Detection system and detection method of electron beam evaporation table, and storage medium

Abstract

The present application relates to a detection system, detection method, and storage medium for an electron beam evaporation table. The detection system includes a gravity detection device, located on the surface of the planetary frame facing away from the plating pot, for detecting the real-time weight of the planetary frame and generating a weight detection signal; a determination device, for receiving and determining the number of plating pots installed on the planetary frame based on the weight detection signal, and generating a first control signal when it is determined that all plating pots are installed on the planetary frame; and a control device, for receiving and controlling the rotation motor to a locked state based on the first control signal to prohibit manual rotation of the plating pot. This eliminates the problem of wafer fragmentation caused by uneven force when the plating pot is rotated by manual thrust, reduces the amount of wafer scrap caused by the evaporation table, and thus reduces manufacturing costs.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a detection system and method for an electron beam evaporation table, and a storage medium. Background Art

[0002] After the plating pot (dome) loaded with wafers is installed on the planetary frame inside the evaporation table, the dome can rotate on the planetary frame when subjected to force. The wafers fixed on the dome rotate with the rotation of the dome, and the wafers on the dome will be broken, increasing manufacturing costs. Summary of the Invention

[0003] Based on this, it is necessary to address the above technical issues and provide an electron beam evaporation table detection system, detection method, and storage medium that can reduce wafer fragmentation in the evaporation table, thereby reducing manufacturing costs.

[0004] A detection system for an electron beam evaporation table, the electron beam evaporation table includes a planetary frame and a plating pot, the plating pot is detachably mounted on the planetary frame, and the detection system includes:

[0005] The gravity detection device is located on the surface of the planetary frame away from the plating pot, and is used to detect the real-time weight of the planetary frame and generate a weight detection signal;

[0006] a determination device for receiving and determining the number of plating pots installed on the planetary carrier according to the weight detection signal, and generating a first control signal when it is determined that all the plating pots are installed on the planetary carrier;

[0007] The control device is used to receive and control the rotary motor to be in a locked state according to the first control signal to prohibit manual rotation of the plating pot.

[0008] The detection system of the above-mentioned electron beam evaporation table detects the real-time weight of the planetary frame through a gravity detection device, and the judgment device determines the number of plating pots installed on the planetary frame according to the real-time weight of the planetary frame. When it is determined that all the plating pots are installed on the planetary frame, a first control signal is generated to enable the control device to put the rotating motor into a locked state that prohibits manual rotation of the plating pot according to the first control signal, thereby eliminating the problem of wafers on the plating pot being broken due to uneven force when the plating pot is rotated by manual thrust, reducing the amount of wafer scrap caused by the evaporation table, and thus reducing manufacturing costs.

[0009] In one embodiment, the distance between the gravity detection device and each plating pot is equal.

[0010] In one embodiment, the determination device is used to obtain the real-time weight according to the weight detection signal, and when the real-time weight is greater than or equal to the preset weight value, determine that the plating pots are all installed on the planetary frame.

[0011] In one embodiment, the determination device is further used to generate a second control signal when it is determined that there is a plating pot that is not installed on the planetary carrier; the control device is further used to control the rotary motor to release the locked state according to the second control signal.

[0012] In one embodiment, the planetary carrier includes a bracket for mounting a plating pot, the bracket corresponding to the plating pot one by one, and the detection system further includes:

[0013] The position detection device is located on the bracket and is used to detect the distance between the fixing device of the plating pot and the bracket when the plating pot is installed on the planetary rack, and generate a position signal; the judgment device is also used to judge whether the plating pot is installed in place according to the position signal. The position detection device is located on the surface of the bracket away from the plating pot.

[0014] A method for detecting an electron beam evaporation table, wherein the electron beam evaporation table includes a planetary frame and a plating pot, wherein the plating pot is detachably mounted on the planetary frame. The detection method includes:

[0015] Detecting the real-time weight of the planetary carrier and generating a weight detection signal;

[0016] Determining the number of plating pots installed on the planetary frame according to the weight detection signal, and generating a first control signal when it is determined that all the plating pots are installed on the planetary frame;

[0017] The rotary motor is controlled to be in a locked state according to the first control signal to prohibit manual rotation of the plating pot.

[0018] The detection method of the above-mentioned electron beam evaporation table determines the number of plating pots installed on the planetary frame through a weight detection signal indicating the real-time weight of the planetary frame, and generates a first control signal when all the plating pots are installed on the planetary frame to put the rotating motor into a locked state that prohibits manual rotation of the plating pots. This eliminates the problem of wafers on the plating pot being broken into pieces due to uneven force when the plating pot is rotated by manual thrust, reduces the amount of wafer scrap caused by the evaporation table, and thus reduces manufacturing costs.

[0019] In one embodiment, determining the number of plating pots installed on the planetary carrier according to the weight detection signal includes:

[0020] Get real-time weight according to weight detection signal;

[0021] When the real-time weight is greater than or equal to the preset weight value, it is determined that the plating pots are all installed on the planetary frame.

[0022] In one embodiment, the method for detecting an electron beam evaporation station further includes:

[0023] When it is determined that there is a plating pot that is not mounted on the planet carrier, generating a second control signal;

[0024] The rotary motor is controlled to release the locked state according to the second control signal.

[0025] In one embodiment, the planet carrier includes a bracket for mounting a plating pot, the bracket corresponding to each plating pot, and further includes:

[0026] When the plating pot is mounted on the planetary frame, the distance between the fixing device of the plating pot and the bracket is detected, and a position signal is generated;

[0027] Determine whether the plating pot is installed in place based on the position signal.

[0028] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of any one of the above-mentioned methods for detecting an electron beam evaporation table. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 Schematic diagram of the structure of a detection system for an electron beam evaporation table in one embodiment;

[0031] Figure 2 is a schematic structural diagram of a detection system for an electron beam evaporation table in another embodiment;

[0032] Figure 3 FIG. 4 is a flow chart of a method for detecting an electron beam evaporation table according to an embodiment.

[0033] Description of reference numerals:

[0034] 102. Planetary carrier; 104. Plating pot; 106. Gravity detection device; 108. Determination device; 110. Control device; 112. Position detection device; 202. Mounting shaft; 204. Bracket; 206. Positioning hole; 208. Fixing device; 210. Preset wafer. DETAILED DESCRIPTION

[0035] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0037] It will be understood that the terms "first," "second," etc., used in this disclosure may be used herein to describe various elements or signals, but these elements or signals are not limited by these terms. These terms are only used to distinguish a first element or signal from another element or signal. For example, without departing from the scope of this disclosure, a first control signal may be referred to as a second control signal, and similarly, a second control signal may be referred to as a first control signal. Both the first control signal and the second control signal are control signals, but they are not the same control signal.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the description of the present disclosure, the meaning of "several" is at least one, such as one, two, etc., unless otherwise clearly and specifically defined.

[0039] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intervening element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc., if there is transmission of electrical signals or data between the connected objects.

[0040] When used herein, the singular forms "a", "an", and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0041] After the dome is installed on the planetary frame in the electron beam evaporation table, the dome on the planetary frame can be rotated manually at will. The uneven manual thrust causes uneven force on the wafer fixed on the dome, resulting in the risk of fragmentation. How to prevent the wafer on the dome from being broken by manual thrust has become an urgent problem that needs to be solved.

[0042] Figure 1FIG. 1 is a schematic diagram of the structure of a detection system for an electron beam evaporation table in one embodiment. Figure 1 As shown, in order to solve the above problems, in this embodiment, a detection system for an electron beam evaporation table is provided. The electron beam evaporation table includes a planetary frame 102 and a plating pot 104. The planetary frame 102 is an integrated structure consisting of a mounting shaft 202 and a bracket 204. The planetary frame 102 is mounted in the process chamber of the electron beam evaporation table through the mounting shaft 202. The planetary frame can be rotated in the process chamber through the mounting shaft 202. The bracket 204 is provided with a positioning hole 206 that passes through the bracket 204. The protrusion on the top of the plating pot 104 passes through the positioning hole 206. After the hole 206, the fixing device 208 is installed on the protrusion on the side of the bracket 204 facing away from the plating pot, so that the plating pot 104 can be detachably installed on the planetary frame 102. A preset wafer 210 is fixed on the plating pot 104. The preset wafer 210 is a product wafer prepared for the evaporation process in the electron beam evaporation table. The preset wafer 210 includes a product wafer that needs to be metallized on the back after thinning and a product wafer that needs to be film-formed on the front; the rotation of the plating pot 104 includes its own rotation relative to the bracket 204 and its revolution with the planetary frame 102. The detection system of the electron beam evaporation table includes: a gravity detection device 106, a judgment device 108 and a control device 110. The gravity detection device 106 is located on the surface of the planetary frame 102 away from the coating pot 104. The deviation here refers to the coating pot 104 being installed on the planetary frame 102. The overall weight of the planetary frame 102 changes with the loading or unloading of the coating pot 104. The gravity detection device 106 is used to detect the real-time weight of the planetary frame 102 and generate a weight detection signal based on the detected real-time weight; the judgment device 108 is connected to the weight detection device 106 and is used to receive the weight detection signal generated by the weight detection device 106 and generate a weight detection signal based on the received weight. The weight detection signal is used to determine the number of plating pots 104 installed on the planetary rack 102. When it is determined that all the plating pots 104 are installed on the planetary rack 102, a first control signal is generated. Here, "all the plating pots 104 are installed on the planetary rack 102" means that all the positioning holes 206 configured on the planetary rack 102 are equipped with plating pots 104. The control device 110 is connected to the determination device 108 for receiving the first control signal generated by the determination device 108, and controlling the rotary motor in the electron beam evaporation table to be in a locked state according to the received first control signal, so as to prohibit manual rotation of the plating pot 104, thereby preventing the plating pot 104 from rotating due to manual thrust.

[0043] The detection system of the above-mentioned electron beam evaporation table detects the real-time weight of the planetary rack 102 through the gravity detection device 106, and the determination device 108 determines the number of plating pots 104 installed on the planetary rack 102 according to the real-time weight of the planetary rack 102. When it is determined that all the plating pots 104 are installed on the planetary rack 102, a first control signal is generated to enable the control device 110 to lock the rotating motor according to the first control signal to prohibit manual rotation of the plating pots 104, thereby eliminating the problem of uneven force when the plating pot 104 is rotated by manual thrust, resulting in fragmentation of the wafers on the plating pot 104, reducing the amount of wafer scrap caused by the evaporation table, and thus reducing manufacturing costs.

[0044] In one embodiment, the distance L between the gravity detection device 106 and each plating pot 104 is equal. For example, the distance L is the length between the gravity detection device 106 and the positioning hole 206 on the bracket 204. This configuration can improve the accuracy of the weight detection signal generated by the gravity detection device 106.

[0045] In some embodiments, the weight detection device 106 includes a weight detector and a weight sensor.

[0046] In one embodiment, the determination device 108 is used to obtain the real-time weight of the planetary carrier 102 based on the weight detection signal, and when the real-time weight is greater than or equal to the preset weight value, determine that the plating pots 104 are all installed on the planetary carrier 102. The preset weight value is the weight W0 of the planetary carrier 102 after all the plating pots 104 that do not carry wafers are installed on the planetary carrier 102.

[0047] In some embodiments, the determination device 108 is used to obtain the real-time weight of the planetary carrier 102 according to the weight detection signal, and determine that there is a plating pot 104 not installed on the planetary carrier 102 when the real-time weight is less than a preset weight value.

[0048] Specifically, the wafers have a certain mass. After the plating pots 104 carrying the wafers are installed on the planetary rack 102, the real-time weight of the planetary rack 102 is the sum of the weight W0 and the weight of all the wafers installed on the planetary rack 102, which is greater than the weight W0; before the plating pots 104 carrying the wafers are not all installed on the planetary rack 102, the real-time weight of the planetary rack 102 is the sum of the weight W0 and the weight W01 of the wafers already installed on the planetary rack 102 minus the weight W02 of the uninstalled plating pots 104, that is, W0+W01-W02. Compared with the plating pots 104, the weight W01 of the wafers already installed on the planetary rack 102 is very small, and W01-W02 is a negative number. Therefore, W0+W01-W02 is less than the weight W0. Through the preset weight value and the real-time weight of the planetary rack 102, it can be accurately determined whether the plating pots 104 are all installed on the planetary rack 102.

[0049] In some embodiments, the determination device 108 is used to obtain the real-time weight of the planetary rack 102 based on the weight detection signal, and when the real-time weight is greater than the initial weight value, it is determined that the plating pots 104 are all installed on the planetary rack 102. The initial weight value is the total weight W1 of all plating pots 104 that can be installed in the process chamber of the electronic evaporation table at the same time.

[0050] In some embodiments, the determination device 108 is used to obtain the real-time weight of the planetary carrier 102 according to the weight detection signal, and determine that there is a plating pot 104 not installed on the planetary carrier 102 when the real-time weight is less than the initial weight value.

[0051] Specifically, the sum of the weights W10 of the mounting shaft 202 and the bracket 204 is less than the weight W11 of one plating pot 104. After all the plating pots 104 are mounted on the planetary rack 102, the real-time weight of the planetary rack 102 is the sum of the weight of the mounting shaft 202, the weight of the bracket 204 and the total weight W1 of all the plating pots 102 (the sum of the weight of the plating pot 102 itself and the weight of the wafer), that is, W01+W1, which is greater than the total weight W1 of the plating pots 104. Before all the plating pots 104 are mounted on the planetary rack 102, the real-time weight of the planetary rack 102 is the sum of the weight of the mounting shaft 202, the weight of the bracket 204, the total weight W1 of all the plating pots 102 and the weight of the installed plating pots 104. The sum of the weight W12 of the wafers on the planetary rack 102 minus the weight W13 of the uninstalled plating pot 104 is W01+W1+W12-W13. Relative to the plating pot 104, the sum of the weight W12 of the wafers installed on the planetary rack 102, the weight of the mounting shaft 202 and the weight W10 of the bracket 204 are very small, and W01+W12-W13 is a negative number. Therefore, W01+W1+W12-W13 is less than the total weight W1. Through the initial weight value and the real-time weight of the planetary rack 102, it is possible to accurately determine whether the plating pot 104 is fully installed on the planetary rack 102, and at the same time, the accuracy requirements when selecting the weight detection device 106 can be reduced.

[0052] In one embodiment, the determination device 108 is further configured to generate a second control signal when determining that there is a plating pot 104 that is not mounted on the planetary carrier 102; the control device 110 is further configured to control the rotary motor to release the locked state according to the second control signal.

[0053] Figure 2 FIG. 1 is a schematic structural diagram of a detection system for an electron beam evaporation table in another embodiment. Figure 2As shown, in one embodiment, the planetary carrier 102 includes a bracket 204 for mounting the coating pot 104. The bracket 204 corresponds to the coating pot 104 on a one-to-one basis, i.e., one coating pot 104 is mounted on each bracket 204. The detection system of the electron beam evaporation table further includes: a position detection device 112, located on the bracket 204, for detecting the height between a fixing device 208 of the coating pot 104 and the bracket 204 when the coating pot 104 is mounted on the planetary carrier 102, and generating a position signal. The distance here refers to the distance of the fixing device 208 away from the bracket 204; a determination device 108 connected to the position detection device 112, for receiving the position signal and determining whether the coating pot 104 is properly installed based on the position signal. The position detection device 112 is located on the surface of the bracket 204 facing away from the coating pot 104. By providing the position detection device 112, it is possible to determine whether the coating pot 104 on the planetary carrier 102 is properly installed, thereby avoiding the impact of abnormal installation of the coating pot 104. For example, the position detection device 112 is close to the positioning hole 206 to improve the detection accuracy. The position detection device 112 corresponds to the bracket 204 one by one, that is, the bracket on which the plating pot 104 is mounted is provided with a position detection device 112.

[0054] In some embodiments, the position detection device 112 includes a position sensor.

[0055] In one embodiment, the control device 110 is further configured to set the electron beam evaporation table to a waiting state upon receiving the first control signal and the third control signal, wherein the third control signal indicates that the plating pot 104 is installed in place on the bracket 204 .

[0056] In some embodiments, the electron beam evaporation station is used to perform a backside metal evaporation process on a product wafer after backside thinning.

[0057] For example, the weight of the plating pot 102 is 4 kg, and three plating pots 102 can be placed in the electron beam evaporation table at a time. The weight detection device 106 detects the real-time weight of the planetary rack 102 and generates a weight detection signal according to the detected real-time weight; the judgment device 108 obtains the real-time weight of the planetary rack 102 according to the weight detection signal, and when the real-time weight is greater than 12 kg, it determines that the plating pots 104 are all installed on the planetary rack 102 and generates a first control signal; after receiving the first control signal, the control device 110 controls the rotary motor to be in a locked state, and the plating pot 104 cannot be moved manually, thereby avoiding the plating pot 104 from being subjected to uneven thrust, which causes the product wafer fixed on the plating pot 104 to be broken into pieces.

[0058] Each device in the detection system for the electron beam evaporation table described above can be implemented in whole or in part through software, hardware, or a combination thereof. Each of these devices can be embedded in or independent of a processor within a computer device in hardware form, or stored in a computer device memory in software form, allowing the processor to call and execute the corresponding operations of each of these devices. It should be noted that the division of devices in the embodiments of this application is illustrative and represents only a logical functional division; alternative divisions may be employed in actual implementation.

[0059] Figure 3 FIG. 1 is a flow chart of a detection method for an electron beam evaporation table in one embodiment. Figure 3 As shown, in this embodiment, a detection method for an electron beam evaporation table is provided. The electron beam evaporation table includes a planetary frame and a plating pot. The plating pot is detachably mounted on the planetary frame. The description of the electron beam evaporation table is described in the aforementioned description of the detection system for the electron beam evaporation table, and will not be repeated here. The detection method for the electron beam evaporation table includes:

[0060] S102, detecting the real-time weight of the planet carrier and generating a weight detection signal.

[0061] S104, determining the number of plating pots installed on the planetary frame according to the weight detection signal, and generating a first control signal when it is determined that all the plating pots are installed on the planetary frame.

[0062] S106, controlling the rotary motor to be in a locked state according to the first control signal to prohibit manual rotation of the plating pot.

[0063] Specifically, the weight of the planetary rack changes with the installation and unloading of the plating pot, the real-time weight of the planetary rack is detected, and a weight detection signal is generated according to the real-time weight of the planetary rack; the real-time weight of the planetary rack is obtained according to the weight detection signal, and the number of plating pots installed on the planetary rack is determined according to the real-time weight. When it is determined that all the plating pots are installed on the planetary rack, a first control signal is generated, and then the rotation motor is controlled to be in a locked state according to the first control signal, and manual rotation of the plating pot is prohibited, thereby avoiding the problem of uneven force on the plating pot causing the product wafer fixed on the plating pot to crack.

[0064] The detection method of the above-mentioned electron beam evaporation table determines the number of plating pots installed on the planetary frame through a weight detection signal indicating the real-time weight of the planetary frame, and generates a first control signal when all the plating pots are installed on the planetary frame to put the rotating motor into a locked state that prohibits manual rotation of the plating pots. This eliminates the problem of wafers on the plating pot being broken into pieces due to uneven force when the plating pot is rotated by manual thrust, reduces the amount of wafer scrap caused by the evaporation table, and thus reduces manufacturing costs.

[0065] In one embodiment, determining the number of plating pots installed on the planetary frame according to the weight detection signal includes steps S202-S204.

[0066] S202, obtaining real-time weight according to the weight detection signal.

[0067] S204: When the real-time weight is greater than or equal to the preset weight value, it is determined that the plating pots are all installed on the planetary frame.

[0068] Specifically, the preset weight value is the weight W0 of the planetary rack after all plating pots without wafers are installed on the planetary rack. The wafers have a certain mass. After all plating pots with wafers are installed on the planetary rack, the real-time weight of the planetary rack is the sum of the weight W0 and the weight of all wafers installed on the planetary rack, which is greater than the weight W0. Therefore, when the real-time weight is greater than or equal to the preset weight value, it is determined that all plating pots are installed on the planetary rack.

[0069] In one embodiment, step S202 further includes: when the real-time weight is less than the preset weight value, determining that there is a plating pot that is not installed on the planetary frame.

[0070] Specifically, before the plating pot 104 carrying the wafers is fully installed on the planetary rack 102, the real-time weight of the planetary rack 102 is the sum of the weight W0 and the weight W01 of the wafers already installed on the planetary rack 102 minus the weight W02 of the uninstalled plating pot 104, that is, W0+W01-W02. The weight W01 of the wafers already installed on the planetary rack 102 is very small relative to the plating pot 104, and W01-W02 is a negative number. Therefore, W0+W01-W02 is less than the weight W0. Through the preset weight value and the real-time weight of the planetary rack 102, it can be accurately determined whether the plating pot 104 is fully installed on the planetary rack 102.

[0071] In some embodiments, determining the number of plating pots installed on the planetary rack according to the weight detection signal includes steps S302-S304.

[0072] S302, obtaining the real-time weight of the planet carrier according to the weight detection signal.

[0073] S304: When the real-time weight is greater than the initial weight value, it is determined that the plating pots are all installed on the planetary frame.

[0074] Specifically, the initial weight value is the total weight W1 of all the plating pots 104 that can be installed simultaneously in the process chamber of the electronic evaporation table. The sum of the weights W10 of the mounting shaft 202 and the bracket 204 is less than the weight W11 of one plating pot 104. When all the plating pots 104 are installed on the planetary rack 102, the real-time weight of the planetary rack 102 is the sum of the weight of the mounting shaft 202, the weight of the bracket 204 and the total weight W1 of all the plating pots 102 (the sum of the weight of the plating pot 102 itself and the weight of the wafer), that is, W01+W1, which is greater than the total weight W1 of the plating pots 104. Therefore, when the real-time weight is greater than the initial weight value, it is determined that all the plating pots are installed on the planetary rack.

[0075] In one embodiment, step S302 further includes: when the real-time weight is less than the preset weight value, determining that there is a plating pot that is not installed on the planetary frame.

[0076] Specifically, before all the plating pots are installed on the planetary rack, the real-time weight of the planet is the sum of the weight of the mounting shaft, the weight of the bracket, the total weight W1 of all the plating pots and the weight W12 of the wafers already installed on the planetary rack, minus the weight W13 of the uninstalled plating pots, that is, W01+W1+W12-W13. Relative to the plating pots, the weight W12 of the wafers already installed on the planetary rack, the sum of the weight W10 of the mounting shaft and the bracket are very small, and W01+W12-W13 is a negative number. Therefore, W01+W1+W12-W13 is less than the total weight W1. Through the initial weight value and the real-time weight of the planetary rack, it is possible to accurately determine whether all the plating pots are installed on the planetary rack, and at the same time, the accuracy requirements when selecting the weight detection device can be reduced.

[0077] In one embodiment, the method for detecting an electron beam evaporation station further includes steps S402 - S404 .

[0078] S402, when it is determined that there is a plating pot that is not installed on the planetary carrier, a second control signal is generated.

[0079] S404 , controlling the rotation motor to release the locked state according to the second control signal.

[0080] In one embodiment, the planetary frame includes a bracket for mounting a plating pot, and the bracket corresponds to the plating pot one by one, that is, one plating pot is mounted on one bracket. The detection method of the electron beam evaporation table further includes steps S502-S504.

[0081] S502, when the plating pot is installed on the planetary frame, the distance between the fixing device of the plating pot and the bracket is detected, and a position signal is generated.

[0082] S504, determining whether the plating pot is installed in place according to the position signal.

[0083] Specifically, when the plating pot is mounted on the planetary carrier, the distance between the plating pot's fixture and the bracket is detected, and a position signal is generated based on the detected distance. The position signal is then used to determine whether the plating pot is properly installed. By detecting the distance between the plating pot's fixture and the bracket, it is possible to determine whether the plating pot is properly installed on the planetary carrier, thereby avoiding the impact of improper plating pot installation. Exemplarily, a position detection device detects the distance between the plating pot's fixture and the bracket and generates a position signal. The position detection device includes a position sensor.

[0084] In some embodiments, when the first control signal and the third control signal are generated, the electron beam evaporation stage is set to a standby state, wherein the third control signal indicates that the plating pot is installed in place on the bracket.

[0085] It should be understood that although Figure 3 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 3 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The order of execution of these steps or stages is not necessarily one by one, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0086] The present disclosure further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of any one of the above-mentioned methods for detecting an electron beam evaporation table are implemented.

[0087] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0088] Throughout this specification, references to terms such as "some embodiments," "other embodiments," and "desired embodiments" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the illustrative descriptions of these terms do not necessarily refer to the same embodiment or example.

[0089] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A detection system for an electron beam evaporation table, characterized in that: The electron beam evaporation table includes a planetary frame and a plating pot, wherein the plating pot is detachably mounted on the planetary frame, and the detection system includes: a gravity detection device, located on a surface of the planetary frame facing away from the plating pot, for detecting the real-time weight of the planetary frame and generating a weight detection signal; a determination device, configured to receive and determine the number of plating pots installed on the planetary carrier according to the weight detection signal, and generate a first control signal when it is determined that all the plating pots are installed on the planetary carrier; The control device is used to receive and control the rotary motor to be in a locked state according to the first control signal to prohibit manual rotation of the plating pot.

2. The detection system according to claim 1, characterized in that: The distance between the gravity detection device and each plating pot is equal.

3. The detection system according to claim 1, characterized in that The determining device is used to obtain the real-time weight according to the weight detection signal, and when the real-time weight is greater than or equal to the preset weight value, determine that the plating pots are all installed on the planetary frame.

4. The detection system according to claim 1, characterized in that The determining device is further configured to generate a second control signal when determining that the plating pot is not mounted on the planetary carrier; the control device is further configured to control the rotary motor to release the locked state according to the second control signal.

5. The detection system according to claim 1, characterized in that The planetary carrier includes a bracket for mounting the plating pot, the bracket corresponding to the plating pot one by one, and further includes: The position detection device is located on the bracket and is used to detect the distance between the fixing device of the plating pot and the bracket when the plating pot is installed on the planetary rack, and to generate a position signal; the judgment device is also used to judge whether the plating pot is installed in place based on the position signal, and the position detection device is located on the surface of the bracket facing away from the plating pot.

6. A method for detecting an electron beam evaporation table, characterized in that: The electron beam evaporation table includes a planetary frame and a plating pot, wherein the plating pot is detachably mounted on the planetary frame. The detection method includes: detecting the real-time weight of the planet carrier and generating a weight detection signal; determining the number of plating pots installed on the planetary carrier according to the weight detection signal, and generating a first control signal when it is determined that all the plating pots are installed on the planetary carrier; The rotary motor is controlled to be in a locked state according to the first control signal to prohibit manual rotation of the plating pot.

7. The detection method according to claim 6, characterized in that The determining the number of plating pots installed on the planetary frame according to the weight detection signal includes: Obtaining the real-time weight according to the weight detection signal; When the real-time weight is greater than or equal to the preset weight value, it is determined that the plating pots are all installed on the planetary frame.

8. The detection method according to claim 6, characterized in that Also includes: When it is determined that the plating pot is not mounted on the planet carrier, generating a second control signal; The rotary motor is controlled to release the locked state according to the second control signal.

9. The detection method according to claim 6, characterized in that The planetary carrier includes a bracket for mounting the plating pot, the bracket corresponding to the plating pot one by one, and further includes: When the plating pot is mounted on the planetary carrier, detecting the distance between the fixing device of the plating pot and the bracket and generating a position signal; Whether the plating pot is installed in place is determined based on the position signal.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the detection method according to any one of claims 6 to 9 are implemented.

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