Spray plate temperature control device, temperature control method and semiconductor coating equipment

Abstract

The present invention provides a spray plate temperature control device, a semiconductor coating equipment, a spray plate temperature control method and a computer-readable storage medium. The spray plate temperature control device includes a cold source, an adjustment ring and a distance adjustment mechanism. The cold source has a cold source temperature that is not higher than the target temperature of the spray plate. The adjustment ring is made of a heat-conducting material and is fixedly mounted on the top of the spray plate. The distance adjustment mechanism includes an insulation liquid inlet and outlet and a receiving cavity, wherein the insulation liquid inlet and outlet are connected to the receiving cavity, the bottom of the receiving cavity is heat-conductingly connected to the top of the adjustment ring, and the top of the receiving cavity is heat-conductingly connected to the bottom of the cold source, and the receiving cavity expands and contracts in a direction away from or close to the adjustment ring as the insulation liquid flows in or out, so as to adjust the heat dissipation efficiency of the cold source to the spray plate, and control the actual temperature of the spray plate to the target temperature.

Description

Technical Field

[0001] The present invention relates to a processing technology of semiconductor devices, and in particular to a spray plate temperature control device, a semiconductor coating equipment, a spray plate temperature control method, and a computer-readable storage medium. Background Art

[0002] The spray plate is a device used to provide a suitable reaction temperature for semiconductor wafers and is widely used in the processing of semiconductor devices. With the continuous advancement of semiconductor coating technology, the spray plate has increasingly stringent control requirements for temperature. Common spray plate heating methods include oil heating, electric heating, etc., and common spray plate cooling methods include air cooling, water cooling, etc. At different stages of the processing process, the semiconductor coating equipment needs to achieve different functions of heating or cooling, and the spray plate needs to provide different functions of heat preservation or heat dissipation accordingly. However, the existing spray plate only has a heat dissipation function and cannot achieve heat preservation during the heating stage, thereby reducing the heating efficiency of the semiconductor coating equipment.

[0003] In order to overcome the above-mentioned defects of the prior art, the art is in urgent need of an improved spray plate temperature control device for flexibly switching between the two functions of heat preservation and heat dissipation to improve the temperature control accuracy and cooling efficiency of semiconductor coating equipment. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a spray plate temperature control device, a semiconductor coating equipment, a spray plate temperature control method and a computer-readable storage medium. By using a distance adjustment mechanism to adjust the distance between the cold source and the top of the spray plate, the heat dissipation efficiency of the cold source to the spray plate can be adjusted, thereby flexibly switching between the two functions of heat preservation and heat dissipation at different stages of the processing process, and improving the temperature control accuracy and cooling efficiency of the semiconductor coating equipment.

[0006] Specifically, the above-mentioned spray plate temperature control device provided according to the first aspect of the present invention includes a cold source, an adjustment ring and a distance adjustment mechanism. The cold source has a cold source temperature that is not higher than the target temperature of the spray plate. The adjustment ring is made of a heat-conducting material and is fixedly mounted on the top of the spray plate. The distance adjustment mechanism includes an insulation liquid inlet and outlet and a receiving chamber. The insulation liquid inlet and outlet are connected to the receiving chamber. The bottom of the receiving chamber is thermally connected to the top of the adjustment ring. The top of the receiving chamber is thermally connected to the bottom of the cold source. The receiving chamber expands and contracts in a direction away from or close to the adjustment ring as the insulation liquid flows in or out, so as to adjust the heat dissipation efficiency of the cold source on the spray plate and control the actual temperature of the spray plate to the target temperature.

[0007] Furthermore, in some embodiments of the present invention, the distance adjustment mechanism adopts a bellows structure. The bellows structure includes an inner bellows and an outer bellows. The inner bellows connects the inner ring of the adjustment ring and the heat sink. The outer bellows connects the outer ring of the adjustment ring and the heat sink so that the insulation liquid completely contacts the heat transfer surface of the adjustment ring and the heat sink.

[0008] Furthermore, in some embodiments of the present invention, at least two layers of insulation liquid channels are provided between the inner and outer bellows. A slit is provided on the layer partition plate between the inner channel and the outer channel. The insulation liquid inlet and outlet are directly connected to the inner channel, so that the insulation liquid first passes through the inner channel and then enters and exits the outer channel through the slit.

[0009] Furthermore, in some embodiments of the present invention, a thermal insulation coating is provided on the inner bellows and / or the outer bellows to block direct heat exchange between the thermal insulation liquid and the external environment.

[0010] Furthermore, in some embodiments of the present invention, the cold source is a water-cooling block. Cooling water flows through the water-cooling block to remove the heat obtained from the spray plate via the distance adjustment mechanism and the adjustment ring.

[0011] Furthermore, in some embodiments of the present invention, the spray plate temperature control device further comprises a controller. The controller is configured to: obtain the actual temperature of the spray plate; and control the insulation liquid to flow into or out of the accommodating cavity according to the difference between the actual temperature and the target temperature, so as to adjust the heat dissipation efficiency of the cold source on the spray plate, and control the actual temperature of the spray plate to the target temperature.

[0012] Furthermore, in some embodiments of the present invention, the step of controlling the insulation liquid to flow into or out of the receiving cavity according to the difference between the actual temperature and the target temperature to adjust the heat dissipation efficiency of the cold source on the spray plate, and controlling the actual temperature of the spray plate to the target temperature includes: in response to the actual temperature being higher than the target temperature, controlling the insulation liquid to flow out of the receiving cavity, reducing the distance from the cold source to the top of the spray plate, so as to improve the heat dissipation efficiency of the cold source on the spray plate; and in response to the actual temperature being lower than the target temperature, controlling the insulation liquid to flow into the receiving cavity, increasing the distance from the cold source to the top of the spray plate, so as to reduce the heat dissipation efficiency of the cold source on the spray plate.

[0013] Furthermore, in some embodiments of the present invention, the step of controlling the insulation liquid to flow into or out of the accommodating cavity according to the difference between the actual temperature and the target temperature so as to adjust the heat dissipation efficiency of the cold source on the spray disk, and controlling the actual temperature of the spray disk to the target temperature includes: determining a target height of the distance adjustment mechanism according to the difference between the actual temperature and the target temperature; and controlling the insulation liquid to flow into or out of the accommodating cavity according to the target height so that the heat dissipation efficiency of the cold source on the spray disk adapts to the difference between the actual temperature and the target temperature.

[0014] Furthermore, in some embodiments of the present invention, the spray plate temperature control device also includes a plurality of insulation liquid sources. Each insulation liquid source stores insulation liquids with different thermal conductivities. The step of controlling the insulation liquid to flow into or out of the accommodating cavity according to the difference between the actual temperature and the target temperature to adjust the heat dissipation efficiency of the cold source to the spray plate, and controlling the actual temperature of the spray plate to the target temperature also includes: selecting an insulation liquid source with a corresponding thermal conductivity according to the difference between the actual temperature and the target temperature; and controlling the selected insulation liquid to flow into or out of the accommodating cavity according to the difference between the actual temperature and the target temperature to adjust the heat dissipation efficiency of the cold source to the spray plate, and controlling the actual temperature of the spray plate to the target temperature.

[0015] In addition, the semiconductor coating equipment provided according to the second aspect of the present invention comprises a process chamber, a spray plate and the spray plate temperature control device provided according to the first aspect of the present invention. The process chamber is used to accommodate semiconductor wafers. The spray plate is arranged on the top of the process chamber, and is used to spray a reaction source of a target temperature onto the semiconductor wafer, so as to coat the surface of the semiconductor wafer.

[0016] In addition, the temperature control method of the above-mentioned spray plate provided in accordance with the third aspect of the present invention comprises the following steps: obtaining the actual temperature of the spray plate, wherein the top of the spray plate is thermally connected to the bottom of a accommodating cavity of a distance adjustment mechanism; and according to the difference between the actual temperature and a target temperature, controlling the insulation liquid to flow into or out of the accommodating cavity, and adjusting the heat dissipation efficiency of the cold source thermally connected to the top of the accommodating cavity to the spray plate through the expansion and contraction of the accommodating cavity away from or close to the spray plate, so as to control the actual temperature of the spray plate to the target temperature.

[0017] In addition, the computer-readable storage medium provided in the fourth aspect of the present invention stores computer instructions, which, when executed by a processor, implement the temperature control method for the spray plate provided in the third aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0019] Figure 1 A front cross-sectional schematic diagram of a spray plate temperature control device provided according to some embodiments of the present invention is shown.

[0020] Figure 2 A schematic side cross-sectional view of a spray plate temperature control device provided according to some embodiments of the present invention is shown.

[0021] Figure 3 A three-dimensional schematic diagram of a spray plate temperature control device provided according to some embodiments of the present invention is shown.

[0022] Figure 4 A schematic top view of a bellows structure provided according to some embodiments of the present invention is shown.

[0023] Figure 5 The bellows provided in some embodiments of the present invention is shown along Figure 4 Schematic diagram of the cross section along the AC direction.

[0024] Figure 6 A schematic flow chart of a spray plate temperature control method according to some embodiments of the present invention is shown.

[0025] Reference numerals

[0026] 11 Cold Source

[0027] 12 Adjustment ring

[0028] 131 Insulation liquid import and export

[0029] 132 Accommodation chamber

[0030] 141 Inner bellows

[0031] 142 External bellows

[0032] 151 Water inlet interface

[0033] 152 Water outlet

[0034] 16 Temperature Sensor

[0035] 511 Inner Channel

[0036] 512 Outer Channel DETAILED DESCRIPTION

[0037] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0040] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0041] As mentioned above, at different stages of the processing, the semiconductor coating equipment needs to achieve different functions of heating or cooling, and the spray plate needs to provide different functions of heat preservation or heat dissipation accordingly. However, the existing spray plate only has the heat dissipation function and cannot achieve heat preservation during the heating stage, thereby reducing the heating efficiency of the semiconductor processing equipment.

[0042] In order to overcome the above-mentioned defects existing in the prior art, the present invention provides a spray plate temperature control device, a semiconductor coating equipment, a spray plate temperature control method and a computer-readable storage medium, which can adjust the distance between the cold source and the top of the spray plate by using a distance adjustment mechanism, and adjust the heat dissipation efficiency of the cold source to the spray plate, so as to flexibly switch between the heat preservation and heat dissipation functions at different stages of the processing process, so as to improve the temperature control accuracy and cooling efficiency of the semiconductor processing equipment.

[0043] In some non-limiting embodiments, the temperature control method of the spray plate provided in the third aspect of the present invention can be implemented via the temperature control device of the spray plate provided in the first aspect of the present invention. Specifically, the temperature control device of the spray plate can be configured in the semiconductor coating device provided in the second aspect of the present invention, wherein a memory and a processor are configured. The memory includes but is not limited to the computer-readable storage medium provided in the fourth aspect of the present invention, on which computer instructions are stored. The processor is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the temperature control method of the spray plate provided in the third aspect of the present invention.

[0044] Please refer to Figure 1 to Figure 3 . Figure 1 A front cross-sectional schematic diagram of a spray plate temperature control device provided according to some embodiments of the present invention is shown. Figure 2 A schematic side cross-sectional view of a spray plate temperature control device provided according to some embodiments of the present invention is shown. Figure 3 A three-dimensional schematic diagram of a spray plate temperature control device provided according to some embodiments of the present invention is shown.

[0045] exist Figure 1 to Figure 3In the illustrated embodiment, the semiconductor coating provided by the second aspect of the present invention includes a process chamber, a spray plate, and the spray plate temperature control device provided by the first aspect of the present invention. The process chamber is located below the spray plate and is used to accommodate semiconductor wafers. The spray plate is arranged at the top of the process chamber and is used to spray a reaction source of target temperature onto the semiconductor wafer to coat the surface of the semiconductor wafer. The spray plate temperature control device is equipped with a cold source 11, an adjustment ring 12 and a distance adjustment mechanism, which are used to flexibly adjust the temperature of the spray plate to meet the actual needs of the semiconductor coating process.

[0046] Specifically, the cold source 11 has a cold source temperature that is not higher than the target temperature of the spray disk. The adjustment ring 12 is made of a heat-conducting material and is fixedly mounted on the top of the spray disk. The distance adjustment mechanism includes an insulation liquid inlet and outlet 131 and a receiving chamber 132. The insulation liquid inlet and outlet 131 is connected to the receiving chamber 132. The bottom of the receiving chamber 132 is thermally connected to the top of the adjustment ring 12. The top of the receiving chamber 132 is thermally connected to the bottom of the cold source 11. In this way, the receiving chamber 132 can be extended or retracted in a direction away from or close to the adjustment ring 12 as the insulation liquid flows in or out, so as to adjust the heat dissipation efficiency of the cold source 11 on the spray disk and control the actual temperature of the spray disk to the target temperature.

[0047] In addition, in some embodiments of the present invention, the above-mentioned cold source 11 can be a water-cooled block, which is provided with a water inlet interface 151 and a water outlet interface 152, so that cooling water is introduced through the water inlet interface 151 and discharged through the water outlet interface 152, so as to achieve a circulating cooling effect and take away the heat obtained from the spray disk through the distance adjustment mechanism and the adjustment ring 12.

[0048] Furthermore, in some embodiments of the present invention, the distance adjustment mechanism may adopt a bellows structure. Specifically, the bellows structure may include an inner bellows 141 and an outer bellows 142. The inner bellows 141 connects the inner ring of the adjustment ring 12 and the cold source 11, while the outer bellows 142 connects the outer ring of the adjustment ring 12 and the cold source 11, so that the insulation liquid completely contacts the heat transfer surface of the adjustment ring 12 and the cold source 11. Furthermore, the inner bellows 141 and / or the outer bellows 142 facing away from the accommodating cavity may preferably be provided with an insulation coating to block direct heat exchange between the insulation liquid and the external environment, so as to reduce the influence of the external environment temperature on the insulation liquid temperature, thereby improving the temperature control accuracy of the spray plate.

[0049] Please refer to Figure 4 and Figure 5 . Figure 4 A schematic top view of a bellows structure provided according to some embodiments of the present invention is shown. Figure 5 The bellows provided in some embodiments of the present invention is shown along Figure 4Schematic diagram of the cross section along the AC direction.

[0050] like Figure 4 and Figure 5 As shown, at least two layers of insulation liquid channels are provided between the inner bellows 141 and the outer bellows 142, wherein a slit is provided on the layer partition plate between the inner channel 511 and the outer channel 512. The insulation liquid inlet and outlet 131 is directly connected to the inner channel 511. In this way, when the insulation liquid is injected into or extracted from the accommodating cavity 132, the insulation liquid can first pass through the inner channel 511, and then enter and exit the outer channel 512 through the slit, thereby improving the force uniformity of the spray plate to avoid the occurrence of eccentric loading.

[0051] In addition, the spray plate temperature control device provided in the first aspect of the present invention may further include a controller and a temperature sensor 16. The controller is configured to first obtain the actual temperature of the spray plate through the temperature sensor 16, and then control the insulation liquid to flow into or out of the accommodating cavity 132 according to the difference between the actual temperature and the target temperature, so as to adjust the heat dissipation efficiency of the cold source 11 to the spray plate, and control the actual temperature of the spray plate to the target temperature.

[0052] The working principle of the above-mentioned spray plate temperature control device and controller will be described below in combination with some embodiments of the spray plate temperature control method. Those skilled in the art will understand that these embodiments of the spray plate temperature control method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the spray plate temperature control device and controller. Similarly, the spray plate temperature control device and controller are also only a non-limiting implementation method provided by the present invention, and do not constitute a limitation on the execution subject or execution order of each step in these spray plate temperature control methods.

[0053] Please refer to Figure 6 , Figure 6 A schematic flow chart of a spray plate temperature control method according to some embodiments of the present invention is shown.

[0054] like Figure 6 As shown, in the process of temperature control of the spray disc, the controller of the spray disc temperature control device can first obtain the actual temperature of the spray disc via the temperature sensor 16. Afterwards, the controller can control the insulation liquid to flow into or out of the accommodating chamber 132 according to the difference between the actual temperature obtained and the preset target temperature, and extend and retract in the direction away from or close to the spray disc through the accommodating chamber 132, and adjust the heat dissipation efficiency of the cold source 11 to the spray disc, so as to efficiently and accurately control the actual temperature of the spray disc to the target temperature.

[0055] For example, the controller can compare the actual temperature obtained with the preset target temperature. In response to the actual temperature being higher than the target temperature, the controller can control the insulation liquid to flow out of the accommodating chamber 132, reduce the distance from the cold source 11 to the top of the spray plate, so as to improve the heat dissipation efficiency of the cold source 11 to the spray plate, thereby promoting the reduction of the temperature of the spray plate. Conversely, in response to the actual temperature being lower than the target temperature, the controller can control the insulation liquid to flow into the accommodating chamber 132, increase the distance from the cold source 11 to the top of the spray plate, so as to reduce the heat dissipation efficiency of the cold source 11 to the spray plate, thereby maintaining the temperature of the spray plate, and using the heat of the heating plate to increase its actual temperature.

[0056] Further, the controller can also preferably quantitatively adjust the heat dissipation efficiency according to the size of the difference between the actual temperature and the target temperature to reduce the fluctuation of the temperature change. Specifically, the controller can first determine the target height of the distance adjustment mechanism according to the difference between the actual temperature and the target temperature. Here, the difference between the actual temperature and the target temperature can be a positive value or a negative value, wherein a positive value indicates that the actual temperature is higher than the target temperature, and a negative value indicates that the actual temperature is lower than the target temperature. The correspondence between the difference and the target height can be determined by a pre-experimental calibration. The lower the target height, the higher the corresponding heat dissipation efficiency. Afterwards, the controller can quantitatively control the insulation liquid to flow into or out of the accommodating chamber 132 according to the determined target height, so that the heat dissipation efficiency of the cold source 11 to the spray plate is adapted to the difference between the actual temperature and the target temperature.

[0057] Furthermore, the above-mentioned spray plate temperature control device provided by the first aspect of the present invention may also preferably include multiple insulation liquid sources, wherein each insulation liquid source stores different insulation liquids with thermal conductivity between 0.2 and 0.8. By storing insulation liquids with different thermal conductivity in each insulation liquid source, the spray plate temperature control device can also select insulation liquid with corresponding thermal conductivity according to the difference between the actual temperature and the target temperature, and control the selected insulation liquid to flow into or out of the accommodating cavity 132 according to the difference between the actual temperature and the target temperature, so as to adjust the heat dissipation efficiency of the cold source 11 to the spray plate, thereby correspondingly adjusting the temperature control range and temperature control speed.

[0058] For example, the spray plate temperature control device may select the first insulation liquid with a thermal conductivity of 0.2 by default for temperature control, so as to obtain the fastest temperature control speed and the highest temperature control accuracy. Afterwards, in response to the difference between the actual temperature and the target temperature being greater than the temperature control range of the first insulation liquid, the spray plate temperature control device may extract the first insulation liquid from the accommodating cavity 132, and select the second insulation liquid with a higher thermal conductivity (for example: 0.4) for temperature control, thereby taking into account the temperature control speed, temperature control accuracy and temperature control range. Afterwards, in response to the difference between the actual temperature and the target temperature being further greater than the temperature control range of the second insulation liquid, the spray plate temperature control device may further select the third insulation liquid with a higher thermal conductivity (for example: 0.8) for temperature control, thereby achieving the maximum range of temperature control.

[0059] Those skilled in the art will appreciate that the above-mentioned embodiments of controlling directly based on a controller are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concepts of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit the scope of protection of the present invention.

[0060] Optionally, in other embodiments, technicians in this field can also obtain the actual temperature of the spray disk through the temperature sensor 16 through manual control methods, and then control the insulation liquid to flow into or out of the containing cavity 132 according to the difference between the actual temperature and the target temperature, so as to adjust the heat dissipation efficiency of the cold source 11 to the spray disk, and control the actual temperature of the spray disk to the target temperature.

[0061] In summary, the above-mentioned spray plate temperature control device, semiconductor coating equipment, spray plate temperature control method and computer-readable storage medium provided by the present invention can adjust the distance between the cold source and the top of the spray plate by using a distance adjustment mechanism, and adjust the heat dissipation efficiency of the cold source to the spray plate, so as to flexibly switch the two functions of heat preservation and heat dissipation at different stages of the processing process, so as to improve the temperature control accuracy and cooling efficiency of the semiconductor coating equipment.

[0062] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0063] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A spray plate temperature control device, characterized in that: include: a cold source having a cold source temperature not higher than a target temperature of the spray pan; An adjusting ring, made of a heat-conducting material and fixedly mounted on the top of the spray plate; The distance adjustment mechanism comprises an insulation liquid inlet and outlet and a receiving chamber, wherein the insulation liquid inlet and outlet are connected to the receiving chamber, the bottom of the receiving chamber is thermally connected to the top of the adjustment ring, and the top of the receiving chamber is thermally connected to the bottom of the cold source; A plurality of insulation liquid sources, wherein each insulation liquid source stores insulation liquids with different thermal conductivities; and The controller is configured to: obtain the actual temperature of the spray disk; select an insulation liquid source with a corresponding thermal conductivity coefficient according to the difference between the actual temperature and the target temperature; and control the selected insulation liquid to flow into or out of the accommodating cavity according to the difference between the actual temperature and the target temperature, so that the accommodating cavity is expanded or contracted in a direction away from or close to the adjustment ring, so as to adjust the heat dissipation efficiency of the cold source on the spray disk and control the actual temperature of the spray disk to the target temperature.

2. The spray plate temperature control device according to claim 1, characterized in that: The distance adjustment mechanism adopts a bellows structure, which includes an inner bellows and an outer bellows, wherein the inner bellows connects the inner ring of the adjustment ring and the cold source, and the outer bellows connects the outer ring of the adjustment ring and the cold source, so that the insulation liquid completely contacts the heat transfer surface of the adjustment ring and the cold source.

3. The spray plate temperature control device according to claim 2, characterized in that: At least two layers of insulation liquid channels are provided between the inner and outer bellows, wherein a slit is provided on the partition plate between the inner and outer channels, and the insulation liquid inlet and outlet are directly connected to the inner channel, so that the insulation liquid first passes through the inner channel and then enters and exits the outer channel through the slit.

4. The spray plate temperature control device according to claim 2, characterized in that: The inner bellows and / or the outer bellows are provided with a thermal insulation coating to block direct heat exchange between the thermal insulation liquid and the external environment.

5. The spray plate temperature control device according to claim 1, characterized in that: The cold source is a water-cooling block, wherein cooling water flows through the water-cooling block to take away the heat obtained from the spray plate via the distance adjustment mechanism and the adjustment ring.

6. The spray plate temperature control device according to claim 1, characterized in that: The step of controlling the selected insulation liquid to flow into or out of the accommodating chamber according to the difference between the actual temperature and the target temperature, so that the accommodating chamber expands or contracts in a direction away from or close to the adjusting ring, so as to adjust the heat dissipation efficiency of the cold source on the spray disk, and controlling the actual temperature of the spray disk to the target temperature comprises: In response to the actual temperature being higher than the target temperature, controlling the selected insulation liquid to flow out of the accommodation cavity, reducing the distance from the cold source to the top of the spray plate, so as to improve the heat dissipation efficiency of the cold source to the spray plate; and In response to the actual temperature being lower than the target temperature, the selected insulation liquid is controlled to flow into the accommodating cavity, and the distance from the cold source to the top of the spray plate is increased to reduce the heat dissipation efficiency of the cold source to the spray plate.

7. The spray plate temperature control device according to claim 1, characterized in that: The step of controlling the selected insulation liquid to flow into or out of the accommodating chamber according to the difference between the actual temperature and the target temperature, so that the accommodating chamber expands or contracts in a direction away from or close to the adjusting ring, so as to adjust the heat dissipation efficiency of the cold source on the spray disk, and controlling the actual temperature of the spray disk to the target temperature comprises: determining a target height of the distance adjustment mechanism according to a difference between the actual temperature and the target temperature; and According to the target height, the selected insulation liquid is controlled to flow into or out of the accommodating cavity, so that the heat dissipation efficiency of the cold source to the spray plate is adapted to the difference between the actual temperature and the target temperature.

8. A semiconductor coating device, characterized in that: include: a process chamber for accommodating semiconductor wafers; A spray plate, disposed at the top of the process chamber, for spraying a reaction source at a target temperature onto the semiconductor wafer to coat the surface of the semiconductor wafer; as well as The spray plate temperature control device according to any one of claims 1 to 7.

9. A method for controlling the temperature of a spray plate, characterized in that: The following steps are involved: Acquiring the actual temperature of the spray plate, wherein the top of the spray plate is thermally connected to the bottom of a receiving cavity of a distance adjustment mechanism; According to the difference between the actual temperature and a target temperature, selecting a thermal insulation liquid source with a corresponding thermal conductivity from a plurality of thermal insulation liquid sources storing thermal insulation liquids with different thermal conductivities; and According to the difference between the actual temperature and the target temperature, the insulation liquid is controlled to flow into or out of the accommodating chamber, and the heat dissipation efficiency of the cold source thermally connected to the top of the accommodating chamber to the spray disk is adjusted through the expansion and contraction of the accommodating chamber in the direction away from or close to the spray disk, so as to control the actual temperature of the spray disk to the target temperature.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by the processor, the temperature control method of the spray plate according to claim 9 is implemented.

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