Temperature sensor

Abstract

The present invention discloses a temperature sensor, which relates to the field of sensor technology. A ceramic trapezoidal slider layer is provided at the front end of the ceramic insulator, and a metal guide groove layer is provided at the front end of the ceramic trapezoidal slider layer. A mutually pushing force is formed between the metal guide groove layer and the ceramic trapezoidal slider layer, so that the ceramic trapezoidal slider layer and the inner wall of the metal guide groove layer generate an interaction force to achieve a tight fit. The gap between the metal guide groove layer and the ceramic trapezoidal slider layer is filled with a metal mixture, and a secondary high-temperature sintering is performed, so that the front end of the ceramic insulator has the electrical conductivity and good thermal conductivity of metal and the mechanical strength of metal. The filling metal mixture layer is used to solve the stress caused by the inconsistent expansion coefficients of the two materials, ceramic and metal, which causes damage to the insulation structure. The metallized head of the ceramic insulator is directly welded to the metal shell, and the tail insulation cavity is encapsulated with high-temperature silicone water to encapsulate the thermistor, thermal fuse, thermistor wiring harness and thermal fuse wiring harness.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a temperature sensor. Background Art

[0002] In related technology, the bottom sensor of a smart appliance is insulated with a sleeve, with a metal housing and metal outer clip securing the thermal fuse and the thermistor. However, the use of stamping and deformation to secure the thermal fuse and thermistor can easily lead to voltage breakdown and internal wiring short circuits. Furthermore, it is worth noting that the sensor's rigid-on-rigid packaging structure can damage the thermistor glass if it is too tight, or inaccurate temperature measurement if it is too loose, significantly impacting temperature consistency.

[0003] The thermistor and thermal link in the bottom sensor are insulated only by a single layer of sleeve, while the rest of the sensor is metallic. The universal metal buckle used to connect the thermistor and thermal link creates burrs during the manufacturing process. Thermal expansion and contraction can puncture the insulating sleeve. Because the insulating sleeve and metal casing form a closed, airtight structure, continuous heating of the bottom sensor can cause the internal air blockage to cause the thermal link to fuse abnormally. This prevents truly safe reinforced insulation, requiring only grounding to meet national 3C safety regulations. Furthermore, manually manufactured sensors exhibit inconsistent temperature sensing and require numerous and complex processes, resulting in inefficient sensor production and assembly.

[0004] Conventional technologies typically connect the metal housing and ceramic insulator of a temperature sensor by means of snap-fits on either side of the ceramic insulator. These snaps squeeze against internal snap-fits on either side of the metal housing to secure the connection, which can easily damage the ceramic insulator. Alternatively, the ceramic insulator is bonded to the metal housing using glue. However, this poses a risk of falling off during high-temperature operation, compromising the insulation and temperature measurement performance of the temperature sensor and failing to meet production requirements. Summary of the Invention

[0005] The object of the present invention is to provide a temperature sensor, aiming to realize welding of a ceramic component of the sensor with a metal shell, which is specifically implemented by metallizing the ceramic head and performing secondary high-temperature sintering to form a metallized whole component.

[0006] To achieve the above objectives, the present invention provides a temperature sensor comprising a metal housing, a metal guide groove layer disposed between the metal housing and a ceramic insulator, a ceramic trapezoidal slider layer disposed below the metal guide groove layer, a metal mixture layer disposed below the ceramic trapezoidal slider layer, and a metal inner wall bayonet disposed below the metal mixture layer;

[0007] The metallized whole is formed by sintering the head of the ceramic insulator twice at high temperature. The lower end of the ceramic insulator is provided with a first cavity and a second cavity. The first cavity is provided with a thermal fuse and a thermal fuse wiring harness through high-temperature silicone water. The second cavity is provided with a thermistor and a thermistor wiring harness through high-temperature silicone water.

[0008] Optionally, the ceramic trapezoidal slider layer is provided in the metal guide groove layer, and the metal mixture layer is provided in the gap between the ceramic trapezoidal slider layer and the metal guide groove layer.

[0009] Optionally, the ceramic trapezoidal slider layer and the ceramic insulator form a connected structural member, and the first cavity and the second cavity are provided inside the connected structural member.

[0010] Optionally, the metallized whole is provided with a packaging cavity, in which the thermistor, the thermistor wiring harness, the thermal fuse, and the thermal fuse wiring harness are respectively provided through high-temperature silicone water.

[0011] The temperature sensor of the present invention comprises a ceramic trapezoidal slider at the front end of the ceramic insulator, and a metal guide groove at the front end of the ceramic trapezoidal slider layer. The metal guide groove and the ceramic trapezoidal slider layer generate a mutually pushing force, which creates an interaction force between the ceramic trapezoidal slider layer and the inner wall of the metal guide groove, achieving a tight fit. The gap between the metal guide groove layer and the ceramic trapezoidal slider layer is filled with a metal mixture, and after a second high-temperature sintering, the metallized ceramic insulator head is formed as a whole, as required for production. The metal mixture layer is used to prevent damage to the insulation structure caused by stress caused by the mismatch between the expansion coefficients of the ceramic and metal materials. The metal shell and the metallized ceramic insulator head are welded to form a single package cavity, which is then filled with high-temperature silicone gel to house the thermistor and thermistor wiring harness, as well as the thermal fuse and the thermal fuse wiring harness.

[0012] Compared with the prior art, the temperature sensor provided by the present invention has the following beneficial effects:

[0013] 1. The metal shell and the metallized head of the ceramic insulator are formed by laser welding, which enables efficient and reliable connection between the metal shell and the internal insulation without damaging the appearance of the shell or the internal insulation structure, thereby increasing product consistency, reliability and insulation safety.

[0014] 2. A metal guide groove layer is provided at the front end of the ceramic trapezoidal slider. A mutual pushing force is formed by the metal guide groove layer and the ceramic trapezoidal slider layer, so that the ceramic trapezoidal slider layer and the inner wall of the metal guide groove generate an interaction force to achieve a tight fit function. A metal mixture is filled between the metal guide groove layer and the ceramic trapezoidal slider layer, and after a second high-temperature sintering, the ceramic insulator head metallization piece required for production is formed, which greatly simplifies the ceramic metallization production process cost, material cost, and manufacturing cost.

[0015] 3. A metal mixture is filled between the metal guide groove layer and the ceramic trapezoidal slider layer and subjected to secondary high-temperature sintering. The metal mixture layer is used to solve the damage to the insulation structure caused by the inconsistent expansion coefficients of the ceramic and metal materials, ensuring that the temperature sensor can adapt to various harsh working environments.

[0016] 4. The front end of the ceramic insulator is provided with a ceramic trapezoidal slider layer and a metal guide groove layer to forcibly separate and connect the insulating guide material, so that the front end of the ceramic insulator has the electrical conductivity and good thermal conductivity of metal and the mechanical strength of metal, which is convenient for welding with the metal shell.

[0017] The ceramic insulator's tail end features a ceramic insulation cavity, housing a thermistor, thermistor wiring harness, and thermal link wiring harness, all enclosed within high-temperature silicone gel. The ceramic trapezoidal slider layer forcibly isolates the metal guide channel layer, eliminating the grounding feature when the insulation thickness reaches 2.0mm.

[0018] 5. The metallization of the ceramic insulator head changes the essential nature of the ceramic head, enabling the ceramic part to have the high electrical conductivity of metal, making it possible to subsequently process and weld it with the metal shell.

[0019] 6. The temperature sensor, metal guide groove layer, and ceramic insulator provided by the present invention are molded to ensure the consistency of product packaging. The metal guide groove layer is made of aluminum alloy (thermal conductivity coefficient 200W / M / S). The ceramic metallization process realizes the aluminum-clad ceramic mode, which greatly increases the thermal conductivity of the entire metallized part of the ceramic insulator head, improves the temperature measurement sensitivity of the temperature sensor, and improves the measurement consistency.

[0020] The present invention also proposes a temperature sensor, which aims to simplify the ceramic metallization process of the temperature sensor and improve the stability and installation consistency of the ceramic metallization connection structure of the temperature sensor.

[0021] The temperature sensor provided by the present invention includes a metal shell, a metal guide groove layer, a ceramic insulator and a temperature sensing element. A connection structure that cooperates with the groove is formed at the end of the ceramic insulator, so that the ceramic insulator and the metal guide groove layer are fixed to the groove through the connection structure; a metal mixture layer is also provided between the ceramic insulator and the groove wall of the groove, and the metal guide groove layer and the metal shell are sintered and connected as a whole through the metal mixture layer; an encapsulation cavity is also formed on the end of the ceramic insulator facing away from the metal guide groove layer; and the temperature sensing element is encapsulated in the encapsulation cavity.

[0022] Optionally, a metal inner wall snap-on is protruding from the opening edge of the groove; the ceramic insulator includes a ceramic main body and a ceramic trapezoidal slider layer connected to the end of the ceramic main body, the ceramic main body is provided with the packaging cavity, the connecting structure is provided on the side wall of the ceramic trapezoidal slider layer, and the connecting structure includes a limiting step formed on the side wall of the ceramic trapezoidal slider layer; the metal inner wall snap-on abuts against the surface of the limiting step to limit the separation of the ceramic trapezoidal slider layer from the groove.

[0023] Optionally, the bottom wall of the groove is inclined along the first direction; and / or the end surface of the ceramic trapezoidal slider layer is gradually tapered in thickness along the first direction; the end surface of the ceramic trapezoidal slider layer is tightly fitted and abutted against the bottom wall of the groove.

[0024] Optionally, the packaging cavity is divided into a first cavity and a second cavity by a partition, and the temperature sensing element includes a thermistor and a thermal fuse, the thermistor is arranged in the second cavity; the thermal fuse is arranged in the first cavity.

[0025] Optionally, one end of the thermistor wiring harness and the thermistor are encapsulated with high-temperature silicone gel, and the other end is disposed outside the encapsulation cavity. Alternatively, one end of the thermal link wiring harness and the thermal link are encapsulated with high-temperature silicone gel, and the other end is disposed outside the encapsulation cavity.

[0026] In the technical solution of the present invention, the ceramic insulator of the temperature sensor is inserted into the groove of the metal guide groove layer, and a metal mixture layer is provided between the ceramic insulator and the groove wall. The ceramic insulator is connected to the metal guide groove layer by secondary high-temperature melting and sintering, the head of the ceramic insulator is metallized, and the metal guide groove layer is welded to the metal shell.

[0027] Compared with the method of installing the ceramic insulator in the metal shell by encapsulating it with glue, there is a risk of it falling off during high-temperature operation, which in turn affects the insulation performance and temperature measurement performance of the temperature sensor and cannot meet the production needs. The solution of the present invention realizes that a metal guide groove layer is sintered and connected to the head of the ceramic insulator, thereby realizing the metallization of the head of the ceramic insulator. The structure of the ceramic metallization is stable and helps to avoid damage to the ceramic insulator during the ceramic metallization process. In addition, since a metal guide groove layer is sintered and connected to the head of the ceramic insulator, it can be welded to the metal shell through the metal guide groove layer. The connection structure formed by the welding has good stability, which can prevent the ceramic insulator from falling off from the metal shell due to high-temperature operation, and is conducive to improving the installation consistency of the ceramic insulator in the metal shell, ensuring the temperature measurement performance of the temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0029] Figure 1 This is a schematic structural diagram of an embodiment of a temperature sensor of the present invention;

[0030] Figure 2 for Figure 1 A partial enlarged schematic diagram of point A in the middle;

[0031] Figure 3 for Figure 1 A schematic cross-sectional view of the structure of the ceramic insulator and the metal guide layer;

[0032] Figure 4 for Figure 1 A cross-sectional diagram showing the structure of the ceramic insulator and the metal parts in cooperation with each other from another perspective;

[0033] Figure 5 for Figure 1 Schematic diagram of the structure of the metal guide layer.

[0034] Description of Figure Numbers:

[0035]

[0036] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0038] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0039] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0040] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that meet both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0041] In related technology, the bottom sensor of a smart appliance is insulated with a sleeve, with a metal housing and metal outer clip securing the thermal fuse and the thermistor. However, the use of stamping and deformation to secure the thermal fuse and thermistor can easily lead to voltage breakdown and internal wiring short circuits. Furthermore, it is worth noting that the sensor's rigid-on-rigid packaging structure can damage the thermistor glass if it is too tight, or inaccurate temperature measurement if it is too loose, significantly impacting temperature consistency.

[0042] The thermistor and thermal link in the bottom sensor are insulated only by a single layer of sleeve, while the rest of the sensor is metallic. The universal metal buckle used to connect the thermistor and thermal link creates burrs during the manufacturing process. Thermal expansion and contraction can puncture the insulating sleeve. Because the insulating sleeve and metal casing form a closed, airtight structure, continuous heating of the bottom sensor can cause the internal air blockage to cause the thermal link to fuse abnormally. This prevents truly safe reinforced insulation, requiring only grounding to meet national 3C safety regulations. Furthermore, manually manufactured sensors exhibit inconsistent temperature sensing and require numerous and complex processes, resulting in inefficient sensor production and assembly.

[0043] In response to the above problems, the present invention proposes a temperature sensor 10, which aims to achieve metallization of the ceramic head of the sensor and secondary high-temperature sintering to form a metallized integral part.

[0044] Reference Figure 1 In one embodiment of the present invention, the temperature sensor 10 includes a metal housing 1, a metal guide groove layer 2 is provided between the metal housing 1 and a ceramic insulator 3, a ceramic trapezoidal slider layer 33 is provided below the metal guide groove layer 2, a metal mixture layer 4 is provided below the ceramic trapezoidal slider layer 33, and a metal inner wall bayonet 21 is provided below the metal mixture layer 4;

[0045] The metallized whole is formed by sintering the head of the ceramic insulator 3 twice at high temperature. The lower end of the ceramic insulator 3 is provided with a first cavity 351 and a second cavity 353. The first cavity 351 is provided with a thermal fuse 53 and a thermal fuse wiring harness 54 through high-temperature silicone gel 55. The second cavity 353 is provided with a thermistor 51 and a thermistor wiring harness 52 through high-temperature silicone gel 55.

[0046] Reference Figure 2 and Figure 3 In one embodiment of the present invention, the ceramic trapezoidal slider layer 33 is provided in the metal guide groove layer 2, and the metal mixture layer 4 is provided in the gap between the ceramic trapezoidal slider layer 33 and the metal guide groove layer 2.

[0047] Reference Figure 3 and Figure 4 In one embodiment of the present invention, the ceramic trapezoidal slider layer 33 and the ceramic insulator 3 form a connected structural member, and the first cavity 351 and the second cavity 353 are provided inside the connected structural member.

[0048] Reference Figure 1In one embodiment of the present invention, the metal shell 1 and the head of the ceramic insulator 3 are metalized as a whole and welded into an integral packaging cavity 35, in which the thermistor 51, the thermistor wiring harness 52, the thermal fuse 53, and the thermal fuse wiring harness 54 are respectively provided through high-temperature silicone gel 55.

[0049] The temperature sensor 10 of the present invention comprises a ceramic trapezoidal slider layer 33 at the front end of the ceramic insulator 3. A metal guide groove layer 2 is provided at the front end of the ceramic trapezoidal slider layer 33. The metal guide groove layer 2 and the ceramic trapezoidal slider layer 33 generate a mutually pushing force, which creates an interaction force between the ceramic trapezoidal slider layer 33 and the inner wall of the metal guide groove, achieving a tight fit. The gap between the metal guide groove layer 2 and the ceramic trapezoidal slider layer 33 is filled with a metal mixture. After a secondary high-temperature sintering process, the metallized head of the ceramic insulator 3 is formed as a single piece, ensuring the front end has the electrical and thermal conductivity of metal, as well as the mechanical strength of metal. The metal mixture layer 4 is used to mitigate stress damage to the insulation structure caused by the mismatch in expansion coefficients between the ceramic and metal materials. The metal housing 1 and the metallized head of the ceramic insulator 3 are welded to form a single package cavity 35. The package cavity 35 is filled with high-temperature silicone gel 55, housing a thermistor 51 and thermistor wiring harness 52, a thermal link 53, and a thermal link wiring harness 54.

[0050] Compared with the prior art, the temperature sensor 10 provided by the present invention is formed by metallization welding of a ceramic head and has the following beneficial effects:

[0051] 1. The metal shell 1 and the metallized head of the ceramic insulator 3 are formed by laser welding, so that the metal shell 1 and the internal insulation are efficiently and reliably connected without damaging the appearance of the shell or the internal insulation structure, thereby increasing the product consistency reliability and insulation safety.

[0052] 2. A metal guide groove layer 2 is provided at the front end of the ceramic trapezoidal slider layer 33. A mutual pushing force is formed by the metal guide groove layer 2 and the ceramic trapezoidal slider layer 33, so that the ceramic trapezoidal slider layer 33 and the inner wall of the metal guide groove layer 2 generate an interaction force to achieve a tight fit function. A metal mixture is filled between the metal guide groove layer 2 and the ceramic trapezoidal slider layer 33, and after a second high-temperature sintering, the required ceramic insulator 3 head metallized component is formed, which greatly simplifies the ceramic metallization production process cost, material cost, and manufacturing cost.

[0053] 3. A metal mixture is filled between the metal guide groove layer 2 and the ceramic trapezoidal slider layer 33 and subjected to secondary high-temperature sintering. The metal mixture layer 4 is used to prevent the damage to the insulation structure caused by the inconsistent expansion coefficients of the ceramic and metal materials, ensuring that the sensor can adapt to various harsh working environments.

[0054] 4. A ceramic trapezoidal slider layer 33 and a metal guide groove layer 2 are provided at the front end of the ceramic insulator 3 to forcibly separate and connect the insulating guide material, so that the front end of the ceramic insulator 3 has the electrical conductivity and good thermal conductivity of metal and the mechanical strength of metal, which is convenient for welding with the metal shell 1.

[0055] The ceramic insulator 3 has a ceramic insulation cavity at its rear end, housing a thermistor 51, thermistor wiring harness 52, a thermal fuse 53, and a thermal fuse wiring harness 54, all enclosed by high-temperature silicone gel 55. The trapezoidal ceramic slider layer 33 forcibly isolates the metal guide channel layer 2, eliminating the grounding feature when the insulation thickness reaches 2.0 mm.

[0056] 5. The entire head of the ceramic insulator 3 is metallized, which changes the essential nature of the ceramic head, enabling the ceramic to have the high electrical conductivity of metal, thereby enabling the subsequent processing and welding thereof with the metal housing 1.

[0057] 6. The temperature sensor 10, metal guide groove layer 2, and ceramic insulator 3 provided by the present invention are molded to ensure the consistency of product packaging. The metal guide groove layer 2 is made of aluminum alloy (thermal conductivity coefficient 200W / M / S). The ceramic metallization process realizes an aluminum-clad ceramic pattern, which greatly increases the thermal conductivity of the entire metallized head of the ceramic insulator 3, thereby improving the sensor's temperature measurement sensitivity and measurement consistency.

[0058] Conventional technologies typically connect the metal housing and ceramic insulator of a temperature sensor by means of snap-fits on either side of the ceramic insulator. These snaps squeeze against internal snap-fits on either side of the metal housing to secure the connection, which can easily damage the ceramic insulator. Alternatively, the ceramic insulator is bonded to the metal housing using glue. However, this poses a risk of falling off during high-temperature operation, compromising the insulation and temperature measurement performance of the temperature sensor and failing to meet production requirements.

[0059] In response to the above problems, the present invention proposes a temperature sensor 10, which aims to simplify the ceramic metallization process of the temperature sensor 10 and improve the stability and installation consistency of the ceramic metallization connection structure of the temperature sensor 10.

[0060] Reference Figure 1In one embodiment of the present invention, the temperature sensor 10 includes a metal shell 1, a metal guide groove layer 2, a ceramic insulator 3, and a temperature sensing element 5. The end of the ceramic insulator 3 is formed with a connection structure that cooperates with the groove 23, so that the ceramic insulator 3 and the metal guide groove layer 2 are fixed to the groove 23 through the connection structure; a metal mixture layer 4 is further provided between the ceramic insulator 3 and the groove wall of the groove 23, and the metal guide groove layer 2 and the metal shell 1 are sintered and connected as a whole through the metal mixture layer 4; an encapsulation cavity 35 is further formed at one end of the ceramic insulator 3 away from the metal guide groove layer 2; and the temperature sensing element 5 is encapsulated in the encapsulation cavity 35.

[0061] The metal housing 1 is used for thermal connection with the object being measured to meet the thermal conductivity requirements of the temperature sensor 10. For example, when the temperature sensor 10 is used to measure the temperature of a pot, the metal housing 1 is configured as a metal cover and the metal cover is placed over the opening of the pot. This helps the metal housing 1 collect the heat generated by the heating inside the pot and transfer the heat to the thermistor 51 or thermal fuse 53 in a timely manner.

[0062] The metal guide channel layer 2 is a metal member having grooves 23 formed therein. A metal with good thermal and electrical conductivity can be selected to improve the sensitivity and consistency of the temperature measurement by the temperature sensor 10. For example, the metal guide channel layer 2 can be made of copper. Alternatively, the metal guide channel layer 2 can be made of an aluminum alloy (with a thermal conductivity of 200 W / M / S).

[0063] Ceramic insulator 3 serves as the substrate of temperature sensor 10, encapsulating temperature-sensing element 5. Ceramic insulator 3 exhibits high thermal stability and high-temperature resistance, ensuring the proper operation of temperature sensor 10. Ceramic insulator 3 can be molded to ensure consistent product packaging.

[0064] The metal mixture layer 4 is a cavity formed by the ceramic insulator 3 and the metal guide channel layer 2. The cavity is used to fill the metal mixture and connect the ceramic insulator 3 and the metal guide channel layer 2 through secondary high-temperature sintering.

[0065] The temperature sensing element 5 is a device used to monitor temperature and convert it into an electrical signal for control. For example, the temperature sensing element 5 includes a thermistor 51, which has different resistance values ​​at different temperatures, thereby enabling the controller to measure temperature. Alternatively, the temperature sensing element 5 includes a thermal fuse 53. When the external temperature reaches a certain threshold, the thermal fuse 53 melts, thereby disconnecting the controller from the control circuit and ensuring safe operation of the controller.

[0066] Due to the significant difference in thermal expansion coefficients between the ceramic insulator 3 and the metal channel layer 2, direct welding between the two is generally impossible. Therefore, in this embodiment, a metal mixture layer 4 is filled between the ceramic insulator 3 and the metal channel layer 2. The metal mixture layer 4 can fuse the ceramic insulator 3 and the metal channel layer 2 through melt sintering. The metal mixture filling helps resolve the problem of welding between the ceramic insulator 3 and the metal channel layer 2 due to the significant difference in thermal expansion coefficients, and also avoids damage to the outer shell of the ceramic insulator 3 caused by welding.

[0067] At the same time, since the gap between the ceramic insulator 3 and the metal guide groove layer 2 is filled with a metal mixture, it is beneficial to avoid the ceramic insulator 3 from being unable to receive the heat conducted by the metal guide groove layer 2 in a timely manner due to the gap, ensuring that the temperature sensing element 5 monitors the heat in a timely manner, which is beneficial to improving the thermal conductivity of the temperature sensor 10.

[0068] Furthermore, the presence of the gap creates a closed, airtight cavity between the ceramic insulator 3 and the metal guide channel layer 2, which can easily cause the thermal link 53 of the temperature sensor 10 to abnormally melt during continuous heating. This solution fills this cavity with a metal mixture welded together, thereby ensuring the proper functioning of the temperature sensor 10.

[0069] In the technical solution of the present invention, the ceramic insulator 3 of the temperature sensor 10 is inserted into the groove 23 of the metal guide groove layer 2, and a metal mixture layer 4 is provided between the ceramic insulator 3 and the groove wall of the groove 23. The ceramic insulator 3 is connected to the metal guide groove layer 2 by secondary high-temperature melting and sintering, the head of the ceramic insulator 3 is metallized, and the metal guide groove layer 2 is welded to the metal shell 1.

[0070] Compared with the method of installing the ceramic insulator in the metal shell by encapsulating it with glue, there is a risk of falling off during high-temperature operation, which in turn affects the insulation performance and temperature measurement performance of the temperature sensor and cannot meet the production needs. The solution of the present invention realizes that a metal guide groove layer 2 is sintered and connected to the head of the ceramic insulator 3, thereby realizing the metallization of the head of the ceramic insulator 3. The structure of the ceramic metallization is stable and helps to avoid damage to the ceramic insulator 3 during the ceramic metallization process. In addition, since the metal guide groove layer 2 is sintered and connected to the head of the ceramic insulator 3, it can be welded to the metal shell 1 through the metal guide groove layer 2. The connection structure formed by the welding has good stability, which can prevent the ceramic insulator 3 from falling off from the metal shell 1 due to high-temperature operation, and is conducive to improving the installation consistency of the ceramic insulator 3 in the metal shell 1, ensuring the temperature measurement performance of the temperature sensor 10.

[0071] Reference Figure 1 、 Figure 3and Figure 5 In one embodiment of the present invention, a metal inner wall snap-on 21 is protruding from the opening edge of the groove 23; the ceramic insulator 3 includes a ceramic main body 31 and a ceramic trapezoidal slider layer 33 connected to the end of the ceramic main body 31, the ceramic main body 31 is provided with the packaging cavity 35, the connecting structure is provided on the side wall of the ceramic trapezoidal slider layer 33, and the connecting structure includes a limiting step 331 formed on the side wall of the ceramic trapezoidal slider layer 33; the metal inner wall snap-on 21 abuts against the surface of the limiting step 331 to limit the separation of the ceramic trapezoidal slider layer 33 from the groove 23.

[0072] The limiting step 331 is formed by a protrusion on the side wall of the ceramic trapezoidal slider layer 33. The limiting step 331 includes a first section and a second section. The inner diameter of the first section is larger than that of the second section. The first and second sections are arranged in a stepped manner. The first end is abutted against the groove body of the groove 23, and the second section passes through the opening of the groove 23. The inner diameter of the second section is larger than that of the ceramic body 31 and is aligned with the opening wall of the groove 23. In addition, the ceramic body 31 and the ceramic trapezoidal slider layer 33 can be an integrated structure.

[0073] In this embodiment, the ceramic insulator 3 is positioned by the metal inner wall clip 21, allowing it to be securely positioned within the groove 23 of the metal guide channel layer 2 without requiring any connection. Furthermore, metal solder can be laid between the metal inner wall clip 21 and the facing end surfaces of the ceramic trapezoidal slider layer 33 for connection, thereby increasing the welded area of ​​the ceramic insulator 3 and further enhancing the stability of the ceramic metallization.

[0074] Reference Figure 4 In one embodiment of the present invention, the bottom wall surface of the groove 23 is inclined along the first direction; and / or the end surface of the ceramic trapezoidal slider layer 33 is gradually tapered in thickness along the first direction; the end surface of the ceramic trapezoidal slider layer 33 is tightly fitted and abutted against the bottom wall surface of the groove 23.

[0075] In this embodiment, Figure 4 The left end of the middle metal guide groove layer 2 is taller than the right end. The ceramic trapezoidal slider layer 33 is arranged with a gradually decreasing thickness along the first direction, specifically in the form of a trapezoidal slider. This trapezoidal slider engages with the inner wall of the groove 23 and guides the installation along the inclined direction. It is worth noting that due to the effect of gravity, a mutual pushing force component is generated between the trapezoidal slider and the groove wall of the groove 23, thereby further securing the trapezoidal slider within the groove 23 and enhancing the stability of the ceramic metallization structure.

[0076] Reference Figure 4In one embodiment of the present invention, the packaging cavity 35 is divided into a first cavity 351 and a second cavity 353 by a partition, and the temperature sensing element 5 includes a thermistor 51 and a thermal fuse 53. The thermistor 51 is arranged in the second cavity 353; the thermal fuse 53 is arranged in the first cavity 351.

[0077] The first cavity 351 is configured as a thermal fuse insulation cavity, and the second cavity 353 is configured as a thermistor insulation cavity.

[0078] In this embodiment, the thermistor 51 is disposed in the second cavity 353 of the ceramic insulator 3, and the thermal fuse 53 is disposed in the first cavity 351 of the ceramic insulator 3. This avoids interference caused by disposing components such as the thermal fuse 53 outside the ceramic insulator 3, thereby ensuring the normal operation of each component and achieving normal temperature measurement of the temperature sensor 10.

[0079] Reference Figure 1 In one embodiment of the present invention, one end of the thermistor harness 52 and the thermistor 51 are encapsulated with high-temperature silicone gel 55, and the other end is passed through the encapsulation cavity 35. And / or one end of the thermal link harness 54 and the thermal link 53 are encapsulated with high-temperature silicone gel 55, and the other end is passed through the encapsulation cavity 35.

[0080] In this embodiment, the thermistor 51 and the thermal fuse 53 are respectively encapsulated in a wiring harness using high-temperature silicone gel 55. While ensuring the working performance of the thermistor 51 and the thermal fuse 53, they are respectively encapsulated in the second cavity 353 and the first cavity 351, thereby enabling the temperature sensor 10 to send the temperature measurement signal and the temperature limit signal to the controller in a timely manner for the controller to control the heating signal.

[0081] Optionally, the thermistor wiring harness 52 and the thermal fuse wiring harness 54 are provided with a double-layer insulation sleeve to improve the insulation performance of the thermistor wiring harness 51 and the thermal fuse wiring harness 54 and improve the insulation performance of the sensor.

[0082] Reference Figure 1 In one embodiment of the present invention, the temperature sensor 10 further includes a spring 6. The metal shell 1 is provided with a first notch and a second notch. The first notch and the second notch are connected to each other. The inner diameter of the first notch is smaller than that of the second notch. The metal guide groove layer 2 is provided in the first notch. One end of the spring 6 is mounted on the wall of the second notch, and the other end is exposed out of the second notch to elastically support the metal shell 1 along the extension and contraction direction of the spring 6.

[0083] In this embodiment, when the metal shell 1 is in contact with the object to be measured for heat transfer, the object to be measured can be pressed onto the metal shell 1, thereby compressing the spring 6. The compressed spring 6 gives the metal shell 1 an elastic supporting force, so that the metal shell 1 fits tightly onto the object to be measured, thereby improving the temperature detection accuracy of the temperature sensor 10 on the object to be measured.

[0084] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A temperature sensor (10), characterized in that: It comprises a metal shell (1), a metal guide groove layer (2) is provided between the metal shell (1) and a ceramic insulator (3), the metal guide groove layer (2) is welded to the metal shell (1), a ceramic trapezoidal slider layer (33) is provided in the metal guide groove layer (2), a metal mixture layer (4) is provided in the gap between the ceramic trapezoidal slider layer (33) and the metal guide groove layer (2), and a metal inner wall clip (21) is provided below the metal mixture layer (4); The ceramic insulator (3), the metal guide groove layer (2), the ceramic trapezoidal slider layer (33) and the metal mixture layer are sintered at high temperature to form a metallized integral part, and a first cavity (351) and a second cavity (353) are respectively provided therein. The first cavity (351) is provided with a thermal fuse (53) and a thermal fuse wiring harness (54) through high-temperature silicone water (55), and the second cavity (353) is provided with a thermistor (51) and a thermistor wiring harness (52) through high-temperature silicone water (55).

2. The temperature sensor (10) according to claim 1, characterized in that The metallized whole is provided with a packaging cavity (35), and the thermistor (51), the thermistor wiring harness (52), the thermal fuse (53), and the thermal fuse wiring harness (54) are respectively provided thereon via high-temperature silicone gel water (55).

3. A temperature sensor (10), characterized in that: The temperature sensor comprises: Metal housing (1); A metal guide groove layer (2), wherein the metal guide groove layer (2) is formed with a groove (23); A ceramic insulator (3), wherein a connection structure cooperating with the groove (23) is formed at an end portion of the ceramic insulator (3), so that the ceramic insulator (3) and the metal guide groove layer (2) are fixed in cooperation with the groove (23) through the connection structure; A metal mixture layer (4) is further provided between the ceramic insulator (3) and the groove wall of the groove (23), and the metal guide groove layer (2) and the metal shell (1) are sintered and connected into a whole through the metal mixture layer (4); An encapsulation cavity (35) is also formed on one end of the ceramic insulator (3) facing away from the metal guide groove layer (2); A temperature sensing element (5), the temperature sensing element (5) being encapsulated in the encapsulation cavity (35); The opening edge of the groove (23) is provided with a metal inner wall clip (21); The ceramic insulator (3) comprises a ceramic body (31) and a ceramic trapezoidal slider layer (33) connected to an end of the ceramic body (31), the ceramic body (31) is provided with the packaging cavity (35), the connecting structure is provided on the side wall of the ceramic trapezoidal slider layer (33), and the connecting structure comprises a limiting step (331) formed on the side wall of the ceramic trapezoidal slider layer (33); The metal inner wall bayonet (21) abuts against the surface of the limiting step (331) to limit the separation of the ceramic trapezoidal slider layer (33) from the groove (23); The bottom wall surface of the groove (23) is arranged to be inclined along a first direction; The end surface of the ceramic trapezoidal slider layer (33) is arranged to have a gradually decreasing thickness along the first direction; The end surface of the ceramic trapezoidal sliding block layer (33) is tightly fitted and abutted against the bottom wall surface of the groove (23).

4. The temperature sensor (10) according to claim 3, characterized in that The packaging cavity (35) is divided into a first cavity (351) and a second cavity (353) by a partition, and the temperature sensing element (5) comprises: a thermal fuse (53), the thermal fuse (53) being disposed in the first cavity (351); and A thermistor (51), wherein the thermistor (51) is disposed in the second cavity (353).

5. The temperature sensor (10) according to claim 3, characterized in that One end of the thermistor harness (52) and the thermistor (51) are encapsulated by high-temperature silicone gel (55), and the other end is passed through the encapsulation cavity (35); And / or, one end of the thermal fuse harness (54) and the thermal fuse (53) are encapsulated by high-temperature silicone water (55), and the other end is passed through the encapsulation cavity (35) for arrangement.

6. The temperature sensor (10) according to claim 3, characterized in that The temperature sensor further comprises a spring (6), the metal shell (1) is provided with a first notch and a second notch, the first notch and the second notch are arranged in communication, the inner diameter of the first notch is smaller than that of the second notch, the metal guide groove layer (2) is arranged at the first notch, one end of the spring (6) is mounted on the wall of the second notch, and the other end is arranged to be exposed from the second notch, so as to elastically support the metal shell (1) along the expansion and contraction direction of the spring (6).

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