A mask assembly and an evaporation device

Abstract

This application discloses a mask assembly and a vapor deposition apparatus. The mask assembly includes a supporting mask and a plurality of metal masks. The supporting mask includes an outer frame with a hollow area in the middle, a plurality of first support plates that span the hollow area along a first direction and are spaced apart on the outer frame along a second direction, and a plurality of second support plates that span the hollow area along the second direction and are spaced apart on the outer frame along the first direction. The first direction and the second direction intersect. The plurality of metal masks span the hollow area along the first direction and are arranged side by side on the outer frame along the second direction. The two sides of the metal masks along the first direction correspond to the outer frame and / or the first support plates, and the non-vapor deposition areas correspond to the outer frame and / or the second support plates. At least the areas on the first support plates corresponding to the two sides of the metal masks along the first direction are provided with first magnetic adsorption areas to adsorb the metal masks onto the first support plates.

Description

Technical Field

[0001] This application belongs to the field of display device fabrication technology, and particularly relates to a mask assembly and a vapor deposition apparatus. Background Technology

[0002] In Organic Light-Emitting Diode (OLED) display panels, the organic light-emitting layer is typically formed using a vapor deposition process. The mask assembly plays a crucial role in this process, comprising a support mask (F-Mask) and a metal mask (FMM). During vapor deposition, it defines the red, green, and blue (RGB) sub-pixel layers, ensuring that the material is deposited in the specified locations.

[0003] In related technologies, during the mesh stretching process before evaporation, the metal mask is stretched only in a first direction. Local warping and / or wrinkles are easily generated in a second direction intersecting the first direction. During evaporation, after the mask assembly is adsorbed, the presence of warping and wrinkles can easily cause displacement of the evaporation position, leading to color mixing problems after evaporation. This affects the yield of the film layer formed on the substrate, and consequently, the display yield of the display panel. Especially for larger mask assemblies, the wrinkling is more severe. Severe wrinkles can easily cause creases in the metal mask, resulting in the entire mask assembly being scrapped, causing certain economic losses.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] This application aims to at least partially solve the technical problem that wrinkles easily form in mask assemblies during the screen stretching process, affecting the yield of the film layer deposited on the substrate and the display yield of the display panel. To this end, this application provides a mask assembly and a vapor deposition apparatus.

[0006] This application provides a mask assembly, the mask assembly comprising:

[0007] A supporting mask plate includes an outer frame with a hollow central section, a plurality of first supporting plates spanning the hollow central section along a first direction and spaced apart on the outer frame along a second direction, and a plurality of second supporting plates spanning the hollow central section along the second direction and spaced apart on the outer frame along the first direction, wherein the first direction intersects the second direction; and,

[0008] Multiple metal photomasks are provided, which are arranged across the hollow area along the first direction and side by side on the outer frame along the second direction. The metal photomasks have multiple hollowed-out vapor deposition areas and non-vapor deposition areas surrounding the vapor deposition areas. The two sides of the metal photomasks along the first direction correspond to the outer frame and / or the first support plate. The non-vapor deposition areas correspond to at least one of the outer frame, the first support plate, and the second support plate.

[0009] Wherein, at least the first support plate has a first magnetic adsorption area in the area corresponding to both sides of the metal mask plate along the first direction, so as to adsorb the metal mask plate onto the first support plate.

[0010] In some embodiments, the outer frame is provided with the first magnetic adsorption area in the region corresponding to both sides of the metal mask plate along the first direction, so as to adsorb the metal mask plate onto the outer frame.

[0011] In some embodiments, at least a second magnetic adsorption region is provided on the second support plate in the area corresponding to the non-evaporation area along the second direction, so as to adsorb the metal mask onto the second support plate, wherein the magnetic strength of the second magnetic adsorption region is less than the magnetic strength of the first magnetic adsorption region.

[0012] In some embodiments, the outer frame has a second magnetic adsorption area in a region corresponding to the non-evaporation area along a second direction, so as to adsorb the metal mask onto the outer frame.

[0013] In some embodiments, the magnetic strength of the second magnetic adsorption region increases from the vicinity of the vapor deposition region toward the direction away from the vapor deposition region.

[0014] In some embodiments, at least one of the outer frame, the first support plate, and the second support plate is provided with a third magnetic adsorption area in a region adjacent to the corner of the vapor deposition area, and the shape of the third magnetic adsorption area matches the corner structure of the vapor deposition area.

[0015] In some embodiments, the first magnetic adsorption area is provided with a plurality of first magnetic adsorption blocks, which are arranged in an array or staggered in the first magnetic adsorption area; the second magnetic adsorption area is provided with a plurality of second magnetic adsorption blocks, which are arranged in an array or staggered in the second magnetic adsorption area; the third magnetic adsorption area is provided with a plurality of third magnetic adsorption blocks, which are arranged in a fan shape in the third magnetic adsorption area.

[0016] In some embodiments, the first magnetic adsorption block, the second magnetic adsorption block, and the third magnetic adsorption block each comprise a magnetically conductive structural material.

[0017] In some implementations, the areas of the first magnetic adsorption region, the second magnetic adsorption region, and the third magnetic adsorption region are positively correlated with the total area of ​​the mask assembly.

[0018] In some embodiments, the outer frame and / or the first support plate have half-etched areas corresponding to the two sides of the first magnetic adsorption area along the first direction.

[0019] In some embodiments, the thickness of the supporting mask is 90 μm to 110 μm, and the thickness of the half-etched area is 50 μm to 60 μm.

[0020] In some implementations, the half-etched area is a multi-cell structure or a single-cell structure.

[0021] This application also proposes a vapor deposition apparatus, which includes a vapor deposition source, a magnetic plate, and the aforementioned mask assembly. The vapor deposition source is disposed on the side of the mask assembly away from the substrate to be vapor deposited, and the magnetic plate is disposed on the side of the substrate to be vapor deposited away from the mask assembly.

[0022] The embodiments of this application have at least the following beneficial effects:

[0023] In the aforementioned mask assembly, the metal mask is disposed across the hollow area of ​​the outer frame along a first direction. Therefore, in the first direction, both ends of the metal mask can be stretched by the outer frame, and the metal mask can be stretched and tensioned by the outer frame in the first direction. The outer frame and / or the first support plate have a first magnetic adsorption area corresponding to the two sides of the metal mask along the first direction. That is, in the second direction, the two sides of the metal mask have a first magnetic adsorption area. The first magnetic adsorption area can adsorb the metal mask in the second direction, thereby stretching and tensioning the metal mask in the second direction to avoid wrinkles in the metal mask in the second direction. Since the metal mask has been stretched and tensioned by the first magnetic adsorption area in the second direction, after the mask assembly is adsorbed during evaporation, the metal mask will not shift. Therefore, it can avoid the shift of the evaporation position to a certain extent, improve the yield of the film layer formed by evaporation on the substrate, and thus improve the display yield of the display panel. Especially for relatively large photomask assemblies, the adsorption and stretching of the metal photomask by the first magnetic adsorption area can prevent the metal photomask from developing serious wrinkles or creases, thus avoiding the scrapping of the entire photomask assembly and avoiding corresponding economic losses. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic diagram of the vapor deposition apparatus in the related technology is shown;

[0026] Figure 2 A schematic diagram of the structure of a mask assembly in the related technology is shown;

[0027] Figure 3 A schematic diagram of the mask assembly in an embodiment of this application is shown;

[0028] Figure 4 It shows Figure 3 Enlarged view of point A in the middle;

[0029] Figure 5 A schematic diagram of the mask assembly in another embodiment of this application is shown;

[0030] Figure 6 It shows Figure 5 Enlarged view at point B;

[0031] Figure 7 It shows Figure 5 A magnified view of point C in the middle.

[0032] Reference numerals for mask components in related technologies:

[0033] 10. Supporting mask; 11. Outer frame; 12. First support plate; 13. Second support plate; 20. Metal mask; 1000. Mask assembly; 2000. Evaporation source; 3000. Magnetic plate; 4000. Substrate; 5000. Cooling plate; 6000. Stainless steel plate; X, First direction; Y, Second direction.

[0034] Reference numerals for the mask assembly in the embodiments of this application:

[0035] 100, Supporting mask; 110, Outer frame; 120, First support plate; 130, Second support plate; 200, Metal mask; 210, Evaporation zone; 220, Non-evaporation zone; 300, First magnetic adsorption zone; 400, Second magnetic adsorption zone; 500, Third magnetic adsorption zone; 600, Half-etched zone; X, First direction; Y, Second direction. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0037] Furthermore, reference numerals and / or reference letters may be repeated in different examples in this application. Such repetition is for simplification and clarity purposes and does not in itself indicate a relationship between the various embodiments and / or settings discussed. In addition, this application provides examples of various specific processes and materials; however, those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0038] This application is described below with reference to the accompanying drawings and specific embodiments:

[0039] During the vapor deposition process, such as Figure 1 As shown, the evaporation apparatus is placed inside a chamber with a vacuum environment. The evaporation source is positioned below the mask assembly, and the substrate is positioned above the mask assembly, ensuring close contact between the substrate and the metal mask within the mask assembly. Typically, the mask assembly and the substrate sag due to their own gravity, creating a gap between them. Therefore, during evaporation, a strongly magnetic plate (Gauss plate) is placed above the substrate. Magnetic force is used to attract the mask assembly, ensuring close contact between the mask assembly and the substrate, reducing the gap, ensuring accurate evaporation positioning, and improving evaporation yield. Furthermore, a cooling plate can be placed between the substrate and the Gauss plate, and a stainless steel plate can be placed above the Gauss plate.

[0040] However, in related technologies, such as Figure 2 As shown, a photomask assembly typically includes a supporting photomask and a metal photomask. The supporting photomask includes an outer frame, multiple first support plates, and multiple second support plates. The middle of the outer frame is a hollow area. The multiple first support plates and multiple second support plates are respectively intersecting and straddling the outer frame along a first direction and a second direction to form a support mesh in the hollow area. The metal photomask is straddling the outer frame along the first direction and is supported by the support mesh. During the mesh stretching process before vapor deposition, the photomask assembly... Figure 2As shown, the metal mask is stretched only in the first direction, and wrinkles are easily generated in the second direction, which intersects the first direction. During evaporation, after the mask assembly is adsorbed, the presence of wrinkles can easily cause the evaporation position to shift, resulting in evaporation deviation and color mixing problems, affecting the yield of the evaporated film layer on the substrate and the display yield of the display panel. Especially in relatively large mask assemblies, the wrinkling problem of the metal mask is more serious after the mask assembly is adsorbed, which can easily lead to creases in the metal mask, seriously affecting the yield of the evaporated film layer on the substrate and the display yield of the display panel, and even causing the entire mask assembly to be scrapped.

[0041] To address the technical problem of wrinkles easily forming in the mask assembly during the screen stretching process, affecting the yield of the film layer deposited on the substrate and the display yield of the display panel, this application proposes a mask assembly, such as... Figures 3 to 7 As shown, the mask assembly proposed in this application includes a supporting mask and multiple metal masks. The supporting mask includes an outer frame with a hollow area in the middle, multiple first support plates that span the hollow area along a first direction and are spaced apart on the outer frame along a second direction, and multiple second support plates that span the hollow area along the second direction and are spaced apart on the outer frame along the first direction. The first direction and the second direction intersect. The multiple metal masks span the hollow area along the first direction and are arranged side by side on the outer frame along the second direction. The metal masks have multiple hollowed-out vapor deposition areas and non-vapor deposition areas surrounding the vapor deposition areas. The non-vapor deposition areas on both sides of the metal masks along the first direction correspond to the outer frame and / or the first support plates. The non-vapor deposition areas correspond to at least one of the outer frame, the first support plates, and the second support plates. At least the areas on the first support plates corresponding to the areas on both sides of the metal masks along the first direction are provided with first magnetic adsorption areas to adsorb the metal masks onto the first support plates.

[0042] In some embodiments, the hollow area edge of the outer frame is provided with a first support plate and a second support plate, respectively. The first support plate located at the edge of the hollow area may be provided with a first magnetic adsorption area to adsorb the metal mask plate onto the first support plate.

[0043] As an alternative implementation, the hollow area edge of the outer frame may not be provided with the first support plate and the second support plate. The hollow area edge of the outer frame supports the metal mask plate through the outer frame. Therefore, a first magnetic adsorption area is provided on the outer frame in the area corresponding to both sides of the metal mask plate along the first direction, so as to adsorb the metal mask plate onto the outer frame.

[0044] In the mask assembly proposed in the embodiments of this application, such as Figures 3 to 7As shown, the metal mask is disposed across the hollow area of ​​the outer frame along the first direction. Therefore, in the first direction, both ends of the metal mask can be stretched by the outer frame, and the metal mask can be stretched and tensioned by the outer frame in the first direction. The outer frame and / or the first support plate are provided with first magnetic adsorption areas in the areas corresponding to both sides of the metal mask along the first direction. That is, in the second direction, the metal mask is provided with first magnetic adsorption areas on both sides. The first magnetic adsorption areas can adsorb the metal mask in the second direction, thereby stretching and tensioning the metal mask in the second direction to avoid wrinkles in the metal mask in the second direction. Since the metal mask has been stretched and tensioned by the first magnetic adsorption areas in the second direction, the metal mask can be stretched and tensioned in all directions. After the mask assembly is adsorbed during evaporation, the metal mask will not shift. Therefore, it can avoid the shift of the evaporation position to a certain extent, improve the yield of the film layer formed by evaporation on the substrate, and thus improve the display yield of the display panel. Especially for relatively large photomask assemblies, the adsorption and stretching of the metal photomask by the first magnetic adsorption area can prevent the metal photomask from developing serious wrinkles or creases, thus avoiding the scrapping of the entire photomask assembly and avoiding corresponding economic losses.

[0045] In some embodiments, the first direction and the second direction intersect, that is, the first direction and the second direction can intersect at any angle. In the following embodiments of this application, such as... Figures 3 to 7 As shown, the mask assembly of this application is illustrated by taking the example of the first direction and the second direction being perpendicular to each other.

[0046] In some embodiments, such as Figures 3 to 7 As shown, the first magnetic adsorption area is adjacent to the vapor deposition area in the first direction, so as to adsorb and fix the non-vapor deposition area around the vapor deposition area in the second direction.

[0047] In some embodiments, such as Figures 3 to 7 As shown, the first support plate and the second support plate are also disposed at the edge of the central control area of ​​the outer frame. Therefore, in the middle part of the hollow area, the first support plate and the second support plate crosswise support the metal mask plate. At the edge of the hollow area, the first support plate and the second support plate also support the edge and end of the metal mask plate. At this time, the first magnetic adsorption area is disposed on the first support plate in the area corresponding to both sides of the metal mask plate along the first direction.

[0048] In other embodiments, the first and second support plates may be disposed only in the middle portion of the hollow area of ​​the outer frame, while the metal mask plate can be supported by the outer frame itself at the edge portion. Furthermore, the first magnetic adsorption area is disposed not only in the areas on the first support plate corresponding to both sides of the metal mask plate along the first direction, but also in the areas on the outer frame corresponding to both sides of the metal mask plate along the first direction.

[0049] In some embodiments, such as Figures 3 to 7 As shown, the metal mask has multiple perforated evaporation zones, with non-evaporation zones surrounding them. During evaporation, the evaporation material passes through the evaporation zones and forms a film structure on the substrate with the same shape as the perforated evaporation zones. The non-evaporation zones can be orthographically projected to corresponding positions on the first support plate, the second support plate, and the outer frame, using these positions for support to prevent deformation and wrinkling of the metal mask. Simultaneously, the first support plate and / or the outer frame have portions of a first magnetic adsorption area extending along a first direction. In a second direction, the non-evaporation zones can be adsorbed and flattened by the first magnetic adsorption area. Therefore, when adsorbed by the magnetic force during evaporation, they can remain flat to avoid wrinkling.

[0050] In some embodiments, metal photomasks span the hollow area of ​​the outer frame along a first direction and are arranged side by side along a second direction. Therefore, in the first direction, there is a splicing gap extending along the first direction between two adjacent metal photomasks. The first support plate is supported under the splicing gap between two adjacent metal photomasks along the first direction. At the same time, the first magnetic adsorption area provided on the first support plate is arranged on both sides of the metal photomasks in the first direction and can exert a force on the metal photomasks in the second direction.

[0051] In some embodiments, such as Figure 4 and Figure 6 As shown, the outer contour shape of the first magnetic adsorption area is not limited, and the specifications of the first magnetic adsorption area can be adjusted according to the size of the corresponding areas on both sides of the first support plate and the metal mask plate along the first direction and the required adsorption force. When the corresponding areas on both sides of the metal mask plate along the first direction are relatively large, or when the width of the metal mask plate in the second direction is large and a larger magnetic adsorption force is required, the width of the first magnetic adsorption area in the second direction can be appropriately increased to increase the force generated by the first magnetic adsorption area in the second direction. Conversely, when the corresponding areas on both sides of the metal mask plate along the first direction are relatively small, or when the width of the metal mask plate in the second direction is large and a smaller magnetic adsorption force is required, the width of the first magnetic adsorption area in the second direction can be appropriately reduced to reduce the force generated by the first magnetic adsorption area in the second direction.

[0052] As an optional implementation, the first magnetic adsorption area is provided with a plurality of first magnetic adsorption blocks, which are arranged in an array or in an alternating manner in the first magnetic adsorption area.

[0053] In some embodiments, such as Figure 4 As shown, the first magnetic adsorption area includes a plurality of first magnetic adsorption blocks, which are arranged in a column along a first direction on the first magnetic adsorption area of ​​the first support plate.

[0054] In some other embodiments, the first magnetic adsorption area includes a plurality of first magnetic adsorption blocks, which are arranged neatly or alternately in two or more columns along a first direction on the first magnetic adsorption area of ​​the first support plate.

[0055] In some embodiments, the shape of the first magnetic adsorption block is not limited. For example... Figure 4 As shown, the first magnetic adsorption block can be rectangular, and multiple first magnetic adsorption blocks are arranged in a certain pattern in the first magnetic adsorption area on the first support plate to form a first magnetic adsorption area with a certain external contour. Optionally, the length of the first magnetic adsorption block in the first direction can be 5.0mm to 10.0mm, and the width in the second direction can be 1.5mm to 3.0mm.

[0056] In other embodiments, the first magnetic adsorption block may also be circular or other shapes.

[0057] In some embodiments, when the first magnetic adsorption area is located at the edge of the hollow area of ​​the supporting mask, it is only necessary to provide adsorption to one side of the metal mask in the first direction. Therefore, when the first magnetic adsorption area is located at the edge of the hollow area of ​​the supporting mask, its width in the second direction can be slightly smaller, meaning that the magnetic strength and force in the second direction can be slightly smaller at the edge of the hollow area. When the first magnetic adsorption area is located inside the hollow area of ​​the supporting mask, it is necessary to provide adsorption to both sides of the metal mask in the first direction. Therefore, when the first magnetic adsorption area is located inside the hollow area of ​​the supporting mask, its width in the second direction can be increased, meaning that the magnetic strength and force in the second direction can be slightly larger at the inside of the hollow area. In other embodiments, the magnitude of the force in the second direction of the first magnetic adsorption area can also be adjusted by adjusting the magnetic strength of the magnetic material in the first magnetic adsorption area.

[0058] As an alternative implementation method, such as Figures 3 to 7As shown, at least the second support plate has a second magnetic adsorption area in the region corresponding to the non-evaporation area along the second direction, so as to adsorb the metal mask plate onto the second support plate. The magnetic strength of the second magnetic adsorption area is less than the magnetic strength of the first magnetic adsorption area.

[0059] As an alternative implementation, a second magnetic adsorption area is provided on the outer frame in the region corresponding to the non-evaporation area along the second direction, so as to adsorb the metal mask onto the outer frame.

[0060] In some embodiments, such as Figures 3 to 7 As shown, a second magnetic adsorption area is provided on the outer frame and / or the second support plate in the region corresponding to the non-evaporation area along the second direction. This second magnetic adsorption area provides a force to the metal mask in the first direction, stretching and tensioning it. Simultaneously, to ensure uniform force distribution on the metal mask in all directions, given that the metal mask already experiences a certain force in the first direction, the magnetic strength of the second magnetic adsorption area needs to be less than that of the first magnetic adsorption area. In other words, the first magnetic adsorption area provides a force in the second direction, and the second magnetic adsorption area provides a force in the first direction. By making the magnetic strength of the first magnetic adsorption area greater than that of the second magnetic adsorption area, the force provided by the first magnetic adsorption area in the second direction is greater than the force provided by the second magnetic adsorption area in the first direction. This results in a higher overall magnetic adsorption force on the metal mask in the second direction than in the first direction, thus ensuring uniform force distribution on the metal mask in both directions, balancing the force on the metal mask, preventing wrinkles, and improving evaporation yield and display yield.

[0061] In some embodiments, the specifications of the second magnetic adsorption zone can be adjusted according to the size of its placement location and the required adsorption force. For example... Figures 3 to 7 As shown, the second magnetic adsorption area is located in the region corresponding to the second support plate and the non-evaporated area in the second direction, providing an adsorption force in the second direction. The outer contour shape of the second magnetic adsorption area is not limited and can be adaptively adjusted as needed.

[0062] As an optional implementation, the second magnetic adsorption area is provided with a plurality of second magnetic adsorption blocks, which are arranged in an array or in an alternating manner in the second magnetic adsorption area.

[0063] In some embodiments, such as Figure 4 and Figure 6As shown, the second magnetic adsorption area includes multiple second magnetic adsorption blocks, which are arranged in one or more columns along the second direction on the second magnetic adsorption area of ​​the second support plate. The second magnetic adsorption blocks can be arranged neatly, staggered, or in a certain regular pattern on the second magnetic adsorption area of ​​the second support plate.

[0064] In some embodiments, the shape of the second magnetic adsorption block is not limited. For example... Figure 4 and Figure 6 As shown, the second magnetic adsorption block can be rectangular, and multiple second magnetic adsorption blocks are arranged in a certain pattern in the second magnetic adsorption area on the second support plate to form a second magnetic adsorption area with a certain external contour. Optionally, the width of the second magnetic adsorption block in the first direction can be 1.5mm to 3.0mm, and the length in the second direction can be 5.0mm to 10.0mm.

[0065] In other embodiments, the second magnetic adsorption block may also be in other shapes such as circular.

[0066] As an alternative implementation, the magnetic intensity of the second magnetic adsorption region increases from the adjacent vapor deposition region to the direction away from the vapor deposition region.

[0067] In some embodiments, such as Figure 4 and Figure 6 As shown, the magnetic intensity of the second magnetic adsorption region increases from the adjacent evaporation region to the direction away from the evaporation region. In other words, the magnetic intensity of the second magnetic adsorption region changes in a gradient in the first direction. The magnetic intensity of the second magnetic adsorption region in the adjacent evaporation region can be greater than that in the portion of the second magnetic adsorption region away from the evaporation region. That is, the force exerted on the non-evaporation region by the second magnetic adsorption region in the first direction increases from the adjacent evaporation region to the direction away from the evaporation region. This allows the force exerted on the metal mask in the first direction to have a certain gradient change, so that when the metal mask is stretched flat in the first direction, it will not affect the force exerted on the metal mask in the human direction, allowing the metal mask to be stretched flat smoothly in the human direction as well.

[0068] In some embodiments, such as Figure 3 and Figure 4 As shown, the area of ​​the second magnetic adsorption region can be gradually expanded from the adjacent vapor deposition region to the direction away from the vapor deposition region, so that the outline of the second magnetic adsorption region has a trapezoidal structure, thereby allowing the force provided by the second magnetic adsorption region to change in a gradient in the first direction.

[0069] As an alternative implementation method, such as Figures 3 to 7As shown, at least one of the outer frame, the first support plate, and the second support plate is provided with a third magnetic adsorption area in a region adjacent to the corner of the vapor deposition area, and the shape of the third magnetic adsorption area matches the corner structure of the vapor deposition area.

[0070] In some embodiments, such as Figures 3 to 7 As shown, at least one of the outer frame, the first support plate, and the second support plate has a third magnetic adsorption area in a region adjacent to the corner of the vapor deposition area. The shape of the third magnetic adsorption area matches the corner structure of the vapor deposition area, so that the corner of the vapor deposition area is adsorbed and fixed by the third magnetic adsorption area, providing forces in the first and second directions to the corner area of ​​the vapor deposition area, thus preventing wrinkles from forming at the corner area of ​​the vapor deposition area. In some embodiments, such as... Figures 3 to 7 As shown, the vapor deposition zone has irregular edges and corners. For these areas, a third magnetic adsorption zone that matches its structure can be provided. The outline of the third magnetic adsorption zone is not limited and can match the irregular edge and corner structure of the vapor deposition zone. It is arranged in a certain pattern in the area corresponding to the irregular edge and corner of the vapor deposition zone to adsorb and stretch the irregular edge and corner part of the vapor deposition zone, so as to avoid wrinkles in the irregular edge and corner part of the vapor deposition zone due to uneven force.

[0071] In some embodiments, such as Figure 4 As shown on the left, when the corners of the vapor deposition zone have a certain curvature, the third magnetic adsorption zone can be arranged in an arc shape along the corners of the vapor deposition zone. For example... Figure 4 As shown on the right, when the third magnetic adsorption area is located between the corners of two adjacent vapor deposition areas, the third magnetic adsorption area can have two arc-shaped parts to correspond to the corners of the two vapor deposition areas respectively.

[0072] As an optional implementation, the third magnetic adsorption zone is provided with a plurality of third magnetic adsorption blocks, which are arranged in a fan shape in the third magnetic adsorption zone.

[0073] In some embodiments, such as Figure 6 As shown on the left, when the corners of the vapor deposition zone have a certain curvature, the third magnetic adsorption zone can be equipped with multiple arc-shaped third magnetic adsorption blocks. These blocks are arranged in a fan shape within the third magnetic adsorption zone to provide adsorption force to the corners of the vapor deposition zone, stretching the corners in both the first and second directions. Simultaneously, the force provided by the third magnetic adsorption zone can gradually increase from the corners adjacent to the vapor deposition zone to the corners farther away, providing a gradient force to the corners of the vapor deposition zone.

[0074] As an alternative implementation, the areas of the first magnetic adsorption area, the second magnetic adsorption area, and the third magnetic adsorption area are positively correlated with the total area of ​​the mask assembly.

[0075] In some embodiments, the areas of the first, second, and third magnetic adsorption regions are positively correlated with the total area of ​​the mask assembly. That is, when the total area of ​​the mask assembly is large, for the fabrication of larger panels, the areas of the first, second, and third magnetic adsorption regions can be appropriately increased by adjusting their respective areas, thereby providing a greater force.

[0076] In some embodiments, to increase the magnetic strength and force of the first magnetic adsorption region, the area of ​​the first magnetic adsorption region can be increased, and the area of ​​the first magnetic adsorption block can also be increased. For example... Figure 6 and Figure 7 As shown, the length of the first magnetic adsorption block in the first direction can be increased to 15.0 mm to 20.0 mm, and the width of the first magnetic adsorption block in the second direction can be increased to 5.0 mm to 7.0 mm, so as to increase the force provided by the first magnetic adsorption area to the metal mask plate in the second direction.

[0077] In some embodiments, such as Figure 6 and Figure 7 As shown, in order to increase the magnetic strength and force of the second magnetic adsorption region, the area of ​​the second magnetic adsorption region can be increased, and the area of ​​the second magnetic adsorption block can also be increased.

[0078] In some embodiments, such as Figure 6 and Figure 7 As shown, in order to increase the magnetic strength and force of the third magnetic adsorption region, the area of ​​the third magnetic adsorption region can be increased, and the number of third magnetic adsorption blocks can also be increased, so that multiple third magnetic adsorption blocks are arranged in a fan shape in the area corresponding to the irregular corner of the vapor deposition region.

[0079] In some embodiments, an additional layer is added between adjacent vapor deposition zones, such as... Figure 7 The symmetrical third magnetic adsorption region shown, such as Figure 7 The magnetic strength of the third magnetic adsorption region shown is affected by other magnetic adsorption regions, such as... Figure 7 The magnetic strength of the third magnetic adsorption region shown is, for example... Figure 6 The magnetic strength of the third magnetic adsorption region shown can be adjusted by adjusting the area of ​​the magnetic adsorption region or by replacing it with a material of different magnetic strength.

[0080] In the mask assembly of this application embodiment, such as Figures 3 to 7As shown, by setting magnetic adsorption areas of different specifications at different positions of the supporting mask, the combination of these magnetic adsorption areas allows for magnetic adsorption during the evaporation process. Under the action of magnetic adsorption areas of different positions and specifications, the metal mask is subjected to balanced force in all directions, reducing or eliminating wrinkles in the metal mask. This allows the substrate to be evaporated to fit tightly with the mask assembly while eliminating wrinkles, reducing or avoiding color mixing defects in the evaporated film layer, and improving the evaporation yield and display yield.

[0081] As an optional implementation, the first magnetic adsorption block, the second magnetic adsorption block, and the third magnetic adsorption block each include a magnetically conductive structural material.

[0082] In some embodiments, the magnetically conductive structural material includes, but is not limited to, iron-nickel-cobalt alloys or iron-cobalt soft magnetic alloys. Typical magnetically conductive structural materials include 35Co-0.5Cr-Fe, 49Co-2V-Fe, 27Co-0.6Cr-Fe, or Fe-Ni-Co alloys with a Ni+Co content of approximately 46%.

[0083] As an alternative implementation, the outer frame and / or the first support plate have half-etched areas corresponding to the two sides of the first magnetic adsorption area along the first direction.

[0084] In some embodiments, to avoid large sagging at the edge of the vapor deposition area during vapor deposition, a half-etched area can be provided on the outer frame and / or the first support plate in the area corresponding to both sides of the first magnetic adsorption area along the first direction. The half-etched area increases the elastic deformation of the outer frame and / or the first support plate, making it easier to be adsorbed and attached to the substrate to be vapor deposited during vapor deposition.

[0085] As an optional implementation, the thickness of the support mask is 90μm to 110μm, and the thickness of the half-etched area is 50μm to 60μm.

[0086] In some embodiments, the thickness of the half-etched region can be adjusted according to the thickness of the supporting mask. In the embodiments of this application, the thickness of the supporting mask can be 90 μm to 110 μm, and the corresponding thickness of the half-etched region is 50 μm to 60 μm, that is, the half-etched region is thinned by 30 μm to 60 μm through etching.

[0087] As an alternative implementation, the half-cut area can be a multi-cell structure or a single-cell structure.

[0088] In some embodiments, the shape of the half-marked area can be adjusted according to design requirements. The half-marked area can be a continuous single-cell structure or multiple structures arranged intermittently.

[0089] Based on the same inventive concept, this application also proposes a vapor deposition apparatus, which includes a vapor deposition source, a magnetic plate, and the aforementioned mask assembly. The vapor deposition source is disposed on the side of the mask assembly away from the substrate to be vapor deposited, and the magnetic plate is disposed on the side of the substrate to be vapor deposited away from the mask assembly.

[0090] Since the vapor deposition apparatus provided by the present invention includes the mask assembly of the above-mentioned technical solution, the vapor deposition apparatus provided by the present invention has all the beneficial effects of the above-mentioned mask assembly, which will not be elaborated here.

[0091] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0092] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0093] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0094] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A reticle assembly, characterized by, The mask plate assembly comprises: a support mask plate comprising an outer frame with a hollow region in the middle, a plurality of first support plates arranged across the hollow region in a first direction and spaced apart on the outer frame in a second direction, and a plurality of second support plates arranged across the hollow region in the second direction and spaced apart on the outer frame in the first direction, the first direction being perpendicular to the second direction; and a plurality of metal mask plates arranged across the hollow region in the first direction and spaced apart on the outer frame in the second direction, the metal mask plates having a plurality of hollow evaporation regions and non-evaporation regions surrounding the evaporation regions, the two sides of the metal mask plates in the first direction corresponding to the outer frame and / or the first support plates, and the non-evaporation regions corresponding to at least one of the outer frame, the first support plates, and the second support plates; wherein at least the regions of the first support plates corresponding to the two sides of the metal mask plates in the first direction are provided with first magnetic adsorption regions to adsorb the metal mask plates on the first support plates, and the non-evaporation regions of the metal mask plates are adsorbed and flattened by the first magnetic adsorption regions in the second direction; the regions of the outer frame corresponding to the two sides of the metal mask plates in the first direction are provided with the first magnetic adsorption regions to adsorb the metal mask plates on the outer frame; at least the regions of the second support plates corresponding to the non-evaporation regions in the second direction are provided with second magnetic adsorption regions to adsorb the metal mask plates on the second support plates, the magnetic strength of the second magnetic adsorption regions being smaller than that of the first magnetic adsorption regions; the magnetic strength of the second magnetic adsorption regions increases from the vicinity of the evaporation regions to the direction away from the evaporation regions; at least one of the outer frame, the first support plates, and the second support plates has a third magnetic adsorption region adjacent to the corner of the evaporation region, the shape of the third magnetic adsorption region matching the corner structure of the evaporation region; the third magnetic adsorption region is provided with a plurality of third magnetic adsorption blocks, and the plurality of third magnetic adsorption blocks are arranged in a fan shape in the third magnetic adsorption region.

2. The reticle assembly of claim 1, wherein, the regions of the outer frame corresponding to the non-evaporation regions in the second direction are provided with the second magnetic adsorption regions to adsorb the metal mask plates on the outer frame.

3. The reticle assembly of claim 2, wherein, the first magnetic adsorption region is provided with a plurality of first magnetic adsorption blocks, and the plurality of first magnetic adsorption blocks are arranged in an array or staggered in the first magnetic adsorption region; the second magnetic adsorption region is provided with a plurality of second magnetic adsorption blocks, and the plurality of second magnetic adsorption blocks are arranged in an array or staggered in the second magnetic adsorption region.

4. The reticle assembly of claim 3, wherein, the first magnetic adsorption blocks, the second magnetic adsorption blocks, and the third magnetic adsorption blocks each comprise a magnetically conductive structural material.

5. The reticle assembly of claim 2, wherein, the areas of the first magnetic adsorption region, the second magnetic adsorption region, and the third magnetic adsorption region are positively correlated with the total area of the mask plate assembly.

6. The reticle assembly of claim 1, wherein, The outer frame and / or the first support plate are provided with a half-etched area corresponding to the area on both sides of the first magnetic force adsorption area along the first direction.

7. The reticle assembly of claim 6, wherein, The thickness of the support mask plate is 90-110 μm, and the thickness of the half-etched area is 50-60 μm.

8. The reticle assembly of claim 6, wherein, The half-etched area is a multi-grid structure or a single-grid structure.

9. An evaporation device, characterized by The evaporation device comprises an evaporation source, a magnetic plate and the mask plate assembly according to any one of claims 1-8, the evaporation source is arranged on the side of the mask plate assembly away from the substrate to be evaporated, and the magnetic plate is arranged on the side of the substrate to be evaporated away from the mask plate assembly.

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