Server node, server and cooling system

Abstract

The application discloses a server node, a server and a cooling system. The server node comprises a shell, a circuit board, a heat conduction member and a cooling working medium arranged in the shell. A first heat generating device is arranged on the circuit board. Particle members are arranged on a substrate of the first heat generating device. At least part of the particle members are not immersed in the liquid cooling working medium. Part of the heat conduction member is used for heat exchange with at least part of the particle members, and another part of the heat conduction member is used for heat exchange with the liquid cooling working medium. Through the foregoing structural arrangement, the heat dissipation problem of the heat generating device with the particle members on the server node is solved under the non-full immersion liquid cooling heat dissipation architecture, and the overall heat dissipation effect of the server node is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of servers, and in particular to a server node, a server and a cooling system. BACKGROUND

[0002] Under the background of national double carbon, the energy efficiency of data centers has become a hot topic. Improving the energy efficiency of data centers mainly lies in improving the efficiency of data center refrigeration. As one of the important components of data centers, the server node has become a research focus in improving the refrigeration efficiency.

[0003] In order to save the cost of cooling liquid, the current server node is cooled by using a non-full immersion liquid cooling heat dissipation architecture. However, for the memory stick on the server node, the memory stick has a large number of small particles, and the height of the memory stick is relatively high, so that the particles on the memory stick cannot be immersed in the cooling liquid. In this way, the heat generated by the particles can only be dissipated through conduction to the part of the memory stick immersed in the cooling liquid, and the heat cannot be dissipated in time, which also affects the overall heat dissipation effect of the memory stick. In addition, due to the small size of the particles, they are often ignored in the design of the heat dissipation architecture. For other electronic devices similar to the memory stick, the same problem of poor heat dissipation exists. SUMMARY

[0004] The embodiments of the present application provide a server node, a server and a cooling system. Through structural optimization, the present application provides a basis for solving the heat dissipation problem of the heat generating device with particles on the node under the non-full immersion liquid cooling heat dissipation architecture, so that the overall heat dissipation effect of the server node can be improved.

[0005] The first aspect of the present application provides a server node, comprising a shell, a circuit board, a heat conducting member and a cooling working medium; the circuit board, the heat conducting member and the cooling working medium are all arranged in the shell, and the cooling working medium is a liquid cooling working medium; the circuit board is provided with a first heat generating device, and the first heat generating device comprises a substrate and particles on the substrate, wherein at least part of the particles are not immersed in the liquid cooling working medium; a part of the heat conducting member is not immersed in the liquid cooling working medium, and another part of the heat conducting member is immersed in the liquid cooling working medium; the part of the heat conducting member is used for heat exchange with at least part of the particles, and the other part of the heat conducting member is used for heat exchange with the liquid cooling working medium, in other words, the heat conducting member is used for transferring the heat of at least part of the particles to the liquid cooling working medium. Here, the particles refer to electronic heat generating devices with relatively small size.

[0006] In actual applications, the shell is filled with liquid cooling medium, part of the heat conductor exchanges heat with the particle parts, and the other part is immersed in the liquid cooling medium. At least part of the particle parts on the first heating device that are not immersed in the liquid cooling medium can transfer heat to the liquid cooling medium through the heat conductor, thereby realizing heat dissipation of the particle parts that are not immersed in the liquid cooling medium; this structural setting, under a non-fully immersed liquid cooling heat dissipation architecture, can promptly dissipate the heat generated by the particle parts on the heating device that are not immersed in the liquid cooling medium, thereby solving the heat dissipation problem of the heating device with particle parts on the server node and improving the overall heat dissipation effect of the server node.

[0007] In one possible implementation, the heat conductor is a heat pipe, which includes at least one evaporation section and at least two condensation sections. The condensation section is connected to the evaporation section, with one portion of the heat conductor being the evaporation section and the other portion being the condensation section. The evaporation section is located above the liquid coolant, i.e., the evaporation section is not immersed in the liquid coolant, while the condensation section is immersed in the liquid coolant. The evaporation section of the heat pipe is used to exchange heat with particulate components that are not immersed in the liquid coolant, while the condensation section of the heat pipe is used to exchange heat with the liquid coolant. In actual applications, the condensation section of the heat pipe is immersed in the liquid coolant, and the heat from the particulate components that are not immersed in the liquid coolant is transferred to the evaporation section of the heat pipe, which then transfers the heat to the liquid coolant, thereby dissipating heat from the particulate components. Using a heat pipe for heat transfer can improve the efficiency of heat dissipation from the particulate components.

[0008] Exemplarily, the heat pipe has only one evaporation section and two condensation sections, and the two condensation sections are located on both sides of the evaporation section. The heat pipe as a whole is approximately in the shape of an "Ω" or a "J", which facilitates heat exchange between the evaporation section and the particle parts. The condensation section is in contact with the liquid cooling medium, which is beneficial for the heat pipe to transfer heat to the liquid cooling medium as quickly as possible.

[0009] In another possible implementation, the evaporation section of the heat pipe contacts at least some of the particle parts. In other words, the evaporation section of the heat pipe contacts the particle parts that are not immersed in the liquid cooling medium. That is, the evaporation section of the heat pipe and these particle parts achieve heat transfer through contact, which is conducive to the timely dissipation of heat from the particle parts.

[0010] In another possible implementation, a thermal pad is provided within the housing. The first heating device comprises multiple particles. The thermal pad is bonded to at least some of the particles, and the evaporation section of the heat pipe is in contact with the thermal pad. In other words, heat from the particles is transferred to the bonded thermal pad, and then to the heat pipe via the thermal pad. This arrangement can reduce the number of heat pipes required for a first heating device with a large number of particles. The thermal pad can simultaneously engage in heat exchange with multiple particles and transfer heat from the particles to the heat pipe, simplifying the structure and reducing costs.

[0011] In another possible implementation, the substrate of the first heat generating device has opposite first and second plate surfaces, and the first and second plate surfaces are both provided with particle members; the heat-conducting pad includes a first pad portion and a second pad portion, the first pad portion is attached to at least some of the particle members on the first plate surface, and the second pad portion is attached to at least some of the particle members on the second plate surface.

[0012] For example, the heat-conducting pad can be provided in one piece and the first and second pad portions can be formed by bending, so as to simplify the structure; for example, the heat-conducting pad can also be provided in two pieces, and the two pieces of the heat-conducting pad can form the first and second pad portions respectively, so as to make the arrangement more flexible and to enable each heat-conducting pad to be attached to more particle members as possible.

[0013] Further, the heat pipe includes a first heat pipe and a second heat pipe, the evaporation section of the first heat pipe is in contact with the first pad portion, and the evaporation section of the second heat pipe is in contact with the second pad portion. In this way, the particle members on the two plate surfaces of the first heat generating device can quickly dissipate heat through the heat-conducting pad and the heat pipe, so as to improve the heat dissipation efficiency.

[0014] In another possible implementation, the heat pipe, the heat-conducting pad, and the first heat generating device are fixed by a clamp. This fixing mode has high reliability, and it is convenient to replace the heat pipe or the heat-conducting pad and to change the relative positions of the heat pipe and the heat-conducting pad with respect to the substrate as needed.

[0015] In another possible implementation, the evaporation section has a planar portion for heat exchange with at least some of the particle members. In actual application, the planar portion of the evaporation section is in contact with the particle members or the heat-conducting pad, so as to increase the heat exchange area between the heat pipe and the particle members, thereby improving the heat dissipation efficiency of the server node.

[0016] In another possible implementation, the housing is further provided with a liquid inlet and a gas outlet, the liquid inlet is used to input the liquid cooling working medium, and the gas outlet is used to output the gaseous cooling working medium; the housing is further provided with a liquid spraying member, the liquid spraying member includes a liquid spraying pipe and a spraying head, the liquid spraying pipe is connected to the liquid inlet, and the spraying head is arranged on the liquid spraying pipe; the spraying head is used to spray the liquid cooling working medium into the housing. In this way, the liquid cooling working medium can dissipate heat from the heat generating device on the circuit board during the spraying process.

[0017] In another possible implementation, the circuit board is provided with a second heat generating device, the height of the second heat generating device is less than that of the first heat generating device, and the second heat generating device is immersed in the liquid cooling working medium. For example, the second heat generating device can be a CPU or a GPU chip.

[0018] In another possible implementation, the first heat generating device comprises a memory bank. The memory bank has a large number of particle devices, and the heat pipe structure can transfer the heat of all the particle devices on the memory bank to the liquid cooling working medium, thereby solving the problem of difficult heat dissipation of the memory bank in the existing non-full immersion liquid cooling heat dissipation frame.

[0019] The second aspect of the present application provides a server comprising a cabinet and a server node arranged in the cabinet, the server node being the server node of the first aspect, and the server node being arranged in the cabinet. The server comprises the server node described above, and the heat dissipation effect of the whole server can be improved. The server node can be arranged in the cabinet in a horizontal manner, and the integration degree is high, which is conducive to the improvement of the overall energy efficiency of the server.

[0020] The third aspect of the present application provides a cooling system comprising an external cooling component and a power component, and further comprising the server node of the first aspect or the server of the second aspect; wherein: the external cooling component, the power component and the server node are connected to form a circulation loop, the external cooling component is used to condense the gaseous cooling working medium discharged by the server node into liquid cooling working medium, and the power component is used to deliver the liquid cooling working medium to the server node. The cooling system can be provided for the single server node described above, or can be provided for the server described above, a circulation loop of the cooling working medium is established, the gaseous cooling working medium subjected to heat absorption and vaporization can be condensed, and the heat dissipation effect of the server node or the server can be guaranteed. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A structural schematic diagram of the server node provided by an embodiment of the present application is shown in the figure;

[0022] Figure 2 A structural schematic diagram of the first heat generating device in the embodiment is shown in the figure; Figure 1

[0023] A structural schematic diagram of the server node provided by another embodiment of the present application is shown in the figure; Figure 3

[0024] A structural schematic diagram of the server node provided by another embodiment of the present application is shown in the figure; Figure 4 Figure 3 A schematic diagram of the assembly relationship between the first heat generating device and the heat pipe and the heat conduction pad in the embodiment is shown in the figure;

[0025] Figure 5 A sectional view of the assembly relationship between the first heat generating device and the heat pipe and the heat conduction pad provided by the present application is shown in the figure;

[0026] Figure 6 A sectional view of the assembly relationship between the first heat generating device and the heat pipe and the heat conduction pad provided by the present application is shown in the figure;

[0027] Figure 7 A structural schematic diagram of the server provided by an embodiment of the present application is shown in the figure;​

[0028] Figure 8 A simplified structural diagram of a cooling system provided in one embodiment of the present application;

[0029] Figure 9 This is a simplified structural diagram of a cooling system provided in another embodiment of the present application. DETAILED DESCRIPTION

[0030] An embodiment of the present application provides a server node, which provides a basis for solving the problem of poor heat dissipation of some heating components in the server node by optimizing the structure of the server node, thereby improving the overall heat dissipation effect of the server node.

[0031] Please refer to Figure 1 , Figure 1 This is a simplified structural diagram of a server node provided in one embodiment of the present application.

[0032] In this embodiment, the server node 10 includes a shell 11, and a circuit board 12 is provided in the shell 11. Usually, a plurality of electronic devices are provided on the circuit board 12. These electronic devices generate heat during operation. In order to ensure the working stability of these electronic devices, these electronic devices need to be cooled.

[0033] The housing 11 has a liquid inlet 111 , which is used for the inflow of the cooling medium 20 , specifically, the inflow of the liquid cooling medium 20 a .

[0034] Please refer to Figure 2 In this embodiment, the electronic device on the circuit board 12 includes a first heating device 13. The first heating device 13 includes a substrate 131 and a particle component 132 provided on the substrate 131. The particle component 132 here refers to a device with a relatively small volume.

[0035] See also Figure 1 The liquid cooling medium 20a flows into the shell 11 through the liquid inlet 111, and has a certain liquid level in the shell 11. The specific height of the liquid level is determined according to the actual application requirements and is not limited. Generally speaking, the circuit board 12 can be immersed in the liquid cooling medium 20a, and the heat generated during its operation can be directly transferred to the liquid cooling medium 20a.

[0036] like Figure 1As shown, because the height of the first heat generating device 13 is high, the particle elements 132 thereon can not be immersed in the liquid cooling working medium 20a, and the server node 10 is further provided with a heat pipe 14, which comprises an evaporation section 141 and a condensation section 142, wherein the evaporation section 141 is in heat exchange with the aforementioned particle elements 132 not immersed in the liquid cooling working medium 20a, and the condensation section 142 is used for heat exchange with the liquid cooling working medium 20a. Specifically, the evaporation section 141 of the heat pipe 14 is in contact with the particle elements 132, and the condensation section 142 is immersed in the liquid cooling working medium 20a, that is, the heat of the particle elements 132 is directly transmitted to the evaporation section 141 of the heat pipe 14, and the evaporation section 141 further transmits the heat to the condensation section 142, so as to achieve heat dissipation of the particle elements 132 not immersed in the liquid cooling working medium 20a.

[0037] The above structure of the server node 10 provides a basis for heat dissipation of the particle elements 132 on the first heat generating device 13, and is suitable for the existing non-full immersion liquid cooling heat dissipation framework. For the server node 10 under the non-full immersion liquid cooling heat dissipation framework, the structure can solve the heat dissipation problem of the particle elements 132 not immersed in the cooling liquid, and can improve the overall heat dissipation effect of the server node.

[0038] For example, the first heat generating device 13 can be a memory bank. Generally, the memory bank has more particle elements 132, and the memory bank is inserted into the circuit board 12, so that the height of the memory bank is high, and the particle elements 132 cannot be immersed in the cooling liquid, and cannot be effectively and timely cooled. At this time, the above-mentioned related structure of the heat pipe 14 can be used to improve the heat dissipation efficiency of the particle elements 132 on the memory bank. The first heat generating device 13 can also be other electronic devices with similar requirements.

[0039] In actual application, the number of the heat pipes 14 is determined according to the number and arrangement of the particle elements 132 not immersed in the cooling liquid on the first heat generating device 13. For example, one heat pipe 14 can be matched with all the particle elements 132 not immersed in the cooling liquid on the first heat generating device 13, that is, the evaporation section 141 of one heat pipe 14 is in contact with all the particle elements 132 not immersed in the cooling liquid. If the arrangement of the particle elements 132 does not allow, multiple heat pipes can be arranged, and part of the particle elements 132 are matched with one heat pipe 14, and part of the particle elements 132 are matched with other heat pipes 14. Of course, all the particle elements 132 on the first heat generating device 13 can be matched with the heat pipes 14.

[0040] In actual operation, the heat pipe 14 can be bent so that the condensation section 142 is close to the circuit board 12, so as to be immersed in the liquid cooling working medium 20a and exchange heat with the liquid cooling working medium 20a.

[0041] Specifically, the heat pipe 14 includes an evaporation section 141 and two condensation sections 142. The condensation section 142 is connected to the evaporation section 141, and the two condensation sections 142 are located at both ends of the evaporation section 141. The evaporation section 141 is located above the liquid cooling medium 20a and is not immersed in the liquid cooling medium 20a. The two condensation sections 142 are arranged close to the circuit board 12 so as to be immersed in the liquid cooling medium 20a. Figure 1 As shown, the shape of the heat pipe 14 can be understood as approximately an "Ω" shape, or a "J" shape. This structural setting can facilitate the contact between the condensation section 142 of the heat pipe and the liquid cooling medium 20a, which is beneficial for the heat pipe 14 to transfer the heat absorbed by the particle members 132 to the liquid cooling medium 20a as quickly as possible.

[0042] Of course, the number of evaporation sections 141 and the number of condensation sections 142 of the heat pipe 14, as well as the shape of the heat pipe 14 are not limited to Figure 1 As shown in , in other embodiments, the heat pipe 14 may also adopt other shapes, such as Z-shape or S-shape.

[0043] Specifically, the evaporator section 141 of the heat pipe 14 can be provided with a flat portion. The evaporator section 141 contacts the particle members 132 via the flat portion, thereby increasing the contact area between the evaporator section 141 and the particle members 132 and improving the heat dissipation efficiency of the particle members 132. If the heat pipe 14 is a circular tube, the evaporator section 141 can be flattened to form a flat tube. This flat portion allows the condenser section 142 of the heat pipe 14 to remain a circular tube, ensuring effective heat dissipation. Of course, the heat pipe 14 can also be entirely a flat tube.

[0044] During actual setting, the heat pipe 14 can be fixed relative to the first heating device 13 by means of a clamp or the like. Specifically, one heat pipe 14 can be fixed to the first heating device 13 by one clamp, or by two or more clamps. Two or more heat pipes 14 can be fixed to the first heating device 13 by sharing one clamp, or by sharing two or more clamps. The heat pipe 14 can be adaptively adjusted according to actual setting requirements.

[0045] Figure 1 The structure of a first heating device 13 is exemplarily illustrated in the figure. It can be understood that in actual settings, the number of first heating devices 13 on the circuit board 12 can be multiple, and the first heating devices 13 are not necessarily of the same type or structure. For each first heating device 13, the heat pipe 14 can be matched and set according to the heat dissipation needs of the particle parts 132 thereon.

[0046] The server node 10 of this embodiment can be used in a two-phase jet heat dissipation architecture. Figure 1In this embodiment, the cooling medium 20 is taken as an example of an insulating phase change medium, which can be a non-conductive fluorinated liquid with a normal boiling point of 30-60℃, i.e., the cooling medium 20 can be vaporized into a gaseous form after absorbing heat and can be liquefied into a liquid form after releasing heat.

[0047] To adapt to the heat dissipation architecture of the two-phase jet, the shell 11 of the server node 10 further has an air outlet 112 to facilitate the discharge of the gaseous cooling medium 20b after absorbing heat and vaporizing, so as to avoid the security risks caused by excessive pressure in the shell 11. The shell 11 of the server node 10 is provided with a liquid spraying component 17 for spraying the liquid cooling medium 20a. Figure 1 The gaseous cooling medium 20b is schematically shown in the form of a circle.

[0048] In the illustrated scheme, the liquid spraying component 17 includes a liquid spraying pipe 171 and a spraying head 172. The liquid spraying pipe 171 is connected to the liquid inlet 111 of the shell 11, and the spraying head 172 is arranged on the liquid spraying pipe 171 to spray the liquid cooling medium 20a into the shell 11. In this way, the spraying head 172 can dissipate heat from the heat generating device of the circuit board 12 during the spraying of the liquid cooling medium 20a.

[0049] The circuit board 12 is further provided with a second heat generating device 18. The height of the second heat generating device 18 is less than that of the first heat generating device 13. The second heat generating device 18 can be, for example, a CPU (central processing unit) or a GPU (graphics processing unit), and can also be a power chip, a network card chip, or a resistor, capacitor, or inductor. Generally, the second heat generating device 18 can be immersed in the liquid cooling medium 20a. When being arranged, the position of the spraying head 172 can be aligned with other heat generating devices on the circuit board 12 that cannot be completely immersed in the liquid cooling medium 20a, so as to ensure the heat dissipation effect of these heat generating devices.

[0050] Figure 1 The structure of one second heat generating device 18 is schematically shown in the figure. It can be understood that the number of second heat generating devices 18 on the circuit board 12 can be multiple in actual arrangement, and each second heat generating device 18 does not necessarily have to be the same type or size of device.

[0051] Figure 3 The structure in which one spraying head 172 is arranged on the liquid spraying pipe 171 is only schematically shown in the figure. It can be understood that the number and position of the spraying heads 172 can be adaptively adjusted in combination with the specific heat dissipation requirements and the arrangement cost in actual application, and are not limited to those shown in the figure.

[0052] The above embodiments can be modified, for example, the heat pipe 14 is replaced by another heat conducting member having heat conducting performance, a part of the heat conducting member is not immersed in the liquid cooling medium 20a, another part of the heat conducting member is immersed in the liquid cooling medium 20a, a part of the heat conducting member exchanges heat with the particle member 132, and another part of the heat conducting member exchanges heat with the liquid cooling medium 20a, and the heat of the particle member 132 can also be conducted to the liquid cooling medium 20a; for another example, the server node 10 can also be used in a single-phase liquid cooling heat dissipation structure, at this time, the above-mentioned gas outlet 112 is cancelled on the shell 11, and a liquid outlet is arranged, and the cooling liquid absorbing heat and being heated can be discharged out of the shell in cooperation with an external device, and the low-temperature cooling liquid can be transported into the shell 11 from the liquid inlet 111.

[0053] Please refer to Figure 4 and Figure 3 , Figure 4 a structure diagram of a server node provided by another embodiment of the present application; Figure 3 for Figure 3 a first heat generating member and a heat pipe and a heat conducting pad are assembled in a simple diagram.

[0054] Figure 1 The embodiment shown is basically the same as the above-mentioned Figure 1 The embodiment shown is basically the same as the above-mentioned Figure 1 The difference is that the heat exchange mode of the heat pipe 14 and the particle member 132 of the first heat generating member 13 is different, and only the difference will be described in detail below, and other parts can be referred to the above-mentioned description of the

[0055] In the embodiment, the server node 10 is provided with the heat conducting pad 15, the heat conducting pad 15 is attached to the particle member 132 on the first heat generating member 13, and the evaporation section 141 of the heat pipe 14 is in contact with the heat conducting pad 15, that is, the heat of the particle member 132 is first conducted to the heat conducting pad 15, then conducted to the evaporation section 141 of the heat pipe 14 through the heat conducting pad 15, and finally conducted to the liquid cooling medium 20a through the condensation section 142 of the heat pipe 14.

[0056] When the particle member 132 on the first heat generating member 13 is provided with a plurality of particle members 132, the heat conducting pad 15 is attached to at least part of the particle members 132, so that one heat pipe 14 can be provided for these particle members 132 attached to the heat conducting pad 15; of course, according to the heat dissipation requirement, two or more heat pipes 14 can be provided in cooperation with the heat conducting pad 15.

[0057] Specifically, the heat conducting pad 15 can be attached to all the particle members 132 on the first heat generating member 13, or can be attached to only the particle members 132 that cannot be immersed in the liquid cooling medium 20a.

[0058] Specifically, the heat pipe 14 , the thermal pad 15 and the substrate 131 of the first heating device 13 may be fixed by a clamp 16 .

[0059] In this embodiment, the structure of the heat pipe 14 can also refer to the aforementioned Figure 5 The embodiment shown is arranged such that the heat pipe 14 as a whole may also be in an "Ω" shape or a "J" shape, and its evaporation section 141 is also provided with a flat portion, which may be in surface contact with the thermal pad 15 to increase the heat conduction area and improve the heat dissipation efficiency.

[0060] Based on the structure of the first heating element 13 , the heat pipe 14 and the thermal pad 15 that cooperate with the particle member 132 of the first heating element 13 may have various forms.

[0061] Please refer to Figure 4 ,contrast Figure 5 and Figure 5 I understand. Figure 4 The viewing angle shown is Figure 5 The substrate 131 of the first heating element 13 has a first plate surface 1311 and a second plate surface 1312 opposite to each other. The first plate surface 1311 and the second plate surface 1312 are both provided with particle members 132. Figure 5 In the illustrated scheme, a thermal pad 15 is provided, which is bent to form a first gasket 151 and a second gasket 152. The first gasket 151 is in contact with the granular parts 132 on the first plate surface 1311, and the second gasket 152 is in contact with the granular parts 132 on the second plate surface 1312. The first gasket 151 is in contact with the evaporation section 141 of one heat pipe 14, and the second gasket 152 is in contact with the evaporation section 141 of another heat pipe 14. In this way, it is ensured that the granular parts 132 on both sides of the substrate 131 of the first heating device 13 can achieve heat dissipation.

[0062] Of course, in Figure 6 On the basis of this, according to the heat dissipation requirements, the first gasket 151 and the second gasket 152 can also be respectively matched with more than two heat pipes 14.

[0063] Please refer to Figure 6 , Figure 5 The viewing angle shown is Figure 6 The first plate surface 1311 and the second plate surface 1312 of the substrate 131 of the first heating element 13 are both provided with particles. Figure 6 In the illustrated embodiment, two thermal pads 15 are provided, one of which is in contact with the particle members 132 on the first plate surface 1311, and the other is in contact with the particle members 132 on the second plate surface 1312. In this embodiment, each thermal pad 15 is in contact with the evaporation section 141 of a heat pipe 14. In this way, it can be ensured that the particle members 132 on both sides of the substrate 131 of the first heating device 13 can achieve heat dissipation.

[0064] In practical applications, Figure 6 The scheme shown can be applicable to the first heat generating device 13 structure in which the particle pieces 132 on the first plate surface 1311 and the second plate surface 1312 do not correspond, that is, if a heat-conducting pad 15 is used in a bent form, the particle pieces 132 on one of the plate surfaces cannot be covered, at this time, the scheme shown in which two relatively independent heat-conducting pads 15 can be used. Of course, Figure 6 The scheme shown is not limited to this case. Figure 6

[0065] Similarly, on the basis of the scheme shown, each heat-conducting pad 15 can also be matched with two or more heat pipes 14 to meet the case in which the heat dissipation demand is large, and the heat can be conducted to the liquid cooling working medium 20a in time through the heat pipe 14. Figure 5 As shown in

[0066] and Figure 6 In actual arrangement, the heat-conducting pad 15, the heat pipe 14 and the first heat generating device 13 can be fixed through the clamp 16, and the form of the clamp 16 is not limited as long as it can clamp the heat-conducting pad 15, the heat pipe 14 and the first heat generating device 13. In specific arrangement, the number of the clamp 16 is not limited, and the clamping demand can be met. Figure 7 In other embodiments, the first heat generating device 13 can be provided with the heat-conducting pad 15 only on one plate surface, and the other plate surface can not be provided with the heat-conducting pad 15.

[0067] The embodiments of the application also provide a server, please refer to

[0068] It is understood that Figure 7 is a simple schematic diagram of the server structure, and the size or proportion relationship between the actual structures is not limited. Figure 8 In the embodiments, the server 100 includes a cabinet 102 and a server node 10 arranged in the cabinet 102, wherein the server node 10 is the server node 10 described in the first aspect, and the specific structure and composition can be understood with reference to the server node 10 described in the first aspect. The embodiments will not be repeated here.

[0069] In the server 100, the overall heat dissipation effect of each server node 10 can be guaranteed, so that the overall heat dissipation efficiency of the server 100 is guaranteed, which is beneficial to improve the energy efficiency of the server 100.

[0070]

[0071] ​​Specifically, the server nodes 10 can be arranged in the cabinet 102 in a horizontal manner. Generally, the server nodes 10 are flat box structures, and when arranged horizontally, the circuit boards 12 of the server nodes 10 are substantially in the horizontal plane. In this way, the server nodes 10 have a smaller size in the vertical direction, so that the same cabinet 102 can accommodate relatively more server nodes 10, and the integration of the server 100 is high, which is also conducive to improving the energy efficiency.

[0072] The embodiment of the present application also provides a cooling system.

[0073] Please refer to Figure 8 , Figure 8 The structural schematic diagram of the cooling system provided by the embodiment of the present application is shown.

[0074] In the embodiment, the cooling system comprises the server node 10, the external cooling component 30 and the power component 40. The server node 10 is the server node 10 described in the first aspect, and its specific structural composition can be understood with reference to the server node 10 described in the embodiments of the first aspect, which will not be repeated here.

[0075] It should be noted that Figure 1 The server node 10 shown in the figure is the server node 10 described in the foregoing Figure 3 The structure of the server node 10 shown in the figure can be understood as that it can also be the structure of the server node 10 in the foregoing Figure 1 or the server node 10 in the other embodiments.

[0076] In combination Figure 9 , in the embodiment, the server node 10, the external cooling component 30 and the power component 40 are connected to form a circulation loop. Specifically, the external cooling component 30 is connected with the gas outlet 112 of the server node 10, and the gaseous cooling working medium 20b in the shell 11 that is vaporized due to heat absorption can be discharged out of the shell 11 through the gas outlet 112 and enter the external cooling component 30 to be condensed, and after being converted into the liquid cooling working medium 20a, it is transported to the shell 11 of the server node 10 through the power component 40, so as to realize the recycling of the cooling working medium 20, thereby saving the cost. Obviously, the power component 40 is used to transport the liquid cooling working medium 20a to the server node 10.

[0077] Please refer to Figure 9 , Figure 9 The structural schematic diagram of the cooling system provided by another embodiment of the present application is shown.

[0078] In this embodiment, the cooling system comprises a server 100, an external cooling component 30 and a power component 40, wherein the server 100 is the server 100 provided in the second aspect, the server 100 is provided with a plurality of server nodes 10, the external cooling component 30, the power component 40 and the server 100 are connected to form a circulation loop, the external cooling component 30 is used to condense the gaseous cooling working medium discharged by the server nodes 10 in the server 100 into liquid cooling working medium, and the power component 40 is used to deliver the liquid cooling working medium to the server nodes 10 in the server 100.

[0079] Figure 8 In the example shown, one external cooling component 30 and one power component 40 are provided, the gas outlets of all the server nodes 10 in the server 100 are connected to the external cooling component 30, that is, the external cooling component 30 is used to condense the gaseous cooling working medium of all the server nodes 10, and the liquid cooling working medium is pumped by the power component 40 and then flows into the liquid inlets of the server nodes 10, respectively, that is, the server nodes 10 in the server 100 are connected to the pipelines of the external cooling component 30 and the power component 40 in parallel.

[0080] In other embodiments, according to application requirements, the server 100 can be matched with two or more external cooling components 30 or two or more power components 40, and two or more circulation loops can be formed according to the number of server nodes 10 and the heat dissipation requirements.

[0081] In Figure 9 and ​ In the example shown, the power component 40 can be in the form of a circulating pump or a booster pump.

[0082] The principles and implementation modes of the present application are described by using specific examples in this paper, and the above description of the examples is only used to help understand the method of the present application. It should be noted that for ordinary skilled persons in the technical field, some improvements and modifications can be made to the present application without departing from the principles of the embodiments of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A server node, characterized by The application relates to a server node and a server. The server node comprises a shell, a circuit board, a heat-conducting member and a cooling medium in the shell, wherein the cooling medium comprises liquid cooling medium. The circuit board is provided with a first heat-generating device, the first heat-generating device comprises a substrate and particle members on the substrate, at least part of the particle members are not immersed in the liquid cooling medium, and the first heat-generating device comprises a memory bank. Part of the heat-conducting member is not immersed in the liquid cooling medium, and another part of the heat-conducting member is immersed in the liquid cooling medium; part of the heat-conducting member is used for heat exchange with the at least part of the particle members; and another part of the heat-conducting member is used for heat exchange with the liquid cooling medium. The heat-conducting member is a heat pipe, the heat pipe comprises at least one evaporation section and at least two condensation sections, the condensation sections are connected with the evaporation section, part of the heat-conducting member is the evaporation section, and another part of the heat-conducting member is the condensation section. The evaporation section is used for heat exchange with the at least part of the particle members, and the condensation section is used for heat exchange with the liquid cooling medium.

2. The server node of claim 1, wherein, The evaporation section is in contact with the at least part of the particle members.

3. The server node of claim 1 or 2, wherein, The shell is provided with a heat-conducting pad, the particle members are multiple, the heat-conducting pad is attached to the at least part of the particle members, and the evaporation section of the heat pipe is in contact with the heat-conducting pad.

4. The server node of claim 3, wherein, The substrate has opposite first and second plate surfaces, the first and second plate surfaces are provided with particle members, the heat-conducting pad comprises first and second pad parts, the first pad part is attached to at least part of the particle members arranged on the first plate surface, and the second pad part is attached to at least part of the particle members arranged on the second plate surface.

5. The server node of claim 4, wherein, The heat pipe comprises first and second heat pipes, the evaporation section of the first heat pipe is in contact with the first pad part, and the evaporation section of the second heat pipe is in contact with the second pad part.

6. The server node of claim 3, wherein, The heat pipe, the heat-conducting pad and the first heat-generating device are fixed by a clamp.

7. The server node of claim 1 or 2, wherein, The evaporation section has a planar part used for heat exchange with the at least part of the particle members.

8. The server node of claim 1 or 2, wherein, The shell is further provided with a liquid inlet and a gas outlet, the liquid inlet is used for inputting the liquid cooling medium, and the gas outlet is used for outputting gaseous cooling medium. The shell is further provided with a liquid spraying part, the liquid spraying part comprises a liquid spraying pipe and a spraying head, the liquid spraying pipe is connected with the liquid inlet, and the spraying head is arranged on the liquid spraying pipe; and the spraying head is used for spraying the liquid cooling medium into the shell.

9. A server, characterized by The server comprises a cabinet and a server node arranged in the cabinet, wherein the server node is the server node as claimed in any one of claims 1-8, and the server node is arranged in the cabinet.

10. A cooling system characterized by, The server comprises an external cooling part and a power part, and further comprises the server node as claimed in any one of claims 1-8 or the server as claimed in claim 9, wherein: The external cooling part, the power part and the server node are connected to form a circulation loop, the external cooling part is used for condensing gaseous cooling medium discharged by the server node into liquid cooling medium, and the power part is used for delivering the liquid cooling medium to the server node.

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