Substrate vacuum chucking device

Abstract

The application provides a substrate vacuum sucking device, which comprises the following: a gas hole is arranged on a substrate placing table, the gas hole avoids a bolt hole arranged on the surface of the substrate placing table and fills the whole surface of the substrate placing table; an exhaust device is fixed on the lower part of the substrate placing table through bolts; a lifting device is arranged on the lower part of the exhaust device, a top rod on the top of the lifting device is connected with the end of the vacuum plate away from the substrate placing table in the exhaust device; a balancing device is arranged around the lifting device and is connected with the vacuum plate on the top; a material lifting device is arranged on one side of the substrate placing table and is connected with the vacuum plate on the bottom; a base is arranged on the bottom of the lifting device, and a positioning hole is arranged on the base and is connected with a slide table rodless air cylinder through a positioning pin. The exhaust device is used for adsorbing the SUB plate which is easy to change after being processed, the gas in the air channel of the vacuum plate is quickly exchanged through the air nozzle and the auxiliary air nozzle, the bottom of the SUB plate is quickly cooled to make it harden and be shaped, and the transportation and processing of the SUB plate are facilitated.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor products, in particular to the field of high-temperature SUB substrate transportation technology, and specifically to a substrate vacuum suction device. Background Art

[0002] The mainstream chip mounting technology used in the production of existing semiconductor products is flip-chip mounting technology, which realizes communication function by welding the substrate and the chip. However, due to the high temperature baking of the substrate during reflow soldering, after the chip is soldered, the mainboard is prone to deformation during transportation, which may cause product defects and flaws in appearance.

[0003] Due to the particularity of the sub-substrate material and the limitations of the process (sealed, high temperature), the deformation of the SUB substrate cannot be fundamentally solved. It can only be optimized and improved by designing and modifying the transportation equipment. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a substrate vacuum suction device to solve the difficulties of the prior art.

[0005] To achieve the above-mentioned and other related purposes, the present invention provides a substrate vacuum suction device, comprising:

[0006] A substrate placement platform 1 is provided with air holes 101, and the air holes 101 avoid the bolt holes provided on the surface of the substrate placement platform 1 and fill the entire surface of the substrate placement platform 1;

[0007] An exhaust device 2, the exhaust device 2 is fixed below the substrate placement platform 1 by bolts 7;

[0008] A lifting device 3 is provided below the exhaust device 2, wherein a top rod 303 of the lifting device 3 is connected to an end of the vacuum plate 201 in the exhaust device 2 away from the substrate placement table 1;

[0009] The balancing device 4 is arranged around the lifting device 3 and the top is connected to the vacuum plate 201;

[0010] A pushing device 5 is provided on one side of the substrate placement platform 1, and the bottom thereof is connected to the vacuum plate 201;

[0011] The base 6 is arranged at the bottom of the lifting device 3. A positioning hole is preset on the base 6 and is connected to the slide rodless cylinder through a positioning pin.

[0012] According to a preferred embodiment, the exhaust device 2 comprises:

[0013] A vacuum plate 201 is located at the bottom of the substrate placement platform 1 and is connected to the substrate placement platform 1 via bolts 7. Connected grooves forming an air channel 204 are provided on the end surface of the vacuum plate 201 close to the substrate placement platform 1.

[0014] A suction nozzle 202 is provided at the bottom of the vacuum plate 201 , and a top end of the suction nozzle 202 is connected to the airway 204 ;

[0015] The air inlet pipe 203 is provided on one side of the vacuum plate 201 , and the top end of the air inlet pipe 203 is connected to the air duct 204 .

[0016] According to a preferred embodiment, the lifting device 3 includes:

[0017] A lifting double-rod cylinder 301 is placed on the base 6, with a slider 302 provided on the top. A push rod 303 is provided above the slider 302, and the top of the push rod 303 is connected to the vacuum plate 201;

[0018] According to a preferred embodiment, the balancing device 4 includes:

[0019] A positioning plate 401 is located between the vacuum plate 201 and the lifting double-rod cylinder 301 and is placed on the slider 302. A limit plate 402 is provided below the positioning plate 401.

[0020] A limiting plate 402 is provided with a limiting groove 408 in the middle of the limiting plate 402. The limiting plate 402 is sleeved on the cylinder wall of the lifting double-rod cylinder 301 through the limiting groove 408 and is connected to the base 6 through the fixing plate 403 below;

[0021] The balancing pillar 404 is provided around the positioning plate 401. The balancing pillar 404 is provided with a thread that is locked with the positioning plate 401. One end of the balancing pillar 404 abuts against the vacuum plate 201, and the other end passes through the limiting plate 402 and extends downward.

[0022] The laser sensor 405 is arranged on one side of the positioning plate 401 through an L-shaped bracket 407 , and a through hole 406 is provided above the sensing head of the laser sensor 405 at a position corresponding to the upper substrate placement platform 1 .

[0023] According to a preferred embodiment, the pushing device 5 includes:

[0024] The top of the vertical plate of the L-shaped plate 501 is connected to the vacuum plate 201, and the horizontal plate is provided with a U-shaped block 502 and a Z-shaped extended push plate 503 from bottom to top.

[0025] The present invention uses the exhaust device 2 to absorb the easily deformable SUB board that has just been processed, and quickly exchanges the gas in the air channel inside the vacuum board through the air nozzle and the auxiliary air nozzle, quickly cooling the bottom of the SUB board to harden and shape it, which is convenient for subsequent transportation and processing of the SUB board.

[0026] Hereinafter, the best embodiment for carrying out the present invention will be described in more detail with reference to the accompanying drawings so that the features and advantages of the present invention can be easily understood. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Shown is a schematic diagram of the body force structure of the present invention from an orthogonal oblique perspective;

[0028] Figure 2 Shown is an exploded view of the exhaust device of the present invention;

[0029] Figure 3 Shown is a schematic diagram of the three-dimensional structure of the lifting device and the balancing device of the present invention;

[0030] Figure 4 Shown is a partial front view of the present invention;

[0031] Description of labels

[0032] 1. Substrate placement table; 101. Air hole; 2. Exhaust device; 201. Vacuum plate; 202. Suction nozzle; 203. Air inlet pipe; 204. Air duct; 3. Lifting device; 301. Lifting double-rod cylinder; 302. Slider; 303. Ejector rod; 4. Balancing device; 401. Positioning plate; 402. Limiting plate; 403. Fixing plate; 404. Balancing pillar; 405. Laser sensor; 406. Through hole; 407. L-shaped bracket; 408. Limiting slot; 5. Pushing device; 501. L-shaped plate; 502. U-shaped block; 503. Z-shaped extended push plate; 6. Base; 7. Bolts DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the technical solution of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of specific embodiments of the present invention. The same figure marks in the drawings represent the same components. It should be noted that the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Compared to the embodiments shown in the drawings, feasible embodiments within the scope of protection of the present invention may have fewer components, additional components not shown in the drawings, different components, differently arranged components, or differently connected components, etc. In addition, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0035] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by persons of ordinary skill in the field to which the invention belongs. The words "first", "second" and similar terms used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "a" or "an" do not necessarily indicate a quantity limitation. Words such as "include" or "comprising" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0036] The present invention proposes a substrate vacuum suction device for use in a product transportation process. The present invention does not limit the type of SUB board being transported, but the structure of the exhaust device and the lifting device is particularly suitable for transporting semiconductor products that are easily deformed.

[0037] In general, the substrate vacuum suction device proposed in the present invention mainly includes a substrate placement table 1, an exhaust device 2, a lifting device 3, a balancing device 4, a pushing device 5 and a base 6. Figure 1 , which shows the arrangement relationship of the substrate placement table 1, the exhaust device 2, the lifting device 3, the balancing device 4, the pushing device 5 and the base 6.

[0038] After SUB substrate processing, the temperature is high and it is easy to deform. Therefore, it cannot be transported by grabbing and can only be transported by parallel tracks. However, when transported by ordinary tracks such as conveyor belts, the sub-substrate becomes soft due to high temperature and will stick to the conveyor track and cannot be transported smoothly. Therefore, this substrate vacuum suction device is designed based on the characteristics of SUB substrates. The bottom of the vacuum suction plate is connected to the slide cylinder to achieve the purpose of transporting the newly processed SUB substrate.

[0039] like Figure 2The substrate placement table 1 of the device shown is connected to the vacuum plate 201 by bolts, wherein the substrate placement table 1 is pierced with air holes 101, and the air holes 101 avoid the bolt holes set on the surface of the substrate placement table 1 and fill the entire surface of the substrate placement table 1, and the upper end surface of the vacuum plate 201 is provided with an air duct 204, the bottom is provided with a suction nozzle 202, and the side is provided with an air inlet pipe 203. The above-mentioned air nozzle is connected to the air pump through a hose. The air pump quickly extracts air from the air duct 204 at a speed greater than the speed of replenishing air from the air inlet pipe 203, which will form a negative pressure, so that the substrate placement table 1 can firmly adsorb the SUB substrate that has just been processed. It should also be noted that the substrate placement table 1 is made of metal materials with high thermal conductivity, such as silver and copper. The air pump quickly converts the air in the air duct 204, which quickly cools the bottom of the SUB board to harden it, making it convenient for transportation in subsequent processes.

[0040] It should also be noted that the substrate vacuum suction device is also provided with a lifting device 3, the lifting device 3 drives the balancing device 4 to control the vacuum plate 201 and the substrate placement table 1 to drive the SUB plate to move up and down, wherein the lifting device 3 includes a lifting double-rod cylinder 301, a slider 302 and a push rod 303. The lifting double-rod cylinder 301 drives the slider 302 to move up and down. If the slider 302 is directly connected to the vacuum plate 201 to drive the vacuum plate 201 to move up and down, the large contact area between the two will cause the vibration of the cylinder during operation to be transmitted from the vacuum plate 201 to the substrate placement table 1. On the platform 1, there is a probability that the SUB plate will be deformed and cause defects, so in order to reduce the contact area, a push rod 303 is set between the slider 302 and the vacuum plate 201, and the push rod 303 drives the vacuum plate 201 to move up and down. However, the contact area between the single push rod 303 and the slider 302 is too small, which may cause the vacuum plate 201 to fall off during operation, so a balancing device 4 is added. The balancing device 4 includes a positioning plate 401, a limit plate 402, a balancing top column 404 and a laser sensor 405, wherein the positioning plate 401 is located between the vacuum plate 201 and the lifting double-rod cylinder 301, The positioning plate 401 is placed on the slider 302 and is driven by the slider 302 to move up and down. A balancing top column 404 is provided around the positioning plate 401. When the positioning plate 401 is driven, the balancing top column 404 presses against the four corners of the vacuum plate 201 so that the vacuum plate 201 can be lifted and lowered horizontally. However, in order to prevent the position of the balancing top column 404 from being offset, a limiting plate 402 is provided below the positioning plate 401. A limiting groove 408 is provided in the middle of the limiting plate 402. The limiting plate 402 is sleeved on the cylinder wall of the lifting double-rod cylinder 301 through the limiting groove 408 and is fixed to the fixing plate 404 below. 03 is connected to the base 6, one end of the balancing top column 404 passes through the positioning plate 401 and rests on the vacuum plate 201, and the other end passes through the limit plate 402 and extends downward. The two points limit the position of the balancing top column 404. Finally, a laser sensor 405 is set on one side of the positioning plate 401. The laser sensor 405 senses whether the up and down movement distance of the lifting double-rod cylinder 301 is the same as the set distance. If the up and down movement distance of the lifting double-rod cylinder 301 deviates due to long-term use of the machine, it only needs to be adjusted according to the data detected by the laser sensor 405.

[0041] Finally, it should be noted that the pushing device 5 is arranged on one side of the substrate placement table 1, and the bottom is connected to the vacuum plate 201. It consists of an L-shaped plate 501, a U-shaped block 502 and a Z-shaped extended pushing plate 503. The top of the vertical plate in the L-shaped plate 501 is connected to the vacuum plate 201, and the horizontal plate is respectively provided with a U-shaped block 502 and a Z-shaped extended pushing plate 503 from bottom to top. The U-shaped block 502 raises the Z-shaped extended pushing plate 503 to prevent the vertical plate of the Z-shaped extended pushing plate 503 from being too long and shaking during movement. The Z-shaped extended pushing plate 503 is made of a polymer material with strong heat resistance, and will not scratch the surface of the SUB plate when pushing the SUB plate.

[0042] The above embodiments are only illustrative of the principles of the present application and its efficacy, and are not intended to limit the present application. Any modification or change made by any person skilled in the art without departing from the spirit and scope of the present application shall be covered by the claims of the present application.

Claims

1. A substrate vacuum suction device, characterized in that: include: A substrate placement table (1), wherein the substrate placement table (1) is provided with air holes (101), and the air holes (101) avoid bolt holes provided on the surface of the substrate placement table (1) and fill the entire surface of the substrate placement table (1); An exhaust device (2), wherein the exhaust device (2) is fixed below the substrate placement platform (1) via bolts (7); A lifting device (3), the lifting device (3) is arranged below the exhaust device (2), and the top rod (303) of the lifting device (3) is connected to an end of the vacuum plate (201) in the exhaust device (2) away from the substrate placement table (1); A balancing device (4), the balancing device (4) is arranged around the lifting device (3), and the top is connected to the vacuum plate (201); A material pushing device (5), the material pushing device (5) is arranged on one side of the substrate placement table (1), and the bottom of the material pushing device (5) is connected to the vacuum plate (201); A base (6), the base (6) being arranged at the bottom of the lifting device (3), and a positioning hole being preset on the base (6) and connected to the slide rodless cylinder via a positioning pin; The exhaust device (2) comprises: A vacuum plate (201), the vacuum plate (201) being located at the bottom of the substrate placement table (1) and connected to the substrate placement table (1) via bolts (7); the vacuum plate (201) having an end surface close to the substrate placement table (1) being provided with connected grooves forming an airway (204); A suction nozzle (202), the suction nozzle (202) is provided through the bottom of the vacuum plate (201), and the top end of the suction nozzle (202) is connected to the airway (204); An air inlet pipe (203), the air inlet pipe (203) is provided on one side of the vacuum plate (201), and the top end of the air inlet pipe (203) is connected to the airway (204); The lifting device (3) comprises: A lifting double-rod cylinder (301), the lifting double-rod cylinder (301) is placed on a base (6), a slider (302) is provided on the top, a push rod (303) is provided above the slider (302), and the top end of the push rod (303) is connected to the vacuum plate (201); The balancing device (4) comprises: A positioning plate (401), the positioning plate (401) is located between the vacuum plate (201) and the lifting double-rod cylinder (301), and is placed on the slider (302). A limiting plate (402) is provided below the positioning plate (401); A limiting plate (402), wherein a limiting groove (408) is provided in the middle of the limiting plate (402), and the limiting plate (402) is sleeved on the cylinder wall of the lifting double-rod cylinder (301) through the limiting groove (408), and is connected to the base (6) through the fixing plate (403) below; a balancing top column (404), wherein the balancing top column (404) is passed through the periphery of the positioning plate (401), and the balancing top column (404) is provided with a thread that is locked with the thread of the positioning plate (401), and one end of the balancing top column (404) is against the vacuum plate (201), and the other end passes through the limiting plate (402) and extends downward; A laser sensor (405), wherein the laser sensor (405) is arranged on one side of the positioning plate (401) via an L-shaped bracket (407), and a through hole (406) is provided above the sensing head of the laser sensor (405) at a position corresponding to the upper substrate placement platform (1); The pushing device (5) comprises: An L-shaped plate (501), wherein the top of the vertical plate in the L-shaped plate (501) is connected to the vacuum plate (201), and a U-shaped block (502) and a Z-shaped extended push plate (503) are respectively provided on the horizontal plate from bottom to top.

Images