Antenna unit, communication device, and method of manufacturing antenna unit

Abstract

The embodiment of the present application relates to the technical field of communication, and discloses an antenna unit, a communication device and a method for manufacturing an antenna unit, the antenna unit comprising a dielectric substrate, a resonator assembly, a decoupling structure, a ground plate and a feeding structure, the dielectric substrate comprising a first surface and a second surface arranged oppositely; the resonator assembly is arranged on the first surface; the decoupling structure is arranged on the resonator assembly; the ground plate is arranged on the second surface, and the ground plate is provided with a first gap for coupling with the resonator assembly; and the feeding structure is arranged on the second surface. In the above manner, the embodiment of the present application can reduce the coupling between the resonator assemblies and improve the performance of the antenna unit.

Description

Antenna elements, communication equipment, and methods for manufacturing antenna elements Technical Field

[0001] This application relates to the field of communication technology, and in particular to an antenna element, a communication device, and a method for manufacturing the antenna element. Background Technology

[0002] 5G millimeter-wave modules typically use an AIP (Antenna In-Package) approach, combining the RF chip with the substrate antenna to reduce RF system losses. This approach also results in higher integration and better performance. Electronic scanning is used to achieve high spatial coverage. The electronic scanning angle of the antenna element is determined by the spacing between the antenna elements. Typically, with a spacing of 0.5 wavelengths, the antenna scanning angle is around +50 degrees or -50 degrees.

[0003] In implementing the embodiments of this application, the inventors discovered that currently, in order to perform large-angle scanning, the spacing between antenna elements must be reduced. However, reducing the spacing between antenna elements can lead to increased coupling, which in turn can worsen the radiation characteristics of the antenna elements and reduce antenna performance. Summary of the Invention

[0004] The main technical problem addressed by the embodiments of this application is to provide an antenna unit that, by setting a decoupling structure, can improve the isolation between antenna units, thereby reducing the coupling between resonator components and improving the performance of the antenna unit.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: providing an antenna unit, including a dielectric substrate, a resonator assembly, a decoupling structure, a ground plane, and a feeding structure, wherein the dielectric substrate includes a first surface and a second surface disposed opposite to each other; the resonator assembly is disposed on the first surface; the decoupling structure is disposed on the resonator assembly; the ground plane is disposed on the second surface, and the ground plane is provided with a first gap for coupling with the resonator assembly; the feeding structure is disposed on the second surface.

[0006] Optionally, the decoupling structure includes a first metal component and a second metal component; the resonator assembly includes a first resonator and a second resonator, the first metal component is disposed on the first resonator, the second metal component is disposed on the second resonator, and the first metal component and the second metal component are disposed opposite to each other.

[0007] Optionally, the first resonator is provided with a first groove and a first opening, the second resonator is provided with a second groove and a second opening, and the first opening and the second opening are connected.

[0008] Optionally, the antenna unit further includes a first metal post, the first groove is provided with a first through hole, the first metal post is disposed in the first through hole, and one end of the first metal post abuts against the first resonator, and the other end of the first metal post abuts against the ground plane.

[0009] Optionally, the antenna unit further includes a second metal post, the second groove is provided with a second through hole, the second metal post is disposed in the second through hole, one end of the second metal post abuts against the second resonator, and the other end of the second metal post abuts against the ground plane.

[0010] Optionally, the decoupling structure further includes a third metal component and a fourth metal component. The third metal component is disposed on the first resonator, and the fourth metal component is disposed on the second resonator. The first metal component is disposed at one end of the first opening, and the third metal component is disposed at the other end of the first opening. The first metal component and the third metal component are disposed opposite to each other. The second metal component is disposed at one end of the second opening, and the fourth metal component is disposed at the other end of the second opening. The second metal component and the fourth metal component are disposed opposite to each other.

[0011] Optionally, the ground plane is further provided with a second gap, the first gap being coupled to the first resonator, and the second gap being coupled to the second resonator.

[0012] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is to provide a communication device including any of the antenna elements mentioned above.

[0013] To solve the above-mentioned technical problems, another technical solution adopted in this application embodiment is: providing a method for manufacturing an antenna element, including providing a dielectric substrate, a resonator assembly, a ground plane, and a feed structure, wherein the resonator assembly includes a first resonator and a second resonator, the first resonator and the second resonator are arranged opposite to each other, and the resonator assembly, the dielectric substrate, the ground plane, and the feed structure are stacked; providing a first metal part disposed on the first resonator; providing a second metal part disposed on the second resonator; hollowing out the first resonator to obtain a first groove, the first groove having a first opening; hollowing out the second resonator to obtain a second groove, the second groove having a second opening, and the first opening and the second opening being arranged opposite to each other to obtain the antenna element.

[0014] Optionally, the dielectric substrate is provided with a first through hole and a second through hole, and the method further includes: providing a first metal pillar and disposing the first metal pillar in the first through hole; providing a second metal pillar and disposing the second metal pillar in the second through hole to obtain the antenna element.

[0015] This application provides an antenna unit, including a dielectric substrate, a resonator assembly, a decoupling structure, a ground plane, and a feed structure. The dielectric substrate includes a first surface and a second surface disposed opposite to each other. The resonator assembly is disposed on the first surface. The decoupling structure is placed on the resonator assembly. The ground plane is disposed on the second surface and has a first gap for coupling with the resonator assembly. The feed structure is disposed on the second surface. By setting the decoupling structure, the isolation between antenna units can be improved, thereby reducing the coupling between resonator assemblies and improving the performance of the antenna unit. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0017] Figure 1 is a schematic diagram of the antenna element according to an embodiment of this application;

[0018] Figure 2 is an exploded view of the antenna element of an embodiment of this application;

[0019] Figure 3 is a schematic diagram of the antenna element from the rear view according to an embodiment of this application;

[0020] Figure 4 is a schematic diagram of the resonator assembly of the antenna unit according to an embodiment of this application;

[0021] Figure 5 is a schematic diagram of the decoupling structure of the antenna element in an embodiment of this application;

[0022] Figure 6 is another schematic diagram of the antenna element according to an embodiment of this application;

[0023] Figure 7 is a schematic diagram of the feeding structure of the antenna element in an embodiment of this application;

[0024] Figure 8 is a flowchart of the fabrication of the antenna unit according to an embodiment of this application;

[0025] Figure 9 is another flowchart of the fabrication of the antenna element according to an embodiment of this application;

[0026] Figure 10 shows the frequency diagram of the antenna element without the decoupling structure 30;

[0027] Figure 11 shows the isolation parameters of the antenna element when the decoupling structure 30 is not set;

[0028] Figure 12 shows the frequency diagram of the antenna element with decoupling structure 30;

[0029] Figure 13 shows the isolation parameters of the antenna element when the decoupling structure 30 is set;

[0030] Figure 14 shows the frequency diagram of the antenna element with the first groove 211 and the second groove 221;

[0031] Figure 15 shows the isolation parameters of the antenna element with the first groove 211 and the second groove 221.

[0032] Figure 16 shows the frequency diagram of the antenna element with the first metal pillar 50 and the second metal pillar 60 configured;

[0033] Figure 17 shows the isolation parameters of the antenna element with the first metal pillar 50 and the second metal pillar 60.

[0034] The reference numerals in the detailed embodiments are as follows: 100, antenna element; 10, dielectric substrate; 101, first surface; 102, second surface; 20, resonator assembly; 201, first resonator; 211, first groove; 212, first opening; 213, first through hole; 202, second resonator; 221, second groove; 222, second opening; 224, second through hole; 30, decoupling structure; 301, first metal component; 302, second metal component; 303, third metal component; 304, fourth metal component; 40, ground plane; 401, first gap; 402, second gap; 50, first metal pillar; 60, second metal pillar; 70, feed structure; 701, first feed branch; 702, second feed branch; 80, second dielectric substrate. Detailed Implementation

[0035] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0037] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0038] Please refer to Figures 1 to 3. The antenna unit 100 includes a dielectric substrate 10, a resonator assembly 20, a decoupling structure 30, a ground plane 40, and a feed structure 70. The dielectric substrate 10 includes a first surface 101 and a second surface 102 disposed opposite to each other. The resonator assembly 20 is disposed on the first surface 101, the decoupling structure 30 is disposed on the resonator assembly 20, and the ground plane 40 is disposed on the second surface 102. The ground plane 40 is provided with a first gap 401 for coupling with the resonator assembly 20. The feed structure 70 is disposed on the second surface 102. The antenna unit 100 feeds the resonator assembly 20 through the feed structure 70 and uses the electromagnetic field generated when microwaves propagate in the first gap 401 between the resonator assembly 20 and the dielectric substrate 10 to propagate signals, thereby realizing high-speed data transmission and high-frequency signal transmission. At the same time, the decoupling structure 30 is provided to improve the isolation between the resonator assemblies 20, reduce coupling, and thus improve the performance of the antenna unit 100.

[0039] Please refer to Figure 2 again. In this embodiment of the invention, the antenna unit 100 further includes a second dielectric substrate 80. The feeding structure 70 is disposed on the second dielectric substrate 80. The resonator assembly 20, dielectric substrate 10, ground plane 40, second dielectric substrate 10 and feeding structure 70 are stacked in sequence. The resonator assembly 20, dielectric substrate 10, ground plane 40, second dielectric substrate 80 and feeding structure 70 can be fixed by adhesive or welding to reduce the risk of the antenna unit 100 falling apart due to external forces.

[0040] Referring to Figure 4, the resonator assembly 20 includes a first resonator 201 and a second resonator 202, which are symmetrically arranged. The first resonator 201 is provided with a first groove 211 and a first opening 212. The second resonator 202 is provided with a second groove 221 and a second opening 222, and the first opening 212 and the second opening 222 are connected. By providing the first groove 211 and the second groove 221, the area with strong coupling of the resonator assembly 20 can be removed, thereby improving the isolation between the first resonator 201 and the second resonator 202, and the performance of the antenna unit 100 is better.

[0041] In this embodiment of the invention, the length, width and height of the first resonator 201 and the second resonator 202 are 0.63 x 0.45 x 0.03λ.

[0042] Referring to Figure 5, the decoupling structure 30 includes a first metal component 301, a second metal component 302, a third metal component 303, and a fourth metal component 304. The first metal component 301 is disposed on the first resonator 201, and the second metal component 302 is disposed on the second resonator 202. The first metal component 301 and the second metal component 302 are disposed opposite to each other. By disposing of the first metal component 301 and the second metal component 302, electromagnetic wave energy is coupled to the first metal component 301 and the second metal component 302 for radiation, thereby reducing the coupling between the first resonator 201 and the second resonator 202 and improving the isolation of the antenna unit 100. Furthermore, the third metal component 303 is disposed on the first resonator 201, and the fourth metal component 304 is disposed on the second resonator 202. The first metal component 301 is disposed at one end of the first opening 212, and the third metal component 303 is disposed at the other end of the first opening 212. The first metal component 301 and the third metal component 303 are disposed opposite to each other. The second metal component 302 is disposed at one end of the second opening 222, and the fourth metal component 304 is disposed at the other end of the second opening 222. The second metal component 302 and the fourth metal component 304 are disposed opposite to each other. By distributing the third metal component 303 and the fourth metal component 304, electromagnetic wave energy is coupled to the third metal component 303 and the fourth metal component 304 for radiation, thereby reducing the coupling between the first resonator 201 and the second resonator 202.

[0043] Please refer to Figures 5 and 6. The antenna unit 100 further includes a first metal post 50 and a second metal post 60. The first groove 211 is provided with a first through hole 213, and the second groove 221 is provided with a second through hole 224. The first metal post 50 is disposed in the first through hole 213, and one end of the first metal post 50 abuts against the first resonator 201, while the other end of the first metal post 50 abuts against the ground plane 40. The second metal post 60 is disposed in the second through hole 224, and one end of the second metal post 60 abuts against the second resonator 202, while the other end of the second metal post 60 abuts against the ground plane 40. By setting the first metal post 50 and the second metal post 60, the current direction of the ground plane 40 can be interfered with, thereby improving the isolation between the first resonator 201 and the second resonator 202 and enhancing the performance of the antenna unit 100.

[0044] In this embodiment of the invention, the size of the first through hole 213 and the second through hole 224 is 0.11λ×0.08λ×0.03λ.

[0045] Please refer to Figure 5 again. The ground plane 40 is also provided with a second gap 402. The first gap 401 is coupled to the first resonator 201, and the second gap 402 is coupled to the second resonator 202. By setting the first gap 401 to be coupled to the first resonator 201 and the second gap 402 to be coupled to the second resonator 202, the electromagnetic field generated when microwaves propagate in the first gap 401 between the first resonator 201, the second resonator 202 and the dielectric substrate 10 is used for signal propagation, realizing high-speed data transmission and high-frequency signal transmission. Since the signal is only transmitted in the first gap 401 and the second gap 402, the coupling feed between the first gap 401 and the first resonator 201 and the coupling feed between the second gap 402 and the second resonator 202 can reduce signal transmission loss and interference, enhance the high-speed transmission of the signal of the antenna unit 100, and at the same time have high-density confidentiality.

[0046] Referring to Figure 7, the feeding structure 70 includes a first feeding branch 701 and a second feeding branch 702. The first feeding branch 701 feeds the first resonator 201, and the second feeding branch 702 feeds the second resonator 202. The feeding structure 70 feeds the first resonator 201 and the second resonator 202 respectively. At the same time, in order to improve the isolation of the antenna element 100, a decoupling structure 30 is introduced between adjacent resonator components 20 on the same dielectric substrate 10. In some embodiments, by reasonably adjusting the structure and size of the decoupling structure 30 and reasonably arranging the positions of the antenna element 100 and the decoupling structure 30, a high degree of isolation between the antenna elements 100 can be achieved simultaneously in both low-frequency and high-frequency bands.

[0047] This application provides an antenna element 100, including a dielectric substrate 10, a resonator assembly 20, a decoupling structure 30, a ground plane 40, and a feed structure 70. The dielectric substrate 10 includes a first surface 101 and a second surface 102 disposed opposite to each other. The resonator assembly 20 is disposed on the first surface 101. The decoupling structure 30 is disposed on the resonator assembly 20. The ground plane 40 is disposed on the second surface 102 and has a first gap 401 for coupling with the resonator assembly 20. The feed structure 70 is disposed on the second surface 102. By providing the decoupling structure 30, the isolation between antenna elements 100 can be improved, thereby reducing the coupling between resonator assemblies 20 and improving the performance of the antenna element 100.

[0048] This application also provides embodiments of communication devices, which include the antenna unit 100 described above. For the specific structure and function of the communication devices, please refer to the above embodiments, which will not be repeated here.

[0049] Referring to Figure 8, this application also provides a method for manufacturing an antenna element 100, the method comprising:

[0050] Step S101: Provide a dielectric substrate 10, a resonator assembly 20, a ground plane 40, and a power supply structure 70, wherein the resonator assembly 20 includes a first resonator 201 and a second resonator 202, the first resonator 201 and the second resonator 202 are arranged opposite to each other, and the resonator assembly 20, the dielectric substrate 10, the ground plane 40 and the power supply structure 70 are stacked.

[0051] The ground plane 40 is provided with a first slot 401 for coupling with the resonator assembly 20. The antenna unit 100 feeds the resonator assembly 20 through the feeding structure 70. The electromagnetic field generated when microwaves propagate in the first slot 401 between the resonator assembly 20 and the dielectric substrate 10 is used for signal propagation, thereby realizing high-speed data transmission and high-frequency signal transmission.

[0052] Step S102: Provide a first metal component 301 and place it on the first resonator 201;

[0053] Step S103: Provide a second metal part 302 and dispose of it in the second resonator 202;

[0054] The first metal component 301 and the second metal component 302 are configured to couple electromagnetic wave energy to the first metal component 301 and the second metal component 302 for radiation, thereby reducing the coupling between the first resonator 201 and the second resonator 202.

[0055] Step S104: Hollow out the first resonator 201 to obtain a first groove 211, and the first groove 211 is provided with a first opening 212;

[0056] Step S105: Hollow out the second resonator 202 to obtain a second groove 221. The second groove 221 is provided with a second opening 222, and the first opening 212 and the second opening 222 are arranged opposite to each other to obtain the antenna unit 100.

[0057] Referring to Figure 9, the dielectric substrate 10 is provided with a first through-hole 213 and a second through-hole 224, and the method further includes:

[0058] Step S106: Provide a first metal post 50 and place the first metal post 50 in the first through hole 213;

[0059] Step S107: Provide a second metal post 60 and place the second metal post 60 in the second through hole 224 to obtain the antenna unit 100.

[0060] By placing the first metal post 50 in the first through hole 213 and the second metal post 60 in the second through hole 224, the current of the ground plane 40 can be interfered with, further improving the isolation between the first resonator 201 and the second resonator 202, thus making the performance of the antenna unit 100 better.

[0061] To help readers better understand the inventive concept of this application, the following comparative experiment is conducted on the antenna element 100:

[0062] Antenna element 100 is equipped with decoupling structure 30:

[0063] That is, when the antenna unit 100 is equipped with both the first resonator 201 and the second resonator 202, the antenna unit 100 is equipped with the above-mentioned decoupling structure 30, which is the decoupling state of the antenna unit 100.

[0064] As can be seen from Figures 10 and 11: Figure 10 is the frequency diagram of the antenna element without the decoupling structure 30, and Figure 11 is the isolation parameter diagram of the antenna element without the decoupling structure 30. When the antenna element 100 is without the decoupling structure 30, the S-parameters show a dual-frequency effect. However, it is found that the isolation of the antenna element 100 is in the range of 26-27.5 GHz and 28.5-30 GHz. Therefore, the S-parameters of the antenna element 100 cannot be used in these two frequency bands.

[0065] As can be seen from Figures 12 and 13: Figure 12 is the frequency diagram of the antenna element with decoupling structure 30 set, and Figure 13 is the isolation parameter diagram of the antenna element with decoupling structure 30 set. When the antenna element 100 adds decoupling structure 30, the isolation of the entire frequency band is only 28.3-29GHz, which is poor. The rest are good, but the S-parameter has been reduced.

[0066] As can be seen from Figures 14 and 15, Figure 14 is a frequency diagram of the antenna element with the first groove 211 and the second groove 221 set, and Figure 15 is an isolation parameter diagram of the antenna element with the first groove 211 and the second groove 221 set. After setting the first groove 211 and the second groove 221, it can be found that the S-parameters are improved and the antenna presents a broadband effect that can cover 24.5-29GHz, and the isolation is below -15dB in the 24-30GHz range.

[0067] As shown in Figures 16 and 17, Figure 16 is a frequency diagram of the antenna element with the first metal pillar 50 and the second metal pillar 60 set, and Figure 17 is an isolation parameter diagram of the antenna element with the first metal pillar 50 and the second metal pillar 60 set. After setting the first metal pillar 50 and the second metal pillar 60, the S-parameters of the antenna element 100 become wider, which can cover the frequency band of 24-29.6GHz, and the isolation is below -23dB in the 24-30GHz range.

[0068] This application provides a method for fabricating an antenna element 100, including providing a dielectric substrate 10, a resonator assembly 20, a ground plane 40, and a feed structure 70. The resonator assembly 20 includes a first resonator 201 and a second resonator 202, which are disposed opposite to each other. The resonator assembly 20, the dielectric substrate 10, the ground plane 40, and the feed structure 70 are stacked. Then, a first metal piece 301 is provided and disposed on the first resonator 201, and a second metal piece 302 is provided and disposed on the second resonator 201. The first resonator 201 is hollowed out to obtain a first groove 211, which has a first opening 212. Finally, the second resonator 202 is hollowed out to obtain a second groove 221, which has a second opening 222. The first opening 212 and the second opening 222 are arranged opposite to each other to obtain the antenna element 100. By setting the decoupling structure 30, the isolation between the antenna elements 100 can be improved, thereby reducing the coupling between the resonator components 20 and improving the performance of the antenna element 100.

[0069] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An antenna element, characterized in that, include: A dielectric substrate includes a first surface and a second surface disposed opposite to each other; a resonator assembly is disposed on the first surface; A decoupling structure is disposed on the resonator assembly, the decoupling structure including a first metal component and a second metal component; the resonator assembly includes a first resonator and a second resonator, the first metal component is disposed on the first resonator, the second metal component is disposed on the second resonator, and the first metal component and the second metal component are disposed opposite to each other; the first resonator is provided with a first groove and a first opening, the second resonator is provided with a second groove and a second opening, the first opening and the second opening are connected; a ground plane is disposed on the second surface, the ground plane is provided with a first gap for coupling with the resonator assembly; a power supply structure is disposed on the second surface; a first metal post, the first groove is provided with a first through hole, the first metal post is disposed in the first through hole, one end of the first metal post abuts against the first resonator, and the other end of the first metal post abuts against the ground plane; The second metal post is provided in the second groove with a second through hole. The second metal post is disposed in the second through hole. One end of the second metal post abuts against the second resonator, and the other end of the second metal post abuts against the ground plane.

2. The antenna element according to claim 1, characterized in that, The decoupling structure further includes a third metal component and a fourth metal component. The third metal component is disposed on the first resonator, and the fourth metal component is disposed on the second resonator. The first metal component is disposed at one end of the first opening, and the third metal component is disposed at the other end of the first opening. The first metal component and the third metal component are disposed opposite to each other. The second metal component is disposed at one end of the second opening, and the fourth metal component is disposed at the other end of the second opening. The second metal component and the fourth metal component are disposed opposite to each other.

3. The antenna element according to claim 2, characterized in that, The ground plane is also provided with a second gap, the first gap is coupled to the first resonator, and the second gap is coupled to the second resonator.

4. A communication device, characterized in that, Includes the antenna element as described in any one of claims 1-3.

5. A method for manufacturing an antenna element as described in any one of claims 1-3, characterized in that, include: A dielectric substrate, a resonator assembly, a ground plane, and a feeding structure are provided. The resonator assembly includes a first resonator and a second resonator, which are disposed opposite to each other. The resonator assembly, the dielectric substrate, the ground plane, and the feeding structure are stacked. A first metal component is provided and disposed on the first resonator. A second metal component is provided and disposed on the second resonator. The first resonator is hollowed out to obtain a first groove with a first opening. The second resonator is hollowed out to obtain a second groove with a second opening, and the first opening and the second opening are disposed opposite to each other to obtain the antenna element.

6. The method according to claim 5, characterized in that, The dielectric substrate is provided with a first through hole and a second through hole. The method further includes: providing a first metal pillar and disposing the first metal pillar in the first through hole; providing a second metal pillar and disposing the second metal pillar in the second through hole to obtain the antenna element.

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