A polishing pad mounting device

Abstract

This application relates to the semiconductor field and discloses a polishing pad mounting device, including a polishing pad adsorption plate, a pressing component, a lifting component, and a negative pressure pipeline. The pressing component is connected to the lifting component. The polishing pad adsorption plate has a through hole in the center. The pressing component is inserted into the through hole and moves up and down under the drive of the lifting component to adhere the center of the polishing pad to the polishing pad during installation. At least two pore arrays are distributed on the polishing pad adsorption plate, arranged sequentially according to a target direction. The target direction is the direction away from the center of the polishing pad adsorption plate. The pore array includes multiple first pores, which are connected to the negative pressure pipeline to vacuum adsorb the polishing pad. During polishing pad installation, the pore array releases vacuum sequentially according to the target direction. This device allows for partitioned polishing pad mounting from the center outwards, reducing the generation of air bubbles. The mounting process is automated, improving mounting efficiency, reducing labor costs, and decreasing the probability of polishing pad failure.

Description

Technical Field

[0001] This application relates to the semiconductor field, and in particular to a polishing pad mounting device. Background Technology

[0002] Chemical mechanical polishing (CMP) is a technique used in semiconductor device manufacturing that uses chemical etching and mechanical force to planarize wafers.

[0003] In chemical mechanical polishing (CMP) equipment, polishing pads are attached to the polishing disc, and this attachment is done manually by a professional engineer. The process is roughly as follows: First, the polishing pad is placed horizontally, aligned with the polishing disc. Then, the adhesive backing of one side of the pad is peeled off and applied to the disc to secure it. The engineer then uses a leveling tool to smooth the pad in a Z-shape, simultaneously peeling off the adhesive backing. Finally, the pad is checked for air bubbles. If no bubbles are found, the attachment is complete; otherwise, they are removed using the leveling tool. This method of attachment, requiring manual operation by a professional engineer, results in low efficiency, high labor intensity, and high labor costs. Furthermore, human error during manual attachment can render the pad unusable, requiring re-attachment and increasing production costs.

[0004] Therefore, how to solve the above-mentioned technical problems should be a key focus for those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a polishing pad mounting device to reduce air bubbles during polishing pad installation, improve installation efficiency, and reduce labor costs.

[0006] To solve the above-mentioned technical problems, this application provides a polishing pad mounting device, including a polishing pad adsorption plate, a top pressing component, a lifting component, and a negative pressure pipeline, wherein the top pressing component is connected to the lifting component;

[0007] The polishing pad adsorption disk has a through hole in the middle. The top pressing component is inserted into the through hole and moves up and down under the drive of the lifting component so as to stick the center position of the polishing pad onto the polishing disk during installation.

[0008] The polishing pad adsorption disk has at least two pore arrays distributed on it, and the pore arrays are arranged sequentially according to the target direction; the target direction is the direction away from the center of the polishing pad adsorption disk.

[0009] The pore array includes multiple first pores, which are connected to the negative pressure pipeline to vacuum-adsorb the polishing pad; when installing the polishing pad, the pore array releases vacuum sequentially in the target direction.

[0010] Optionally, the pressing component includes a pressure plate and a connecting rod; the pressure plate is connected to the connecting rod; the connecting rod passes through the through hole and is connected to the lifting component.

[0011] Optional, also includes:

[0012] The second air holes distributed on the connecting rod are used to spray gas when the polishing pad is installed.

[0013] Optionally, the second air holes are evenly distributed on the connecting rod.

[0014] Optionally, the pressure applied by the gas on the polishing pad is in the range of 0.5 kg / cm². 2 ~1kg / cm 2 .

[0015] Optional, also includes:

[0016] At least two pneumatic valves, one of which is connected to a negative pressure pipeline corresponding to one of the air hole arrays.

[0017] Optionally, each of the pore arrays is arranged in a ring shape.

[0018] Optionally, the first pores are evenly distributed throughout the pore array.

[0019] Optionally, the number of pore arrays is three.

[0020] Optional, also includes:

[0021] A fixing member is provided on the polishing pad adsorption plate to fix the polishing pad adsorption plate to the polishing plate.

[0022] This application provides a polishing pad mounting device, comprising a polishing pad adsorption plate, a pressing component, a lifting component, and a negative pressure pipeline. The pressing component is connected to the lifting component. The polishing pad adsorption plate has a through hole in the center. The pressing component is inserted into the through hole and moves up and down under the drive of the lifting component to adhere the center of the polishing pad to the polishing pad during installation. The polishing pad adsorption plate has at least two pore arrays distributed on it, arranged sequentially according to a target direction. The target direction is the direction away from the center of the polishing pad adsorption plate. The pore array includes multiple first pores connected to the negative pressure pipeline for vacuum adsorption of the polishing pad. During polishing pad installation, the pore array releases vacuum sequentially according to the target direction.

[0023] As can be seen, the polishing pad installation device of this application includes a polishing pad adsorption plate, a top pressure component, a lifting component, and a negative pressure pipeline. The polishing pad adsorption plate is equipped with an array of air holes, which vacuum-adsorbs the polishing pad. When installing the polishing pad onto the polishing disc, the top pressure component moves downward under the drive of the lifting component, applying pressure to the center of the polishing pad, so that the center of the polishing pad first adheres to the polishing disc. Then, the air hole array releases vacuum sequentially in the target direction, and the corresponding part of the polishing pad adheres downward to the polishing disc, thereby achieving the polishing pad to adhere to the polishing disc sequentially from the center outward, reducing the generation of air bubbles. The entire adhesion process is completed automatically, improving adhesion efficiency, reducing labor costs, and the polishing pad installation device is easy to operate, saving time and costs in training new engineers to adhere polishing pads. At the same time, it can avoid errors caused by human factors, reduce the probability of polishing pad scrap, and reduce production costs. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a polishing pad mounting device provided in an embodiment of this application;

[0026] Figure 2 This is a side view of a polishing pad mounting device provided in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of a pore array provided in an embodiment of this application;

[0028] Figure 4 This is a schematic diagram of the structure of a top-pressing component provided in an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of another polishing pad mounting device provided in an embodiment of this application;

[0030] Figure 6 This is a schematic diagram of the structure of a polishing disc provided in an embodiment of this application;

[0031] Figure 7 This is a flowchart illustrating a polishing pad application process provided in an embodiment of this application.

[0032] In the picture,

[0033] 1. Polishing pad adsorption plate; 2. Top pressure component; 3. Lifting component; 4. Pneumatic valve; 5. Fixing component; 6. Polishing disc; 7. Polishing pad; 11. Air hole array; 11A. First air hole array; 11B. Second air hole array; 11C. Third air hole array; 111. Air hole array unit; 112. First air hole; 12. Through hole; 21. Pressure plate; 22. Connecting rod; 221. Second air hole. Detailed Implementation

[0034] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0036] As described in the background section, polishing pads are currently applied to polishing discs manually. This results in low pad application efficiency, high labor intensity, and high labor costs. Furthermore, human error during manual application can render the polishing pads unusable, requiring reapplication and increasing production costs.

[0037] In view of this, this application provides a polishing pad mounting device, please refer to... Figures 1 to 3 It includes: a polishing pad adsorption plate 1, a top pressure component 2, a lifting component 3, and a negative pressure pipeline, wherein the top pressure component 2 is connected to the lifting component 3;

[0038] The polishing pad adsorption disk 1 has a through hole 12 in the middle. The top pressing component 2 is inserted into the through hole 12 and moves up and down under the drive of the lifting component 3 so as to stick the center position of the polishing pad onto the polishing disk during installation.

[0039] The polishing pad adsorption disk 1 has at least two pore arrays 11 distributed on it, and the pore arrays 11 are arranged sequentially according to the target direction; the target direction is the direction away from the center of the polishing pad adsorption disk 1.

[0040] The pore array 11 includes a plurality of first pores 112, which are connected to the negative pressure pipeline to vacuum adsorb the polishing pad; when installing the polishing pad, the pore array 11 releases vacuum sequentially in the target direction.

[0041] The shape of the polishing pad adsorption tray 1 includes, but is not limited to, circles, squares, and rectangles. It should be noted that after the polishing pad is adsorbed by the polishing pad adsorption tray 1, the polishing pad must not be exposed outside the polishing pad adsorption tray 1.

[0042] It should be noted that the shape of the first vent 112 is not limited in this application. For example, the shape of the first vent 112 can be circular, elliptical, square, rectangular, rhomboid, etc., and can be set by the user.

[0043] The lifting component 3 can be a cylinder or other component that can control the up and down movement of the pressing component 2.

[0044] In one possible implementation, the pressing component 2 includes a pressure plate 21 and a connecting rod 22; the pressure plate 21 is connected to the connecting rod 22; the connecting rod 22 passes through the through hole 12 and is connected to the lifting component 3.

[0045] The shape of the pressure plate 21 includes, but is not limited to, circles, ovals, squares, and rectangles. Figure 1 The shape of the pressure plate 21 is shown as a circle.

[0046] The shape of the connecting rod 22 can be a cylinder, prism, cuboid, etc., all of which are within the protection scope of this application.

[0047] The pressure plate 21 is used to contact the polishing pad during installation and to apply pressure to the polishing pad.

[0048] The size of the pressure plate 21 can be larger than the size of the through hole 12. The pressure plate 21 is located on the side of the polishing pad adsorption plate 1 facing the polishing pad. The pressure plate 21 cannot pass through the through hole 12. The size of the pressure plate 21 can be equal to the size of the through hole 12. The pressure plate 21 can also move up and down in the through hole 12.

[0049] It should be noted that the number of pore arrays 11 is not limited in this application and depends on the situation. For example, the number of pore arrays 11 can be two, three, four, etc. When the number of pore arrays 11 is three, such as... Figure 1 and Figure 2 As shown.

[0050] To ensure the stability of the adsorption of the polishing pad, the edge of the outermost pore array 11 coincides with the edge of the polishing pad.

[0051] As one possible implementation, each of the pore arrays 11 is arranged in a circular pattern, such as... Figure 1 and Figure 2 As shown, this increases the adsorption contact area between the pore array 11 and the polishing pad, thereby enhancing the adsorption stability of the polishing pad.

[0052] In one possible implementation, the first pores 112 are evenly distributed in the pore array 11 to balance the adsorption force of the pore array 11 on the polishing pad at each point, so that when the vacuum of the pore array 11 is released, the polishing pad corresponding to the pore array 11 is simultaneously separated from the polishing pad adsorption disk 1 and adhered to the polishing disk.

[0053] However, this application does not specifically limit the distribution of the first pores 112. In other embodiments of this application, such as... Figure 3 As shown, in a pore array 11, the pore array 11 includes a plurality of pore array units 111, each pore array unit 111 includes a plurality of first pores 112, and there are no first pores 112 in the area outside the pore array unit 111, and the pore array units 111 are uniformly distributed in the pore array 11.

[0054] Of course, in other embodiments of this application, the first pores 112 may also be randomly distributed in the pore array 11.

[0055] As one possible implementation, the polishing pad mounting device may further include:

[0056] At least two pneumatic valves 4, one of which is connected to a negative pressure pipeline corresponding to one of the air hole arrays 11.

[0057] The number of pneumatic valves 4 is equal to the number of air hole arrays 11. One pneumatic valve 4 can control whether the first air hole 112 in an air hole array 11 releases the vacuum, which is very simple and convenient.

[0058] by Figure 2 Taking a three-pore array 11 as an example, this application explains how the pore array 11 releases vacuum sequentially in the target direction during polishing pad installation using the polishing pad mounting device. According to the target direction, the three pore arrays 11 are sequentially referred to as the first pore array 11A, the second pore array 11B, and the third pore array 11C. That is, the pore array 11 closest to the center is the first pore array 11A, the pore array 11 farthest from the center is the third pore array 11C, and the pore array 11B is located between the first pore array 11A and the third pore array 11C. After the pressure plate 21 presses down and adheres the central area of ​​the polishing pad onto the polishing disk, the vacuum of the first pore array 11A is first released, causing the portion of the polishing pad corresponding to the first pore array 11A to fall and adhere to the polishing disk. Then, the vacuum of the second pore array 11B is released, causing the portion of the polishing pad corresponding to the second pore array 11B to fall and adhere to the polishing disk. Finally, the vacuum of the third pore array 11C is released, causing the portion of the polishing pad corresponding to the third pore array 11C to fall and adhere to the polishing disk, thus completing the entire polishing pad installation process.

[0059] This embodiment of the polishing pad installation device includes a polishing pad adsorption plate 1, a top pressing component 2, a lifting component 3, and a negative pressure pipeline. The polishing pad adsorption plate 1 is equipped with an air hole array 11, which vacuum-adsorbs the polishing pad. When installing the polishing pad onto the polishing pad, the top pressing component 2 moves downward under the drive of the lifting component 3, applying pressure to the center of the polishing pad, so that the center of the polishing pad first adheres to the polishing pad. Then, the air hole array 11 releases vacuum sequentially in the target direction, and the corresponding part of the polishing pad adheres downward to the polishing pad, thereby achieving the polishing pad to be adhered to the polishing pad sequentially from the center outwards, reducing the generation of air bubbles. The entire adhesion process is completed automatically, improving adhesion efficiency, reducing labor costs, and the polishing pad installation device is easy to operate, saving time and costs in training new engineers to adhere polishing pads. At the same time, it can avoid errors caused by human factors, reduce the probability of polishing pad scrap, and reduce production costs.

[0060] Please refer to Figure 4 Based on the above embodiments, in one embodiment of this application, the polishing pad mounting device further includes:

[0061] The second air hole 221 distributed on the connecting rod 22 is used to spray gas when the polishing pad is installed.

[0062] It should be noted that the shape of the second vent 221 is not limited in this application. For example, the shape of the second vent 221 can be circular, elliptical, square, rectangular, rhomboid, etc., and can be set by the user.

[0063] The gas can be an inert gas such as nitrogen, which is relatively clean and will not have any effect on the polishing pad.

[0064] The gas ejected from the second vent 221 can, on the one hand, apply pressure to the polishing pad, so that the part of the polishing pad released by the polishing pad adsorption disk 1 can completely adhere to the polishing disk. On the other hand, the gas can also blow away the surface of the polishing pad to prevent contaminant particles from contacting the surface of the polishing pad.

[0065] The pressure range of the gas applied to the polishing pad is 0.5 kg / cm². 2 ~1kg / cm 2 For example, 0.5 kg / cm 2 0.6 kg / cm 2 0.7kg / cm 2 0.8kg / cm 2 0.9kg / cm 2 1kg / cm 2 wait.

[0066] As one possible implementation, the second air hole 221 is evenly distributed on the connecting rod 22 so that the pressure generated by the gas ejected from the second air hole on each part of the polishing pad is equal, thereby making the polishing pad firmly adhered to the polishing disk at each part.

[0067] Please refer to Figure 5 and Figure 6 Based on any of the above embodiments, in one embodiment of this application, the polishing pad mounting device may further include:

[0068] A fixing member 5 is provided on the polishing pad adsorption plate 1 to fix the polishing pad adsorption plate 1 to the polishing plate 6.

[0069] This application does not limit the type of fastener 5; it can be set arbitrarily. For example, such as Figure 5 and Figure 6 As shown, the fixing member 5 on the polishing pad adsorption plate 1 can be an alignment pin. At this time, the polishing plate 6 is provided with an alignment pin that matches the fixing member 5 on the polishing pad adsorption plate 1. The alignment pin on the polishing plate 6 can be a female head, and the alignment pin on the polishing pad adsorption plate 1 can be a male head; or, the fixing member 5 on the polishing pad adsorption plate 1 can be a buckle to fix the polishing pad adsorption plate 1 and the polishing plate 6.

[0070] The number of fixing parts 5 is two or more, preferably three fixing parts 5, which are arranged in a triangle to improve the stability of the polishing pad adsorption plate 1.

[0071] In this embodiment, the fixing component 5 is used to fix the polishing pad adsorption plate 1 and the polishing plate 6, so as to ensure that the polishing pad and the polishing plate 6 are aligned when the polishing pad is installed, and to avoid misalignment.

[0072] Please refer to Figure 7 The following is based on Figure 2 The polishing pad mounting device shown illustrates the process of mounting the polishing pad.

[0073] Step 1: The polishing pad adsorption plate 1 adsorbs the polishing pad 7;

[0074] Step 2: Fix the polishing pad adsorption plate 1 onto the polishing pad 6 using the fixing parts on the polishing pad adsorption plate 1;

[0075] Step 3: The cylinder is pneumatic, pressing the top pressing component downwards. The pressure plate of the top pressing component applies a force of 8N to 10N to the center position of the polishing pad 7, causing the center position of the polishing pad 7 to fall and stick onto the polishing disk 6, which serves as the positioning reference point for subsequent uniform bonding.

[0076] Step 4: The air hole array on the polishing pad adsorption disk 1 releases vacuum sequentially in the target direction. First, the vacuum of the first air hole array is released, so that the polishing pad 7 and the part corresponding to the first air hole array fall down. At the same time, nitrogen gas is sprayed from the second air hole of the connecting rod to apply uniform downward pressure so that the polishing pad 7 and the part corresponding to the first air hole array are completely attached to the surface of the polishing disk 6. At the same time, the surface of the polishing pad 7 is blown to prevent contaminant particles from contacting the surface of the polishing pad 7.

[0077] Then the vacuum of the second pore array is released, causing the polishing pad 7 and the corresponding part of the second pore array to fall. At the same time, nitrogen gas is sprayed from the second pore of the connecting rod, applying uniform downward pressure so that the polishing pad 7 and the corresponding part of the first pore array are completely attached to the surface of the polishing disk 6. At the same time, the surface of the polishing pad 7 is blown to prevent contaminant particles from contacting the surface of the polishing pad 7.

[0078] Finally, the vacuum of the third pore array is released, causing the polishing pad 7 and the corresponding area of ​​the third pore array to fall. Simultaneously, nitrogen gas is injected through the second pore of the connecting rod, applying uniform downward pressure to ensure that the polishing pad 7 and the corresponding area of ​​the first pore array completely adhere to the surface of the polishing disk 6. At the same time, the surface of the polishing pad 7 is blown away to prevent contaminant particles from contacting the surface, thus completing the entire installation process of the polishing pad 7. Figure 7 As shown.

[0079] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0080] The polishing pad mounting device provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A polishing pad mounting device, characterized in that, It includes a polishing pad adsorption plate, a top pressure component, a lifting component, and a negative pressure pipeline, wherein the top pressure component is connected to the lifting component; The polishing pad adsorption disk has a through hole in the middle. The top pressing component is inserted into the through hole and moves up and down under the drive of the lifting component so as to stick the center position of the polishing pad onto the polishing disk during installation. The polishing pad adsorption disk has at least two pore arrays distributed on it, and the pore arrays are arranged sequentially according to the target direction; the target direction is the direction away from the center of the polishing pad adsorption disk. The pore array includes multiple first pores, which are connected to the negative pressure pipeline to vacuum-adsorb the polishing pad; when installing the polishing pad, the pore array releases vacuum sequentially in the target direction.

2. The polishing pad mounting device as described in claim 1, characterized in that, The pressing component includes a pressure plate and a connecting rod; the pressure plate is connected to the connecting rod; the connecting rod passes through the through hole and is connected to the lifting component.

3. The polishing pad mounting device as described in claim 2, characterized in that, Also includes: The second air holes distributed on the connecting rod are used to spray gas when the polishing pad is installed.

4. The polishing pad mounting device as described in claim 3, characterized in that, The second air hole is evenly distributed on the connecting rod.

5. The polishing pad mounting device as described in claim 3, characterized in that, The pressure range of the gas applied to the polishing pad is 0.5 kg / cm². 2 ~1kg / cm 2 .

6. The polishing pad mounting device as described in claim 1, characterized in that, Also includes: At least two pneumatic valves, one of which is connected to a negative pressure pipeline corresponding to one of the air hole arrays.

7. The polishing pad mounting device as described in claim 1, characterized in that, Each of the pore arrays is distributed in a circular pattern.

8. The polishing pad mounting device as described in claim 7, characterized in that, The first pore is evenly distributed throughout the pore array.

9. The polishing pad mounting device as described in claim 7, characterized in that, The number of pore arrays is three.

10. The polishing pad mounting device according to any one of claims 1 to 9, characterized in that, Also includes: A fixing member is provided on the polishing pad adsorption plate to fix the polishing pad adsorption plate to the polishing plate.

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