PCB stacking equipment and stacking method

Abstract

The application discloses a PCB stacking matching equipment and a stacking matching method, and relates to the technical field of PCB production, and can realize two-way matching stacking, and can improve the production capacity, production efficiency and product quality of PCB core plate matching stacking.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of printed circuit board, and particularly to a PCB stacking matching equipment and a stacking matching method. BACKGROUND

[0002] Traditional printed circuit board matching equipment usually needs manual operation, and errors are prone to occur, which affects production efficiency and product quality. Especially with the continuous miniaturization and precision of modern electronic products, higher requirements are put forward for the alignment capability of high multi-layer printed circuit boards (PCB), the stacking number increases, and the efficiency requirement of the stacking matching equipment is higher and higher. Therefore, it is an urgent need to develop an automatic printed circuit board stacking matching equipment with high efficiency.

[0003] When the printed circuit board is used for high multi-layer board, in order to realize efficient matching and correct sequence of PCB core boards, the matching method, matching position, and positioning mode are often performed separately, and the number of layers of the PCB is not fixed. The existing stacking and matching configuration can only play the maximum efficiency in one layer number, and is very limited in high layer number board. SUMMARY

[0004] The present application provides a PCB stacking matching equipment and a stacking matching method, which can realize bidirectional matching and stacking, and can improve the production capacity, production efficiency and product quality of PCB core board matching and stacking.

[0005] According to one aspect of the present application, a PCB stacking matching equipment is provided, comprising:

[0006] a production control system, a first board receiving machine, a first punching machine, a first board placing machine, a multi-station matching machine, a second board placing machine, a second punching machine and a second board receiving machine; wherein the production control system is in communication connection with the first board receiving machine, the first punching machine, the first board placing machine, the multi-station matching machine, the second board placing machine, the second punching machine and the second board receiving machine; the first board receiving machine, the first punching machine, the first board placing machine, the multi-station matching machine, the second board placing machine, the second punching machine and the second board receiving machine are arranged in a straight line in sequence;

[0007] The multi-station matching machine is used for receiving the first production instruction and the second production instruction sent by the production control system, storing multiple types of PCB core boards according to the first production instruction, and transmitting the multiple types of PCB core boards to the first board placing machine according to the preset sequence information in the direction of the multi-station matching machine pointing to the first board receiving machine, and sequentially transmitting the multiple types of PCB core boards to the second board placing machine according to the preset sequence information in the direction of the multi-station matching machine pointing to the second board receiving machine;

[0008] The first plate placing machine is configured to receive a third production instruction sent by the production control system, confirm the PCB core plate length and width size information, target point size and target point position information according to the third production instruction, and transmit the PCB core plate with the confirmed PCB core plate length and width size information, target point size and target point position information to the first punching machine after pre-alignment at a preset position;

[0009] The second plate placing machine is configured to receive a fourth production instruction sent by the production control system, confirm the PCB core plate length and width size information, target point size and target point position information according to the fourth production instruction, and transmit the PCB core plate with the confirmed PCB core plate length and width size information, target point size and target point position information to the second punching machine after pre-alignment at a preset position;

[0010] The first punching machine is configured to receive a fifth production instruction sent by the production control system, confirm the first punching machine die size according to the fifth production instruction, and transmit the pre-aligned PCB core plate to the first plate collecting machine after punching;

[0011] The second punching machine is configured to receive a sixth production instruction sent by the production control system, confirm the second punching machine die size according to the sixth production instruction, and transmit the pre-aligned PCB core plate to the second plate collecting machine after punching;

[0012] The first plate collecting machine is configured to receive a seventh production instruction sent by the production control system, confirm the PCB core plate length and width size information according to the seventh production instruction, collect the punched PCB core plate with the confirmed PCB core plate length and width size information, and transfer the punched PCB core plate to the first carrier;

[0013] The second plate collecting machine is configured to receive an eighth production instruction sent by the production control system, confirm the PCB core plate length and width size information according to the eighth production instruction, collect the punched PCB core plate with the confirmed PCB core plate length and width size information, and transfer the punched PCB core plate to the second carrier.

[0014] Optionally, the multi-station matching machine comprises a first mechanical arm, a first conveying device, a second conveying device and a plurality of machine loading positions arranged in two rows in a straight line; the arrangement direction of the plurality of machine loading positions in each row is the direction in which the first plate collecting machine points to the second plate collecting machine;

[0015] The upper machine position is configured to receive a first production instruction sent by a production control system and store multiple types of PCB core boards according to the first production instruction; the first mechanical arm is configured to receive a second production instruction sent by the production control system and sequentially pick up the PCB core boards from the upper machine position to the first conveying device or the second conveying device according to a preset order information; the first conveying device is configured to transmit the multiple types of PCB core boards to the first board placing machine according to the preset order information in a direction of the multi-station matching machine pointing to the first board collecting machine; and the second conveying device is configured to transmit the multiple types of PCB core boards to the second board placing machine according to the preset order information in a direction of the multi-station matching machine pointing to the second board collecting machine.

[0016] Optionally, the first conveying device and the second conveying device are bidirectional conveying belts or bidirectional conveying belts.

[0017] Optionally, the multi-station matching machine further comprises an upper machine code reader.

[0018] The upper machine code reader is configured to receive a second production instruction sent by a production control system, read the code on each PCB core board according to the second production instruction, and check the order of each PCB core board.

[0019] Optionally, the first board placing machine and the second board placing machine are both provided with a visual camera, the first board placing machine is further provided with a second mechanical arm, and the second board placing machine is further provided with a third mechanical arm.

[0020] The visual camera is configured to collect target point and image information of the PCB core board; the second mechanical arm is configured to correct the position of the PCB core board on the first board placing machine and transmit the corrected PCB core board on the first board placing machine to the first punching machine; and the third mechanical arm is configured to correct the position of the PCB core board on the second board placing machine and transmit the corrected PCB core board on the second board placing machine to the second punching machine.

[0021] Optionally, the visual camera is a CCD industrial camera or a video camera.

[0022] Optionally, the punching machine is a CCD automatic alignment punching machine, which can automatically calculate the number of punching and control the service life of the punching die.

[0023] Optionally, the PCB stacking matching equipment further comprises:

[0024] The brown device, the stacking device and the pressing device; the brown device comprises a first brown device and a second brown device, the stacking device comprises a first stacking device and a second stacking device, and the pressing device comprises a first pressing device and a second pressing device.

[0025] The PCB core plate punched by the first punching machine is transmitted to the first brown device, the PCB core plate after brown treatment is transmitted to the first stacking device by the first brown device, the stacked PCB core plates are transmitted to the first pressing device by the first stacking device, and the pressed PCB core plates are transmitted to the first plate collector by the first pressing device; the PCB core plate punched by the second punching machine is transmitted to the second brown device, the PCB core plate after brown treatment is transmitted to the second stacking device by the second brown device, the stacked PCB core plates are transmitted to the second pressing device by the second stacking device, and the pressed PCB core plates are transmitted to the second plate collector by the second pressing device.

[0026] The brown device is used for brown treatment of the punched PCB core plates; the stacking device is used for stacking the brown treated PCB core plates; and the pressing device is used for pressing the stacked PCB core plates.

[0027] According to another aspect of the present application, a PCB stacking matching method is provided, which is executed by using the PCB stacking matching device according to any of the embodiments of the present application, and the stacking matching method comprises:

[0028] The multi-station matching machine receives the first production instruction and the second production instruction sent by the production control system, stores the PCB core plates according to the first production instruction, and transmits the PCB core plates to the first plate collector according to the preset order information in the direction of the first plate collector according to the second production instruction; and the PCB core plates are sequentially transmitted to the second plate collector according to the preset order information in the direction of the second plate collector.

[0029] The first plate collector receives the third production instruction sent by the production control system, confirms the PCB core plate length and width size information, target point size and target point position information according to the third production instruction, and transmits the PCB core plate after pre-alignment at the preset position to the first punching machine.

[0030] The second plate collector receives the fourth production instruction sent by the production control system, confirms the PCB core plate length and width size information, target point size and target point position information according to the fourth production instruction, and transmits the PCB core plate after pre-alignment at the preset position to the second punching machine.

[0031] The first punching machine receives the fifth production instruction sent by the production control system, confirms the first punching machine mold size according to the fifth production instruction, and transmits the pre-aligned PCB core plate after punching to the first plate collector.

[0032] The second punching machine receives the sixth production instruction sent by the production control system, confirms the mold size of the second punching machine according to the sixth production instruction, and after confirming the mold size of the second punching machine, the pre-aligned PCB core plate is punched and then transmitted to the second plate receiving machine;

[0033] The first plate receiving machine receives the seventh production instruction sent by the production control system, confirms the length and width size information of the PCB core plate according to the seventh production instruction, collects the punched PCB core plate with the confirmed length and width size information, and transfers the punched PCB core plate to the first carrier;

[0034] The second plate receiving machine receives the eighth production instruction sent by the production control system, confirms the length and width size information of the PCB core plate according to the eighth production instruction, collects the punched PCB core plate with the confirmed length and width size information, and transfers the punched PCB core plate to the second carrier.

[0035] Optionally, the multi-station matching machine comprises a first mechanical hand, a first conveying device, a second conveying device, and a plurality of machine loading positions arranged in a straight line;

[0036] The multi-station matching machine receives the first production instruction and the second production instruction sent by the production control system; the multi-station matching machine stores a plurality of types of PCB core plates according to the first production instruction, and transmits the plurality of types of PCB core plates to the first plate placing machine in a preset order along a direction in which the multi-station matching machine points to the first plate receiving machine according to the second production instruction, and sequentially transmits the plurality of types of PCB core plates to the second plate placing machine along a direction in which the multi-station matching machine points to the second plate receiving machine, comprising:

[0037] The machine loading position receives the first production instruction sent by the production control system, and stores a plurality of types of PCB core plates according to the first production instruction;

[0038] The first mechanical hand receives the second production instruction sent by the production control system, and sequentially grabs the PCB core plates from the machine loading position to the first conveying device or the second conveying device according to the preset order information;

[0039] The first conveying device transmits the plurality of types of PCB core plates to the first plate placing machine in a preset order along a direction in which the multi-station matching machine points to the first plate receiving machine;

[0040] The second conveying device transmits the plurality of types of PCB core plates to the second plate placing machine in a preset order along a direction in which the multi-station matching machine points to the second plate receiving machine.

[0041] The PCB stacking supporting equipment provided by the technical scheme of the embodiment of the application comprises: a production control system, a first plate collecting machine, a first punching machine, a first plate placing machine, a multi-station supporting machine, a second plate placing machine, a second punching machine and a second plate collecting machine; wherein the production control system is in communication connection with the first plate collecting machine, the first punching machine, the first plate placing machine, the multi-station supporting machine, the second plate placing machine, the second punching machine and the second plate collecting machine; the first plate collecting machine, the first punching machine, the first plate placing machine, the multi-station supporting machine, the second plate placing machine, the second punching machine and the second plate collecting machine are arranged in a straight line in sequence. The multi-station supporting machine is used for storing multiple types of PCB core boards according to a first production instruction, transmitting the multiple types of PCB core boards to the first plate placing machine in a preset order according to a second production instruction in a direction of the multi-station supporting machine pointing to the first plate collecting machine, and transmitting the multiple types of PCB core boards to the second plate placing machine in a preset order in a direction of the multi-station supporting machine pointing to the second plate collecting machine. Bidirectional supporting automation connection design can be realized, so that bidirectional supporting of the same product, supporting of a single product and bidirectional simultaneous supporting of different products can be realized, flexible production scheduling can be realized, and the idle waiting of supporting stations can be avoided, the production efficiency is improved, in addition, the number of stations of the multi-station supporting machine can be increased based on product upgrading (increase in the number of layers), flexibility is increased, the supporting capacity of the whole product is increased, and the first plate collecting machine, the first punching machine, the first plate placing machine, the multi-station supporting machine, the second plate placing machine, the second punching machine and the second plate collecting machine do not need manual operation throughout the process, product quality reduction caused by manual error is reduced, and full-automatic production can improve product quality.

[0042] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the application, nor is it used to limit the scope of the application. Other features of the application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creating laborious work.

[0044] Figure 1 is a schematic diagram of a PCB stacking supporting equipment provided by the first embodiment of the application;

[0045] Figure 2 is a flowchart of a PCB stacking supporting method provided by the second embodiment of the application;

[0046] Figure 3 is Figure 2 is a detailed flowchart of a PCB stacking supporting method included in S110. DETAILED DESCRIPTION

[0047] In order to make the personnel in the technical field better understand the present application scheme, the technical scheme in the embodiment of the present application will be clearly and completely described below in combination with the drawings in the embodiment of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor should belong to the scope of protection of the present application.

[0048] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0049] Embodiment one

[0050] The embodiment of the present application provides a PCB stacking supporting equipment, Figure 1 is a schematic diagram of a PCB stacking supporting equipment provided by the embodiment one of the present application, referring to Figure 1 The PCB stacking supporting equipment comprises:

[0051] a production control system, a first plate collecting machine 60, a first punching machine 40, a first plate placing machine 20, a multi-station supporting machine 10, a second plate placing machine 30, a second punching machine 50 and a second plate collecting machine 70; wherein the production control system is in communication connection with the first plate collecting machine 60, the first punching machine 40, the first plate placing machine 20, the multi-station supporting machine 10, the second plate placing machine 30, the second punching machine 50 and the second plate collecting machine 70; and the first plate collecting machine 60, the first punching machine 40, the first plate placing machine 20, the multi-station supporting machine 10, the second plate placing machine 30, the second punching machine 50 and the second plate collecting machine 70 are arranged in a straight line in sequence.

[0052] The multi-station matching machine 10 is used for receiving the first production instruction and the second production instruction sent by the production control system, storing multiple types of PCB core boards according to the first production instruction, and transmitting the multiple types of PCB core boards to the first plate placing machine 60 in a preset order according to the second production instruction in a direction of the multi-station matching machine 10 pointing to the first plate placing machine 60, and transmitting the multiple types of PCB core boards to the second plate placing machine 70 in a preset order in a direction of the multi-station matching machine 10 pointing to the second plate placing machine 70.

[0053] The first plate placing machine 20 is used for receiving the third production instruction sent by the production control system, confirming the length-width size information, target point size and target point position information of the PCB core board according to the third production instruction, and transmitting the PCB core board with the confirmed length-width size information, target point size and target point position information to the first punching machine 40 after pre-alignment at a first preset position.

[0054] The second plate placing machine 30 is used for receiving the fourth production instruction sent by the production control system, confirming the length-width size information, target point size and target point position information of the PCB core board according to the fourth production instruction, and transmitting the PCB core board with the confirmed length-width size information, target point size and target point position information to the second punching machine 50 after pre-alignment at a second preset position.

[0055] The first punching machine 40 is used for receiving the fifth production instruction sent by the production control system, confirming the first punching machine die size according to the fifth production instruction, and transmitting the pre-aligned PCB core board to the first plate placing machine 60 after punching.

[0056] The second punching machine 50 is used for receiving the sixth production instruction sent by the production control system, confirming the second punching machine die size according to the sixth production instruction, and transmitting the pre-aligned PCB core board to the second plate placing machine 70 after punching.

[0057] The first plate placing machine 60 is used for receiving the seventh production instruction sent by the production control system, confirming the length-width size information of the PCB core board according to the seventh production instruction, and collecting and transferring the punched PCB core board with the confirmed length-width size information to the first carrier.

[0058] The second plate placing machine 70 is used for receiving the eighth production instruction sent by the production control system, confirming the length-width size information of the PCB core board according to the eighth production instruction, and collecting and transferring the punched PCB core board with the confirmed length-width size information to the second carrier.

[0059] The production control system is used for sending the first production instruction, the second production instruction, the third production instruction, the fourth production instruction, the fifth production instruction, the sixth production instruction, the seventh production instruction and the eighth production instruction to the multi-station matching machine 10, the first plate placing machine 20, the second plate placing machine 30, the first punching machine 40, the second punching machine 50, the first plate placing machine 60 and the second plate placing machine 70. Figure 1As shown in the figure, the production control system can be used to integrate the production process, resources and data on the production line to improve production efficiency and quality, and reduce production cost. After the PCB core board completes the pattern transfer, it is transported to the repair waiting area by the transplanting machine or conveying mechanism or multiple AGV trolleys for automatic optical detection (AOI) and repair (VRS) before being transported to the multi-station matching machine 10. According to the production instruction of the production control system, the various types of PCB core boards in the matching processing area are transported to the corresponding multi-station matching machine 10 by the transplanting machine or conveying mechanism or multiple AGV trolleys, and the different types of PCB core boards are transported to the corresponding multi-station matching machine 10. For example, the multi-station matching machine includes multiple machine positions, and different types of PCB core boards can be transported to multiple machine positions, and each type of PCB core board is placed in a machine position.

[0060] Specifically, the multi-station matching machine 10 is used to receive the first production instruction and the second production instruction sent by the production control system. The first production instruction can be a storage instruction for various types of PCB core boards, and the multi-station matching machine 10 is used to store multiple types of PCB core boards according to the first production instruction, for example, each type of PCB core board can be placed in a machine position. The second production instruction can be a transmission instruction for multiple types of PCB core boards, including the direction, quantity and type of transmission; according to the second production instruction, multiple types of PCB core boards are transmitted to the first board placing machine 60 in the direction of the multi-station matching machine 10 pointing to the first board placing machine 60 according to the preset sequence information, and multiple types of PCB core boards are transmitted to the second board placing machine 70 in the direction of the multi-station matching machine 10 pointing to the second board placing machine 70 according to the preset sequence information, and the preset sequence information is the sequence information of product board placing; the bidirectional matching automation connection design can be realized, so that the same product bidirectional matching, single product matching and different product bidirectional matching can be realized, flexible scheduling can be realized, and the production efficiency can be improved. In addition, based on product upgrading (increasing the number of layers), the number of stations of the multi-station matching machine 10 can be increased, and the overall product matching capability can be increased. According to the preset board placing scheme, the tediousness of manual operation is greatly reduced, and the production efficiency is improved.

[0061] The first plate placing machine 20 is configured to receive a third production instruction sent by the production control system, and the second plate placing machine 30 is configured to receive a fourth production instruction sent by the production control system. The third production instruction and the fourth production instruction can be instructions for confirming the PCB core plate length and width size information, the target point size and the target point position information. By calling the PCB core plate length and width size information in the production control system and comparing the PCB core plate length and width size information with the corresponding target point size and target point position information, the information is confirmed to be correct. After the PCB core plate length and width size information, the target point size and the target point position information are confirmed, the first plate placing machine 20 pre-positions the PCB core plate with the confirmed PCB core plate length and width size information, the target point size and the target point position information at a preset position and then transmits the PCB core plate to the first punching machine 40. The second plate placing machine 30 is also configured to pre-position the PCB core plate with the confirmed PCB core plate length and width size information, the target point size and the target point position information at a preset position and then transmit the PCB core plate to the second punching machine 50. The preset position is the position where the PCB core plate is placed in the first plate placing machine 20 and the second plate placing machine 30. The position information of the PCB core plate in the first plate placing machine 20 and the second plate placing machine 30 is automatically identified to determine whether the position information corresponds to the target point position, so that automatic adjustment is performed, the error of manual operation is reduced, and the positioning accuracy is improved.

[0062] The first punching machine 40 is configured to receive a fifth production instruction sent by the production control system. The fifth production instruction can be an instruction for confirming the first punching machine die size, so that the first punching machine 40 can punch according to the die size. The second punching machine 50 is configured to receive a sixth production instruction sent by the production control system. The fifth production instruction can be an instruction for confirming the second punching machine die size, so that the second punching machine 50 can punch according to the die size. For example, if the same product is a high multi-layer PCB board with bidirectional matching, the first punching machine die size and the second punching machine die size are the same, and the same set of products uses the same set of dies for punching, thereby improving the alignment accuracy of the high multi-layer PCB product. If the same product is a high multi-layer PCB board with bidirectional matching, the first punching machine die size and the second punching machine die size are different, so that flexible production can be realized, and the idle waiting of the matching station can be avoided.

[0063] The first plate receiving machine 60 is used for receiving the seventh production instruction sent by the production control system, and the second plate receiving machine 70 is used for receiving the eighth production instruction sent by the production control system, and the seventh production instruction and the eighth production instruction can be instructions for confirming the length and width size information of the PCB core plate; by calling the length and width size information of the PCB core plate in the production control system, the two are compared, after confirming that the information is correct, the punched PCB core plate with the confirmed length and width size information of the PCB core plate is collected and transferred to the first carrier, the punched PCB core plate with the confirmed length and width size information of the PCB core plate is collected and transferred to the second carrier, and after the carrier is full, the carrier is transferred to the next process by the conveying mechanism or the plurality of AGV trolleys. The whole process does not need manual operation, reduces the product quality decline caused by manual error, and the fully automated production can improve the product quality.

[0064] The PCB stacking supporting equipment provided by the technical scheme of the embodiment of the application comprises a production control system, a first plate receiving machine 60, a first punching machine 40, a first plate placing machine 20, a multi-station supporting machine 10, a second plate placing machine 30, a second punching machine 50 and a second plate receiving machine 70. The production control system is in communication connection with the first plate receiving machine 60, the first punching machine 40, the first plate placing machine 20, the multi-station supporting machine 10, the second plate placing machine 30, the second punching machine 50 and the second plate receiving machine 70. The first plate receiving machine 60, the first punching machine 40, the first plate placing machine 20, the multi-station supporting machine 10, the second plate placing machine 30, the second punching machine 50 and the second plate receiving machine 70 are arranged in a straight line in sequence. The multi-station supporting machine 10 is used for storing multiple types of PCB core plates according to a first production instruction, and transmitting the multiple types of PCB core plates to the first plate placing machine 60 in a preset order along a direction of the multi-station supporting machine 10 pointing to the first plate receiving machine 60 according to a second production instruction, and sequentially transmitting the multiple types of PCB core plates to the second plate placing machine 70 in a preset order along a direction of the multi-station supporting machine 10 pointing to the second plate receiving machine 70. The bidirectional supporting automatic connection design can be realized, so that bidirectional supporting of the same product, supporting of a single product and bidirectional simultaneous supporting of different products can be realized, flexible production scheduling can be realized, the supporting stations can be avoided from being idle and waiting, the production efficiency is improved, in addition, the number of stations of the multi-station supporting machine 10 can be flexibly increased based on product upgrading (increase in the number of layers), the supporting capacity of the whole product is increased, and the first plate receiving machine 60, the first punching machine 40, the first plate placing machine 20, the multi-station supporting machine 10, the second plate placing machine 30, the second punching machine 50 and the second plate receiving machine 70 do not need manual operation throughout the whole process, the product quality decline caused by manual error is reduced, and the fully automated production can improve the product quality.

[0065] Optionally, with reference to Figure 1, the multi-station matching machine comprises a first mechanical arm, a first conveying device, a second conveying device and two rows of multiple machine loading positions 11 arranged in a straight line; the arrangement direction of the multiple machine loading positions 11 in each row is the direction in which the first plate collecting machine 60 points to the second plate collecting machine 70; the machine loading position 11 is used for receiving a first production instruction sent by a production control system and storing multiple types of PCB core boards according to the first production instruction; the first mechanical arm is used for receiving a second production instruction sent by the production control system and sequentially grabbing the PCB core boards from the machine loading positions to the first conveying device or the second conveying device according to preset sequence information; the first conveying device is used for transmitting the multiple types of PCB core boards to the first plate placing machine 60 in the direction in which the multi-station matching machine 10 points to the first plate collecting machine 60 according to the preset sequence information; and the second conveying device is used for transmitting the multiple types of PCB core boards to the second plate placing machine 70 in the direction in which the multi-station matching machine 10 points to the second plate collecting machine 70 according to the preset sequence information.

[0066] In the multi-station matching machine, the machine loading position 11 stores multiple types of PCB core boards according to the first production instruction, and each machine loading position 11 stores one type of PCB core board. The first mechanical arm is used for receiving a second production instruction sent by the production control system, sequentially grabbing different types of PCB core boards from different machine loading positions according to the sequence information of product plate arrangement, and transmitting the PCB core boards to the first conveying device or the second conveying device. The first conveying device or the second conveying device is used for sequentially transmitting multiple types of PCB core boards. The first conveying device is used for transmitting the multiple types of PCB core boards to the first plate placing machine 60 in the direction in which the multi-station matching machine 10 points to the first plate collecting machine 60. The second conveying device is used for transmitting the multiple types of PCB core boards to the second plate placing machine 70 in the direction in which the multi-station matching machine 10 points to the second plate collecting machine 70. The above-mentioned arrangement can realize bidirectional plate arrangement, bidirectional matching of high-multilayer PCB plates of the same product and bidirectional simultaneous matching of high-multilayer PCB plates of different products, flexible production scheduling, avoidance of idle waiting of matching stations and improvement of production efficiency. In addition, the number of stations of the multi-station matching machine 10 can be increased based on product upgrading (increase in the number of layers) and flexibility, and the overall product matching capacity can be increased.

[0067] For example, the number of machine loading positions 11 can be 18, and two rows of 9 machine loading positions 11 are arranged in a straight line. Two rows of 9 machine loading positions 11 respectively transmit 9 PCB core boards in two directions, form two 18-layer PCB plates, and press copper foil on the top layer and the bottom layer of each 18-layer PCB plate in the subsequent pressing device. Therefore, the same product can be simultaneously bidirectionally matched with 20-layer PCB plates and 20-layer PCB plates, or different 20-layer PCB products can be simultaneously bidirectionally matched. Alternatively, when only one product is formed in the subsequent pressing device, two rows of 9 machine loading positions 11 respectively transmit 9 PCB core boards in the same direction, form a 36-layer PCB plate, and press copper foil on the top layer and the bottom layer of the 36-layer PCB plate in the subsequent pressing device. Therefore, one-way matching of 38-layer PCB plates can be realized, and the matching efficiency and matching capacity are greatly improved.

[0068] Optionally, the first conveying device and the second conveying device are bidirectional conveying belts or bidirectional conveying belts.

[0069] Optionally, the first conveying device and the second conveying device are bidirectional conveying belts or bidirectional conveying belts, which are used to automatically convey the PCB core boards, reduce the time of manual operation, and improve the production efficiency.

[0070] Optionally, the multi-station matching machine further comprises an on-machine code reader; the on-machine code reader is used to receive the second production instruction sent by the production control system, read the code on each PCB core board according to the second production instruction, and check the sequence of each PCB core board.

[0071] Optionally, the first mechanical hand is used to receive the second production instruction sent by the production control system, sequentially grasp different types of PCB core boards from different on-machine positions according to the sequence information of the boards, and convey the PCB core boards to the first conveying device or the second conveying device; when the on-machine code reader reads the code on each PCB core board, the code is a two-dimensional code on the PCB core board, and the sequence of each PCB core board is checked; if the sequence of the checked two-dimensional code does not match, the production is stopped; only when the sequence of the checked two-dimensional code matches the sequence in the production control system, the next operation is continued, which can improve the product quality and reduce the error rate.

[0072] Optionally, the first board placing machine and the second board placing machine are both provided with a visual camera, the first board placing machine is further provided with a second mechanical hand, and the second board placing machine is further provided with a third mechanical hand; the visual camera is used to collect the target point and image information of the PCB core board; the second mechanical hand is used to correct the position of the PCB core board on the first board placing machine and convey the corrected PCB core board on the first board placing machine to the first punching machine; and the third mechanical hand is used to correct the position of the PCB core board on the second board placing machine and convey the corrected PCB core board on the second board placing machine to the second punching machine.

[0073] Optionally, the visual camera is a CCD industrial camera or a video camera; the visual camera collects the image information of the PCB core board for visual positioning; when the position of the PCB core board deviates, the second mechanical hand is used for angle correction to correct the position of the PCB core board; the position information of the PCB core board is automatically recognized in the first board placing machine and the second board placing machine, so as to automatically adjust; the PCB core board can be accurately conveyed to the punching machine, the precision of placing the board is high, the repeat precision is good, the error of manual operation can be reduced, and the positioning precision and the precision during subsequent punching can be improved.

[0074] Optionally, the PCB stacking supporting equipment further comprises: a brown device, a stacking device and a pressing device; the brown device comprises a first brown device and a second brown device, the stacking device comprises a first stacking device and a second stacking device, and the pressing device comprises a first pressing device and a second pressing device.

[0075] The PCB core plate punched by the first punching machine is transmitted to the first brown device, the PCB core plate after the brown treatment of the first brown device is transmitted to the first stacking device, the stacked various PCB core plates of the first stacking device are transmitted to the first pressing device, and the various PCB core plates after the pressing of the first pressing device are transmitted to the first plate collector; the PCB core plate punched by the second punching machine is transmitted to the second brown device, the PCB core plate after the brown treatment of the second brown device is transmitted to the second stacking device, the stacked various PCB core plates of the second stacking device are transmitted to the second pressing device, and the various PCB core plates after the pressing of the second pressing device are transmitted to the second plate collector. The brown device is used for brown treatment of the punched various PCB core plates; the stacking device is used for stacking the various PCB core plates after the brown treatment; and the pressing device is used for pressing the various inner layer PCB core plates after the stacking.

[0076] The brown device increases the roughness of the copper surface of the inner layer PCB core plate through chemical treatment to enhance the bonding force between the PCB core plate and the prepreg (PP); the stacking device fixes the PP sheet and the PCB core plate in place after alignment; and the pressing device can bond each layer into a whole.

[0077] Embodiment two

[0078] The embodiment of the application further provides a PCB stacking supporting method based on the above-mentioned embodiment, which is executed by the PCB stacking supporting equipment of any embodiment of the application, Figure 2 is a flowchart of the PCB stacking supporting method provided in the embodiment two of the application, and the reference Figure 2 , the stacking supporting method comprises:

[0079] S110, the multi-station supporting machine receives the first production instruction and the second production instruction sent by the production control system, stores the various PCB core plates according to the first production instruction, and transmits the various PCB core plates to the first plate placing machine according to the preset order information in the direction of the first plate collector of the multi-station supporting machine according to the second production instruction, and sequentially transmits the various PCB core plates to the second plate placing machine according to the preset order information in the direction of the second plate collector of the multi-station supporting machine.

[0080] S120, the first plate placing machine receives the third production instruction sent by the production control system, confirms the PCB core board length and width size information, target point size and target point position information according to the third production instruction, and transmits the PCB core board with the confirmed PCB core board length and width size information, target point size and target point position information to the first punching machine after pre-alignment at a preset position.

[0081] S130, the second plate placing machine receives the fourth production instruction sent by the production control system, confirms the PCB core board length and width size information, target point size and target point position information according to the fourth production instruction, and transmits the PCB core board with the confirmed PCB core board length and width size information, target point size and target point position information to the second punching machine after pre-alignment at a preset position.

[0082] S140, the first punching machine receives the fifth production instruction sent by the production control system, confirms the first punching machine mold size according to the fifth production instruction, and transmits the pre-aligned PCB core board to the first plate collecting machine after punching.

[0083] S150, the second punching machine receives the sixth production instruction sent by the production control system, confirms the second punching machine mold size according to the sixth production instruction, and transmits the pre-aligned PCB core board to the second plate collecting machine after punching.

[0084] S160, the first plate collecting machine receives the seventh production instruction sent by the production control system, confirms the PCB core board length and width size information according to the seventh production instruction, and collects and transfers the punched PCB core board with the confirmed PCB core board length and width size information to the first carrier.

[0085] S170, the second plate collecting machine receives the eighth production instruction sent by the production control system, confirms the PCB core board length and width size information according to the eighth production instruction, and collects and transfers the punched PCB core board with the confirmed PCB core board length and width size information to the second carrier.

[0086] Optionally, the multi-station matching machine includes a first mechanical hand, a first conveying device, a second conveying device and a plurality of machine positions arranged in a straight line; the arrangement direction of the plurality of machine positions in each row is the direction in which the first plate collecting machine points to the second plate collecting machine.

[0087] Figure 3 is Figure 2 The detailed flowchart of the PCB stacking matching method included in S110, please refer to Figure 3, S110, the multi-station matching machine receives the first production instruction and the second production instruction sent by the production control system, stores the multiple types of PCB core boards according to the first production instruction, and transmits the multiple types of PCB core boards to the first plate placing machine according to the preset sequence information in the direction of the multi-station matching machine pointing to the first plate collecting machine according to the second production instruction, and sequentially transmits the multiple types of PCB core boards to the second plate placing machine according to the preset sequence information in the direction of the multi-station matching machine pointing to the second plate collecting machine, comprising:

[0088] S111, the upper machine position receives the first production instruction sent by the production control system, and stores the multiple types of PCB core boards according to the first production instruction.

[0089] S112, the first manipulator receives the second production instruction sent by the production control system, and sequentially grabs the PCB core boards from the upper machine position to the first conveying device or the second conveying device according to the preset sequence information.

[0090] S113, the first conveying device transmits the multiple types of PCB core boards to the first plate placing machine according to the preset sequence information in the direction of the multi-station matching machine pointing to the first plate collecting machine.

[0091] S114, the second conveying device transmits the multiple types of PCB core boards to the second plate placing machine according to the preset sequence information in the direction of the multi-station matching machine pointing to the second plate collecting machine.

[0092] The PCB stacking matching method provided by the embodiment of the application and the PCB stacking matching device described in any embodiment of the application belong to the same inventive concept, and the PCB stacking matching method and the PCB stacking matching device described in any embodiment of the application have the same beneficial effects.

[0093] It should be understood that the various forms of flow shown above can be used to reorder, add or delete steps. For example, the steps described in the present application can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions of the present application can be achieved, which are not limited herein.

[0094] The above specific embodiments do not constitute a limitation on the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent replacement and improvement within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A PCB stacker kit, characterized by, The application relates to a production control system and a first, second, third, fourth, fifth, sixth, seventh and eighth collecting machine. The first collecting machine is used for receiving a third production instruction sent by the production control system, confirming PCB core board length-width size information, target point size and target point position information according to the third production instruction, pre-aligning the PCB core board with the confirmed PCB core board length-width size information, target point size and target point position information at a preset position and then transmitting the pre-aligned PCB core board to the first punching machine. The second collecting machine is used for receiving a fourth production instruction sent by the production control system, confirming PCB core board length-width size information, target point size and target point position information according to the fourth production instruction, pre-aligning the PCB core board with the confirmed PCB core board length-width size information, target point size and target point position information at a preset position and then transmitting the pre-aligned PCB core board to the second punching machine. The first punching machine is used for receiving a fifth production instruction sent by the production control system, confirming a first punching machine die size according to the fifth production instruction, punching the pre-aligned PCB core board after the first punching machine die size is confirmed and then transmitting the punched PCB core board to the first collecting machine. The second punching machine is used for receiving a sixth production instruction sent by the production control system, confirming a second punching machine die size according to the sixth production instruction, punching the pre-aligned PCB core board after the second punching machine die size is confirmed and then transmitting the punched PCB core board to the second collecting machine. The first collecting machine is used for receiving a seventh production instruction sent by the production control system, confirming PCB core board length-width size information according to the seventh production instruction, collecting the punched PCB core board with the confirmed PCB core board length-width size information and then transferring the collected punched PCB core board to a first carrier. The second collecting machine is used for receiving an eighth production instruction sent by the production control system, confirming PCB core board length-width size information according to the eighth production instruction, collecting the punched PCB core board with the confirmed PCB core board length-width size information and then transferring the collected punched PCB core board to a second carrier. The multi-station matching machine comprises a first mechanical hand, a first conveying device, a second conveying device and a plurality of machine positions arranged in two rows in a straight line. ​ The upper machine position is used to receive the first production instruction sent by the production control system, and store multiple types of PCB core boards according to the first production instruction; the first mechanical hand is used to receive the second production instruction sent by the production control system, and sequentially grab the PCB core boards from the upper machine position to the first conveying device or the second conveying device according to the second production instruction and preset sequence information; the first conveying device is used to transmit multiple types of PCB core boards to the first plate placing machine according to preset sequence information in the direction of the multi-station matching machine pointing to the first plate collecting machine; the second conveying device is used to transmit multiple types of PCB core boards to the second plate placing machine according to preset sequence information in the direction of the multi-station matching machine pointing to the second plate collecting machine.

2. The PCB stacking matching equipment according to claim 1, characterized in that: The first conveying device and the second conveying device are bidirectional conveying belts or bidirectional conveying belts.

3. The PCB stack-out kit of claim 1, wherein, The multi-station matching machine further comprises an upper machine code reader. The upper machine code reader is used to receive the second production instruction sent by the production control system, read the code on each PCB core board according to the second production instruction, and check the sequence of each PCB core board.

4. The PCB stack-out kit of claim 1, wherein, The first plate placing machine and the second plate placing machine are both provided with visual cameras, the first plate placing machine is further provided with a second mechanical hand, and the second plate placing machine is further provided with a third mechanical hand. The visual camera is used to collect target points and image information of the PCB core board; the second mechanical hand is used to correct the position of the PCB core board on the first plate placing machine, and transmit the corrected PCB core board on the first plate placing machine to the first punching machine; and the third mechanical hand is used to correct the position of the PCB core board on the second plate placing machine, and transmit the corrected PCB core board on the second plate placing machine to the second punching machine.

5. The PCB stacking matching equipment according to claim 4, characterized in that: The visual camera is a CCD industrial camera or a video camera.

6. The PCB stack-out apparatus of claim 1, wherein, Further comprising: A brown device, a stacking device and a pressing device; The brown device comprises a first brown device and a second brown device, the stacking device comprises a first stacking device and a second stacking device, and the pressing device comprises a first pressing device and a second pressing device; The PCB core board punched by the first punching machine is transmitted to the first brown device, the PCB core board after brown treatment by the first brown device is transmitted to the first stacking device, the stacked PCB core boards of various types by the first stacking device are transmitted to the first pressing device, and the pressed PCB core boards of various types by the first pressing device are transmitted to the first plate collecting machine; The PCB core board punched by the second punching machine is transmitted to the second brown device, the PCB core board after brown treatment by the second brown device is transmitted to the second stacking device, the stacked PCB core boards of various types by the second stacking device are transmitted to the second pressing device, and the pressed PCB core boards of various types by the second pressing device are transmitted to the second plate collecting machine; The brown device is used for brown processing of various PCB core plates after punching; The stacking device is used for stacking various PCB core plates after brown processing; and the pressing device is used for pressing various PCB core plates after stacking.

7. A method of PCB stacking kit, characterized by, The stacking method comprises: The production control system, the first plate receiving machine, the first punching machine, the first plate placing machine, the multi-station matching machine, the second plate placing machine, the second punching machine and the second plate receiving machine; wherein the production control system is in communication connection with the first plate receiving machine, the first punching machine, the first plate placing machine, the multi-station matching machine, the second plate placing machine, the second punching machine and the second plate receiving machine; the first plate receiving machine, the first punching machine, the first plate placing machine, the multi-station matching machine, the second plate placing machine, the second punching machine and the second plate receiving machine are arranged in a straight line in sequence; The first plate placing machine receives the third production instruction sent by the production control system, confirms the PCB core plate length and width size information, target point size and target point position information according to the third production instruction, pre-aligns the PCB core plate with the confirmed PCB core plate length and width size information, target point size and target point position information at a preset position, and then transmits the pre-aligned PCB core plate to the first punching machine; The second plate placing machine is used for receiving the fourth production instruction sent by the production control system, confirming the PCB core plate length and width size information, target point size and target point position information according to the fourth production instruction, pre-aligning the PCB core plate with the confirmed PCB core plate length and width size information, target point size and target point position information at a preset position, and then transmitting the pre-aligned PCB core plate to the second punching machine; The first punching machine receives the fifth production instruction sent by the production control system, confirms the first punching machine mold size according to the fifth production instruction, and then transmits the pre-aligned PCB core plate after punching to the first plate receiving machine after confirming the first punching machine mold size; The second punching machine receives the sixth production instruction sent by the production control system, confirms the second punching machine mold size according to the sixth production instruction, and then transmits the pre-aligned PCB core plate after punching to the second plate receiving machine after confirming the second punching machine mold size; The first plate receiving machine receives the seventh production instruction sent by the production control system, confirms the PCB core plate length and width size information according to the seventh production instruction, collects the punched PCB core plate with the confirmed PCB core plate length and width size information, and then transfers the punched PCB core plate to the first carrier; The second plate receiving machine is used for receiving the eighth production instruction sent by the production control system, confirming the PCB core plate length and width size information according to the eighth production instruction, collecting the punched PCB core plate with the confirmed PCB core plate length and width size information, and then transferring the punched PCB core plate to the second carrier; The multi-station matching machine comprises a first mechanical hand, a first conveying device, a second conveying device and a plurality of upper machine positions arranged in a straight line in two rows; the arrangement direction of the plurality of upper machine positions in each row is the direction in which the first plate receiving machine points to the second plate receiving machine; The upper machine position receives the first production instruction sent by the production control system, and stores various PCB core plates according to the first production instruction. The first mechanical arm receives second production instructions sent by the production control system, and sequentially grabs the PCB core board from the upper machine position to the first conveying device or the second conveying device according to the second production instructions and preset sequence information; The first conveying device transmits multiple types of PCB core boards to the first board placing machine in a direction of the multi-station matching machine pointing to the first board collecting machine according to preset sequence information; The second conveying device transmits multiple types of PCB core boards to the second board placing machine in a direction of the multi-station matching machine pointing to the second board collecting machine according to preset sequence information.

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