Circuit board, integrated circuit module, and electronic device

Abstract

This application provides a circuit board, an integrated circuit module, and an electronic device. A first sub-layer of the circuit board has a first through-hole, which has a first conductive structure. The outer edge of the axial projection of the first conductive structure defines a through-hole projection area on a second sub-layer stacked on the surface of the first sub-layer. A second through-hole is formed within the through-hole projection area, filled with a solid second conductive structure that is electrically in contact with the first conductive structure. The second sub-layer also has a first via and a second via. At least a portion of the first via is located within the through-hole projection area and is insulated from the first conductive structure. The second via is outside the through-hole projection area and is electrically connected to the corresponding first via through a line on the second sub-layer. The second via is also electrically in contact with a line on the surface of the first sub-layer. This reduces the impact on the high-density arrangement of the circuit board connection structure on the circuit board surface while meeting the requirements of high current flow.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a circuit board, an integrated circuit module, and an electronic device. Background Technology

[0002] Circuit boards are carriers for electrical connections of electronic components such as chips. In order to connect lines located on different layers of the circuit board that are in the same network, corresponding vias can be opened on the circuit board. Vias can include signal vias for transmitting signals, power vias for transmitting current, and grounding vias for grounding.

[0003] With technological advancements, the power demands of electronic components connected to circuit boards are constantly increasing. Correspondingly, the current-carrying capacity of power vias on circuit boards is also rising, and this capacity is related to the cross-sectional dimensions of the conductors within the via. In scenarios requiring high current carrying capacity on thicker circuit boards, through-hole vias can be created to increase the current-carrying capacity of the power vias. A power via consists of the via wall and a solid copper pillar embedded within it, through which current is transmitted. However, the smaller the diameter of the solid copper pillar, the more difficult it is to manufacture and embed it into the corresponding through-hole. This makes it difficult to produce power vias with smaller diameters, and the presence of large-diameter power vias on the circuit board surface is detrimental to the high-density arrangement of circuit board connection structures for connecting electronic components. Therefore, how to reduce the impact on the high-density arrangement of circuit board connection structures on the circuit board surface while meeting the requirements for high current carrying capacity has become a pressing problem in circuit board design. Summary of the Invention

[0004] This application provides a circuit board, an integrated circuit module, and an electronic device. By dividing the conductive structure for transmitting current within the circuit board into two segments of different sizes, the smaller segment is located on the surface layer of the circuit board where electronic components are mounted. Furthermore, by rearranging the arrangement of vias on the surface layer of the circuit board where electronic components are mounted through vias distributed in staggered layers, the larger segment of the conductive structure has less impact on the arrangement of surface layer vias. This reduces the impact on the high-density arrangement of the circuit board connection structure on the circuit board surface while meeting the requirements for high current carrying capacity.

[0005] This application provides a circuit board including a first sub-board layer, on the surface of which a second sub-board layer is stacked. The first sub-board layer has a first through-hole, which has a first conductive structure. The outer edge of the axial projection of the first conductive structure defines a through-hole projection area on the second sub-board layer. A second through-hole, which is a blind via, is formed within the through-hole projection area. The diameter of the second through-hole is smaller than the diameter of the first through-hole opposite its end face. The second through-hole is filled with a second conductive structure, which is a solid conductor, and is electrically contacted with the first conductive structure opposite its end face. The second sub-board layer also has a first via, which is a blind via. At least a portion of the first via is located within the through-hole projection area. The first via is spaced apart from the first conductive structure and insulated from it. The second sub-board layer also has a second via corresponding to the first via. The second via is outside the through-hole projection area and is electrically connected to the corresponding first via through a line on the inner layer of the second sub-board layer. The second via is also electrically contacted with a line on the surface of the first sub-board layer.

[0006] In this embodiment of the circuit board, a first through-hole with a large aperture is formed in the first sub-board layer, and a first conductive structure is formed in the first through-hole. A second sub-board layer is stacked on the surface of the first sub-board layer. A second through-hole with a smaller aperture is formed in the through-hole projection area defined by the axial projection of the first conductive structure on the second sub-board layer. A second conductive structure, which is set as a solid conductor, is formed in the second through-hole, so that the second conductive structure is in electrical contact with the first conductive structure. The current on the circuit board can be transmitted along the thickness direction of the circuit board through the first conductive structure and the second conductive structure. The aperture of the first through-hole is large, and it is easier to set the first conductive structure. The second sub-board layer is located on the surface of the circuit board, so the thickness of the second sub-board layer can be thinner, and it is also easier to set the second conductive structure as a solid conductor. In addition to the second through-hole, the current-transmitting projection area also has a first via that is spaced apart from and insulated from the first conductive structure. The first via is electrically connected to the second via on the second sub-board layer, located outside the current-transmitting projection area, through the lines in the second sub-board layer. The first via and the corresponding second via are staggered. The first via can be connected to the lines on the first sub-board layer located outside the first through-hole through the second via. The second conductive structure and the first via can connect to different networks on the first sub-board layer and can be used to connect to the component connection parts of different networks on electronic components. Through the staggered connection of the first and second vias, the positions of the vias on the second sub-board layer facing away from the first sub-board layer can be rearranged. The first through-hole and the first conductive structure in the first sub-board layer have little impact on the arrangement of vias on the surface of the second sub-board layer used to mount electronic components, and the diameter of the second through-hole is small, which is conducive to the high-density arrangement of circuit board connection structures on the surface of the second sub-board layer facing away from the first sub-board layer. In addition, since the first through hole and the first conductive structure therein have little impact on the arrangement of vias on the surface of the second sub-board layer used for mounting electronic components, a larger first through hole and a larger first conductive structure can be arranged in the first through hole. This is suitable for scenarios where the circuit board requires high current flow. In this way, the impact on the high-density arrangement of the circuit board connection structure on the surface of the circuit board can be reduced while meeting the requirement of high current flow.

[0007] In one possible implementation, the first conductive structure is electrically connected to the power lines of the inner layer of the first sub-board layer.

[0008] In one possible implementation, the first conductive structure is a solid structure that fills the cavity of the first flow passage.

[0009] In one possible implementation, the first conductive structure includes a first conductive wall formed on the wall of the first flow hole and a filler filling the first conductive wall.

[0010] In one possible implementation, the filler is a conductive filler that is in electrical contact with the first conductive wall.

[0011] In one possible implementation, the conductive filler is integrated with the first conductive wall as a single structure.

[0012] In one possible implementation, the filler is a pore-sealing adhesive.

[0013] In one possible implementation, the first conductive structure further includes a conductive connection portion disposed at the end of the first conductive wall facing the second sub-layer, the conductive connection portion covering the end face corresponding to the filler and electrically connected to the first conductive wall, and the second conductive structure being in electrical contact with the conductive connection portion.

[0014] In one possible implementation, the thickness of the first conductive wall is greater than or equal to 4 mil.

[0015] In one possible implementation, the first conductive structure includes a solid metal block disposed within a first flow hole and securely connected to the wall of the first flow hole.

[0016] In one possible implementation, the metal block is interference-fitted with the wall of the first flow hole.

[0017] In one possible implementation, the first conductive structure further includes a first conductive wall formed on the wall of the first flow hole, and the metal block is interference-fitted with the first conductive wall.

[0018] In one possible implementation, the metal block is bonded and fixed to the wall of the first flow hole.

[0019] In one possible implementation, a third via is provided at the connection between the metal block and the first flow hole, and the metal block is electrically connected to the power line of the inner layer of the first sub-board through the third via.

[0020] In one possible implementation, the second sub-board layer is a multi-level high-density interconnect board layer, the second through-hole and the second conductive structure therein form a multi-level stacked via structure, and the first via and the corresponding second via form a multi-level staggered via structure.

[0021] In one possible implementation, a second sub-layer is stacked on both sides of the first sub-layer.

[0022] In one possible implementation, at least two second flow holes are provided within the flow projection area.

[0023] In one possible implementation, the diameter of the second flow orifice is greater than or equal to 10 mil and less than or equal to 12 mil.

[0024] In one possible implementation, the diameter of the first flow orifice is greater than or equal to 20 mil.

[0025] In one possible implementation, the second via is a buried via.

[0026] A second aspect of this application provides an integrated circuit module, including electronic components and a circuit board as described in any of the above embodiments, wherein the electronic components are disposed on the circuit board.

[0027] A third aspect of this application provides an electronic device, including electronic components and a circuit board as described in any of the above embodiments, wherein the electronic components are disposed on the circuit board. Attached Figure Description

[0028] Figure 1 A schematic diagram of a circuit board with electronic components provided in an embodiment of this application;

[0029] Figure 2 A via distribution diagram of the second sub-layer surface of a circuit board provided in an embodiment of this application;

[0030] Figure 3 A schematic diagram of another circuit board with electronic components provided in an embodiment of this application;

[0031] Figure 4 A schematic diagram of another circuit board with electronic components provided in an embodiment of this application;

[0032] Figure 5 A schematic diagram of another circuit board with electronic components provided in an embodiment of this application;

[0033] Figure 6 A schematic diagram of another circuit board with electronic components provided in an embodiment of this application;

[0034] Figure 7 A schematic diagram of another circuit board with electronic components provided in an embodiment of this application;

[0035] Figure 8 A schematic diagram of another circuit board with electronic components provided in an embodiment of this application;

[0036] Figure 9 This is a schematic diagram showing the connection of a first conductive structure on the first sub-layer of a circuit board to a power line via a third via, as provided in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100, First sub-layer; 110, First through-hole; 120, First conductive structure; 121, First conductive wall; 122, Filler; 123, Conductive connection; 124, Metal block; 130, Third via; 140, Fourth via; 200, Second sub-layer; 210, Second through-hole; 220, Second conductive structure; 230, First via; 240, Second via; 250, Through-hole projection area; 300, Circuit; 310, Power line; 400, Electronic component; 410, Component connection structure. Detailed Implementation

[0039] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0040] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, touch-screen TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, smart door locks, servers, switches, speakers, desk lamps, robots, etc.

[0041] The electronic device provided in this application may include an integrated circuit module and a housing, with the integrated circuit module installed inside the housing. The integrated circuit module may include, but is not limited to, a baseboard module, a mid-board module, a backplane module, a switching network board module, a main control board module, and a service board module.

[0042] Figure 1 This is a schematic diagram of a circuit board with electronic components provided in an embodiment of this application.

[0043] like Figure 1 As shown, the integrated circuit module provided in this application may include a circuit board and electronic components 400 disposed on the circuit board. The electronic components 400 may be chips such as a central processing unit (CPU), a graphics processing unit (GPU), and memory, or they may be power modules, resistors, capacitors, inductors, etc. One or more electronic components 400 may be disposed on the circuit board, and various different types of electronic components 400 may be disposed on the circuit board.

[0044] In the embodiments of this application, the circuit board may include stacked multilayer sub-boards, each sub-board may include stacked multilayer core boards, adjacent core boards may be bonded together by prepreg, each core board may be provided with a line 300, the line 300 may include power lines 310, signal lines and ground lines, etc., each core board may be provided with one or more of power lines 310, signal lines and ground lines.

[0045] It is understandable that power lines 310 on the same core board can be in the same network, and multiple power lines 310 that are disconnected from each other and in multiple different networks can also be set on the same core board; signal lines on the same core board can be in the same network, and multiple signal lines that are disconnected from each other and in multiple different networks can also be set on the same core board; ground lines on the same core board can be in the same network, and multiple ground lines that are disconnected from each other and in multiple different networks can also be set on the same core board.

[0046] In the embodiments of this application, electronic components 400 can be disposed on the circuit board via circuit board connection structures on the surface of the circuit board and component connection structures 410 on the electronic components 400, and electrically connected to the circuit board. The arrangement of the circuit board connection structures on the circuit board corresponds to the arrangement of the component connection structures 410 on the electronic components disposed on the circuit board, and the component connection structures 410 on the electronic components 400 are connected to the corresponding circuit board connection structures on the circuit board.

[0047] It is understood that the circuit board connection structure can be a pad, solder ball, etc. set on the surface of the circuit board, and the component connection structure 410 can be a pin, pin, etc. set on the electronic component 400.

[0048] In embodiments of this application, the circuit board is further provided with vias, which may include power vias for connecting power lines 310 of different layers, signal vias for connecting signal lines of different layers, and grounding vias for connecting ground lines of different layers.

[0049] On some circuit boards, vias on the circuit board surface can be placed between two adjacent circuit board connection structures, or the circuit board connection structure can be placed on the end face of the via on the circuit board surface through plated over filled via (POFV) technology.

[0050] It should be noted that the dimensions of the circuit board connection structure and the center-to-center distance between two adjacent circuit board connection structures are related to the aperture of the vias on the circuit board surface. The smaller the aperture of the vias on the circuit board surface, the smaller the dimensions of the circuit board connection structure and the center-to-center distance between two adjacent circuit board connection structures can be, allowing for a higher density of circuit board connection structure arrangement. This ensures that the circuit board connection structure on the circuit board surface corresponds to the high-density component connection structure 410 on the electronic components 400 mounted on the circuit board. For example, in a circuit board used to mount a Ball Grid Array (BGA) chip, due to the high density of the solder balls of the BGA chip, a corresponding high-density circuit board connection structure is also required on the circuit board, which necessitates controlling the aperture of the vias on the circuit board surface.

[0051] With technological advancements, the power requirements of some electronic components 400 connected to circuit boards are constantly increasing. For example, for some high-computing-power chips, improving computing power requires increasing chip power. As the power of electronic components 400 increases, the current flowing through them also increases accordingly, necessitating a corresponding increase in the current-carrying capacity of the power vias on the circuit board connected to the power lines 310 of electronic components 400. The current-carrying capacity of a power via is related to the cross-sectional area of ​​its conductive structure; a larger cross-sectional area results in a stronger current-carrying capacity. To enhance the current-carrying capacity of power vias, the conductive structure can be a solid conductor within the via's current-carrying hole. This solid conductor can be formed by electroplating within the current-carrying hole, or it can be embedded into the via's current-carrying hole using a pre-formed solid conductor method.

[0052] However, a single electroplating process can only create solid conductors within the vias of thin circuit boards (e.g., less than 1 mm thick). For thicker circuit boards (e.g., greater than or equal to 1 mm but less than 4 mm thick), a multi-stage electroplating method can be used, involving multiple laminations, drilling, and electroplating processes to create multi-stage stacked via structures. However, this multi-stage electroplating method for creating solid conductor vias on a circuit board is lengthy, costly, and results in lower reliability after multiple laminations. Due to the limited number of laminations the circuit board can withstand, creating solid conductor vias through electroplating is difficult when the circuit board is thick (e.g., greater than or equal to 4 mm thick).

[0053] In the method of first forming a solid conductor and then embedding the solid conductor in the through hole of the power via, the smaller the diameter of the solid conductor, the more difficult it is to manufacture and embed it into the corresponding through hole. The method of embedding the pre-formed solid conductor in the through hole of the power via makes it difficult to make power vias with small apertures. This is not conducive to the high-density arrangement of the circuit board connection structure on the circuit board surface, and affects the setting and connection of the electronic components 400 with the high-density arrangement of the component connection structure 410 on the circuit board.

[0054] Figure 2 This is a via distribution diagram on the surface of the second sub-layer of a circuit board provided in an embodiment of this application.

[0055] like Figure 2 As shown, and see Figure 1 Based on this, this application provides a circuit board including a first sub-board layer 100, and a second sub-board layer 200 stacked on the surface of the first sub-board layer 100. The first sub-board layer 100 has a first through-hole 110, and the first through-hole 110 has a first conductive structure 120. The outer edge of the axial projection of the first conductive structure 120 defines a through-hole projection region 250 on the second sub-board layer 200. A second through-hole 210 is formed within the through-hole projection region 250. The second through-hole 210 is a blind via, and its diameter is smaller than that of the first through-hole 110 opposite to its end face. The second through-hole 210 is filled with a second conductive structure 220, which is a solid conductor, and the second conductive structure 220 is in electrical contact with the first conductive structure 120 opposite to its end face. The second sub-layer 200 also has a blind via 230. At least a portion of the first via 230 is located within the current projection area 250. The first via 230 is spaced apart from the first conductive structure 120 and is insulated from each other. The second sub-layer 200 also has a second via 240 corresponding to the first via 230. The second via 240 is outside the current projection area 250 and is electrically connected to the corresponding first via 230 through the line 300 of the inner layer of the second sub-layer 200. The second via 240 is also electrically in contact with the line 300 on the surface of the first sub-layer 100.

[0056] Thus, for thicker circuit boards, a second conductive structure 220 can be formed in the second through hole 210 of the second sub-board layer 200 on the surface by electroplating. The second conductive structure 220 is a solid conductor. The required aperture of the second through hole 210 is small and can meet the requirements of large current flow. A first through hole 110 with a larger aperture is opened on the first sub-board layer 100. It is relatively easy to set a first conductive structure 120 that can be used for large current flow in the first through hole 110. The current on the circuit board can be transmitted along the thickness direction of the circuit board through the electrically contacted first conductive structure 120 and second conductive structure 220. In addition to the second through-hole 210, the current-carrying projection area 250 also has a first via 230 that is spaced apart from and insulated from the first conductive structure 120. The first via 230 is electrically connected to a second via 240 on the second sub-board layer 200 and located outside the current-carrying projection area 250 through a line 300 in the second sub-board layer 200. The first via 230 and the corresponding second via 240 are staggered. The first via 230 can be connected to the line 300 on the first sub-board layer 100 located outside the first through-hole 110 through the second via 240. The second conductive structure 220 and the first via 230 can be connected to the first sub-board layer 100. Different networks can be used to connect to the component connection parts of different networks on the electronic component 400. Through the staggered connection of the first via 230 and the second via 240, the positions of the vias on the surface of the second sub-board layer 200 facing away from the first sub-board layer 100 can be rearranged. The first through hole 110 and the first conductive structure 120 inside the first sub-board layer 100 have little impact on the arrangement of the vias on the surface of the second sub-board layer 200 used to mount the electronic component 400. Moreover, the aperture of the second through hole 210 is small, which is conducive to the high-density arrangement of the circuit board connection structure on the surface of the second sub-board layer 200 facing away from the first sub-board layer 100. In addition, since the first through hole 110 and the first conductive structure 120 therein have little impact on the arrangement of vias on the surface of the second sub-board layer 200 used for mounting electronic components 400, a larger first through hole 110 and a larger first conductive structure 120 can be arranged in the first through hole 110. This is suitable for scenarios where the circuit board needs to carry a large current. In this way, the impact on the high-density arrangement of the circuit board connection structure on the surface of the circuit board can be reduced while meeting the requirements of carrying a large current.

[0057] The implementation method of the circuit board provided in the embodiments of this application will be described below.

[0058] like Figure 1As shown, the circuit board in this embodiment includes a first sub-board layer 100, and a second sub-board layer 200 is stacked on the surface of the first sub-board layer 100. It should be noted that the second sub-board layer 200 may be stacked on only one side of the first sub-board layer 100, or the second sub-board layer 200 may be stacked on both sides of the first sub-board layer 100.

[0059] It is understood that the first sub-layer 100 and the second sub-layer 200 can be bonded and fixed together using a prepreg. Both the first sub-layer 100 and the second sub-layer 200 can be formed by laminating multiple layers of core boards and prepregs located between adjacent core boards. The second sub-layer 200 can be manufactured on the surface of the first sub-layer 100 after the first sub-layer 100 has been formed. Alternatively, the first sub-layer 100 and the second sub-layer 200 can be formed separately and then laminated together.

[0060] like Figure 1 , Figure 2 As shown in the embodiment of this application, the first sub-plate layer 100 is provided with a first flow passage 110, the first flow passage 110 is provided with a first conductive structure 120, and the outer edge of the axial projection of the first conductive structure 120 defines a flow projection area 250 on the second sub-plate layer 200.

[0061] It should be noted that when the second sub-board layer 200 is stacked on only one side of the first sub-board layer 100 and the other side is the surface of the circuit board, the first through-hole 110 is a blind via; when the second sub-board layer 200 is stacked on both sides of the first sub-board layer 100, or when the second sub-board layer 200 is stacked on one side of the first sub-board layer 100 and other sub-board layers are stacked on the other side, the first through-hole 110 is a buried via, and the first sub-board layer 100 is an inner layer structure of the circuit board.

[0062] The first conductive structure 120 may include a first conductive wall 121 formed on the wall of the first flow hole 110. The inner cavity of the first conductive wall 121 may be a hollow structure or filled with a filler 122. The first conductive structure 120 may also include a conductive body embedded in the first flow hole 110. The conductive body may be a solid structure or a hollow structure.

[0063] The first conductive structure 120 can be insulated from the circuit 300 of the inner layer of the first sub-board layer 100, and can also be electrically connected to the power line 310 of the inner layer of the first sub-board layer 100.

[0064] It is understood that the first sub-board layer 100 may have one or more first through holes 110 as needed, and the first conductive structures 120 in different first through holes 110 may be connected to different power networks.

[0065] In the embodiments of this application, a second flow through hole 210 is provided in the flow projection area 250 of the second sub-plate layer 200. The second flow through hole 210 is a blind hole. The diameter of the second flow through hole 210 is smaller than the diameter of the first flow through hole 110 opposite to its end face. The second flow through hole 210 is filled with a second conductive structure 220. The second conductive structure 220 is a solid conductor. The second conductive structure 220 is in electrical contact with the first conductive structure 120 opposite to its end face.

[0066] It is understood that the second conductive structure 220 can be formed by electroplating the second sub-board layer 200 before the first sub-board layer 100 and the second sub-board layer 200 are laminated to form a circuit board. The second conductive structure 220 can also be formed during the process of manufacturing the second sub-board layer 200 on the surface of the first sub-board layer 100.

[0067] The second conductive structure 220 can be a copper pillar, a silver pillar, etc.

[0068] A circuit board connection structure for connecting to the component connection structure 410 of the electronic component 400 can be provided on the end face of the second conductive structure 220 facing away from the first conductive structure 120. The second conductive structure 220 can be electrically connected to the power line 310 of the electronic component 400 through the circuit board connection structure and the corresponding component connection structure 410 on its end face.

[0069] In embodiments of this application, the second sub-board layer 200 further includes a blind via 230. At least a portion of the first via 230 is located within the current projection region 250. The first via 230 is spaced apart from and insulated from the first conductive structure 120. The second sub-board layer 200 also includes a second via 240 corresponding to the first via 230. The second via 240 is located outside the current projection region 250 and is electrically connected to the corresponding first via 230 via a line 300 on the inner layer of the second sub-board layer 200. The second via 240 is also electrically in contact with the line 300 on the surface of the first sub-board layer 100.

[0070] It should be noted that the first via 230 and the second via 240 are connected to the line 300 of the same network. The first via 230 and the second via 240 can be signal vias, power vias or ground vias, and can be connected to signal networks, power networks or ground networks.

[0071] A circuit board connection structure for connecting to the component connection structure 410 of the electronic component 400 can be provided on the end face of the first via 230 facing away from the first conductive structure 120. The first via 230 can be electrically connected to the signal line, power line 310 or ground line of the electronic component 400 through the circuit board connection structure and the corresponding component connection structure 410 on its end face.

[0072] Understandably, the second via 240 can be a blind via or a buried via.

[0073] The conductive structure of the first via 230 can be a second conductive wall or a solid conductor formed within the hole wall of the first via 230, and the conductive structure of the second via 240 can be a third conductive wall or a solid conductor formed within the hole wall of the second via 240.

[0074] In the above embodiments, for thicker circuit boards, a second conductive structure 220 can be formed in the second through hole 210 of the second sub-board layer 200 on the surface by electroplating. The second conductive structure 220 is a solid conductor. The required aperture of the second through hole 210 is small and can meet the requirements of large current flow. A first through hole 110 with a larger aperture is opened on the first sub-board layer 100. A first conductive structure 120 that can be used for large current flow can be easily set in the first through hole 110. The current on the circuit board can be transmitted along the thickness direction of the circuit board through the electrically contacted first conductive structure 120 and second conductive structure 220. In addition to the second through-hole 210, the current-carrying projection area 250 also has a first via 230 that is spaced apart from and insulated from the first conductive structure 120. The first via 230 is electrically connected to a second via 240 on the second sub-board layer 200 and located outside the current-carrying projection area 250 through a line 300 in the second sub-board layer 200. The first via 230 and the corresponding second via 240 are staggered. The first via 230 can be connected to the line 300 on the first sub-board layer 100 located outside the first through-hole 110 through the second via 240. The second conductive structure 220 and the first via 230 can be connected to the first sub-board layer 100. Different networks can be used to connect to the component connection parts of different networks on the electronic component 400. Through the staggered connection of the first via 230 and the second via 240, the positions of the vias on the surface of the second sub-board layer 200 facing away from the first sub-board layer 100 can be rearranged. The first through hole 110 and the first conductive structure 120 inside the first sub-board layer 100 have little impact on the arrangement of the vias on the surface of the second sub-board layer 200 used to mount the electronic component 400. Moreover, the aperture of the second through hole 210 is small, which is conducive to the high-density arrangement of the circuit board connection structure on the surface of the second sub-board layer 200 facing away from the first sub-board layer 100. In addition, since the first through hole 110 and the first conductive structure 120 therein have little impact on the arrangement of vias on the surface of the second sub-board layer 200 used for mounting electronic components 400, a larger first through hole 110 and a larger first conductive structure 120 can be arranged in the first through hole 110. This is suitable for scenarios where the circuit board needs to carry a large current. In this way, the impact on the high-density arrangement of the circuit board connection structure on the surface of the circuit board can be reduced while meeting the requirements of carrying a large current.

[0075] In some examples, a fourth via 140 is also provided within the first sub-board layer 100. The fourth via 140 is electrically connected to the second via 240 via the wiring 300 on the surface of the first sub-board layer 100. Thus, the fourth via 140 can connect the corresponding second via 240 on the second sub-board layer 200 to the wiring 300 on the inner layer of the first sub-board layer 100, and it can also connect the corresponding second via 240 on both sides of the first sub-board layer 100. It should be noted that the fourth via 140 can be a buried via.

[0076] It is understandable that when the first via 230 and the second via 240 are power vias, the fourth via 140, which is electrically connected to the first via 230, is also a power via; when the first via 230 and the second via 240 are signal vias, the fourth via 140, which is electrically connected to the second via 240, is also a signal via; when the first via 230 and the second via 240 are ground vias, the fourth via 140, which is electrically connected to the second via 240, is also a ground via.

[0077] In the embodiments of this application, the diameter of the first via 230 is less than or equal to 6 mil. This facilitates a high-density arrangement of the circuit board connection structure on the surface of the second sub-layer 200 where electronic components 400 are disposed.

[0078] In the embodiments of this application, the diameter of the second via 240 is less than or equal to 6 mil. This reduces the impact of the second via 240 on the traces 300 on the surface of the first sub-layer 100.

[0079] In the embodiments of this application, the first conductive structure 120 is electrically connected to the power line 310 of the inner layer of the first sub-board layer 100. In this way, the current in the first conductive structure 120 can flow to the power line 310 of the inner layer of the first sub-board layer 100, and the current can flow in the direction perpendicular to the thickness of the circuit board through the first conductive structure 120.

[0080] In the embodiments of this application, the second via 240 is a buried via. This reduces the impact of the second via 240 on the arrangement of the circuit board connection structure on the circuit board surface, allowing for the arrangement of more circuit board connection structures connecting different networks on the surface of the second sub-board layer 200 facing away from the first sub-board layer 100.

[0081] In the embodiments of this application, at least two second flow-through holes 210 are provided within the current-through projection area 250. Thus, the second conductive structures 220 within the multiple second flow-through holes 210 can be connected to the same power network through the first conductive structure 120 within a first flow-through hole 110. This reduces the number of first flow-through holes 110 and first conductive structures 120 provided in the first sub-board layer 100, facilitates increasing the size of the first flow-through holes 110 and first conductive structures 120, improves the current-through capacity of the first conductive structure 120, and increases the manufacturing efficiency and reduces the manufacturing cost of the first sub-board layer 100.

[0082] It is understandable that within the same flow projection area 250, two, three, four or more second flow holes 210 can be opened, and the first conductive structure 120 and the second conductive structure 220 opposite to its end face are in electrical contact.

[0083] Multiple component connection structures 410 on the same electronic component 400 that need to be connected to the same power network can be electrically connected to multiple different second conductive structures 220 that are in electrical contact with the same first conductive structure 120. Multiple component connection structures 410 on different electronic components 400 that need to be connected to the same power network can be electrically connected to multiple different second conductive structures 220 that are in electrical contact with the same first conductive structure 120.

[0084] In the embodiments of this application, a second sub-board layer 200 is stacked on both sides of the first sub-board layer 100. In this way, while meeting the requirements of high current carrying capacity, the circuit board connection structures on both sides of the circuit board can be arranged in a high-density manner, and electronic components 400 arranged in a high-density manner can be provided on both sides of the circuit board via component connection structures 410.

[0085] Figure 3 This is a schematic diagram of another circuit board with electronic components provided in an embodiment of this application.

[0086] like Figure 3 As shown, and see Figure 1 In the embodiments of this application, the second sub-board layer 200 is a multi-level high-density interconnect (HDI) layer, the second through-hole 210 and the second conductive structure 220 therein form a multi-level stacked hole structure, and the first via 230 and the corresponding second via 240 form a multi-level staggered hole structure.

[0087] This facilitates the formation of staggered first vias 230 and second vias 240 on the second sub-layer 200, and also facilitates the formation of a second conductive structure 220 on the slightly thicker second sub-layer 200.

[0088] like Figure 1As shown, in some examples, the second sub-board layer 200 can be a second-order high-density interconnect board layer, and the second through-hole 210 and the second conductive structure 220 therein form a second-order stacked via structure.

[0089] like Figure 3 As shown, in some examples, the second sub-board layer 200 can also be a third-order high-density interconnect board layer, the second through-hole 210 and the second conductive structure 220 therein form a third-order stacked via structure, and one of the first via 230 and the second via 240 is a second-order stacked via structure.

[0090] Of course, the second sub-layer 200 can also be a high-density interconnect layer structure of fourth order or more.

[0091] like Figure 1 As shown, taking the second sub-board layer 200 as an example of a second-order high-density interconnect board layer, the method of forming the first via 230, the second via 240, the second through-hole 210, and the second conductive structure 220 on the second sub-board layer 200 is described. The second sub-board layer 200 includes a first core board and a second core board. First, the first core board is pressed onto the surface of the first sub-board layer 100. After the first core board is pressed onto the surface of the first sub-board layer 100, the hole wall of the second via 240 and the first section of the second through-hole 210 are formed on the first core board by laser engraving or deep drilling. Then, the first core board is electroplated, forming a conductive structure of the second via 240 that is electrically in contact with the line 300 on the surface of the first sub-board layer 100 within the hole wall of the second via 240, and the second through-hole 210... A first segment of a second conductive structure 220 is formed within a section, which is in electrical contact with the first conductive structure 120. Then, a second core board is pressed and bonded to the surface of the first core board using a prepreg. A second segment of a first through hole 230 and a second flow hole 210 are formed on the second core board by laser drilling. The second segment of the second flow hole 210 and the first segment of the second flow hole 210 are aligned. Then, the second core board is electroplated to form a conductive structure of the first through hole 230 within the hole wall of the first through hole 230, and a second segment of a second conductive structure 220 that is in electrical contact with the first segment of the second conductive structure 220 is formed within the second segment of the second flow hole 210. The first segment of the second conductive structure 220 and the second segment of the second conductive structure 220 together form the second conductive structure 220.

[0092] like Figures 1-3 As shown in the embodiments of this application, the diameter of the second flow-through orifice 210 is greater than or equal to 10 mil and less than or equal to 12 mil. It can be understood that the diameter of the second conductive structure 220 within the second flow-through orifice 210 is also greater than or equal to 10 mil and less than or equal to 12 mil.

[0093] In this way, the second conductive structure 220 within the second through-hole 210 has a large current-carrying capacity, and the aperture of the second through-hole 210 is small, which has little impact on the high-density arrangement of the circuit board connection structure on the surface of the second sub-board layer 200 used to house the electronic components 400. For example, when the second conductive structure 220 is a solid copper pillar filled within the second through-hole 210, the current-carrying capacity of the second conductive structure 220 can reach 7~8A.

[0094] In the embodiments of this application, the diameter of the first flow hole 110 is greater than or equal to 20 mil.

[0095] This facilitates the formation of a larger first conductive structure 120 within the first flow passage 110, thereby meeting the requirements for the flow capacity of the first conductive structure 120.

[0096] In the embodiments of this application, the first conductive structure 120 is a solid structure that fills the cavity of the first flow hole 110.

[0097] In this way, the first conductive structure 120 can support the second sub-plate layer 200, which is beneficial for the second sub-plate layer 200 and the first sub-plate layer 100 to be pressed together and reduces the risk of the second sub-plate layer 200 being dented at the first flow hole 110.

[0098] Figure 4 This is a schematic diagram of another circuit board with electronic components provided in an embodiment of this application.

[0099] like Figure 4 As shown, in an embodiment of this application, the first conductive structure 120 includes a first conductive wall 121 formed on the wall of the first flow hole 110.

[0100] In this way, the first conductive structure 120 is easier to form and facilitates the connection between the first conductive structure 120 and the power line 310 of the inner layer of the first sub-board layer 100.

[0101] It is understood that the first conductive wall 121 can be formed by opening a first flow hole 110 in the first sub-plate layer 100 and electroplating the first sub-plate layer 100 before the first sub-plate layer 100 and the second sub-plate layer 200 are pressed together.

[0102] In the embodiments of this application, the thickness of the first conductive wall 121 is greater than or equal to 4 mil.

[0103] In this way, the first conductive wall 121 has a large current-carrying capacity, which is beneficial to meeting the current-carrying requirements of the electronic components 400 connected to the first conductive wall 121. For example, when the first conductive wall 121 is a copper wall, the current-carrying capacity of the first conductive wall 121 can reach 7~8A.

[0104] In embodiments of this application, the first conductive structure 120 includes a filler 122 further filled within the first conductive wall 121.

[0105] In this way, the filler 122 can support the second sub-layer 200, which facilitates the compression molding of the second sub-layer 200 and the first sub-layer 100, reduces the risk of the second sub-layer 200 denting at the first flow hole 110, and makes the installation of the filler 122 easier. In addition, the filler 122 also helps to ensure that the first conductive wall 121 fits tightly with the first flow hole 110, reducing the risk of the first conductive wall 121 detaching or disconnecting from the power line 310 in the first sub-layer 100.

[0106] It is understandable that the filler 122 can be either a conductor or an insulator.

[0107] In the embodiments of this application, the filler 122 is a conductive filler, and the conductive filler is in electrical contact with the first conductive wall 121.

[0108] This helps to increase the conductivity of the first conductive structure 120 and improve its current-carrying capacity.

[0109] It is understandable that conductive fillers can be structures formed from conductive pastes such as conductive copper paste and conductive silver paste; conductive fillers can also be structures formed from colloids such as conductive resin and conductive rubber.

[0110] In the embodiments of this application, the conductive filler and the first conductive wall 121 are integrated into a single structure. This ensures the conductive filler is firmly fixed, preventing movement and deformation, maintaining stable electrical contact with the second conductive structure 220, and achieving high efficiency and stable current transfer between the conductive filler and the first conductive wall 121.

[0111] For example, the conductive filler is a structure formed by conductive pastes such as conductive copper paste and conductive silver paste, which can be integrated with the first conductive wall 121 into a single structure when the conductive paste solidifies.

[0112] In the embodiments of this application, the filler 122 is a plugging adhesive. Thus, after the first conductive wall 121 is formed, the plugging adhesive can be inserted into the hollow part of the first conductive wall 121 to complete the filling, and it is more convenient to fill the filler 122 into the first conductive wall 121.

[0113] It is understandable that the through-hole sealant can be a conductive adhesive, such as conductive rubber or conductive resin; it can also be an insulating adhesive, such as insulating resin or insulating rubber.

[0114] Figure 5 This is a schematic diagram of another circuit board with electronic components provided in an embodiment of this application.

[0115] like Figure 5 As shown in the embodiments of this application, the first conductive structure 120 further includes a conductive connection portion 123 disposed at the end of the first conductive wall 121 facing the second sub-layer 200. The conductive connection portion 123 covers the corresponding end face of the filler 122 and is electrically connected to the first conductive wall 121. The second conductive structure 220 is in electrical contact with the conductive connection portion 123. This facilitates the electrical connection between the second conductive structure 220 and the first conductive wall 121.

[0116] It is understood that the conductive connection portion 123 can be a pad covering the end face of the filler 122 or other conductive plates, conductive sheets, or other structures. The conductive connection portion 123 can be formed by electroplating the first sub-board layer 100 after the filler 122 is filled, and the conductive connection portion 123 can be formed at the same time as the circuit 300 on the surface of the first sub-board layer 100.

[0117] It should be noted that when the filler 122 is a conductor or an insulator, a conductive connection portion 123 can be provided at the end of the first conductive wall 121 facing the second sub-plate layer 200.

[0118] Figure 6 This is a schematic diagram of another circuit board with electronic components provided in an embodiment of this application.

[0119] like Figure 6 As shown in the embodiments of this application, the first conductive structure 120 includes a solid metal block 124, which is disposed within the first flow passage 110 and is securely connected to the wall of the first flow passage 110. Thus, the first conductive structure 120 has strong current-carrying capacity, the metal block 124 has a stable structure and is not easily deformed, providing good support for the second sub-plate layer 200.

[0120] For example, the metal block 124 can be a copper block, a silver block, etc.

[0121] In the embodiments of this application, the metal block 124 is interference-fitted with the wall of the first flow passage 110. This ensures that the metal block 124 is firmly fixed to the wall of the first flow passage 110, preventing movement and ensuring stable electrical contact with the second conductive structure 220. It also facilitates electrical connection between the metal block 124 and the power line 310 extending from the inner layer of the first sub-plate layer 100 to the wall of the first flow passage 110. Alternatively, the first flow passage 110 can be formed after the first sub-plate layer 100 is formed, and the pre-formed metal block 124 can be embedded into the first flow passage 110 after its formation, resulting in an interference fit between the metal block 124 and the wall of the first flow passage 110.

[0122] Figure 7 This is a schematic diagram of another circuit board with electronic components provided in an embodiment of this application.

[0123] like Figure 7 As shown in the embodiment of this application, the first conductive structure 120 further includes a first conductive wall 121 formed on the wall of the first flow hole 110, and the metal block 124 is interference-fitted with the first conductive wall 121. Thus, the metal block 124 is electrically connected to the power line 310 extending from the inner layer of the first sub-plate layer 100 to the wall of the first flow hole 110 through the first conductive wall 121, resulting in good stability of the electrical connection between the metal block 124 and the power line 310 of the inner layer of the first sub-plate layer 100. In this case, the first flow hole 110 can be formed after the first sub-plate layer 100 is formed, and then the first conductive wall 121 can be formed within the first flow hole 110. After the first conductive wall 121 is formed on the wall of the first flow hole 110, the pre-formed metal block 124 is then embedded into the first conductive wall 121, so that the metal block 124 and the first conductive wall 121 are interference-fitted.

[0124] In the embodiments of this application, the metal block 124 is bonded and fixed to the wall of the first flow hole 110. In this way, it is relatively easy to fix the metal block 124 to the first flow hole 110.

[0125] In some examples, the metal block 124 can be bonded and fixed using a prepreg within the first sub-layer 100. This eliminates the need for additional adhesive, improving manufacturing efficiency. It should be noted that the metal block 124 can be placed into the first flow hole 110 before the first sub-layer 100 is pressed into shape. During the pressing process of the first sub-layer 100, the prepreg within the first sub-layer 100 is compressed into the first flow hole 110, thus bonding and fixing the metal block 124 within the first flow hole 110.

[0126] Of course, after the first sub-plate layer 100 is pressed, a metal block 124 with adhesive coating on its sidewall can be placed into the first flow hole 110 so that the metal block 124 is bonded and fixed to the hole wall of the first flow hole 110.

[0127] Figure 8 This is a schematic diagram of another circuit board with electronic components provided in an embodiment of this application. Figure 9 This is a schematic diagram showing the connection of a first conductive structure on the first sub-layer of a circuit board to a power line via a third via, as provided in an embodiment of this application.

[0128] like Figure 8 , Figure 9As shown in the embodiment of this application, a third via 130 is also provided at the connection between the metal block 124 and the first through hole 110. The metal block 124 is electrically connected to the power line 310 of the inner layer of the first sub-board layer 100 through the third via 130. In this way, the metal block 124 can be connected to the power line 310 of the inner layer of the first sub-board layer 100, and the current can flow in the direction perpendicular to the thickness of the circuit board through the metal block 124 and the third via 130.

[0129] It should be noted that after the metal block 124 is fixed in the first through hole 110, a third via 130 can be opened on the edge of the end face of the metal block 124 along the thickness direction of the circuit board. The via is partially on the power line 310 of the first sub-board layer 100 and partially on the metal block 124. The conductive structure of the third via 130 allows the metal block 124 to be connected to the power line 310 on the first sub-board layer 100.

[0130] It is understandable that the conductive structure of the third via 130 can be a fourth conductive wall formed within the hole wall of the third via 130, and the fourth conductive wall is filled with a solid structure for supporting the second sub-layer 200.

[0131] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0132] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0133] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A circuit board, characterized in that, It includes a first sub-layer, and a second sub-layer is stacked on the surface of the first sub-layer; The first sub-plate layer is provided with a first flow passage hole, and the first flow passage hole is provided with a first conductive structure. The outer edge of the axial projection of the first conductive structure defines a flow projection area on the second sub-plate layer. A second flow passage is provided in the flow projection area. The second flow passage is a blind hole. The diameter of the second flow passage is smaller than the diameter of the first flow passage opposite its end face. The second flow passage is filled with a second conductive structure. The second conductive structure is a solid conductor. The second conductive structure is in electrical contact with the first conductive structure opposite its end face. The second sub-board layer also has a blind via, at least a portion of which is located within the current-carrying projection area. The first via is spaced apart from the first conductive structure and is insulated from it. The second sub-board layer also has a second via corresponding to the first via. The second via is outside the current-carrying projection area and is electrically connected to the corresponding first via through the wiring of the inner layer of the second sub-board layer. The second via is also electrically in contact with the wiring on the surface of the first sub-board layer.

2. The circuit board according to claim 1, characterized in that, The first conductive structure is electrically connected to the power line of the inner layer of the first sub-board layer.

3. The circuit board according to claim 1, characterized in that, The first conductive structure is a solid structure that fills the cavity of the first flow hole.

4. The circuit board according to claim 3, characterized in that, The first conductive structure includes a first conductive wall formed on the wall of the first flow hole and a filler filling the first conductive wall.

5. The circuit board according to claim 4, characterized in that, The filler is a conductive filler, and the conductive filler is in electrical contact with the first conductive wall.

6. The circuit board according to claim 5, characterized in that, The conductive filler is integrated with the first conductive wall to form a single structure.

7. The circuit board according to claim 4, characterized in that, The filler is a pore-sealing adhesive.

8. The circuit board according to claim 4, characterized in that, The first conductive structure further includes a conductive connection portion disposed at the end of the first conductive wall facing the second sub-plate layer. The conductive connection portion covers the end face corresponding to the filler and is electrically connected to the first conductive wall. The second conductive structure is in electrical contact with the conductive connection portion.

9. The circuit board according to claim 4, characterized in that, The thickness of the first conductive wall is greater than or equal to 4 mil.

10. The circuit board according to claim 3, characterized in that, The first conductive structure includes a solid metal block disposed inside the first flow hole and fastened to the hole wall of the first flow hole.

11. The circuit board according to claim 10, characterized in that, The metal block is interference-fitted with the wall of the first flow hole; Alternatively, the first conductive structure may further include a first conductive wall formed on the wall of the first flow hole, wherein the metal block is interference-fitted with the first conductive wall.

12. The circuit board according to claim 10, characterized in that, The metal block is bonded and fixed to the wall of the first flow hole.

13. The circuit board according to claim 12, characterized in that, A third through hole is also provided at the connection between the metal block and the first flow hole, and the metal block is electrically connected to the power line of the inner layer of the first sub-board layer through the third through hole.

14. The circuit board according to any one of claims 1-13, characterized in that, The second sub-board layer is a multi-level high-density interconnect board layer. The second through-hole and the second conductive structure therein form a multi-level stacked via structure. The first via and the corresponding second via form a multi-level staggered via structure.

15. The circuit board according to any one of claims 1-13, characterized in that, The second sub-layer is stacked on both sides of the first sub-layer.

16. The circuit board according to any one of claims 1-13, characterized in that, At least two second flow holes are provided within the flow projection area.

17. The circuit board according to any one of claims 1-13, characterized in that, The diameter of the second flow orifice is greater than or equal to 10 mil and less than or equal to 12 mil.

18. The circuit board according to any one of claims 1-13, characterized in that, The diameter of the first flow orifice is greater than or equal to 20 mil.

19. The circuit board according to any one of claims 1-13, characterized in that, The second via is a buried via.

20. An integrated circuit module, characterized in that, It includes electronic components and a circuit board as described in any one of claims 1-19, wherein the electronic components are disposed on the circuit board.

21. An electronic device, characterized in that, It includes electronic components and a circuit board as described in any one of claims 1-19, wherein the electronic components are disposed on the circuit board.

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