A semiconductor material testing workbench

Abstract

This invention relates to the field of materials testing technology and provides a semiconductor material testing workbench, including a workbench body with a testing seat mounted on it. A conveyor belt is provided on one side of the workbench body. The workbench body also includes: a clamping mechanism distributed circumferentially around the testing seat on the workbench body and mounted on a control mechanism; and a transport mechanism including a third driving component, a fourth gear, a fifth gear, a third rotating component, a first guide component, a lifting component, a second guide component, a transport seat, and an adsorption component. This semiconductor material testing workbench allows the transport mechanism to reciprocate between the testing seat and the conveyor belt, eliminating manual picking and improving the testing efficiency of semiconductor materials. The clamping mechanism, in conjunction with the control mechanism, can effectively fix semiconductor materials of different thicknesses and widths onto the testing seat.

Description

Technical Field

[0001] This invention belongs to the field of materials testing technology, and in particular relates to a semiconductor materials testing workbench. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. With societal development, the demand for semiconductor materials is constantly increasing. To meet this demand, while semiconductor materials are being produced rapidly, timely testing is also necessary to ensure their quality.

[0003] An existing semiconductor material testing workbench includes a workbench body, on which a conveyor belt for transporting a placement seat is installed. The placement seat is equipped with a fixing mechanism for clamping semiconductor materials, and the workbench body is also provided with an equipment rack. The placement seat, in cooperation with the fixing mechanism and the conveyor belt, can automatically transport semiconductor materials to the bottom of the equipment rack, facilitating testing by the testing equipment.

[0004] In existing workbenches, semiconductor materials need to be manually picked up and placed into the placement seat, or removed from the placement seat, and then placed in a dedicated transfer mechanism to facilitate their entry into the next processing stage. This is not only cumbersome, but also inefficient for manual picking of some small semiconductor materials, which affects the detection efficiency of the testing equipment.

[0005] Therefore, in view of the above situation, there is an urgent need to develop a semiconductor material testing workbench to overcome the shortcomings in current practical applications. Summary of the Invention

[0006] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a semiconductor material testing stage to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A semiconductor material testing workbench includes a workbench body, an equipment rack mounted on one side of the workbench body, a testing seat mounted on the workbench body, and a conveyor belt disposed on the other side of the workbench body. It also includes:

[0009] A clamping mechanism is distributed circumferentially around the detection seat on the main body of the worktable, and the clamping mechanism is mounted on the control mechanism. One end of the control mechanism is installed inside the main body of the worktable. The clamping mechanism effectively fixes semiconductor materials of different thicknesses and widths on the detection seat by cooperating with the control mechanism.

[0010] The conveying mechanism includes a third driving component, a fourth gear, a fifth gear, a third rotating component, a first guide component, a lifting component, a second guide component, a conveying seat, and an adsorption component. The third driving component is installed inside the main body of the workbench on the side near the conveyor belt. A fourth gear is installed on the output end of the third driving component, and the fourth gear meshes with a fifth gear fixed to the bottom of the third rotating component.

[0011] The third rotating component is rotatably installed inside the workbench body. A V-shaped guide groove is provided on the outer wall of the third rotating component. One end of the lifting component extends into the third rotating component and is fixed with a first guide component that slides in cooperation with the V-shaped guide groove.

[0012] The other end of the lifting component extends to the outside of the workbench body and is connected to the transport seat. An adsorption component is installed on the transport seat. A U-shaped guide groove is provided on the outer wall of the lifting component. The U-shaped guide groove slides in cooperation with the second guide component fixed on the inner wall of the workbench body.

[0013] The third driving component drives the fourth gear to rotate, and the fourth gear drives the third rotating component to rotate through the fifth gear. The third rotating component drives the lifting component to rise and fall by cooperating with the V-shaped guide groove and the first guide component. The second guide component drives the lifting component to rotate 180 degrees by cooperating with the U-shaped guide groove. The lifting component drives the adsorption component to rise and fall and rotate 180 degrees through the transport seat. The adsorption component realizes automatic transport of semiconductor materials by rising and falling and rotating 180 degrees.

[0014] As a further technical solution of the present invention, the control mechanism includes a sliding seat, a mounting column, a rotating component, and an adjusting component. The sliding seat is fixed inside the worktable body by the mounting column. Straight grooves for the adjusting component to slide are distributed on both the sliding seat and the worktable body. The adjusting component is installed on the sliding seat. One end of the rotating component is installed inside the worktable body, and the other end of the rotating component is connected to the adjusting component.

[0015] As a further technical solution of the present invention, the adjustment assembly includes an adjustment seat, a sliding member, a mounting member, a second driving member, a third gear, and gear teeth. The adjustment seat is rotatably mounted on the bottom of the sliding seat, and the adjustment seat is movably connected to the sliding member. The sliding member is slidably mounted in a straight groove, and the mounting member is rotatably mounted on the sliding member. A clamping mechanism is fixed to one end of the mounting member extending outside the main body of the worktable, and one end of the mounting member located inside the main body of the worktable is connected to a rotating assembly. The second driving member is fixed on the adjustment seat, and a third gear is fixed to the output end of the second driving member. The third gear meshes with gear teeth distributed on the outer wall of the sliding seat.

[0016] As a further technical solution of the present invention, the adjusting seat is provided with oblique grooves, and one end of the sliding member is slidably installed in the oblique grooves.

[0017] As a further technical solution of the present invention, the rotating assembly includes a first driving component, a transmission module, a rotating component, a first gear, a second gear, a first rotating component, a connecting component, and a second rotating component. The first driving component is fixed inside the worktable body. The output end of the first driving component is connected to the rotating component through the transmission module. The rotating component is rotatably mounted on the outer wall of the mounting column. A first gear is fixed on the rotating component. The first gear meshes with a second gear that is circumferentially distributed inside the worktable body around the rotating component. A first rotating component is fixed on the second gear. The first rotating component is connected to the second rotating component through the connecting component. The second rotating component is fixedly connected to the bottom of the mounting component.

[0018] As a further technical solution of the present invention, both the upper and lower ends of the connector are fixed with locking components, and the first rotating component and the second rotating component are provided with slots on the side near the connector, and the locking components slide with the slots.

[0019] As a further technical solution of the present invention, the clamping mechanism includes a fixed seat, a mounting seat, a telescopic member, and a clamping seat. The fixed seat is fixed on the mounting member, and mounting seats are distributed circumferentially on the side wall of the fixed seat. Telescopic members of different lengths are respectively installed at the bottom of multiple sets of mounting seats, and a clamping seat is fixed at the bottom of the telescopic member.

[0020] As a further technical solution of the present invention, the telescopic component is a telescopic structure composed of a telescopic tube and a spring.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] The conveyor belt carries both untested and tested semiconductor materials. A third drive unit drives a fourth gear to rotate, which in turn drives a third rotating component to rotate via a fifth gear. This third rotating component, in conjunction with a V-shaped guide groove and a first guide component, drives a lifting component to move up and down. A second guide component, in conjunction with a U-shaped guide groove, drives the lifting component to rotate 180 degrees. The lifting component, via a transport seat, drives an adsorption component to move up and down and rotate 180 degrees. The adsorption component, through its lifting and lowering motion, can adsorb semiconductor materials on the testing seat and the conveyor belt, or place the adsorbed semiconductor materials onto the testing seat or the conveyor belt. By rotating 180 degrees, the adsorption component can reciprocate to above the testing seat and the conveyor belt, thus achieving automatic handling of the semiconductor materials. During this process, no manual picking is required, improving the testing efficiency of the semiconductor materials and reducing the labor costs of semiconductor testing. The clamping mechanism, in conjunction with the control mechanism, can effectively fix semiconductor materials of different thicknesses and widths onto the testing seat.

[0023] To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the semiconductor material testing stage provided in an embodiment of the present invention.

[0025] Figure 2 for Figure 1 A partial sectional view of the structure from the side.

[0026] Figure 3 for Figure 2 Enlarged view of the transport mechanism.

[0027] Figure 4 for Figure 3 Side view of the structure of the conveying mechanism

[0028] Figure 5 for Figure 2 Enlarged side view of the control mechanism and clamping mechanism.

[0029] Figure 6 for Figure 5 A side view of the structure in an inclined direction.

[0030] Figure 7 for Figure 6 Enlarged view of the structure at point B.

[0031] Figure 8 for Figure 5 Enlarged view of the structure at point A in the middle.

[0032] Reference numerals: 1 - Workbench body, 2 - Equipment frame, 3 - Detection seat, 4 - Clamping mechanism, 41 - Fixed seat, 42 - Mounting seat, 43 - Telescopic component, 44 - Clamping seat, 5 - Control mechanism, 51 - Sliding seat, 52 - Mounting column, 53 - Rotating assembly, 531 - First driving component, 532 - Transmission module, 533 - Rotating component, 534 - First gear, 535 - Second gear, 536 - First rotating component, 537 - Connecting component, 538 - Second rotating component, 539 - Engaging component, 54 - Adjustment Components: 541 - Adjustment seat; 542 - Sliding component; 543 - Mounting component; 544 - Second drive component; 545 - Third gear; 546 - Gear tooth; 547 - Inclined slide groove; 55 - Straight slide groove; 6 - Conveying mechanism; 61 - Third drive component; 62 - Fourth gear; 63 - Fifth gear; 64 - Third rotating component; 641 - V-shaped guide groove; 65 - First guide component; 66 - Lifting component; 661 - U-shaped guide groove; 67 - Second guide component; 68 - Conveying seat; 69 - Adsorption component; 7 - Conveyor belt. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0034] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0035] like Figures 1 to 4 As shown, a semiconductor material testing workbench provided as an embodiment of the present invention includes a workbench body 1, an equipment rack 2 mounted on one side of the workbench body 1, a testing seat 3 mounted on the workbench body 1, and a conveyor belt 7 disposed on the other side of the workbench body 1. It also includes:

[0036] A clamping mechanism 4 is distributed around the detection seat 3 on the workbench body 1, and the clamping mechanism 4 is mounted on the control mechanism 5. One end of the control mechanism 5 is installed inside the workbench body 1. The clamping mechanism 4 effectively fixes semiconductor materials of different thicknesses and widths on the detection seat 3 by cooperating with the control mechanism 5.

[0037] The conveying mechanism 6 includes a third driving member 61, a fourth gear 62, a fifth gear 63, a third rotating member 64, a first guide member 65, a lifting member 66, a second guide member 67, a conveying seat 68, and an adsorption member 69. The third driving member 61 is installed inside the workbench body 1 on one side near the conveyor belt 7. The fourth gear 62 is installed on the output end of the third driving member 61. The fourth gear 62 meshes with the fifth gear 63 fixed at the bottom of the third rotating member 64.

[0038] The third rotating component 64 is rotatably installed inside the workbench body 1. A V-shaped guide groove 641 is provided on the outer wall of the third rotating component 64. One end of the lifting component 66 extends into the third rotating component 64 and is fixed with a first guide component 65 that slides in cooperation with the V-shaped guide groove 641.

[0039] The other end of the lifting component 66 extends to the outside of the workbench body 1 and is connected to the transport seat 68. An adsorption component 69 is installed on the transport seat 68. A U-shaped guide groove 661 is provided on the outer wall of the lifting component 66. The U-shaped guide groove 661 slides in cooperation with the second guide component 67 fixed on the inner wall of the workbench body 1.

[0040] In this embodiment, the conveyor belt 7 carries undetected and detected semiconductor materials. The third driving member 61 drives the fourth gear 62 to rotate. The fourth gear 62 drives the third rotating member 64 to rotate via the fifth gear 63. The third rotating member 64 drives the lifting member 66 to rise and fall by cooperating with the V-shaped guide groove 641 and the first guide member 65. The second guide member 67 drives the lifting member 66 to rotate 180 degrees by cooperating with the U-shaped guide groove 661. The lifting member 66 drives the suction member 69 to rise and fall and rotate 180 degrees via the transport seat 68. The suction member 69 can be lifted and lowered by the lifting mechanism. The semiconductor material on the detection seat 3 and the conveyor belt 7 is adsorbed, or the adsorbed semiconductor material is placed on the detection seat 3 or the conveyor belt 7. The adsorption component 69 can rotate 180 degrees to move back and forth above the detection seat 3 and the conveyor belt 7, thereby realizing the automatic handling of semiconductor materials. In this process, no manual picking is required, which improves the detection efficiency of the detection equipment for semiconductor materials and reduces the labor cost of semiconductor detection. The clamping mechanism 4, in cooperation with the control mechanism 5, can effectively fix semiconductor materials of different thicknesses and widths on the detection seat 3.

[0041] In a preferred embodiment, the third drive unit 61 is preferably a servo motor;

[0042] The third rotating component 64 preferably adopts a circular cylindrical structure;

[0043] Both the first guide member 65 and the second guide member 67 preferably adopt a columnar structure;

[0044] The lifting component 66 preferably adopts a circular cylindrical structure;

[0045] The adsorption element 69 is preferably a suction cup that can adsorb semiconductor materials.

[0046] like Figures 5 to 7As shown, in a preferred embodiment of the present invention, the control mechanism 5 includes a sliding seat 51, a mounting column 52, a rotating component 53, and an adjusting component 54. The sliding seat 51 is fixed inside the worktable body 1 by the mounting column 52. Both the sliding seat 51 and the worktable body 1 are provided with straight slide grooves 55 for the adjusting component 54 to slide. The adjusting component 54 is mounted on the sliding seat 51. One end of the rotating component 53 is mounted inside the worktable body 1, and the other end of the rotating component 53 is connected to the adjusting component 54.

[0047] like Figures 5 to 7 As shown, in a preferred embodiment of the present invention, the adjustment assembly 54 includes an adjustment seat 541, a sliding member 542, a mounting member 543, a second driving member 544, a third gear 545, and gear teeth 546. The adjustment seat 541 is rotatably mounted on the bottom of the sliding seat 51. The adjustment seat 541 is movably connected to the sliding member 542. The sliding member 542 is slidably mounted in a straight groove 55. The mounting member 543 is rotatably mounted on the sliding member 542. A pressing mechanism 4 is fixed to one end of the mounting member 543 extending outside the worktable body 1. One end of the mounting member 543 located inside the worktable body 1 is connected to the rotating assembly 53. The second driving member 544 is fixed on the adjustment seat 541. The output end of the second driving member 544 is fixed with the third gear 545. The third gear 545 meshes with the gear teeth 546 distributed on the outer wall of the sliding seat 51.

[0048] like Figures 5 to 7 As shown, in a preferred embodiment of the present invention, the adjusting seat 541 is provided with inclined grooves 547, and one end of the sliding member 542 is slidably installed in the inclined grooves 547.

[0049] like Figures 5 to 7 As shown, in a preferred embodiment of the present invention, the rotating assembly 53 includes a first driving member 531, a transmission module 532, a rotating member 533, a first gear 534, a second gear 535, a first rotating member 536, a connecting member 537, and a second rotating member 538. The first driving member 531 is fixed inside the workbench body 1. The output end of the first driving member 531 is connected to the rotating member 533 through the transmission module 532. The rotating member 533 is rotatably mounted on the outer wall of the mounting column 52. The first gear 534 is fixed on the rotating member 533. The first gear 534 meshes with the second gear 535, which is circumferentially distributed inside the workbench body 1 around the rotating member 533. The first rotating member 536 is fixed on the second gear 535. The first rotating member 536 is connected to the second rotating member 538 through the connecting member 537. The second rotating member 538 is fixedly connected to the bottom of the mounting member 543.

[0050] like Figures 5 to 7As shown, in a preferred embodiment of the present invention, both the upper and lower ends of the connector 537 are fixed with engaging members 539, and the first rotating member 536 and the second rotating member 538 are provided with slots on the side near the connector 537, and the engaging members 539 slide in cooperation with the slots.

[0051] like Figure 5 and Figure 8 As shown, in a preferred embodiment of the present invention, the clamping mechanism 4 includes a fixed seat 41, a mounting seat 42, a telescopic member 43, and a clamping seat 44. The fixed seat 41 is fixed on the mounting member 543. Mounting seats 42 are distributed circumferentially on the side wall of the fixed seat 41. The bottom of multiple sets of mounting seats 42 are respectively installed with telescopic members 43 of different lengths. The bottom of the telescopic member 43 is fixed with a clamping seat 44.

[0052] like Figure 5 and Figure 8 As shown, in a preferred embodiment of the present invention, the telescopic member 43 is a telescopic structure composed of a telescopic tube and a spring.

[0053] In this embodiment, the second driving member 544, in cooperation with the third gear 545 and gear teeth 546, can drive the adjusting seat 541 to rotate at the bottom of the sliding seat 51. The adjusting seat 541 drives the sliding member 542 to move along the direction of the straight sliding groove 55 through the inclined sliding groove 547. The sliding member 542 drives the pressing mechanism 4 and the second rotating member 538 to move through the mounting member 543. The pressing mechanism 4 can press semiconductor materials of different widths by moving, ensuring their stability during the detection process and improving the accuracy of the detection data.

[0054] When the slot on the second rotating member 538 is in the same direction as its movement, the second rotating member 538 slides only on the connecting member 537. When the slot on the second rotating member 538 is not in the same direction as its movement, the second rotating member 538 drives the connecting member 537 to slide on the first rotating member 536 through the slot and the engaging member 539.

[0055] The first driving component 531 drives the rotating component 533 to rotate via the transmission module 532. The rotating component 533 drives the second gear 535 to rotate via the first gear 534. The second gear 535 drives the first rotating component 536 to rotate. The first rotating component 536 drives the second rotating component 538 to rotate via the connecting component 537 and the engaging component 539. During the rotation, the engaging components 539 at the upper and lower ends of the connecting component 537 slide continuously in the slots on the first rotating component 536 and the second rotating component 538, respectively. The second rotating component 538 drives the mounting component 543 to rotate. The mounting component 543 simultaneously drives the fixed base 41 and the mounting base 42 to rotate. Multiple sets of mounting bases 42 drive the clamping bases 44 of different heights to rotate via the telescopic component 43. According to the thickness of the semiconductor material, the clamping bases 44 that meet the requirements can effectively fix the semiconductor material by rotating, ensuring its stability during the testing process, improving the accuracy of the test data, and improving the practicality of the testing station.

[0056] In a preferred embodiment, both the first drive unit 531 and the second drive unit 544 are preferably servo motors;

[0057] The transmission module 532 preferably adopts a belt drive structure;

[0058] The rotating component 533 preferably adopts a circular cylindrical structure;

[0059] The first rotating component 536, the connecting component 537, and the second rotating component 538 are all preferably of a disc structure;

[0060] The snap-fit ​​component 539 preferably adopts a strip-shaped block structure;

[0061] The slider 542 preferably adopts an L-shaped block structure;

[0062] The mounting component 543 preferably adopts a cylindrical structure.

[0063] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor material detection workbench, comprising a workbench body, a device rack is installed on one side of the workbench body, a detection seat is installed on the workbench body, and a conveying belt is arranged on the other side of the workbench body, characterized in that, Also include: The pressing mechanism is circumferentially distributed on the workbench body around the detection seat, and the pressing mechanism is installed on the control mechanism, one end of the control mechanism is installed in the workbench body, and the pressing mechanism is effectively fixed on the detection seat through cooperation with the control mechanism. The carrying mechanism includes a third driving element, a fourth gear, a fifth gear, a third rotating element, a first guide element, a lifting element, a second guide element, a carrying seat and a suction accessory, the third driving element is installed in the workbench body near one side of the conveying belt, the output end of the third driving element is provided with the fourth gear, and the fourth gear is engaged with the fifth gear fixed on the bottom of the third rotating element. The third rotating element is rotatably installed in the workbench body, V-shaped guide grooves are formed in the outer wall of the third rotating element, one end of the lifting element extends into the third rotating element and is fixed with the first guide element which is in sliding cooperation with the V-shaped guide grooves. The other end of the lifting element extends to the outside of the workbench body and is connected with the carrying seat, the suction accessory is installed on the carrying seat, U-shaped guide grooves are formed in the outer wall of the lifting element, and the U-shaped guide grooves are in sliding cooperation with the second guide element fixed on the inner wall of the workbench body. The third driving element drives the fourth gear to rotate, the fourth gear drives the third rotating element to rotate through the fifth gear, the third rotating element drives the lifting element to lift through cooperation with the V-shaped guide grooves and the first guide element, the second guide element drives the lifting element to rotate 180 degrees through cooperation with the U-shaped guide grooves, the lifting element drives the suction accessory to lift and rotate 180 degrees through the carrying seat, and the suction accessory realizes automatic carrying of the semiconductor material through lifting and rotating 180 degrees.

2. The semiconductor material testing station of claim 1, wherein, The control mechanism includes a sliding seat, a mounting column, a rotating assembly and an adjusting assembly, the sliding seat is fixed in the workbench body through the mounting column, the sliding seat and the workbench body are both provided with straight sliding grooves for the adjusting assembly to slide, the adjusting assembly is installed on the sliding seat, one end of the rotating assembly is installed in the workbench body, and the other end of the rotating assembly is connected with the adjusting assembly.

3. The semiconductor material testing station of claim 2, wherein, The adjusting assembly includes an adjusting seat, a sliding element, a mounting element, a second driving element, a third gear and a tooth, the adjusting seat is rotatably installed at the bottom of the sliding seat, the adjusting seat is movably connected with the sliding element, the sliding element is slidably installed in the straight sliding groove, the mounting element is rotatably installed on the sliding element, one end of the mounting element extending to the outside of the workbench body is fixed with the pressing mechanism, one end of the mounting element located in the workbench body is connected with the rotating assembly, the second driving element is fixed on the adjusting seat, the output end of the second driving element is fixed with the third gear, and the third gear is engaged with the tooth distributed on the outer wall of the sliding seat.

4. The semiconductor material testing station of claim 3, wherein, The adjusting seat is provided with an inclined sliding groove, and one end of the sliding element is slidably installed in the inclined sliding groove.

5. The semiconductor material testing station of claim 3, wherein, The rotating assembly comprises a first driving member, a transmission module, a rotating member, a first gear, a second gear, a first rotating member, a connecting member and a second rotating member, the first driving member is fixed in the workbench main body, the output end of the first driving member is connected with the rotating member through the transmission module, the rotating member is rotatably installed on the outer wall of the mounting column, the first gear is fixed on the rotating member, the first gear is engaged with the second gear which is distributed in the workbench main body in the circumferential direction around the rotating member, the first rotating member is fixed on the second gear, the first rotating member is connected with the second rotating member through the connecting member, and the second rotating member is fixedly connected with the bottom of the mounting member.

6. The semiconductor material testing station of claim 5, wherein, The upper and lower ends of the connecting member are fixedly connected with clamping members, the first rotating member and the second rotating member are both provided with clamping grooves on the side close to the connecting member, and the clamping members are in sliding connection with the clamping grooves.

7. The semiconductor material testing station of claim 3, wherein, The pressing mechanism comprises a fixing seat, a mounting seat, an extension member and a pressing seat, the fixing seat is fixed on the mounting member, the side wall of the fixing seat is circumferentially provided with the mounting seat, the bottoms of the mounting seats are respectively provided with the extension members with different lengths, and the bottom of the extension member is fixedly connected with the pressing seat.

8. The semiconductor material testing station of claim 7, wherein, The extension member is a telescopic structure composed of a telescopic pipe and a spring.

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