A new energy automobile circuit board glue curing device, method and application thereof

Abstract

The application discloses a new energy automobile circuit board glue curing device and a method and application thereof, and mainly comprises a surface light source module, a main controller, a temperature sensing module and the like, the main controller is connected with the temperature sensing module and the surface light source module, the surface light source module irradiates the area to be glued, and the flux is heated to the activation temperature. In the application, the flux is heated to the activation temperature and then the epoxy glue is dotted, which is beneficial to improving the flowability of the epoxy glue and timely removing the bubbles in the epoxy glue, promoting the fusion of the flux and the epoxy glue, and significantly improving the filling, bubble removing and curing effects; the LED lamp bead array arranged in sequence is arranged to form the surface light source module, and the surface light source module is matched with the main controller, so that the surface light source module can be used immediately, the irradiation power, irradiation time, irradiation range and the like can be adjusted, rapid heating is realized, the working efficiency is high, the automatic production is beneficial to be realized, and the surface light source module realizes the glue curing through irradiation, the risk of blowing away and scattering the flux does not exist, and the curing is more reliable.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of glue curing, and particularly relates to a new energy automobile circuit board glue curing device, a method thereof and application. BACKGROUND

[0002] In recent years, new energy vehicles have gradually become one of the daily transportation tools of people due to the advantages of energy saving, environmental protection and high efficiency. The new energy vehicle circuit board usually needs to be glued, insulated and protected and reinforced, for example, the connector needs to be glued with epoxy or UV glue, the metal PIN pin needs to be wrapped and protected, the nickel sheet needs to be glued with epoxy or UV glue, and the NTC needs to be glued with epoxy or UV glue. The UV glue can be cured by UV, but at present, the oven or reflow soldering needs to be used after the epoxy glue is glued in the industry, and the curing time is about 30-60 min. The curing time is relatively long, the curing efficiency is relatively low, and the curing effect is also poor. Especially, the connector needs to be SMT, and the solder paste is fused and welded. A large amount of flux is left on all PIN pins. Due to the different thicknesses of the residual flux, the product will have a certain percentage of failure in actual application. This is because the flux and the epoxy glue are not well fused, which leads to the decrease of the adhesion of the epoxy glue and the base material, and then leads to the leakage current between the PIN pins and the PIN pins, which reduces the protection. In addition, the viscosity of the epoxy glue is high, and there will be bubbles in the glue during the gluing process. If the bubbles cannot be removed in time during the curing, the product protection will also lose effect. Due to the high viscosity of the epoxy glue, the wrapping itself needs to be filled due to the problem of the product structure, which conflicts with the high viscosity of the glue, and therefore, the filling will also have a certain percentage of problems, which will also lead to the loss of product protection effect.

[0003] It also needs to be noted that different fluxes have different activation temperatures, and the most active temperature of the flux is usually 120-180 DEG C. However, in the current process, the epoxy glue usually starts to react when the flux has not reached the activation temperature, and the curing effect is poor. If the whole is directly heated, if the product is too long and too large, not only the energy consumption will be greatly increased, but also the production efficiency will be seriously affected, and even there is a risk of damaging the product. And from the production process point of view, it is not easy to realize. If only the residual area of the flux is heated, a form similar to hot air blowing can be selected, but there is a risk of blowing away the flux, which makes the black epoxy glue worse for product protection. If the traditional chassis heating is considered, the products in the new energy industry are too many, too large and too miscellaneous, and the chassis heating cannot be used. At the same time, the problem of the large carrier and the carrier material will lead to a large amount of heat dissipation, which is difficult to meet the needs, and the time is consumed. From the production process point of view, it is not easy to realize. If infrared heating is considered, the traditional infrared cannot realize point-to-point local heating, and the time is consumed, which cannot realize the process production of the production product. SUMMARY

[0004] To solve the technical problems in the prior art, the purpose of the present application is to provide a new energy automobile circuit board glue curing device, method and application.

[0005] To achieve the above purposes and effects, the technical solution adopted by the present application is as follows:

[0006] A new energy automobile circuit board glue curing device, characterized in that it comprises a surface light source module, a main controller and a temperature sensing module, the input end of the main controller is connected with the temperature sensing module, the output end of the main controller is connected with the surface light source module, the temperature sensing module is used for real-time detection of temperature data of a to-be-glued area and transmission to the main controller, the main controller controls the surface light source module to adjust irradiation parameters according to the temperature data transmitted by the temperature sensing module, the irradiation range of the surface light source module is adjustable and matched with the to-be-glued area, and the surface light source module is used for irradiation of the to-be-glued area to heat the flux to an activation temperature.

[0007] Further, the new energy automobile circuit board glue curing device further comprises an area size statistical module, the input end of the main controller is connected with the area size statistical module, the area size statistical module is used for real-time detection of the area size of the to-be-glued area and transmission to the main controller, and the main controller controls LED lamp beads at different positions of the surface light source module to be lit according to the area size data transmitted by the area size statistical module to adjust the irradiation area.

[0008] Further, the surface light source module comprises an array of LED lamp beads arranged in sequence, and the main controller controls the surface light source module to adjust irradiation parameters including irradiation power, duty cycle and irradiation time according to the temperature data transmitted by the temperature sensing module.

[0009] Further, the wavelength interval of the array of LED lamp beads is 800-1600nm.

[0010] Further, the main controller is a single-chip microcomputer or a PLC programmable logic controller.

[0011] Further, the single-chip microcomputer is an STM32F series or an STC series single-chip microcomputer.

[0012] Further, the temperature sensing module is an infrared temperature sensor, a thermal imager or a digital temperature sensor.

[0013] The present application also discloses a new energy automobile circuit board glue curing method, which adopts the new energy automobile circuit board glue curing device as described above and comprises the following steps:

[0014] 1) Determine the new energy automobile circuit board to be glued area, through the temperature sensing module real-time detection temperature data of the area to be glued and transmitted to the main controller, also can be according to the actual demand through the area size statistics module real-time detection area size of the area to be glued and transmitted to the main controller;

[0015] 2) Before dispensing, the main controller controls the LED lamp bead irradiation power, duty ratio and irradiation time of the area light source module according to the temperature data transmitted by the temperature sensing module to control the temperature rising interval to achieve the constant set temperature;

[0016] The main controller can also light up LED lamp beads at different positions according to the area size data transmitted by the area size statistics module;

[0017] 3) Before dispensing, use the area light source module to irradiate the area to be glued, so that the flux is heated to the activation temperature;

[0018] 4) When the temperature of the area to be glued does not decrease significantly, the area to be glued is filled, and then the plate is discharged and flows into the next process.

[0019] In step 4), epoxy glue is used for filling, and the PIN pin is wrapped and protected.

[0020] The application also discloses an application of the new energy automobile circuit board glue curing device in a connector.

[0021] Compared with the prior art, the application has the following advantages:

[0022] The application discloses a new energy automobile circuit board glue curing device, a method and an application thereof. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The principle diagram of the application is shown in the figure. DETAILED DESCRIPTION

[0024] The present application will be described in detail below so that the advantages and features of the present application can be more easily understood by those skilled in the art, and the scope of protection of the present application can be more clearly defined.

[0025] The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0026] As shown in Figure 1 A new energy vehicle wiring board glue curing device, comprising a surface light source module, a main controller, a temperature sensing module, wherein the main controller is a PLC programmable logic controller or a single-chip microcomputer (STM32F series or STC series single-chip microcomputer), preferably a PLC programmable logic controller, the input end of the main controller is connected with the temperature sensing module, the temperature sensing module is used for real-time detection of temperature data of a to-be-gluing area and transmission to the main controller for processing, the output end of the main controller is connected with the surface light source module, the surface light source module comprises an LED lamp bead array arranged in sequence, the main controller controls the surface light source module to adjust irradiation parameters including irradiation power, duty cycle (which can be understood as the frequency of lamp bead flashing within 1s), irradiation time, etc. according to the temperature data transmitted by the temperature sensing module, the irradiation range of the surface light source module is adapted to the to-be-gluing area, and in use, the to-be-gluing area is first irradiated by the surface light source module to heat the flux to an activation temperature (active temperature), and then the gluing operation is performed.

[0027] In the present application, the wavelength range of the LED lamp bead array is 800-1600nm, and the wavelength is preferably 808, 850, 940nm. The irradiation power, irradiation range and duty cycle of the LED lamp bead array can be flexibly adjusted, as long as the irradiated object is kept in a constant temperature range. The LED lamp bead array can be set on a gluing equipment or an independent equipment according to actual needs.

[0028] In the present application, the temperature sensing module is an infrared temperature sensor or a thermal imager or a digital temperature sensor, which can be purchased from the market according to actual needs.

[0029] The curing device of the application can also be integrated with an area size counting module according to actual needs, the input end of the main controller is connected with the temperature sensing module and the area size counting module respectively, the area size of the area to be glued is detected in real time through the area size counting module and transmitted to the main controller for processing, the main controller can light LED lamp beads at different positions according to the area size data transmitted by the area size counting module, and then adjust the irradiation area.

[0030] A new energy automobile circuit board glue curing method, comprising the following steps:

[0031] 1) Determine the area to be glued of the new energy automobile circuit board, detect the area size of the area to be glued in real time through the area size counting module and transmit it to the main controller, detect the temperature data of the area to be glued in real time through the temperature sensing module and transmit it to the main controller;

[0032] 2) Before gluing, the main controller controls the area light source module to adjust the irradiation parameters including irradiation power, duty cycle, irradiation time, etc. according to the temperature data transmitted by the temperature sensing module, and the main controller also lights LED lamp beads at different positions according to the area size data transmitted by the area size counting module, so that the irradiation area of the LED lamp beads coincides with the area to be glued;

[0033] 3) Before gluing, use the area light source module to irradiate the area to be glued, so that the flux residue is heated to the activation temperature (active temperature), which is usually heated to 140-150 DEG C;

[0034] 4) Because the temperature loss is relatively large when heating the flux locally, the activation of the flux will decrease with the decrease of the temperature, therefore, it is necessary to select the temperature of the area to be glued not to decrease greatly, that is, under the condition of 100-150 DEG C, the area to be glued is filled, preferably using epoxy glue to fill and wrap the PIN pin for protection, and then the board is discharged and flows into the next process.

[0035] The application is helpful for the fusion of all fluxes and epoxy glues, as long as the flux is irradiated and heated in advance, then glued, and then normally discharged. In the existing process, only one process of heating the flux to the activation temperature is needed to obtain significant curing effect, which is low in cost and simple in operation.

[0036] The application also discloses an application of the new energy automobile circuit board glue curing device in a connector, which can improve the adhesion by 20-30% or even more, effectively reduces the probability of leakage current, and improves the performance of the whole product; and can solve the problem of poor curing effect caused by the fusion degree, filling degree and bubbles of the flux and epoxy glue in the prior art.

[0037] Spectrum warming test test:

[0038] The 3812-1 epoxy glue coated on the glass test piece was irradiated for 1 min using HF-5643 spectrum, HF-7945 spectrum, HF-7780 spectrum and HF-4904 spectrum respectively. The results showed that after irradiation for 1 min, the glue had no obvious change, but the HF-5643 spectrum and the HF-7945 spectrum were slow in warming the glue, and did not reach the test standard of more than 150 DEG C within 1 min, and did not meet the use requirements; the HF-7780 spectrum was relatively fast in warming the glue, but also did not reach the test standard of more than 150 DEG C within 1 min, and did not meet the use requirements; the HF-4904 spectrum emitted smoke and had burnt marks within 10 s of irradiating the glue, indicating that the power was too high. After reducing the power by one fourth, the HF-4904 spectrum was very fast in warming the glue, reached the test standard of more than 150 DEG C within 1 min, met the use requirements, and could be used for glue curing.

[0039] Penetration force test test:

[0040] The 3812-1 epoxy glue was coated on the connector according to the use requirements, with a coating thickness of 8 mm, and was heated for 5 min using the HF-4904 spectrum LED lamp bead and the oven respectively. The results are shown in Table 1.

[0041] Table 1

[0042]

[0043]

[0044] The results showed that compared with the oven heating, the HF-4904 spectrum irradiation had a more intense warming effect on the glue, the penetration heating speed was fast, the penetration force was stronger, and the glue could smoke and burn in a very short time, the glue could be cured more gently in a controllable temperature range, and the glue temperature rise could be more flexibly controlled; the glue in the room temperature environment could be rapidly heated by irradiation penetration; when irradiating the glue, the temperature difference between the surface and the bottom of the glue was large, which was caused by the small irradiation area of the bottom.

[0045] Adhesion test test:

[0046] First, the solder paste is heated, and the excess flux is collected. After the flux is cooled, the 3812-1 epoxy glue is coated on the glass, the HF-4904 spectrum is irradiated for 15 minutes, and the oven is baked at 125 DEG C for 15 minutes. The results show that after the HF-4904 spectrum is irradiated, the solder resist is drier, the yellowing is less, there is no bubble on the back, there is no gap similar to the crack, it is difficult to peel off, and the body of the glue needs to be damaged basically. However, after the oven is baked, the solder resist is slightly sticky, the yellowing is more, there is no bubble and no gap similar to the crack on the back, the blade is inserted into the bottom of the glue, and the glue and the glass are peeled off with slight force. The opening is in a sheet shape, which means that the adhesion of the oven-cured glue is lower than that of the irradiated-cured glue.

[0047] Tensile shear strength test test:

[0048] The flux is applied to the aluminum test piece, and the 3812-1 epoxy glue is coated after the flux is cooled. The thickness of the glue and the flux is controlled within 1 mm. The HF-4904 spectrum is irradiated for 30 minutes, and the oven is baked at 125 DEG C for 30 minutes. The results show that the average value of the tensile shear strength of the irradiation (10.163 MPa, 12.73, 9.594 MPa, 10.668 MPa) is greater than the average value of the oven tensile shear strength (3.524 MPa, 5.679 MPa, 4.11 MPa, 7.928 MPa).

[0049] DC1000 voltage test leakage current <1 mA test test:

[0050] The results show that the average value of the irradiation DC1000 voltage test leakage current is greater than that of the oven DC1000 voltage test leakage current.

[0051] From the above test, it can be known that:

[0052] 1. The surface light source module can heat the glue under the irradiation of the suitable spectrum, and the heating effect is extremely fast.

[0053] 2. When the surface light source module is irradiated, the penetrating power of the rays is strong, and can penetrate different colors, different thicknesses and materials.

[0054] 3. According to visual observation and artificial judgment, the adhesion of the glue and the flux on the test piece is obviously different under the irradiation and the oven, and the irradiation is better than the oven at present.

[0055] 4. The tensile shear strength and the DC1000 leakage current test results show that the data of the irradiation and the oven are obviously different, and the data of the irradiation is better than that of the oven at present.

[0056] The parts or structures not specifically described in the application can adopt the prior art or existing products, which will not be described here.

[0057] The above merely illustrates the embodiments of the present application, and is not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process conversion, or direct or indirect application in other related technical fields, made by using the content of the present application, are also included in the patent protection scope of the present application.

Claims

1. A new energy vehicle circuit board glue curing device, characterized in that, The surface light source module, the main controller, the temperature sensing module and the area size statistical module are connected, the input end of the main controller is connected with the temperature sensing module, the output end of the main controller is connected with the surface light source module, the temperature sensing module is used for detecting the temperature data of the area to be glued and transmitting to the main controller, the main controller controls the surface light source module to adjust the irradiation parameters according to the temperature data transmitted by the temperature sensing module, the irradiation range of the surface light source module is adjustable and suitable for the area to be glued, and the surface light source module is used for irradiating the area to be glued and heating the flux to the activation temperature. The input end of the main controller is connected with the area size statistical module, the area size statistical module is used for detecting the area size of the area to be glued and transmitting to the main controller, and the main controller controls the LED lamp beads at different positions of the surface light source module to adjust the irradiation area according to the area size data transmitted by the area size statistical module. The wavelength interval of the LED lamp bead array is 800-1600nm. Before gluing, the surface light source module is used for irradiating the area to be glued, so that the flux residue is heated to 140-150 DEG C.

2. The new energy vehicle circuit board glue curing device according to claim 1, characterized in that, The surface light source module comprises an LED lamp bead array arranged in sequence, and the main controller controls the surface light source module to adjust the irradiation parameters including the irradiation power, the duty cycle and the irradiation time according to the temperature data transmitted by the temperature sensing module.

3. The new energy vehicle circuit board glue curing device according to claim 1, characterized in that, The main controller is a single-chip microcomputer or a PLC programmable logic controller.

4. The new energy vehicle circuit board glue curing device according to claim 3, characterized in that, The single-chip microcomputer is an STM32F series or an STC series single-chip microcomputer.

5. The new energy vehicle circuit board glue curing device according to claim 1, characterized in that, The temperature sensing module is an infrared temperature sensor, a thermal imager or a digital temperature sensor.

6. A method for curing the glue of a new energy vehicle wiring board, characterized in that, The new energy automobile circuit board glue curing device comprises the following steps: 1) determining the area to be glued of the new energy automobile circuit board, detecting the temperature data of the area to be glued by the temperature sensing module and transmitting to the main controller; 2) before gluing, the main controller controls the surface light source module to adjust the LED lamp bead irradiation power, the duty cycle and the irradiation time according to the temperature data transmitted by the temperature sensing module, controls the temperature rising interval, so as to reach the constant setting temperature; 3) before gluing, the surface light source module is used for irradiating the area to be glued, so that the flux is heated to the activation temperature; 4) when the temperature of the area to be glued does not decrease greatly, the area to be glued is filled with glue, and then the board is discharged and flows into the next process.

7. The method according to claim 6, wherein the curing is performed at a temperature of 60 to 80°C for 1 to 3 hours. In step 4), the epoxy glue is used for filling, and the PIN pin is wrapped and protected.

8. The application of the new energy automobile circuit board glue curing device in the connector according to any one of claims 1-5.

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