Wafer post-processing device

Abstract

The present invention discloses a wafer post-processing device, which includes: a box body; a clamping assembly, which is arranged in the box body and can vertically clamp and drive the wafer to rotate; a protective assembly, which is arranged on the outer peripheral side of the clamping assembly, and includes a rotating cover and a fixed cover, the rotating cover is connected to the clamping assembly and is located on the outer peripheral side of the wafer to be processed, and the fixed cover is concentrically arranged on the outer side of the rotating cover; the rotating cover and / or the fixed cover are formed with a blocking structure to prevent the centrifugally scattered fluid from returning to the wafer surface.

Description

Technical Field

[0001] The present invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a wafer post-processing device. Background Art

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in driving the transformation and upgrading of the manufacturing industry towards digitalization and intelligentization. Chips are the carriers of integrated circuits. Chip manufacturing involves a series of processes, including integrated circuit design, wafer fabrication, wafer processing, electrical measurement, cutting, packaging, and testing. Chemical mechanical polishing (CMP) is one of the five core processes in wafer manufacturing.

[0003] After chemical mechanical polishing (CMP), a large amount of particles remain on the wafer surface. Therefore, the wafer needs to be cleaned, dried, and processed. Post-processing generally refers to the cleaning and drying of wafers after CMP.

[0004] In the prior art, a schematic diagram of a wafer cleaning device 100' is shown as follows: Figure 1 The wafer cleaning device 100' includes a housing 10', within which is disposed a clamping mechanism 20' for vertically clamping a wafer. A driving member (not shown) is disposed at the end of the clamping mechanism 20' to rotate the clamping mechanism 20' and the wafer W clamped therein. The wafer cleaning device 100' also includes an inner retaining ring 30' and an outer retaining ring 40'. The inner retaining ring 30' rotates synchronously with the clamping mechanism 20', and the outer retaining ring 40' is disposed on the inner sidewall of the housing 10' and located outside the inner retaining ring 30'.

[0005] During wafer cleaning, the clamping mechanism 20' rotates the wafer around its central axis, and a sprayer (not shown) sprays cleaning liquid toward the wafer W. Under the action of centrifugal force, the liquid on the wafer surface is thrown out and splashes onto the inner retaining ring 30', preventing the liquid from splashing around in the housing 10' and contaminating the wafer.

[0006] Since the inner retaining ring 30' rotates in the same direction as the wafer W, the outer retaining ring 40' located on the outside remains stationary, and the liquid thrown out by the wafer is received by the inner wall of the inner retaining ring 30'. The relative speed of the liquid thrown out by the wafer and the inner retaining ring 30' is relatively small, and the thrown liquid flows along the inner wall of the inner retaining ring 30' and then is discharged from the inner retaining ring discharge port 31' ( Figure 2 shown) discharged.

[0007] Since the relative speed between the inner retaining ring 30' and the outer retaining ring 40' is relatively high, the liquid droplets ejected from the inner retaining ring discharge port 31' will hit the inner wall of the outer retaining ring 40' at a relatively high relative speed, thereby generating splashing droplets, so that the droplets fill the space between the inner retaining ring 30' and the outer retaining ring 40'. The droplets formed inside the box 10' have at least the following adverse effects:

[0008] First, liquid will accumulate in the center of the inner wall of the top of the outer retaining ring 40', forming a large number of hanging droplets, such as Figure 2 As shown, the hanging droplets will extend to the front end of the outer retaining ring 40' and randomly drip onto the outer wall of the inner retaining ring 30'; if the droplets fall onto the outer wall of the stationary inner retaining ring 30', the droplets may drip onto the surface of the wafer W through the top front end of the inner retaining ring 30', thereby affecting the cleaning effect of the wafer;

[0009] Furthermore, the sputtering droplets between the inner retaining ring 30' and the outer retaining ring 40' will move rightward with the airflow to the entrance of the gap between the inner retaining ring 30' and the outer retaining ring 40'. The sputtering droplets will continuously fly outward from the entrance and reach the space where the front side of the wafer is located. The sputtering droplets containing particulate matter may return to the wafer surface and affect the wafer cleaning effect. Summary of the Invention

[0010] An embodiment of the present invention provides a wafer post-processing device, which aims to solve at least one of the technical problems existing in the prior art.

[0011] A first aspect of an embodiment of the present invention provides a wafer post-processing device, comprising:

[0012] Box;

[0013] A clamping assembly is provided in the box body, which can vertically clamp and drive the wafer to rotate;

[0014] A protective assembly is provided on the outer periphery of the clamping assembly, comprising a rotating cover and a fixed cover, wherein the rotating cover is connected to the clamping assembly and is located on the outer periphery of the wafer to be processed, and the fixed cover is concentrically provided on the outer side of the rotating cover;

[0015] The rotating cover and / or the fixed cover are formed with a blocking structure to prevent the centrifugally scattered fluid from returning to the wafer surface.

[0016] In one embodiment, the clamping assembly includes a clamping disc and a rotating shaft, wherein the clamping disc is connected to the rotating shaft; and the rotating cover is fixed to the rotating shaft to rotate synchronously with the clamping disc.

[0017] In one embodiment, the fixed cover is vertically connected to the back plate of the box body, and a fixed cover drain port is arranged below the fixed cover.

[0018] In one embodiment, the outer side wall of the rotating cover and the inner side wall of the fixed cover are provided with corrugated blocking structures, and the protrusions of the two are staggered in the horizontal direction.

[0019] In one embodiment, the rotating cover comprises a disc body and a rotating cover body, wherein the rotating cover body is arranged on the outer edge of the disc body; a rotating cover drain port is arranged at the junction of the disc body and the rotating cover body.

[0020] In one embodiment, the outer side wall of the rotating cover body is provided with a rotating cover protrusion, and the rotating cover protrusion includes a rotating cover water-facing surface and a rotating cover connecting surface. The rotating cover water-facing surface extends inward from the rotating cover peak point away from the disk body, and the rotating cover connecting surface is located on the other side of the rotating cover peak point and extends inward from the rotating cover peak point.

[0021] In one embodiment, the inner side wall of the fixed cover is provided with a fixed cover protrusion, and the fixed cover protrusion includes a fixed cover water-facing surface and a fixed cover connecting surface, the fixed cover water-facing surface extends outward from the fixed cover peak point toward the back plate, and the fixed cover connecting surface is located on the other side of the fixed cover peak point and extends outward from the fixed cover peak point.

[0022] In one embodiment, the peak point of the fixed cover is arranged opposite to the water-facing surface of the rotating cover, and the peak point of the rotating cover is arranged opposite to the water-facing surface of the fixed cover.

[0023] In one embodiment, the inner side wall at the rear end of the fixed cover is provided with a fixed cover conical surface, which is inclined outward from the rear end of the fixed cover; the fixed cover conical surface is connected to the water-facing surface of the fixed cover at the rear end, and the inclination angle of the fixed cover conical surface is less than or equal to the inclination angle of the fixed cover water-facing surface.

[0024] In one embodiment, a groove is configured at the front end of the fixed cover, an annular retaining ring is configured on the outer peripheral side of the rotating cover, and the annular retaining ring gap is set in the groove; the size and setting position of the annular retaining ring match the size and setting position of the groove.

[0025] In one embodiment, the outer side wall of the annular retaining ring is a tapered surface extending outward from the front end of the annular retaining ring.

[0026] In one embodiment, the fixed cover drainage openings are multiple in number and are spaced apart along the length direction of the fixed cover. Moreover, the fixed cover drainage openings are located at positions corresponding to the wave troughs of the blocking structure.

[0027] A second aspect of an embodiment of the present invention provides a wafer post-processing device, wherein the wafer to be processed is arranged horizontally, and the device comprises:

[0028] Box;

[0029] A clamping assembly is provided in the box body, which can clamp the wafer horizontally and drive the wafer to rotate;

[0030] A protective assembly is provided on the outer periphery of the clamping assembly, comprising a rotating cover and a fixed cover, wherein the rotating cover is connected to the clamping assembly and is located on the outer periphery of the wafer to be processed, and the fixed cover is concentrically provided on the outer side of the rotating cover;

[0031] The rotating cover and / or the fixed cover are formed with a blocking structure to prevent the centrifugally scattered fluid from returning to the wafer surface.

[0032] In one embodiment, the fixed cover is vertically connected to the back plate of the box body, and the back plate is provided with a fluid outlet.

[0033] The beneficial effects of the present invention include:

[0034] a. A corrugated barrier structure is configured on the outer wall of the rotating cover and the inner wall of the fixed cover to direct the droplets toward the backplane, inhibiting the droplets from moving to the front of the protective assembly. This prevents the droplets from accumulating at the front of the rotating cover and falling, thereby affecting the cleaning and drying effect of the wafers.

[0035] b. Reasonably set the number and size of the liquid discharge ports of the rotating cover to suppress the turbulence caused by the relative rotation of the rotating cover and the fixed cover, and to prevent the gas carrying sputtering droplets from escaping through the gap between the rotating cover and the fixed cover and adhering to the wafer surface;

[0036] c. The protective component can be applied to vertical wafer cleaning devices and horizontal wafer cleaning devices. It can control the movement of fluid to inhibit the centrifugal scattered fluid from returning to the wafer surface, thereby ensuring the post-processing effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings, which are only exemplary and do not limit the scope of protection of the present invention, wherein:

[0038] Figure 1 It is a schematic diagram of a wafer cleaning device in the prior art;

[0039] Figure 2 yes Figure 1 A partial enlarged view of point A in the middle;

[0040] Figure 3 is a schematic diagram of a wafer post-processing device provided by one embodiment of the present invention;

[0041] Figure 4 yes Figure 3 A partial enlarged view of point B in the middle;

[0042] Figure 5is a schematic diagram of a rotating cover provided by one embodiment of the present invention;

[0043] Figure 6 is a schematic diagram of a fixed cover provided by one embodiment of the present invention;

[0044] Figure 7 is a perspective view of a rotating cover provided by one embodiment of the present invention;

[0045] Figure 8 is a schematic diagram of a fixed cover provided by another embodiment of the present invention;

[0046] Figure 9 It is a schematic diagram of a wafer post-processing device provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0047] The technical solutions of the present invention are described in detail below in conjunction with specific embodiments and the accompanying drawings. The embodiments described herein are specific embodiments of the present invention and are used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary and should not be understood as limiting the embodiments of the present invention and the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the contents disclosed in the claims of this application and its specification, including technical solutions that adopt any obvious replacements and modifications to the embodiments described herein.

[0048] The drawings in this specification are schematic diagrams that assist in illustrating the concepts of the present invention and schematically illustrate the shapes of the various components and their interrelationships. It should be understood that in order to clearly illustrate the structures of the various components of the embodiments of the present invention, the drawings are not drawn to the same scale, and the same reference numerals are used to represent the same parts in the drawings.

[0049] In the present invention, wafer (W) is also called substrate, and its meaning and actual function are equivalent. The term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc. can refer to different or the same objects, and are only used to distinguish the objects referred to, and do not imply a specific spatial order, temporal order, order of importance, etc. of the objects referred to. In some embodiments, values, processes, selected items, determined items, equipment, devices, means, components, assemblies, etc. are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made from a number of available functional options, and that such a selection does not need to be better, lower, higher, smaller, larger, or otherwise preferred than other options in other aspects or all aspects.

[0050] Figure 3 FIG. 1 is a schematic diagram of a wafer post-processing apparatus 100 provided in one embodiment of the present invention. The wafer post-processing apparatus 100 includes:

[0051] The box body 10 has an opening (not shown) at the top thereof so that a robot can take and place wafers to be processed through the opening;

[0052] The clamping assembly 20 is disposed in the housing 10 and is capable of vertically clamping and rotating the wafer. Specifically, the clamping assembly 20 includes a clamping plate 21 and a rotating shaft 22. The rotating shaft 22 is disposed perpendicular to the back plate 11 of the housing 10, and the clamping plate 21 is disposed at the end of the rotating shaft 22. The clamping plate 21 is a circular disc-shaped structure with claws disposed on its outer periphery to clamp the wafer to be processed. A drive motor (not shown) is disposed at the other end of the rotating shaft 22 to drive the clamping plate 21 and the wafer clamped therein to rotate synchronously.

[0053] The wafer post-processing device 100 further includes a spraying unit ( Figure 3 Not shown), which is arranged on the outside of the clamping assembly 20 to spray fluid, such as cleaning liquid, nitrogen and / or IPA vapor, toward the rotating wafer to process the surface of the wafer and obtain a wafer with a cleanliness level that meets the requirements.

[0054] Figure 3 In the illustrated embodiment, the wafer post-processing device 100 further includes a protective component, which is disposed in the housing 10 and located on the outer peripheral side of the clamping component 20 to control the fluid centrifugally ejected from the wafer surface, and to suppress or prevent the fluid from splashing disorderly and returning to the wafer surface.

[0055] Furthermore, the protective assembly includes a rotating cover 30 and a fixed cover 40; wherein, the rotating cover 30 is arranged on the outer peripheral side of the clamping disk 21, and the rotating cover 30 is fixed to the rotating shaft 22 of the clamping assembly 20; the fixed cover 40 is concentrically arranged on the outside of the rotating cover 30, specifically, the fixed cover 40 is vertically arranged on the back plate 11 of the box body 10.

[0056] In the present invention, the fixed cover 40 is connected to the box body 10, that is, the fixed cover 40 is stationary; and the rotating cover 30 rotates synchronously with the clamping plate 21; in order to avoid interference between the rotating cover 30 and the fixed cover 40, a gap is provided between the rotating cover 30 and the fixed cover 40, such as Figure 4 shown.

[0057] Figure 5 FIG3 is a schematic diagram of a rotating cover 30 according to an embodiment of the present invention. The rotating cover 30 includes a disc body 31 and a rotating cover body 32. The rotating cover body 32 is disposed on the outer edge of the disc body 31. Specifically, the rotating cover body 32 extends from the outer edge of the disc body 31 toward the front end to form a single-ended open chamber that houses the clamping disc 21.

[0058] Furthermore, a rotary cover drain port 33 is provided at the junction of the disk body 31 and the rotary cover body 32. During wafer cleaning, fluid, such as droplets, that falls into the single-ended chamber can move toward the rear end of the rotary cover 30 through the rotary cover drain port 33 and be discharged to the outside of the single-ended chamber.

[0059] Figure 6 Figure 4 is a schematic diagram of a fixed cover 40 according to one embodiment of the present invention. The fixed cover 40 is an annular structure, and a fixed cover drain port 41 is disposed below the fixed cover 40 to drain fluid flowing into the fixed cover 40. The fixed cover drain port 41 is disposed along the circumference of the fixed cover 40. In some embodiments, the fixed cover drain port 41 has an arc length of 10-30 mm and is spaced apart along the length of the fixed cover 40. During wafer post-processing, the fixed cover 40 is relatively stationary. Liquid droplets entering the fixed cover 40 will converge at the bottom of the inner wall of the fixed cover 40 due to gravity. The fixed cover drain port 41 disposed below can promptly drain the liquid.

[0060] Figure 3 In the illustrated embodiment, in order to suppress or prevent the centrifugally scattered fluid from returning to the wafer surface and affecting the wafer cleaning effect, the rotating cover 30 and / or the fixed cover 40 are formed with a blocking structure.

[0061] Furthermore, the outer wall of the rotating cover 30 and the inner wall of the fixed cover 40 are provided with a corrugated blocking structure, such as Figure 4 As shown, the protrusions of the two are staggered in the horizontal direction to control the movement of the fluid entering between the rotating cover 30 and the fixed cover 40, inhibiting or preventing the fluid containing particulate matter from entering the space where the wafer is located through the gap between the two and causing secondary contamination.

[0062] Figure 4 In the embodiment, the outer wall of the rotating cover body 32 is provided with a rotating cover protrusion 32A. There are a plurality of rotating cover protrusions 32A, which are arranged horizontally along the length direction of the rotating cover body 32 .

[0063] Furthermore, the rotating cover protrusion 32A includes a rotating cover water-facing surface 32A-1 and a rotating cover connection surface 32A-2. The rotating cover water-facing surface 32A-1 extends inward from the rotating cover peak 32B, away from the disc body 31. The rotating cover connection surface 32A-2 is located on the other side of the rotating cover peak 32B and extends inward from the rotating cover peak 32B. The rotating cover peak 32B refers to the highest point on the outer wall of the rotating cover 30. It is understood that adjacent rotating cover peaks 32B may not be in the same plane, that is, the heights of adjacent rotating cover peaks 32B may be different, to regulate the airflow between the rotating cover 30 and the fixed cover 40 and prevent airflow disturbances between the two from escaping from the front end of the protective assembly. In the present invention, when describing the protective assembly, the terms "inside" and "outside" are used relative to the centerline of the protective assembly; toward the centerline of the protective assembly is "inside", and away from the centerline is "outside".

[0064] Furthermore, the inner sidewall of the fixed cover 40 is provided with a fixed cover protrusion 40A. The fixed cover protrusion 40A includes a fixed cover water-facing surface 40A-1 and a fixed cover connection surface 40A-2. The fixed cover water-facing surface 40A-1 extends outward from the fixed cover peak 40B toward the back plate 11, while the fixed cover connection surface 40A-2 is located on the other side of the fixed cover peak 40B and extends outward from the fixed cover peak 40B. The fixed cover peak 40B refers to the highest point on the inner sidewall of the fixed cover 40. It will be understood that the heights of adjacent fixed cover peaks 40B can vary to adjust the airflow between the rotating cover 30 and the fixed cover 40.

[0065] Furthermore, the inner side wall of the rear end of the fixed cover 40 is provided with a fixed cover tapered surface 40C, and the fixed cover tapered surface 40C is extended obliquely from the rear end of the fixed cover 40 toward the outside, as shown in FIG. Figure 4 shown.

[0066] Furthermore, the fixed cover conical surface 40C is connected to the fixed cover water-facing surface 40A-1 at the rear end to form a continuous liquid guiding surface. Figure 4In the embodiment shown, the inclination angle of the fixed cover conical surface 40C is less than or equal to the inclination angle of the fixed cover water-facing surface 40A-1. Here, the inclination angle of the fixed cover conical surface 40C is the angle formed relative to the center line of the protective component (acute angle). In some embodiments, the inclination angle of the fixed cover conical surface 40C is 15 to 45 degrees, while the inclination angle of the fixed cover water-facing surface 40A-1 is 35 to 75 degrees. In some embodiments, the inclination angle of the fixed cover conical surface 40C is less than the inclination angle of the fixed cover water-facing surface 40A-1. Such an arrangement can make the length dimension corresponding to the fixed cover conical surface 40C larger, and the disk 31 of the rotating cover 30 is away from the back plate 11 of the box body 10. This to a certain extent avoids the liquid on the back plate 11 from adhering to the rotating cover 30 again, so as to improve the post-processing effect of the wafer.

[0067] In the present invention, when describing the protective component, the "rear end" and "front end" used are relative to the back plate 11 of the box body 10; the direction close to the back plate 11 is the "rear end"; correspondingly, the direction away from the back plate 11 is the "front end".

[0068] Figure 4 In the embodiment, the fixed cover peak 40B is positioned opposite the rotating cover water-facing surface 32A-1, and the rotating cover peak 32B is positioned opposite the fixed cover water-facing surface 40A-1. This arrangement effectively prevents droplets entering between the rotating cover 30 and the fixed cover 40 from moving away from the backing plate 11, thereby preventing droplets containing particulate matter from reattaching to the wafer surface, thereby ensuring the post-processing effect of the wafer.

[0069] During wafer post-processing, the rotating hood 30 rotates around the axis 22 of the clamping assembly 20 at the same angular velocity as the wafer W. That is, the rotating hood 30 and the wafer W rotate at the same angular velocity and in the same direction. The fixed hood 40 remains stationary. Liquid ejected from the wafer surface is collected by the inner sidewall of the rotating hood 30 and then drained through the hood drain port 33, converging at the hood peak 32B at the rear end. Figure 4 In the diagram, dashed lines with arrows are used to roughly indicate the direction of movement of fluids, droplets, or mist droplets.

[0070] Under the action of centrifugal force, liquid droplets converging at the rotating hood peak 32B are flung outward and collected by the fixed hood water-facing surface 40A-1. Because the fixed hood water-facing surface 40A-1 and the fixed hood tapered surface 40C at the rear end of the fixed hood 40 form a continuous liquid-guiding surface, most of the liquid discharged from the rotating hood drain port 33 follows this liquid-guiding surface toward the back plate 11 of the housing 10. Under the action of gravity, it moves to the bottom of the fixed hood 40 before being discharged through the fixed hood drain port 41.

[0071] However, a small amount of liquid may migrate toward the front end of the protective assembly. Specifically, this small amount of liquid migrates to the rear end of the fixed cover peak 40B and accumulates there, forming large droplets. Then, under the action of gravity, these large droplets fall onto the rotating cover water-facing surface 32A-1. Because the rotating cover water-facing surface 32A-1 is inclined toward the back plate 11 of the housing 10, the droplets flow toward the rotating cover peak 32B and are centrifugally thrown off again onto the fixed cover water-facing surface 40A-1, thereby forming a trend of migration toward the rear end of the protective assembly.

[0072] Figure 4 In the embodiment, multiple rotating cover protrusions 32A and fixed cover protrusions 40A are arranged along the length of the protective assembly from the rear end to the front end to prevent trace amounts of liquid from migrating toward the front end of the protective assembly. This step-by-step barrier prevents droplets from migrating toward the front end of the protective assembly through the gap between the rotating cover 30 and the fixed cover 40, and instead directs them toward the rear end of the protective assembly. This inhibits or prevents liquid containing particulate matter from migrating to the front end of the protective assembly and then re-staining the wafer surface, thereby ensuring optimal post-processing of the wafers.

[0073] Preferably, the number of the rotating cover protrusions 32A and the fixed cover protrusions 40A is 2 to 4, which are arranged along the length direction of the protection component. It is understandable that the number of the rotating cover protrusions 32A and the fixed cover protrusions 40A can also be other.

[0074] In the present invention, the front end of the fixed cover 40 is provided with a groove 42, and the rotating cover 30 is correspondingly provided with an annular retaining ring 34. Figure 4 As shown, the annular retaining ring 34 is spaced inside the groove 42 .

[0075] Furthermore, the size and location of the annular retaining ring 34 match those of the groove 42 , so that a gap exists between them, thereby suppressing or preventing interference between the annular retaining ring 34 and the groove 42 and affecting the cleaning and drying process of the wafer.

[0076] Figure 4 In the embodiment shown, the outer wall of the annular retaining ring 34 is a conical surface, which extends outward from the front end of the annular retaining ring 34, so that the gap between the outer wall of the annular retaining ring 34 and the inner wall of the groove 42 gradually decreases from front to back, so that the gas outside the single-ended open chamber has a velocity component entering the gap, thereby suppressing the turbulence caused by the relative rotation of the rotating cover 30 and the fixed cover 40, and suppressing or preventing the gas carrying sputtering droplets from escaping through the gap between the rotating cover 30 and the fixed cover 40 and adhering to the wafer surface.

[0077] In the present invention, the number of the fixed cover drain ports 41 located below the fixed cover 40 is multiple, such as Figure 6As shown, they are spaced apart along the length of the fixed cover 40, and the fixed cover drain ports 41 are located at positions corresponding to the troughs of the barrier structure, so that the liquid droplets gather at the lower part of the fixed cover 40 and are easily discharged. In the present invention, the trough of the fixed cover 40 refers to the concave portion formed by adjacent fixed cover protrusions 40A. Figure 4 In the figure, the trough of the fixed cover 40 is a concave portion formed by the fixed cover water-facing surface 40A-1 and the fixed cover connecting surface 40A-2 of the adjacent fixed cover protrusion 40A.

[0078] Figure 3 In the embodiment shown, the inner side wall of the rotating hood 30 has a centrifugal guiding function. When the rotating hood 30 rotates, the air flow will move from the rotating hood drain port 33 to the back plate 11 of the housing 10. Therefore, it is necessary to control the number and size of the rotating hood drain ports 33 to prevent excessive gas from being discharged through the rotating hood drain ports 33 to the space between the rotating hood 30 and the fixed hood 40, and from escaping from the front end of the gap between the two with sputtering droplets to the space where the wafers are located. That is, the amount of fluid delivered through the rotating hood drain ports 33 needs to match the exhaust structure configured for the wafer post-processing device 100, so that the exhaust structure can discharge the fluid delivered through the rotating hood drain ports 33 in a timely manner to suppress or prevent excessive fluid from moving toward the front end of the protective component.

[0079] Figure 7 3D is a perspective view of a rotating cover 30 provided in one embodiment of the present invention. The number of the rotating cover drain ports 33 is 2 to 20; preferably, the number of the rotating cover drain ports 33 is 8 to 16.

[0080] Furthermore, the length of the rotary cover drain port 33 is 10 to 50 mm; preferably, the length of the rotary cover drain port 33 is 20 to 30 mm, so as to control the amount of fluid delivered through the rotary cover drain port 33 .

[0081] The width of the rotary cover drain port 33 is 1 to 6 mm; preferably, the width of the rotary cover drain port 33 is 2 to 4 mm to control the fluid delivery rate through the rotary cover drain port 33 so that the fluid delivery rate matches the exhaust structure configured for the wafer post-processing device 100.

[0082] Figure 8 This is a schematic diagram of a fixed cover 40 according to another embodiment of the present invention. The rotating cover drain port 33 is tilted, and the inner sidewall of the rotating cover drain port 33 is rounded to facilitate smooth fluid discharge. Specifically, the rotating cover drain port 33 extends outward at an angle from the front end to the rear end. Fluid flows along the inner sidewall of the rotating cover 30 toward the rear end and is discharged through the rotating cover drain port 33 toward the back plate 11 of the housing 10.

[0083] As one aspect of this embodiment, the inclination angle of the rotating cover drain port 33 relative to the horizontal plane is 25 to 55 degrees (acute angle); preferably, the inclination angle of the rotating cover drain port 33 relative to the horizontal plane is 30 to 45 degrees, so as to reasonably adjust the resistance of the fluid and control the fluid delivery amount through the rotating cover drain port 33.

[0084] In some embodiments, the inclination angles of adjacent rotating cover drain ports 33 are different. For example, the difference in the inclination angles of adjacent rotating cover drain ports 33 is 5-25°, so as to adjust the resistance of the fluid so that the fluid delivery volume through the rotating cover drain ports 33 matches the exhaust volume configured for the wafer post-processing device 100.

[0085] At the same time, the present invention also provides a wafer post-processing device 110, the schematic diagram of which is as follows: Figure 9 As shown, the wafer post-processing device 110 includes: a box 10, a clamping assembly 20 and a protective assembly, and a spraying part (not shown) is arranged above the clamping assembly 20. The structures of the above components are similar to Figure 3 The embodiments shown are substantially the same and will not be described in detail herein. The difference between the two embodiments is that the clamping assembly 20 clamps the wafer horizontally and drives the wafer to rotate.

[0086] Furthermore, the protective component is arranged on the outer peripheral side of the clamping component 20, and the protective component includes a rotating cover 30 and a fixed cover 40. The rotating cover 30 is connected to the clamping component 20 and is located on the outer peripheral side of the wafer to be processed, and the fixed cover 40 is concentrically arranged on the outer side of the rotating cover 30.

[0087] Figure 9 In the embodiment, the rotating cover 30 and / or the fixed cover 40 are formed with a blocking structure to inhibit or prevent the centrifugally scattered fluid from returning to the wafer surface.

[0088] Furthermore, the fixed cover 40 is vertically connected to the back panel 11 of the housing 10. The back panel 11 is equipped with a fluid outlet 12. This outlet 12 not only drains liquids but also serves as a ventilation outlet. To ensure optimal drainage, multiple outlets 12 are provided, dispersed and interspersed throughout the back panel 11, allowing waste gases and liquids to be promptly discharged to the exterior of the housing 10.

[0089] Furthermore, the rotating cover 30 and / or the fixed cover 40 are provided with a corrugated barrier structure to prevent the liquid or mist droplets from returning to the wafer surface through the gap between the two. The technical solution of the corrugated barrier structure is similar to that of the fixed cover 40. Figure 3 The same as the embodiment shown, the corrugated blocking structure can prevent the gas carrying sputtering droplets from overflowing from the gap between the rotating cover 30 and the fixed cover 40 into the space where the wafer is located, so as to obtain a good wafer post-processing effect, which will not be repeated here.

[0090] At the same time, the upper end of the protective component is also provided with an annular retaining ring 34 and a groove 42 to suppress the turbulence caused by the relative rotation of the rotating cover 30 and the fixed cover 40, and to suppress or prevent the gas carrying sputtering droplets from escaping through the gap between the rotating cover 30 and the fixed cover 40 and adhering to the wafer surface.

[0091] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0092] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A wafer post-processing device, characterized in that: include: Box; A clamping assembly is provided in the box body, which can vertically clamp and drive the wafer to rotate; A protective assembly is provided on the outer periphery of the clamping assembly, comprising a rotating cover and a fixed cover. The rotating cover is connected to the clamping assembly and is located on the outer periphery of the wafer to be processed. The fixed cover is concentrically provided on the outer side of the rotating cover. A groove is provided at the front end of the fixed cover, and an annular retaining ring is provided on the rotating cover accordingly. The rotating cover and the fixed cover form a blocking structure to prevent the centrifugally scattered fluid from returning to the wafer surface; The fixed cover is vertically connected to the back plate of the box body, and a fixed cover drain port is arranged below it; the outer wall of the rotating cover and the inner wall of the fixed cover are provided with a corrugated blocking structure, and the protrusions of the two are staggered in the horizontal direction; The rotating cover includes a disc body and a rotating cover body, and the rotating cover body is arranged on the outer edge of the disc body; a rotating cover drain port is provided at the junction of the disc body and the rotating cover body; the outer side wall of the rotating cover body is provided with a rotating cover protrusion, and the rotating cover protrusion includes a rotating cover water-facing surface and a rotating cover connecting surface, the rotating cover water-facing surface extends inward from the peak point of the rotating cover away from the disc body, and the rotating cover connecting surface is located on the other side of the peak point of the rotating cover and extends inward from the peak point of the rotating cover.

2. The wafer post-processing device according to claim 1, wherein: The clamping assembly includes a clamping disc and a rotating shaft, wherein the clamping disc is connected to the rotating shaft; and the rotating cover is fixed to the rotating shaft to rotate synchronously with the clamping disc.

3. The wafer post-processing device according to claim 1, wherein: The inner side wall of the fixed cover is provided with a fixed cover protrusion, and the fixed cover protrusion includes a fixed cover water-facing surface and a fixed cover connecting surface. The fixed cover water-facing surface extends outward from the fixed cover peak point toward the back plate, and the fixed cover connecting surface is located on the other side of the fixed cover peak point and extends outward from the fixed cover peak point.

4. The wafer post-processing device according to claim 3, wherein: The peak point of the fixed cover is arranged opposite to the water-facing surface of the rotating cover, and the peak point of the rotating cover is arranged opposite to the water-facing surface of the fixed cover.

5. The wafer post-processing device according to claim 3, wherein: The inner side wall of the rear end of the fixed cover is provided with a fixed cover conical surface, which is inclined outward from the rear end of the fixed cover; the fixed cover conical surface is connected to the water-facing surface of the fixed cover at the rear end, and the inclination angle of the fixed cover conical surface is less than or equal to the inclination angle of the fixed cover water-facing surface.

6. The wafer post-processing device according to claim 1, wherein: The annular retaining ring gap is set in the groove; the size and setting position of the annular retaining ring match the size and setting position of the groove.

7. The wafer post-processing device according to claim 6, wherein: The outer side wall of the annular retaining ring is a tapered surface, which extends outward from the front end of the annular retaining ring.

8. The wafer post-processing device according to claim 1, wherein: There are multiple fixed cover drainage ports, which are arranged at intervals along the length direction of the fixed cover, and the fixed cover drainage ports are located at corresponding positions of the wave troughs of the blocking structure.

9. A wafer post-processing device, characterized in that: include: Box; A clamping assembly is provided in the box body, which can clamp the wafer horizontally and drive the wafer to rotate; A protective assembly is provided on the outer periphery of the clamping assembly, comprising a rotating cover and a fixed cover. The rotating cover is connected to the clamping assembly and is located on the outer periphery of the wafer to be processed. The fixed cover is concentrically provided on the outer side of the rotating cover. A groove is provided at the front end of the fixed cover, and an annular retaining ring is provided on the rotating cover accordingly. The rotating cover and the fixed cover form a corrugated blocking structure, and the protrusions of the two are staggered in the vertical direction to prevent the centrifugally scattered fluid from returning to the wafer surface.

10. The wafer post-processing device according to claim 9, wherein: The fixed cover is vertically connected to the back plate of the box body, and the back plate is provided with a fluid discharge port.

Images