A system and method for finely controlling the microstructure and composition of metal materials

Abstract

The embodiment of the present application discloses a system and method for finely controlling the microstructure and composition of a metal material, the system comprising: a molten pool for solidifying the metal material; a current input device for supplying current to the molten pool; a magnetic field input device for supplying a magnetic field to the molten pool; a material adding module for adding additive materials to the molten pool before or during solidification; an information acquisition module for collecting and monitoring the forming process and parameter information during the solidification process of the metal material; a host computer for receiving and displaying the information collected by the information acquisition module, and for processing and analyzing the displayed information and comparing it with preset parameters to obtain output parameters; the host computer is also used to control the change of the current and magnetic field supplied; and a wire for connecting the above modules and supplying current and magnetic field to the molten pool. The present application can more finely control the microstructure and composition of the material, and can be used to develop new material organizational properties and monitor the changes in microstructure morphology.

Description

Technical Field

[0001] The present application relates to the field of material design technology, and more specifically, to a system and method for finely regulating the microstructure and composition of metal materials. Background Art

[0002] As a global leader in "Industry 4.0," new materials have garnered significant attention in recent years, prompting numerous countries to vigorously develop their industries. As one of my country's seven strategic emerging industries and one of the ten key development areas under the "Made in China 2025" initiative, new materials are fundamental to the transformation and upgrading of the entire manufacturing industry, necessitating innovative research and development methods and manufacturing processes.

[0003] Numerous studies have shown that the properties of a material are closely related to its internal structure. Whether it is a single-phase material or a multiphase composite material, its matrix structure is generally a polycrystalline aggregate, and parameters such as the shape, size, and crystal orientation of the grains have a significant impact on its performance. During the material forming process, different external conditions will cause it to produce different microstructures, thereby affecting the material's ultimate performance. If the input external conditions can be controlled during this process, the material's properties can be changed and even new materials can be developed. Therefore, this application provides a system and method for finely controlling the microstructure and composition of metal materials. Summary of the Invention

[0004] The purpose of the present invention is to provide a system and method for finely controlling the microstructure and composition of metal materials, which can more finely control the microstructure and composition of materials, and then can formulate the required properties, and cooperate with corresponding new processes to manufacture and develop new materials with excellent performance; it can also be used to develop new material organizational properties; it can also monitor the changes in microstructural morphology, which is convenient for the research of metal materials.

[0005] In order to achieve at least one of the above objectives, the present application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a system for finely controlling the microstructure and composition of a metal material, comprising:

[0007] A molten pool for solidifying the metal material;

[0008] a current input device for supplying current to the molten pool;

[0009] A magnetic field input device, used for introducing a magnetic field into the molten pool;

[0010] A material adding module, used for adding additional material into the molten pool before or during solidification;

[0011] An information collection module, used to collect and monitor the forming process and parameter information during the solidification process of the metal material;

[0012] A host computer is used to receive and display the information collected by the information collection module, and is also used to process and analyze the displayed information and compare it with preset parameters to obtain output parameters;

[0013] The host computer is also used to control and change the current and magnetic field introduced;

[0014] Conductors are used to connect the modules and to pass current and magnetic field into the molten pool.

[0015] In a specific embodiment,

[0016] Conductors are laid in the molten pool, and the current input device and the magnetic field input device are connected to the molten pool via the conductors;

[0017] The information acquisition modules are distributed on the conductors laid in the molten pool;

[0018] The host computer is connected to the information acquisition module;

[0019] The host computer is also connected to the current input device and the magnetic field input device.

[0020] In a specific embodiment,

[0021] The wires are laid across or in parallel to each other, so as to divide the molten pool into grids;

[0022] Wherein, the wire is a semiconductor wire;

[0023] The thickness of the wire is selected based on feasibility, cost, laying density and the degree of impact on the metal material;

[0024] The material of the wire is selected according to the properties of the metal material to be solidified.

[0025] In a specific embodiment,

[0026] An information collection module is distributed on each of the grids;

[0027] The information acquisition module is a nanoelectronic material or sensor with monitoring function.

[0028] In a specific embodiment, the information acquisition module monitors the forming process during the metal solidification process, including monitoring the local temperature of the metal material, the particle and fluid movement direction and the formation of the organizational phase.

[0029] In a specific embodiment, the system further comprises:

[0030] The manual module is used to use the output parameters to manually and precisely adjust material properties and processing production.

[0031] In a specific embodiment,

[0032] The current input device passes a direct current or a pulse current into the molten pool;

[0033] The magnetic field input device introduces a pulsed magnetic field, an alternating magnetic field or a composite magnetic field into the molten pool.

[0034] In a specific embodiment, the host computer is used to control and change the magnitude, direction and type of the current and magnetic field introduced.

[0035] A second aspect of the present application further provides a method for finely controlling the microstructure and composition of a metal material, comprising:

[0036] S10, laying a conductor in the molten pool, passing an electric current and a magnetic field through the molten pool to solidify the metal material;

[0037] S30, adding additional material to the molten pool before or during solidification;

[0038] S50, collecting and monitoring the forming process and parameter information of the metal material during solidification, and displaying the information through a host computer;

[0039] S70: Process and analyze the information displayed by the host computer and compare it with the preset parameters.

[0040] If the requirements are met, the parameters are output;

[0041] If the requirements are not met, other additives are added to the molten pool, and the current and magnetic field are changed by the host computer control, and the above steps S50-S70 are performed in sequence until the information displayed by the host computer meets the requirements, and then the parameters are output.

[0042] In a specific embodiment, the method further comprises:

[0043] S90. Use the output parameters to manually and precisely adjust material properties and process production.

[0044] The beneficial effects of this application are as follows:

[0045] In response to the problems existing in the current existing technology, the present application provides a system and method for finely controlling the microstructure and composition of metal materials, which can finely control the microstructure and composition of materials, and then can formulate the required properties, and cooperate with the corresponding new process to manufacture and develop new materials with excellent performance; it can also be used to develop new material organizational properties, use electric and magnetic fields to control the material forming process, cooperate with information collection materials and computers and other advanced equipment to monitor and adjust, find the corresponding affinity substances for different materials, or the dispersed phase suitable for adding to the alloy, to form the system parameters of the synthetic material; it can also monitor the change process of the microstructure morphology, which is convenient for the research of metal materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0047] Figure 1 A system module diagram showing fine control of the microstructure and composition of a metal material in one embodiment of the present application is shown.

[0048] Figure 2 A schematic diagram of a molten pool conductor laying system for finely controlling the microstructure and composition of a metal material in one embodiment of the present application is shown.

[0049] Figure 3 A flow chart of a method for finely controlling the microstructure and composition of a metal material in one embodiment of the present application is shown. DETAILED DESCRIPTION

[0050] In the following description, for the purpose of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may be practiced without these specific details.

[0051] In the description of this application, it should be noted that the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0052] It should also be noted that, in the description of the present application, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0053] In order to solve the problems existing in the prior art, an embodiment of the present application provides a system for finely controlling the microstructure and composition of metal materials, such as Figure 1 Shown, including:

[0054] The molten pool 100 is used to solidify the metal material;

[0055] A current input device 200, used to supply current to the molten pool 100;

[0056] A magnetic field input device 300 is used to introduce a magnetic field into the molten pool 100;

[0057] The material adding module 400 is used to add the additional material 401 into the molten pool 100 before or during solidification;

[0058] An information collection module 500 is used to collect and monitor the forming process and parameter information during the solidification process of the metal material;

[0059] The host computer 600 is used to receive and display the information collected by the information collection module 500, and is also used to process and analyze the displayed information and compare it with preset parameters to obtain output parameters;

[0060] The host computer 600 is also used to control and change the current and magnetic field;

[0061] The wire 800 is used to connect the above modules and to pass current and magnetic field into the molten pool 100 .

[0062] In a specific embodiment, the system further comprises:

[0063] A manual module 700 is used to manually adjust material properties and process production using the output parameters;

[0064] In a specific embodiment,

[0065] A conductor 800 is laid in the molten pool 100, and the current input device 200 and the magnetic field input device 300 are connected to the molten pool 100 through the conductor 800 to pass current and magnetic field into the molten pool 100;

[0066] In a specific embodiment, the conductors are in the form of thin wires or thin ribbons, and the conductors 800 are laid in the molten pool 100 at a certain angle or in parallel. Figure 2 As shown, the molten pool 100 can be meshed;

[0067] In a specific embodiment, the wires can be connected or slightly staggered up and down and not connected, ensuring that the current on each wire can be independently controlled, the types of current and magnetic field can be adjusted, and the current and magnetic field can act independently or be coupled with each other;

[0068] In a specific embodiment,

[0069] The wire is a semiconductor wire;

[0070] The thickness of the wire is selected based on feasibility, cost, laying density and the degree of impact on the metal material;

[0071] The material of the wire is selected according to the properties of the metal material to be solidified;

[0072] In a specific embodiment, the laid conductors can be regarded as composite fibers in a metallic material.

[0073] In a specific embodiment,

[0074] The current input device passes a direct current or a pulse current into the molten pool;

[0075] In other specific embodiments, the current input device feeds other current into the molten pool;

[0076] The magnetic field input device introduces a pulsed magnetic field, an alternating magnetic field or a composite magnetic field into the molten pool;

[0077] In other specific embodiments, the magnetic field input device is used to introduce other magnetic fields into the molten pool;

[0078] In a specific embodiment,

[0079] The action form of the current and magnetic field passed into the molten pool 100 can be adjusted by the host computer 600. The host computer 600 is connected to the current input device 200 and the magnetic field input device 300, and can control the size, direction and type of the current and magnetic field passed into the molten pool 100.

[0080] In a specific embodiment, the material adding module adds the additional material to the molten pool at an appropriate time before solidification or during the metal solidification process;

[0081] In a specific embodiment, the added material is a hydrophilic substance of the metal material or a dispersed phase material of the metal material, a magnetic substance and metal particles;

[0082] Preferably, the added material is some substance that is sensitive to electric current and magnetic field;

[0083] In a specific embodiment, the adding parameters of the adding material module 400 can be repeatedly adjusted by the host computer 600 until the required adding parameters are found.

[0084] The present application regulates the metal material forming process through electric and magnetic fields. By controlling the size, direction and type of the current and adding a variable magnetic field to the molten pool, the metal particles in the free state can migrate under the action of the current and magnetic field, interfering with the formation of the organizational phase during the crystallization process to form the required organizational structure, and then regulating the organizational morphology and composition during the metal material forming process. Combined with the upper computer's adjustment of the addition parameters, different materials are added until the required additional materials are found, and the output parameters of the preset metal material are obtained, thereby achieving fine control of the material's microstructure and producing materials with excellent performance.

[0085] In a specific embodiment, an information collection module 500 is also distributed on the wire 800 laid in the molten pool 100;

[0086] In a specific embodiment, an information collection module is distributed on each grid divided by the wires;

[0087] In a specific embodiment, the information acquisition module is a nanoelectronic material or sensor with monitoring function;

[0088] In a specific embodiment, the information acquisition module monitors the forming process during the metal solidification process, including monitoring the local temperature of the metal material, the direction and form of particle and fluid movement, and the formation of organizational phases, etc. It can also monitor the concentration, movement and crystallization of particles in the molten pool, etc., which is equivalent to the effect of a microscope to some extent;

[0089] In a specific embodiment, the host computer 600 is connected to the information acquisition module 500. The host computer 600 receives data from the information acquisition module 500, processes, analyzes and displays the data, and compares the data with preset parameters, thereby outputting parameters or adjusting the current, magnetic field and added materials through the host computer.

[0090] This application receives data from the information acquisition module through the host computer to adjust the current, magnetic field and added materials and display the material forming process, finds suitable parameters to form the required metal material, and finally obtains the output parameters. The obtained output parameters are the input parameters required to form the target material. This application adopts a cyclical approach to explore and obtain the optimal output parameters, thereby realizing fine control of the microstructure and composition of the metal material.

[0091] Another embodiment of the present application also provides a method for finely controlling the microstructure and composition of a metal material, such as Figure 2 Shown, including:

[0092] S10, laying a conductor in the molten pool, passing an electric current and a magnetic field through the molten pool to solidify the metal material;

[0093] S30, adding additional material to the molten pool before or during solidification;

[0094] S50, collecting and monitoring the forming process and parameter information of the metal material during solidification, and displaying the information through a host computer;

[0095] S70: Process and analyze the information displayed by the host computer and compare it with the preset parameters.

[0096] If the requirements are met, the parameters are output;

[0097] If the requirements are not met, other additives are added to the molten pool, and the current and magnetic field are changed by the host computer, and the above steps S50-S70 are performed in sequence until the information displayed by the host computer meets the requirements, and then the parameters are output;

[0098] In a specific embodiment, the method further comprises:

[0099] S90. Use the output parameters to manually and precisely adjust material properties and process production.

[0100] Since electric current and magnetic field have a great influence on the metal crystallization process, they can cause free metal particles to migrate, thereby adjusting the crystal morphology, size and solute, etc. Therefore, the present application adds certain affinity substances of the material or other dispersed phase materials in the alloy (such as certain magnetic substances, or materials sensitive to electric current and magnetic field) in a timely manner while passing electric current and magnetic field through the molten pool, artificially intervenes in the formation of the material's microstructure and components, improves the material performance, and cooperates with the monitoring and precise adjustment of input conditions of equipment such as information acquisition modules and host computers to improve efficiency and repeatedly test to find a more optimized solution to achieve fine control of the material's organizational properties.

[0101] The present application provides a system and method for finely controlling the microstructure and composition of metal materials, which can more finely control the microstructure and composition of materials, and then can formulate the required properties, and cooperate with corresponding new processes to develop new materials with excellent performance; it can also be used to develop new material organizational properties, use electric and magnetic fields to control the material forming process, cooperate with information collection materials and computers and other advanced equipment for monitoring and adjustment, find the corresponding affinity substances for different materials, or the dispersed phase suitable for adding to the alloy, to form the system parameters of the synthetic material; it can also monitor the change process of the microstructure morphology, which is convenient for the research of metal materials.

[0102] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A system for finely controlling the microstructure and composition of metal materials, characterized in that: include: A molten pool for solidifying the metal material; a current input device for supplying current to the molten pool; A magnetic field input device, used for introducing a magnetic field into the molten pool; A material adding module, used for adding additional material into the molten pool before or during solidification; An information collection module, used to collect and monitor the forming process and parameter information during the solidification process of the metal material; A host computer is used to receive and display the information collected by the information collection module, and is also used to process and analyze the displayed information and compare it with preset parameters to obtain output parameters; The host computer is also used to control and change the current and magnetic field introduced; Conductors, used to connect the modules and introduce current and magnetic field into the molten pool; The wires are laid across or in parallel to each other, so as to divide the molten pool into grids; Wherein, the wire is a semiconductor wire; The thickness of the wire is selected based on feasibility, cost, laying density and the degree of impact on the metal material; The material of the wire is selected according to the properties of the metal material to be solidified; The conductor is in the form of a thin wire or a thin ribbon; the laid conductor is regarded as a composite fiber in the metal material; The information acquisition module monitors the forming process during the metal solidification process, including monitoring the local temperature of the metal material, the direction and form of particle and fluid movement, and the formation of the organizational phase; and also monitors the concentration, movement, and crystallization of particles in the molten pool; Conductors are laid in the molten pool, and the current input device and the magnetic field input device are connected to the molten pool via the conductors; The information acquisition modules are distributed on the conductive wires laid in the molten pool.

2. The system according to claim 1, wherein: The host computer is connected to the information acquisition module; The host computer is also connected to the current input device and the magnetic field input device.

3. The system according to claim 1, wherein: An information collection module is distributed on each of the grids; The information acquisition module is a nanoelectronic material or sensor with monitoring function.

4. The system according to claim 1, wherein: The system further comprises: The manual module is used to use the output parameters to manually and precisely adjust material properties and processing production.

5. The system according to claim 1, wherein: The current input device passes a direct current or a pulse current into the molten pool; The magnetic field input device introduces a pulsed magnetic field, an alternating magnetic field or a composite magnetic field into the molten pool.

6. The system according to claim 1, wherein: The host computer is used to control and change the size, direction and type of the current and magnetic field introduced.

7. A method for finely controlling the microstructure and composition of a metal material using the system according to any one of claims 1 to 6, characterized in that: include: S10, laying a conductor in the molten pool, passing an electric current and a magnetic field through the molten pool to solidify the metal material; S30, adding additional material to the molten pool before or during solidification; S50, collecting and monitoring the forming process and parameter information of the metal material during solidification, and displaying the information through a host computer; S70: Process and analyze the information displayed by the host computer and compare it with the preset parameters. If the requirements are met, the parameters are output; If the requirements are not met, other additives are added to the molten pool, and the current and magnetic field are changed by the host computer control, and the above steps S50-S70 are performed in sequence until the information displayed by the host computer meets the requirements, and then the parameters are output.

8. The method according to claim 7, characterized in that The method further comprises: S90. Use the output parameters to manually and precisely adjust material properties and process production.

Images