Method for reducing wafer defects by optimizing single-side grinding machine wheel replacement steps

Abstract

The present application relates to a kind of methods for reducing silicon wafer defects by optimizing single surface grinding machine grinding wheel replacement step, the technical field of the silicon wafer processing, including the following operating steps: first step: single surface grinding machine is powered off, first replace cooling water.Second step: single surface grinding machine is powered on, then through the adsorption disc on driving mechanical arm suction polishing plate.Third step: driving mechanical arm drives polishing plate and single surface grinding machine interface.Fourth step: input new grinding wheel size, then disassemble old grinding wheel and clean baffle.Fifth step: install new grinding wheel, and polish new grinding wheel by polishing plate.Sixth step: place silicon wafer on silicon wafer tray, try to polish a round.Before disassembling grinding wheel, first the two table surfaces of machine are cleaned with the size like polishing plate of table surface with vacuum adsorption, so that when disassembling grinding wheel cleaning grinding wheel device, silicon chip will not fall on table surface, adhere to table surface and affect silicon wafer quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer processing, in particular to a method for reducing silicon wafer defects by optimizing single-side grinding machine wheel replacement steps. BACKGROUND

[0002] Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, and domestic wafer production lines mainly use 8-inch and 12-inch wafers. In the grinding process of 12-inch wafers, the main machine used is a Disco single-side grinding machine (DFG8360), which is used to thin the silicon wafer and reduce the damage layer caused by the previous process.

[0003] However, due to the shortcomings of the machine itself, silicon chips and diamond particles in the wheel will fall and adhere to the processing table during the wheel replacement process. If not cleaned in time, the particles will form a pit on the back surface of the silicon wafer, affecting the flatness (GBIR) of the silicon wafer. The larger the value, the worse the flatness of the silicon wafer, resulting in a decrease in the quality of the silicon wafer. Therefore, it is important to prevent silicon chips and diamond particles from falling onto the table and adhering to improve the quality and yield of the processed product.

[0004] During the current wheel replacement process, silicon chips, diamond particles in the wheel, and other materials will fall onto the table when the old wheel is removed. During processing, the silicon wafer will have defects due to the presence of hard objects on the table. Therefore, it is important to prevent silicon chips and other materials from falling onto the table. SUMMARY

[0005] The present application mainly solves the problems existing in the prior art and provides a method for reducing silicon wafer defects by optimizing single-side grinding machine wheel replacement steps. Before disassembling the wheel, the two tables of the machine are first cleaned with a polishing plate of the same size as the table using a vacuum suction. This prevents silicon chips from falling onto the table during the disassembly and cleaning of the wheel device, which affects the quality of the silicon wafer.

[0006] The above technical problems of the present application are mainly solved by the following technical scheme:

[0007] A method for reducing silicon wafer defects by optimizing single-side grinding machine wheel replacement steps, the single-side grinding machine wheel structure includes a silicon wafer tray, a wheel rotating shaft is arranged above the silicon wafer tray, a wheel is arranged between the lower end of the wheel rotating shaft and the silicon wafer tray, a polishing plate is arranged on the side of the wheel, a driving mechanical arm is arranged at the rear end of the polishing plate, and a suction disc is arranged between the driving mechanical arm and the polishing plate.

[0008] The method for reducing silicon wafer defects by optimizing single-side grinding machine wheel replacement steps includes the following operation steps:

[0009] Step 1: After the single-side grinding machine is turned off, replace the cooling water first.

[0010] Second step: Turn on the single surface grinding machine, then use the suction plate on the mechanical arm to suck the polishing plate.

[0011] Third step: Use the mechanical arm to drive the polishing plate to connect with the single surface grinding machine.

[0012] Fourth step: Input the new grinding wheel size, then disassemble the old grinding wheel and clean the baffle.

[0013] Fifth step: Install the new grinding wheel and polish it with the polishing plate.

[0014] Sixth step: Place the silicon wafer on the silicon wafer tray and try to polish it.

[0015] As a preferred embodiment, before disassembling the grinding wheel, use a clean polishing plate with a size similar to the table surface to vacuum adsorb the two table surfaces of the machine.

[0016] As a preferred embodiment, the thickness of the polishing plate is 0.9mm-1.1mm.

[0017] As a preferred embodiment, during the disassembly of the grinding wheel, the silicon dust or diamond particles in the grinding wheel will be isolated from the table surface by the polishing plate, preventing them from adhering to the table surface and affecting the quality of the silicon wafer.

[0018] The present application can achieve the following effects:

[0019] The present application provides a method for reducing silicon wafer defects by optimizing the single surface grinding machine grinding wheel replacement steps. Compared with the prior art, before disassembling the grinding wheel, use a clean polishing plate with a size similar to the table surface to vacuum adsorb the two table surfaces of the machine, so that during the disassembly and cleaning of the grinding wheel device, silicon dust will not fall onto the table surface and adhere to the table surface, affecting the quality of the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a structural schematic diagram of the present application.

[0021] In the figure: driving mechanical arm 1, suction plate 2, polishing plate 3, grinding wheel shaft 4, grinding wheel 5, silicon wafer tray 6. DETAILED DESCRIPTION

[0022] The technical solutions of the present application will be further described in detail below, combined with the drawings.

[0023] Example: As Figure 1As shown, a method for reducing wafer defects by optimizing the single-sided grinding machine wheel replacement step, the single-sided grinding machine wheel structure includes a wafer tray 6, a grinding wheel shaft 4 is arranged above the wafer tray 6, a grinding wheel 5 is arranged between the lower end of the grinding wheel shaft 4 and the wafer tray 6, a polishing plate 3 is arranged on the side of the grinding wheel 5, a driving mechanical arm 1 is arranged at the rear end of the polishing plate 3, and a suction disc 2 is arranged between the driving mechanical arm 1 and the polishing plate 3.

[0024] The method for reducing wafer defects by optimizing the single-sided grinding machine wheel replacement step comprises the following operation steps:

[0025] Step 1: After the single-sided grinding machine is turned off, the cooling water is replaced first.

[0026] Step 2: The single-sided grinding machine is turned on, and then the polishing plate 3 is sucked by the suction disc 2 on the driving mechanical arm 1.

[0027] Before disassembling the grinding wheel, the two table surfaces of the machine are vacuum-sucked by the clean polishing plate 3 with a size similar to the table surface. The thickness of the polishing plate 3 is 1.0 mm.

[0028] Step 3: The driving mechanical arm 1 drives the polishing plate 3 to be connected with the single-sided grinding machine.

[0029] Step 4: The height of the new grinding wheel 5 is input, and then the old grinding wheel 5 is disassembled and the baffle is cleaned. During the disassembly of the grinding wheel, the silicon chips or diamond particles in the grinding wheel are isolated from the table surface by the polishing plate 3, so as to prevent them from adhering to the table surface and affecting the quality of the wafer.

[0030] Step 5: The new grinding wheel 5 is installed, and the new grinding wheel 5 is polished by the polishing plate 3.

[0031] Step 6: The wafer is placed on the wafer tray 6, and a round of polishing is tried.

[0032] As described above, the method for reducing wafer defects by optimizing the single-sided grinding machine wheel replacement step first vacuum-sucks the two table surfaces of the machine with clean polishing plates with a size similar to the table surface before disassembling the grinding wheel, so that silicon chips do not fall on the table surface during the disassembly and cleaning of the grinding wheel device, and adhere to the table surface to affect the quality of the wafer.

[0033] The above description is only a specific embodiment of the present application, but the structural characteristics of the present application are not limited to this. Any changes or modifications made by those skilled in the art within the scope of the present application are covered by the patent scope of the present application.

Claims

1. A method for reducing silicon wafer defects by optimizing the grinding wheel replacement steps of a single-sided grinding machine, characterized in that: The grinding wheel structure of the single-sided grinding machine includes a silicon wafer tray (6), a grinding wheel shaft (4) is provided above the silicon wafer tray (6), a grinding wheel (5) is provided between the lower end of the grinding wheel shaft (4) and the silicon wafer tray (6), a grinding plate (3) is provided on the side of the grinding wheel (5), a driving mechanical arm (1) is provided at the rear end of the grinding plate (3), and an adsorption plate (2) is provided between the driving mechanical arm (1) and the grinding plate (3). Methods to reduce silicon wafer defects by optimizing the grinding wheel replacement process of a single-sided grinding machine include the following steps: Step 1: After shutting down the machine for single-sided grinding, replace the cooling water first; Step 2: Start the single-sided grinding machine and then pick up the grinding plate (3) by the suction plate (2) on the drive robotic arm (1). Before disassembling the grinding wheel, vacuum adsorb the two tables of the machine with a clean grinding plate (3) of the same size as the table and an adsorption plate (2); Step 3: Drive the robotic arm (1) to drive the grinding plate (3) to connect with the single-sided grinding machine; Step 4: Input the new grinding wheel (5) feet high, then remove the old grinding wheel (5) and clean the baffle; During the disassembly of the grinding wheel, silicon chips or diamond particles in the grinding wheel will be isolated outside the table due to the presence of the grinding plate (3), preventing them from adhering to the table and thus affecting the quality of the silicon wafer. Step 5: Install the new grinding wheel (5) and grind the new grinding wheel (5) using the grinding plate (3); Step 6: Place the silicon wafer on the silicon wafer tray (6) and perform a trial polishing.

2. The method for reducing silicon wafer defects by optimizing the grinding wheel replacement steps of a single-sided grinding machine according to claim 1, characterized in that: The thickness of the grinding plate (3) is 0.9mm to 1.1mm.

Images