A phase change heat spreader

Abstract

The application discloses a phase change radiator, and relates to the technical field of loop heat pipe. The phase change radiator comprises an evaporation assembly, a heat pipe assembly, a heat exchange assembly and a heat dissipation assembly, the inside of the evaporation assembly is provided with an evaporation cavity and a liquid storage cavity, and the outside of the evaporation assembly is provided with a heat absorption surface and a heat dissipation surface; the heat pipe assembly is provided with an air inlet communicated with the evaporation cavity and a liquid outlet communicated with the liquid storage cavity, the heat pipe assembly forms a first phase change path with the evaporation cavity and the liquid storage cavity, and the first phase change path is filled with phase change working medium; the heat exchange assembly is arranged on the heat dissipation surface and is provided with a heat exchange groove, the heat exchange groove is communicated with the evaporation cavity and the liquid storage cavity and forms a second phase change path, and the second phase change path is filled with phase change working medium; and the heat dissipation assembly is used for absorbing heat generated in the process of phase change of the phase change working medium in the first phase change path and the second phase change path. Because the paths for phase change heat exchange are increased, the heat dissipation paths of the phase change radiator are enriched, and thus the heat dissipation efficiency of the phase change radiator is improved.

Description

Technical Field

[0001] This application relates to the field of loop heat pipe technology, and in particular to a phase change radiator. Background Technology

[0002] Phase change heat sinks are filled with phase change working fluid. The working principle of phase change heat sinks is to use the gas-liquid phase change process of the phase change working fluid, namely the evaporation and condensation of two-phase flow, to achieve heat dissipation of heat dissipation devices.

[0003] In the process of realizing this invention, the inventors discovered at least the following technical problems in the prior art: Currently, the main forms of phase change heat sinks are heat pipes and vapor chambers. While similar in principle, they differ in their heat conduction methods. Heat pipes typically involve one-dimensional linear heat conduction, while vapor chambers conduct heat on a two-dimensional surface. The drawbacks of these forms and their combinations are as follows: For vapor chambers, the placement of the heat dissipation structure is greatly restricted by the direction of heat conduction, limiting their spatial availability; for the combination of a vapor chamber and a heat pipe, the heat dissipation structure occupies the heat dissipation surface of the vapor chamber, thus reducing the heat dissipation effect at the junction, resulting in generally poor heat dissipation performance. Summary of the Invention

[0004] The purpose of this application is to provide a phase change heat sink that allows heat from a heat source to undergo phase change heat exchange through a first phase change path and a second phase change path. Because the number of paths for phase change heat exchange is increased, the heat dissipation path of the phase change heat sink is enriched, thereby improving the heat dissipation efficiency of the phase change heat sink.

[0005] To achieve the above objectives, this application provides a phase change heat sink, including an evaporation assembly, wherein the evaporation assembly has an evaporation chamber and a liquid storage chamber inside, and a heat absorption surface and a heat dissipation surface outside the evaporation assembly; the phase change heat sink further includes:

[0006] A heat pipe assembly has an air inlet communicating with the evaporation chamber and a liquid outlet communicating with the liquid storage chamber. The heat pipe assembly, the evaporation chamber, and the liquid storage chamber form a first phase change path, and the first phase change path is filled with a phase change working fluid.

[0007] A heat exchange component is disposed on the heat dissipation surface and is provided with heat exchange channels. The heat exchange channels are connected to the evaporation chamber and the liquid storage chamber to form a second phase change path. The second phase change path is filled with a phase change working fluid.

[0008] A heat dissipation component is used to absorb the heat generated by the phase change working fluid in the first phase change path and the second phase change path during the gas-liquid phase change process.

[0009] In some embodiments, the heat dissipation component includes:

[0010] The first heat sink has a heat sink cavity and a first heat-conducting surface and a second heat-conducting surface communicating with the heat sink cavity. The first heat-conducting surface is in contact with the heat pipe assembly, and the second heat-conducting surface is in contact with the heat exchange assembly.

[0011] The first heat-conducting surface and the second heat-conducting surface are opposite surfaces on the heat dissipation cavity.

[0012] In some embodiments, the heat pipe assembly includes:

[0013] At least one first heat pipe component, with an air inlet at the first end and a liquid outlet at the second end; when there are multiple first heat pipe components, the multiple first heat pipe components are spaced apart along a first direction;

[0014] The heat dissipation component also includes:

[0015] At least one second heat sink is in contact with the first heat pipe; when there are multiple first heat pipes, there are multiple second heat sinks and the number of second heat sinks is the same as the number of first heat pipes, and each first heat pipe is located between the first heat sink and the second heat sink in the first direction, or between adjacent second heat sinks.

[0016] In some embodiments, the heat pipe assembly further includes:

[0017] The second heat pipe is connected in parallel with the first heat pipe between the evaporation chamber and the liquid storage chamber.

[0018] In some embodiments, the heat-absorbing surface and the heat-dissipating surface are opposing surfaces on the evaporation assembly in a first direction, and the air inlet and the liquid outlet are located on the side of the evaporation assembly between the heat-absorbing surface and the heat-dissipating surface.

[0019] In some embodiments, the heat pipe assembly includes:

[0020] The first conductive section has an air inlet at its free end;

[0021] The heat exchange section is connected to the first conductive section and has a straight section and a bent section. The straight section is spaced apart along the second direction, and the bent section makes the straight section unidirectionally connected.

[0022] The second conductive section is connected to the heat exchange section, and the liquid outlet is provided at its free end.

[0023] In some embodiments, the evaporation assembly includes:

[0024] The evaporator body has a phase change space inside for filling the phase change working fluid;

[0025] A space partition is disposed inside the evaporator body, and divides the phase change space into the evaporation chamber and the liquid storage chamber;

[0026] The heat exchange assembly includes:

[0027] The cover plate assembly is sealed to the evaporator body to enclose the phase change space, the cover plate assembly forms the heat dissipation surface, and the cover plate assembly is provided with the heat exchange channels.

[0028] In some embodiments, the cover plate subassembly includes:

[0029] The overflow cover is sealed to the evaporator body and is provided with an airflow through hole and a liquid flow through hole. The airflow through hole is connected to the evaporation chamber and the liquid flow through hole is connected to the liquid storage chamber.

[0030] A channel cover plate is installed on the side of the overflow cover plate away from the evaporator body, and is provided with the heat exchange channel, which is connected to the airflow through hole and the liquid flow through hole.

[0031] In some embodiments, the heat exchange channel is a spiral channel; the airflow through hole is connected to the inlet at the center of the spiral channel, and the liquid flow through hole is connected to the outlet at the outer periphery of the spiral channel.

[0032] In some embodiments, the liquid storage chamber surrounds the evaporation chamber; the evaporation assembly is further provided with a capillary pad layer communicating with the liquid storage chamber and the evaporation chamber, and the projection pattern of the evaporation chamber on the capillary pad layer is completely covered by the capillary pad layer.

[0033] Compared to the aforementioned background technology, the phase change radiator provided in this application includes an evaporation assembly, a heat pipe assembly, a heat exchange assembly, and a heat dissipation assembly. The evaporation assembly has an evaporation chamber and a liquid storage chamber internally, and an absorption surface and a heat dissipation surface externally. The heat pipe assembly has an air inlet communicating with the evaporation chamber and a liquid outlet communicating with the liquid storage chamber. The heat pipe assembly, the evaporation chamber, and the liquid storage chamber form a first phase change path, which is filled with a phase change working fluid. The heat exchange assembly is disposed on the heat dissipation surface and has heat exchange channels. The heat exchange channels communicate with the evaporation chamber and the liquid storage chamber to form a second phase change path, which is filled with a phase change working fluid. The heat dissipation assembly is used to absorb the heat generated by the phase change working fluid in the first and second phase change paths during the gas-liquid phase change process.

[0034] During the use of this phase change radiator, the phase change radiator can absorb heat from the heat source. For example, heat absorption can be achieved through the heat-absorbing surface of the evaporation component. When the phase change radiator absorbs heat, the phase change working fluid in the first and second phase change paths changes to a gaseous state at the evaporation chamber. At this time, the phase change working fluid absorbs heat during the gas-liquid phase change process. After the phase change working fluid changes to a gaseous state, the heat dissipation component absorbs the heat from the phase change working fluid, and the phase change working fluid changes to a liquid state. At this time, the phase change working fluid generates heat during the gas-liquid phase change process. After the phase change working fluid changes to a liquid state, the phase change working fluid flows into the liquid storage chamber, which replenishes the phase change working fluid in the evaporation chamber, forming a heat dissipation cycle for the heat source. In this process, the first phase change path is formed by the heat pipe assembly, the evaporation chamber, and the liquid storage chamber. Due to the characteristics of the heat pipe assembly, the first phase change path has the advantage of long-distance transmission, which can disperse heat to higher and farther places for heat dissipation. The second phase change path is formed by the heat exchange channel, the evaporation chamber, and the liquid storage chamber. The heat exchange channel is set on the heat dissipation surface of the evaporation assembly. Because the second phase change path adopts phase change heat dissipation, the heat dissipation effect is better than the heat radiation heat dissipation method on the heat dissipation surface of the evaporation assembly. Therefore, while maintaining the heat dissipation function of the heat dissipation surface, the second phase change path improves the heat dissipation effect of the heat dissipation surface.

[0035] Based on the above structural and process description, this phase change radiator allows the heat from the heat source to undergo phase change heat exchange through the first and second phase change paths. Because the number of paths for phase change heat exchange is increased, the heat dissipation path of the phase change radiator is enriched, thereby improving the heat dissipation efficiency of the phase change radiator. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of the phase change heat sink provided in the first embodiment of this application;

[0038] Figure 2 This is a schematic diagram of the structure of a phase change heat sink provided in the second embodiment of this application;

[0039] Figure 3 This is a schematic diagram of the structure of the heat pipe assembly and evaporation assembly provided in the embodiments of this application;

[0040] Figure 4 for Figure 1 A schematic diagram of the phase change heat sink;

[0041] Figure 5 for Figure 1 A cross-sectional view of the phase change radiator with a plane perpendicular to the second direction as the cross-section;

[0042] Figure 6 for Figure 1 A cross-sectional view of a phase change radiator with a plane perpendicular to the third direction as the cross section;

[0043] Figure 7 This is a schematic diagram of the structure of the channel cover and evaporation assembly provided in the embodiments of this application;

[0044] Figure 8 This is a schematic diagram of the structure of the flow cover and evaporation assembly provided in the embodiments of this application;

[0045] Figure 9 This is a schematic diagram of the structure of the evaporation assembly provided in the embodiments of this application;

[0046] Figure 10 This is a schematic diagram of the structure of the channel cover plate provided in the first embodiment of this application;

[0047] Figure 11 This is a schematic diagram of the structure of the overflow cover provided in the embodiments of this application;

[0048] Figure 12 This is a schematic diagram of the structure of a phase change heat sink provided in the third embodiment of this application;

[0049] Figure 13 This is a schematic diagram of the structure of the phase change heat sink provided in the fourth embodiment of this application;

[0050] Figure 14 This is a schematic diagram of the structure of the channel cover plate provided in the second embodiment of this application;

[0051] Figure 15 This is a structural schematic diagram of the channel cover plate provided in the third embodiment of this application.

[0052] in:

[0053] 1-Evaporation assembly, 1001-Evaporation chamber, 1002-Liquid storage chamber, 1003-Heat absorption surface, 1004-Heat dissipation surface, 101-Evaporator body, 1011-Phase change space, 102-Space partition, 103-Capillary pad, 104-Flow guide pipe, 105-Water injection pipe, 106-Support column,

[0054] 2-Heat pipe assembly, 2001-Air inlet, 2002-Liquid outlet, 2000-First phase change path, 21-First heat pipe component, 22-Second heat pipe component, 201-First conductive section, 202-Heat exchange section, 2021-Straight section, 2022-Bent section, 203-Second conductive section

[0055] 3-Heat exchange assembly, 301-Heat exchange channel, 3011-Guiding unit, 3000-Second phase change passage, 31-Cover plate sub-assembly, 311-Flow cover plate, 3111-Airflow through hole, 3112-Liquid flow through hole, 312-Channel cover plate,

[0056] 4-Heat dissipation component, 41-First heat sink, 411-Heat dissipation cavity, 412-First heat conduction surface, 413-Second heat conduction surface, 42-Second heat sink, 401-Heat dissipation body, 4011-Air cooling channel, 402-Heat dissipation fins, 403-Mounting groove. Detailed Implementation

[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0058] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0059] Currently, electronic devices are consuming increasingly higher power, and the application of kilowatt-level to megawatt-level heat-generating equipment and components is becoming more and more widespread. How to achieve sufficient heat dissipation within a limited space and increase the heat dissipation effect has placed higher demands on heat sinks.

[0060] Traditional methods typically employ heat pipes welded onto vapor chambers or copper plates to form a three-dimensional, irregular structure, followed by the welding of heat dissipation fins for heat transfer and dissipation. However, this approach usually relies on complex heat dissipation components, and heat transfer is significantly affected by the application.

[0061] Therefore, there are many drawbacks to the combination of vapor chamber and heat pipe. For example, the heat pipe is welded to the heat dissipation surface of the vapor chamber, and the connection between the capillary in the heat pipe and the capillary in the vapor chamber is complicated. The heat pipe occupies the heat dissipation surface, which makes the overall heat dissipation effect generally poor. The three-dimensional vapor chamber formed by welding heat pipe to vapor chamber has poor performance when used in the direction against gravity.

[0062] To address the aforementioned technical problems, particularly the issue of mediocre overall heat dissipation due to the occupied heat dissipation surface of the vapor chamber, this application provides a phase change heat sink, please refer to... Figure 1 , Figure 1 This is a schematic diagram of the structure of a phase change heat sink provided in the first embodiment of this application.

[0063] like Figure 1 As shown, the phase change radiator mainly includes an evaporation assembly 1, a heat pipe assembly 2, a heat exchange assembly 3, and a heat dissipation assembly 4. Figure 1 Only one possible positional relationship between the evaporation assembly 1, heat pipe assembly 2, heat exchange assembly 3, and heat dissipation assembly 4 is shown. Unless otherwise specified below, the positional relationship of each component is not limited to the scheme given in each figure.

[0064] exist Figure 1 The illustrated coordinate system includes an X-axis, a Y-axis, and a Z-axis. In some cases, the X-axis is a third direction, the Y-axis is a second direction, and the Z-axis is a first direction. Alternatively, the X-axis and the third direction may correspond to the horizontal direction, the Y-axis and the second direction may correspond to the vertical direction, and the Z-axis and the first direction may correspond to the vertical direction.

[0065] Please refer to Figure 5 , Figure 5 for Figure 1 A cross-sectional view of the phase change radiator with a plane perpendicular to the second direction as the cross-section. Figure 5 The cross-section of the phase change radiator is parallel to the plane intersecting the X and Z axes.

[0066] For evaporation component 1, such as Figure 5 As shown, after dissecting the evaporation assembly 1, it can be seen that the evaporation assembly 1 has an evaporation chamber 1001 and a liquid storage chamber 1002 inside. The evaporation chamber 1001 and the liquid storage chamber 1002 should be connected, so that after the phase change working medium leaves the evaporation chamber 1001, the liquid storage chamber 1002 can replenish the phase change working medium into the evaporation chamber 1001. For the specific structure and principle of the connection between the evaporation chamber 1001 and the liquid storage chamber 1002, please refer to the relevant content of evaporators in the prior art, which is not an improvement or description of this embodiment.

[0067] The evaporation assembly 1 has an external heat-absorbing surface 1003 and a heat-dissipating surface 1004. The heat-absorbing surface 1003 facilitates the transfer of heat from the heat source to the evaporation assembly 1; that is, the evaporation assembly 1 absorbs heat from the heat source through the heat-absorbing surface 1003. The heat-absorbing surface 1003 is not limited to a single surface on the exterior of the evaporation assembly 1; it can be a single surface or multiple surfaces. Furthermore, regarding the heat transfer method from the heat-absorbing surface 1003 to the heat source, the heat-absorbing surface 1003 can be in contact with the heat source or not in direct contact with the heat source, both of which fall within the scope of this embodiment. The heat-dissipating surface 1004 is a different surface from the heat-absorbing surface 1003. The function of the heat-dissipating surface 1004 is to diffuse the heat absorbed by the evaporation assembly 1 into the external environment, thereby achieving heat dissipation.

[0068] Please refer to Figure 2 , Figure 2This is a schematic diagram of the structure of a phase change heat sink provided in the second embodiment of this application.

[0069] For heat pipe assembly 2, such as Figure 2 As shown, the heat pipe assembly 2 has an air inlet 2001 and a liquid outlet 2002. The air inlet 2001 and the liquid outlet 2002 can be located at the end of the heat pipe assembly 2 or other positions, and are not limited in this embodiment. Figure 2 and Figure 5 As can be seen, the air inlet 2001 is connected to the evaporation chamber 1001, thus enabling the phase change working fluid in the evaporation chamber 1001 to enter the heat pipe assembly 2 in gaseous form; the liquid outlet 2002 is connected to the liquid storage chamber 1002, thus enabling the phase change working fluid in the heat pipe assembly 2 to enter the liquid storage chamber 1002 in liquid form. Based on this, through the connection between the air inlet 2001 and the evaporation chamber 1001 and the connection between the liquid outlet 2002 and the liquid storage chamber 1002, the heat pipe assembly 2, the evaporation chamber 1001, and the liquid storage chamber 1002 form a first phase change path 2000. The first phase change path 2000 is filled with the phase change working fluid. The phase change working fluid changes to gas at the evaporation chamber 1001 and enters the heat pipe assembly 2. The phase change working fluid then changes to liquid in the heat pipe assembly 2 and enters the liquid storage chamber 1002, from which the liquid storage chamber 1002 replenishes the phase change working fluid to the evaporation chamber 1001.

[0070] For heat exchange component 3, combined with Figure 2 and Figure 5 As can be seen, the heat exchange component 3 is disposed on the heat dissipation surface 1004, and the heat exchange component 3 is provided with a heat exchange channel 301. The heat exchange channel 301 should be located on the side of the heat exchange component 3 facing the evaporation component 1. Similar to the first phase change passage 2000, the heat exchange channel 301 is connected to the evaporation chamber 1001 and the liquid storage chamber 1002 to form a second phase change passage 3000. The second phase change passage 3000 is filled with a phase change working medium. The phase change working medium changes to gas at the evaporation chamber 1001 and enters the heat exchange channel 301. The phase change working medium then changes to liquid in the heat exchange channel 301 and enters the liquid storage chamber 1002. The liquid storage chamber 1002 replenishes the phase change working medium to the evaporation chamber 1001.

[0071] For heat dissipation component 4, such as Figure 1As shown, the heat dissipation component 4 is used to absorb the heat generated by the phase change working fluid in the first phase change path 2000 and the second phase change path 3000 during the gas-liquid phase change process. It should be noted that the heat dissipation component 4 can conduct heat from the first phase change path 2000 and the second phase change path 3000 in various ways, including contact conduction and non-contact conduction, both of which fall within the scope of this embodiment. The heat dissipation principle of the heat dissipation component 4 can also be varied, including air cooling and water cooling, both of which fall within the scope of this embodiment. Furthermore, the heat dissipation component 4 can absorb heat from the first phase change path 2000 and the second phase change path 3000 simultaneously, or it can absorb heat from the first phase change path 2000 and the second phase change path 3000 independently, both of which fall within the scope of this embodiment.

[0072] During the use of this phase change radiator, the phase change radiator can absorb heat from the heat source. For example, heat absorption can be achieved through the heat absorption surface 1003 of the evaporation component 1. When the phase change radiator absorbs heat, the phase change working fluid in the first phase change passage 2000 and the second phase change passage 3000 changes to a gaseous state at the evaporation chamber 1001. At this time, the phase change working fluid absorbs heat during the gas-liquid phase change process. After the phase change working fluid changes to a gaseous state, the heat dissipation component 4 absorbs the heat of the phase change working fluid, and the phase change working fluid changes to a liquid state. At this time, the phase change working fluid generates heat during the gas-liquid phase change process. After the phase change working fluid changes to a liquid state, the phase change working fluid flows into the liquid storage chamber 1002, and the liquid storage chamber 1002 replenishes the phase change working fluid in the evaporation chamber 1001, forming a heat dissipation cycle for the heat source. In this process, the first phase change path 2000 is formed by the heat pipe assembly 2, the evaporation chamber 1001, and the liquid storage chamber 1002. Due to the characteristics of the heat pipe assembly 2, the first phase change path 2000 has the advantage of long-distance transmission, which can disperse heat to higher and farther places for heat dissipation. In addition, under anti-gravity application, the heat pipe assembly 2 can also exert its good anti-gravity characteristics, expanding the operation modes of the phase change heat sink in all directions; for the second phase change path 3000... The second phase change passage 3000 is formed by the heat exchange channel 301, the evaporation chamber 1001, and the liquid storage chamber 1002. The heat exchange channel 301 is disposed on the heat dissipation surface 1004 of the evaporation component 1. Because the second phase change passage 3000 adopts phase change heat dissipation, the heat dissipation effect is better than the heat dissipation method of heat radiation on the heat dissipation surface 1004 of the evaporation component 1. Therefore, while maintaining the heat dissipation function of the heat dissipation surface 1004, the second phase change passage 3000 improves the heat dissipation effect of the heat dissipation surface 1004.

[0073] Based on the above structural and process description, this phase change radiator allows heat from the heat source to undergo phase change heat exchange through the first phase change path 2000 and the second phase change path 3000. Because the number of pathways for phase change heat exchange is increased, the heat dissipation paths of the phase change radiator are enriched, thereby improving its heat dissipation efficiency. Furthermore, it can reduce the start-up temperature within the evaporation assembly 1, improving the start-up performance and heat transfer performance of the phase change path.

[0074] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of the heat pipe assembly and evaporation assembly provided in the embodiments of this application.

[0075] like Figure 3 As shown, in some embodiments, the heat pipe assembly 2 includes a first heat pipe component 21. The first end of the first heat pipe component 21 is provided with an air inlet 2001, and the second end of the first heat pipe component 21 is provided with a liquid outlet 2002. The first heat pipe component 21 is connected to the evaporation chamber 1001 through the air inlet 2001, and the first heat pipe component 21 is connected to the liquid storage chamber 1002 through the liquid outlet 2002.

[0076] Furthermore, at least one first heat pipe component 21 is provided. When there are multiple first heat pipe components 21, the multiple first heat pipe components 21 are spaced apart along the first direction, that is, the multiple first heat pipe components 21 are spaced apart in the Z-axis direction. This is equivalent to a layered design of the heat pipe assembly 2 in the vertical direction, which makes full use of the vertical space and allows heat to be transferred to higher and farther positions, thereby improving the overall heat dissipation efficiency. In addition, the heat pipe assembly 2 has gaps between layers, which helps to improve the heat dissipation efficiency of each layer and avoids the accumulation of heat in the vertical direction.

[0077] Please refer to Figure 4 , Figure 4 for Figure 1 A schematic diagram showing the disassembled phase change heat sink.

[0078] Combination Figure 4 and Figure 2 In some embodiments, the heat dissipation assembly 4 includes a first heat dissipation element 41, which has a heat dissipation cavity 411 and a first heat-conducting surface 412 and a second heat-conducting surface 413 communicating with the heat dissipation cavity 411. The first heat-conducting surface 412 is in contact with the heat pipe assembly 2, and the second heat-conducting surface 413 is in contact with the heat exchange assembly 3. The first heat-conducting surface 412 and the second heat-conducting surface 413 are opposite surfaces on the heat dissipation cavity 411.

[0079] In this embodiment, the Z-axis corresponds to the vertical direction as an example. The second heat-conducting surface 413 is located on the lower side of the first heat sink 41 in the vertical direction. When the heat sink assembly 4 contacts the heat exchange assembly 3, the second heat-conducting surface 413 contacts the heat exchange assembly 3 downwards. At this time, the heat from the first phase change path 2000 can be conducted upwards through the heat exchange channel 301 of the heat exchange assembly 3 and through the second heat-conducting surface 413 to the heat sink assembly 4. The first heat-conducting surface 412 is located on the upper side of the first heat sink 41 in the vertical direction. When the heat sink assembly 4 contacts the heat pipe assembly 2, the first heat-conducting surface 412 contacts the heat pipe assembly 2 upwards. At this time, the heat from the first phase change path 2000 can be conducted downwards through the heat pipe assembly 2 and through the first heat-conducting surface 412 to the heat sink assembly 4.

[0080] In some cases, the heat dissipation component 4 can be air-cooled. The heat dissipation cavity 411 should be used as an air-cooled cavity. When using and installing the phase change heat sink, the first heat dissipation element 41 of the heat dissipation component 4 should be placed in the path of the air-cooling airflow. At this time, the air-cooling airflow carries away the heat absorbed by the second heat-conducting surface 413 and the first heat-conducting surface 412 in the heat dissipation cavity 411.

[0081] In some cases, the heat dissipation component 4 can be water-cooled. The heat dissipation cavity 411 should be used as a water-cooled cavity. When using and installing the phase change heat sink, the first heat dissipation element 41 of the heat dissipation component 4 is connected to the coolant system. The coolant system circulates and supplies water-cooled liquid into the heat dissipation cavity 411. At this time, the water-cooled liquid carries away the heat absorbed by the second heat-conducting surface 413 and the first heat-conducting surface 412 in the heat dissipation cavity 411.

[0082] Combination Figure 1 and Figure 4 In some embodiments, the heat dissipation assembly 4 further includes a second heat dissipation element 42, which is in contact with the first heat pipe 21.

[0083] In some cases, the second heat sink 42 has a similar structure to the first heat sink 41, but their functions differ. The first heat sink 41 can cool the first phase change path 2000 and the second phase change path 3000 on opposite sides, while the second heat sink 42 only cools the first phase change path 2000. The addition of the second heat sink 42 increases the heat dissipation area.

[0084] When only one first heat pipe 21 is provided in the first direction, the first heat pipe 21 is located between the first heat sink 41 and the second heat sink 42 in the first direction, and can be regarded as the first heat pipe 21 being jointly wrapped by the first heat sink 41 and the second heat sink 42.

[0085] When multiple first heat pipe components 21 are spaced apart in the first direction, multiple second heat sinks 42 are also set and the number is the same as that of the first heat pipe components 21. Except for the first first heat pipe component 21 located between the first heat sink 41 and the second heat sink 42 in the first direction, the remaining first heat pipe components 21 are located between adjacent second heat sinks 42 in the first direction. This achieves the full wrapping of the heat sink components around the heat pipe components, which can maximize the heat dissipation effect.

[0086] Please refer to Figure 12 , Figure 12 This is a schematic diagram of the phase change heat sink provided in the third embodiment of this application.

[0087] Combination Figure 1 and Figure 12 As can be seen, the heat dissipation component 4 includes a first heat dissipation element 41 and a second heat dissipation element 42. The heat exchange component 3 and the heat pipe component 2 share the first heat dissipation element 41 on the opposite side of the first heat dissipation element 41. The heat pipe component 2 is also wrapped by the first heat dissipation element 41 and the second heat dissipation element 42 in the first direction.

[0088] Please refer to Figure 13 , Figure 13 This is a schematic diagram of the phase change heat sink provided in the fourth embodiment of this application.

[0089] Combination Figure 2 and Figure 13 As can be seen, the heat dissipation component 4 includes only one first heat dissipation element 41, and the heat exchange component 3 and the heat pipe component 2 share the first heat dissipation element 41 on the opposite side of the first heat dissipation element 41.

[0090] Combination Figure 12 and Figure 13 In some embodiments, the heat pipe assembly 2 further includes a second heat pipe component 22, which is connected in parallel with the first heat pipe component 21 between the evaporation chamber 1001 and the liquid storage chamber 1002.

[0091] In this embodiment, both the second heat pipe 22 and the first heat pipe 21 have an air inlet 2001 and a liquid outlet 2002. Both of them form corresponding first phase change paths 2000 with the evaporation chamber 1001 and the liquid storage chamber 1002. The first phase change paths 2000 are connected in parallel. This increases the phase change contact area with the heat dissipation component 4 by arranging heat dissipation paths in multiple stages, so that heat exchange can be carried out more fully, thereby enhancing the uniformity of heat transfer and improving heat exchange efficiency.

[0092] It should be noted that this embodiment does not limit the number of second heat pipes 22. A larger number of second heat pipes 22 and a larger number of first phase change passages 2000 should also be within the scope of this embodiment. In addition, this embodiment does not limit the arrangement of the second heat pipes 22. The second heat pipes 22 can be arranged in a way that is spaced along the first direction, referring to the first heat pipes 21. This should also be within the scope of this embodiment.

[0093] Preferably, the second heat pipe 22 is connected in parallel with the first heat pipe 21 and is located on the same plane on the heat dissipation surface 1004. When the second heat pipe 22 and the first heat pipe 21 have the same structure, the heat dissipation effect of the heat dissipation assembly 4 on the second heat pipe 22 should be the same as the heat dissipation effect of the heat dissipation assembly 4 on the first heat pipe 21.

[0094] Please continue to refer to this. Figure 5 In some embodiments, the heat absorption surface 1003 and the heat dissipation surface 1004 are opposite surfaces on the evaporation assembly 1 in a first direction, and the air inlet 2001 and the liquid outlet 2002 are located on the side of the evaporation assembly 1 between the heat absorption surface 1003 and the heat dissipation surface 1004.

[0095] In this embodiment, the heat-absorbing surface 1003 can be regarded as the bottom of the evaporation assembly 1 in the vertical direction. Through the full contact between the heat-absorbing surface 1003 and the heat source, the heat from the heat source is conducted upward to the evaporation assembly 1 through the heat-absorbing surface 1003 as much as possible. At the same time, the heat-dissipating surface 1004 can be regarded as the top of the evaporation assembly 1 in the vertical direction. The top heat-dissipating surface 1004 can dissipate heat through the second phase change path 3000. The air inlet 2001 and the liquid outlet 2002 serve to connect the second phase change path 3000 with the evaporation assembly 1. By reasonably setting the air inlet 2001 and the liquid outlet 2002 on the side of the evaporation assembly 1, the functions of the heat-absorbing surface 1003 and the heat-dissipating surface 1004 are not affected, and the second phase change path 3000 is led out from the evaporation assembly 1.

[0096] Please continue to refer to this. Figure 3 In some embodiments, the heat pipe assembly 2 includes a first conductive section 201, a heat exchange section 202, and a second conductive section 203.

[0097] In this embodiment, the free end of the first conductive part 201 is provided with an air inlet 2001, the heat exchange part 202 is connected to the first conductive part 201, and has a straight section 2021 and a bent section 2022. The straight section 2021 is spaced apart along the second direction, and the bent section 2022 makes the straight section 2021 unidirectionally connected. At this time, the heat exchange part 202 is an S-shaped channel. The second conductive part 203 is connected to the heat exchange part 202, and the free end is provided with a liquid outlet 2002. In use, the gaseous phase change working fluid in the evaporation chamber 1001 enters the first conductive section 201 through the air inlet 2001, and the phase change working fluid is transported over a long distance through the first conductive section 201; the gaseous phase change working fluid rises along the first conductive section 201 and enters the heat exchange section 202, the heat exchange section 202 contacts the heat dissipation component 4, the phase change working fluid undergoes a phase change in the heat exchange section 202, the heat generated by the phase change working fluid is absorbed by the heat dissipation component 4, and the phase change working fluid changes from a gaseous state to a liquid state; the liquid phase change working fluid enters the second conductive section 203 from the heat exchange section 202 and descends along the second conductive section 203, and the liquid phase change working fluid flows into the liquid storage chamber 1002.

[0098] It should be noted that this embodiment provides an implementation of a heat pipe assembly 2. The technical solutions of the first conductive part 201, the heat exchange part 202 and the second conductive part 203 described above can be applied to both the first heat pipe component 21 and the second heat pipe component 22, and should also fall within the scope of this embodiment.

[0099] Please refer to Figure 6 , Figure 6 for Figure 1 A cross-sectional view of a phase change radiator with a plane perpendicular to the third direction as the cross-section.

[0100] Combination Figure 5 and Figure 6 In some embodiments, the heat dissipation assembly 4 includes a heat dissipation body 401, heat dissipation fins 402, and mounting groove 403.

[0101] In this embodiment, the heat dissipation body 401 has an internal air-cooling channel 4011 through which air-cooled airflow passes. Heat dissipation fins 402 are disposed inside the heat dissipation body 401, and the plane of the heat dissipation fins 402 is parallel to the direction of the air-cooled airflow in the air-cooling channel 4011. A mounting groove 403 is disposed outside the heat dissipation body 401, and the cross-sectional shape of the mounting groove 403 at least partially matches the cross-sectional shape of the heat pipe assembly 2. In some cases, a fan is used to generate airflow and force convection cooling of the heat dissipation body 401.

[0102] It should be noted that this embodiment provides an implementation of the heat dissipation component 4. The technical solutions of the heat dissipation body 401, heat dissipation fins 402 and mounting groove 403 described above can be applied to both the first heat dissipation component 41 and the second heat dissipation component 42, and should also fall within the scope of this embodiment.

[0103] Please continue to refer to this. Figure 6 In some embodiments, the evaporation assembly 1 includes an evaporator body 101 and a space partition 102.

[0104] Please refer to Figure 9 , Figure 9 This is a schematic diagram of the evaporation assembly provided in an embodiment of this application.

[0105] Combination Figure 4 , Figure 6 and Figure 9 As can be seen, the interior of the evaporator body 101 has a phase change space 1011 for filling the phase change working medium; the space partition 102 is disposed inside the evaporator body 101 and divides the phase change space 1011 into an evaporation chamber 1001 and a liquid storage chamber 1002.

[0106] Please continue to refer to this. Figure 4 The heat exchange assembly 3 includes a cover plate sub-assembly 31, which is sealed to the evaporator body 101 to enclose the phase change space 1011. The cover plate assembly 31 forms a heat dissipation surface 1004 and is provided with heat exchange channels 301.

[0107] Please refer to Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the structure of the channel cover and evaporation assembly provided in the embodiments of this application. Figure 8 This is a schematic diagram of the structure of the flow cover and evaporation assembly provided in the embodiments of this application.

[0108] Combination Figure 4 , Figure 7 and Figure 8 In some embodiments, the cover plate subassembly 31 includes a flow cover plate 311 and a channel cover plate 312. The flow cover plate 311 is sealed to the evaporator body 101 and is provided with an airflow through hole 3111 and a liquid flow through hole 3112. The airflow through hole 3111 communicates with the evaporation chamber 1001, and the liquid flow through hole 3112 communicates with the liquid storage chamber 1002. The channel cover plate 312 is installed on the side of the flow cover plate 311 facing away from the evaporator body 101 and is provided with a heat exchange channel 301. The heat exchange channel 301 is located on the side of the channel cover plate 312 facing the flow cover plate 311 and communicates with the airflow through hole 3111 and the liquid flow through hole 3112.

[0109] Please refer to Figure 11 , Figure 11 This is a schematic diagram of the structure of the overflow cover provided in an embodiment of this application.

[0110] like Figure 11As shown, preferably, the airflow through-hole 3111 is located at the center of the flow cover plate 311, and the liquid flow through-hole 3112 is located at the edge position away from the center of the flow cover plate 311. The position where the heat exchange channel 301 connects with the airflow through-hole 3111 is equivalent to the starting point of the heat exchange channel 301, and the position where the heat exchange channel 301 connects with the liquid flow through-hole 3112 is equivalent to the ending point of the heat exchange channel 301. The channel of the heat exchange channel 301 between the starting point and the ending point should cover the surface of the channel cover plate 312 as much as possible. This arrangement can increase the heat exchange area of ​​the second phase change passage 3000 on the channel cover plate 312.

[0111] Please refer to Figure 10 , Figure 10 This is a schematic diagram of the structure of the channel cover plate provided in the first embodiment of this application.

[0112] like Figure 10 As shown, in some embodiments, the heat exchange channel 301 is a spiral channel, which is a spiral-shaped one-way channel, and the airflow through hole 3111 is connected to the inlet at the center of the spiral channel, and the liquid flow through hole 3112 is connected to the outlet at the outer periphery of the spiral channel.

[0113] Besides the embodiment where the heat exchange channel 301 is a spiral channel as described above, the heat exchange channel 301 can also be a channel of other shapes. Please refer to... Figure 14 and Figure 15 , Figure 14 This is a schematic diagram of the structure of the channel cover plate provided in the second embodiment of this application. Figure 15 This is a structural schematic diagram of the channel cover plate provided in the third embodiment of this application.

[0114] like Figure 14 and Figure 15 As shown, the heat exchange channel 301 includes multiple guiding units 3011. The starting point of the multiple guiding units 3011 is connected to the center of the flow cover plate 311 and to the airflow through hole 3111. The ending point of the guiding unit 3011 is located at the edge position away from the center of the flow cover plate 311. The liquid flow through hole 3112 should be set according to the number and position of the ending point of the guiding unit 3011. The ending point of the guiding unit 3011 is connected to the corresponding liquid flow through hole 3112. At this time, the surface of the channel cover plate 312 is covered by the combination of multiple guiding units 3011.

[0115] For example, the guiding unit 3011 is an S-shaped channel unit. There are various ways to combine S-shaped channel units, including but not limited to... Figure 14 and Figure 15 As shown in the diagram.

[0116] Please continue to refer to this. Figure 9In some embodiments, the liquid storage chamber 1002 surrounds the evaporation chamber 1001; the evaporation assembly 1 is also provided with a capillary pad 103 that communicates with the liquid storage chamber 1002 and the evaporation chamber 1001, and the projection pattern of the evaporation chamber 1001 on the capillary pad 103 is completely covered by the capillary pad 103.

[0117] In this embodiment, the capillary pad 103 drives the phase change working medium in the direction from the liquid storage chamber 1002 to the evaporation chamber 1001, thereby realizing the circulation of the phase change working medium in the phase change path. Since the liquid storage chamber 1002 surrounds the evaporation chamber 1001 and the projection pattern of the evaporation chamber 1001 on the capillary pad 103 is completely covered by the capillary pad 103, the capillary pad 103 drives the phase change working medium without dead angles. The phase change working medium enters from 360° of the evaporation chamber 1001, thereby providing higher heat dissipation efficiency.

[0118] Please continue to refer to this. Figure 4 and Figure 6 In one specific embodiment, the phase change radiator includes an evaporation assembly 1, a heat pipe assembly 2, a heat exchange assembly 3, and a heat dissipation assembly 4. For the evaporation assembly 1, the evaporation assembly 1 includes an evaporator body 101, a space partition 102, a capillary pad 103, a guide pipe 104, a water injection pipe 105, and a support column 106.

[0119] In this embodiment, the evaporator body 101 has a one-way opening, and the space partition 102 is composed of a ring of plates. The space partition 102 and the capillary pad 103 are located inside the evaporator body 101, with the capillary pad 103 located at the bottom of the space partition 102. The evaporator body 101 surrounds the space partition 102 around its perimeter and forms a liquid storage chamber 1002 between the space partition 102 and the space partition 102. The space partition 102 inwardly surrounds to form an evaporation chamber 1001, which is connected to the capillary pad. Layer 103 replenishes the liquid storage chamber 1002 with phase change working fluid. The guide pipe 104 is located in the liquid storage chamber 1002 and is positioned corresponding to the liquid flow through hole 3112, so that the liquid phase change working fluid can flow into the liquid storage chamber 1002. The water injection pipe 105 is located in the evaporator body 101 and communicates with the liquid storage chamber 1002, so that the phase change working fluid can be filled into the liquid storage chamber 1002 from the outside. The support column 106 is located between the evaporator body 101 and the flow cover plate 311, and plays a role in positioning the flow cover plate 311.

[0120] It should be noted that this embodiment does not limit the shape of the evaporator body 101 and the space partition 102, as well as the corresponding evaporation chamber 1001 and liquid storage chamber 1002. For example, square, circular and other shapes should also be included in the scope of this embodiment.

[0121] Optionally, the phase change working fluid in the phase change radiator can be designed as pure water, acetone, refrigerant, or other working liquids as needed. The shell materials of the evaporator assembly 1, heat pipe assembly 2, and heat exchange assembly 3 in the phase change radiator can be pure copper, pure aluminum and its alloys, stainless steel, or composite materials. The channel cover plate 312 is brazed or diffusion-welded onto the flow cover plate 311, forming a sealed structure. The heat dissipation assembly 4 is welded onto the channel cover plate 312.

[0122] This phase change heat sink is primarily used in high-thermal-conductivity conductive components that require high power consumption and compact structures; for example, it can be applied to electronic heat dissipation products such as servers, computers, and optical modules. Through two or more phase change paths, this heat sink enhances heat transfer uniformity, improves heat exchange efficiency, and solves the problem of heat dissipation difficulties for high-heat-flux-density, high-power electronic components.

[0123] One of the pathways, the first built-in disc-shaped LHP0 (Loop Heat Pipe) loop, namely the first phase change path 2000, passes through the evaporation chamber 1001, through the airflow ...

[0124] Another circuit extends from the side of the evaporation assembly 1, passes through the liquid storage chamber 1002 from the evaporation chamber 1001, and connects to the air inlet 2001 of the heat pipe assembly 2. The portion of the heat pipe assembly 2 between the air inlet 2001 and the liquid outlet 2002 passes through the heat dissipation assembly 4, and then connects to the liquid storage chamber 1002 from the other side of the evaporation assembly 1 through the liquid outlet 2002 of the heat pipe assembly 2, forming the second LHP1 loop, i.e., the second phase change path 3000. The heat pipe assembly 2 and the heat dissipation assembly 4 are in contact, performing phase change heat exchange.

[0125] After experimental verification, the inventors found that the phase change heat sink can exhibit good anti-gravity characteristics under anti-gravity application; the phase change heat sink can withstand normal operation with only a power attenuation of about 10-20% under anti-gravity application, which is a significant improvement compared to the traditional three-dimensional heat exchange plate with a power attenuation of about 50%.

[0126] It should be noted that many of the components mentioned in this application are general standard parts or components known to those skilled in the art, and their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0127] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0128] The phase change heat sink provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A phase change radiator, comprising an evaporation assembly, wherein the evaporation assembly has an evaporation chamber and a liquid storage chamber disposed inside, and an absorption surface and a heat dissipation surface disposed outside the evaporation assembly; characterized in that, The phase change heat sink also includes: A heat pipe assembly has an air inlet communicating with the evaporation chamber and a liquid outlet communicating with the liquid storage chamber. The heat pipe assembly, the evaporation chamber, and the liquid storage chamber form a first phase change path, and the first phase change path is filled with a phase change working fluid. A heat exchange component is disposed on the heat dissipation surface and is provided with heat exchange channels. The heat exchange channels are connected to the evaporation chamber and the liquid storage chamber to form a second phase change path. The second phase change path is filled with a phase change working fluid. A heat dissipation component is used to absorb the heat generated by the phase change working fluid in the first phase change path and the second phase change path during the gas-liquid phase change process. The evaporation assembly includes an evaporator body, the interior of which has a phase change space for filling the phase change working fluid; The heat exchange assembly includes: The cover plate assembly is sealed to the evaporator body to enclose the phase change space, the cover plate assembly forms the heat dissipation surface, and the cover plate assembly is provided with the heat exchange channel; The cover plate assembly includes: The overflow cover is sealed to the evaporator body and is provided with an airflow through hole and a liquid flow through hole. The airflow through hole is connected to the evaporation chamber and the liquid flow through hole is connected to the liquid storage chamber. A channel cover plate is installed on the side of the overflow cover plate away from the evaporator body, and is provided with the heat exchange channel, which is connected to the airflow through hole and the liquid flow through hole; The evaporation assembly is also provided with a capillary pad layer that communicates with the liquid storage chamber and the evaporation chamber.

2. The phase change heat sink according to claim 1, characterized in that, The heat dissipation component includes: The first heat sink has a heat sink cavity and a first heat-conducting surface and a second heat-conducting surface communicating with the heat sink cavity. The first heat-conducting surface is in contact with the heat pipe assembly, and the second heat-conducting surface is in contact with the heat exchange assembly. The first heat-conducting surface and the second heat-conducting surface are opposite surfaces on the heat dissipation cavity.

3. The phase change heat sink according to claim 2, characterized in that, The heat pipe assembly includes: At least one first heat pipe component, with an air inlet at the first end and a liquid outlet at the second end; when there are multiple first heat pipe components, the multiple first heat pipe components are spaced apart along a first direction; The heat dissipation component also includes: At least one second heat sink is in contact with the first heat pipe; when there are multiple first heat pipes, there are multiple second heat sinks and the number of second heat sinks is the same as the number of first heat pipes, and each first heat pipe is located between the first heat sink and the second heat sink in the first direction, or between adjacent second heat sinks.

4. The phase change heat sink according to claim 3, characterized in that, The heat pipe assembly also includes: The second heat pipe is connected in parallel with the first heat pipe between the evaporation chamber and the liquid storage chamber.

5. The phase change heat sink according to claim 1, characterized in that, The heat-absorbing surface and the heat-dissipating surface are opposite surfaces on the evaporation assembly in a first direction, and the air inlet and the liquid outlet are located on the side of the evaporation assembly between the heat-absorbing surface and the heat-dissipating surface.

6. The phase change heat sink according to claim 1, characterized in that, The heat pipe assembly includes: The first conductive section has an air inlet at its free end; The heat exchange section is connected to the first conductive section and has a straight section and a bent section. The straight section is spaced apart along the second direction, and the bent section makes the straight section unidirectionally connected. The second conductive section is connected to the heat exchange section, and the liquid outlet is provided at its free end.

7. The phase change heat sink according to any one of claims 1 to 6, characterized in that, The evaporation assembly includes: A space partition is disposed inside the evaporator body, and divides the phase change space into the evaporation chamber and the liquid storage chamber.

8. The phase change heat sink according to claim 7, characterized in that, The heat exchange channel is a spiral channel; the airflow through hole is connected to the inlet at the center of the spiral channel, and the liquid flow through hole is connected to the outlet at the outer periphery of the spiral channel.

9. The phase change heat sink according to any one of claims 1 to 6, characterized in that, The liquid storage chamber surrounds the evaporation chamber; the projection pattern of the evaporation chamber on the capillary pad is completely covered by the capillary pad.

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