A substrate chuck for a semiconductor device

Abstract

The present invention discloses a substrate chuck for a semiconductor device, which includes a substrate chuck base and a substrate table; a knob positioning assembly is provided on the substrate chuck base, and the knob positioning assembly is used to assist in the installation and positioning of the substrate table onto the substrate chuck base and can precisely rotate and adjust the circumferential position of the substrate table on the substrate chuck base; a substrate positioning member is provided on the substrate table, and the substrate positioning member is used to clamp substrates of various specifications and sizes onto the substrate table; the tension posts on the substrate chuck base are connected to the connection device of the exposure chamber to realize the clamping of the substrate chuck base in the exposure chamber. The present invention has the advantages of compact structure, simple operation, high compatibility, and high positioning accuracy, solves the problems in the prior art that a single substrate cannot be quickly and accurately positioned after entering the exposure chamber, resulting in low substrate exposure efficiency and unstable quality, and realizes the rapid and accurate positioning of the substrate and high-quality engraving.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor vacuum equipment, and particularly relates to a substrate chuck of a semiconductor device. Background Art

[0002] The main working object of semiconductor vacuum equipment is a substrate (wafer). It is difficult to precisely adjust the position of a single substrate after it enters the exposure chamber. Therefore, it is necessary to design a substrate chuck to convert the external precise positioning of the substrate into the precise positioning of the clamping device and the connection device of the exposure chamber, so as to achieve the precise positioning of the substrate in the exposure chamber. Currently, there is no related substrate chuck in the prior art. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a substrate chuck of a semiconductor device with a compact structure, simple operation, high compatibility, and high positioning accuracy, aiming at the problem that a single substrate cannot be precisely positioned after entering the exposure chamber in the prior art.

[0004] To solve the above technical problem, the present invention adopts the following technical solutions:

[0005] A substrate chuck of a semiconductor device includes a substrate chuck base and a substrate stage; a knob positioning assembly is provided on the substrate chuck base, and the knob positioning assembly is used to assist in installing and fixing the substrate stage to the substrate chuck base and adjusting the circumferential position of the substrate stage on the substrate chuck base; a substrate positioning member is provided on the substrate stage, and the substrate positioning member is used to clamp substrates of various specifications and sizes onto the substrate stage; a tension column is further provided on the substrate chuck base, and the tension column is connected to the connection device of the exposure chamber to clamp the substrate chuck base in the exposure chamber.

[0006] As a further improvement of the present invention, the knob positioning assembly includes a knob assembly, a first positioning column, and a second positioning column evenly distributed on the substrate chuck base. The knob assembly, the first positioning column, and the second positioning column are used to limit the substrate stage at the rotation center; when the button of the knob assembly rotates, it drives the substrate stage to rotate, so as to align the substrate loaded into the substrate stage with the X-axis and Y-axis of the substrate chuck.

[0007] A pressure rod assembly and a retaining piece are further provided on the substrate chuck base; a plurality of the retaining pieces are evenly distributed on the substrate chuck base and are used to limit the outer edge of the substrate stage, and there is a gap between the retaining piece and the outer edge of the substrate stage; the pressure rod assembly is connected to the second positioning column. When the pressure rod assembly is pressed, the second positioning column is disengaged from the substrate stage, and the button of the knob assembly is rotated to adjust the circumferential position of the substrate stage. After the adjustment is in place, the pressure rod assembly is released to clamp the substrate stage on the substrate chuck base.

[0008] As a further improvement of the present invention, a latch is provided on the side of the substrate disk base, and the latch cooperates with a locking hook on the substrate handling robot arm to connect or disconnect the substrate disk base from the substrate handling robot arm.

[0009] As a further improvement of the present invention, a calibration component is provided on one side of the top surface of the substrate disk base. The origin of coordinates in the calibration component is calibrated when the substrate disk base is connected to the exposure chamber, and the origin of coordinates is used to calibrate the center position of the substrate.

[0010] As a further improvement of the present invention, a plurality of electricity-isolating positioning members are evenly distributed on the bottom surface of the substrate disk base, and the electricity-isolating positioning members are used to limit three degrees of freedom of the substrate disk base in the exposure chamber.

[0011] As a further improvement of the present invention, along the advancing direction of the substrate disk base, electricity-isolating positioning members are provided on both sides of the front end of the substrate disk base; and on any one side of the front end of the substrate disk base, the two electricity-isolating positioning members are perpendicular to each other; the electricity-isolating positioning members are used to limit three degrees of freedom of the substrate disk base in the exposure chamber.

[0012] As a further improvement of the present invention, the substrate positioning member includes an elastic rod and a positioning pin. The elastic rod and the positioning pin are arranged along the radius of the substrate table and are used to position and clamp substrates of different sizes on the substrate table.

[0013] As a further improvement of the present invention, the substrate table adopts a hollow structure.

[0014] As a further improvement of the present invention, a plurality of roller assemblies are evenly distributed on the bottom surface of the substrate disk base. Along the moving direction of the substrate disk, a plurality of roller assemblies are arranged side by side on both sides of the substrate disk base, and the roller assemblies are used to reduce the frictional resistance during the substrate transfer process.

[0015] As a further improvement of the present invention, a conductive sheet is further provided on the substrate table. The conductive sheet is located outside the substrate table, the conductive sheet contacts the substrate on the substrate table, and the conductive sheet is connected to an external terminal and is used to conduct the electrons scattered on the substrate to the outside of the substrate disk.

[0016] Compared with the prior art, the advantages of the present invention are as follows:

[0017] The substrate chuck of the semiconductor device of the present invention uses a knob positioning component to assist in the installation and fixation of the substrate stage to the substrate chuck base, and realizes the circumferential position adjustment of the substrate stage on the substrate chuck base. The substrate positioning member realizes the clamping of substrates of various specifications such as 4-inch, 5-inch, and 6-inch to the substrate stage, improving the compatibility of the substrate chuck. By connecting the tension posts at the bottom of the substrate chuck base to the connecting device of the exposure chamber, the connection and fixation of the substrate chuck base to the exposure chamber are realized, and then the clamping of the substrate stage in the exposure chamber is realized, and finally the fixation of the substrate in the exposure chamber is realized. The substrate chuck of the present invention realizes the conversion of the substrate clamping accuracy, converts the external clamping accuracy of the substrate into the connection accuracy between the substrate chuck and the connecting device of the exposure chamber, realizes the precise clamping and accurate adjustment of the substrate, and significantly improves the engraving effect of the substrate. Description of the Drawings

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure principle of the substrate chuck of the semiconductor device of the present invention.

[0019] Figure 2 It is a schematic diagram of the structure principle of the substrate chuck of the semiconductor device of the present invention.

[0020] Figure 3 It is a schematic diagram of the structure principle of another perspective of the substrate chuck of the semiconductor device of the present invention.

[0021] Legend: 1. Substrate chuck base; 2. Lock; 3. Elastic rod; 4. Pressing rod assembly; 5. Substrate stage; 6. Retaining piece; 7. Positioning pin; 8. Calibration component; 9. Conductive sheet; 10. Knob assembly; 101. First positioning post; 102. Second positioning post; 11. Electric insulation positioning member; 12. Roller assembly; 13. Tension post. Detailed Embodiment

[0022] The following further describes the present invention in conjunction with the accompanying drawings of the specification and specific preferred embodiments, but does not limit the protection scope of the present invention thereby.

[0023] Embodiment

[0024] As Figures 1 to 3As shown, the substrate chuck of the semiconductor device of the present invention includes a substrate chuck base 1 and a substrate stage 5. A knob positioning assembly is provided on the substrate chuck base 1. The knob positioning assembly is used to assist in mounting and fixing the substrate stage 5 to the substrate chuck base 1 and can accurately adjust the circumferential position of the substrate stage 5 on the substrate chuck base 1. A substrate positioning member is provided on the substrate stage 5. The substrate positioning member is used to clamp substrates of various specifications and sizes onto the substrate stage 5. A tension post 13 is further provided at the bottom of the substrate chuck base 1. The tension post 13 is connected to the connecting device of the exposure chamber to clamp the substrate chuck base 1 in the exposure chamber, and further clamp the substrate stage 5 in the exposure chamber. By converting the position of the substrate relative to the substrate chuck into the position of the substrate chuck relative to the connecting device of the exposure chamber, accurate positioning and exposure of the substrate in the exposure chamber are achieved.

[0025] In this embodiment, by using the knob positioning assembly to assist in mounting and fixing the substrate stage 5 to the substrate chuck base 1, accurate adjustment of the circumferential position of the substrate stage 5 on the substrate chuck base 1 is achieved. By means of the substrate positioning member, substrates of various specifications and sizes such as 4 inches, 5 inches, and 6 inches are clamped onto the substrate stage 5, improving the compatibility of the substrate chuck. By connecting the tension post 13 at the bottom of the substrate chuck base 1 to the connecting device of the exposure chamber, the connection and fixation of the substrate chuck base 1 and the exposure chamber are achieved, and further the substrate stage 5 is clamped in the exposure chamber, and finally the substrate is fixed in the exposure chamber. The substrate chuck of this embodiment realizes the conversion of the substrate clamping accuracy, converting the external clamping accuracy of the substrate into the connection accuracy between the substrate chuck and the connecting device of the exposure chamber, achieving precise clamping and accurate adjustment of the substrate, and significantly improving the exposure effect of the substrate.

[0026] As Figure 1 and Figure 2 shown, in this embodiment, the knob positioning assembly includes a knob assembly 10, a first positioning post 101, and a second positioning post 102 evenly distributed on the substrate chuck base 1. The knob assembly 10, the first positioning post 101, and the second positioning post 102 are used to limit the substrate stage 5 at the rotation center. When the button of the knob assembly 10 rotates, it drives the substrate stage 5 to rotate to align the substrate loaded into the substrate stage 5 with the X-axis and Y-axis of the substrate chuck.

[0027] Specifically, the three points of the knob assembly 10, the first positioning post 101, and the second positioning post 102 and their lower fulcrums limit the substrate stage 5 at the rotation center. When the button of the rotation assembly 10 is rotated, the substrate stage 5 will rotate within a certain range, and the rotation accuracy can reach 0.1°. The function is to align the substrate loaded into the substrate stage 5 with the X-axis and Y-axis of the substrate chuck. The X-axis and Y-axis of the substrate chuck are aligned with the X-axis and Y-axis of the exposure chamber through the positioning devices at the front end and bottom surface of the substrate chuck base 1, thereby achieving the alignment of the substrate with the X-axis and Y-axis of the exposure chamber. Essentially, the substrate chuck is the accuracy conversion device of the substrate.

[0028] As Figure 1 and Figure 2 shown, in this embodiment, a pressing rod assembly 4 and a retaining piece 6 are further provided on the substrate chuck base 1. A plurality of retaining pieces 6 are evenly distributed on the substrate chuck base 1 for limiting the outer edge of the substrate table 5, and there is a gap between the retaining piece 6 and the outer edge of the substrate table 5. As Figure 2 shown, the pressing rod assembly 4 is connected to the second positioning post 102. When a force F is applied to press the pressing rod assembly 4, the second positioning post 102 is disengaged from the substrate table 5. The button of the knob assembly 10 is rotated to adjust the circumferential position of the substrate table 5. After the adjustment is in place, the pressing rod assembly 4 is released to clamp the substrate table 5 on the substrate chuck base 1.

[0029] As Figure 2 and Figure 3 shown, in this embodiment, a lock 2 is provided on the side of the substrate chuck base 1. The lock 2 cooperates with a lock hook on the substrate handling robot arm to connect or disconnect the substrate chuck base 1 from the substrate handling robot arm.

[0030] As Figure 1 shown, in this embodiment, a calibration component 8 is provided on one side of the top surface of the substrate chuck base 1. The coordinate origin in the calibration component 8 is calibrated when the substrate chuck base 1 is connected to the exposure chamber. The coordinate origin is used to calibrate the central position of the substrate. In this embodiment, a cross mark and other coordinate origins are provided on the calibration component 8, and the exact position of the substrate center is calibrated through the calibration component 8. The cross mark on the calibration component 8 is calibrated when the substrate chuck is connected to the exposure chamber, that is, the calibration component 8 realizes the position conversion between the exposure chamber coordinates and the substrate coordinates.

[0031] Specifically, a coordinate origin is provided on the calibration component 8. When it is necessary to determine the position of the substrate center after the X-axis and Y-axis are aligned, at this time, the position relationship between the substrate center and the coordinate origin on the calibration component 8 can be found through a microscope. The coordinate origin on the calibration component 8 is engraved at a fixed position in the exposure chamber, that is, the coordinate origin on the calibration component 8 and the position of the exposure chamber are uniquely determined. At this time, when the substrate enters the exposure chamber and is positioned and clamped, the position between the substrate center and the exposure chamber can be uniquely determined according to the coordinate conversion relationship.

[0032] As Figure 3 shown, in this embodiment, a plurality of insulating and positioning members 11 are evenly distributed on the bottom surface of the substrate chuck base 1. The insulating and positioning members 11 are used to limit the degrees of freedom of the substrate chuck base 1 in the exposure chamber. Further, along the advancing direction of the substrate chuck base 1, insulating and positioning members 11 are provided on both sides of the front end of the substrate chuck base 1; and on any one side of the front end of the substrate chuck base 1, the two insulating and positioning members 11 are perpendicular to each other; the insulating and positioning members 11 are used to limit the degrees of freedom of the substrate chuck base 1 in the exposure chamber.

[0033] In this embodiment, the electricity-isolating positioning member 11 may specifically be made of electricity-isolating sapphire. There are 3 sapphire contact points on the bottom surface of the substrate chuck base 1 to limit 3 degrees of freedom. There are 2 mutually perpendicular sapphire contact points at the front end of the substrate chuck base 1 to limit 2 degrees of freedom. There is another 1 sapphire contact point on the other side of the front end of the substrate chuck base 1 to limit 1 degree of freedom, thus limiting a total of 6 degrees of freedom of the substrate chuck base 1. At the same time, the tension posts 13 of the substrate chuck base 1 are connected and locked with the locking device of the exposure chamber, thereby realizing the clamping of the substrate chuck.

[0034] In this embodiment, sapphire contact connection is adopted for positioning, which can not only achieve complete electricity isolation between the substrate and the exposure chamber, but also play a certain supporting role for the substrate chuck, thereby reducing the interference during the engraving process and ensuring the smooth progress of the engraving process. The substrate chuck base 1 is accurately positioned with the connection device of the exposure chamber according to the 6-point positioning principle, and the tension posts 13 are connected and locked with the locking device of the exposure chamber, thereby converting the accuracy of the substrate relative to the substrate chuck into the accuracy of the substrate chuck relative to the connection device of the exposure chamber, realizing the accurate positioning and exposure of the substrate in the exposure chamber.

[0035] As Figure 1 and Figure 2 shown, in this embodiment, the substrate positioning member includes an elastic rod 3 and a positioning pin 7. The elastic rod 3 and the positioning pin 7 are arranged along the radius of the substrate table 5 to meet the rapid positioning and clamping of substrates of different sizes on the substrate table 5.

[0036] Furthermore, the substrate table 5 adopts a hollow structure. The positioning pin 7 is used to position the outer edge of the substrate. According to the change in the size of the substrate, the telescopic length of the elastic rod 3 on the substrate table 5 is adjusted accordingly to achieve the positioning of the outer edge of the substrate. Through the cooperation of the elastic rod 3 and the positioning pin 7, the elastic and rapid clamping and precise positioning of the substrate are realized, and the substrate table 5 can well accommodate the clamping of 4-inch, 5-inch, and 6-inch substrates.

[0037] As Figure 3 shown, in this embodiment, three roller assemblies 12 are evenly distributed on the bottom surface of the substrate chuck base 1. Along the moving direction of the substrate chuck, multiple roller assemblies 12 are arranged side by side on both sides of the substrate chuck base 1. The roller assemblies 12 are used to move the substrate chuck to minimize the conveying resistance and ensure the smoothness of the wafer transfer process.

[0038] As Figure 1As shown, in this embodiment, a conductive sheet 9 is further provided on the substrate stage 5. The conductive sheet 9 is located outside the substrate stage 5 and can rotate. The conductive sheet 9 contacts the substrate in the substrate stage 5 to assist the substrate in being exposed in the exposure chamber. When electron beam lithography is performed on the substrate, during engraving, there are also electrons scattered from the emitted electron beam itself falling on the substrate. Press the conductive sheet 9 on the substrate, and the conductive sheet 9 is connected to a dedicated terminal, which can timely divert the scattered electrons on the substrate.

[0039] In this embodiment, when loading the substrate, the substrate is clamped by an electrostatic chuck and inserted from right to left of the substrate cassette. The elastic rod 3 positions the substrate at the center of the substrate stage 5 and presses it obliquely downward; three retaining sheets 6 and a knob assembly 10 for fine adjustment are designed on the periphery of the substrate stage 5, realizing the rotation adjustment of the substrate within the range of ±3° while ensuring the positioning accuracy. Roller assemblies 12 are provided on both sides and the bottom of the substrate cassette, minimizing the transfer resistance and ensuring the smoothness of the substrate transfer process. Insulating sapphires are designed at the bottom and front end of the substrate cassette, playing the role of electrical insulation and positioning support. At the same time, a Faraday cup and a positioning mark array are also designed on the substrate cassette, used to detect the electron beam current, beam current drift, and the relative position relationship of the substrate. In addition, to reduce the calibration time in the exposure chamber, before the substrate is placed in the substrate cassette, it is necessary to perform comparative positioning with the substrate through the positioning marks on the substrate cassette and the knob assembly 10 under a pre-alignment microscope, determine the coordinate transformation relationship between the substrate cassette and the substrate, and thus determine the position relationship between the substrate and the exposure chamber after the accuracy conversion of the substrate cassette, achieving the purpose of improving the exposure efficiency.

[0040] Although the present invention is disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make many possible changes and modifications to the technical solution of the present invention, or modify it into an equivalent embodiment with equivalent changes, without departing from the spirit and technical solution of the present invention. Therefore, any simple modification, equivalent replacement, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A substrate chuck for a semiconductor device, characterized in that, It includes a substrate disk base (1) and a substrate stage (5); a knob positioning component is provided on the substrate disk base (1), and the knob positioning component is used to assist in mounting and fixing the substrate stage (5) to the substrate disk base (1) and adjusting the circumferential position of the substrate stage (5) on the substrate disk base (1); a substrate positioning member is provided on the substrate stage (5), and the substrate positioning member is used to clamp substrates of various specifications and sizes onto the substrate stage (5); a tension post (13) is further provided on the substrate disk base (1), and the tension post (13) is connected to the connecting device of the exposure chamber to clamp the substrate disk base (1) in the exposure chamber. The knob positioning component includes a knob component (10), a first positioning post (101), and a second positioning post (102) evenly distributed on the substrate disk base (1). The knob component (10), the first positioning post (101), and the second positioning post (102) are used to limit the substrate stage (5) at the rotation center; when the button of the knob component (10) rotates, it drives the substrate stage (5) to rotate so as to align the substrate loaded into the substrate stage (5) with the X-axis and Y-axis of the substrate disk. A pressure bar component (4) and a stop piece (6) are further provided on the substrate disk base (1); a plurality of the stop pieces (6) are evenly distributed on the substrate disk base (1) and are used to limit the outer edge of the substrate stage (5), and there is a gap between the stop piece (6) and the outer edge of the substrate stage (5); the pressure bar component (4) is connected to the second positioning post (102). When the pressure bar component (4) is pressed, the second positioning post (102) is separated from the substrate stage (5), and the button of the knob component (10) is rotated to adjust the circumferential position of the substrate stage (5). After the adjustment is in place, the pressure bar component (4) is released to clamp the substrate stage (5) on the substrate disk base (1).

2. The substrate holder of the semiconductor device according to claim 1, characterized in that, A lock (2) is provided on the side of the substrate disk base (1), and the lock (2) cooperates with the lock hook on the substrate handling robot arm to connect or separate the substrate disk base (1) from the substrate handling robot arm.

3. The substrate holder of the semiconductor device according to claim 1, characterized in that, A calibration component (8) is provided on one side of the top surface of the substrate disk base (1). The coordinate origin in the calibration component (8) is calibrated when the substrate disk base (1) is connected to the exposure chamber, and the coordinate origin is used to calibrate the center position of the substrate.

4. The substrate holder of the semiconductor device according to claim 1, wherein A plurality of electrical insulation positioning members (11) are evenly distributed on the bottom surface of the substrate disk base (1), and the electrical insulation positioning members (11) are used to limit three degrees of freedom of the substrate disk base (1) in the exposure chamber.

5. The substrate holder of the semiconductor device according to claim 4, characterized in that, Along the advancing direction of the substrate disk base (1), an electrical insulation positioning member (11) is provided at the front end of the substrate disk base (1); and on any one side of the front end of the substrate disk base (1), two electrical insulation positioning members (11) are perpendicular to each other; the electrical insulation positioning members (11) are used to limit three degrees of freedom of the substrate disk base (1) in the exposure chamber.

6. The susceptor of a semiconductor device according to any one of claims 1 to 5, characterized in that, The substrate positioning member includes an elastic rod (3) and a positioning pin (7). The elastic rod (3) and the positioning pin (7) are arranged along the radius of the substrate stage (5) and are used to position and clamp substrates of different sizes on the substrate stage (5).

7. The substrate holder of the semiconductor device according to any one of claims 1 to 5, characterized in that A plurality of roller assemblies (12) are uniformly distributed on the bottom surface of the substrate disk base (1). Along the moving direction of the substrate disk, a plurality of roller assemblies (12) are arranged side by side on both sides of the substrate disk base (1). The roller assemblies (12) are used to reduce the frictional resistance during substrate transfer.

8. The susceptor of the semiconductor device according to any one of claims 1 to 5, characterized in that, A conductive sheet (9) is further provided on the substrate table (5). The conductive sheet (9) is located outside the substrate table (5). The conductive sheet (9) contacts the substrate on the substrate table (5), and the conductive sheet (9) is connected to an external terminal for guiding the electrons scattered on the substrate to the outside of the substrate disk.

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