A high temperature material emissivity measurement system

Abstract

The application discloses a high-temperature material emissivity measuring system, which comprises a micro spectrometer, a base, a blackbody empty box, a first high-temperature type thermocouple wire and a thermocouple heating furnace controller. The blackbody empty box comprises two hemispheres which are detachably buckled to form a spherical shape. One of the two hemispheres is fixed on the base, and the other hemisphere is provided with a clamped sleeve type sliding optical fiber interface at the top. The micro spectrometer is connected with the clamped sleeve type sliding optical fiber interface through an optical fiber line. The first high-temperature type thermocouple wires are arranged in pairs and horizontally opposite to each other, and a storage compartment is formed between each pair of the first high-temperature type thermocouple wires. The storage compartment is used for storing and supporting the measured sample. The thermocouple heating furnace controller is arranged outside the blackbody empty box and connected with the two first high-temperature type thermocouple wires through transmission wires and heating wires, and is used for controlling the temperature of the first high-temperature type thermocouple wires. The measuring system can improve the accuracy of the measurement results of the high-temperature material emissivity measurement, and is convenient to carry.

Description

Technical Field

[0001] This invention relates to the field of high-temperature material thermophysical property measurement technology, and in particular to a high-temperature material emissivity measurement system. Background Technology

[0002] Emissivity is a crucial parameter in numerical calculations and temperature measurements, playing a vital role in fields such as energy utilization, aerospace, and materials science. The emissivity of a material surface depends not only on its intrinsic properties but also on its physical state, smoothness, and temperature, making emissivity measurement complex. Particularly for high-temperature materials, such as blast furnace slag, molten salts, and ceramic tiles for machinery, where application temperatures typically exceed 1000°C, obtaining the emissivity at these temperatures presents a significant challenge.

[0003] Based on different measurement principles, emissivity measurement methods are generally classified into calorimetry, reflectivity, energy methods, and multi-wavelength measurement methods. Measurement systems built using these methods typically occupy a large space and are inconvenient to carry. Furthermore, when the temperature of the analyte exceeds its melting temperature, the analyte changes from a solid to a liquid state, exhibiting a certain degree of fluidity and even transparency. Measuring emissivity requires consideration of sample fixation and the background radiation from the heating furnace, increasing the difficulty of sample heating and measurement methods. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the technical problem to be solved by this invention is to provide a high-temperature material emissivity measurement system, which improves the accuracy of high-temperature material emissivity measurement results; at the same time, it can test the emissivity of the same sample under different shapes, and is also convenient to carry.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-temperature material emissivity measurement system, comprising:

[0006] Miniature spectrometer;

[0007] Base;

[0008] The blackbody empty box includes two hemispheres that are detachably snapped together to form a spherical shape. One of the hemispheres is fixed to the base, and the top of the other hemisphere is provided with a clip-on sliding optical fiber interface. The miniature spectrometer is connected to the clip-on sliding optical fiber interface via an optical fiber line.

[0009] The first high-temperature thermocouple wire, at least one pair, is arranged horizontally opposite to each other to form a storage compartment between each first high-temperature thermocouple wire. The storage compartment is used to store and support the sample to be tested.

[0010] A thermocouple heating furnace controller is located outside the blackbody empty box and is connected to the two first high-temperature thermocouple wires through transmission wires and heating wires, and is used to control the temperature of the first high-temperature thermocouple wires.

[0011] Furthermore, the positive and negative electrodes of the first high-temperature thermocouple wire are welded together in a straight line and then bent into a U-shape. Each end of the first high-temperature thermocouple wire is fitted with a high-temperature sleeve. The blackbody empty box has an insertion hole extending radially therefrom. The end of the high-temperature sleeve can slide out through the insertion hole and connect to the thermocouple heating furnace controller.

[0012] Furthermore, it also includes a position adjustment component connected between the high-temperature sleeve and the base, for driving the high-temperature sleeve to move radially along the blackbody box.

[0013] Furthermore, the adjustment assembly includes a connecting rod, a support rod, and an adjusting rod. The connecting rod is connected between the two high-temperature sleeves on the same side. The support rod is connected to the connecting rod. The adjusting rod is a threaded rod and is connected to the base. The support rod is threadedly connected to the adjusting rod.

[0014] Furthermore, a heat-insulating material is provided between the high-temperature thermocouple wire and the high-temperature sleeve.

[0015] Furthermore, the hemisphere comprises a metal layer, a heat insulation layer, and a porous blackbody layer stacked sequentially from the outside to the inside, and the porous blackbody layer is made of a porous dielectric material with high emissivity.

[0016] Furthermore, a strip-shaped opening is formed along the outer wall of the hemisphere, and the jacketed sliding optical fiber interface is slidably formed on the opening.

[0017] Furthermore, the jacketed sliding fiber optic interface includes a fiber optic interface channel, an outer sliding cover, and an inner sliding cover. The outer sliding cover and the inner sliding cover are respectively fixed at the upper and lower ends of the fiber optic interface channel and can slide along the inner and outer walls of the hemisphere. The fiber optic interface channel is slidably mounted in the opening, and the fiber optic cable is connected to the fiber optic interface channel.

[0018] Furthermore, it also includes a blackbody furnace, which is made of a thermally conductive material with high emissivity; the blackbody furnace has a light-shielding cover at its outlet; the outer wall of the blackbody furnace has a spiral groove, in which a second high-temperature thermocouple wire is laid, and the gap between the second high-temperature thermocouple wire and the spiral groove is filled with a thermally conductive material.

[0019] Furthermore, the blackbody furnace is a thin-walled cavity with a cylindrical upper end and a conical lower end.

[0020] The beneficial effects of this invention are:

[0021] The aforementioned high-temperature material emissivity measurement system includes a miniature spectrometer, a base, a blackbody box, a first high-temperature thermocouple wire, and a thermocouple heating furnace controller. The blackbody box comprises two hemispheres that are detachably and interlocked to form a spherical shape. One hemisphere is fixed to the base, and the top of the other hemisphere is provided with a jacketed sliding fiber optic interface. The miniature spectrometer is connected to the jacketed sliding fiber optic interface via an optical fiber line.

[0022] There is at least one pair of first high-temperature thermocouple wires. The first high-temperature thermocouple wires are arranged in pairs and horizontally opposite each other to form a storage compartment between each first high-temperature thermocouple wire. The storage compartment is used to store and support the sample to be tested. The thermocouple heating furnace controller is located outside the blackbody empty box and is connected to the two first high-temperature thermocouple wires through transmission wires and heating wires, and is used to control the temperature of the first high-temperature thermocouple wires.

[0023] This high-temperature material emissivity measurement system, through a thermocouple heating furnace controller and a first high-temperature thermocouple wire, can heat the sample to be tested to 1600℃ (and above). Simultaneously, this invention utilizes a blackbody empty cell to reduce the influence of background radiation and optical path distortion on the emissivity measurement results, thus improving the accuracy of the measurement. Furthermore, it allows for convenient adjustment of the sample size, enabling emissivity testing of the same sample under different shapes. Additionally, the blackbody empty cell and heating system used in this invention are small in size and highly portable. Attached Figure Description

[0024] To more clearly illustrate the specific embodiments of the present invention, the accompanying drawings used in the specific embodiments will be briefly described below. In all the drawings, the elements or parts are not necessarily drawn to scale.

[0025] Figure 1 This is a schematic diagram of a high-temperature material emissivity measurement system provided in an embodiment of the present invention;

[0026] Figure 2 for Figure 1 The diagram shows a blackbody cell with two hemispheres in a high-temperature material emissivity measurement system.

[0027] Figure 3 for Figure 1 A schematic diagram of a blackbody furnace for measuring the emissivity of high-temperature materials is shown.

[0028] Figure label:

[0029] 1. Miniature spectrometer; 12. Fiber optic cable; 2. Base; 3. Blackbody empty box; 31. Hemisphere; 311. Metal layer; 312. Thermal insulation layer; 313. Porous blackbody layer; 32. Socket; 33. Opening; 4. Jacketed sliding fiber optic interface; 41. Fiber optic interface channel; 42. External sliding cover; 43. Internal sliding cover; 5. First high-temperature thermocouple wire; 51. High-temperature sleeve; 52. Thermal insulation material; 6. Thermocouple furnace controller; 61. Transmission wire; 62. Heating guide; 7. Adjustment component; 71. Connecting rod; 72. Support rod; 73. Adjustment rod; 8. Blackbody furnace; 81. Outlet; 82. Light-shielding cover; 83. Spiral groove; 84. Second high-temperature thermocouple wire. Detailed Implementation

[0030] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0031] Please see Figures 1 to 3 The present invention provides a high-temperature material emissivity measurement system, including a miniature spectrometer 1, a base 2, a blackbody empty box 3, a first high-temperature thermocouple wire 5, and a thermocouple heating furnace controller 6.

[0032] Specifically, the blackbody empty box 3 includes two hemispheres 31, which are detachably interlocked to form a spherical shape. One hemisphere 31 is fixed on the base 2, and the top of the other hemisphere 31 is provided with a clip-on sliding optical fiber interface 4. The miniature spectrometer 1 is connected to the clip-on sliding optical fiber interface 4 through an optical fiber line 12.

[0033] There is at least one pair of first high-temperature thermocouple wires 5. The first high-temperature thermocouple wires 5 are arranged in pairs, horizontally opposite each other, forming a storage compartment between each first high-temperature thermocouple wire 5. The storage compartment is used to store and support the sample 10 to be tested. The thermocouple heating furnace controller 6 is located outside the blackbody empty box 3 and is connected to the two first high-temperature thermocouple wires through transmission wires 61 and heating wires 62. It is used to heat the first high-temperature thermocouple wires 5 and control the temperature.

[0034] This invention employs a high-temperature thermocouple wire for heating and temperature measurement. The high-temperature thermocouple wire itself is a metallic material with a certain resistance. When energized, it generates heat through the resistance effect, causing the thermocouple wire to heat up. This heated thermocouple wire then heats the sample 10 being tested. The increased temperature of the sample 10 generates a thermoelectric potential in contact with the heated thermocouple wire, allowing the temperature of the sample to be measured. The thermocouple wire can withstand high temperatures, thus enabling the measurement of high-temperature emissivity.

[0035] The test sample 10 has at least two first high-temperature thermocouple wires 5, which are arranged in pairs. On the one hand, this helps to promote uniform heating of the test sample 10. On the other hand, when the test sample 10 is heated to a liquid state, the surface tension of the liquid can be used to fix the test sample 10 between the first high-temperature thermocouple wires 5 to achieve good placement of the test sample 10. It also helps to adjust the size of the test sample 10 placed between the first high-temperature thermocouple wires 5, so as to test the emissivity of the same sample under different shapes.

[0036] The blackbody cassette 3 of the present invention comprises two hemispheres 31, which can be fastened together by clips or screws. A jacketed sliding optical fiber interface 4 is provided on the central wall of the upper hemisphere 31 of the blackbody cassette 3. This interface receives thermal radiation from the sample and enters the micro spectrometer 1 through the optical fiber, thereby obtaining the radiation intensity of the sample.

[0037] Using this high-temperature material emissivity measurement system, the sample 10 to be tested can be heated to 1600℃ (and above) through the thermocouple heating furnace controller 6 and the first high-temperature thermocouple wire 5. At the same time, the present invention utilizes the blackbody empty cell 3 to reduce the influence of background radiation and optical path distortion on the emissivity measurement results, thereby improving the accuracy of the measurement results. In addition, the size of the sample 10 to be tested can be easily adjusted, thus enabling the testing of emissivity of the same sample under different shapes. Furthermore, the blackbody empty cell 3 and heating system used in the present invention are small in size and have good portability.

[0038] In a preferred embodiment, the positive and negative electrodes of the first high-temperature thermocouple wire 5 are welded together in a straight line and then bent into a U-shape. Each end of the first high-temperature thermocouple wire 5 is fitted with a high-temperature sleeve 51. The black body empty box 3 has an insertion hole 32 extending radially therein. The end of the high-temperature sleeve 51 can slide out through the insertion hole 32 and connect to the thermocouple heating furnace controller 6.

[0039] The insertion hole 32 ensures that the position and height of the first high-temperature thermocouple wire 5 are fixed, thereby ensuring the flatness of the surface of the sample 10 being tested. The high-temperature sleeve 51 serves both as insulation and facilitates the passage of the first high-temperature thermocouple wire 5 through the insertion hole 32.

[0040] In practical implementation, a heat insulation material 52 can be placed between the first high-temperature thermocouple wire 5 and the high-temperature sleeve 51 to reduce heat loss from the thermocouple, lower the surface temperature of the high-temperature sleeve 51, and weaken the influence of background radiation during sample emissivity measurement.

[0041] In a more preferred embodiment, the device further includes a position adjustment component 7, which is connected between the high-temperature sleeve 51 and the base 2. The adjustment component 7 is used to drive the high-temperature sleeve 51 to move radially along the blackbody empty box 3, thereby changing the size of the storage chamber. This facilitates the use of the surface tension of the molten liquid sample 10 to fix the sample 10 between the thermocouple wires to achieve proper sample placement. It also allows for easy adjustment of the size of the sample 10, thus enabling the testing of emissivity of the same sample under different shapes.

[0042] Specifically, the adjusting assembly 7 includes a connecting rod 71, a support rod 72, and an adjusting rod 73. The connecting rod 71 is connected between two high-temperature sleeves 51 on the same side, the support rod 72 is connected to the connecting rod 71, and the adjusting rod 73 is a threaded rod connected to the base 2. The support rod 72 and the adjusting rod 73 are threaded together.

[0043] When it is necessary to adjust the distance between the two first high-temperature thermocouple wires 5, simply rotate the adjusting rod 73. The adjusting rod 73 will drive the support rod 72 and the connecting rod 71 to move closer to or away from the blackbody box 3, thus making the adjustment.

[0044] As another preferred embodiment, a strip-shaped opening 33 is provided on the outer wall of the hemisphere 31, and the jacketed sliding optical fiber interface 4 is slidably opened on the opening 33.

[0045] Specifically, the jacketed sliding fiber optic interface 4 includes a fiber optic interface channel 41, an outer sliding cover 42, and an inner sliding cover 43. The outer sliding cover 42 and the inner sliding cover 43 are fixed to the upper and lower ends of the fiber optic interface channel 41, respectively, and can slide along the inner and outer walls of the hemisphere 31. The fiber optic interface channel 41 is slidably fitted into the opening 33, and the fiber optic cable 12 is connected to the fiber optic interface channel 41.

[0046] This method allows the jacketed sliding fiber optic interface 4 to slide within a certain angle on the upper hemisphere 31, thereby measuring the directional emissivity of the sample. In practice, the length of the internal sliding cover 43 can be twice the length of the opening 33 on the upper hemisphere 31, and its width can also be greater than the width of the opening 33, ensuring that no radiation energy overflows from the blackbody box 3 at different positions on the upper hemisphere 31 of the jacketed sliding fiber optic interface 4. The length of the opening 33 can be one-quarter of the circumference of the hemisphere 31, thus allowing the jacketed sliding fiber optic interface 4 to slide within an angle of 0-90°.

[0047] In this embodiment, the hemisphere 31 comprises a metal layer 311, a heat insulation layer 312, and a porous blackbody layer 313 stacked sequentially from the outside to the inside. The porous blackbody layer 313 is made of a high-emissivity porous dielectric material. This high-emissivity porous dielectric material can absorb background radiation generated by the hot filament and reduce the impact of optical path distortion on the radiation energy received by the miniature spectrometer 1, ensuring that the infrared radiation transmitted through the jacketed sliding fiber optic interface 4 originates only from the sample surface. The middle layer of the blackbody empty cell 3 is a heat insulation layer to reduce the influence of the external environment on the sample temperature.

[0048] In another preferred embodiment, the device further includes a blackbody furnace 8, which is made of a high-emissivity thermally conductive material. A light-shielding cover 82 is provided at the outlet 81 of the blackbody furnace 8. A spiral groove 83 is provided on the outer wall of the blackbody furnace 8, and a second high-temperature thermocouple wire 84 is laid within the spiral groove 83, with the gap between the second high-temperature thermocouple wire 84 and the spiral groove 83 filled with a thermally conductive material.

[0049] In use, the blackbody furnace 8 is placed inside the blackbody empty box 3, and the temperature of the blackbody furnace 8 is controlled by the thermocouple heating furnace controller 6. The energy radiated by the blackbody furnace 8 is detected by the miniature spectrometer 1 through the jacketed sliding fiber optic interface 4. The emissivity is obtained by comparing the radiation energy of the sample 10 under test with the radiation energy of the blackbody.

[0050] In practical implementation, a thin-walled cavity with a cylindrical shape at the top and a conical shape at the bottom can be set for the blackbody furnace 8.

[0051] The working process of the above-mentioned high-temperature material emissivity measurement system is as follows:

[0052] In use, the blackbody furnace 8 with the second high-temperature thermocouple wire 84 wound around it is first placed in the center of the blackbody empty box 3, and the second high-temperature thermocouple wire 84 is extended out of the blackbody empty box 3 and connected to the thermocouple heating furnace controller 6. Then, the second high-temperature thermocouple wire 84 is set to the required temperature and the blackbody furnace 8 is heated by the thermocouple heating furnace controller 6. Then, the infrared radiation intensity emitted by the blackbody furnace 8 at different temperatures is measured and recorded by the micro spectrometer 1. After the infrared radiation intensity test of the blackbody furnace 8 is completed, the blackbody empty box 3 is opened and the blackbody furnace 8 is taken out.

[0053] Subsequently, the sample 10 to be tested is ground into powder and mixed with a low-boiling-point organic solvent to form a moist block. The block sample 10 is then placed between two opposing first high-temperature thermocouple wires 5, so that the first high-temperature thermocouple wires 5 support the sample 10. The first high-temperature thermocouple wires 5 are then set to the required temperature and the thermocouple heating furnace controller 6 is started for heating. After the sample 10 is melted, the two first high-temperature thermocouple wires 5 are adjusted to a suitable distance so that the sample 10 comes into contact with the two first high-temperature thermocouple wires 5. Then, the two hemispheres 31 of the blackbody empty box 3 are joined and tightly connected. The sample 10 is heated and the sample radiation energy at different temperatures is recorded. The sample radiation energy at different temperatures is compared with the radiation energy of the blackbody furnace 8 to measure the emissivity.

[0054] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. A high-temperature material emissivity measurement system, characterized in that, include: Miniature spectrometer; Base; The blackbody empty box includes two hemispheres that are detachably snapped together to form a spherical shape. One of the hemispheres is fixed to the base, and the top of the other hemisphere is provided with a clip-on sliding optical fiber interface. The miniature spectrometer is connected to the clip-on sliding optical fiber interface via an optical fiber line. The first high-temperature thermocouple wires, at least one pair, are arranged horizontally opposite each other in pairs, forming a storage compartment between each first high-temperature thermocouple wire. The storage compartment is used to store and support the sample being tested. The positive and negative electrodes of the first high-temperature thermocouple wires are welded together in a straight line and then bent into a U-shape. A thermocouple heating furnace controller is located outside the blackbody empty box and is connected to the two first high-temperature thermocouple wires through transmission wires and heating wires, and is used to control the temperature of the first high-temperature thermocouple wires.

2. The high-temperature material emissivity measurement system according to claim 1, characterized in that, Each of the first high-temperature thermocouple wires has a high-temperature sleeve at both ends. The blackbody box has a recess extending radially therein, and the end of the high-temperature sleeve can slide out of the recess and connect to the thermocouple heating furnace controller.

3. The high-temperature material emissivity measurement system according to claim 2, characterized in that, It also includes a position adjustment component connected between the high-temperature sleeve and the base, for driving the high-temperature sleeve to move radially along the blackbody box.

4. The high-temperature material emissivity measurement system according to claim 3, characterized in that, The adjustment assembly includes a connecting rod, a support rod, and an adjusting rod. The connecting rod is connected between the two high-temperature sleeves on the same side. The support rod is connected to the connecting rod. The adjusting rod is a threaded rod and is connected to the base. The support rod is threadedly connected to the adjusting rod.

5. The high-temperature material emissivity measurement system according to claim 2, characterized in that, A heat insulation material is provided between the first high-temperature thermocouple wire and the high-temperature sleeve.

6. The high-temperature material emissivity measurement system according to claim 1, characterized in that, The hemisphere comprises a metal layer, a heat insulation layer, and a porous blackbody layer stacked sequentially from the outside to the inside, and the porous blackbody layer is made of a porous dielectric material with high emissivity.

7. The high-temperature material emissivity measurement system according to claim 1, characterized in that, The hemisphere has a strip-shaped opening along its outer wall, and the jacketed sliding fiber optic interface is slidably opened on the opening.

8. The high-temperature material emissivity measurement system according to claim 7, characterized in that, The jacketed sliding fiber optic interface includes a fiber optic interface channel, an outer sliding cover, and an inner sliding cover. The outer and inner sliding covers are fixed at the upper and lower ends of the fiber optic interface channel, respectively, and can slide along the inner and outer walls of the hemisphere. The fiber optic interface channel is slidably mounted in the opening, and the fiber optic cable is connected to the fiber optic interface channel.

9. The high-temperature material emissivity measurement system according to claim 1, characterized in that, It also includes a blackbody furnace, which is made of a high emissivity thermally conductive material; the blackbody furnace has a light-shielding cover at its outlet; the outer wall of the blackbody furnace has a spiral groove, in which a second high-temperature thermocouple wire is laid, and the gap between the second high-temperature thermocouple wire and the spiral groove is filled with a thermally conductive material.

10. A high-temperature material emissivity measurement system according to claim 9, characterized in that, The blackbody furnace is a thin-walled cavity with a cylindrical upper end and a conical lower end.

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