Optical glass component processing system and processing method

Abstract

This application provides an optical glass element processing system and method. The processing system includes: an adsorption device for adsorbing and supporting a plate to be processed; a first cutting tool for processing the processing surface of the plate to form at least one element, the first cutting tool including a first cutting body and a first processing shaft, the first cutting body being mounted on the first processing shaft, the first processing shaft being used to drive the first cutting body to rotate coaxially, the bottom surface of the first cutting body being provided with a main processing edge and a secondary processing edge symmetrically arranged along the first processing shaft; a second cutting tool for cutting at least one element off the plate; the second cutting tool including a second cutting body and a second processing shaft, the second cutting body being mounted on the second processing shaft, the second processing shaft being used to drive the second cutting body to rotate coaxially, the bottom surface of the second cutting body being provided with a plurality of cutting edges symmetrically arranged along the second processing shaft; and a driving mechanism for driving the first cutting tool or the second cutting tool perpendicular to the processing surface of the plate.

Description

Technical Field

[0001] This application relates to the field of machining technology, and in particular to an optical glass element processing system and processing method. Background Technology

[0002] In industrial production, it is necessary to process tiny, round glass components. The existing method for processing these glass components is as follows: First, a whole piece of raw glass is cut into cubes of the same size. Then, the cut glass cubes are glued to a specific fixture using adhesive. Next, the glass cubes glued to the fixture are shaped using a cutting tool. The shaped and chamfered glass components are then placed in a double-sided grinding and polishing machine for polishing. After polishing, they are cleaned, thus completing the processing of the glass component.

[0003] The aforementioned processing methods use adhesives, making the glass components highly susceptible to scratches during the application and removal of adhesive. Therefore, polishing is necessary. However, the small, thin, and round transparent glass components are prone to rotation and breakage during polishing. For example, breakage during polishing can render multiple glass components on a specific fixture unusable due to scratches. After polishing, the adhesive residue on the glass components causes approximately 80% of the glass components to be lifted when the polishing machine's grinding disc is raised, making unloading extremely difficult and posing a significant risk of further scratches. Therefore, existing glass component processing methods suffer from low efficiency, inconsistent quality, and high labor costs. Summary of the Invention

[0004] In view of the above, it is necessary to provide an optical glass component processing system and processing method to solve the technical problems of low processing efficiency, unstable processing quality and high labor costs of existing processing technologies.

[0005] In a first aspect, embodiments of this application provide an optical glass element processing system, comprising: an adsorption device for adsorbing and carrying a plate to be processed; a first cutting tool for processing the processing surface of the plate to form at least one element, the first cutting tool comprising a first cutting body and a first processing shaft, the first cutting body being mounted on the first processing shaft, the first processing shaft being used to drive the first cutting body to rotate coaxially, the bottom surface of the first cutting body being provided with a main processing cutting edge and a secondary processing cutting edge symmetrically arranged along the first processing shaft, the main processing cutting edge and the secondary processing cutting edge protruding relative to the bottom surface of the first cutting tool, the cutting thickness of the main processing cutting edge being greater than the cutting thickness of the secondary processing cutting edge; a second cutting tool for cutting at least one element from the plate; the second cutting tool comprising a second cutting body and a second processing shaft, the second cutting body being mounted on the second processing shaft, the second processing shaft being used to drive the second cutting body to rotate coaxially, the bottom surface of the second cutting body being provided with a plurality of cutting cutting edges symmetrically arranged along the second processing shaft, the plurality of cutting cutting edges protruding relative to the bottom surface of the second cutting tool; and a driving mechanism, the first processing shaft and the second processing shaft being mounted on the driving mechanism, the driving mechanism being used to drive the first cutting tool or the second cutting tool perpendicular to the processing surface of the plate.

[0006] In the above embodiment, firstly, the adsorption device adsorbs the sheet material to be processed; then, the driving mechanism drives the first cutter perpendicular to the processing surface of the sheet material; next, the first processing shaft drives the first cutter body to rotate coaxially, so that during the rotation, the main processing blade and the secondary processing blade process and chamfer the sheet material to form components. Since the cutting thickness of the main processing blade is greater than that of the secondary processing blade, the main processing blade first cuts the sheet material, then cuts out the approximate shape of the component on the sheet material. The secondary processing blade processes the corners of the component cut by the main processing blade, thus completing the formation of the component. Next, the driving mechanism drives the second cutter perpendicular to the processing surface of the sheet material; then, the second processing shaft drives the second cutter body to rotate coaxially, so that during the rotation, the cutting blade cuts the component off the sheet material, thus processing the entire sheet material into multiple components. The aforementioned optical glass component processing system treats the sheet material to be processed as a whole for processing and subsequent edge and corner treatment operations, which greatly improves the efficiency of technicians. It can avoid cracking, scratches, etc. that occur when processing ultra-thin sheets cut into component sizes separately, thus ensuring the stability of processing quality. In addition, the entire processing process is highly automated, which effectively improves processing efficiency and saves labor costs.

[0007] In some embodiments, the main machining edge includes a main outer cutting edge, a main inner cutting edge, and a first cutting tip. The first cutting tip connects the main outer cutting edge and the main inner cutting edge. The main outer cutting edge and the main inner cutting edge are respectively connected to the bottom surface of the first tool body. The cutting edge angle of the main outer cutting edge is between 25° and 31°, and the cutting edge angle of the main inner cutting edge is between 3° and 7°. The secondary machining edge includes a secondary outer cutting edge, a secondary inner cutting edge, and a second cutting tip. The second cutting tip connects the secondary outer cutting edge and the secondary inner cutting edge. The secondary outer cutting edge and the secondary inner cutting edge are respectively connected to the bottom surface of the first tool body. The cutting edge angle of the secondary inner cutting edge is the same as the chamfer angle of the component.

[0008] In some embodiments, the cutting edge includes an outer cutting edge, an inner cutting edge, and a bottom cutting edge. The bottom cutting edge connects the outer cutting edge and the inner cutting edge. The outer cutting edge and the inner cutting edge are respectively connected to the bottom surface of the second tool body. The cutting edge angle of the outer cutting edge is smaller than that of the main outer cutting edge, and the cutting edge angle of the inner cutting edge is between 0.5° and 2°.

[0009] In some embodiments, the first blade tip is arc-shaped, and the radius of the first blade tip is in the range of 30% to 50% of the thickness of the plate.

[0010] In some embodiments, the cutting thickness of the main machining edge is between 120% and 140% of the thickness of the sheet metal; the cutting thickness of the secondary machining edge is between 93% and 97% of the cutting thickness of the main machining edge.

[0011] In some embodiments, the cutting thickness of the cutting edge is between 110% and 125% of the thickness of the sheet metal.

[0012] In some embodiments, the main machining edge and the secondary machining edge are inclined toward the central axis of the first tool body.

[0013] In some embodiments, the adsorption device includes: a base, the base having a vacuum channel connected to a vacuum pump; an adsorption fixture detachably disposed on the base, the adsorption fixture having a plurality of suction holes; and a fixture sealing ring fitted onto the contact portion between the adsorption fixture and the base, so that the vacuum channel communicates with the plurality of suction holes.

[0014] In some embodiments, the adsorption fixture is provided with a support groove for placing the plate, and a sealing ring for the plate is provided around the support groove.

[0015] This application also provides a method for processing optical glass components, applied to the optical glass component processing system described in the above embodiments, the method comprising:

[0016] The adsorption device is controlled to adsorb the plate to be processed, the plate having a front processing surface and a back processing surface that are opposite to each other;

[0017] The control drive mechanism drives the first cutter body of the first tool to be perpendicular to the front machining surface of the plate;

[0018] The first machining axis is controlled to drive the first cutter body to rotate. The main machining edge and the secondary machining edge of the rotating first cutter body act sequentially on the front and back machining surfaces of the plate, thereby forming at least one component.

[0019] The drive mechanism is controlled to drive the second cutter body of the second cutter to be perpendicular to at least one of the elements on the plate;

[0020] The second machining axis is controlled to drive the second cutter body to rotate. The multiple cutting edges of the rotating second cutter body act on the plate, thereby cutting off the components controlled by the first machining axis from the plate in sequence.

[0021] In the above embodiment, the driving mechanism then drives the first cutter perpendicular to the processing surface of the plate; then, the first processing shaft drives the first cutter body to rotate coaxially, so that during the rotation, the main processing blade and the secondary processing blade process and chamfer the plate, thereby forming a component. Since the cutting thickness of the main processing blade is greater than that of the secondary processing blade, the main processing blade first cuts the plate, thereby cutting out the approximate shape of the component on the plate. The secondary processing blade processes the corners of the component cut by the main processing blade, thereby completing the formation of the component. Next, the driving mechanism drives the second cutter perpendicular to the processing surface of the plate; then, the second processing shaft drives the second cutter body to rotate coaxially, so that during the rotation, the cutting blade cuts the component off the plate, thereby processing the entire plate into multiple components. The aforementioned optical glass component processing method treats the plate to be processed as a whole and performs subsequent edge and corner treatment operations, which greatly improves the efficiency of the technicians. It can avoid cracking, scratches, etc. that would occur when processing ultra-thin plates cut into component sizes separately, thus ensuring the stability of processing quality. In addition, the entire processing process is highly automated, which effectively improves processing efficiency and saves labor costs. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an optical glass element processing system provided in an embodiment of this application.

[0023] Figure 2 Yes Figure 1 The diagram shows the structure of the component formed after the sheet material is processed.

[0024] Figure 3 yes Figure 1 The diagram shows the structure of the first cutting tool.

[0025] Figure 4 yes Figure 3 The image shows a bottom view of the first cutting tool.

[0026] Figure 5 yes Figure 1 The diagram shows the structure of the second cutting tool.

[0027] Figure 6 yes Figure 5 The second cutting tool is shown in a bottom view.

[0028] Figure 7 This is a schematic diagram of the processing of a first cutting tool, a second cutting tool, and an adsorption device in an optical glass component processing system provided in an embodiment of this application.

[0029] Figure 8 yes Figure 1 The diagram shows the partial contact state between the first cutting tool and the plate.

[0030] Figure 9 yes Figure 1 The diagram shows the partial contact state between the second cutting tool and the component.

[0031] Figure 10 yes Figure 1 The diagram shows the structure of the adsorption device and the plate.

[0032] Figure 11 This is a schematic flowchart of an embodiment of the optical glass element processing method provided in this application.

[0033] Figure 12 This is a schematic diagram of the composition of a control device provided in an embodiment of this application.

[0034] Explanation of main component symbols

[0035] Optical Glass Component Processing System 100

[0036] Component 1

[0037] Board 2

[0038] Adsorption device 10

[0039] Base 11

[0040] Vacuum Channel 111

[0041] Positioning pin 112

[0042] Adsorption fixture 12

[0043] Intake port 121

[0044] Positioning hole 122

[0045] Fixture sealing ring 13

[0046] Supporting groove 14

[0047] 15 sheet sealing ring

[0048] First cutting tool 20

[0049] First blade 21

[0050] Bottom 211, 311

[0051] Main machining cutting edge 22

[0052] Main external cutting edge 22a

[0053] Main internal cutting edge 22b

[0054] First blade tip 22c

[0055] Secondary machining cutting edge 23

[0056] Secondary external cutting edge 23a

[0057] Secondary internal cutting edge 23b

[0058] Second blade tip 23c

[0059] First machining axis 24

[0060] Second cutting tool 30

[0061] Second blade 31

[0062] Cutting blade 32

[0063] External cutting edge 32a

[0064] Internal cutting edge 32b

[0065] Bottom edge 32c

[0066] Second machining axis 33

[0067] Cutting edge angles α1, α2, α3, α4, α5, α6

[0068] Cutting thicknesses h1, h2, h3

[0069] Control device 40

[0070] Memory 41

[0071] Processor 42

[0072] Computer Program 43

[0073] Drive mechanism 50 Detailed Implementation

[0074] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0075] In the embodiments of this application, it should be understood that the terms "vertical," "parallel," etc., indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "installation" and "connection" should be interpreted broadly, for example, they can be fixed connections or detachable connections; they can be mechanical connections or electrical connections or connections that allow communication; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements or the interaction relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0076] In the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner. Without conflict, the following embodiments and features described therein can be combined with each other.

[0077] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0078] Combination Figure 1 The image shows an optical glass component processing system 100 provided in an embodiment of this application. In this embodiment, the plate 2 to be processed is processed to form... Figure 2The element 1 shown is cylindrical, with dimensions of 7.00 mm in diameter at the base and 0.40 mm in thickness. It has a chamfer on both sides. In this application, optical glass is used as the substrate 2 to be processed as an example to describe the embodiments of this application in detail. The substrate 2 to be processed has a thickness of 0.40 mm.

[0079] Specifically, the optical glass component processing system 100 includes an adsorption device 10, a first cutting tool 20, a second cutting tool 30, and a drive mechanism 50. The adsorption device 10 is used to adsorb and support the plate 2 to be processed. The first cutting tool 20 is used to process the plate 2 to form... Figure 2 At least one element 1 is shown. Combined Figures 3-6 As shown, the first cutting tool 20 includes a first cutting body 21 and a first machining shaft 24. The first cutting body 21 is mounted on the first machining shaft 24, which drives the first cutting body 21 to rotate coaxially. The bottom surface 211 of the first cutting body 21 is provided with a main machining edge 22 and a secondary machining edge 23 symmetrically arranged along the first machining shaft 24. The main machining edge 22 and the secondary machining edge 23 protrude relative to the bottom surface 211 of the first cutting body 21. The cutting thickness of the main machining edge 22 is greater than the cutting thickness of the secondary machining edge 23. The second cutting tool 30 is used to sequentially cut at least one of the components 1 formed by the first cutting tool 20 from the plate 2. The second cutting tool 30 includes a second cutting body 31 and a second machining shaft 33. The second cutting body 31 is mounted on the second machining shaft 33, which drives the second cutting body 31 to rotate coaxially. The bottom surface 311 of the second cutting body 31 is provided with a plurality of cutting edges 32 symmetrically arranged along the second machining shaft 33. The first machining axis 24 and the second machining axis 33 are mounted on the drive mechanism 50. The drive mechanism 50 is used to drive the first tool 20 or the second tool 30 perpendicular to the machining surface of the plate 2, so that the first tool 20 or the second tool 30 performs relevant machining operations on the plate 2.

[0080] In this embodiment, the bottom surface 311 of the second blade body 31 is provided with four cutting blades 32, which are evenly arranged on the bottom surface 311 of the second blade body 31. The plurality of cutting blades 32 protrude relative to the bottom surface 311 of the second blade body 31.

[0081] In this embodiment, the optical glass element processing system 100 includes multiple adsorption devices 10, which respectively carry the plate 2 in different processing states. Correspondingly, the optical glass element processing system 100 includes multiple drive mechanisms 50, which are respectively equipped with a first cutter 20 and a second cutter 30, so that the first cutter 20 and the second cutter 30 can process the plate 2 in different processing states at the same time, which can ensure the continuity of the processing process and improve the processing efficiency.

[0082] In the above embodiments, combined with Figure 7 As shown, when processing the sheet material 2, firstly, the adsorption device 10 adsorbs the sheet material 2 to be processed; then, the driving mechanism 50 drives the first cutting tool 20 perpendicular to the processing surface of the sheet material 2; then, the first processing shaft 24 drives the first cutting tool body 21 to rotate coaxially, so that during the rotation, the main processing cutting edge 22 and the secondary processing cutting edge 23 process and chamfer the sheet material 2, thereby forming the component 1. Since the cutting thickness of the main processing cutting edge 22 is greater than the cutting thickness of the secondary processing cutting edge 23, the main processing cutting edge... First, the plate 2 is cut, and then the approximate shape of the component 1 is cut out on the plate 2. The secondary processing blade 23 processes the corners of the component 1 cut by the main processing blade 22, thereby forming the component 1. Next, the drive mechanism 50 drives the second cutter 30 perpendicular to the processing surface of the plate 2. Then, the second processing shaft 33 drives the second cutter body 31 to rotate coaxially, so that during the rotation, the cutting blade 32 cuts the component 1 off the plate 2, thereby processing the entire plate 2 into multiple components 1. The above-mentioned optical glass component processing system 100 processes the plate 2 as a whole and performs subsequent corner processing operations, which greatly improves the efficiency of the technician and avoids problems such as cracking and scratching of the plate 2 during processing, thereby ensuring the stability of the processing quality. In addition, the entire processing process is simple, highly automated, simplifies the processing steps, effectively improves the processing efficiency, and saves labor costs.

[0083] Combination Figure 3 and Figure 4As shown, in some embodiments, the main machining cutting edge 22 includes a main outer cutting edge 22a, a main inner cutting edge 22b, and a first cutting tip 22c. The first cutting tip 22c connects the main outer cutting edge 22a and the main inner cutting edge 22b. The main outer cutting edge 22a and the main inner cutting edge 22b are respectively connected to the bottom surface 211 of the first tool body 21. The cutting edge angle α1 of the main outer cutting edge 22a is between 25° and 31°. If α1 is too large, the contact area between the main machining cutting edge 22 and the sheet metal 2 will be too large during machining, causing the sheet metal 2 to crack. If α1 is too small, the cutting force of the main machining cutting edge 22 will be too concentrated during machining, causing the sheet metal 2 to chip. The cutting edge angle α2 of the main inner cutting edge 22b is between 3° and 7°. If α2 is too small, the sheet metal 2 will easily be lifted when the first tool 20 retracts, causing the sheet metal 2 to break. If α2 is too large, the shape of the machined component 1 will have obvious line marks. The secondary machining cutting edge 23 includes a secondary outer cutting edge 23a, a secondary inner cutting edge 23b, and a second cutting tip 23c. The second cutting tip 23c connects the secondary outer cutting edge 23a and the secondary inner cutting edge 23b. The secondary outer cutting edge 23a and the secondary inner cutting edge 23b are respectively connected to the bottom surface 211 of the first tool body 21. The cutting edge angle α4 of the secondary inner cutting edge 23b is the same as the chamfer angle of the component 1, enabling chamfering of the inner and outer edges of the component 1, thus simplifying traditional machining processes.

[0084] In some embodiments, the main machining blade 22 and the secondary machining blade 23 are inclined toward the first machining axis 24 to ensure that the forming element 1 can be machined on the sheet metal 2.

[0085] In some embodiments, the first cutting tip 22c is arc-shaped, and the radius of the first cutting tip 22c is between 30% and 50% of the thickness of the plate 2. If the radius of the first cutting tip 22c is too large, the first cutting tool 20 will apply too much force during processing, causing the plate 2 to crack. If the radius of the first cutting tip 22c is too small, the first cutting tool 20 will experience accelerated wear during processing.

[0086] Combination Figure 8 As shown, in some embodiments, the cutting thickness h1 of the main machining edge 22 is between 120% and 140% of the thickness of the sheet metal 2. During the machining process of the first tool 20, the end face of the main machining edge 22 cuts into the sheet metal 2 first, and the excess sheet metal 2 is mainly removed by the secondary machining edge 23. The cutting thickness h2 of the secondary machining edge 23 is between 93% and 97% of the cutting thickness of the main machining edge 22. The cutting thickness h2 of the secondary machining edge 23 is slightly lower than the cutting thickness h1 of the main machining edge 22, which can prevent the end face of the secondary machining edge 23 from participating in secondary cutting during machining.

[0087] Combination Figure 5 and Figure 6 As shown, in some embodiments, the cutting edge 32 includes an outer cutting edge 32a, an inner cutting edge 32b, and a bottom cutting edge 32c. The bottom cutting edge 32c connects the outer cutting edge 32a and the inner cutting edge 32b, and the outer cutting edge 32a and the inner cutting edge 32b are respectively connected to the bottom surface 311 of the second tool body 31. The cutting edge angle α5 of the outer cutting edge 32a is smaller than the cutting edge angle α1 of the main outer cutting edge 22a, which can prevent the outer cutting edge 32a from performing secondary processing on the component 1. For example, the cutting edge angle α5 of the outer cutting edge 32a is 1° smaller than the cutting edge angle α1 of the main outer cutting edge 22a. The cutting edge angle α6 of the inner cutting edge 32b is between 0.5° and 2°, and the inner cutting edge 32b is slightly inclined to prevent the component 1 from moving when the second tool 30 exits after cutting. For example, if α6 is too small, it will cause the second tool 30 to pull the component 1 when it exits after machining is completed; if α6 is too large, it will cause the contour dimensions of the component 1 to be distorted.

[0088] Combination Figure 9 As shown, in some embodiments, the cutting thickness h3 of the cutting edge is between 110% and 125% of the thickness of the plate 2, and the bottom cutting edge 32c cuts the plate 2 first to cut the component 1 off the plate 2.

[0089] Combination Figure 10 As shown, in some embodiments, the adsorption device 10 includes a base 11, an adsorption fixture 12, and a fixture sealing ring. The base 11 is provided with a vacuum channel 111, which is connected to a vacuum pump (not shown). The adsorption fixture 12 is detachably mounted on the base 11, and the adsorption fixture 12 is provided with a plurality of suction holes 121. The fixture sealing ring is fitted onto the contact portion between the adsorption fixture 12 and the base 11 to ensure that the vacuum channel 111 communicates with the plurality of suction holes 121.

[0090] In the above embodiment, the adsorption fixture 12 and the base 11 are detachably disposed on the first cutter 20. After the plate 2 on the adsorption device 10 below the first cutter 20 is processed, the adsorption fixture 12 below the first cutter 20 can be directly moved to the base 11 of the adsorption device 10 below the first cutter 20 for cutting by the second cutter 30. Moving the adsorption fixture 12 and the plate 2 on the adsorption fixture 12 as a whole can avoid repeated contact with the plate 2, which could cause scratches and other problems.

[0091] In some implementations, the base 11 is provided with a plurality of positioning pins 112, and the adsorption fixture 12 is provided with a plurality of positioning holes adapted to the positioning pins 112. The adsorption fixture 12 and the base 11 can be detached and connected through the cooperation of the positioning holes and the positioning pins 112, which facilitates the disassembly and positioning of the adsorption fixture 12.

[0092] In this embodiment, the base 11 is provided with two positioning pins 112 located at opposite corners of the base 11, and the adsorption fixture 12 is provided with two positioning holes located at opposite corners of the adsorption fixture 12.

[0093] In some embodiments, the adsorption fixture 12 is provided with a support groove for placing the plate 2, and a sealing ring for the plate 2 is provided around the support groove to prevent vacuum leakage between the adsorption fixture 12 and the plate 2, and to ensure that the adsorption fixture 12 firmly adheres to the plate 2.

[0094] Combination Figure 11 As shown, this application embodiment also provides an optical glass element processing method, applied to the optical glass element processing system 100 described in the above embodiment. The executing entity of the optical glass element processing method in this application embodiment is... Figure 12 The control device 40 shown can control the adsorption device 10, the first cutter 20 and the second cutter 30 to realize the processing of optical glass elements.

[0095] Specifically, the optical glass element processing method includes the following steps.

[0096] S100 controls the adsorption device to adsorb the board material to be processed.

[0097] Specifically, the plate 2 has a front processing surface and a back processing surface that are opposite to each other, and in step S100, the front processing surface of the plate 2 is set facing upwards.

[0098] S200, the control drive mechanism drives the first cutter body of the first tool to be perpendicular to the positive machining surface of the plate.

[0099] Specifically, the first cutter body 21 of the first tool 20 is parallel to the front machining surface of the plate 2 to avoid the first cutter body 21 tilting during the machining process, which would lead to machining failure.

[0100] S300, control the first machining axis to drive the first cutter body to rotate, and the main machining edge and the secondary machining edge of the rotating first cutter body act on the front machining surface and the back machining surface of the plate in sequence, thereby processing to form at least one component.

[0101] Specifically, in combination Figure 7As shown, the first machining axis 24 drives the first cutter body 21 to rotate along the central axis of the first cutter body 21. First, the main machining edge 22 cuts the front machining surface to form the prototype of component 1. Then, since the cutting edge angle α4 of the secondary inner cutting edge 23b of the secondary machining edge 23 is the same as the chamfer angle of the component 1, the inner and outer edges of the component 1 are chamfered simultaneously during the rotation of the main machining edge 22. Next, the plate 2 is flipped over. The same operation is performed on the reverse machining surface of the plate 2 to form component 1.

[0102] S400, control the drive mechanism to drive the second cutter body of the second cutter to be perpendicular to at least one of the elements on the plate.

[0103] Specifically, the adsorption fixture 12 on which the plate 2 forming element 1 is adsorbed is moved to the base 11 of the adsorption device 10 below the second cutter 30.

[0104] S500, control the second processing axis to drive the second cutter body to rotate, and the multiple cutting edges of the rotating second cutter body act on the plate, thereby cutting off the components controlled by the first processing axis from the plate in sequence.

[0105] Specifically, in combination Figure 7 As shown, the second processing shaft 33 drives the second cutter body 31 to rotate along the central axis of the second cutter body 31, and then multiple cutting blades 32 act on the plate 2 to cut off the component 1 on the plate 2.

[0106] In the above embodiment, firstly, the adsorption device 10 adsorbs the plate 2 to be processed; then, the driving mechanism 50 drives the first cutter 20 perpendicular to the processing surface of the plate 2; next, the first processing shaft 24 drives the first cutter body 21 to rotate coaxially, so that during the rotation, the main processing blade 22 and the secondary processing blade 23 process and chamfer the plate 2, thereby forming the component 1. Since the cutting thickness of the main processing blade 22 is greater than that of the secondary processing blade 23, the main processing blade 22 cuts first... The process involves cutting sheet 2 to create the approximate shape of component 1. The secondary machining blade 23 processes the edges and corners of component 1 cut by the main machining blade 22, thus forming component 1. Next, the drive mechanism 50 drives the second cutter 30 perpendicular to the machining surface of sheet 2. Then, the second machining shaft 33 drives the second cutter body 31 to rotate coaxially, causing the cutting blade 32 to cut component 1 from sheet 2 during rotation. This allows the entire sheet 2 to be processed into multiple components 1. This optical glass component processing method treats the sheet 2 as a whole for processing and subsequent edge / corner treatment, greatly improving efficiency. It avoids cracking and scratches that can occur when processing ultra-thin sheets 2 individually into component 1 sizes, ensuring stable processing quality. Furthermore, the high degree of automation throughout the process effectively improves processing efficiency and saves labor costs.

[0107] In this application, the hardware of the control device 40 includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0108] Specifically, in combination Figure 12 As shown, the control device 40 includes, but is not limited to, a memory 41, a processor 42, and a computer program 43 stored in the memory 41 and executable by the processor 42, such as an optical glass element processing program for controlling the optical glass element processing system 100.

[0109] The processor 42 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor. The processor 42 can also be any conventional processor. The processor 42 is the computational core and control center of the control device, connecting various parts of the entire control device through various interfaces and lines, and acquiring the operating system of the control device, as well as various installed application programs and program code.

[0110] The processor 42 acquires the operating system of the control device and various installed applications. The processor 42 acquires these applications to implement the steps in the embodiments of the above-described optical glass element processing method, for example... Figure 11 The steps are shown.

[0111] The memory 41 can be used to store computer programs and / or modules. The processor 42 implements various functions of the control device by running or retrieving the computer programs and / or modules stored in the memory 41, and by calling the data stored in the memory 41. The memory 41 may mainly include a program storage area and a data storage area, wherein the program storage area may store the operating system, at least one application program required for a function, etc. In addition, the memory 41 may include non-volatile memory, such as hard disk, memory, plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, at least one disk storage device, flash memory device, or other non-volatile solid-state storage device.

[0112] The memory 41 can be an external memory and / or an internal memory of the control device. Furthermore, the memory 41 can be a physical memory, such as a memory module, a TF card (Trans-flash Card), etc.

[0113] If the modules / submodules integrated into the control device are implemented as software functional submodules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by the computer program 43 instructing related hardware. The computer program 43 can be stored in a computer-readable storage medium, and when the computer program 43 is acquired by the processor 42, it can implement the steps of the various method embodiments described above.

[0114] The computer program 43 includes computer program code, which may be in the form of source code, object code, accessible file, or some intermediate form. Computer-readable media may include: any entity or device capable of carrying computer program code, recording media, USB flash drive, portable hard drive, magnetic disk, optical disk, computer memory, and read-only memory (ROM).

[0115] The memory 41 in the control device 40 stores multiple instructions, and the processor 42 can acquire multiple instructions to implement the optical glass element processing method described in the above embodiments.

[0116] Furthermore, it is clear that the word "comprising" does not exclude other submodules or steps, and the singular does not exclude the plural. Multiple submodules or devices described in this application may also be implemented by a single submodule or device through software or hardware.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. An optical glass element processing system, characterized by comprising: The system comprises: an adsorption device for adsorbing and carrying a plate to be processed; a first cutter for processing a processing surface of the plate to form at least one element, the first cutter comprising a first cutter body and a first processing shaft, the first cutter body being mounted on the first processing shaft, the first processing shaft being used to drive the first cutter body to rotate coaxially, a bottom surface of the first cutter body being provided with a main processing edge portion and a secondary processing edge portion which are symmetrical along the first processing shaft, the main processing edge portion and the secondary processing edge portion being convex relative to the bottom surface of the first cutter body, a cutting thickness of the main processing edge portion being greater than a cutting thickness of the secondary processing edge portion; the main processing edge portion comprises a main outer cutting edge, a main inner cutting edge and a first cutting tip, the first cutting tip connecting the main outer cutting edge and the main inner cutting edge, the main outer cutting edge and the main inner cutting edge being connected to the bottom surface of the first cutter body respectively, wherein a cutting edge angle of the main outer cutting edge is between 25° and 31°, and a cutting edge angle of the main inner cutting edge is between 3° and 7°; the secondary processing edge portion comprises a secondary outer cutting edge, a secondary inner cutting edge and a second cutting tip, the second cutting tip connecting the secondary outer cutting edge and the secondary inner cutting edge, the secondary outer cutting edge and the secondary inner cutting edge being connected to the bottom surface of the first cutter body respectively, wherein a cutting edge angle of the secondary inner cutting edge is the same as a chamfer angle of the element; a second cutter for cutting the at least one element from the plate; the second cutter comprising a second cutter body and a second processing shaft, the second cutter body being mounted on the second processing shaft, the second processing shaft being used to drive the second cutter body to rotate coaxially, a bottom surface of the second cutter body being provided with a plurality of cutting edge portions which are symmetrical along the second processing shaft, the plurality of cutting edge portions being convex relative to the bottom surface of the second cutter body, the cutting edge portion comprising an outer cutting edge, an inner cutting edge and a bottom edge, the bottom edge connecting the outer cutting edge and the inner cutting edge, the outer cutting edge and the inner cutting edge being connected to the bottom surface of the second cutter body respectively, wherein a cutting edge angle of the outer cutting edge is less than the cutting edge angle of the main outer cutting edge, and a cutting edge angle of the inner cutting edge is between 0.5° and 2°; a driving mechanism, the first processing shaft and the second processing shaft being mounted on the driving mechanism, the driving mechanism being used to drive the first cutter or the second cutter to be perpendicular to the processing surface of the plate.

2. The optical glass element processing system according to claim 1, wherein the first cutting tip is in a circular arc shape, and a radius of the first cutting tip is between 30% and 50% of a thickness of the plate.

3. The optical glass element processing system according to claim 1, wherein the cutting thickness of the main processing edge portion is between 120% and 140% of the thickness of the plate; and the cutting thickness of the secondary processing edge portion is between 93% and 97% of the cutting thickness of the main processing edge portion.

4. The optical glass element processing system according to claim 1, wherein the cutting thickness of the cutting edge portion is between 110% and 125% of the thickness of the plate. ​ ​ ​ ​ 5.The optical glass element processing system according to claim 1, wherein the main cutting edge portion and the auxiliary cutting edge portion are arranged to be inclined toward the first processing axis. The adsorption device comprises:

6. The optical glass element processing system of claim 1, wherein a base provided with a vacuum channel connected with a vacuum pump; an adsorption jig separably arranged on the base, the adsorption jig being provided with a plurality of air suction holes; a jig sealing ring sleeved on the contact part of the adsorption jig and the base to make the vacuum channel communicate with the plurality of air suction holes. 7.The optical glass element processing system according to claim 6, wherein the adsorption jig is provided with a bearing groove for placing the plate, and the bearing groove is surrounded by a plate sealing ring. The method comprises: controlling the adsorption device to adsorb a plate to be processed, the plate having a front processing surface and a back processing surface arranged oppositely; 8. An optical glass element processing method applied to the optical glass element processing system according to any one of claims 1 to 7, characterized by, controlling the driving mechanism to drive the first cutter to vertically move relative to the front processing surface of the plate; controlling the first processing axis to drive the first cutter to rotate, the main cutting edge portion and the auxiliary cutting edge portion of the rotating first cutter acting on the front processing surface and the back processing surface of the plate in sequence, thereby processing to form at least one element; controlling the driving mechanism to drive the second cutter to vertically move relative to the at least one element on the plate; controlling the second processing axis to drive the second cutter to rotate, the plurality of cutting edge portions of the rotating second cutter acting on the plate, thereby sequentially cutting off the elements on the plate. ​ ​

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