A semiconductor production machine monitoring management system
By configuring a semiconductor production machine monitoring and management system with monitoring and control rules, the problem of machine malfunctions caused by human monitoring errors has been solved, achieving standardized management and quality assurance of machines and reducing factory cost losses.
Patent Information
- Application Number
- CN202310311384.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-28
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2043-03-28
AI Technical Summary
The monitoring of existing semiconductor manufacturing equipment mainly relies on manual operation, which is prone to errors and causes equipment malfunctions to go undetected in time, resulting in cost losses for the factory.
Design a semiconductor manufacturing equipment monitoring and management system. By configuring monitoring and control rules, the system can automatically identify and execute monitoring tasks, including modules for monitoring rule configuration, trigger identification, execution, wafer control, and result identification, to achieve standardized management of the manufacturing equipment.
It enables timed and quantitative monitoring of production machines, timely detection of abnormalities, reduction of factory cost losses, and guarantee of processing quality and economic value.
Smart Images
Figure CN117198924B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of semiconductor manufacturing, and more particularly, to a semiconductor production machine monitoring management system. BACKGROUND
[0002] To ensure the normal operation of the semiconductor production machine, that is, the production yield of the process machine and the measurement accuracy of the measurement machine, the production machine is usually monitored under some constraints, such as periodic, quantitative, machine maintenance, machine downtime, machine acid replacement, and machine downtime.
[0003] The control film is used for monitoring the machine. Before the product is put into production, the control film needs to be used for trial processing to test the stability of the production line. During the production process, some control films are mixed in the positive film, and after the process is completed, the control film can be used to determine whether the batch is normal. By using the control film, the resistivity, film deposition rate, etching rate, grinding rate, and uniformity in ion implantation, thin film deposition, photolithography, etching, and grinding processes can be monitored.
[0004] When the machine is abnormal, such as a large amount of dust is measured after the machine is monitored, the equipment engineer needs to troubleshoot, and the cavity may also need to be maintained until the dust is within the specification range. During this process, the machine is in a downtime state and is not allowed to continue processing.
[0005] The whole process of machine monitoring is manually controlled and executed, and personnel operation will inevitably make mistakes, such as forgetting to monitor and forgetting to switch the machine state. If the machine is not monitored, the batch processing will be abnormal, causing serious loss of factory cost. SUMMARY
[0006] The purpose of the present application is to provide a semiconductor production machine monitoring management system, which can standardize the management of actual production and processing of production machines by configuring corresponding monitoring control rules, and reduce processing loss.
[0007] The above technical purpose of the present application is achieved by the following technical scheme: a semiconductor production machine monitoring management system, comprising:
[0008] A monitoring rule configuration module is configured to configure corresponding monitoring control rules according to product information to be processed.
[0009] A monitoring rule trigger identification module is configured to identify whether the monitoring rule is triggered.
[0010] A monitoring execution module is configured to issue a monitoring instruction to monitor the production machine when the monitoring rule is triggered.
[0011] The control piece control module is used for controlling a corresponding number of control pieces to enter a processing production line of a production machine according to a monitoring instruction.
[0012] The control piece monitoring module is used for monitoring the processed control pieces.
[0013] The monitoring result identification module is used for obtaining the processing monitoring result of the control pieces and judging a real-time production state parameter of the production machine.
[0014] The production line control module is used for controlling the operation of the production machine according to the real-time production state parameter of the production machine.
[0015] As a preferred technical solution of the present application, the types of the monitoring control rules include a time period monitoring trigger rule, a quantity period monitoring trigger rule, a state change monitoring trigger rule and an abnormal situation monitoring trigger rule.
[0016] As a preferred technical solution of the present application, the time period monitoring trigger rule is used for defining a time period of the production machine monitoring, and one monitoring is performed after the defined time period is reached.
[0017] The quantity period monitoring trigger rule is used for defining a quantity period of the production machine monitoring, and one monitoring is performed after the defined quantity period is reached.
[0018] The state change monitoring trigger rule is used for defining that one monitoring is performed when the production machine is in a defined monitoring state.
[0019] The abnormal state monitoring trigger rule is used for defining that one monitoring is performed after the production machine is restarted in an abnormal state.
[0020] As a preferred technical solution of the present application, the production machine uses corresponding monitoring control rule combinations according to product information to be processed.
[0021] As a preferred technical solution of the present application, the defined monitoring state includes that the production machine is completed maintenance, the production machine is restarted after shutdown, the production machine is restarted after acid replacement and the production machine is restarted after breakdown.
[0022] As a preferred technical solution of the present application, the monitoring rule trigger identification module includes a time period identification module, a quantity period identification module, a machine state switching identification module and an abnormal situation identification module.
[0023] The time period identification module is used for recording processing time after the last monitoring, and triggering the time period monitoring trigger rule after the defined time period of the time period monitoring trigger rule is reached.
[0024] The quantity cycle identification module is configured to record the processing quantity after the last monitoring, and trigger the quantity cycle monitoring trigger rule when the quantity cycle monitoring trigger rule is reached.
[0025] The machine state switching identification module is configured to identify the production machine state, and trigger the state change monitoring trigger rule when the production machine is in the specified monitoring state specified in the state change monitoring trigger rule.
[0026] The abnormal situation identification module is configured to identify whether the production machine has an abnormal situation, and trigger the abnormal state monitoring trigger rule when the production machine has the abnormal situation specified in the abnormal state monitoring trigger rule.
[0027] As a preferred technical solution of the present application, the production line control module comprises a state parameter setting module and a running control module, the state parameter setting module is configured to set the minimum production state parameter of the normal operation of the production line, and the running control module is configured to control the normal operation of the production machine when the real-time production state parameter of the production machine exceeds the minimum production state parameter, and control the production machine to suspend production when the real-time production state parameter of the production machine is lower than the minimum production state parameter.
[0028] As a preferred technical solution of the present application, the monitoring result identification module is further configured to record the production state parameter of the production machine.
[0029] In summary, the present application has the following advantages: the actual production and processing of the production machine can be monitored and controlled by configuring corresponding monitoring and control rules, and the production machine can be monitored in a planned manner, and the production machine can be detected in a special state and abnormal situation, and the entire processing of the production machine can be standardized managed, and the abnormal situation can be found in time to reduce the cost loss of the factory; the real-time production state parameter can be recorded to monitor and predict the processing quality of the production machine, and the risk can be avoided as much as possible, so that the processing quality of the entire production machine can be guaranteed, and higher economic value can be provided for the factory. BRIEF DESCRIPTION OF DRAWINGS
[0030] Figure 1 The system block diagram of the present application. DETAILED DESCRIPTION
[0031] The present application will be further described in detail below with reference to the accompanying drawings.
[0032] As Figure 1As shown, the present application provides a semiconductor production machine monitoring management system, including a monitoring rule configuration module, a monitoring rule trigger identification module, a monitoring execution module, a control piece control module, a control piece monitoring module, a monitoring result identification module and a production line control module. The specific module functions and compositions are as follows:
[0033] The monitoring rule configuration module is used to configure the corresponding monitoring control rule according to the information of the product to be processed.
[0034] The types of monitoring control rules include time period monitoring trigger rules, quantity period monitoring trigger rules, state change monitoring trigger rules and abnormal condition monitoring trigger rules. Other range monitoring control rules can also be set according to actual production conditions.
[0035] In addition, the production machine can also use corresponding monitoring control rule combinations according to the information of the product to be processed, for example, time period monitoring trigger rules and quantity period monitoring trigger rules, which can be one of the two or both can be used at the same time, or the common use rule can be set during use, for example, when the quantity period monitoring trigger rule is triggered, the time corresponding to the record of the time period monitoring trigger rule is updated, and when the time period monitoring trigger rule is triggered, the number corresponding to the record of the quantity period monitoring trigger rule is updated, so that the two can be better used in cooperation.
[0036] Specifically, the time period monitoring trigger rule is used to specify the time period of the production machine monitoring, and the monitoring is performed once after the specified time period is reached, for example, every 2 days or 3 days.
[0037] The quantity period monitoring trigger rule is used to specify the quantity period of the production machine monitoring, and the monitoring is performed once after the specified quantity period is reached, for example, the monitoring is performed once every 1000 wafers processed.
[0038] The state change monitoring trigger rule is used to specify that the production machine performs monitoring once when it is in a specified monitoring state, and the specified monitoring state includes: the production machine completes maintenance, the production machine stops and restarts, the production machine changes acid and restarts, and the production machine crashes and restarts. Other production machine states can also be added as monitoring trigger conditions according to actual conditions.
[0039] The abnormal state monitoring trigger rule is used to specify that the production machine performs monitoring once after it is restarted in an abnormal state, for example, the production machine performs monitoring once after the dust rate is treated.
[0040] The monitoring rule trigger identification module is used to identify whether the monitoring rule is triggered.
[0041] The monitoring rule triggering identification module comprises a time period identification module, a quantity period identification module, a machine state switching identification module, and an abnormal situation identification module.
[0042] The time period identification module is configured to record the processing time after the last monitoring, and trigger the time period monitoring triggering rule when the time period specified in the time period monitoring triggering rule is reached.
[0043] The quantity period identification module is configured to record the processing quantity after the last monitoring, and trigger the quantity period monitoring triggering rule when the quantity period specified in the quantity period monitoring triggering rule is reached.
[0044] The machine state switching identification module is configured to identify the state of the production machine, and trigger the state change monitoring triggering rule when the production machine is identified to be in a specified monitoring state specified in the state change monitoring triggering rule.
[0045] The abnormal situation identification module is configured to identify whether an abnormal situation occurs in the production machine, and trigger the abnormal state monitoring triggering rule when an abnormal situation specified in the abnormal state monitoring triggering rule is identified in the production machine.
[0046] The monitoring execution module is configured to issue a monitoring instruction to monitor the production machine when the monitoring rule is triggered.
[0047] The control piece control module is configured to control a corresponding number of control pieces to enter the processing production line of the production machine according to the monitoring instruction.
[0048] The control piece monitoring module is configured to monitor the results of the processed control pieces.
[0049] The monitoring result identification module is configured to obtain the processing monitoring results of the control pieces and determine the real-time production state parameters of the production machine. The monitoring result identification module is also configured to record the production state parameters of the production machine.
[0050] The production line control module is configured to control the operation of the production machine according to the real-time production state parameters of the production machine. The production line control module comprises a state parameter setting module and an operation control module. The state parameter setting module is configured to set the minimum production state parameter for normal operation of the production line. The operation control module is configured to control the production machine to operate normally when the real-time production state parameter of the production machine exceeds the minimum production state parameter, and control the production machine to suspend production when the real-time production state parameter of the production machine is lower than the minimum production state parameter.
[0051] The semiconductor production machine monitoring management system has the advantages that the actual production and processing of the production machine can be monitored and controlled by configuring corresponding monitoring and control rules, planned monitoring can be performed, monitoring can be performed in a time and quantity manner, detection can be performed when the production machine is in a special state or an abnormal condition, the entire processing of the production machine can be standardized managed, abnormalities can be found in time, factory cost loss can be reduced, real-time production state parameters can be recorded, production yield can be obtained according to processing results, the processing quality of the production machine can be monitored and predicted, risks can be avoided as much as possible, the processing quality of the entire production machine can be ensured, and higher economic value can be provided for the factory.
[0052] The above merely describes the preferred embodiments of the present application, and the protection scope of the present application is not limited to the above-described embodiments. Any technical solution falling within the concept of the present application shall fall within the protection scope of the present application. It should be noted that, for ordinary skilled persons in the art, some improvements and refinements without departing from the principles of the present application shall also be considered as falling within the protection scope of the present application.
Claims
1. A semiconductor production machine monitoring management system, characterized by: Comprise: Monitoring rule configuration module, for configuring corresponding monitoring control rules according to product information to be processed; The type of monitoring control rules includes: time period monitoring trigger rule, quantity period monitoring trigger rule, state change monitoring trigger rule, abnormal state monitoring trigger rule, production machine uses corresponding monitoring control rule combination according to product information to be processed; Monitoring rule trigger identification module, including time period identification module, quantity period identification module, machine state switching identification module, abnormal situation identification module; be used for identifying whether corresponding monitoring control rules are triggered respectively; Monitoring execution module, for issuing a monitoring instruction when the monitoring rule is triggered, monitoring the production machine; Control piece control module, for controlling the corresponding number of control pieces into the processing production line of the production machine according to the monitoring instruction; Control piece monitoring module, for monitoring the processing result of the control piece; Monitoring result identification module, for obtaining the processing monitoring result of the control piece, judging the real-time production state parameter of the production machine, and recording the production state parameter of the production machine; Line control module, for controlling the operation of the production machine according to the real-time production state parameter of the production machine, including running setting module and running control module, the running setting module is used for setting the minimum production state parameter of the normal running of the line; the running control module is used for controlling the normal running of the production machine when the real-time production state parameter of the production machine exceeds the minimum production state parameter, and controlling the production machine to suspend production when the real-time production state parameter of the production machine is lower than the minimum production state parameter.
2. The system of claim 1, wherein: the system further comprises a plurality of sensors configured to monitor the plurality of semiconductor production machines; and the system further comprises a plurality of actuators configured to control the plurality of semiconductor production machines. The time period monitoring trigger rule is used to specify the time period of the production machine monitoring, and the monitoring is performed once after the specified time period is reached; The quantity period monitoring trigger rule is used to specify the quantity period of the production machine monitoring, and the monitoring is performed once after the specified quantity period is reached; The state change monitoring trigger rule is used to specify that the production machine performs monitoring once when it is in a specified monitoring state; The abnormal state monitoring trigger rule is used to specify that the production machine performs monitoring once after restarting from an abnormal state.
3. The system of claim 2, wherein: the system further comprises a plurality of sensors configured to monitor the plurality of semiconductor production machines; and the system further comprises a plurality of actuators configured to control the plurality of semiconductor production machines. The specified monitoring state includes: the production machine completes maintenance, the production machine stops and restarts, and the production machine restarts after changing acid.
4. The semiconductor production machine monitoring management system of claim 3, characterized in that: The time period identification module is used to record the processing time after the last monitoring, and trigger the time period monitoring trigger rule when the time period specified by the time period monitoring trigger rule is reached; The quantity period identification module is used to record the processing quantity after the last monitoring, and trigger the quantity period monitoring trigger rule when the quantity period specified by the quantity period monitoring trigger rule is reached; The machine state switching identification module is used to identify the state of the production machine, and trigger the state change monitoring trigger rule when the production machine is in the specified monitoring state specified in the state change monitoring trigger rule. The abnormal situation identification module is configured to identify whether an abnormal situation occurs in the production machine, and trigger the abnormal situation monitoring trigger rule when it is identified that the abnormal situation specified in the abnormal situation monitoring trigger rule occurs in the production machine. The abnormal situation identification module is configured to identify whether an abnormal situation occurs in the production machine, and trigger the abnormal situation monitoring trigger rule when it is identified that the abnormal situation specified in the abnormal situation monitoring trigger rule occurs in the production machine.
Citation Information
Patent Citations
Monitoring system of standard semiconductor equipment based on organic photo conductor (OPC)
CN103197654A
Methods and systems of offline measurement for process tool monitoring
CN1983089A