Automatic unloading equipment for silicon ingot after slicing and method of using the same

Abstract

The application discloses a kind of silicon crystal bar slicing automatic discharging equipment and its use method, belong to silicon crystal bar slicing discharging technical field, the silicon crystal bar is fixedly installed with material seat, the discharging equipment includes frame, the positioning component of positioning to silicon crystal bar and the material placing component of storing to silicon crystal bar, the positioning component includes first positioning structure, second positioning structure and third positioning structure;The first positioning structure, second positioning structure and third positioning structure are connected with the frame by lifting platform;The material placing component includes discharging conveying line and the material bin of storing to silicon crystal bar, and the discharging conveying line is transmitted to discharging position by material bin.The application is positioned to silicon crystal bar by first positioning structure, second positioning structure and third positioning structure combination formation positioning component, can accurately, stably realize the positioning of silicon crystal bar, and its positioning precision is high, and precision deviation does not appear, effectively avoid the breakage of wafer.

Description

Technical Field

[0001] This invention belongs to the field of silicon crystal rod slicing and feeding technology, and particularly relates to an automatic feeding device for silicon crystal rods after slicing and its usage method. Background Technology

[0002] Semiconductor photovoltaic technology refers to a technology that converts light energy into electrical energy. Its main principle is to utilize the absorption of light and the movement of electrons by photovoltaic elements to convert electrical energy. It is mainly divided into three categories: silicon crystal photovoltaics, thin-film solar cells, and polycrystalline silicon photovoltaics.

[0003] Silicon crystal photovoltaic (PV) technology is currently the most widely used PV technology. Its cells use silicon as the main material and are made of monocrystalline or polycrystalline silicon. Silicon crystal PV offers advantages such as high efficiency, stability, and reliability, but its production cost is high. Thin-film solar cells mainly use materials such as amorphous silicon, copper indium gallium selenide (CIGS), and organic materials, and are characterized by light weight, low production cost, and high flexibility, but their efficiency is relatively lower than that of silicon crystal PV. Polycrystalline silicon PV uses high-purity silicon microcrystalline crystals, comparable to ordinary silicon crystal cells, but its manufacturing process is more advanced than that of silicon crystal PV technology. Silicon crystal rods are a commonly used type of silicon crystal.

[0004] After silicon ingots are sliced, they retain their original shape and require unloading. Chinese invention patent application number "202111309702.4" entitled "Post-Cut Wafer Unloading Fixture" discloses that "existing unloading fixtures have complex overall structures, high failure rates, and during the process of placing the diced wafers into the feed frame, cutting fluid splashes, contaminating the equipment and causing sensor misjudgments, resulting in frequent alarms." This includes a transfer machine comprising a frame assembly, a feed frame positioning assembly on the side wall of the frame assembly, a first flip-plate flattening assembly and a second flip-plate flattening assembly on the upper part of the side wall of the frame assembly, and a first pressure rod opening assembly on one side of the first flip-plate flattening assembly. In this invention... This significantly simplifies the cumbersome process of unloading, improves unloading efficiency, and simplifies the complexity of the structure, thereby reducing the failure rate and the risk of equipment contamination caused by cutting fluid splashing. The original unloading fixture after slicing utilizes mechanisms such as a flip-plate flattening assembly, a pressure rod opening assembly, and a positioning push rod cylinder, and the material frame structure is complex. During the process of placing the wafer into the material frame, high positioning accuracy is required between the robot, gripper, and material frame; any deviation can lead to wafer breakage and damage. Furthermore, due to the lack of side shielding plates and a cutting fluid collection pool at the bottom, cutting fluid splashes everywhere during placement, easily contaminating the equipment and causing sensor malfunctions, resulting in frequent failures. Therefore, we propose an automatic unloading device for silicon ingots after slicing to solve these problems. Summary of the Invention

[0005] This invention overcomes the shortcomings of the prior art by providing an automatic feeding device for silicon crystal rods after slicing and its usage method, thereby solving the problems existing in the prior art.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: an automatic unloading device for silicon crystal rods after slicing, wherein a material holder is fixedly installed on the silicon crystal rod, and the unloading device includes a frame, a positioning component for positioning the silicon crystal rod, and a feeding component for storing the silicon crystal rod. The positioning component is located above the feeding component and the positioning component can move along the length direction of the frame to place the silicon crystal rod into the feeding component.

[0007] The positioning component includes a first positioning structure, a second positioning structure, and a third positioning structure;

[0008] The first positioning structure includes a first driver and two hook plates driven by the first driver, which cooperate with both sides of the material seat.

[0009] The second positioning structure includes a second driver and a positioning block located at the driving end of the second driver, the positioning block positioning the end of the material seat;

[0010] The third positioning structure includes a third driver and a push block located at the driving end of the third driver, the push block pushing the material seat to move along its own length direction;

[0011] The first positioning structure, the second positioning structure, and the third positioning structure are all connected to the frame via a lifting platform;

[0012] The feeding assembly includes a feeding conveyor line and a hopper for storing silicon ingots. The feeding conveyor line transports the hopper to the feeding position.

[0013] In a preferred embodiment of the present invention, a lifting drive module is provided on the frame, and the lifting drive module drives the lifting platform to lift.

[0014] In a preferred embodiment of the present invention, the first positioning structure, the second positioning structure and the third positioning structure are all installed on the lifting platform, and the material seat is located below the lifting platform.

[0015] In a preferred embodiment of the present invention, the hook plate is an L-shaped structure, and the side of the material seat is provided with a protruding structure. The hook plate cooperates with the protruding structure to position the material seat.

[0016] In a preferred embodiment of the present invention, the third driver is a flipping cylinder, the pushing block pushes the protruding structure to position the material seat, the pushing block includes a flipping frame and a flipping patch, the flipping frame is a bent structure, and the flipping patch fits into the protruding structure after flipping.

[0017] In a preferred embodiment of the present invention, the positioning block is an L-shaped sheet metal part, the positioning block is provided with a positioning groove, and the end of the material seat is provided with an end protrusion. The positioning groove and the end protrusion cooperate to position the material seat.

[0018] In a preferred embodiment of the present invention, a limiting structure is provided at both the beginning and end of the feeding conveyor line. The limiting structure includes a limiting cylinder and a limiting roller for limiting the end of the hopper. The limiting roller is connected to the limiting cylinder through a telescopic frame. A collection pool is provided below the feeding conveyor line.

[0019] In a preferred embodiment of the present invention, a compressible buffer is provided in the hopper, and multiple sets of opening and closing components are provided on the frame. The opening and closing components include a first cylinder, a second cylinder located at the driving end of the first cylinder, and a pressure block located at the driving end of the second cylinder. The pressure block cooperates with the end of the buffer. When the first cylinder drives the second cylinder, the pressure block presses the buffer tightly.

[0020] In a preferred embodiment of the present invention, there are two sets of buffer components located on both sides inside the hopper. A reset torsion spring is provided on the hopper, and the reset torsion spring is connected to the end of the buffer component. When the opening and closing assembly is reset, the buffer component is reset under the action of the reset torsion spring.

[0021] This invention also discloses a method for using an automatic unloading device after silicon ingot slicing, comprising the following steps:

[0022] S1. The cut silicon ingots are moved to the bottom of the lifting platform by the robot, and the hook plate of the first positioning structure performs coarse positioning on both sides of the material seat.

[0023] S2. The second driver of the second positioning structure drives the positioning block to move, so that the positioning block cooperates with the end of the material seat to position the end of the material seat;

[0024] S3, the third driver of the third positioning structure drives the push block to rotate, and the push block rotates to drive the material seat to move, thus completing the precise positioning of the material seat;

[0025] S4. The hopper is transported to the unloading position by the unloading conveyor line. The limit cylinder of the limit structure drives the limit roller to move. The limit roller rolls and limits the two ends of the hopper to adjust the position of the hopper.

[0026] S5. The second cylinder of the opening and closing assembly drives the pressure block to move, so that the pressure block is aligned with the end of the buffer. The first cylinder drives the second cylinder to move, and the buffer is pressed tightly under the action of the pressure block.

[0027] S6. The lifting drive module drives the lifting platform to descend until the silicon crystal rod falls into the hopper.

[0028] S7, the lifting drive module and the opening and closing components are reset, and the buffer clamps the silicon crystal rod from both sides under the reset action of the reset torsion spring.

[0029] This invention addresses the shortcomings of the prior art and has the following beneficial effects:

[0030] (1) The present invention uses a combination of a first positioning structure, a second positioning structure and a third positioning structure to form a positioning component for silicon crystal rods, which can accurately and stably position silicon crystal rods. Its positioning accuracy is high and there will be no accuracy deviation, effectively avoiding the situation of wafer breakage.

[0031] (2) The first positioning structure, the second positioning structure and the third positioning structure are all integrated on the lifting platform. The high degree of integration makes the material frame structure used simpler, which can save costs and occupy less space.

[0032] (3) The existence of the collection pool can collect the cutting fluid, preventing it from splashing everywhere and affecting the normal use of electronic components on the equipment. Therefore, it can reduce the failure rate of the equipment and reduce the maintenance cost of the equipment. Attached Figure Description

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0034] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram of the structure of a silicon crystal rod according to a preferred embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of the positioning component according to a preferred embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the first positioning structure and the silicon crystal rod in a preferred embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of the cooperation between the second positioning structure and the silicon crystal rod in a preferred embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the cooperation between the third positioning structure and the silicon crystal rod in a preferred embodiment of the present invention;

[0040] Figure 7 This is a partial structural schematic diagram of a preferred embodiment of the present invention;

[0041] Figure 8 This is a partial structural diagram of a preferred embodiment of the present invention;

[0042] Figure 9 for Figure 8 Top view;

[0043] Figure 10 A flowchart of a preferred embodiment of the present invention;

[0044] In the diagram: 100, silicon crystal rod; 110, material holder; 1101, protruding structure; 1102, end protrusion;

[0045] 10. Frame; 11. Lifting drive module; 20. Positioning component; 21. First positioning structure; 211. First driver; 212. Hook plate; 22. Second positioning structure; 221. Second driver; 222. Positioning block; 2221. Positioning groove; 23. Third positioning structure; 231. Third driver; 232. Push block; 2321. Tilting frame; 2322. Tilting patch; 30. Feeding component; 31. Feeding conveyor line; 32. Hopper; 321. Buffer; 40. Lifting platform; 50. Limiting structure; 51. Limiting cylinder; 52. Limiting roller; 60. Telescopic frame; 70. Collection pool; 80. Opening and closing component; 81. First cylinder; 82. Second cylinder; 83. Pressing block; 90. Reset torsion spring. Detailed Implementation

[0046] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0047] Example 1

[0048] Combination Figures 1 to 9 As shown, this embodiment provides an automatic unloading device for silicon ingots 100 after slicing. The device uses a combination of a first positioning structure 21, a second positioning structure 22, and a third positioning structure 23 to form a positioning component 20 for the silicon ingots 100. This component can accurately and stably position the silicon ingots 100 with high positioning accuracy and no accuracy deviation, effectively preventing wafer breakage.

[0049] like Figure 2As shown, a material holder 110 is fixedly installed on the silicon crystal rod 100 (i.e., the material holder 110 is fixedly connected to the silicon crystal rod 100). The side of the material holder 110 is provided with a protruding structure 1101, and the end of the material holder 110 is provided with an end protrusion 1102. The first positioning structure 21 cooperates with the protruding structure 1101 of the material holder 110 to perform coarse positioning of the silicon crystal rod 100, while the second positioning structure 22 can cooperate with the end protrusion of the material holder 110 to perform secondary positioning of the silicon crystal rod 100.

[0050] Combination Figure 1 and Figure 3 As shown, the unloading equipment includes a frame 10, a positioning component 20 for positioning the silicon ingot 100, and a feeding component 30 for storing the silicon ingot 100. The positioning component 20 is located above the feeding component 30 and can move along the length of the frame 10 to place the silicon ingot 100 into the feeding component 30. A lifting drive module 11 is provided on the frame 10. The positioning component 20 includes a first positioning structure 21, a second positioning structure 22, and a third positioning structure 23. The first positioning structure 21, the second positioning structure 22, and the third positioning structure 23 are all positioned by the silicon ingot 100. Both structure 22 and the third positioning structure 23 are connected to the frame 10 through the lifting platform 40. The lifting drive module 11 drives the lifting platform 40 to lift. In this embodiment, the lifting drive module 11 includes a servo geared motor, a reducer, a coupling, a connecting bearing seat, and a lead screw. The servo geared motor drives the lead screw through the reducer, and the coupling and the connecting bearing seat can connect the lead screw to realize the drive of the lead screw. The lead screw is threadedly connected to the lifting platform 40. When the lead screw rotates, the lifting platform 40 will perform lifting operations.

[0051] Specifically, the first positioning structure 21, the second positioning structure 22, and the third positioning structure 23 are all installed on the lifting platform 40. When the lifting platform 40 is in lifting operation, the first positioning structure 21, the second positioning structure 22, and the third positioning structure 23 will all move up and down. The material seat 110 is located below the lifting platform 40, which facilitates the first positioning structure 21, the second positioning structure 22, and the third positioning structure 23 to position the silicon ingot 100 through the material seat 110.

[0052] Combination Figure 3 and Figure 4As shown, the first positioning structure 21 includes a first driver 211 and hook plates 212 driven by the first driver 211. There are two hook plates 212, which cooperate with both sides of the material seat 110. In this embodiment, the first driver 211 consists of a servo motor, a reducer, a synchronous wheel set, and positive and negative trapezoidal lead screws. The servo motor is decelerated by the reducer and drives the positive and negative trapezoidal lead screws to rotate by the synchronous wheel set. The positive and negative trapezoidal lead screws are threadedly connected to the two hook plates 212. When the positive and negative trapezoidal lead screws rotate, the two hook plates 212 move in opposite directions or in the opposite direction to clamp and position the material seat 110. The material seat 110 has protruding structures 1101 on both sides. The hook plates 212 cooperate with the protruding structures 1101 to perform coarse positioning of the material seat 110.

[0053] Specifically, the hook plate 212 is an L-shaped structure. The hook plate 212 cooperates with the protruding structure 1101 to position the material seat 110. At this time, the material seat 110 can always move along its own length direction. Therefore, the first positioning structure 21 achieves coarse positioning of the material seat 110.

[0054] Combination Figure 3 and Figure 5 As shown, the second positioning structure 22 includes a second driver 221 and a positioning block 222 located at the driving end of the second driver 221. The positioning block 222 positions the end of the material seat 110. In this embodiment, the second driver 221 is a cylinder. The second driver 221 drives the positioning block 222 to move from bottom to top to position the end of the material seat 110.

[0055] Specifically, the positioning block 222 is an L-shaped sheet metal part. The positioning block 222 is provided with a positioning groove 2221. The positioning groove 2221 cooperates with the end protrusion 1102 to position the material seat 110, prevent the material seat 110 from deflecting to the side, and complete the secondary positioning of the material seat 110.

[0056] Combination Figure 3 and Figure 6 As shown, the third positioning structure 23 includes a third driver 231 and a push block 232 located at the driving end of the third driver 231. The push block 232 pushes the material seat 110 to move along its own length direction. The third driver 231 is a tilting cylinder. The push block 232 pushes the protruding structure 1101 to position the material seat 110. After the third driver 231 drives the push block 232 to tilt 90 degrees, the push block 232 pushes the material seat 110 to reach the designated position, completing the final positioning of the material seat 110.

[0057] In this embodiment, the push block 232 includes a flipping frame 2321 and a flipping patch 2322. The flipping frame 2321 has a bent structure. After flipping, the flipping patch 2322 fits into the protruding structure 1101. The third driver 231 drives the flipping frame 2321 to flip. The flipping frame 2321 drives the flipping patch 2322 to flip. As the flipping patch 2322 continues to approach the surface of the material seat 110, it pushes the material seat 110 to move, thus completing the positioning of the material seat 110.

[0058] In this embodiment, the first positioning structure 21, the second positioning structure 22, and the third positioning structure 23 are all integrated on the lifting platform 40. The high degree of integration makes the material frame structure simpler, saving costs and reducing the footprint. Furthermore, the combination of the first positioning structure 21, the second positioning structure 22, and the third positioning structure 23 forms the positioning component 20 for the silicon ingot 100, which can accurately and stably position the silicon ingot 100. The positioning accuracy is high, and there will be no accuracy deviation, effectively avoiding the breakage of the wafer.

[0059] like Figure 7 As shown, the feeding assembly 30 includes a feeding conveyor line 31 and a hopper 32 for storing silicon ingots 100. The feeding conveyor line 31 transports the hopper 32 to the feeding position. A collection pool 70 is provided below the feeding conveyor line 31. By setting up the collection pool 70, the cutting fluid can be collected, preventing the cutting fluid from splashing everywhere and affecting the normal use of electronic components on the equipment. Therefore, the failure rate of the equipment can be reduced and the maintenance cost of the equipment can be reduced.

[0060] Combination Figure 8 and Figure 9 As shown, the beginning and end of the feeding conveyor line 31 are equipped with limit structures 50. The limit structure 50 includes a limit cylinder 51 and a limit roller 52 for limiting the end of the hopper 32. The limit roller 52 is connected to the limit cylinder 51 through a telescopic frame 60. When the hopper 32 is conveyed to the predetermined position under the action of the feeding conveyor line 31, the limit cylinder 51 of the limit structure 50 drives the limit roller 52 to move. The limit rollers 52 located at both ends of the hopper 32 limit the hopper 32, so that the hopper 32 is in the standard position, which prepares for the subsequent feeding of silicon ingots 100 and ensures the subsequent feeding accuracy.

[0061] like Figure 9As shown, a compressible buffer 321 is provided inside the hopper 32, and multiple sets of opening and closing assemblies 80 are provided on the frame 10. Each opening and closing assembly 80 includes a first cylinder 81, a second cylinder 82 located at the driving end of the first cylinder 81, and a pressure block 83 located at the driving end of the second cylinder 82. The pressure block 83 cooperates with the end of the buffer 321. When the first cylinder 81 drives the second cylinder 82, the pressure block 83 presses the buffer 321 tightly. In this embodiment, the buffer 321 is made of sponge composite rubber material, and the opening and closing assembly... There are four sets of opening and closing components 80, which are arranged at both ends of the two buffers 321. The four sets of opening and closing components 80 can stably squeeze the buffers 321, increasing the material discharge space in the hopper 32, making it easier to put the silicon crystal rod 100 into the hopper 32. When the opening and closing components 80 are in use, the second cylinder 82 drives the pressure block 83 to move, so that the pressure block 83 corresponds to the end of the buffer 321. Then the first cylinder 81 drives the second cylinder 82 to move, so that the pressure block 83 can press the end of the buffer 321.

[0062] In this embodiment, there are two sets of buffer members 321 located on both sides inside the hopper 32. A reset torsion spring 90 is provided on the hopper 32, and the reset torsion spring 90 is connected to the end of the buffer member 321. When the opening and closing assembly 80 is reset, the buffer member 321 is reset under the action of the reset torsion spring 90. When the opening and closing assembly 80 presses the buffer member 321, the reset torsion spring 90 is stretched, and at this time, elastic potential energy is stored. After the silicon crystal rod 100 is put into the hopper 32, the opening and closing assembly 80 is reset, and the reset torsion spring 90 is automatically reset, so that the buffer member 321 clamps the silicon crystal rod 100.

[0063] In actual use, the cutting silicon ingot 100 maintains its original shape after being cut. Under the transfer action of the robot, the silicon ingot 100 is moved to below the lifting platform 40. At this time, the first driver 211 of the first positioning structure 21 drives the hook plate 212 to move, clamping both sides of the material holder 110 to achieve coarse positioning. Then, the second driver 221 of the second positioning structure 22 drives the positioning block 222 to move, positioning the two ends of the material holder 110. After positioning, the second positioning structure 22 resets. Then, the third driver 231 of the third positioning structure 23 drives the pushing block 232 to rotate, pushing the material holder 110 to move during rotation, thus bringing the material holder 110 to the designated position. In the final positioning of the paired material holders 110, during the positioning process of the material holders 110, the material bins 32 are simultaneously conveyed to the unloading position via the unloading conveyor line 31. The limiting structure 50 limits both ends of the material bins 32, so that the material bins 32 are in the standard position. Then, the second cylinder 82 of the opening and closing assembly 80 drives the pressure block 83 to move, so that the pressure block 83 corresponds to the end position of the buffer 321. The first cylinder 81 drives the second cylinder 82 to move, so that the pressure block 83 presses the end of the buffer 321. At this time, the space in the material bins 32 is sufficient for the silicon crystal rods 100 to enter. Then, under the action of the lifting drive module 11, the lifting platform 40 is driven to move, so that the silicon crystal rods 100 fall into the material bins 32. After the silicon crystal rods 100 fall in, the opening and closing assembly 80 resets, and the reset torsion spring 90 automatically resets, so that the buffer 321 clamps the silicon crystal rods 100.

[0064] Example 2

[0065] like Figure 10 As shown in the figure, this embodiment discloses a method for using an automatic unloading device after slicing a silicon ingot 100, including the following steps:

[0066] S1. The cut silicon ingot 100 is moved to the bottom of the lifting platform 40 under the action of the robot (although the silicon ingot 100 is cut, it always maintains its original shape). The hook plate 212 of the first positioning structure 21 performs rough positioning on both sides of the material seat 110. There are two hook plates 212, which support and position the material seat 110 from both sides, so that the material seat 110 is initially fixed.

[0067] S2. The second driver 221 of the second positioning structure 22 drives the positioning block 222 to move, so that the positioning block 222 cooperates with the end of the material seat 110 to position the end of the material seat 110. The positioning block 222 is provided with a positioning groove 2221. During the process of the second driver 221 driving the positioning block 222 to approach the end of the material seat 110, the positioning groove 2221 cooperates with the end protrusion 1102 of the material seat 110 to realize the positioning of the material seat 110. The material seat 110 is fixedly connected to the silicon crystal rod 100, thus realizing the secondary positioning of the silicon crystal rod 100.

[0068] S3. The third driver 231 of the third positioning structure 23 drives the push block 232 to rotate. During the rotation of the push block 232, the material seat 110 is moved to complete the precise positioning of the material seat 110. Under the action of the third driver 231, the push block 232 rotates 90 degrees and pushes the material seat 110, causing the silicon crystal rod 100 to move along its own length direction, and finally the silicon crystal rod 100 is in the standard position, completing the final positioning of the silicon crystal rod 100.

[0069] S4. The hopper 32 is conveyed to the unloading position via the unloading conveyor line 31. The limiting cylinder 51 of the limiting structure 50 drives the limiting roller 52 to move. The limiting roller 52 rolls and limits the two ends of the hopper 32 to adjust the position of the hopper 32. In this embodiment, the unloading conveyor line 31 is a roller conveyor line. When the hopper 32 reaches the predetermined position, the limiting cylinder 51 drives the limiting roller 52 to move. Under the action of the limiting roller 52, the two ends of the hopper 32 are limited to achieve the positioning of the hopper 32.

[0070] S5. The second cylinder 82 of the opening and closing assembly 80 drives the pressure block 83 to move, so that the pressure block 83 is aligned with the end of the buffer 321. The first cylinder 81 drives the second cylinder 82 to move, and the buffer 321 is pressed tightly under the action of the pressure block 83. There are four sets of opening and closing assemblies 80, located at the ends of the two buffers 321. The four sets of opening and closing assemblies 80 are started at the same time to press the buffer 321, expand the space in the hopper 32, and facilitate the silicon crystal rod 100 to fall into the hopper 32.

[0071] S6. The lifting drive module 11 drives the lifting platform 40 to descend until the silicon crystal rod 100 falls into the hopper 32. After the silicon crystal rod 100 falls into the hopper 32, the lifting drive module 11 drives the lifting platform 40 to reset.

[0072] S7, lifting drive module 11 and opening / closing assembly 80 are reset. Under the reset action of reset torsion spring 90, buffer 321 clamps silicon crystal rod 100 from both sides. During the squeezing process of opening / closing assembly 80, reset torsion spring 90 stores elastic potential energy. After opening / closing assembly 80 is reset, buffer 321 is automatically reset under the action of reset torsion spring 90, clamping silicon crystal rod 100 located in hopper 32, thus achieving buffering of silicon crystal rod 100.

[0073] The buffer 321 used in this embodiment is made of sponge composite rubber, which can further improve the buffering effect on the silicon crystal rod 100 and ensure the stability of the silicon crystal rod 100 in the hopper 32.

[0074] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. An automatic unloading device for silicon ingots after slicing, wherein a material holder (110) is fixedly installed on the silicon ingot (100), the unloading device includes a frame (10), a positioning component (20) for positioning the silicon ingot (100), and a feeding component (30) for storing the silicon ingot (100), wherein the positioning component (20) is located above the feeding component (30) and the positioning component (20) is movable along the length direction of the frame (10) to place the silicon ingot (100) into the feeding component (30); characterized in that, The positioning component (20) includes a first positioning structure (21), a second positioning structure (22), and a third positioning structure (23); The first positioning structure (21) includes a first driver (211) and a hook plate (212) driven by the first driver (211). There are two hook plates (212) and they cooperate with both sides of the material seat (110). The second positioning structure (22) includes a second driver (221) and a positioning block (222) located at the driving end of the second driver (221), wherein the positioning block (222) positions the end of the material holder (110); The third positioning structure (23) includes a third driver (231) and a push block (232) located at the driving end of the third driver (231). The push block (232) pushes the material seat (110) to move along its own length direction. The first positioning structure (21), the second positioning structure (22), and the third positioning structure (23) are all connected to the frame (10) via a lifting platform (40); The feeding assembly (30) includes a feeding conveyor line (31) and a hopper (32) for storing silicon ingots (100). The feeding conveyor line (31) transports the hopper (32) to the feeding position. The hopper (32) is provided with compressible buffers (321). There are two sets of buffers (321) located on both sides inside the hopper (32). The frame (10) is provided with multiple sets of opening and closing components (80). Each opening and closing component (80) includes a first cylinder (81), a second cylinder (82) located at the driving end of the first cylinder (81), and a pressure block (83) located at the driving end of the second cylinder (82). The pressure block (83) cooperates with the end of the buffer (321). The first cylinder (81) drives the second cylinder (82), and the pressure block (83) presses the buffer (321) tightly, thereby increasing the material discharge space inside the hopper (32).

2. The automatic unloading device for silicon ingot slicing according to claim 1, characterized in that, A lifting drive module (11) is provided on the frame (10), and the lifting drive module (11) drives the lifting platform (40) to lift.

3. An automatic unloading device for silicon ingots after slicing, as described in claim 1 or 2, characterized in that, The first positioning structure (21), the second positioning structure (22) and the third positioning structure (23) are all installed on the lifting platform (40), and the material seat (110) is located below the lifting platform (40).

4. The automatic unloading device for silicon ingots after slicing according to claim 1, characterized in that, The hook plate (212) is an L-shaped structure, and the material seat (110) has a protruding structure (1101) on its side. The hook plate (212) cooperates with the protruding structure (1101) to position the material seat (110).

5. The automatic unloading device for silicon ingots after slicing according to claim 4, characterized in that, The third actuator (231) is a tilting cylinder. The push block (232) pushes the protruding structure (1101) to position the material seat (110). The push block (232) includes a tilting frame (2321) and a tilting patch (2322). The tilting frame (2321) is a bent structure. The tilting patch (2322) fits against the protruding structure (1101) after tilting.

6. The automatic unloading device for silicon ingots after slicing according to claim 1, characterized in that, The positioning block (222) is an L-shaped sheet metal part. The positioning block (222) is provided with a positioning groove (2221). The end of the material seat (110) is provided with an end protrusion (1102). The positioning groove (2221) cooperates with the end protrusion (1102) to position the material seat (110).

7. The automatic unloading device for silicon ingots after slicing according to claim 1, characterized in that, The feeding conveyor line (31) is provided with a limit structure (50) at both the beginning and the end. The limit structure (50) includes a limit cylinder (51) and a limit roller (52) for limiting the end of the hopper (32). The limit roller (52) is connected to the limit cylinder (51) through a telescopic frame (60). A collection pool (70) is provided below the feeding conveyor line (31).

8. The automatic unloading device for silicon ingots after slicing according to claim 7, characterized in that, The hopper (32) is provided with a reset torsion spring (90), which is connected to the end of the buffer (321). When the opening and closing assembly (80) is reset, the buffer (321) is reset under the action of the reset torsion spring (90).

9. A method of using an automatic unloading device for silicon ingots after slicing, applied to the automatic unloading device for silicon ingots after slicing as described in claim 8, characterized in that, Includes the following steps: S1. The cut silicon ingot (100) is moved to the lower part of the lifting platform (40) under the action of the robot. The hook plate (212) of the first positioning structure (21) performs rough positioning on both sides of the material seat (110). S2. The second driver (221) of the second positioning structure (22) drives the positioning block (222) to move, so that the positioning block (222) cooperates with the end of the material seat (110) to position the end of the material seat (110); S3, the third driver (231) of the third positioning structure (23) drives the push block (232) to rotate. During the rotation of the push block (232), it pushes the material seat (110) to move, thus completing the precise positioning of the material seat (110). S4. The hopper (32) is conveyed to the unloading position via the unloading conveyor line (31). The limiting cylinder (51) of the limiting structure (50) drives the limiting roller (52) to move. The limiting roller (52) rolls and limits the two ends of the hopper (32) to adjust the position of the hopper (32). S5. The second cylinder (82) of the opening and closing assembly (80) drives the pressure block (83) to move, so that the pressure block (83) is aligned with the end of the buffer (321). The first cylinder (81) drives the second cylinder (82) to move, and the buffer (321) is pressed under the action of the pressure block (83). S6. The lifting drive module (11) drives the lifting platform (40) to descend until the silicon crystal rod (100) falls into the hopper (32); S7, the lifting drive module (11) and the opening and closing assembly (80) are reset, and the buffer (321) clamps the silicon crystal rod (100) from both sides under the reset action of the reset torsion spring (90).

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