated teaching housing system and / or loading port. The robotic arm uses the specific location to determine the position of an object mounted in any housing system on the same loading port.

[0104] Reference Figure 5C In method 540, at block 542, a robotic arm scans an automated teaching pin disposed within the internal volume of the automated teaching housing system. In some embodiments, the robotic arm scans the automated teaching pin by moving only one component of the robotic arm (e.g., the wrist component) while keeping the other components of the robotic arm stationary. In some embodiments, the robotic arm uses the same components used in the calibration operation.

[0105] At box 544, based on the scan results of box 542, a fixed position (e.g., a center position) associated with the automated teaching shell system and / or loading port is determined. In some embodiments, the fixed position is further determined based on robotic arm errors.

[0106] At box 546, the robotic arm is positioned to transfer contents based on a fixed location. In some embodiments, the robotic arm transfers contents based on robot error. The fixed location is used for any operation of the housing system (e.g., calibration operations, diagnostic operations, etc. of other components of the robotic arm) and / or subsequent operations of other housing systems docked at the same loading port as the automated teaching housing system (e.g., transfer of wafers, carriers, processing kit rings, placement verification wafers, etc.).

[0107] Figure 5DA method 560 is shown for performing diagnostic operations (e.g., while maintaining a sealed environment) using an automated teaching enclosure system according to certain embodiments. In some embodiments, the diagnostic operations are performed when: periodically (e.g., daily, weekly, monthly), when the robotic arm is aging, when problems are detected with the robotic arm and / or the wafers handled by the robotic arm, when statistical processing control (SPC) tracking is performed on the robotic arm to anticipate potential deterioration and plan downtime, or similarly. Diagnostic operations may be performed to determine if any component of the robotic arm has failed.

[0108] Reference Figure 5D In method 560, at block 562, a robotic arm is positioned below the calibration substrate in a first orientation corresponding to a first width of the calibration substrate. In some embodiments, an end effector of the robotic arm is located below the calibration substrate. The end effector has a flat upper surface and one or more distal ends opposite the wrist of the robotic arm. Each of the one or more distal ends has a corresponding protrusion (e.g., a tooth cusp) extending upward from the flat surface. The end effector has a plunger disposed above the flat upper surface. The upper flat surface is configured to support the substrate. The plunger is configured to be actuated to push against one side of the substrate, while the protrusion (e.g., a tooth cusp) pushes against the other side of the substrate, such that the substrate is gripped (e.g., secured) between the plunger and the protrusion. While securing the substrate via the end effector, the robotic arm can transport the substrate.

[0109] At box 564, the plunger of the robotic arm is instructed to actuate to secure the calibration substrate in a first orientation. To secure the calibration substrate, it is fixed between a pad (e.g., a tooth cusp) and the plunger at the distal end of the end effector.

[0110] At box 566, it is determined whether a first error occurs when the calibration substrate is fixed in the first orientation. The robotic arm can actuate the plunger until either a time threshold amount or an earlier one is determined (e.g., a sensor determines a threshold amount of resistance to plunger actuation) is reached. This is in response to determining the distance between the distal end of the plunger and the pad. For example, the distance between the plunger and the pad may correspond to each position of plunger actuation.

[0111] In some implementations, the determination of the first error responds to determining that the substrate was not secured between the plunger and the pad within a time threshold amount of plunger actuation (e.g., a threshold amount of time threshold amount during which no resistance was detected). This may indicate that the plunger has failed due to non-application or actuation at a speed below a threshold.

[0112] In some implementations, the determination of the first error responds to determining that the plunger has been actuated beyond a threshold distance to fix the calibration substrate (e.g., causing the measured width to be smaller than the actual width). This may indicate that the plunger has failed because the actuated distance was less than the distance it was instructed to actuate.

[0113] In some implementations, the determination of the first error is in response to determining that the measured width of the calibration substrate in the first orientation differs from the actual width of the calibration substrate in the first orientation. This may indicate that the plunger has failed to actuate as much as instructed, or that the calibration substrate has not been properly secured.

[0114] In some implementations, the first error responds to the calibration substrate not being properly positioned on the robotic arm (e.g., one or more portions popping out of the tip of the end effector), wear of the end effector, or the like.

[0115] At box 568, the robotic arm is positioned below the calibration substrate in a second orientation corresponding to a second width different from the first width. One of the first or second orientations corresponds to a feature (e.g., a notch, recess) in the periphery of the calibration substrate.

[0116] At block 570, the plunger of the robotic arm is actuated to secure the calibration substrate in the second orientation. In some embodiments, block 570 is similar to block 564.

[0117] At block 572, it is determined whether a second error occurs when the calibration substrate is fixed in the second orientation. In some embodiments, block 572 is similar to block 566. In some embodiments, it is determined whether an error occurs for one of the first or second orientations (e.g., and whether the other of the first or second orientation does not have an error).

[0118] Figure 6 This is a block diagram showing a computer system 600 according to some embodiments. In some embodiments, the computer system 600 is a controller 109 (e.g., see...). Figure 1 The computer system 600 (e.g., processing unit 602) is used to enable the robotic arm to perform automated teaching operations, calibration operations, and / or diagnostic operations.

[0119] In some implementations, computer system 600 is connected (e.g., via a network such as a local area network (LAN), intranet, extranet, or internet) to other computer systems. Computer system 600 operates as a server or client computer in a client-server environment, or as a peer computer in a peer-to-peer or distributed network environment. Computer system 600 is provided by a personal computer (PC), tablet computer, set-top box (STB), personal digital assistant (PDA), cellular phone, web application, server, network router, switch, or bridge, or any means capable of executing a set of instructions (sequential or other instructions) specifying the operations to be performed by the means. Furthermore, the term "computer" should include any collection of computers that individually or collectively execute (one or more sets of) sets of instructions to perform any one or more of the methods described herein.

[0120] In a further aspect, the computer system 600 includes a processing device 602, volatile memory 604 (e.g., random access memory (RAM)), non-volatile memory 606 (e.g., read-only memory (ROM) or electrically erasable programmable ROM (EEPROM)) and data storage device 616, which communicate with each other via a bus 608.

[0121] The processing device 602 is provided by one or more processors such as a general-purpose processor (such as, for example, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a microprocessor that implements other types of instruction sets, or a processor that implements a combination of types of instruction sets) or a special-purpose processor (such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), or a network processor).

[0122] The computer system 600 further includes a network interface device 622 (e.g., communicating via a network 674). The computer system 600 also includes a video display unit 610 (e.g., an LCD), an alphanumeric input device 612 (e.g., a keyboard), a cursor control device 614 (e.g., a mouse), and a signal generation device 620.

[0123] In some implementations, the data storage device 616 includes a non-transitory computer-readable storage medium 624 storing instructions 626 that encode one or more of the methods or functions described herein, including instructions for implementing the methods described herein (e.g., causing the robotic arm to perform automated teaching operations, causing the robotic arm to perform calibration operations, causing the robotic arm to perform diagnostic operations, and / or performing...). Figure 4C Method 470).

[0124] While the computer system 600 executes the instruction 626, the instruction 626 also resides wholly or partially in the volatile memory 604 and / or the processing device 602. Therefore, in some embodiments, the volatile memory 604 and the processing device 602 also constitute a machine-readable storage medium.

[0125] Although computer-readable storage medium 624 is shown as a single medium in the explicit example, the term "non-transitory computer-readable storage medium" should include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) for storing one or more sets of executable instructions. The term "non-transitory computer-readable storage medium" should also include tangible media capable of storing or encoding sets of instructions for execution by a computer, which enable the computer to perform any or more of the methods described herein. The term "non-transitory computer-readable storage medium" should include (but is not limited to) solid-state memory, optical media, and magnetic media.

[0126] In some embodiments, the methods, components, and features described herein are implemented by discrete hardware components or integrated into the functionality of other hardware components such as ASICs, FPGAs, DSPs, or similar devices. In some embodiments, the methods, components, and features are implemented by firmware modules or functional circuitry within a hardware device. Furthermore, in some embodiments, the methods, components, and features are implemented in any combination of hardware devices and computer program components or in a computer program.

[0127] Unless otherwise expressly stated, terms such as “scan,” “move,” “cause,” “execute,” “remove,” “place,” “instruct,” “determine,” “set,” “actuate,” “locate,” or similar terms refer to operations and processes performed or implemented by a computer system that manipulates or converts data represented as physical (electronic) quantities in computer system registers or memory into other data similarly represented as physical quantities in computer system memory or registers or other such information storage, transmission, or display devices. Similarly, the terms “first,” “second,” “third,” “fourth,” etc., as used herein are labels used to distinguish different elements and may not have ordinal meaning as specified by their numbers.

[0128] The examples described herein also relate to apparatus for performing the methods described herein. In some embodiments, such apparatus is specifically configured to perform the methods described herein, or it comprises a general-purpose computer system selectively programmed by a computer program stored in a computer system. In some embodiments, such a computer program is stored in a computer-readable tangible storage medium.

[0129] The methods and illustrative examples described herein are not inherently associated with any particular computer or other device. Various general-purpose systems can be used in accordance with the teachings described herein, or more specialized devices can be constructed to perform each of the methods described herein and / or their respective functions, routines, subroutines, or operations. Examples of the structures of various such systems are illustrated in the description above.

[0130] The foregoing description sets forth numerous specific details, such as examples of particular systems, components, methods, etc., to provide a good understanding of several embodiments of this disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of this disclosure may be practiced without these specific details. In other instances, well-known components or methods have not been described in detail or presented in simple block diagram form to avoid unnecessarily obscuring this disclosure. Therefore, the specific details set forth are merely exemplary. Specific implementations may differ from these exemplary details and may still be contemplated within the scope of this disclosure.

[0131] Throughout this specification, references to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Additionally, the term "or" is intended to indicate an inclusive "or" rather than an exclusive "or." When the terms "about" or "approximately" are used herein, it is intended to indicate that the presented nominal values ​​are exactly within ±10%.

[0132] Although the operations of the methods described herein are shown and described in a specific order, the order of operations for each method may be changed so that certain operations are performed in reverse order, or that certain operations are performed at least partially concurrently with other operations. In another embodiment, instructions or sub-operations of different operations are performed intermittently and / or alternately.

[0133] It should be understood that the above description is intended to be illustrative and not restrictive. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the above description. Therefore, the scope of this disclosure should be determined by reference to the appended claims and the full scope of their equivalents.

Claims

1. An automated teaching enclosure system for a chip processing system, the automated teaching enclosure system comprising: An automatic teaching pin, wherein the automatic teaching pin is a scanable feature having a fixed position within the automatic teaching housing system, wherein the automatic teaching pin enables automatic teaching operations of the robotic arm of the wafer processing system, wherein the automatic teaching operation is the operation of automatically teaching the fixed position within the automatic teaching housing system to the robotic arm of the wafer processing system, wherein the automatic teaching pin comprises: A first portion, comprising cylindrical sidewalls, wherein the robotic arm will use the first portion to position the fixed location within the automated teaching housing system; and The second part includes a flat sidewall configured to calibrate robotic arm errors, wherein... The central axis of the first portion passes through the center of the circular periphery of the first portion, and the second portion has an asymmetrical periphery around the central axis of the first portion. The symmetry of the first part is compared with the asymmetry of the second part to perform the calibration of the robot arm error.

2. The automated teaching housing system according to claim 1, wherein the end effector of the robotic arm is used to scan the automated teaching pin to perform the automated teaching operation of the robotic arm.

3. The automatic teaching shell system according to claim 1, wherein the first part is disposed above the second part.

4. The automated teaching shell system according to claim 1, wherein the first portion has a circular perimeter, and wherein the second portion has a perimeter that is trapezoidal, elliptical, or polygonal.

5. The automated teaching shell system according to claim 1, wherein the first portion has a circular perimeter, and wherein the second portion has a perimeter of one or more of a square, a rectangle, or a triangle.

6. The automated teaching housing system of claim 1, wherein the robotic arm moves along the z-direction to scan the first portion and the second portion, and wherein the robotic arm rotates about a single joint to measure the second portion from multiple angles to perform calibration.

7. The automated teaching housing system of claim 1, wherein the top distal end of the first portion is configured as a support collar to support a calibration substrate, and wherein the calibration substrate is lifted by the robotic arm.

8. The automatic teaching housing system of claim 1, wherein the automatic teaching pin includes a base fixed to a protrusion of a base plate, and wherein one or more fasteners couple the base to the protrusion of the base plate.

9. The automated teaching housing system of claim 1, wherein the robotic arm scans the second portion from different angles to determine a plurality of measurements of the second portion, thereby performing the calibration of the robotic arm.

10. The automated teaching shell system according to claim 1, further comprising: A calibration substrate disposed above the automatic teaching pin, the calibration substrate being configured to be disposed on a plurality of support structures of the wafer processing system, the calibration substrate including calibration pins, wherein the calibration substrate enables the calibration operation of the robotic arm of the wafer processing system to automatically determine the robotic arm error.

11. The automated teaching housing system of claim 10, wherein the calibration substrate includes a basic horizontal structure configured to be disposed on a support structure, and wherein the calibration pin is attached to the upper surface of the basic horizontal structure.

12. The automated teaching enclosure system according to claim 10, wherein: The calibration pin will be scanned by the robotic arm; After the calibration pin is scanned, the calibration substrate will be lifted from the first position by the robotic arm; In response to the robotic arm raising the calibration substrate, the calibration substrate will be placed at a second position by the robotic arm; In response to the calibration substrate being placed on the support structure, the calibration pin will be rescanned by the robotic arm; and The robotic arm error will be determined based on the difference between the first position and the second position.

13. The automatic teaching housing system of claim 10, further comprising a collar disposed on the automatic teaching pin, wherein the calibration substrate is disposed on the collar.

14. The automated teaching housing system of claim 10, wherein the calibration substrate enables diagnostic operations of the robotic arm to determine whether a first error occurs when the calibration substrate is fixed.

15. The automated teaching housing system of claim 14, wherein the first error is based on whether the end effector of the robotic arm grasps the calibration substrate within a threshold amount of time.

16. The automated teaching housing system of claim 14, wherein the calibration substrate has a first width in a first orientation and a second width in a second orientation, wherein the first width is different from the second width, and wherein the first error is based on whether the end effector of the robotic arm grasps the calibration substrate in the first orientation and the second orientation within a time threshold amount.

17. The automated teaching housing system of claim 16, wherein the first width corresponds to a notch or recess formed by the calibration substrate.

18. An automatic teaching method for a chip processing system, the automatic teaching method comprising the following steps: The automatic teaching pin is scanned by a robotic arm of the wafer processing system. The automatic teaching pin is a scannable feature with a fixed position in the wafer processing system. The automatic teaching pin includes a first part and a second part. The first part includes a cylindrical sidewall, and the second part includes a flat sidewall. The robotic arm performs an automatic teaching operation based on the cylindrical sidewall of the first portion of the automatic teaching pin, wherein the automatic teaching operation is an operation that automatically teaches the robotic arm the fixed position within the wafer processing system; and The calibration operation is performed on the flat sidewall of the second part of the automatic teaching pin to automatically calibrate the robot arm error, wherein... The central axis of the first portion passes through the center of the circular periphery of the first portion, and the second portion has an asymmetrical periphery around the central axis of the first portion. The symmetry of the first part is compared with the asymmetry of the second part to perform the calibration of the robot arm error.

19. An automatic teaching method for a chip processing system, the automatic teaching method comprising the following steps: The automatic teaching pin, which is set within the internal volume of the automatic teaching housing system by a robotic arm, comprises a first part and a second part. The first part has a cylindrical sidewall, and the second part has a flat sidewall. The central axis of the first part passes through the center of the circular periphery of the first part, and the second part has an asymmetrical periphery around the central axis of the first part. The fixed position associated with the automated teaching shell system is determined based on the results of scanning the first part; The robot arm error is calibrated by comparing the symmetry of the first part with the asymmetry of the second part based on the results of scanning the first part and the second part. The robotic arm delivers the contents according to the fixed position.

20. The method of claim 19, further comprising the step of: engaging a front interface of the automated teaching housing system with a substantially vertical portion of the loading port of a factory interface of a wafer processing system to establish a sealed environment comprising the internal volume of the automated teaching housing system and the interior of the factory interface.

21. The method of claim 20, wherein the robotic arm is the robotic arm of the factory interface, and wherein the scanning is performed while maintaining the sealed environment.

22. The method of claim 19, further comprising the step of: while the automated teaching enclosure system is closed, purifying the automated teaching enclosure system via one or more purification adapters, the one or more purification adapters being coupled to at least one of a plurality of surfaces of the automated teaching enclosure system that at least partially surround the internal volume.

23. The method of claim 22 further comprises the step of: after the purification, opening the automated teaching shell system to establish a sealed environment.

24. The method of claim 19, further comprising the following steps: Scan the calibration pins on the calibration substrate to determine the first position of the calibration substrate; Remove the calibration substrate from the multiple support structures; The robotic arm is guided to place the calibration substrate in the first position; The calibration pins on the calibration substrate are scanned again to determine the second position of the calibration substrate; The robot arm error is determined based on the difference between the first position and the second position.

25. The method of claim 19, further comprising the following steps: The robotic arm is positioned below the calibration substrate with a first orientation, the first orientation corresponding to a first width of the calibration substrate; Actuate the plunger of the robotic arm to fix the calibration substrate in the first orientation; Determine whether a first error occurs when the calibration substrate is fixed in the first orientation.

26. The method of claim 24, further comprising the step of: prior to the scanning, placing the calibration substrate on the plurality of support structures located above the automatic teaching pins within the internal volume of the automatic teaching housing system.

27. The method of claim 24, wherein: The step of scanning the calibration pins of the calibration substrate to determine the first position of the calibration substrate is performed via the robotic arm; The removal is performed via the robotic arm; and The rescan is performed via the robotic arm.

28. The method of claim 24, further comprising the step of: determining a fixed position of the automated teaching housing system based on the robotic arm error, wherein the calibration substrate is disposed within the automated teaching housing system.

29. The method of claim 24, further comprising the step of: causing the robotic arm to transfer contents based on the robotic arm error.

30. The method of claim 25, further comprising the following steps: The robotic arm is positioned below the calibration substrate with a second orientation, the second orientation corresponding to the second width of the calibration substrate; Actuate the plunger of the robotic arm to fix the calibration substrate in the second orientation; Determine whether a second error occurs when the calibration substrate is fixed in the second orientation.

31. The method of claim 30, wherein the second width is different from the first width.

32. The method of claim 25, wherein the calibration substrate is disposed on a plurality of support structures within the internal volume of the automated teaching housing system.

33. A non-transitory computer-readable storage medium storing instructions that, when executed, cause a processing apparatus to perform the method according to any one of claims 18-32.

34. A chip processing system, comprising: Memory; and A processing device coupled to the memory, the processing device performing the method according to any one of claims 18-32.

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