A detection method, device and equipment of a laser processing device and a storage medium

Abstract

Embodiments of the present application disclose a kind of detection method, device, equipment and storage medium of laser processing equipment.The method is applied to laser processing equipment, the method includes: obtaining test file, test file is provided with at least one test area, test file includes multiple preset layers, preset layer is provided with corresponding test pattern in each test area;According to preset layer and preset defocusing data, determine the preset defocusing distance corresponding to each test pattern;According to test pattern and preset defocusing distance, control laser processing equipment to test workpiece is carried out laser processing;Obtain cutting line detection data on the test workpiece after processing;According to cutting line detection data, determine the equipment detection result corresponding to cutting line detection data.The present application realizes the automatic determination of equipment detection result, reduces the security risk of operator, and improves the quality of laser processing precision detection.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a detection method, apparatus, equipment, and storage medium for laser processing equipment. Background Technology

[0002] Precise inspection of laser processing equipment has always been a challenge in the industry. Laser focus position detection is a crucial factor in precise laser processing inspection. Due to the high energy density at the laser focus point, current methods for finding the focus typically involve visually estimating the focus by hitting a test paper with the laser or moving the laser back and forth along the Z-axis on a metal sheet and judging the focus position by the brightness or sound of the cut. This process is not only time-consuming and labor-intensive but also poses certain safety hazards. For example, moving the test paper can easily cause a fire, and using the metal sheet can cause eye damage due to the high intensity of the laser reflection. Therefore, proposing a simple and safe inspection method for laser processing equipment is of paramount importance. Summary of the Invention

[0003] Based on this, it is necessary to propose a detection method, device, equipment, and storage medium for laser processing equipment to address the above problems.

[0004] In a first aspect, the present invention proposes a detection method for laser processing equipment, applied to laser processing equipment, the method comprising:

[0005] Obtain a test file, the test file having at least one test area, the test file including multiple preset layers, the preset layers having a corresponding test pattern in each test area;

[0006] Determine the preset focus distance corresponding to each test pattern based on the preset layer and preset focus data;

[0007] Based on the test pattern and the preset focal distance, the laser processing equipment is controlled to perform laser processing on the test workpiece;

[0008] Obtain cutting line detection data on the processed test workpiece;

[0009] Based on the cutting line detection data, determine the equipment detection results corresponding to the cutting line detection data, including the XY axis motor detection results of the galvanometer;

[0010] The step of acquiring cutting line detection data on the processed test workpiece and determining the equipment detection result corresponding to the cutting line detection data further includes:

[0011] The number of test areas is multiple, and the cutting line widths corresponding to the target arcs of the test patterns in the multiple test areas are obtained on the processed test workpiece to obtain multiple arc cutting line widths;

[0012] Determine whether the arc cutting line widths corresponding to the same preset layer are consistent;

[0013] When the arc cutting line width corresponding to the same preset layer is consistent, the detection result of the XY axis motor of the galvanometer is determined to be normal.

[0014] When the arc cutting line widths corresponding to the same preset layer are inconsistent, the XY axis motor detection results of the galvanometer are determined to be abnormal.

[0015] Secondly, the present invention also proposes a detection device for laser processing equipment, applied to laser processing equipment, the device comprising:

[0016] A test file acquisition module is used to acquire a test file, wherein the test file has at least one test area and includes multiple preset layers, wherein each preset layer has a corresponding test pattern in each test area;

[0017] The focus distance acquisition module is used to determine the preset focus distance corresponding to each of the test patterns based on the preset layer and preset focus data.

[0018] The processing module is used to control the laser processing equipment to perform laser processing on the test workpiece according to the test pattern and the preset focal distance;

[0019] The detection result determination module is used to acquire cutting line detection data on the processed test workpiece, and determine the equipment detection result corresponding to the cutting line detection data based on the cutting line detection data. The equipment detection result includes the detection result of the galvanometer XY-axis motor. There are multiple test areas, and the cutting line widths corresponding to the target arcs of the test patterns in multiple test areas on the processed test workpiece are acquired to obtain multiple arc cutting line widths. It is determined whether the arc cutting line widths corresponding to the same preset layer are consistent. When the arc cutting line widths corresponding to the same preset layer are consistent, the galvanometer XY-axis motor detection result is determined to be normal; when the arc cutting line widths corresponding to the same preset layer are inconsistent, the galvanometer XY-axis motor detection result is determined to be abnormal.

[0020] Thirdly, the present invention also proposes a storage medium storing a computer instruction program, which, when executed by a processor, causes the processor to perform the steps of any of the methods described in the first aspect.

[0021] Fourthly, the present invention also provides a computer device comprising at least one memory and at least one processor, wherein the memory stores a computer instruction program, and when the computer instruction program is executed by the processor, the processor performs the steps of the method described in any of the first aspects.

[0022] In summary, the detection method, apparatus, equipment, and storage medium for laser processing equipment of the present invention achieve the following: acquiring test files; determining the preset focal distance corresponding to each test pattern based on the preset layers and preset focal length data of the test files; acquiring cutting line detection data on the processed test workpiece; and determining the corresponding equipment detection results based on the cutting line detection data, including the detection results of the galvanometer XY-axis motor. The operation is simple, achieving automated determination of equipment detection results and improving the quality of precise laser processing detection. The entire testing process does not require brightness or sound to determine the laser focal position, nor does it require test paper or metal sheets, reducing safety hazards for operators. Furthermore, it can determine the detection results of the galvanometer XY-axis motor, thereby further improving the quality of precise laser processing detection. Therefore, the present invention achieves automated determination of equipment detection results, reduces safety hazards for operators, and improves the quality of precise laser processing detection. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] in:

[0025] Figure 1 This is a schematic diagram of the structure of a laser processing device in one embodiment;

[0026] Figure 2 This is a flowchart of a detection method for a laser processing device in one embodiment;

[0027] Figure 3 This is a schematic diagram of multiple test areas in one embodiment;

[0028] Figure 4 This is a schematic diagram of a test area in one embodiment;

[0029] Figure 5 for Figure 2 The flowchart of the laser focus position detection results for determining the detection method of laser processing equipment;

[0030] Figure 6 for Figure 2 Determination of testing methods for laser processing equipment; Flowchart of testing results for the equipment's optical path system;

[0031] Figure 7 for Figure 2 Determination of testing methods for laser processing equipment; Flowchart of testing results for XY-axis motor of galvanometer.

[0032] Figure 8 This is a structural block diagram of the detection device of a laser processing equipment in one embodiment;

[0033] Figure 9 This is a structural block diagram of a computer device in one embodiment. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] This invention proposes a detection method for laser processing equipment. The method is applied to laser processing equipment and can be used to accurately detect the laser processing of the equipment.

[0036] like Figure 1 As shown, the laser processing equipment includes: a processing platform 102, a two-dimensional galvanometer and focusing lens device 104; the two-dimensional galvanometer and focusing lens device 104 is disposed above the processing platform 102, and the workpiece to be processed is placed on the processing platform 102. The laser processing equipment is used to perform laser processing on a test workpiece (equivalent to the workpiece to be processed) placed on the processing platform 102. The laser processing includes, but is not limited to: laser cutting and laser drilling. The test workpiece is a material that can be laser processed, and its shape can be polygonal.

[0037] To improve the accuracy of the detection method for laser processing equipment, the test workpiece of this invention uses a workpiece with a parallel upper surface (the surface near the two-dimensional galvanometer) and a parallel lower surface (the surface in contact with the processing platform 102). It is understood that the test workpiece of this invention can also use a workpiece with a non-parallel upper and lower surface. In this case, it is necessary to convert the relevant data to the case where the upper and lower surfaces of the test workpiece are parallel before applying the detection method of the laser processing equipment of this invention. This will not be elaborated upon here.

[0038] like Figure 2As shown, in one embodiment, the detection method of the laser processing equipment includes:

[0039] S202. Obtain a test file, wherein the test file has at least one test area and includes multiple preset layers, and each preset layer has a corresponding test pattern in each test area.

[0040] The test file can be imported into the program module that executes the testing method for the laser processing equipment, or the test file can be directly set in the program module that executes the testing method for the laser processing equipment.

[0041] A test file is a document that records test patterns. A test pattern is a pattern used in laser processing equipment for laser processing, including at least one graphic composed of lines and / or dots. A test area refers to the area where the test pattern is set. This can be understood as the test area being within the processing range of the two-dimensional galvanometer of the laser processing equipment during laser processing according to the test file. A preset layer refers to a movable layer in the test file where the test pattern is placed. Setting a preset layer allows for quick and consistent adjustment of the preset focus distance corresponding to the test pattern. For example, when the test pattern includes multiple graphics, adjusting the preset focus distance of the preset layer is sufficient to adjust the preset focus distance of the entire test pattern, avoiding the need to adjust the preset focus distance of each graphic, reducing the number of operations, and improving the accuracy of adjustment. When there are at least two test areas, adjusting the preset focus distance of the preset layer is sufficient to adjust the preset focus distance of the test patterns in all test areas, thus avoiding the need to adjust each test pattern for each test area, reducing the number of operations, and ensuring consistency in the preset focus distance of test patterns within the same preset layer.

[0042] Understandably, setting preset layers also allows for convenient and quick setting of the distance between different test patterns in the test file.

[0043] Optionally, test patterns within the same test area can be located on different preset layers, which facilitates quickly setting different preset focus distances for test patterns within the same test area.

[0044] The number of test areas can be 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, and no specific limit is imposed here.

[0045] It is understandable that when a test file has at least two test areas, the test areas do not overlap.

[0046] Optionally, when the test document has at least two test areas, the number and layout of test patterns in different test areas are the same, and the specifications and orientations of test patterns at the same relative position in different test areas are the same. Test patterns at the same relative position refer to test patterns with the same offset position (including horizontal and vertical coordinates) relative to the center point of their respective test areas. The same specifications mean that the components constituting the test pattern are the same, and the dimensions of the same components are the same; the orientation refers to the direction of the graphic in the test pattern. The layout method refers to the arrangement position and spacing of the test patterns in each test area. For example, as shown... Figure 3 As shown, there are 9 test areas, and each test area has 9 test patterns (the number of test patterns is the same in different test areas). The 9 test patterns in each test area are arranged in a 3x3 grid (the layout of the test patterns in different test areas is the same). The offset position of the center point of the test area where the first test pattern in the upper left corner is located is the same (9 out of 9 test areas have the same first test pattern in the same relative position).

[0047] Optionally, all test patterns should have the same specifications and orientation. This is beneficial for quickly determining the equipment's test results based on the cutting line detection data after laser processing according to the test patterns.

[0048] Optionally, test patterns at the same relative position are located on the same preset layer, which facilitates quickly setting test patterns at the same relative position to the same preset focus distance.

[0049] It is understandable that the preset focus distances of different preset layers can be the same or different.

[0050] S204. Determine the preset focus distance corresponding to each test pattern based on the preset layer and preset focus data;

[0051] Off-focus distance refers to the distance offset from the initial laser focus position of the laser processing equipment, including upper and lower off-focus. Preset off-focus distance refers to the preset off-focus distance.

[0052] During initial debugging, since the exact value of the laser focus position is unknown, the ideal laser focus position of the laser processing equipment can be used as the initial laser focus position. The ideal laser focus position of the laser processing equipment is a default position, such as the zero point position.

[0053] Obtain the preset focus data input by the user, determine the preset focus distance corresponding to the preset layer based on the preset focus data, and use the preset focus distance of the preset layer as the preset focus distance corresponding to all test patterns on the preset layer. For example, during the initial debugging, assuming there are 9 preset layers (L1 to L9), and the preset focus data includes 800 μm, 600 μm, 400 μm, 200 μm, 0 μm, -200 μm, -400 μm, -600 μm, and -800 μm, where (x0, y0) is the ideal laser focus position of the laser processing equipment, and (x0, y0) is used as the initial laser focus position of the laser processing equipment. Positive preset focus data indicates upper focus, and negative data indicates lower focus. Therefore, the preset focus distance for the test pattern corresponding to preset layer L1 is set to 800 μm, preset layer L2 to 600 μm, preset layer L3 to 400 μm, preset layer L4 to 200 μm, preset layer L5 to 0 μm, and preset layer L6 to -200 μm. The preset focus distance settings for the test pattern in preset layer L7 are -400 um, for preset layer L8 are -600 um, and for preset layer L9 are -800 um. These are examples without specific limitations.

[0054] S206. Based on the test pattern and the preset defocus distance, control the laser processing equipment to perform laser processing on the test workpiece;

[0055] The laser processing equipment is controlled to perform laser processing on the test workpiece according to the test pattern and the preset focal distance. When the preset focal distance of the test pattern is equal to 0, the laser processing equipment performs laser processing at the initial laser focus position; when the preset focal distance of the test pattern is not equal to 0, the laser processing equipment performs laser processing after adding the preset focal distance to the initial laser focus position. The value of the preset focal distance can be used as a compensation value. The compensation value is added to the initial laser focus position of the laser processing equipment through the software of the laser processing equipment to obtain the compensated laser focus position of the laser processing equipment. Then, the laser processing equipment performs laser processing at the compensated laser focus position. By determining different compensated laser focus positions through different preset focal distances, the actual laser focus position of the laser processing equipment can be found. For example, if the preset focal distance of the test pattern corresponding to preset layer L5 is set to 0 μm, then when processing the test pattern corresponding to preset layer L5, the laser processing equipment will perform laser processing at the initial laser focus position; if the preset focal distance of the test pattern corresponding to preset layer L1 is set to 800 μm, then the initial laser focus position will be used as the reference point and the laser focus will be shifted upwards by 800 μm to obtain the compensated laser focus position. Then, when processing the test pattern corresponding to preset layer L1, the laser processing equipment will perform laser processing at the compensated laser focus position (with the initial laser focus position used as the reference point and the laser focus shifted upwards by 800 μm). This example does not impose specific limitations.

[0056] Optionally, the processing platform 102 adopts a suction platform, which uses suction to adsorb the test workpiece onto the suction platform to ensure that the test workpiece remains parallel to the upper surface of the suction platform.

[0057] Understandably, the test piece can be one or multiple.

[0058] S208. Obtain cutting line detection data on the processed test workpiece;

[0059] Cutting lines on the processed test workpiece can be measured using a high-powered microscope to obtain cutting line detection data. Alternatively, other methods can be used to determine the cutting line detection data, such as using a high-powered camera to capture images and using image analysis software to determine the cutting line detection data based on the images captured by the high-powered camera.

[0060] The cutting line detection data includes position data and line width detection results. The line width detection results are used to describe the width of the cutting line.

[0061] S210. Based on the cutting line detection data, determine the equipment detection result corresponding to the cutting line detection data. The equipment detection result includes one or more of the following: laser focal point position detection result, equipment optical path system detection result, and / or galvanometer XY axis motor detection result.

[0062] Specifically, based on the position data and the linewidth detection results, the device detection results corresponding to the cutting line detection data are determined. Specifically, based on all the linewidth detection results and all the position data, the laser focus position detection result is determined; there are multiple test areas, and the cutting linewidths corresponding to the test patterns in each of the multiple test areas are obtained on the processed test workpiece, resulting in multiple pattern cutting linewidths. Based on the pattern cutting linewidths corresponding to the same preset layer, the device optical path system detection result is determined; there are multiple test areas, and the cutting linewidths corresponding to the target arcs of the test patterns in each of the multiple test areas are obtained on the processed test workpiece, resulting in multiple arc cutting linewidths. Based on the arc cutting linewidths corresponding to the same preset layer, the galvanometer XY axis motor detection result is determined.

[0063] The laser focus position detection result refers to the actual position of the laser focus. The equipment optical path system detection result refers to the detection result of the optical path system of the laser processing equipment, including whether it is normal or abnormal. The optical path system of the laser processing equipment refers to the components or devices used for the laser to propagate from the laser emitter to the two-dimensional galvanometer, excluding the laser itself, but including the two-dimensional galvanometer.

[0064] The detection results of the X and Y axis motors of the galvanometer include the detection results of the X-scan motor and the detection results of the Y-scan motor.

[0065] The cutting line width refers to the line width of the laser cutting line.

[0066] Understandably, the accuracy of the device's detection results can be improved by adjusting the interval between adjacent data in the preset focus data. For example, adjusting the interval between adjacent data in the preset focus data from 200 to 100 will result in a more accurate detection result than one obtained with an interval of 200, thus improving the overall accuracy of the device's detection results.

[0067] This embodiment achieves the following: acquiring test files, determining the preset focal distance corresponding to each test pattern based on the preset layers and preset focal length data of the test files, acquiring cutting line detection data on the processed test workpiece, and determining the corresponding equipment detection results based on the cutting line detection data. The equipment detection results include one or more of the following: laser focus position detection results, equipment optical path system detection results, and / or galvanometer XY-axis motor detection results. The operation is simple, automating the determination of equipment detection results and improving the quality of precise laser processing detection. The entire testing process does not require brightness or sound to determine the laser focus position, nor does it require test paper or metal sheets, reducing safety hazards for operators. Furthermore, it can determine the equipment optical path system detection results and galvanometer XY-axis motor detection results, thereby further improving the quality of precise laser processing detection.

[0068] like Figure 3 As shown, in one embodiment, the number of test areas is nine; the nine test areas are arranged in a 3x3 grid; all test patterns have the same specifications and all test patterns have the same orientation; the target offset positions corresponding to the same preset layer are the same, where the target offset position refers to the offset position of the target test pattern relative to the center point of the test area corresponding to the target test pattern, and the target test pattern can be any one of the test patterns. Arranging them in a 3x3 grid facilitates laser processing by the laser processing equipment and also facilitates obtaining cutting line detection data on the processed test workpiece based on the laser processing results.

[0069] Optionally, the size of the nine-square grid formed by the test areas is smaller than or equal to the processing range of the two-dimensional galvanometer of the laser processing equipment, so as to avoid some test patterns being unable to be laser-processed, thereby further improving the quality of laser processing precision detection.

[0070] Optionally, the center point of one of the test areas overlaps with the center point of the processing range of the two-dimensional galvanometer of the laser processing equipment, which is beneficial for the laser processing equipment to perform laser processing and improves the efficiency of precise detection of laser processing.

[0071] All the test patterns have the same specifications and orientation, and the target offset positions corresponding to the same preset layer are the same. This facilitates rapid comparison and analysis of the cutting line detection data, further improving the efficiency of precise laser processing detection.

[0072] like Figure 3 and Figure 4As shown, in one embodiment, the test area includes nine test patterns arranged in a 3x3 grid; all test patterns are identical in size and orientation; and the distance between any two adjacent test patterns is the same. Arranging the nine test patterns in a 3x3 grid facilitates laser processing by the laser processing equipment. The identical size and orientation of all test patterns facilitate rapid comparative analysis of cutting line detection data, further improving the efficiency of precise laser processing detection. The equidistant distance between adjacent test patterns simplifies the control of the laser processing equipment. For example, as... Figure 4 As shown, the test area corresponds to 9 preset layers (L1 to L9), and each preset layer corresponds to one test pattern. The distances between L1 and L2 (the distance between L1 and L2 refers to the distance between the center point of the test pattern corresponding to L1 and the center point of the test pattern corresponding to L2), L1 and L6, L7 and L6, L7 and L8, L9 and L8, L9 and L4, L3 and L4, L3 and L2, L6 and L5, L4 and L5, L8 and L5, and L2 and L5 are the same.

[0073] Optionally, the preset focus distance of the test pattern at the center of the 3x3 grid can be set to 0.

[0074] like Figure 4 As shown, in one embodiment, the test pattern includes one or more of the following: a circular shape, a star-shaped shape, and / or a square shape; the center points of all the shapes in the test pattern overlap; when the test pattern includes both the square shape and the star-shaped shape, the vertices of the square shape are located on the lines of the star-shaped shape. The circular shape is composed of arcs, the star-shaped shape is composed of multiple intersecting lines, and the square shape is a closed shape composed of four straight lines intersecting perpendicularly in pairs. Combining one or more of the following shapes into a test pattern facilitates comparative analysis of the cutting line detection data after laser processing.

[0075] like Figure 5 As shown, in one embodiment, acquiring cutting line detection data on the processed test workpiece and determining the equipment detection result corresponding to the cutting line detection data includes:

[0076] S502. Obtain a test file, wherein the test file has at least one test area and includes multiple preset layers, and each preset layer has a corresponding test pattern in each test area.

[0077] S504. Determine the preset focus distance corresponding to each test pattern based on the preset layer and preset focus data;

[0078] S506. Based on the test pattern and the preset defocus distance, control the laser processing equipment to perform laser processing on the test workpiece;

[0079] S508. Obtain the cutting line width corresponding to the test pattern on the processed test workpiece, and obtain multiple pattern cutting line widths;

[0080] Optionally, the minimum value of the cutting line width in each processing pattern on the processed test workpiece can be used as the pattern cutting line width of the test pattern corresponding to that processing pattern.

[0081] Optionally, the average value of the cutting line width in each processing pattern on the processed test workpiece can be used as the pattern cutting line width of the test pattern corresponding to that processing pattern.

[0082] Optionally, since each test pattern has the same preset focal distance, the width of any cutting line in the processed pattern obtained after laser processing of the test pattern on the processed test workpiece can be used as the pattern cutting line width of the test pattern, thereby simplifying the method of obtaining the pattern cutting line width.

[0083] It is understood that each of the test patterns corresponds to a pattern cutting line width.

[0084] S510. Determine the minimum value from the multiple pattern cutting line widths as the target cutting line width;

[0085] The minimum value is determined from the plurality of pattern cutting line widths, and the pattern cutting line width corresponding to the minimum value is taken as the target cutting line width.

[0086] For example, if there are 9 preset layers (L1 to L9) and 9 test areas, and each preset layer corresponds to a test pattern in each test area, then 81 test patterns can be obtained. The 81 test patterns correspond to 81 pattern cutting line widths. The minimum value is determined from the 81 pattern cutting line widths, and the pattern cutting line width corresponding to the minimum value is taken as the target cutting line width.

[0087] S512. Determine the target test pattern corresponding to the target cutting line width based on the target cutting line width;

[0088] The test pattern corresponding to the target cutting line width is used as the target test pattern corresponding to the target cutting line width.

[0089] S514. Determine the target preset defocus distance based on the target test pattern;

[0090] The preset defocus distance corresponding to the target test pattern is taken as the target preset defocus distance.

[0091] S516. Determine the laser focus position detection result based on the target preset defocus distance.

[0092] Specifically, when the target preset focus distance is equal to 0, the initial laser focus position of the laser processing equipment is used as the laser focus position detection result; when the target preset focus distance is not equal to 0, the initial laser focus position of the laser processing equipment is added to the target preset focus distance to obtain the laser focus position detection result. For example, if the initial laser focus position of the laser processing equipment is (x1, y1) and the target preset focus distance is 200 μm, then the initial laser focus position of the laser processing equipment is used as the reference point and an upward focus of 200 μm is applied to obtain the laser focus position detection result.

[0093] In one embodiment, determining the laser focus position detection result based on the target preset focus distance further includes: when the target preset focus distance is not equal to 0, adjusting the focus position of the laser processing equipment based on the laser focus position detection result, and performing the step of determining the preset focus distance of each test pattern based on the preset layer and preset focus data; when the target preset focus distance is equal to 0, using the laser focus position detection result as the target focus position of the laser processing equipment.

[0094] Specifically, when the target preset focus distance is not equal to 0, the compensation value is added to the initial laser focus position of the laser processing equipment through the software program to obtain the compensated laser focus position of the laser processing equipment. This compensated laser focus position is identical to the laser focus position detection result. The compensated laser focus position is then used as the initial laser focus position for the next laser processing operation, and steps S504 to S516 are executed for testing and verification. When the target preset focus distance is equal to 0, it indicates that the initial laser focus position of the laser processing equipment is correct. Therefore, the laser focus position detection result (which is also the initial laser focus position of the laser processing equipment) can be used as the target focus position of the laser processing equipment. The target focus position is used as the final result of software focusing for laser processing production. The entire process achieves software focusing, which simplifies the control of the laser processing equipment, improves the accuracy of laser processing, and enhances the quality of the processed products.

[0095] like Figure 6 As shown, in one embodiment, the step of acquiring cutting line detection data on the processed test workpiece and determining the equipment detection result corresponding to the cutting line detection data further includes:

[0096] S602. Obtain a test file, wherein the test file has at least one test area and includes multiple preset layers, wherein each preset layer has a corresponding test pattern in each test area;

[0097] S604. Determine the preset focus distance corresponding to each test pattern based on the preset layer and preset focus data;

[0098] S606. Based on the test pattern and the preset defocus distance, control the laser processing equipment to perform laser processing on the test workpiece;

[0099] S608. The number of test areas is multiple. The cutting line widths corresponding to the test patterns of the multiple test areas on the processed test workpiece are obtained to obtain multiple pattern cutting line widths.

[0100] The number of test areas is multiple. The cutting line widths corresponding to all test patterns in all test areas are obtained on the processed test workpiece, resulting in multiple pattern cutting line widths. For example, if there are 9 preset layers (L1 to L9), 9 test areas, and each preset layer corresponds to one test pattern in each test area, then 81 test patterns can be obtained, and 81 test patterns correspond to 81 pattern cutting line widths.

[0101] S610. Determine whether the pattern cutting line widths corresponding to the same preset layer are consistent;

[0102] Determine whether the pattern cutting line widths corresponding to all test patterns located on the same preset layer are consistent.

[0103] It is understandable that the step of judging whether the cut line widths of all the patterns corresponding to the same preset layer are consistent can be performed one by one on each preset layer.

[0104] S612. When the pattern cutting line widths corresponding to the same preset layer are consistent, the detection result of the device optical path system is determined to be normal.

[0105] Since the preset focal distances of the patterns corresponding to the same preset layer are the same, and assuming the optical path system settings of the laser processing equipment are the same and functioning normally, the laser processing equipment performs the same degree of laser processing. The most direct manifestation of the same degree of laser processing is that the cutting line width is the same. Therefore, when the cutting line widths of the patterns corresponding to the same preset layer are consistent, it can be determined that the detection result of the equipment's optical path system is normal.

[0106] Each preset layer is analyzed individually. When the pattern cutting line widths corresponding to all preset layers are consistent, the detection result of the device's optical path system is determined to be normal. For example, if there are 9 preset layers (L1 to L9) and 9 test areas, with each preset layer corresponding to one test pattern in each test area, then the detection result of the device's optical path system is determined to be normal when the pattern cutting line widths of the 9 test patterns in L1, L2, L3, L4, L5, L6, L7, L8, and L9 are simultaneously consistent. Here, "the pattern cutting line widths of the 9 test patterns are consistent" means that all 9 test patterns have the same pattern cutting line width.

[0107] S614. When the pattern cutting line widths corresponding to the same preset layer are inconsistent, the detection result of the device optical path system is determined to be abnormal.

[0108] When the pattern cutting line widths corresponding to the same preset layer are inconsistent, it indicates that the optical path system of the device has not transmitted the laser as expected, resulting in laser offset. The laser offset leads to different degrees of laser processing in different test areas.

[0109] Each preset layer is analyzed individually. When the pattern cutting line widths corresponding to the same preset layer are inconsistent, the detection result of the device's optical path system is determined to be abnormal. For example, if there are 9 preset layers (L1 to L9), 9 test areas, and each preset layer corresponds to one test pattern in each test area, then if any of the following occurs: inconsistent pattern cutting line widths among the 9 test patterns in L1, L2, L3, L4, L5, L6, L7, L8, and L9, the detection result of the device's optical path system is determined to be abnormal. Inconsistent pattern cutting line widths among the 9 test patterns indicate that not all of the 9 test patterns have the same pattern cutting line width.

[0110] This embodiment enables the determination of the detection results of the equipment's optical path system based on whether the cutting line widths of the patterns corresponding to the same preset layer are consistent. This facilitates timely adjustments based on the detection results of the equipment's optical path system, further improving the quality of products processed by laser processing equipment.

[0111] like Figure 7 As shown, in one embodiment, the step of acquiring cutting line detection data on the processed test workpiece and determining the equipment detection result corresponding to the cutting line detection data further includes:

[0112] S702. Obtain a test file, wherein the test file has at least one test area and includes multiple preset layers, and each preset layer has a corresponding test pattern in each test area.

[0113] S704. Determine the preset focus distance corresponding to each test pattern based on the preset layer and preset focus data;

[0114] S706. Based on the test pattern and the preset defocus distance, control the laser processing equipment to perform laser processing on the test workpiece;

[0115] S708. The number of test areas is multiple. The cutting line widths corresponding to the target arcs of the test patterns in the multiple test areas are obtained on the processed test workpiece to obtain multiple arc cutting line widths.

[0116] Specifically, the cutting line widths corresponding to the target arcs of all test patterns for all test areas are obtained on the processed test workpiece, resulting in multiple pattern cutting line widths. Each test pattern corresponds to one target arc.

[0117] The target arc is a segment of arc in the test pattern. It can be a major arc, a minor arc, or a semicircular arc. A major arc is an arc that is larger than a semicircle, and a minor arc is an arc that is smaller than a semicircle.

[0118] Optionally, the curve is a 135° optimal arc, which is beneficial for accurate and quick selection of the curve.

[0119] Optionally, the arc is a minor arc of 45°, which is beneficial for accurate and quick selection of the arc.

[0120] Optionally, the target arcs corresponding to the multiple arc cutting line widths are of the same type. Same type means that the size of the arcs and their relative positions in the test pattern are all the same. For example, they are all upper semicircles, or all lower semicircles, or all 135° dominant arcs (arcs between 45° and 180°), or all 45° dominant arcs (arcs between 0° and 45°). These are just examples and are not specifically limited.

[0121] S710. Determine whether the arc cutting line widths corresponding to the same preset layer are consistent;

[0122] Determine whether the arc cutting line widths corresponding to the target arcs of all test patterns located on the same preset layer are consistent.

[0123] It is understandable that the step of judging whether the width of all the arc cutting lines corresponding to the same preset layer is consistent can be performed one by one for each preset layer.

[0124] S712. When the arc cutting line width corresponding to the same preset layer is consistent, the detection result of the XY axis motor of the galvanometer is determined to be normal.

[0125] A two-dimensional galvanometer refers to a two-dimensional scanning galvanometer, which is a vector scanning device. It includes an X-scanning motor, a Y-scanning motor, and an XY optical scanning head. By driving the X-scanning motor and the Y-scanning motor, the XY optical scanning head is driven to scan in the XY plane, thereby realizing the control of the laser beam deflection in the XY plane.

[0126] When the arc cutting line widths corresponding to the same preset layer are consistent, it can be determined that the X-scanning motor and the Y-scanning motor deflect in a preset manner, thereby confirming that the X and Y axis motor detection results of the galvanometer are normal.

[0127] Each preset layer is analyzed individually. When the arc cutting line width corresponding to all preset layers is consistent, the detection result of the XY axis motor of the galvanometer is determined to be normal. For example, if there are 9 preset layers (L1 to L9) and 9 test areas, with each preset layer corresponding to a test pattern in each test area, and the target arc is the upper semicircle of the test pattern, then if the following conditions are met simultaneously: the arc cutting line widths of the 9 test patterns in L1, L2, L3, L4, L5, L6, L7, L8, and L9 are all consistent, then the XY-axis motor detection result of the galvanometer is determined to be normal. Here, "the arc cutting line widths of the target arcs of the 9 test patterns are consistent" means that the arc cutting line widths of the target arcs of all 9 test patterns are identical.

[0128] S714. When the arc cutting line widths corresponding to the same preset layer are inconsistent, the XY axis motor detection results of the galvanometer are determined to be abnormal.

[0129] When the arc cutting line widths corresponding to the same preset layer are inconsistent, it indicates that the X scanning motor and / or Y scanning motor have not deflected in the preset manner, resulting in laser offset. Laser offset leads to different degrees of laser processing in different test areas.

[0130] Each preset layer is analyzed individually. When the arc cutting line width corresponding to the same preset layer is inconsistent, the XY-axis motor detection result of the galvanometer is determined to be abnormal. For example, if there are 9 preset layers (L1 to L9), 9 test areas, and each preset layer corresponds to one test pattern in each test area, and the target arc is the upper semicircle of the test pattern, then the following inconsistencies will occur: Inconsistent arc cutting line widths in the 9 test patterns of L1, L2, L3, L4, and L5. If any one of the following occurs: inconsistent arc cutting line widths of the target arcs of the nine test patterns L6, inconsistent arc cutting line widths of the target arcs of the nine test patterns L7, inconsistent arc cutting line widths of the target arcs of the nine test patterns L8, or inconsistent arc cutting line widths of the target arcs of the nine test patterns L9, then the XY-axis motor detection result of the galvanometer is determined to be abnormal. Among them, inconsistent arc cutting line widths of the target arcs of the nine test patterns indicate that the arc cutting line widths of the target arcs of the nine test patterns are not all the same.

[0131] This embodiment determines the XY-axis motor detection results of the galvanometer by judging whether the arc cutting line widths corresponding to the same preset layer are consistent. This facilitates timely adjustments based on the XY-axis motor detection results, further improving the quality of products processed by the laser processing equipment.

[0132] In one embodiment, the method further includes: setting the laser processing equipment to increase the spacing of the focused spot, wherein setting the spacing of the focused spot includes: increasing the galvanometer scanning rate of the laser processing equipment and / or decreasing the pulse frequency of the laser processing equipment; controlling the laser processing equipment after setting the spacing of the focused spot to perform laser processing on the test workpiece to obtain multiple non-overlapping focused spot cutting points; acquiring the shape data of the multiple non-overlapping focused spot cutting points as focused spot detection data; determining the roundness analysis result and energy distribution analysis result of the focused spot based on the focused spot detection data; and determining the laser spot detection result based on the roundness analysis result and the energy distribution analysis result.

[0133] The laser spot detection results include the focusing effect detection results of the focused spot and the energy distribution detection results of the focused spot.

[0134] The laser processing equipment is configured to increase the spacing of the focused light spots, so that the laser processing equipment changes from a cutting line to a cutting point line (the points do not overlap), with each point representing a focused light spot cutting point.

[0135] It is understood that the laser processing equipment, after controlling the setting of increasing the spacing of the focused spot, does not specifically limit the laser processing of the test workpiece; it can be a straight line or the aforementioned test pattern.

[0136] Obtaining the shape data of the multiple non-overlapping focused spot cutting points as focused spot detection data includes: measuring the cutting point lines on the processed test workpiece using a high-power microscope to obtain focused spot detection data; or using other means to determine focused spot detection data, such as taking images with a high-power camera and using image analysis software to determine focused spot detection data based on the images taken by the high-power camera.

[0137] Based on the analysis of the focused spot detection data, when the size of the circle of the maximum contour of the focused spot cutting point meets the expected size and the roundness of the circle of the maximum contour of the focused spot cutting point meets the expected roundness, the focused spot focusing effect detection result is determined to be normal; otherwise, the focused spot focusing effect detection result is determined to be abnormal.

[0138] Based on the analysis of the focused spot detection data, the focused spot energy distribution detection result is determined to be normal when the energy distribution at the focused spot cutting point meets the expected energy distribution; otherwise, the focused spot energy distribution detection result is determined to be abnormal. For example, the expected energy is high (deep cutting depth) at the center (the center point of the circle of the maximum contour of the focused spot cutting point, which is located on the surface of the test workpiece near the two-dimensional galvanometer), and low further away from the center (the cutting depth is inversely proportional to the distance from the center). Moreover, the energy is symmetrically distributed around the center point of the circle of the maximum contour of the focused spot cutting point (when the focused spot cutting point is projected onto the surface of the test workpiece near the two-dimensional galvanometer, the projected pattern is close to a concentric circle).

[0139] By increasing the galvanometer scanning rate of the laser processing equipment and / or decreasing the pulse frequency of the laser processing equipment, the focusing effect and energy distribution of the focused spot can be detected. The operation is simple, thereby further improving the quality of precise detection in laser processing.

[0140] In one embodiment, before obtaining the test file, the method further includes: adjusting the focusing lens device so that the X direction of the focusing lens device is parallel to the X direction of the processing platform, and the Y direction of the focusing lens device is parallel to the Y direction of the processing platform. This ensures that the distance between the focusing lens device and the upper surface of the processing platform is the same during processing, which helps improve the consistency of laser processing equipment.

[0141] The X-direction of the machining platform is perpendicular to the Y-direction.

[0142] In one embodiment, the test workpiece may be adjusted to remain horizontal on the machining platform. Specifically, such as... Figure 1 As shown, the test workpiece can be placed on the processing platform 102, and the processing platform 102 can be adjusted to evenly adsorb the test workpiece to ensure that the test workpiece remains horizontal under the adsorption. This horizontal position can be ensured on the processing platform 102 by an adsorption device or a fixing buckle. By pre-adjusting the laser equipment, interference from hardware errors during laser processing can be eliminated, resulting in more accurate test results.

[0143] In one embodiment, before acquiring the test file, the method further includes: setting the distance between the focusing lens device and the processing platform to a preset focal length value, where the preset focal length value is the theoretical focal length value of the focusing lens of the focusing lens device. Setting the distance between the focusing lens and the processing platform to a preset focal length value is to eliminate the influence of hardware errors on the testing process.

[0144] like Figure 8 As shown, in one embodiment, a detection device for laser processing equipment is proposed, applied to laser processing equipment, the device comprising:

[0145] The test file acquisition module 802 is used to acquire a test file, wherein the test file has at least one test area and includes multiple preset layers, and each preset layer has a corresponding test pattern in each test area.

[0146] The focus distance acquisition module 804 is used to determine the preset focus distance corresponding to each test pattern based on the preset layer and preset focus data.

[0147] The processing module 806 is used to control the laser processing equipment to perform laser processing on the test workpiece according to the test pattern and the preset focal distance;

[0148] The detection result determination module 808 is used to acquire cutting line detection data on the processed test workpiece, and determine the equipment detection result corresponding to the cutting line detection data based on the cutting line detection data. The equipment detection result includes one or more of the following: laser focus position detection result, equipment optical path system detection result, and / or galvanometer XY axis motor detection result.

[0149] This embodiment achieves the following: acquiring test files, determining the preset focal distance corresponding to each test pattern based on the preset layers and preset focal length data of the test files, acquiring cutting line detection data on the processed test workpiece, and determining the corresponding equipment detection results based on the cutting line detection data. The equipment detection results include one or more of the following: laser focus position detection results, equipment optical path system detection results, and / or galvanometer XY-axis motor detection results. The operation is simple, automating the determination of equipment detection results and improving the quality of precise laser processing detection. The entire testing process does not require brightness or sound to determine the laser focus position, nor does it require test paper or metal sheets, reducing safety hazards for operators. Furthermore, it can determine the equipment optical path system detection results and the galvanometer XY-axis motor detection results, thereby further improving the quality of precise laser processing detection.

[0150] Figure 9 An internal structural diagram of a computer device in one embodiment is shown. This computer device can specifically be a terminal or a server. Figure 9 As shown, the computer device includes a processor, memory, and network interface connected via a system bus. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system and may also store a computer program. When executed by the processor, this computer program enables the processor to implement a detection method for the laser processing equipment. The internal memory may also store a computer program, which, when executed by the processor, enables the processor to implement the detection method for the laser processing equipment. Those skilled in the art will understand that... Figure 9 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0151] In one embodiment, the detection method for laser processing equipment provided in this application can be implemented as a computer program, and the computer program can be implemented as follows: Figure 9The computer device shown runs on this device. The computer device's memory can store various program templates that constitute a detection apparatus for a laser processing device. For example, these include a test file acquisition module 802, a focal distance acquisition module 804, a processing module 806, and a detection result determination module 808.

[0152] In one embodiment, a storage medium is provided that stores a computer instruction program, which, when executed by a processor, causes the processor to perform the following method steps:

[0153] A test file is obtained, the test file having at least one test area and including multiple preset layers, each preset layer having a corresponding test pattern in each test area; a preset defocus distance corresponding to each test pattern is determined based on the preset layers and preset defocus data; the laser processing equipment is controlled to perform laser processing on the test workpiece based on the test pattern and the preset defocus distance; cutting line detection data is obtained on the processed test workpiece; based on the cutting line detection data, the equipment detection result corresponding to the cutting line detection data is determined, the equipment detection result including one or more of the following: laser focus position detection result, equipment optical path system detection result, and / or galvanometer XY axis motor detection result.

[0154] In one embodiment, a laser processing apparatus is provided, including at least one memory and at least one processor. The memory stores a computer instruction program, which, when executed by the processor, causes the processor to perform the following method steps:

[0155] A test file is obtained, the test file having at least one test area and including multiple preset layers, each preset layer having a corresponding test pattern in each test area; a preset defocus distance corresponding to each test pattern is determined based on the preset layers and preset defocus data; the laser processing equipment is controlled to perform laser processing on the test workpiece based on the test pattern and the preset defocus distance; cutting line detection data is obtained on the processed test workpiece; based on the cutting line detection data, the equipment detection result corresponding to the cutting line detection data is determined, the equipment detection result including one or more of the following: laser focus position detection result, equipment optical path system detection result, and / or galvanometer XY axis motor detection result.

[0156] It should be noted that the above-mentioned laser device detection method, laser device detection apparatus, storage medium and laser processing equipment belong to the same general inventive concept, and the contents of the embodiments of the laser device detection method, laser device detection apparatus, storage medium and laser processing equipment are applicable to each other.

[0157] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0158] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0159] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for detecting laser processing equipment, characterized in that, The method, applied to laser processing equipment, includes: Obtain a test file, the test file having at least one test area, the test file including multiple preset layers, the preset layers having a corresponding test pattern in each test area; Determine the preset focus distance corresponding to each test pattern based on the preset layer and preset focus data; Based on the test pattern and the preset focal distance, the laser processing equipment is controlled to perform laser processing on the test workpiece; Obtain cutting line detection data on the processed test workpiece; Based on the cutting line detection data, determine the equipment detection results corresponding to the cutting line detection data, including the XY axis motor detection results of the galvanometer; The step of acquiring cutting line detection data on the processed test workpiece and determining the equipment detection result corresponding to the cutting line detection data further includes: The number of test areas is multiple, and the cutting line widths corresponding to the target arcs of the test patterns in the multiple test areas are obtained on the processed test workpiece to obtain multiple arc cutting line widths; Determine whether the arc cutting line widths corresponding to the same preset layer are consistent; When the arc cutting line width corresponding to the same preset layer is consistent, the detection result of the XY axis motor of the galvanometer is determined to be normal. When the arc cutting line widths corresponding to the same preset layer are inconsistent, the XY axis motor detection results of the galvanometer are determined to be abnormal.

2. The detection method for laser processing equipment according to claim 1, characterized in that, The number of test areas is 9; The nine test areas are arranged in a 3x3 grid; All the test patterns are identical in specifications and all the test patterns are oriented in the same direction; The target offset positions corresponding to the same preset layer are the same. The target offset position refers to the offset position of the target test pattern relative to the center point of the test area corresponding to the target test pattern. The target test pattern can be any one of the test patterns.

3. The detection method for laser processing equipment according to claim 1, characterized in that, The test pattern includes one or more of the following: circular, star-shaped, and / or square patterns. The center points of all the graphics in the test pattern overlap. When the test pattern includes both the square shape and the cross shape, the vertices of the square shape are located on the lines of the cross shape.

4. The detection method for laser processing equipment according to claim 1, characterized in that, The device The detection results also include laser focus position detection results. The process of acquiring cutting line detection data on the processed test workpiece and determining the corresponding equipment detection results based on the cutting line detection data includes: The cutting line widths of the test patterns on the processed test workpieces are obtained respectively, resulting in multiple pattern cutting line widths; The minimum value among the multiple pattern cutting line widths is determined as the target cutting line width; Based on the target cutting line width, determine the target test pattern corresponding to the target cutting line width; Based on the target test pattern, determine the target preset defocus distance; The laser focal point position detection result is determined based on the target preset defocus distance.

5. The detection method for laser processing equipment according to claim 4, characterized in that, The method for determining the laser focal position detection result based on the target preset defocus distance further includes: When the target preset defocus distance is not equal to 0, the focus position of the laser processing equipment is adjusted according to the laser focus position detection result, and the step of determining the preset defocus distance of each test pattern according to the preset layer and preset defocus data is performed; When the target preset defocus distance is equal to 0, the laser focus position detection result is taken as the target focus position of the laser processing equipment.

6. The detection method for laser processing equipment according to claim 3, characterized in that, The device The test results also include the test results from the equipment's optical path system. Acquiring cutting line detection data on the processed test workpiece and determining the corresponding equipment test results based on the cutting line detection data further includes: The number of test areas is multiple, and the cutting line widths corresponding to the test patterns of the multiple test areas are obtained on the processed test workpiece to obtain multiple pattern cutting line widths; Determine whether the pattern cutting line widths corresponding to the same preset layer are consistent; When the pattern cutting line widths corresponding to the same preset layer are consistent, the detection result of the device optical path system is determined to be normal; When the pattern cutting line widths corresponding to the same preset layer are inconsistent, the detection result of the device's optical path system is determined to be abnormal.

7. The detection method for laser processing equipment according to claim 1, characterized in that, The method further includes: The laser processing equipment is configured to increase the spacing of the focused light spot, which includes increasing the galvanometer scanning rate of the laser processing equipment and / or decreasing the pulse frequency of the laser processing equipment. The laser processing equipment, after controlling the setting of increasing the spacing of the focused light spots, performs laser processing on the test workpiece to obtain multiple non-overlapping focused light spot cutting points; The shape data of the multiple non-overlapping focused spot cutting points are obtained as focused spot detection data; Based on the focused spot detection data, the roundness analysis results and energy distribution analysis results of the focused spot are determined; Based on the roundness analysis results and the energy distribution analysis results, the laser spot detection results are determined.

8. The detection method for laser processing equipment according to claim 7, characterized in that, The laser spot detection results include focused spot focusing effect detection results and focused spot energy distribution detection results. Determining the laser spot detection results based on the roundness analysis results and the energy distribution analysis results includes: When the size of the circle of the maximum outline of the focused spot cutting point meets the expected size and the roundness of the circle of the maximum outline of the focused spot cutting point meets the expected roundness, the focusing effect test result of the focused spot is determined to be normal; when the size of the circle of the maximum outline of the focused spot cutting point does not meet the expected size or the roundness of the circle of the maximum outline of the focused spot cutting point does not meet the expected roundness, the focusing effect test result of the focused spot is determined to be abnormal. When the energy distribution at the focused spot cutting point meets the expected energy distribution, the focused spot energy distribution detection result is determined to be normal; when the energy distribution at the focused spot cutting point does not meet the expected energy distribution, the focused spot energy distribution detection result is determined to be abnormal.

9. A detection device for laser processing equipment, characterized in that, The device is used in laser processing equipment and includes: A test file acquisition module is used to acquire a test file, wherein the test file has at least one test area and includes multiple preset layers, wherein each preset layer has a corresponding test pattern in each test area; The focus distance acquisition module is used to determine the preset focus distance corresponding to each of the test patterns based on the preset layer and preset focus data. The processing module is used to control the laser processing equipment to perform laser processing on the test workpiece according to the test pattern and the preset focal distance; The detection result determination module is used to acquire cutting line detection data on the processed test workpiece, and determine the equipment detection result corresponding to the cutting line detection data based on the cutting line detection data. The equipment detection result includes the detection result of the galvanometer XY-axis motor. There are multiple test areas. The module acquires the cutting line width corresponding to the target arc of the test pattern in each of the multiple test areas on the processed test workpiece, resulting in multiple arc cutting line widths. The module determines whether the arc cutting line widths corresponding to the same preset layer are consistent. When the arc cutting line widths corresponding to the same preset layer are consistent, the galvanometer XY-axis motor detection result is determined to be normal. When the arc cutting line widths corresponding to the same preset layer are inconsistent, the galvanometer XY-axis motor detection result is determined to be abnormal.

10. A storage medium storing a computer instruction program, characterized in that, When the computer instruction program is executed by the processor, it causes the processor to perform the steps of the method as described in any one of claims 1 to 8.

11. A laser processing device, characterized in that, It includes at least one memory and at least one processor, the memory storing a computer instruction program, which, when executed by the processor, causes the processor to perform the steps of the method as described in any one of claims 1 to 8.

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