Chamfering device and method

Abstract

The application discloses a chamfering device and a processing method. The chamfering device comprises a laser emitting assembly, a positioning assembly and a transmission assembly. The laser emitting assembly comprises a laser source and a laser cutting head. The laser source is used for providing a CO2 laser beam for chamfering. The laser cutting head is used for converting the CO2 laser beam into a defocused CO2 laser beam and emitting the defocused CO2 laser beam to a chamfering edge of a workpiece to be processed. The positioning assembly is used for adjusting the relative posture of the laser cutting head and the workpiece to be processed, so that the defocused CO2 laser beam is irradiated to the chamfering edge at a preset incident angle. The transmission assembly is used for driving the relative movement of the laser emitting assembly and the workpiece to be processed, so that the defocused CO2 laser beam moves along the chamfering edge, and the chamfering processing of the chamfering edge is realized. The chamfering device utilizes the defocused CO2 laser beam to irradiate the chamfering edge for chamfering, and has the advantages of good processing environment, no water pollution, no abrasive wear, low noise and the like.

Description

Technical Field

[0001] This invention relates to the field of glass processing technology, and in particular to a chamfering apparatus and processing method that can be used for chamfering hard and brittle materials such as glass. Background Technology

[0002] Currently, in the production process of hard and brittle finished products, such as photovoltaic glass, engineering glass, bathroom glass, and home appliance panel glass, it is often necessary to chamfer the sharp right-angled edges to remove the right-angled edges. This is to prevent damage to the right-angled edges during normal use or handling of the glass, and also to prevent the sharp right-angled edges from injuring people or other objects.

[0003] Chamfering of hard and brittle materials such as glass is typically performed using CNC grinding machines. This involves using abrasives and grinding wheels to chamfer the right-angled edges of these materials into different shapes. However, CNC grinding consumes cutting fluid and diamond grit, generates a significant amount of grinding debris (such as glass shards), which is environmentally unfriendly. Furthermore, it is slow, inefficient, and produces chamfered surfaces with high roughness and poor quality. Therefore, it is necessary to propose a novel chamfering technology to address the problems of low efficiency, high surface roughness, poor quality, and environmental impact associated with existing chamfering techniques. Summary of the Invention

[0004] The purpose of this invention is to provide a novel chamfering processing device and method that can be used for hard and brittle materials such as glass, in order to solve the problems of low processing efficiency, large roughness of chamfered surfaces, insufficient quality, and environmental protection problems existing in the above-mentioned existing chamfering processing technology.

[0005] To achieve the above objectives, the present invention provides the following solution:

[0006] This invention provides a chamfering processing apparatus, comprising:

[0007] A laser emitting assembly includes a laser source and a laser cutting head. The laser source is used to provide a CO2 laser beam for chamfering. The laser cutting head is disposed on the emission path of the CO2 laser beam and is used to convert the CO2 laser beam into a defocused CO2 laser beam and emit the defocused CO2 laser beam onto the chamfered edge of the workpiece.

[0008] A positioning component is connected to at least one of the laser emitting component and the workpiece to be processed. The positioning component is used to adjust the relative posture of the laser cutting head and the workpiece to be processed so that the defocused CO2 laser beam irradiates the edge to be chamfered at a preset incident angle.

[0009] A transmission assembly is configured to drive at least one of the laser emitting assembly and the workpiece to move, so that the laser cutting head and the workpiece move relative to each other, the defocused CO2 laser beam moves along the edge to be chamfered, and the chamfering of the edge to be chamfered is realized.

[0010] Optionally, the laser source is a continuous CO2 laser, and the laser cutting head comprises a corner nozzle, the corner nozzle comprises a first straight pipe section and a second straight pipe section arranged in sequence along the emission path of the CO2 laser beam, the first straight pipe section and the second straight pipe section are arranged at an angle, a mirror for projecting the light beam to the second straight pipe section is arranged in the first straight pipe section, and a focusing mirror is arranged in the second straight pipe section.

[0011] Optionally, the laser emitting assembly further comprises a light guide system arranged on the emission path of the CO2 laser beam, and the light guide system is located between the laser source and the laser cutting head; the light guide system comprises an expander mirror and at least one reflecting mirror arranged in sequence along the emission path of the CO2 laser beam; or the light guide system comprises a collimator and at least one reflecting mirror arranged in sequence along the emission path of the CO2 laser beam.

[0012] Optionally, a support is further provided, the transmission assembly is arranged on the support, the positioning assembly is arranged on the transmission assembly, and the laser emitting assembly is connected with the positioning assembly, wherein the positioning assembly is configured to adjust the posture of the laser cutting head relative to the workpiece, and the transmission assembly is configured to drive the laser cutting head to move along the edge to be chamfered.

[0013] The support is further provided with a chamfering station and a fixing clamp, the chamfering station is configured to load the workpiece, and the fixing clamp is configured to fix the workpiece on the chamfering station.

[0014] Optionally, the positioning assembly comprises:

[0015] A visual positioning system is configured to monitor the position information of the edge to be chamfered.

[0016] A fine adjustment mechanism is mounted with the laser emitting assembly, the fine adjustment mechanism is communicatively connected with the visual positioning system, and the fine adjustment mechanism is configured to adjust the posture of the laser cutting head relative to the workpiece according to the position information, so that the defocused CO2 laser beam is irradiated onto the edge to be chamfered at the preset incident angle.

[0017] Optionally, a preheating assembly is further included, which is arranged along the extension direction of the chamfered edge to be chamfered and in front of the movement direction of the laser emitting assembly, so as to preheat the position to be processed on the chamfered edge to be chamfered before the defocused CO2 laser beam emitted by the laser emitting assembly reaches the position to be processed; the preheating assembly is a flame sprayer or the laser emitting assembly.

[0018] Optionally, a chamfered surface finishing assembly is further included, which is arranged on one side of the chamfering station and used for finishing the chamfered surface after the chamfering process of the chamfered edge to be chamfered by the laser emitting assembly; the chamfered surface finishing assembly is an infrared nanosecond laser cooperating with a galvanometer system, or a green nanosecond laser cooperating with a galvanometer system.

[0019] The application further provides a chamfering method, which directly emits a defocused CO2 laser beam to the chamfered edge to be chamfered of a workpiece to be processed and moves the defocused CO2 laser beam along the chamfered edge to be chamfered, so as to realize the chamfering process of the chamfered edge to be chamfered.

[0020] Optionally, the defocused CO2 laser beam is used to perform one or more reciprocating scans along the chamfered edge to be chamfered at the starting point and / or the ending point of the chamfered edge to be chamfered.

[0021] Optionally, the position to be chamfered is preheated by a flame or a CO2 laser beam before the defocused CO2 laser beam used for chamfering reaches the position to be chamfered on the chamfered edge to be chamfered.

[0022] The application has the following technical effects compared with the prior art:

[0023] The chamfering device provided by the application has the following advantages:

[0024] (1) The CO2 laser with high absorption to glass is used as the laser source, and the defocused CO2 laser beam is used to irradiate the chamfered edge to be chamfered, so that the chamfering efficiency is high, the chamfering quality is high, and the surface is smooth and bright.

[0025] (2) Without the need to spend cutting fluid, no cutting debris formation, with good processing environment, no water pollution, no abrasive wear, low noise and other advantages, environmental protection effect is obvious, without the need for water treatment purification equipment required by traditional edging machine, improve the labor environment, green processing.

[0026] (3) The laser chamfering technology of the present application can be widely used in the processing and application of photovoltaic glass, engineering glass, bathroom glass, household appliance panel glass and other glass, which will bring huge economic and social benefits. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0028] Figure 1 The isometric view of the chamfering device disclosed in the embodiments of the present application;

[0029] Figure 2 The front view of the chamfering device; Figure 1

[0030] Figure 3 The side view of the chamfering device; Figure 1

[0031] The rear view of the chamfering device; Figure 4 Figure 1 The working principle diagram of the laser cutting head in the chamfering device disclosed in the embodiments of the present application;

[0032] Figure 5 The principle diagram of chamfering two groups of edges to be chamfered at the same time disclosed in the embodiments of the present application;

[0033] Figure 6 The structural arrangement diagram of two groups of laser cutting heads disclosed in the embodiments of the present application.

[0034] Figure 7 Among them, the reference signs are:

[0035] 100, chamfering device;

[0036] 100, chamfering device;

[0037] ​​1, laser emitting assembly; 11, laser source; 12, laser cutting head; 121, first straight pipe section; 122, second straight pipe section; 13, CO2 laser beam; 14, defocused CO2 laser beam; 15, collimating mirror; 16, first reflecting mirror; 17, second reflecting mirror; 18, third reflecting mirror;

[0038] 2, positioning assembly; 21, visual positioning system; 22, fine adjustment mechanism;

[0039] 3, transmission assembly;

[0040] 4, workpiece to be processed; 41, edge to be chamfered;

[0041] 5, support; 51, chamfering station. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0043] One of the objectives of the present application is to provide a new chamfering device suitable for hard and brittle materials such as glass, so as to solve the problems of low processing efficiency, large roughness of chamfered surface, low quality and environmental pollution of the existing chamfering technology.

[0044] Another objective of the present application is to provide a new chamfering method suitable for hard and brittle materials such as glass, so as to solve the problems of low processing efficiency, large roughness of chamfered surface, low quality and environmental pollution of the existing chamfering technology.

[0045] In order to make the above-mentioned objectives, features and advantages of the present application more apparent and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0046] Embodiment one

[0047] As Figures 1-4As shown, the embodiment provides a chamfering device 100, which comprises a laser emitting assembly 1, a positioning assembly 2 and a transmission assembly 3. The laser emitting assembly 1 comprises a laser source 11 and a laser cutting head 12. The laser source 11 is used to provide a CO2 laser beam 13 for chamfering. The laser cutting head 12 is arranged on the emitting path of the CO2 laser beam 13 and is used to convert the CO2 laser beam 13 into a defocused CO2 laser beam 14 and emit the defocused CO2 laser beam 14 onto a chamfering edge 41 of a workpiece 4 to be processed. The chamfering edge 41 is generally a straight sharp edge with a right-angle sharp corner structure. The positioning assembly 2 is connected with at least one of the laser emitting assembly 1 and the workpiece 4 to be processed. The positioning assembly 2 is used to adjust the relative attitude of the laser cutting head 12 and the workpiece 4 to be processed so that the defocused CO2 laser beam 14 is irradiated onto the chamfering edge 41 at a preset incident angle. The transmission assembly 3 is used to drive at least one of the laser emitting assembly 1 and the workpiece 4 to be processed to move so that the laser cutting head 12 and the workpiece 4 to be processed move relatively to each other, the defocused CO2 laser beam 14 moves along the chamfering edge 41, and the chamfering process of the whole chamfering edge 41 is realized. The working principle of the above chamfering device 100 is as follows: the defocused (or non-focused) CO2 laser beam with sufficient energy is used to directly irradiate the chamfering edge 41 of the workpiece 4 to be processed at a preset incident angle (which can be adjusted according to the actual effect), the local high temperature formed by the laser beam is used to make the irradiated part locally melt instantaneously, and the other part of the workpiece 4 to be processed which is not affected by the laser beam is used to cool the locally melted part quickly, which causes the part of the glass to produce a peeling effect, forms the separation and falling off of the surface material of the part, and thus a small part of the sharp corner is removed to play a chamfering role.

[0048] In the embodiment, the laser source 11 is a continuous CO2 laser, and the power is generally 300W-500W. Specifically, a sealed CO2 laser or a radio frequency CO2 laser can be selected to provide the energy beam for chamfering.

[0049] In the embodiment, the laser cutting head 12 comprises a corner nozzle, which comprises a first straight pipe section 121 and a second straight pipe section 122 arranged in sequence along the emission path of the CO2 laser beam 13, and the first straight pipe section 121 is arranged at an included angle C with the second straight pipe section 122, which is generally set to 135°, and can also be set to other applicable angles according to actual needs. Generally, the first straight pipe section 121 serves as the incident end of the laser cutting head 12, and the second straight pipe section 122 serves as the exit end of the laser cutting head 12. A mirror (which is generally a plane mirror) is arranged in the first straight pipe section 121 for projecting the light beam into the second straight pipe section 122. The mirror or mirror group can be used to adjust the angle of the laser irradiation to the chamfered edge 41. A focusing mirror is arranged in the second straight pipe section 122, which is generally a 2-inch (50.8 mm) or 2.5-inch (63.5 mm) focusing lens, which can make the CO2 laser beam 13 finally irradiate onto the chamfered edge 41 in a defocused manner at a right angle.

[0050] In the embodiment, the preset incident angle a of the defocused CO2 laser beam 14 emitted by the laser cutting head 12 is adjustable. Taking the glass plate as an example, the glass plate is generally arranged horizontally during chamfering, and the preset incident angle a is the included angle between the defocused CO2 laser beam 14 and the thickness direction axis of the glass plate. The included angle a is generally 45±15°, i.e. the value range of a is 30°-60°.

[0051] In the embodiment, the laser emission assembly 1 further comprises a light guide system arranged on the emission path of the CO2 laser beam 13, and the light guide system is located between the laser source 11 and the laser cutting head 12. The light guide system comprises a beam expander and at least one reflecting mirror arranged in sequence along the emission path of the CO2 laser beam 13. Alternatively, the light guide system comprises a collimating mirror 15 and at least one reflecting mirror arranged in sequence along the emission path of the CO2 laser beam 13. Taking the latter as an example, as shown in FIG. 5, in the laser emission assembly 1, the laser emission direction of the laser source 11 is horizontal, and the incident end of the laser cutting head 12, i.e. the first straight pipe section 121, is vertical and perpendicular to the laser emission direction of the laser source 11. At this time, the light guide system between the laser source 11 and the first straight pipe section 121 specifically comprises the collimating mirror 15 and three reflecting mirrors (i.e. the first reflecting mirror 16, the second reflecting mirror 17 and the third reflecting mirror 18). The laser source 11, the collimating mirror 15, the first reflecting mirror 16, the second reflecting mirror 17, the third reflecting mirror 18 and the first straight pipe section 121 are arranged in sequence along the emission path of the CO2 laser beam 13. The light guide system finally converts the horizontally emitted CO2 laser beam 13 into a vertically emitted CO2 laser beam 13 and emits it into the first straight pipe section 121.

[0052] In the embodiment, a support 5 is further provided, which provides an integrated mounting space for the aforementioned laser emission assembly 1, the positioning assembly 2 and the transmission assembly 3. Specifically, as shown in FIG. 6, the support 5 comprises a base 51 and a plurality of vertical supports 52 arranged on the base 51. The laser emission assembly 1, the positioning assembly 2 and the transmission assembly 3 are arranged on the vertical supports 52 in sequence. Figures 1-4As shown, the transmission assembly 3 is arranged on the bracket 5, the positioning assembly 2 is arranged on the transmission assembly 3, and the laser emitting assembly 1 is connected with the positioning assembly 2. The positioning assembly 2 is used to adjust the posture of the laser cutting head 12 relative to the workpiece 4 to be processed, and the transmission assembly 3 is used to drive the laser cutting head 12 to move along the edge 41 to be chamfered. The bracket 5 is further provided with a chamfering station 51 and a fixing clamp. The chamfering station 51 is generally located below the laser cutting head 12 and is used to load the workpiece 4 to be processed. The fixing clamp is used to fix the workpiece 4 to be processed on the chamfering station 51 to prevent the workpiece 4 to be processed from deviating during the chamfering process.

[0053] In this embodiment, the positioning assembly 2 specifically includes a visual positioning system 21 and a fine adjustment mechanism 22. The visual positioning system 21 is used to monitor the position information of the edge 41 to be chamfered. The laser emitting assembly 1 is installed on the fine adjustment mechanism 22. The fine adjustment mechanism 22 is communicatively connected with the visual positioning system 21. The fine adjustment mechanism 22 is used to adjust the posture of the laser cutting head 12 relative to the workpiece 4 to be processed according to the position information monitored by the visual positioning system 21, so that the defocused CO2 laser beam 14 emitted by the second straight pipe section 122 is irradiated onto the edge 41 to be chamfered at a preset incident angle α. The visual positioning system 21 mainly takes a photo of the edge 41 to be chamfered, analyzes the image, determines the specific position of the edge 41 to be chamfered, and then aligns the laser cutting head 12 with the edge 41 to be chamfered at a preset angle through the fine adjustment mechanism 22. The visual positioning system 21 can specifically select a CCD visual system.

[0054] In this embodiment, the aforementioned fine adjustment mechanism 22 can select an existing two-dimensional slide table or a three-dimensional slide table or other spatial adjustment mechanism. The aforementioned transmission assembly 3 can select an existing electric slide table structure.

[0055] In this embodiment, the chamfering machining device 100 can be used in combination with a device capable of automatically feeding and discharging the workpiece 4 to be processed, or a device specifically used for automatically feeding and discharging the workpiece 4 to be processed can be arranged in the chamfering machining device 100. The automatic feeding and discharging device can automatically convey the workpiece 4 to be processed to the chamfering station 51 and fix the workpiece 4 to be processed by using a corresponding fixing clamp, so that the workpiece 4 to be processed does not move during the laser chamfering process and the chamfering machining is successfully completed. Then, the automatic feeding and discharging device automatically conveys the workpiece after the chamfering machining out of the chamfering station 51. A support platform is generally arranged at the chamfering station 51. During the chamfering machining, the workpiece 4 to be processed is located on the support platform. The aforementioned automatic feeding and discharging device can generally select a conveyor belt or a conveyor chain device, or a movable mechanical hand can be directly used.

[0056] The working principle of the chamfering machining device 100 will be specifically described below by taking the workpiece 4 to be processed as a glass plate as an example. The machining process of the chamfering machining device 100 is as follows:

[0057] 1) The conveying device of the loading station conveys the glass plate to be chamfered to the chamfering station 51, and the glass plate is placed flat and pressed by the corresponding fixing clamp. The support platform at the chamfering station 51 can be specially made according to the specific size of the glass.

[0058] 2) The CCD vision system is used to position the edge 41 to be chamfered of the glass plate, determine the specific position of the edge 41 to be chamfered, and then adjust the second straight tube section 122 of the laser cutting head 12 to align the edge 41 to be chamfered at an angle of a by using the fine adjustment mechanism 22, so that the defocused CO2 laser beam 14 is emitted to the edge 41 to be chamfered at an incident angle of a.

[0059] 3) The laser source 11 emits a CO2 laser beam 13, which passes through the beam expander or collimator 15 in sequence, and then is reflected by the three-stage mirror to enter the laser cutting head 12, and finally is directly irradiated to the edge 41 to be chamfered at an incident angle of 45 degrees in a defocused manner. The local high temperature formed by the laser beam causes the irradiated part of the glass surface to melt instantaneously, and the other parts of the glass not affected by the laser beam are used to quickly cool the locally melted glass, causing the glass in this part to produce a peeling effect, forming the separation and falling off of the surface glass in this part, thereby removing a small part of the sharp corner and playing a chamfering role.

[0060] 4) After the laser chamfering process is completed, the processed glass plate is sent out by the conveying device, and the chamfering process is completed. The conveying device can specifically use the horizontal conveying assembly commonly used in glass conveying equipment.

[0061] In the above chamfering process, the laser power, the defocusing amount, the incident angle a of the defocused CO2 laser beam 14, and the moving speed of the laser beam along the edge 41 to be chamfered should be matched with each other and can be adjusted adaptively.

[0062] In actual operation, the defocused CO2 laser beam 14 can be allowed to perform multiple reciprocating scans at the start and end of the edge 41 to be chamfered to solve the problem of poor chamfering effect at the start and end of the edge.

[0063] The chamfering device 100 described above uses CO2 laser with high absorption to glass as the laser source, and directly irradiates the edge to be chamfered with the defocused CO2 laser beam, which not only has high chamfering processing efficiency and high chamfering quality, smooth and bright surface, but also has good processing environment, no water pollution, no abrasive wear, low noise, etc. The environmental protection effect is obvious, which solves the problems of low processing efficiency, large chamfering surface roughness, low quality, and environmental protection in the existing chamfering processing technology.

[0064] Example Two

[0065] The chamfering device 100 of the present embodiment is as follows:Figure 7 As shown, the laser emission assembly 1 can be arranged in two groups along the extension direction of the to-be-chamfered edge 41 to emit two groups of parallel defocused CO2 laser beams 14 to the to-be-chamfered edge 41, wherein the laser emission assembly 1 located in front of the laser moving direction acts as a preheating assembly, mainly to preheat the to-be-processed position before the defocused CO2 laser beams 14 emitted by the other group of laser emission assemblies 1 reach the to-be-processed position of the to-be-chamfered edge 41. The arrangement interval of the laser cutting heads 12 of the two groups of laser emission assemblies 1 is generally preferably 5mm-10mm, and the parallel interval of the two groups of defocused CO2 laser beams 14 respectively emitted by the two groups of laser emission assemblies 1 is 5mm-10mm. The remaining structures in the chamfering device 100 in this embodiment are the same as those in Embodiment One, and will not be repeated here.

[0066] In specific applications, the two groups of laser emission assemblies 1 can share one set of positioning assembly 2 and transmission assembly 3, or can be respectively configured with one set of positioning assembly 2 and transmission assembly 3, generally ensuring that the two groups of laser emission assemblies 1 move synchronously and in the same direction.

[0067] The working principle of the chamfering device 100 is that two groups of laser emission assemblies 1 are arranged, the laser beams emitted by the front group of laser emission assemblies 1 have a preheating effect, and after the preheating effect, the chamfering is mainly performed by the laser emitted by the rear group of laser emission assemblies 1, thereby solving the problem of poor chamfering effect at the start and end.

[0068] Embodiment Three

[0069] The chamfering device 100 in this embodiment is different from that in Embodiment Two only in that the front group of laser emission assemblies 1 is replaced by a flame sprayer. The flame sprayer has a preheating effect on the to-be-processed position before the defocused CO2 laser beams 14 emitted by the other group of laser emission assemblies 1 reach the to-be-processed position of the to-be-chamfered edge 41. After the preheating effect, the chamfering is mainly performed by the laser emitted by the rear group of laser emission assemblies 1, thereby solving the problem of poor chamfering effect at the start and end.

[0070] In this embodiment, the arrangement interval of the flame sprayer and the laser cutting head 12 of the laser emission assembly 1 is generally preferably 5mm-10mm. The flame sprayer and the laser emission assembly 1 can share one set of positioning assembly 2 and transmission assembly 3, or can be respectively configured with one set of positioning assembly 2 and transmission assembly 3, generally ensuring that the flame sprayer and the laser emission assembly 1 move synchronously and in the same direction.

[0071] In this embodiment, the remaining structures except the flame sprayer are the same as those in Embodiment One, and will not be repeated here.

[0072] Embodiment Four

[0073] Considering that the chamfering effect may be poor at the beginning and end after a single chamfering operation using a single beam (i.e., a defocused CO2 laser beam 14), this embodiment adds a chamfering surface finishing component to the first embodiment. This component is located on one side of the chamfering station 51 and is used to finish the chamfering surface after the laser emitting component 1 completes the chamfering of the edge 41 to be chamfered, effectively adding a finishing station. In practical applications, the chamfering surface finishing component can use a 100-120W infrared nanosecond laser + galvanometer, or a 40-60W green nanosecond laser + galvanometer. Through a multi-layer scanning method (a mature existing technology), it performs a surface roughening process, essentially using a glass surface marking and engraving technique. Along the chamfering path, based on inconsistencies in surface effect between the beginning and end of the chamfer and other locations, the number of scans is adjusted to ensure consistent glass chamfering surface quality.

[0074] The specific installation and movement of the chamfered surface finishing components can be found in the positioning component 2 and transmission component 3 in this embodiment, and will not be described in detail hereafter.

[0075] Example 5

[0076] In this embodiment, multiple sets of chamfering processing devices 100 are generally used in combination. That is, each chamfering edge 41 of the workpiece 4 corresponds to a chamfering processing device 100. When multiple sets of chamfering processing devices 100 are started at the same time, multiple chamfering edges 41 of the workpiece 4 can be chamfered at the same time, which can improve processing efficiency.

[0077] like Figure 6 As shown, the two chamfered edges 41 located on the same side of the workpiece 4 correspond to a chamfering device 100. The two chamfering devices 100 are arranged symmetrically, and can chamfer the two chamfered edges 41 at the same time.

[0078] Example 6

[0079] This embodiment proposes a chamfering method, which involves directly emitting a defocused CO2 laser beam 14 onto the chamfered edge 41 of the workpiece 4 and moving the defocused CO2 laser beam 14 along the chamfered edge 41 to achieve chamfering of the chamfered edge 41.

[0080] In this embodiment, a defocused CO2 laser beam 14 is used to perform one or more reciprocating scans along the edge 41 to be chamfered at the starting point and / or the ending point of the edge 41, in order to solve the problem of poor chamfering effect at the starting point and the ending point of the edge.

[0081] The above method can be implemented using the apparatus disclosed in Embodiment 1.

[0082] The chamfering method uses CO2 laser with high absorption to glass as laser source, and directly irradiates the chamfering edge with defocused CO2 laser beam, which has high chamfering efficiency and quality, bright and smooth surface, good processing environment, no water pollution, no abrasive wear, low noise, obvious environmental protection effect, and solves the problems of low processing efficiency, rough chamfering surface, low quality and environmental protection of the existing chamfering technology.

[0083] Example Seven

[0084] The chamfering method directly emits defocused CO2 laser beam 14 to the chamfering edge 41 of the workpiece 4 to be processed, and moves the defocused CO2 laser beam 14 along the chamfering edge 41 to realize chamfering of the chamfering edge 41.

[0085] In this embodiment, two groups of defocused CO2 laser beams 14 can be directly emitted to the chamfering edge 41, and the two groups of defocused CO2 laser beams 14 are arranged in parallel and spaced apart along the extension direction of the chamfering edge 41. The front group of defocused CO2 laser beams 14 plays a preheating role, and after the preheating effect, the chamfering is mainly performed by the rear group of defocused CO2 laser beams 14, thereby solving the problem of poor chamfering effect at the start and end of the edge.

[0086] The above method can be implemented by the device disclosed in Example Two.

[0087] The chamfering method uses CO2 laser with high absorption to glass as laser source, and directly irradiates the chamfering edge with defocused CO2 laser beam, which has high chamfering efficiency and quality, bright and smooth surface, good processing environment, no water pollution, no abrasive wear, low noise, obvious environmental protection effect, and solves the problems of low processing efficiency, rough chamfering surface, low quality and environmental protection of the existing chamfering technology.

[0088] The front group of defocused CO2 laser beams 14 can also be replaced by flame or conventional CO2 laser beam.

[0089] The above only describes the preferred embodiments of the present application and does not limit the present application. Any modification, equivalent replacement or improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chamfering method characterized by, The chamfer processing device is used for processing a workpiece, the workpiece is glass, and the chamfer processing device comprises: A laser emission assembly comprises a laser source and a laser cutting head, the laser source is used for providing a CO2 laser beam for chamfering, the laser cutting head is arranged on the emission path of the CO2 laser beam, and is used for converting the CO2 laser beam into a defocused CO2 laser beam and emitting the defocused CO2 laser beam onto the chamfered edge of the workpiece; the laser source is a continuous CO2 laser; the laser cutting head comprises a corner nozzle, the corner nozzle comprises a first straight pipe section and a second straight pipe section arranged in sequence along the emission path of the CO2 laser beam, the first straight pipe section and the second straight pipe section are arranged at an angle, a mirror for projecting a light beam into the second straight pipe section is arranged in the first straight pipe section, and a focusing mirror is arranged in the second straight pipe section; A positioning assembly comprises a visual positioning system and a fine adjustment mechanism, the visual positioning system is used for monitoring position information of the chamfered edge, the fine adjustment mechanism is arranged on the laser emission assembly, the fine adjustment mechanism is in communication connection with the visual positioning system, and the fine adjustment mechanism is used for adjusting the posture of the laser cutting head relative to the workpiece according to the position information, so that the defocused CO2 laser beam is irradiated onto the chamfered edge at a preset incident angle, the preset incident angle is the angle between the defocused CO2 laser beam and the thickness direction axis of the workpiece, and the angle is in the range of 30°-60°; A transmission assembly is used for driving at least one of the laser emission assembly and the workpiece to move, so that the laser cutting head and the workpiece move relatively, the defocused CO2 laser beam moves along the chamfered edge, and chamfering of the chamfered edge is realized; The chamfer processing method is that the defocused CO2 laser beam is directly emitted onto the chamfered edge of the workpiece, and the defocused CO2 laser beam moves along the chamfered edge, so that local high temperature formed by the defocused CO2 laser beam can locally and instantaneously melt the irradiated part, other parts of the workpiece not affected by the laser beam are used to rapidly cool the locally melted part, the part of the glass produces a peeling effect, the separation and falling of the surface material of the part are formed, and chamfering of the chamfered edge is realized.

2. The chamfering method according to claim 1, characterized by The laser emission assembly further comprises a light guide system arranged on the emission path of the CO2 laser beam, and the light guide system is located between the laser source and the laser cutting head; the light guide system comprises a beam expander and at least one reflecting mirror arranged in sequence along the emission path of the CO2 laser beam; or the light guide system comprises a collimator and at least one reflecting mirror arranged in sequence along the emission path of the CO2 laser beam.

3. The chamfering method according to claim 1, wherein The chamfer processing device further comprises a support, the transmission assembly is arranged on the support, the positioning assembly is arranged on the transmission assembly, and the transmission assembly is used for driving the laser cutting head to move along the chamfered edge. The support is further provided with a chamfering station for loading the workpiece and a fixing clamp for fixing the workpiece on the chamfering station.

4. The chamfering method according to claim 3, wherein The chamfering device further comprises a preheating assembly arranged along the extension direction of the edge to be chamfered and in front of the laser emitting assembly in the moving direction of the laser emitting assembly, which is a flame sprayer or a laser emitting assembly.

5. The chamfering method according to claim 3, wherein The chamfering device further comprises a chamfer surface finishing assembly arranged on one side of the chamfering station for finishing the chamfer surface after the laser emitting assembly finishes chamfering the edge to be chamfered, which is an infrared nanosecond laser cooperating with a galvanometer system or a green nanosecond laser cooperating with a galvanometer system.

6. The chamfering method according to claim 1, wherein The defocused CO2 laser beam is used to perform one or more reciprocating scans along the edge to be chamfered at the start and / or end of the edge to be chamfered.

7. The chamfering method according to claim 1, wherein The edge to be chamfered is preheated by a flame or a CO2 laser beam before the defocused CO2 laser beam for chamfering reaches the chamfering position of the edge to be chamfered.

Images