A silicon wafer cleaning and drying device and a cleaning and drying method

Abstract

The present invention belongs to the technical field of silicon wafer cleaning, and specifically relates to a silicon wafer cleaning and drying device and a cleaning and drying method, which includes a workbench, and a support frame is arranged on the top surface of the workbench; a slider is slidably connected to the top surface of the support frame; a lead screw is meshed and penetrated through the side surface of the slider; a first telescopic rod is arranged on the top surface of the slider, the bottom end of the output end of the first telescopic rod penetrates below the slider, and a suction cup assembly for adsorbing the silicon wafer is arranged at the bottom end; for the silicon wafer cleaning and drying device and the cleaning and drying method of the present invention, by arranging support rollers on the placement plate, transferring the silicon wafer to the top of the placement plate through the suction cup assembly, propping it up by the support rollers, and then soaking it in the cleaning solvent. At the same time, the push plate intermittently pushes the silicon wafer to move, and the contact position between the silicon wafer and the support rollers continuously changes, so that the whole silicon wafer is fully in contact with the cleaning solvent, which is beneficial to reducing the soaking completion speed of the silicon wafer and avoiding affecting the soaking efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of silicon wafer cleaning, and specifically relates to a silicon wafer cleaning and drying device and a cleaning and drying method. Background Art

[0002] A silicon wafer refers to a thin slice cut from a silicon single crystal ingot, also known as a silicon wafer, which is a substrate material widely used in industries such as integrated circuits and photovoltaic cells; before use, the silicon wafer needs to be cleaned, and the cleaning effect will directly affect the final performance of the photovoltaic cell and the integrated circuit. At the same time, the silicon wafer needs to be dried after cleaning; the commonly used cleaning method at present is wet cleaning. Specifically, the silicon wafer is soaked in a cleaning solvent, so that the impurity particles on the surface of the silicon wafer react with the solvent to generate soluble substances, gases or directly fall off.

[0003] When the existing silicon wafer is soaked in the cleaning solvent, it is necessary to clamp the silicon wafer through a fixture. In order to improve the comprehensiveness of the silicon wafer soaking, it is necessary to adjust the clamping position of the fixture on the silicon wafer during the soaking process, so that the original clamping position of the silicon wafer is exposed, and then it can be fully contacted with the cleaning solvent, which is rather inconvenient and affects the soaking efficiency.

[0004] For this reason, the present invention provides a wearable self-injecting medical box. Summary of the Invention

[0005] In order to make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art.

[0006] The technical solution adopted by the present invention to solve its technical problems is as follows: A silicon wafer cleaning and drying device of the present invention includes a workbench, and a support frame is arranged on the top surface of the workbench; a slider is slidably connected to the top surface of the support frame; a lead screw is meshed and penetrated through the side surface of the slider; a first telescopic rod is arranged on the top surface of the slider, and the bottom end of the output end of the first telescopic rod penetrates below the slider, and a suction cup assembly for sucking the silicon wafer is arranged at the bottom end; the end of the lead screw is provided with the output end of a servo motor; the servo motor is installed on the surface of the support frame;

[0007] A receiving plate is arranged on the top surface of the workbench and below the suction cup assembly; a first conveying assembly is arranged at one end of the receiving plate; a second conveying assembly is arranged at the other end of the receiving plate. An immersion tank is inserted through the top surface of the receiving plate, and a cleaning tank is inserted through the center of the top surface of the receiving plate; a drying oven is arranged on the top surface of the receiving plate and on one side symmetric to the immersion tank based on the center.

[0008] A placement plate is provided inside the soaking tank. A second telescopic rod is provided below the soaking tank. The output end of the second telescopic rod penetrates into the soaking tank and is connected to the bottom surface of the placement plate. A plurality of support rollers are rotatably connected to the top surface of the placement plate. The highest position of the annular roller surface of the support roller is higher than the top surface of the placement plate. A placement groove is formed on the side surface of the placement plate. A third telescopic rod is installed inside the placement groove. A push plate is provided on the top surface of the placement plate. A first connecting frame is provided between the side surface of the push plate and the end of the output end of the third telescopic rod. There are a pair of push plates, which are symmetric based on the placed silicon wafers.

[0009] Preferably, a groove is formed on the side of the push plate facing the center of the placement plate. A spray head with a spray port pointing to the center of the placement plate is provided inside the groove. A first submersible pump is provided on the top surface of the push plate. The output end of the first submersible pump is communicated with the spray head. The liquid water sprayed by the spray head acts on the side surface of the placed silicon wafer.

[0010] Preferably, a sealing ring is provided at the notch of the placement groove. The output end of the third telescopic rod cooperates with the sealing ring to seal the notch of the placement groove.

[0011] Preferably, a pair of baffle plates are provided on the top surface of the placement plate. The bottom surface of the baffle plate is located above the support roller.

[0012] Preferably, a plurality of rectangular grooves are formed on the side surface of the placement plate. An isolation box is provided at the notch of the rectangular groove. The isolation box is communicated with the rectangular groove and isolates the notch of the rectangular groove from the soaking tank. A second submersible pump is provided on the side surface of the isolation box. The input end of the second submersible pump is communicated with the isolation box. A plurality of through holes communicated with the rectangular grooves are formed on the top surface of the placement plate.

[0013] Preferably, the end of the output end of the second telescopic rod is rotatably connected to the bottom surface of the placement plate. A toothed ring is provided on the bottom surface of the placement plate. An installation plate is provided on the inner wall of the soaking tank. A driving motor is installed on the top surface of the installation plate. The output end of the driving motor penetrates below the installation plate and a driving gear is provided at the end. The toothed ring is in a position meshing with the driving gear when it moves vertically.

[0014] Preferably, a plurality of triangular blocks are provided on the bottom surface of the toothed ring and between the tooth grooves. A plurality of conical blocks are provided on the top surface of the driving gear and between the teeth.

[0015] Preferably, an isolation cylinder is provided outside the driving motor. The isolation cylinder cooperates with the installation plate to isolate the driving motor from the outside.

[0016] Preferably, a pair of fourth telescopic rods are provided on both sides of the soaking tank that are centrosymmetric. The end of the output end of the fourth telescopic rod is provided with a second connecting frame, and the end of the second connecting frame away from the fourth telescopic rod is provided with a cover plate; when the pair of cover plates are butted, the opening of the soaking tank is blocked.

[0017] A silicon wafer cleaning and drying method includes the following steps:

[0018] S1. During use, place the silicon wafer to be cleaned on the conveying surface of the first conveying component, and then the first conveying component transfers the silicon wafer above the workbench;

[0019] S2. Then start the servo motor connected to the end of the lead screw. The lead screw meshes with the slider for transmission. When the slider drives the first telescopic rod to move directly above the silicon wafer to be cleaned, stop;

[0020] S3. Then start the first telescopic rod. The suction cup component at the bottom end of the output end of the first telescopic rod contacts the top surface of the silicon wafer, then adsorbs the silicon wafer, and then transfers the silicon wafer to the top of the placement plate through the cooperation of the lead screw, the first telescopic rod and the suction cup component;

[0021] S4. Then start the second telescopic rod. The output end of the second telescopic rod drives the placement plate to move downward, so that the placement plate drives the silicon wafer to move downward below the liquid level of the cleaning solvent; start the third telescopic rod, and drive the push plate to move above the placement plate through the first connecting frame to push the silicon wafer;

[0022] S5. When the push plate squeezes the silicon wafer supported by the support roller to make it move, the silicon wafer moves on the support roller. When it moves a certain distance, the push plate resets, and at this time, the push plate on the other side continues to push the silicon wafer to move.

[0023] The beneficial effects of the present invention are as follows:

[0024] 1. For the silicon wafer cleaning and drying equipment and the cleaning and drying method of the present invention, by providing support rollers on the placement plate, transferring the silicon wafer to the top of the placement plate through the suction cup component, supporting it by the support rollers, and then soaking it in the cleaning solvent. At the same time, the push plate intermittently pushes the silicon wafer to move, and the contact position between the silicon wafer and the support roller changes continuously, so that the whole silicon wafer is fully in contact with the cleaning solvent. Compared with the existing method of adjusting the clamping position of the silicon wafer by the fixture to make the silicon wafer fully contact with the cleaning solvent, it has convenience, which is beneficial to reducing the soaking completion speed of the silicon wafer and avoiding affecting the soaking efficiency.

[0025] 2. For a silicon wafer cleaning and drying device and a cleaning and drying method according to the present invention, by providing a nozzle on the push plate, when the push plate moves, the first submersible pump is started. The first submersible pump pumps the cleaning solvent in the soaking tank into the interior of the nozzle, and then through the nozzle orifice, it acts on the side of the silicon wafer, and the silicon wafer is impacted and moved; the nozzle increases the flow velocity of the cleaning solvent at the surface position of the silicon wafer; thereby accelerating the shedding of impurity particles on the surface of the silicon wafer, which is beneficial to improving the soaking efficiency of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below with reference to the accompanying drawings.

[0027] Figure 1 is a perspective view of the present invention;

[0028] Figure 2 is of the present invention Figure 1 enlarged schematic view of part A;

[0029] Figure 3 is an overall side schematic view of the present invention;

[0030] Figure 4 is a schematic view of the internal structure of the soaking tank of the present invention;

[0031] Figure 5 is a schematic view of the connection structure of the soaking tank of the present invention;

[0032] Figure 6 is a schematic view of the upper structure of the placement plate of the present invention;

[0033] Figure 7 is a schematic view of the placement plate of the present invention;

[0034] Figure 8 is of the present invention Figure 7 enlarged schematic view of part B;

[0035] Figure 9 is a schematic view of the connection structure of the placement plate of the present invention;

[0036] Figure 10 is of the present invention Figure 9 enlarged schematic view of part C;

[0037] Figure 11 is a schematic view of the push plate of the present invention;

[0038] Figure 12 is a schematic view of the connection structure of the push plate of the present invention;

[0039] Figure 13 is of the present invention Figure 9 enlarged schematic view of part D;

[0040] Figure 14 is of the present inventionFigure 9 Schematic enlarged view of part E;

[0041] Figure 15 is the process flow chart of the present invention.

[0042] In the figure: 1, workbench; 11, support frame; 12, first telescopic rod; 13, slider; 14, lead screw; 2, receiving plate; 21, first conveying component; 22, second conveying component; 23, soaking tank; 24, second telescopic rod; 3, placing plate; 31, support roller; 32, placing groove; 33, third telescopic rod; 34, first connecting frame; 35, pushing plate; 36, sealing ring; 4, spray head; 41, first submersible pump; 42, baffle; 5, rectangular groove; 51, isolation box; 52, second submersible pump; 53, through hole; 6, gear ring; 61, mounting plate; 62, driving motor; 63, driving gear; 64, triangular block; 7, isolation cylinder; 8, cover plate; 81, fourth telescopic rod; 82, second connecting frame. Detailed implementation manners

[0043] In order to make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.

[0044] As Figures 1 to 12 shown, a silicon wafer cleaning and drying device according to an embodiment of the present invention includes a workbench 1, and a support frame 11 is provided on the top surface of the workbench 1; a slider 13 is slidably connected to the top surface of the support frame 11; a lead screw 14 is meshed and penetrated through the side surface of the slider 13; a first telescopic rod 12 is provided on the top surface of the slider 13, and the bottom end of the output end of the first telescopic rod 12 penetrates below the slider 13, and a suction cup assembly for sucking silicon wafers is provided at the bottom end; the end of the lead screw 14 is provided with the output end of a servo motor; the servo motor is installed on the surface of the support frame 11;

[0045] A receiving plate 2 is provided on the top surface of the workbench 1 and below the suction cup assembly; a first conveying component 21 is provided at one end of the receiving plate 2; a second conveying component 22 is provided at the other end of the receiving plate 2, a soaking tank 23 is penetrated and inserted into the top surface of the receiving plate 2, and a cleaning tank 25 is penetrated and inserted into the center of the top surface of the receiving plate 2; a drying oven 26 is provided on the top surface of the receiving plate 2 and on the side symmetrical to the soaking tank 23 based on the center.

[0046] Inside the soaking tank 23, a placing plate 3 is provided. Below the soaking tank 23, a second telescopic rod 24 is provided. The output end of the second telescopic rod 24 penetrates into the soaking tank 23 and is connected to the bottom surface of the placing plate 3. A plurality of support rollers 31 are rotatably connected to the top surface of the placing plate 3. The highest position of the annular roller surface of the support roller 31 is higher than the top surface of the placing plate 3. A placing groove 32 is formed in the side surface of the placing plate 3. Inside the placing groove 32, a third telescopic rod 33 is installed. On the top surface of the placing plate 3, a pushing plate 35 is provided. Between the side surface of the pushing plate 35 and the end of the output end of the third telescopic rod 33, a first connecting frame 34 is provided. There are a pair of pushing plates 35, and they are symmetrically arranged based on the placed silicon wafers.

[0047] When the embodiment of the present invention is in use, the silicon wafers to be cleaned are placed on the conveying surface of the first conveying component 21. Then, the first conveying component 21 transfers the silicon wafers above the workbench 1. Then, the servo motor connected to the end of the lead screw 14 is started. The lead screw 14 meshes with the slider 13 for transmission. When the slider 13 drives the first telescopic rod 12 to move directly above the silicon wafers to be cleaned, it stops. Then, the first telescopic rod 12 is started. The suction cup component at the bottom end of the output end of the first telescopic rod 12 contacts the top surface of the silicon wafer, and then the silicon wafer is adsorbed. Then, through the cooperation of the lead screw 14, the first telescopic rod 12 and the suction cup component, the silicon wafer is transferred to the top of the placing plate 3 and is supported by the support rollers 31 on the top surface of the placing plate 3. At this time, the placing plate 3 is located above the liquid level of the cleaning solvent in the soaking tank 23.

[0048] Then, the second telescopic rod 24 is started. The output end of the second telescopic rod 24 drives the placing plate 3 to move downward, so that the placing plate 3 drives the silicon wafers to move downward below the liquid level of the cleaning solvent, and starts to soak the silicon wafers. During this process, the third telescopic rod 33 is started, and through the first connecting frame 34, it drives the pushing plate 35 to move above the placing plate 3. When moving, the bottom surface of the pushing plate 35 is located above the support rollers 31, so it is not blocked by the support rollers 31. When the pushing plate 35 squeezes the silicon wafers supported by the support rollers 31 to make them move, the silicon wafers move on the support rollers 31. When moving a certain distance, the pushing plate 35 resets. At this time, the other pushing plate 35 continues to push the silicon wafers to move, and the contact positions between the silicon wafers and the support rollers 31 are constantly changed, so that the whole silicon wafers are fully in contact with the cleaning solvent. Compared with the existing method of adjusting the clamping position of the silicon wafers by the fixture to make the silicon wafers fully contact with the cleaning solvent, it has convenience, is beneficial to reducing the soaking completion speed of the silicon wafers, and avoids affecting the soaking efficiency.

[0049] On one side of the push plate 35 facing the center of the placement plate 3, a groove is provided. Inside the groove, a spray head 4 with a spray nozzle pointing towards the center of the placement plate 3 is arranged. On the top surface of the push plate 35, a first submersible pump 41 is provided. The output end of the first submersible pump 41 is communicated with the spray head 4. The liquid water sprayed by the spray head 4 acts on the side surface of the placed silicon wafer. When the push plate 35 moves, the first submersible pump 41 is started. The first submersible pump 41 pumps the cleaning solvent in the soaking tank 23 into the interior of the spray head 4, and then through the spray nozzle of the spray head 4, it acts on the side surface of the silicon wafer, and the silicon wafer is impacted and moved. The spray head 4 increases the flow rate of the cleaning solvent at the surface position of the silicon wafer, thereby accelerating the shedding of impurity particles on the surface of the silicon wafer, which is beneficial to improving the soaking efficiency of the silicon wafer.

[0050] As Figures 9 to 13 shown, a sealing ring 36 is arranged at the notch of the placement groove 32. The output end of the third telescopic rod 33 cooperates with the sealing ring 36 to seal the notch of the placement groove 32. When the third telescopic rod 33 is started, the output end of the third telescopic rod 33 passes through the sealing ring 36, and the sealing ring 36 seals the notch of the placement groove 32, preventing the cleaning solvent from contacting the housing part of the third telescopic rod 33, and realizing the use protection of the third telescopic rod 33.

[0051] As Figure 9 shown, a pair of baffle plates 42 are arranged on the top surface of the placement plate 3, and the bottom surface of the baffle plates 42 is located above the support rollers 31. When the silicon wafer is pushed by the push plate 35, the baffle plates 42 will limit the position of the silicon wafer to prevent the silicon wafer from falling off the placement plate 3.

[0052] As Figures 6 to 14 shown, a plurality of rectangular grooves 5 are provided on the side surface of the placement plate 3. At the notch of the rectangular groove 5, an isolation box 51 is arranged. The isolation box 51 is communicated with the rectangular groove 5 and isolates the notch of the rectangular groove 5 from the soaking tank 23. A second submersible pump 52 is arranged on the side surface of the isolation box 51, and the input end of the second submersible pump 52 is communicated with the isolation box 51. A plurality of through holes 53 communicated with the rectangular grooves 5 are provided on the top surface of the placement plate 3. When the silicon wafer is driven to move downward for soaking, the second submersible pump 52 is started, and the second submersible pump 52 pumps liquid into the isolation box 51, and the isolation box 51 is communicated with the rectangular groove 5. Therefore, the cleaning solvent enters the rectangular groove 5 through the through holes 53, and then is pumped out by the second submersible pump 52 through the isolation box 51, so that a negative pressure exists between the silicon wafer and the placement plate 3. Therefore, the silicon wafer is adsorbed on the support rollers 31. When the silicon wafer moves downward for soaking, it is prevented from falling off the placement plate 3 under the action of the cleaning solvent, and the stability of the soaking process is improved.

[0053] The end of the output end of the second telescopic rod 24 is rotatably connected to the bottom surface of the placement plate 3; a toothed ring 6 is provided on the bottom surface of the placement plate 3, an installation plate 61 is provided on the inner wall of the soaking tank 23, a driving motor 62 is installed on the top surface of the installation plate 61, the output end of the driving motor 62 penetrates below the installation plate 61 and a driving gear 63 is provided at the end, and the toothed ring 6 is in a position meshed with the driving gear 63 when moving vertically; when the placement plate 3 moves to the lowest position, the toothed ring 6 on the bottom surface of the placement plate 3 is butted and meshed with the driving gear 63, and then the driving motor 62 is started, the driving motor 62 drives the driving gear 63 to rotate, thereby driving the toothed ring 6 to rotate, and the toothed ring 6 drives the silicon wafer adsorbed by negative pressure on the placement plate 3 to rotate. The impurity particles on the surface of the silicon wafer are subjected to centrifugal force, and under the action of the centrifugal force, the particles on the surface of the silicon wafer are accelerated to fall off, which is beneficial to improving the soaking efficiency.

[0054] A plurality of triangular blocks 64 are provided on the bottom surface of the toothed ring 6 and between the tooth grooves, and a plurality of tapered blocks are provided on the top surface of the driving gear 63 and between the teeth; when the toothed ring 6 moves downward, when the triangular block 64 on the bottom surface of the toothed ring 6 contacts the tapered block on the top surface of the driving gear 63, the tapered block presses against the inclined surface of the triangular block 64, and then drives the toothed ring 6 to rotate, so that the toothed ring 6 is accurately butted and meshed with the driving gear 63, avoiding jamming during butt joint and meshing.

[0055] An isolation cylinder 7 is provided outside the driving motor 62, and the isolation cylinder 7 cooperates with the installation plate 61 to isolate the driving motor 62 from the outside; preventing the driving motor 62 from being damaged by the intrusion of the cleaning solvent.

[0056] As Figures 4 to 5 shown, a pair of fourth telescopic rods 81 are provided on both sides of the soaking tank 23 based on central symmetry. The end of the output end of the fourth telescopic rod 81 is provided with a second connecting frame 82, and a cover plate 8 is provided at the end of the second connecting frame 82 far from the fourth telescopic rod 81; when a pair of cover plates 8 are butted, the tank opening of the soaking tank 23 is blocked; when the placement plate 3 rotates, the fourth telescopic rod 81 is started, and the fourth telescopic rod 81 drives the cover plate 8 to move through the second connecting frame 82, and a pair of cover plates 8 are butted to block the tank opening of the soaking tank 23, preventing the cleaning solvent from sloshing and splashing out of the soaking tank 23 when the placement plate 3 rotates.

[0057] As Figure 15 shown, a method for cleaning and drying silicon wafers includes the following steps:

[0058] S1. During use, place the silicon wafer to be cleaned on the conveying surface of the first conveying component 21, and then the first conveying component 21 transfers the silicon wafer above the workbench 1;

[0059] S2. Then start the servo motor connected to the end of the lead screw 14. The lead screw 14 is in meshing transmission with the slider 13. When the slider 13 drives the first telescopic rod 12 to move directly above the silicon wafer to be cleaned, it stops;

[0060] S3. Then, start the first telescopic rod 12. The suction cup assembly at the bottom end of the output end of the first telescopic rod 12 contacts the top surface of the silicon wafer, and then adsorbs the silicon wafer. Then, through the cooperation of the lead screw 14, the first telescopic rod 12 and the suction cup assembly, the silicon wafer is transferred to the top of the placement plate 3;

[0061] S4. Then, start the second telescopic rod 24. The output end of the second telescopic rod 24 drives the placement plate 3 to move downward, so that the placement plate 3 drives the silicon wafer to move downward below the liquid level of the cleaning solvent; Start the third telescopic rod 33, and drive the push plate 35 to move above the placement plate 3 through the first connecting frame 34 to push the silicon wafer;

[0062] S5. When the push plate 35 squeezes the silicon wafer supported by the support roller 31 to make it move, the silicon wafer moves on the support roller 31. When it moves a certain distance, the push plate 35 resets. At this time, the push plate 35 on the other side continues to push the silicon wafer to move.

[0063] During operation, when in use, place the silicon wafer to be cleaned on the conveying surface of the first conveying assembly 21. Then, the first conveying assembly 21 transfers the silicon wafer above the workbench 1. Then, start the servo motor connected to the end of the lead screw 14. The lead screw 14 meshes with the slider 13 for transmission. When the slider 13 drives the first telescopic rod 12 to move directly above the silicon wafer to be cleaned, stop. Then, start the first telescopic rod 12. The suction cup assembly at the bottom end of the output end of the first telescopic rod 12 contacts the top surface of the silicon wafer, and then adsorbs the silicon wafer. Then, through the cooperation of the lead screw 14, the first telescopic rod 12 and the suction cup assembly, the silicon wafer is transferred to the top of the placement plate 3 and is supported by the support roller 31 on the top surface of the placement plate 3; At this time, the placement plate 3 is located above the liquid level of the cleaning solvent in the soaking tank 23;

[0064] After that, the second telescopic rod 24 is started, and the output end of the second telescopic rod 24 drives the placing plate 3 to move downward, so that the placing plate 3 drives the silicon wafer to move downward below the liquid level of the cleaning solvent, and starts to soak the silicon wafer. During this process, the third telescopic rod 33 is started, and the push plate 35 is driven to move above the placing plate 3 through the first connecting frame 34. When moving, the bottom surface of the push plate 35 is located above the support roller 31, so it is not blocked by the support roller 31; when the push plate 35 squeezes the silicon wafer supported by the support roller 31 to make it move, the silicon wafer moves on the support roller 31. When moving a certain distance, the push plate 35 resets. At this time, the push plate 35 on the other side continues to push the silicon wafer to move, and the contact position between the silicon wafer and the support roller 31 changes continuously, so that the whole silicon wafer is fully in contact with the cleaning solvent; when the push plate 35 moves, the first submersible pump 41 is started, and the first submersible pump 41 pumps the cleaning solvent in the soaking tank 23 into the inside of the nozzle 4, and then acts on the side of the silicon wafer through the nozzle of the nozzle 4, and the silicon wafer is impacted and moved; the nozzle 4 increases the flow rate of the cleaning solvent on the surface of the silicon wafer; when the third telescopic rod 33 is started, the output end of the third telescopic rod 33 passes through the sealing ring 36, and the sealing ring 36 seals the notch of the placing groove 32.

[0065] When the silicon wafer is pushed by the push plate 35, the baffle 42 will limit the position of the silicon wafer to prevent the silicon wafer from falling off the placing plate 3; when the silicon wafer is driven to move downward for soaking, the second submersible pump 52 is started, and the second submersible pump 52 pumps liquid into the isolation box 51, and the isolation box 51 is communicated with the rectangular groove 5; so the cleaning solvent enters the rectangular groove 5 through the through hole 53, and then is pumped out by the second submersible pump 52 through the isolation box 51, so that there is negative pressure between the silicon wafer and the placing plate 3, so the silicon wafer is adsorbed on the support roller 31; when the placing plate 3 moves to the lowest position, the toothed ring 6 on the bottom surface of the placing plate 3 is butted and engaged with the driving gear 63, and then the driving motor 62 is started, and the driving motor 62 drives the driving gear 63 to rotate, and then drives the toothed ring 6 to rotate. The toothed ring 6 drives the silicon wafer adsorbed by the placing plate 3 under negative pressure to rotate. The impurity particles on the surface of the silicon wafer are under centrifugal force, and under the action of the centrifugal force, the particles on the surface of the silicon wafer are accelerated to fall off; when the toothed ring 6 moves downward, when the triangular block 64 on the bottom surface of the toothed ring 6 contacts the conical block on the top surface of the driving gear 63, the conical block presses against the inclined surface of the triangular block 64, and then drives the toothed ring 6 to rotate, so that the toothed ring 6 is accurately butted and engaged with the driving gear 63; when the placing plate 3 rotates, the fourth telescopic rod 81 is started, and the fourth telescopic rod 81 drives the cover plate 8 to move through the second connecting frame 82, and a pair of cover plates 8 are butted to seal the opening of the soaking tank 23 to prevent the cleaning solvent from splashing out of the soaking tank 23 when the placing plate 3 rotates.

[0066] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cleaning and drying device, characterized in that: It includes a workbench (1), and a support frame (11) is arranged on the top surface of the workbench (1); a slider (13) is slidably connected to the top surface of the support frame (11); a lead screw (14) is meshed and penetrated through the side surface of the slider (13); a first telescopic rod (12) is arranged on the top surface of the slider (13), the output end of the first telescopic rod (12) penetrates below the slider (13), and a suction cup assembly for sucking a silicon wafer is arranged at the bottom end; the end of the lead screw (14) is provided with the output end of a servo motor; the servo motor is installed on the surface of the support frame (11). A receiving plate (2) is arranged on the top surface of the workbench (1) and below the suction cup assembly; a first conveying assembly (21) is arranged at one end of the receiving plate (2); a second conveying assembly (22) is arranged at the other end of the receiving plate (2), an immersion tank (23) is inserted through the top surface of the receiving plate (2), and a cleaning tank (25) is inserted through the center of the top surface of the receiving plate (2); a drying box (26) is arranged on the top surface of the receiving plate (2) and on one side symmetrical to the immersion tank (23) based on the center. A placing plate (3) is arranged inside the immersion tank (23), a second telescopic rod (24) is arranged below the immersion tank (23), the output end of the second telescopic rod (24) penetrates into the immersion tank (23) and is connected to the bottom surface of the placing plate (3); a plurality of support rollers (31) are rotatably connected to the top surface of the placing plate (3), and the highest position of the circumferential roller surface of the support roller (31) is higher than the top surface of the placing plate (3); a placing groove (32) is formed in the side surface of the placing plate (3); a third telescopic rod (33) is installed inside the placing groove (32), a push plate (35) is arranged on the top surface of the placing plate (3), and a first connecting frame (34) is arranged between the side surface of the push plate (35) and the end of the output end of the third telescopic rod (33); a pair of push plates (35) are arranged and are symmetrical based on the placed silicon wafer.

2. The silicon wafer cleaning and drying equipment according to claim 1, wherein: A groove is formed in the side of the push plate (35) facing the center of the placing plate (3), and a spray head (4) with a spray port pointing to the center of the placing plate (3) is arranged in the groove, a first submersible pump (41) is arranged on the top surface of the push plate (35), and the output end of the first submersible pump (41) is communicated with the spray head (4); the liquid water sprayed by the spray head (4) acts on the side of the placed silicon wafer.

3. A silicon wafer cleaning and drying device according to claim 1, characterized in that: A sealing ring (36) is arranged at the notch of the placing groove (32); the output end of the third telescopic rod (33) cooperates with the sealing ring (36) to seal the notch of the placing groove (32).

4. A silicon wafer cleaning and drying device according to claim 2, characterized in that: A pair of baffle plates (42) are arranged on the top surface of the placing plate (3), and the bottom surface of the baffle plate (42) is above the support roller (31).

5. A silicon wafer cleaning and drying device according to claim 1, characterized in that: A plurality of rectangular grooves (5) are formed in the side surface of the placement plate (3). An isolation box (51) is arranged at the notch of the rectangular groove (5). The isolation box (51) communicates with the rectangular groove (5) and isolates the notch of the rectangular groove (5) from the soaking box (23). A second submersible pump (52) is arranged on the side surface of the isolation box (51). The input end of the second submersible pump (52) communicates with the isolation box (51). A plurality of through holes (53) communicating with the rectangular grooves (5) are formed in the top surface of the placement plate (3).

6. The silicon wafer cleaning and drying equipment according to claim 5, characterized in that: The end of the output end of the second telescopic rod (24) is rotatably connected to the bottom surface of the placement plate (3). A toothed ring (6) is arranged on the bottom surface of the placement plate (3). An installation plate (61) is arranged on the inner wall of the soaking box (23). A driving motor (62) is installed on the top surface of the installation plate (61). The output end of the driving motor (62) penetrates below the installation plate (61) and a driving gear (63) is arranged at the end. When the toothed ring (6) moves vertically, it is in a position meshing with the driving gear (63).

7. The silicon wafer cleaning and drying equipment according to claim 6, characterized in that: A plurality of triangular blocks (64) are arranged on the bottom surface of the toothed ring (6) and between the tooth grooves. A plurality of conical blocks are arranged on the top surface of the driving gear (63) and between the teeth.

8. A silicon wafer cleaning and drying device according to claim 6, characterized in that: An isolation cylinder (7) is arranged outside the driving motor (62). The isolation cylinder (7) and the installation plate (61) cooperate to isolate the driving motor (62) from the outside.

9. A silicon wafer cleaning and drying device according to claim 6, characterized in that: A pair of fourth telescopic rods (81) are arranged on two sides of the soaking box (23) that are centrosymmetric. The end of the output end of the fourth telescopic rod (81) is provided with a second connecting frame (82). A cover plate (8) is arranged at the end of the second connecting frame (82) away from the fourth telescopic rod (81). When the pair of cover plates (8) are butted, the box opening of the soaking box (23) is blocked.

10. A method for cleaning and drying a silicon wafer, the cleaning and drying method using a silicon wafer cleaning and drying device described in any one of the above claims 1-9, characterized in that ; including the following steps: S1. During use, place the silicon wafer to be cleaned on the conveying surface of the first conveying assembly (21). Then, the first conveying assembly (21) transfers the silicon wafer above the workbench (1). S2. Then, start the servo motor connected to the end of the lead screw (14). The lead screw (14) and the slider (13) are engaged in transmission. When the slider (13) drives the first telescopic rod (12) to move directly above the silicon wafer to be cleaned, stop. S3. Then, start the first telescopic rod (12). The suction cup assembly at the bottom end of the output end of the first telescopic rod (12) contacts the top surface of the silicon wafer. Then, adsorb the silicon wafer. Then, through the cooperation of the lead screw (14), the first telescopic rod (12) and the suction cup assembly, transfer the silicon wafer to the top of the placement plate (3). S4. Then, start the second telescopic rod (24). The output end of the second telescopic rod (24) drives the placement plate (3) to move downward, so that the placement plate (3) carries the silicon wafer downward to below the liquid level of the cleaning solvent. Start the third telescopic rod (33), and drive the push plate (35) to move above the placement plate (3) through the first connecting frame (34) to push the silicon wafer. S5. When the push plate (35) extrudes the silicon wafer supported by the support roller (31) to make it move, the silicon wafer moves on the support roller (31). When it moves a certain distance, the push plate (35) resets. At this time, the push plate (35) on the other side continues to push the silicon wafer to move.

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