A polishing apparatus for a quartz shaft for a semiconductor

Abstract

The application provides a quartz shaft polishing device for semiconductor. The quartz shaft polishing device for semiconductor comprises a mounting mechanism, a pressing mechanism arranged on the mounting mechanism and in contact with a quartz shaft, a fixing mechanism arranged on both ends of the quartz shaft, a rotating mechanism arranged on the fixing mechanism and connected with the mounting mechanism, a liquid supplementing mechanism arranged on the mounting mechanism and in contact with the quartz shaft, and a dust removing mechanism arranged on the mounting mechanism. The quartz shaft polishing device for semiconductor has the advantages of being suitable for various specifications and processes, high polishing process stability, timely dust and mixed liquid cleaning, and simple operation.

Description

Technical Field

[0001] This invention relates to the field of quartz shaft manufacturing technology, and in particular to a quartz shaft polishing device for semiconductors. Background Technology

[0002] Quartz shafts for semiconductors refer to shafts made of quartz material used in semiconductor processing. Quartz is a high-purity crystalline form of silicon, possessing excellent thermal stability, chemical stability, and mechanical strength, and is therefore widely used in the semiconductor industry.

[0003] However, the quartz shafts used in the semiconductor industry come in various specifications, and the polishing processes required for different types of quartz shafts are also different. If different equipment is used for polishing according to different polishing needs, it will result in higher equipment manufacturing and usage costs. In addition, the dust generated during quartz shaft polishing, or the liquid generated by the mixture of dust and polishing fluid, may solidify around the quartz shaft if not cleaned up in time, which can easily affect the quality of quartz shaft polishing.

[0004] Therefore, it is necessary to provide a new quartz shaft polishing device for semiconductors to solve the above-mentioned technical problems. Summary of the Invention

[0005] The technical problem solved by this invention is to provide a semiconductor quartz shaft polishing device that is applicable to various specifications and processes, has high stability in the polishing process, can clean dust and mixtures in a timely manner, and is easy to operate.

[0006] To achieve the above objectives, the technical solution of the present invention is specifically implemented as follows:

[0007] The present invention provides a quartz shaft polishing apparatus for semiconductors, comprising: a mounting mechanism, a quartz shaft disposed on the mounting mechanism, a clamping mechanism disposed on the mounting mechanism and in contact with the quartz shaft, a fixing mechanism disposed at both ends of the quartz shaft, a rotating mechanism disposed on the fixing mechanism and connected to the mounting mechanism, a liquid replenishing mechanism disposed on the mounting mechanism and in contact with the quartz shaft, and a dust removal mechanism disposed on the mounting mechanism.

[0008] As a further embodiment of the present invention, the mounting mechanism includes a side plate disposed on one side of the quartz shaft, a housing fixedly mounted on the side plate, and the quartz shaft located inside the housing. A top plate is disposed above the housing and is fixedly connected to the side plate. A partition is fixedly mounted inside the housing, and two vertical plates are fixedly mounted at the bottom of the partition, with the bottom of the vertical plates fixedly connected to the bottom inner wall of the housing.

[0009] As a further embodiment of the present invention, the clamping mechanism includes a cylinder fixedly installed at the bottom of the top plate, a fixing plate fixedly installed on the output end of the cylinder, a polishing plate provided at the bottom of the fixing plate, two screws threadedly installed on the fixing plate, and the bottom ends of the screws fixedly connected to the top of the polishing plate, a positioning groove provided at the top of the partition plate, a protective pad provided inside the positioning groove, and the top of the protective pad contacting the quartz shaft.

[0010] As a further embodiment of the present invention, the fixing mechanism includes vacuum suction cups respectively disposed on both sides of the quartz shaft, and a housing is disposed on the side of the two vacuum suction cups that are far apart from each other, and the housing is connected to the shell. A vacuum pump is disposed inside the housing, and the vacuum pump passes through the housing and is connected to the vacuum suction cups. Multiple exhaust holes are opened on the side of the housing that is far away from the quartz shaft.

[0011] As a further embodiment of the present invention, the rotating mechanism includes support frames that are fixedly installed on both sides of the housing. A motor is provided on the top of the support frame, and a gear is fixedly installed on the output end of the motor. A plurality of protruding teeth are provided on one end of the housing that extends outside the housing, and the protruding teeth mesh with the gear. A connecting cylinder is sleeved on the housing, and a bearing is sleeved on the connecting cylinder, and the bearing is connected to the housing.

[0012] As a further embodiment of the present invention, the liquid replenishment mechanism includes a liquid storage tank and a pump body disposed between the two vertical plates. The pump body is provided with a liquid extraction pipe, and the two vertical plates are provided with liquid delivery pipes. The two ends of the liquid delivery pipes extend to the sides of the two vertical plates that are far apart from each other, and the two ends of the liquid extraction pipes are respectively connected to the liquid storage tank and the liquid delivery pipes. The liquid delivery pipes are provided with multiple branch pipes, and the branch pipes pass through the partition and the protective pad and contact the quartz shaft.

[0013] As a further embodiment of the present invention, the dust removal mechanism includes two holes formed on the partition plate, and the two holes are respectively located on both sides of the positioning groove. Two vacuum pumps are provided inside the housing, and the air inlet of the vacuum pumps is connected to the bottom of the holes. Ventilation ports are respectively provided on both sides of the housing, and the ventilation ports are located above the bearing.

[0014] As a further embodiment of the present invention, bolts are threadedly installed on both sides of the connecting cylinder and the motor, and multiple threaded holes are respectively opened on both sides of the housing and the top of the support frame to match the bolts.

[0015] As a further embodiment of the present invention, the top of the fixing plate is provided with two nuts, and the nuts are threaded onto the screw.

[0016] As a further embodiment of the present invention, side doors are provided on the two vertical plates, a double door is provided on the housing, and the side doors are located between the double doors and the two vertical plates. A viewing window is provided on the housing, and the viewing window is located above the double doors. Multiple support feet are provided at the bottom of the housing.

[0017] This invention provides a quartz shaft polishing device for semiconductors. Its advantages include: by connecting the fixing mechanism and the rotating mechanism, the quartz shaft can be fixed while simultaneously polishing, improving the device's practicality; by using the housing and the side plate as one side, the stability of the device connection is increased, and the manufacturing cost is reduced; the partition isolates the polishing area from the dust collection area, facilitating dust collection and cleaning; the vacuum suction cup and vacuum pump fix the quartz shaft, and multiple exhaust holes expel air, increasing the quartz shaft's fixation strength and facilitating quick disassembly and fixing; the protective pad in the positioning groove prevents direct contact between the quartz shaft and the inner wall of the positioning groove, thus avoiding impact on polishing accuracy; the connecting cylinder connects the housing to the box, and can be adjusted according to different quartz shaft sizes. The bearing configuration enhances the smoothness and stability of the polishing process. The addition of a liquid replenishment mechanism and multiple branch pipes allows for the application of polishing liquid to various locations on the quartz shaft, ensuring even coverage and improving polishing effectiveness and precision. A vacuum pump within the dust removal mechanism discharges polishing dust or liquid below the partition, where it is collected in a collection bag. The bolts and additional threaded holes accommodate different quartz shaft sizes, enhancing the device's adaptability. Nuts secure the screw to the fixing plate, facilitating the installation and removal of the polishing plate and allowing for replacement with the appropriate plate to meet the specific processing requirements of the quartz shaft. A viewing window allows for real-time monitoring of the polishing process, and the double and side doors facilitate replenishment of polishing liquid to the reservoir and dust collection. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a preferred embodiment of the semiconductor quartz shaft polishing apparatus provided by the present invention;

[0020] Figure 2 for Figure 1 The diagram shows the front view of the structure.

[0021] Figure 3 This is a schematic diagram of a partial cross-sectional view of the present invention.

[0022] Figure 4 for Figure 1 The enlarged schematic diagram of part A is shown.

[0023] Numbered in the diagram: 1. Installation mechanism; 2. Quartz shaft; 3. Clamping mechanism; 4. Fixing mechanism; 5. Rotating mechanism; 6. Liquid replenishment mechanism; 7. Dust removal mechanism; 11. Side plate; 12. Housing; 13. Top plate; 14. Partition plate; 15. Vertical plate; 31. Cylinder; 32. Fixing plate; 33. Polishing plate; 34. Screw; 35. Positioning groove; 36. Protective pad; 41. Vacuum suction cup; 42. Housing; 43. Vacuum pump one; 44. Exhaust port; 51. Support frame; 52. Motor; 53. Gear; 54. Convex tooth; 55. Connecting cylinder; 56. Bearing; 57. Bolt; 61. Liquid storage tank; 62. Pump body; 63. Liquid extraction pipe; 64. Liquid delivery pipe; 65. Branch pipe; 71. Leakage hole; 72. Vacuum pump two; 73. Ventilation port. Detailed Implementation

[0024] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0025] See Figures 1-4 The present invention provides a semiconductor quartz shaft polishing device comprising: a mounting mechanism 1, a quartz shaft 2 mounted on the mounting mechanism 1, a clamping mechanism 3 mounted on the mounting mechanism 1 and in contact with the quartz shaft 2, a fixing mechanism 4 mounted at both ends of the quartz shaft 2, a rotating mechanism 5 mounted on the fixing mechanism 4 and connected to the mounting mechanism 1, a liquid replenishing mechanism 6 mounted on the mounting mechanism 1 and in contact with the quartz shaft 2, and a dust removal mechanism 7 mounted on the mounting mechanism 1. By connecting the fixing mechanism 4 and the rotating mechanism 5, the quartz shaft 2 can be fixed while polishing is not affected, which improves the practicality of the device.

[0026] The mounting mechanism 1 includes a side plate 11 disposed on one side of the quartz shaft 2. A housing 12 is fixedly mounted on the side plate 11, and the quartz shaft 2 is located inside the housing 12. A top plate 13 is disposed above the housing 12 and is fixedly connected to the side plate 11. A partition 14 is fixedly mounted inside the housing 12. Two vertical plates 15 are fixedly mounted at the bottom of the partition 14, and the bottom of the vertical plates 15 is fixedly connected to the bottom inner wall of the housing 12. By setting the housing 12 and using the side plate 11 as one side, the stability of the device connection can be increased and the manufacturing cost of the device can be reduced. At the same time, by setting the partition 14, the polishing area can be isolated from the dust collection area, which facilitates the collection and cleaning of dust generated during polishing.

[0027] The clamping mechanism 3 includes a cylinder 31 fixedly installed at the bottom of the top plate 13. A fixing plate 32 is fixedly installed on the output end of the cylinder 31. A polishing plate 33 is provided at the bottom of the fixing plate 32. Two screws 34 are threadedly installed on the fixing plate 32, and the bottom ends of the screws 34 are fixedly connected to the top of the polishing plate 33. A positioning groove 35 is provided at the top of the partition plate 14, and a protective pad 36 is provided inside the positioning groove 35. The top of the protective pad 36 is in contact with the quartz shaft 2. By providing a protective pad 36 inside the positioning groove 35, the quartz shaft 2 can be prevented from directly contacting the inner wall of the positioning groove 35, thereby affecting the polishing accuracy.

[0028] The fixing mechanism 4 includes vacuum suction cups 41 respectively disposed on both sides of the quartz shaft 2. A housing 42 is disposed on the side of the two vacuum suction cups 41 that is far away from each other, and the housing 42 is connected to the shell 12. A vacuum pump 43 is disposed inside the housing 42, and the vacuum pump 43 passes through the housing 42 and is connected to the vacuum suction cups 41. Multiple exhaust holes 44 are opened on the side of the housing 42 that is far away from the quartz shaft 2. By fixing the quartz shaft 2 with the vacuum suction cups 41 and the vacuum pump 43 and venting air through the multiple exhaust holes 44, the firmness of the fixing of the quartz shaft 2 can be increased, and it is also convenient for quick disassembly and fixing.

[0029] The rotating mechanism 5 includes support frames 51 fixedly installed on both sides of the housing 12. A motor 52 is installed on the top of the support frame 51. A gear 53 is fixedly installed on the output end of the motor 52. A plurality of protruding teeth 54 are provided on the end of the housing 42 extending outside the housing 12, and the protruding teeth 54 mesh with the gear 53. A connecting cylinder 55 is sleeved on the housing 42, and a bearing 56 is sleeved on the connecting cylinder 55. The bearing 56 is connected to the housing 12. By setting the connecting cylinder 55, the housing 42 can be connected to the housing 12, and it can be adjusted according to the different sizes of the quartz shaft 2. The setting of the bearing 56 can improve the smoothness and stability of the device during rotation polishing.

[0030] The replenishment mechanism 6 includes a storage tank 61 and a pump body 62 disposed between two vertical plates 15. The pump body 62 is provided with a suction pipe 63, and the two vertical plates 15 are provided with infusion pipes 64. The two ends of the infusion pipes 64 extend to the opposite sides of the two vertical plates 15, and the two ends of the suction pipe 63 are connected to the storage tank 61 and the infusion pipes 64, respectively. The infusion pipes 64 are provided with multiple branch pipes 65, and the branch pipes 65 pass through the partition 14 and the protective pad 36 to contact the quartz shaft 2. By setting up the replenishment mechanism 6 and providing multiple branch pipes 65, the polishing liquid can be added to multiple positions of the quartz shaft 2, which can evenly coat the surface of the quartz shaft 2, which is beneficial to improving the polishing effect and precision.

[0031] The dust removal mechanism 7 includes two holes 71 opened on the partition plate 14, and the two holes 71 are respectively located on both sides of the positioning groove 35. Two vacuum pumps 72 are installed inside the housing 12, and the air inlet of the vacuum pumps 72 is connected to the bottom of the holes 71. Ventilation ports 73 are opened on both sides of the housing 12, and the ventilation ports 73 are located above the bearing 56. By installing vacuum pumps 72 inside the dust removal mechanism 7, the dust or liquid generated during polishing can be discharged to the bottom of the partition plate 14 and collected and processed by the collection bag.

[0032] Bolts 57 are threadedly installed on both sides of the connecting cylinder 55 and the motor 52, and multiple threaded holes are opened on both sides of the housing 42 and the top of the support frame 51 to match the bolts 57. By setting the bolts 57 and opening multiple matching threaded holes, it is possible to fix quartz shafts 2 of different specifications, which is beneficial to improving the adaptability of the device.

[0033] The top of the fixing plate 32 is provided with two nuts, and the nuts are threaded onto the screw 34. By setting the nuts, the screw 34 is fixed to the fixing plate 32, which facilitates the disassembly and assembly of the polishing plate 33 and also makes it convenient to replace the appropriate polishing plate 33 according to the processing requirements of different quartz shafts 2.

[0034] The two vertical plates 15 are equipped with side doors, and the housing 12 is equipped with double doors, with the side doors located between the double doors and the two vertical plates 15. The housing 12 is equipped with a viewing window, which is located above the double doors. The bottom of the housing 12 is equipped with multiple support feet. The viewing window allows for timely monitoring of the polishing status of the quartz shaft 2 during the polishing process. The double doors and side doors facilitate the replenishment of polishing fluid to the storage tank 61 and the collection of dust.

[0035] The working principle of the quartz shaft polishing device for semiconductors provided by this invention is as follows:

[0036] First, place the quartz shaft 2 in the positioning groove 35, slide the housing 42 in the connecting cylinder 55, and drive the vacuum suction cup 41 to contact one end of the quartz shaft 2. At this time, start the vacuum pump 43 and exhaust the air through multiple exhaust holes 44, thereby fixing the quartz shaft 2 in the positioning groove 35 from both ends. Then, use bolts 57 to fix the housing 42 and the connecting cylinder 55, and the motor 52 and the support frame 51, and ensure that the gear 53 meshes with multiple convex teeth 54. Then, start the cylinder 31 to push the fixing plate 32, and bring the bottom of the polishing plate 33 into contact with the top of the quartz shaft 2.

[0037] Then, start the two motors 52, which drive multiple teeth 54 through the gears 53, thereby driving the housing 42 to rotate. The quartz shaft 2 rotates accordingly and rubs against the polishing plate 33 to polish the quartz shaft 2. During the polishing process, the polishing status can be checked at any time through the viewing window. In addition, if polishing fluid needs to be added when polishing the quartz shaft 2, the pump body 62 can be started to transport the polishing fluid in the storage tank 61 to the delivery pipe 64 through the liquid extraction pipe 63. Then, it is evenly added to the bottom of the quartz shaft 2 through multiple branch pipes 65 and flows on its surface during the rotation of the quartz shaft 2, so that it can be more comprehensively covered on the polishing surface of the quartz shaft 2 to improve the polishing effect.

[0038] Next, start the two vacuum pumps 72, open the double door, fix the collection bag to the outlet of the vacuum pump 72, and draw the air above the partition 14 to the bottom of the partition 14 through the leakage hole 71, and discharge it outside the housing 12 through the double door. At the same time, the vent 73 replenishes the air inside the housing 12 to form an air circulation. The dust generated at both ends of the positioning groove 35 due to polishing, or the liquid generated by the mixture of dust and polishing liquid, is discharged into the collection bag by the vacuum pump 72 for further processing. After polishing is completed, the polishing plate 33 is lifted to the top of the housing 12 by the cylinder 31, and then the quartz shaft 2 is removed.

[0039] Compared with related technologies, the quartz shaft polishing apparatus for semiconductors provided by the present invention has the following advantages:

[0040] This invention provides a quartz shaft polishing device for semiconductors. By connecting the fixing mechanism 4 and the rotating mechanism 5, the quartz shaft 2 can be fixed while polishing is performed, improving the practicality of the device. The housing 12 with the side plate 11 as one side increases the stability of the device connection and reduces manufacturing costs. The partition 14 isolates the polishing area from the dust collection area, facilitating dust collection and cleaning. The vacuum suction cup 41 and vacuum pump 43 fix the quartz shaft 2, and multiple exhaust holes 44 expel air, increasing the stability of the fixation and facilitating quick disassembly and reassembly. The protective pad 36 inside the positioning groove 35 prevents direct contact between the quartz shaft 2 and the inner wall of the positioning groove 35, thus avoiding impact on polishing accuracy. The connecting cylinder 55 connects the housing 42 to the housing 12 and can be adjusted according to different sizes of the quartz shaft 2. The bearing 56 enhances the smoothness and stability of the device during polishing. By setting up a liquid replenishment mechanism 6 and multiple branch pipes 65, the polishing liquid is added to multiple positions of the quartz shaft 2, which can evenly coat the surface of the quartz shaft 2, thus improving the polishing effect and precision. By setting up a vacuum pump 72 in the dust removal mechanism 7, the dust or liquid generated during polishing can be discharged to the bottom of the partition 14 and collected by a collection bag. By setting up bolts 57 and additionally opening multiple matching threaded holes, it is possible to fix quartz shafts 2 of different specifications, which can improve the adaptability of the device. By setting up nuts to fix the screw 34 to the fixing plate 32, it is easy to disassemble and install the polishing plate 33, and it is also convenient to replace the appropriate polishing plate 33 according to the processing requirements of different quartz shafts 2. The viewing window allows the polishing status of the quartz shaft 2 to be viewed in time during the polishing process. The double door and side door facilitate the replenishment of polishing liquid to the liquid storage tank 61 and the collection of dust.

[0041] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A quartz shaft polishing apparatus for semiconductors, characterized in that, Include: The installation mechanism (1) is provided with quartz shaft (2), the installation mechanism (1) is provided with pressure mechanism (3), and the pressure mechanism (3) is in contact with the quartz shaft (2), both ends of the quartz shaft (2) are provided with fixed mechanism (4), the fixed mechanism (4) is provided with rotating mechanism (5), and the rotating mechanism (5) is connected with the installation mechanism (1), the installation mechanism (1) is provided with liquid supplementing mechanism (6), and the liquid supplementing mechanism (6) is in contact with the quartz shaft (2), the installation mechanism (1) is provided with dust removal mechanism (7); The installation mechanism (1) includes a side plate (11) arranged on one side of the quartz shaft (2), the side plate (11) is fixedly installed with a shell (12), and the quartz shaft (2) is located in the shell (12), a top plate (13) is arranged above the shell (12), and the top plate (13) is fixedly connected with the side plate (11), a partition plate (14) is fixedly installed in the shell (12), two vertical plates (15) are fixedly installed at the bottom of the partition plate (14), and the bottom of the vertical plate (15) is fixedly connected with the inner wall of the bottom of the shell (12); The pressure mechanism (3) includes a gas cylinder (31) fixedly installed at the bottom of the top plate (13), a fixed plate (32) is fixedly installed on the output end of the gas cylinder (31), a polishing plate (33) is arranged at the bottom of the fixed plate (32), a positioning groove (35) is arranged at the top of the partition plate (14), a protective pad (36) is arranged in the positioning groove (35), and the top of the protective pad (36) is in contact with the quartz shaft (2); The liquid supplementing mechanism (6) includes a liquid storage tank (61) and a pump body (62) arranged between the two vertical plates (15), the pump body (62) is provided with a liquid suction pipe (63), the two vertical plates (15) are provided with a liquid delivery pipe (64), the two ends of the liquid delivery pipe (64) extend to the sides away from each other of the two vertical plates (15), respectively, and the two ends of the liquid suction pipe (63) are in communication with the liquid storage tank (61) and the liquid delivery pipe (64), respectively, a plurality of branch pipes (65) are arranged on the liquid delivery pipe (64), and the branch pipes (65) pass through the partition plate (14) and the protective pad (36) and are in contact with the quartz shaft (2).

2. The quartz spindle polishing apparatus for semiconductor according to claim 1, characterized by Two screw rods (34) are threadedly installed on the fixed plate (32), and the bottom ends of the screw rods (34) are fixedly connected with the top of the polishing plate (33).

3. The apparatus for polishing a quartz shaft for a semiconductor according to claim 2, wherein The fixing mechanism (4) comprises vacuum suction cups (41) arranged on both sides of the quartz shaft (2) respectively, box bodies (42) arranged on the sides away from each other of the two vacuum suction cups (41) respectively, the box bodies (42) are connected with the shell (12), vacuum pumps I (43) are arranged in the box bodies (42), the vacuum pumps I (43) are communicated with the vacuum suction cups (41) through the box bodies (42), and a plurality of exhaust holes (44) are arranged on the sides of the box bodies (42) away from the quartz shaft (2).

4. The apparatus for polishing a quartz shaft for a semiconductor according to claim 3, wherein The rotating mechanism (5) comprises support frames (51) fixedly installed on both sides of the shell (12) respectively, motors (52) arranged on the top of the support frames (51), gears (53) fixedly installed on the output ends of the motors (52), a plurality of convex teeth (54) arranged on the end of the box body (42) extending out of the shell (12), the convex teeth (54) are engaged with the gears (53), a connecting barrel (55) is arranged on the box body (42), a bearing (56) is arranged on the connecting barrel (55), and the bearing (56) is connected with the shell (12).

5. The apparatus for polishing a quartz shaft for a semiconductor according to claim 4, wherein The dust removal mechanism (7) comprises two leakage holes (71) arranged on the partition plate (14), the two leakage holes (71) are located on the two sides of the positioning groove (35) respectively, two vacuum pumps II (72) are arranged in the shell (12), the air inlet ends of the vacuum pumps II (72) are communicated with the bottoms of the leakage holes (71), air vents (73) are arranged on the two sides of the shell (12) respectively, and the air vents (73) are located above the bearing (56).

6. The apparatus for polishing a quartz shaft for a semiconductor as set forth in claim 4, wherein Bolts (57) are threadedly installed on the two sides of the connecting barrel (55) and the motor (52) respectively, and a plurality of threaded holes are arranged on the two sides of the box body (42) and the top of the support frame (51) respectively and matched with the bolts (57).

7. The apparatus for polishing a quartz shaft for a semiconductor as set forth in claim 2, wherein Two nuts are arranged on the top of the fixing plate (32) and are threadedly sleeved on the screw rod (34).

8. The apparatus for polishing a quartz shaft for a semiconductor according to claim 1, wherein Side-hinged doors are arranged on the two vertical plates (15), double-hinged doors are arranged on the shell (12), the side-hinged doors are located between the double-hinged doors and the two vertical plates (15), a view window is arranged on the shell (12) and located above the double-hinged doors, and a plurality of supporting legs are arranged on the bottom of the shell (12).

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