Nozzle for a distributor of a material deposition source, material deposition source, vacuum deposition system and method for depositing material

Abstract

A nozzle for an evaporated material dispenser is described. The nozzle comprises a nozzle inlet for receiving an evaporated material, a nozzle outlet, and a nozzle passage extending between the nozzle inlet and the nozzle outlet, the nozzle passage having a first passage portion, a second passage portion, and a third passage portion, the second passage portion having a continuously increasing aperture angle in a direction from the nozzle inlet to the nozzle outlet, and the third passage portion having a substantially constant aperture angle.

Description

Technical Field

[0001] Embodiments of this disclosure relate to a nozzle for a material deposition source, a material dispenser, a vacuum deposition system, and a method for depositing material on a substrate. In particular, embodiments of this disclosure relate to a nozzle for guiding vapor-deposited material into a vacuum chamber of a vacuum deposition system, a material deposition source including a nozzle for guiding vapor-deposited material into a vacuum chamber, and a method for depositing material on a substrate in a vacuum chamber.

[0002] background

[0003] Organic vapor deposition equipment is a tool used to produce organic light-emitting diodes (OLEDs). OLEDs are a special type of light-emitting diode in which the emitting layer comprises a thin film of certain organic compounds. OLEDs are used in the manufacture of television screens, computer monitors, mobile phones, and other handheld devices for displaying information. OLEDs can also be used for general spatial lighting. OLED displays offer a wider range of possible colors, brightness, and viewing angles than conventional LCD displays because OLED pixels emit light directly without backlighting. Therefore, OLED displays consume significantly less energy than conventional LCD displays. Furthermore, the fact that OLEDs can be fabricated on flexible substrates creates further applications. A typical OLED display may include, for example, layers of organic material disposed between two electrodes, deposited on a substrate in such a way that a matrix display panel with individually excitable pixels is formed. OLEDs are typically placed between two glass panels, the edges of which are sealed to encapsulate the OLED within.

[0004] The fabrication of such display devices presents numerous challenges. OLED displays or OLED illumination applications involve stacks of several organic materials, for example, deposited in a vacuum. The organic materials are then deposited via a shadow mask in subsequent processes. For efficient fabrication of OLED stacks, it is advantageous to co-deposit or co-evaporate two or more materials (e.g., host and dopant) to create a mixed / doped layer. Additionally, several process conditions for the evaporation of highly sensitive organic materials must be considered.

[0005] To vaporize and deposit material onto a substrate, the material is heated until it evaporates. The vaporized material is guided to the substrate through a conduit or nozzle. Over the past few years, the precision of deposition processes has been improved, for example, to enable increasingly smaller pixel sizes. In some processes, masks are used to define pixels as the vaporized material passes through mask openings. However, mask shading effects, vaporized material diffusion, and other factors make it difficult to further improve the precision and predictability of the vapor deposition process.

[0006] For example, document US2016 / 0201195 describes a nozzle having a second injection section coupled to a first injection section and configured to correct the directionality of diffusely reflected particles at the outlet of the first injection section. The injected deposited material has improved directionality by using variations in the directionality of the material diffusely reflected from the inner surfaces of the first and second injection sections, respectively, through controlling the surface roughness of the inner surfaces of the first and second injection sections. Document JP2004079541 shows nozzles with various different shapes. The nozzle is positioned to allow for directional delivery of the formulation and adjustment of the formulation flow rate. Document WO 2018 / 054472 describes a nozzle in which the shading effect caused by a mask positioned in front of a substrate is reduced. The aperture angle continuously increases until the nozzle outlet. The aperture angle α at the nozzle outlet is called the outlet aperture angle α. E And is described in particular as α E >40°. Previous attempts to improve the angular distribution of vapor-deposited materials through nozzles focused on the direction of particles released from the nozzle surface. Further improvement in the angular distribution of vapor-deposited materials is beneficial.

[0007] In view of the foregoing, the embodiments described herein provide an improved nozzle, an improved material deposition source, an improved vacuum deposition system, and an improved method for depositing material on a substrate.

[0008] Overview

[0009] In view of the foregoing, a nozzle, a material deposition source, a vacuum deposition system, and a method for depositing material on a substrate are provided. Further advantages, features, aspects, and details will become clear from the dependent claims, the specification, and the drawings.

[0010] According to one embodiment, a nozzle for a vapor deposition material dispenser is provided. The nozzle includes: a nozzle inlet for receiving vapor deposition material; a nozzle outlet; and a nozzle passage extending between the nozzle inlet and the nozzle outlet, the nozzle passage having a first passage portion, a second passage portion, and a third passage portion, the second passage portion having an aperture angle that continuously increases in a direction from the nozzle inlet to the nozzle outlet, and the third passage portion having a substantially constant aperture angle.

[0011] According to one embodiment, a material deposition source is provided for depositing material onto a substrate in a vacuum deposition chamber. The material deposition source includes: a dispenser in fluid communication with the material source; and at least one nozzle according to any of the embodiments described herein. Specifically, the nozzle includes: a nozzle inlet for receiving vapor-deposited material; a nozzle outlet; and a nozzle passage extending between the nozzle inlet and the nozzle outlet, the nozzle passage having a first passage portion, a second passage portion, and a third passage portion, the second passage portion having an aperture angle that continuously increases in the direction from the nozzle inlet to the nozzle outlet, and the third passage portion having a substantially constant aperture angle.

[0012] According to one embodiment, a vacuum deposition system is provided. The system includes: a vacuum deposition chamber; and a material deposition source according to any of the embodiments described herein. Specifically, the material deposition source includes: a distributor in fluid communication with the material source; and at least one nozzle according to any of the embodiments described herein. Specifically, the nozzle includes: a nozzle inlet for receiving vapor-deposited material; a nozzle outlet; and a nozzle passage extending between the nozzle inlet and the nozzle outlet, the nozzle passage having a first passage portion, a second passage portion, and a third passage portion, the second passage portion having an aperture angle that continuously increases in a direction from the nozzle inlet to the nozzle outlet, and the third passage portion having a substantially constant aperture angle.

[0013] According to one embodiment, a method for depositing material onto a substrate in a vacuum deposition chamber is provided. The method includes: vapor-depositing a material to be deposited; guiding the vapor-deposited material to a dispenser; and guiding the vapor-deposited material through a plurality of nozzles as described in any of the embodiments herein. Specifically, the nozzles include: a nozzle inlet for receiving the vapor-deposited material; a nozzle outlet; and a nozzle passage extending between the nozzle inlet and the nozzle outlet, the nozzle passage having a first passage portion, a second passage portion, and a third passage portion, the second passage portion having an aperture angle that continuously increases in a direction from the nozzle inlet to the nozzle outlet, and the third passage portion having a substantially constant aperture angle.

[0014] Brief description of the attached figures

[0015] To gain a more detailed understanding of the features described above in this disclosure, reference can be made to embodiments to obtain a more specific description of the disclosure briefly summarized above. The accompanying drawings illustrate embodiments of this disclosure and are described below: Embodiments are depicted in the drawings and described in detail below.

[0016] Figure 1 A schematic cross-sectional view of a nozzle according to an embodiment described herein is shown, the nozzle being connected to a dispenser for guiding vapor-deposited material from a material source into a vacuum chamber;

[0017] Figure 2 A graph comparing the angular distribution of a nozzle according to an embodiment of the present disclosure with that of other nozzles is shown.

[0018] Figure 3 A schematic side view of a material deposition source according to another embodiment described herein is shown;

[0019] Figure 4 A vacuum deposition system according to an embodiment described herein is shown;

[0020] Figure 5A and Figure 5B A schematic diagram of a dispenser with nozzles according to an embodiment described herein is shown; and

[0021] Figure 6 A flowchart is shown of a method for depositing material on a substrate according to an embodiment described herein.

[0022] Detailed description of the implementation method

[0023] Reference will now be made in detail to the various embodiments, each illustrated in one or more examples of these embodiments. Each example is provided for illustrative purposes and is not intended to be limiting. For example, a feature illustrated or described as a part of one embodiment may be used in or in combination with any other embodiment to produce yet another embodiment. Such modifications and variations are contemplated.

[0024] In the following description of the accompanying drawings, the same reference numerals refer to the same or similar parts. Generally, only differences with respect to individual embodiments are described. Unless otherwise specified, the description of parts or aspects of one embodiment applies to corresponding parts or aspects of another embodiment.

[0025] In this disclosure, a "material source" or "material deposition source" (the term may be used synonymously herein) can be understood as an assembly that provides material to be deposited on a substrate. Specifically, a material deposition source may be configured to deposit material onto a substrate in a vacuum chamber (such as the vacuum deposition chamber of a vacuum deposition system). According to some embodiments, a material deposition source may be a vapor deposition source. For example, a material deposition source may include: a vapor depositor or crucible that vapor deposits the material to be deposited on the substrate; and a dispenser, such as a dispensing conduit or one or more point sources, which may be arranged along a vertical axis. The dispenser is configured to release vapor-deposited material in a direction toward the substrate, for example, through one or more outlets or one or more nozzles as described herein. A crucible can be understood as a device or reservoir that provides or contains material to be vapor-deposited. The crucible may be in fluid communication with the dispenser. In one example, the crucible may be a crucible for vapor-depositing organic materials (e.g., organic materials with a vapor deposition temperature of about 100°C to about 600°C).

[0026] According to some embodiments described herein, a "distributor" can be understood as a distribution conduit for guiding and distributing vapor-deposited material. Specifically, the distribution conduit guides vapor-deposited material from the vapor depositor to one or more outlets (such as nozzles or openings) within the distribution conduit. For example, the distribution conduit can be a linear distribution conduit extending in a first direction, particularly the longitudinal direction. In some embodiments, the linear distribution conduit comprises a conduit having a cylindrical shape, wherein the cylinder may have a circular, triangular, or near-square bottom shape, or any other suitable bottom shape.

[0027] In this disclosure, the term "nozzle" as used herein can be understood as a device for guiding fluid, and in particular for controlling the direction or characteristics of the fluid (such as the flow rate, velocity, shape, and / or pressure of the fluid ejected from the nozzle). According to some embodiments described herein, a nozzle can be a device for guiding or directing vapors, such as vapors of a vaporized material to be deposited on a substrate. According to some embodiments, a nozzle can be part of a dispenser, for example, a dispensing tube. Additionally or alternatively, the nozzle described herein may be connected to or be connected to a dispenser that provides vaporized material and may receive vaporized material from the dispenser.

[0028] Figure 1An example of a nozzle 100 according to an embodiment described herein is shown, the nozzle being connected to a dispenser for guiding vapor deposition material from a material source into a vacuum chamber. Nozzle 100 includes a nozzle inlet 110, a nozzle outlet 120, and a nozzle passage 130 between the nozzle inlet 110 and the nozzle outlet 120. According to some embodiments, vapor deposition material from a material source (such as a crucible) is guided into a dispenser as described herein and enters the nozzle through the nozzle inlet 110. The vapor deposition material then exits the nozzle through the nozzle passage 130 and at the nozzle outlet 120. The flow direction 111 of the vapor deposition material can be described as from the nozzle inlet 110 to the nozzle outlet 120. Reference Figure 1 According to the nozzle embodiment described herein, the nozzle passage 130 includes a first passage portion, a second passage portion, and a third passage portion. The nozzle portions are arranged in this order such that the second nozzle portion is located between the first nozzle portion and the third nozzle portion. The first nozzle portion is located at the nozzle inlet, and the third nozzle portion is located at the nozzle outlet.

[0029] According to embodiments of this disclosure, a nozzle for a vapor deposition material dispenser is provided. The nozzle includes a nozzle inlet and a nozzle outlet, the nozzle inlet for receiving vapor deposition material. The nozzle includes a nozzle passage extending between the nozzle inlet and the nozzle outlet, the nozzle passage having a first passage portion, a second passage portion, and a third passage portion, the second passage portion having an aperture angle that continuously increases in a direction from the nozzle inlet 110 to the nozzle outlet 120, and the third passage portion having a substantially constant aperture angle.

[0030] The embodiments of this disclosure provide direction for improving the material to be vapor-deposited, such as Figure 2 As shown. According to some embodiments that can be combined with other embodiments described herein, Figure 1 The nozzle shown may have a rotationally symmetric shape. Previous nozzle designs, as described in the Background section, emphasized correction of the directionality of particles diffusely reflected at the outlet of the injection section. The inventors have discovered that, additionally, the receiving characteristics of the nozzle's inner surface have a stronger influence than previously anticipated. Therefore, embodiments provide a first passage portion, a second passage portion, and a third passage portion to provide improved directionality of the material to be deposited while taking into account the emission characteristics of particles adhering to the inner surface and the receiving characteristics of the nozzle passage's inner surface. Receiving characteristics are understood herein as the ability of the nozzle to adsorb or receive particles that deviate from the beneficial directionality of the material to be deposited onto the nozzle's inner surface.

[0031] Therefore, in addition to the second passage portion 131, which continuously increases in the direction from nozzle inlet 110 to nozzle outlet 120, a third passage portion 132 with a substantially constant aperture angle is also provided. According to some embodiments that can be combined with other embodiments described herein, the first nozzle passage has a substantially 0° aperture angle. Furthermore, the aperture angle of the nozzle passage continuously increases in the second passage portion up to an angle α > 25°. This is achieved through… Figure 1 Angles α1 and α2 are illustrated, wherein the aperture angle increases up to an aperture angle α3. In particular, the aperture angle increases up to an aperture angle where α < 40°. More particularly, according to some embodiments that can be combined with other embodiments of this disclosure, the aperture angle increases up to an aperture angle where α < 36°.

[0032] According to embodiments of this disclosure, the aperture angle α is substantially constant in the third passage section. "Substantially constant" is understood herein to mean a constant aperture angle with a deviation from a constant state of ±3°. According to some embodiments that may be combined with other embodiments described herein, the addition of the third passage section increases the length L of the nozzle passage to 25 mm or more.

[0033] According to some embodiments, the length ratio of the second passage portion and the third passage portion along the direction from the nozzle inlet to the nozzle outlet is 1:2 to 2:1. The nozzle direction as referred to herein is understood as the main direction of the nozzle or the flow direction, and extends, for example, along the axis of the first passage portion, i.e., the central axis of the first passage portion.

[0034] According to some embodiments that can be combined with other embodiments described herein, the nozzle passage includes a tangential junction between the second passage portion and the third passage portion. Additionally or alternatively, a tangential junction is provided between the first passage portion and the second passage portion. The tangential junction is understood as a continuous function of the orifice angle along the direction of the nozzle passage.

[0035] According to some embodiments that can be combined with other embodiments described herein, the inner diameter D1 of the first passage portion is 12 mm or less. Additionally or alternatively, the inner diameter D1 of the first passage portion may be 3 mm or more.

[0036] Embodiments of this disclosure relate to, for example, masking deposition for OLED display fabrication or co-evaporation of materials (such as substrates and dopants) for OLED display fabrication. The nozzle may include materials suitable for evaporating organic materials at temperatures between about 100°C and about 600°C.

[0037] According to embodiments of this disclosure, the nozzle described herein can be used to deposit materials onto a substrate in a vacuum deposition chamber, particularly for the production of organic light-emitting diodes.

[0038] Figure 2 The angular distributions of various nozzle designs are shown. Curve 210 shows the integral intensity as a function of the angle of a standard nozzle. Curve 220 shows the integral intensity as a function of the nozzle angle, as described, for example, in document WO 2018 / 054472. Curve 230 shows the integral intensity as a function of the angle of a nozzle according to an embodiment of the present disclosure having a first inner diameter D1 with a first passage portion. Curve 240 shows the integral intensity as a function of the angle of a nozzle according to an embodiment of the present disclosure having a second inner diameter D1 with a first passage portion, wherein the second inner diameter is smaller than the first inner diameter.

[0039] It can be seen that for a given angular distribution value, the integral intensity increases. For example, for a nozzle with curve 240, the integral intensity at a 40° focal point can exceed 79%.

[0040] Therefore, by utilizing or providing a nozzle for depositing vapor-deposited material onto a substrate according to the embodiments described herein, the shading effect caused by a mask disposed in front of the substrate can be reduced, as will be referred to above. Figure 2 A more detailed description follows. Additionally, for co-evaporation, for example, when using a common metal mask (CMM) or another deposition process, material mixing on the substrate can be improved.

[0041] Embodiments of this disclosure may involve masked deposition. Fine metal masks (FMMs) can be used in some processes during display manufacturing, where the mask includes a pattern defining pixels of the display. For some processes during device manufacturing, CMMs, i.e., masks with large openings for the display, can be used. According to further specific embodiments that may be combined with other embodiments described herein, co-evaporation can be used for both CMM and FMM processes. In co-evaporation, different materials are deposited on a substrate, and particularly simultaneously. For example, material deposition sources may include two or more (e.g., three) material deposition sources close to each other. For example, one deposition source may deposit a host material, and another deposition source may simultaneously deposit a dopant material. Material mixing occurs on the substrate or shortly before the material reaches the substrate. Improved directionality enhances material mixing and / or pixel resolution based on reduced shading effects.

[0042] For example, if the mask is used to deposit material onto a substrate (such as in an OLED manufacturing system), the mask can be a pixel mask with pixel openings of about 50 μm × 50 μm or less, such as a cross-sectional dimension (e.g., a minimum cross-sectional dimension) of about 30 μm or less, or about 20 μm. In one example, the pixel mask may have a thickness of about 40 μm. Considering the mask thickness and the size of the pixel openings, a shading effect may occur, where the walls of the pixel openings in the mask obscure the pixel openings. The nozzles according to the embodiments described herein can help reduce the shading effect, enabling the production of displays with high pixel density (dpi), particularly ultra-high definition (UHD) displays (e.g., UHD-OLED displays).

[0043] According to the embodiments described herein, the nozzle passage 130 includes a passage wall surrounding the passage channel. The passage surrounds the nozzle passage or passage channel, that is, it surrounds the passage channel circumferentially. Therefore, the passage wall opens the nozzle passage 130 at both ends, namely the nozzle inlet 110 and the nozzle outlet 120.

[0044] According to some embodiments that can be combined with other embodiments described herein, the aperture angle (α) continuously increases in the flow direction within the second passage section, such that the diameter of the outlet portion of the nozzle passage 130 continuously increases in the flow direction in a near-circular arc manner within the second passage section. The aperture angle (α) is substantially constant in the third passage section. Therefore, the vapor-deposited material is more likely to adhere in the third passage section and be released with an improved angular distribution.

[0045] According to some embodiments that can be combined with other embodiments described herein, the nozzle is configured to guide vapor-deposited organic material at a temperature between about 100°C and about 600°C into a vacuum chamber. Additionally, the nozzle can be configured for a mass flow rate of less than 0.5 sccm. For example, the mass flow rate within the nozzle according to embodiments described herein can be particularly only 0.8 sccm and more particularly less than 0.25 sccm. In one example, the mass flow rate in the nozzle according to embodiments described herein can be less than 0.1 sccm, such as less than 0.05 sccm, particularly less than 0.03 sccm, and even more particularly less than 0.02 sccm.

[0046] Additionally or alternatively, the nozzle passage has a minimum size, for example, the diameter D1 of the first passage portion is less than 12 mm.

[0047] According to embodiments that can be combined with other embodiments described herein, the nozzle may include nozzle passages with segments of different lengths. For example, Figure 1A nozzle 100 is shown, comprising a first passage portion having a first length L1, a second passage portion having a second length L2, and a third passage portion having a second width L3. Specifically, the length of the passage portion should be understood only when it is understood that the nozzle section extends along the length direction of the nozzle or along the main flow direction of the material being vaporized in the nozzle (i.e.,...). Figure 1 The dimensions of the flow direction 111 are exemplarily shown in the diagram. A first passage portion of the nozzle provides a first diameter, such as an inlet diameter. A second passage portion of the nozzle provides a continuously increasing diameter, which increases continuously from the first diameter to the second diameter. A third passage portion has a substantially constant orifice angle (>10°), wherein the diameter increases up to, for example, an outlet diameter D2. In other words, according to some embodiments that may be combined with other embodiments described herein, the first passage portion of the nozzle may include a nozzle inlet, and the third passage portion of the nozzle may include a nozzle outlet. The second passage portion is located between the first and third passage portions.

[0048] In addition, the high directionality achieved by using a nozzle according to the embodiments described herein leads to an increase in the utilization rate of the vapor-deposited material, because more vapor-deposited material actually reaches the substrate.

[0049] Example reference Figure 3 This document describes a material deposition source 200 for depositing material onto a substrate in a vacuum deposition chamber. The material deposition source 200 typically includes dispensers, such as two or more dispensing assemblies, such as a first dispenser 206a and a second dispenser 206b, for example, dispensing conduits. Each dispenser may be in fluid communication with a material source (e.g., a vapor depositor or crucible) that supplies material to the dispenser. The material deposition source also includes a plurality of nozzles according to embodiments described herein.

[0050] According to some embodiments that can be combined with other embodiments described herein, the nozzle of the dispensing conduit can be adapted to release the vapor-deposited material in a direction different from the direction of the length of the dispensing conduit (such as in a direction substantially perpendicular to the length of the dispensing conduit). According to some embodiments, the nozzle is arranged with a main vapor deposition direction having a horizontal ±20° (in Figure 1 This is also referred to as the flow direction 111. According to some specific embodiments, the evaporation direction may be oriented slightly upwards, for example, in the range from horizontal to 15° upwards (such as 3° to 7° upwards). Accordingly, the substrate may be slightly tilted to be substantially perpendicular to the evaporation direction. This can reduce the formation of unwanted particles. However, the nozzle and material deposition source according to the embodiments described herein can also be used in a vacuum deposition system configured to deposit material on a horizontally oriented substrate.

[0051] In some specific implementations, the length of the dispensing conduit corresponds at least to the height of the substrate to be deposited in the deposition system. The length of the dispensing conduit will be at least 10% or even 20% longer than the height of the substrate to be deposited. This provides uniform deposition at the upper and / or lower ends of the substrate. According to some implementations that may be combined with other embodiments described herein, the length of the dispensing conduit may be 1.3 m or more, for example, 2.5 m or more. Depending on the configuration, such as... Figure 3 As shown, material sources such as the first vapor depositor 202a and the second vapor depositor 202b can be located at the lower end of the distribution pipe. Alternatively, the material source can be located substantially at the center along the length direction. Organic materials are vapor deposited in a vapor deposition crucible. The vapor of the organic material enters the distribution pipe and is guided substantially laterally through multiple nozzles in the distribution pipe, for example toward a substantially vertical substrate.

[0052] As described herein, a dispenser can be a dispensing conduit having a hollow cylinder. The term "cylinder" can be understood as having a circular bottom shape, a circular top shape, and a curved surface region or shell connecting the upper circle and a slightly lower bottom circle. According to additional or alternative embodiments that may be combined with other embodiments described herein, the term "cylinder" can be further understood mathematically as having an arbitrary bottom shape, a similar top shape, and a curved surface region or shell connecting the top and bottom shapes. A cylindrical cylinder does not necessarily need to have a circular cross-section. Instead, the bottom and top surfaces may have shapes other than circular. According to some embodiments that may be combined with other embodiments described herein, the cross-section may be triangular, for example, with rounded edges. Therefore, nozzles of adjacent conduits for co-evaporation can be closer together, for example, 70 mm or less.

[0053] According to some embodiments that may be combined with other embodiments described herein, at least one nozzle 100 is in fluid communication with a linear dispensing conduit. Additionally, the crucible may be in fluid communication with the dispensing conduit, and the dispensing conduit is in fluid communication with at least one nozzle.

[0054] Example reference Figure 4 This describes an embodiment of a vacuum deposition system 300. According to an embodiment that can be combined with any other embodiment described herein, the vacuum deposition system 300 includes a vacuum deposition chamber 310 and a material deposition source 200, as referenced above. Figure 3 As exemplarily described, the vacuum deposition system also includes a substrate support for supporting the substrate during deposition.

[0055] In particular, Figure 4A vacuum deposition system 300 is shown, in which a nozzle 100 and a material deposition source 200, according to embodiments described herein, can be used. The vacuum deposition system 300 includes a material deposition source 200 located within a vacuum deposition chamber 310. The material deposition source 200 can be configured for translational movement and rotation about an axis, particularly a substantially vertical axis. The material deposition source 200 has one or more material sources 204, particularly one or more vapor deposition crucibles, and one or more dispensing assemblies 206, particularly one or more dispensing conduits. For example, in Figure 4 The diagram shows two vapor deposition crucibles and two dispensing channels. Additionally, two substrates 170 are disposed within the vacuum deposition chamber 310. Typically, a mask 160 for masking layer deposition on the substrates may be disposed between the substrates and the material deposition source 200.

[0056] According to the embodiments described herein, the substrate is coated with an organic material in a substantially vertical position. Figure 4 The view shown is a top view of a system including a material deposition source 200. Typically, the dispenser is configured as a distribution conduit with vapor distribution nozzles, particularly linear vapor distribution nozzles. The distribution conduit provides a line source that extends substantially vertically. According to the embodiments described herein, which may be combined with other embodiments described herein, substantially vertical is understood to allow deviations of 20° or less (e.g., 10° or less) from the vertical direction, particularly when it comes to substrate orientation. This deviation can be provided, for example, because a substrate support with some deviation from the vertical orientation may result in a more stable substrate position. The surface of the substrate is typically coated by a line source extending in one direction corresponding to a substrate size (e.g., a vertical substrate size) and by translational movement in another direction corresponding to another substrate size (e.g., a horizontal substrate size). According to other embodiments, the deposition system can be a deposition system for depositing material on a substantially horizontally oriented substrate. For example, coating of the substrate in the deposition system can be performed in an upward or downward direction.

[0057] Example reference Figure 4 The material deposition source 200 can be configured to be movable within the vacuum deposition chamber 310, such as by rotation or translation. For example, Figure 4 The example shown depicts a material source arranged on track 330 (e.g., a circular track or linear guide). Typically, the track or linear guide is configured for translational movement of the material deposition source. Depending on different embodiments that may be combined with other embodiments described herein, actuators for translational or rotational movement may be provided within the material deposition source or combinations thereof within a vacuum chamber. Additionally, in Figure 4 In an exemplary embodiment, valve 305, such as a gate valve, is shown. Valve 305 allows control of adjacent vacuum chambers ( Figure 4Vacuum seal (not shown). The valve can be opened to transport the substrate 170 or mask 160 into or out of the vacuum deposition chamber 310.

[0058] like Figure 4 As exemplarily shown, according to an embodiment that can be combined with any other embodiment described herein, two substrates 170 may be supported on corresponding transport tracks within a vacuum chamber. Additionally, two tracks may be provided for providing a mask 160 thereon. Thus, the substrates can be masked by the corresponding masks during coating. According to some embodiments, the masks 160 (i.e., a first mask corresponding to the first substrate and a second mask corresponding to the second substrate) are disposed in a mask frame 161 to hold the masks 160 in a predetermined position. For example, the first mask and the second mask may be pixel masks.

[0059] It should be understood that the described material deposition source and vacuum deposition system can be used in a variety of applications, including applications for OLED device fabrication (including processing methods in which two or more organic materials are simultaneously vapor-deposited). Therefore, for example, as... Figure 4 As shown, two or more distribution pipes and corresponding vapor deposition crucibles can be arranged close to each other. Although Figure 4 The illustrated embodiments provide a deposition system with a movable source; however, those skilled in the art will understand that the above embodiments can also be applied to deposition systems in which a substrate is moved during processing. For example, the substrate to be coated can be guided and driven along a fixed material deposition source.

[0060] According to some embodiments that can be combined with any other embodiments described herein, the vacuum deposition system is configured for a large-area substrate or a substrate carrier supporting one or more substrates. For example, the large-area substrate can be used in display manufacturing and can be a glass or plastic substrate. Specifically, the substrates described herein should encompass substrates typically used in LCDs (liquid crystal displays), PDPs (plasma display panels), OLED displays, etc. For example, a "large-area substrate" may have an area of ​​0.5 μm. 2 Or larger, especially 1m 2 Or a larger main surface area. In some embodiments, the large-area substrate can be a 4.5 generation (which corresponds to approximately 0.67m²). 2 Substrate (0.73m × 0.92m), Generation 5 (which corresponds to approximately 1.4m) 2 Substrate (1.1m × 1.3m), Generation 7.5 (which corresponds to approximately 4.29m) 2 Substrate (1.95m × 2.2m), Generation 8.5 (which corresponds to approximately 5.7m) 2 Substrate (2.2m × 2.5m) or even the 10th generation (which corresponds to approximately 8.7m) 2The substrate is 2.85m × 3.05m. Higher generations (such as the 11th and 12th generations) and corresponding substrate areas can be implemented similarly.

[0061] As used herein, the term "substrate" should specifically encompass non-flexible substrates, such as glass and metal plates. However, this disclosure is not limited thereto, and the term "substrate" can also encompass flexible substrates (such as rolls or foils). According to some embodiments, the substrate can be made of any material suitable for material deposition. For example, the substrate can be made of materials selected from the group consisting of: glass (e.g., soda-lime glass, borosilicate glass, etc.), metals, polymers, ceramics, compound materials, carbon fiber materials, mica, or any other material or combination of materials that can be coated by a deposition process. For example, the thickness of the substrate can be from 0.1 mm to 1.8 mm, such as 0.7 mm, 0.5 mm, or 0.3 mm. In some specific embodiments, the thickness of the substrate can be 50 μm or greater and / or 700 μm or less. Processing thin substrates with a thickness of a few micrometers (e.g., 8 μm or greater and 50 μm or less) can be challenging.

[0062] According to some embodiments that can be combined with other embodiments described herein, the material source, vapor depositor, or crucible described herein may be configured to receive and vapor-deposit an organic material. According to some embodiments, the material to be vapor-deposited may include at least one of ITO, NPD, Alq3, quinacridone, Mg / AG, starburst material, etc. As described herein, a nozzle may be configured to guide the vapor-deposited organic material into a vacuum chamber. For example, the nozzle material may be suitable for vapor-depositing organic materials at temperatures from about 100°C to about 600°C. For example, in some embodiments, the nozzle may include a material with a thermal conductivity greater than 21 W / mK and / or a material that is chemically inert to the vapor-deposited organic material. According to some embodiments, the nozzle may include at least one of Cu, Ta, Ti, Nb, DLC, and graphite, or may include a coating of one of the aforementioned materials on the passage wall.

[0063] In one example, the pressure in the distributor, particularly in the distribution pipe, could be around 10. -2 millibars to approximately 10 -5 Between millibars, or around 10 -2 millibars to 10- 3 Between millibars. According to some implementations, the vacuum chamber can provide approximately 10... -5 To about 10 -7 Millibar pressure.

[0064] Example reference Figure 5AAccording to some embodiments that can be combined with other embodiments described herein, the distribution conduit of the material deposition source may have a substantially triangular cross-section. The distribution conduit 508 has walls 522, 526, and 524 surrounding an internal hollow space 510. Wall 522 is disposed on the outlet side of the distribution conduit, on which nozzle 100 or more nozzles are disposed. The nozzles may be as described above. Figure 1 The nozzle mentioned above. Additionally, and not limited to... Figure 5A In the illustrated embodiment, the nozzle may be connected (e.g., screw-on) to a dispensing channel or may be integrally formed within the dispensing channel. The cross-section of the dispensing channel can be described as substantially triangular. The triangular shape of the dispensing channel allows the outlets (e.g., nozzles) of adjacent dispensing channels to be as close to each other as possible. This allows for improved mixing of different materials from different dispensing channels, such as in the case of co-evaporation of two, three, or even more different materials.

[0065] Allocate the width of the outlet side of the pipe, for example Figure 5A The dimensions of the wall 522 in the cross-section shown are indicated by arrow 552. Additionally, other dimensions of the cross-section of the dispensing conduit 508 are indicated by arrows 554 and 555. According to the embodiment described herein, the width of the outlet side of the dispensing conduit is 30% or less of the largest dimension (e.g., 30%) of the larger dimension indicated by arrow 555. Depending on the size and shape of the dispensing conduit, the nozzles 100 of adjacent dispensing conduits can be positioned at a smaller distance. This smaller distance improves the mixing of organic materials vaporized close to each other.

[0066] Figure 5B An implementation is shown where two distribution pipes are positioned close to each other. Therefore, as... Figure 5B As shown, a material deposition source with two distribution channels can vapor-deposit two organic materials close to each other. For example... Figure 5B As shown, the cross-sectional shape of the distribution pipes allows the nozzles of adjacent distribution pipes to be placed close to each other. According to some embodiments that can be combined with other embodiments described herein, the first nozzle of the first distribution pipe and the second nozzle of the second distribution pipe may have a distance of 70 mm or less, such as from 5 mm to 60 mm. According to some embodiments, the three distribution pipes may be arranged close to each other.

[0067] In light of the foregoing, it should be understood that the embodiments of the material deposition source and the vacuum deposition system described herein are particularly advantageous for the deposition of organic materials, for example, for the fabrication of OLED displays on large-area substrates.

[0068] Example reference Figure 6The flowchart in the document describes an embodiment of a method 600 for depositing material onto a substrate 170 in a vacuum deposition chamber 310. Specifically, method 600 includes vapor deposition 610 of material to be deposited in a crucible. Specifically, the material is heated in the crucible. For example, the material to be deposited may be an organic material used to form an OLED device. The crucible may be heated according to the vapor deposition temperature of the material. In some examples, the material is heated to 600°C, for example, to a temperature between about 100°C and 600°C. According to some embodiments, the crucible is in fluid communication with a dispensing conduit.

[0069] Additionally, method 600 includes providing vapor-deposited material 620 to a dispenser in fluid communication with the crucible. In some embodiments, the dispensing conduit is at a first pressure level, which may typically be, for example, about 10. -2 millibars to 10 -5 millibars, more typically around 10 -2 millibars and 10 -3 Between millibars. According to some embodiments, the vacuum deposition chamber is at a second pressure level, which, for example, can be around 10... -5 Up to 10 -7 Between millibars. In some embodiments, the material deposition source is configured to move the vapor-deposited material in a vacuum using the vapor pressure of the vapor-deposited material, i.e., the vapor-deposited material is driven to (and / or through) the distribution pipe solely by the vapor-deposited pressure (e.g., by the pressure derived from the material vapor deposition). For example, no additional components (such as fans, pumps, etc.) are used to drive the vapor-deposited material to and through the distribution pipe.

[0070] Additionally, method 600 includes guiding 630 vapor-deposited material through a nozzle having a nozzle passage extending from a nozzle inlet to a nozzle outlet, and according to an embodiment of this disclosure. Typically, guiding 630 vapor-deposited material through the nozzle also includes guiding the vapor-deposited material through an outlet section of the nozzle passage having a first passage portion, a second passage portion, and a third passage portion, the second passage portion having an aperture angle that continuously increases in the direction from the nozzle inlet 110 to the nozzle outlet 120, and the third passage portion having a substantially constant aperture angle. In particular, guiding 630 vapor-deposited material through the nozzle passage may include a nozzle passage for guiding vapor-deposited material through a nozzle according to an embodiment described herein, such as referenced... Figure 1 As stated above.

[0071] Therefore, in view of the foregoing, the embodiments of the nozzle, the embodiments of the material deposition source, the embodiments of the vacuum deposition system, and the embodiments of the method for depositing material on a substrate provide improved manufacturing of high-resolution, particularly ultra-high-resolution displays, such as OLED displays, and / or may provide improved material mixing during co-evaporation. According to some embodiments that may be combined with other embodiments described herein, the method for deposition according to the embodiments of this disclosure may be included in a method of manufacturing a device (such as a display device or a semiconductor device). The display device may be, in particular, an OLED display device.

[0072] This written description uses examples to disclose the contents of this disclosure, including best practices, and also enables any person skilled in the art to practice the described subject matter, including making and using any device or system and performing any incorporated methods. Although various specific embodiments have been disclosed in the foregoing, the non-mutually exclusive features of the embodiments described above can be combined with each other. The scope of patent protection is defined by the claims, and other examples are contemplated within the scope of the claims, provided that the claims have structural elements that are not different from the literal language of the claims, or as long as the claims include equivalent structural elements that are not substantially different from the literal language of the claims.

Claims

1. A nozzle for a vapor deposition material dispenser, the nozzle comprising: A nozzle inlet for receiving vapor-deposited material; Nozzle outlet; and A nozzle passage extending between the nozzle inlet and the nozzle outlet, the nozzle passage having a first passage portion, a second passage portion, and a third passage portion, the second passage portion having an aperture angle that continuously increases in the direction from the nozzle inlet (110) to the nozzle outlet (120), and the third passage portion having a substantially constant aperture angle. The diameter of the nozzle passage increases continuously from a first diameter D1 of the first passage portion along the second passage portion until the outlet diameter D2 of the third passage portion having the substantially constant aperture angle. Tangential nodes are provided between the first passage portion and the second passage portion and between the second passage portion and the third passage portion. The tangential nodes are continuous functions of the aperture angle along the direction of the nozzle passage, such that the diameter change from the first passage portion through the second passage portion to the third passage portion is continuous and smooth.

2. The nozzle of claim 1, wherein the first passage portion has an orifice angle of substantially 0°.

3. The nozzle according to claim 1, wherein the aperture angle continuously increases in the second passage portion until an angle α > 25°.

4. The nozzle according to claim 2, wherein the aperture angle continuously increases in the second passage portion until an angle α < 40°.

5. The nozzle according to any one of claims 1 to 4, wherein the length ratio along the direction between the second passage portion and the third passage portion is 1:2 to 2:

1.

6. The nozzle according to any one of claims 1 to 4, wherein the inner diameter of the first passage portion is 10 mm or less.

7. The nozzle according to claim 5, wherein the inner diameter of the first passage portion is 10 mm or less.

8. The nozzle according to claim 1, wherein the inner diameter of the first passage portion is 10 mm or less.

9. The nozzle according to any one of claims 1 to 4, wherein the nozzle comprises a material suitable for vapor deposition of organic materials at a temperature between about 100°C and about 600°C.

10. The nozzle of claim 5, wherein the nozzle comprises a material suitable for vapor deposition of organic materials at temperatures between about 100°C and about 600°C.

11. The nozzle of claim 1, wherein the nozzle comprises a material suitable for vapor deposition of organic materials at temperatures between about 100°C and about 600°C.

12. The nozzle according to any one of claims 1 to 4, wherein the main vapor deposition direction of the nozzle is substantially horizontal.

13. The use of the nozzle according to any one of claims 1 to 4 for depositing material onto a substrate in a vacuum deposition chamber.

14. Use of the nozzle according to claim 13, wherein the deposition of material on the substrate is for the production of organic light-emitting diodes.

15. A material deposition source for depositing material onto a substrate in a vacuum deposition chamber, comprising: Distributor, the distributor being in fluid communication with a material source; and At least one nozzle according to any one of claims 1 to 4.

16. The material deposition source of claim 15, wherein the material source is a crucible for vapor deposition of material, and wherein the dispenser comprises a linear dispensing tube.

17. A vacuum deposition system, comprising: Vacuum deposition chamber; and The material deposition source according to claim 15 is located in the vacuum deposition chamber.

18. A method for depositing material on a substrate in a vacuum deposition chamber, comprising: The material to be deposited is vapor-deposited; Guide the vapor-deposited material to the dispenser; and The vapor-deposited material is guided through a plurality of nozzles according to any one of claims 1 to 4.

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