Folded fin vapor chamber cold plate

Abstract

Folded fin vapor chamber cold plates are disclosed. A heat rejection apparatus can include a vapor chamber device and a cover coupled to the vapor chamber device. The vapor chamber device includes a base, a folded fin structure coupled to the base, wherein the base and the folded fin structure define a vapor chamber that houses a wick and a working fluid. The cover and the vapor chamber device define a liquid chamber configured to receive a liquid coolant. The folded fin structure includes a plurality of folded fins that define a first plurality of grooves on a first side of the folded fin structure and a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves is part of the vapor chamber. The second plurality of grooves is part of the liquid chamber.

Description

Background Technology

[0001] Electronic devices such as computers, network devices, and power supply units generate heat during use. Cooling systems can remove this heat from the components of these devices to keep them within desired operating temperatures. For example, liquid cooling technology can remove heat from the system using a flow of liquid coolant. In this liquid cooling technology, a cold plate can be used to transfer heat from the electronic device to the liquid coolant. The cold plate can be thermally coupled to both the electronic device and the liquid coolant flow. For example, some cold plates may have protrusions (e.g., fins, pins, or other similar heat exchange surface elements) extending into the liquid coolant flow, allowing the cold plate to absorb heat from the components and dissipate the heat into the liquid coolant in contact with the protrusions.

[0002] Other types of heat transfer devices include heat pipes and vapor chamber devices. In heat pipe and vapor chamber devices, a sealed vapor chamber is defined by a set of walls, and a working fluid is disposed within the vapor chamber. The working fluid undergoes repeated phase change cycles of vaporization, convection, condensation, and wicking to transfer heat from the hot side of the device (e.g., the side thermally coupled to the heat-generating component) to the colder side of the device (e.g., the side thermally coupled to the cold plate). This phase change cycle causes the working fluid in a heat pipe or vapor chamber device to transfer heat at rates significantly higher than those possible through conduction via a solid metal device similar in size and shape to a heat pipe or vapor chamber device. Attached Figure Description

[0003] This disclosure can be understood from the following detailed description, either alone or in conjunction with the accompanying drawings. These drawings are included to provide a further understanding of this disclosure and are incorporated in and form part of this specification. The drawings illustrate one or more examples of the teachings and, together with the description, explain certain principles and operations. In the drawings:

[0004] Figure 1 This is a block diagram illustrating a folded finned vapor chamber cold plate.

[0005] Figure 2 This is an exploded perspective view of the folded finned vapor chamber cooling plate.

[0006] Figure 3 yes Figure 2 The cross-section of the folded finned vapor chamber cold plate, wherein the cross-section along... Figure 2 3-3 is extracted from the middle.

[0007] Figure 4 yes Figure 2 A perspective view of the bottom side of the cover of the folded finned steam chamber cold plate.

[0008] Figure 5 yes Figure 2A side view of a row of turbulent flowers on a folded finned vapor chamber cooling plate.

[0009] Figure 6 This is an exploded perspective view of another folded finned vapor chamber cold plate.

[0010] Figure 7 It is a perspective view of a system including a folded finned vapor chamber cooling plate. Detailed Implementation

[0011] The term “cold plate” is sometimes used in the art with varying meanings, some of which are more general and others more specific. As used herein, “cold plate” specifically refers to a subgroup of thermal devices configured to receive heat from a component via conduction and dissipate that heat into a flow of liquid coolant (e.g., water), which differs from “radiator” as used herein, which specifically refers to a subgroup of thermal devices configured to receive heat from a component via conduction and dissipate that heat into a gas (e.g., air).

[0012] For example, some electronic devices, such as high-performance computers, generate a significant amount of heat. Furthermore, as electronic devices become faster and more powerful in the future, they are expected to generate even more heat. Such high heat output may make it difficult to remove heat from heat-generating components at a sufficient rate. In addition, in some cases, stricter limitations are being imposed on cooling systems, such as requiring higher inlet water temperatures and / or lower pressures for liquid-cooled systems. These limitations may make it even more difficult for existing thermal devices to remove heat at the expected rate.

[0013] In cooling technologies utilizing cold plates, some cold plates may not have a sufficiently high heat transfer rate to keep up with the expected heat output while also meeting increasingly stringent constraints on the cooling system. Some cold plates include a set of protrusions with relatively high surface areas (e.g., fins, pins, and other types of protrusions with relatively high surface areas) extending from a common base into the liquid coolant flow. The common base may be thermally coupled to the heat-generating component, and thus heat is transferred from the component to the base via conduction. Heat is then transferred via conduction through the thickness of the base to the attachment end of the protrusion, then along the height dimension of the protrusion (the dimension extending from its attachment end to its free end), and from the protrusion into the liquid coolant. However, the rate of conductive heat transfer through the base and through the height dimension of the protrusion may limit the overall heat transfer rate of the cold plate, and therefore, in some cases, the overall heat transfer rate may be insufficient to allow the desired operating temperature.

[0014] To address the challenges associated with removing heat from electronic devices, the examples disclosed herein utilize folded-fin vapor chamber cold plates capable of achieving relatively high heat transfer rates. The folded-fin vapor chamber cold plate includes a base, a folded-fin structure coupled to the base, and a cover coupled to the base and / or the folded-fin structure. The folded-fin structure includes multiple folded fins defining a first set of grooves on the side of the folded-fin structure facing the base (hereinafter referred to as the "base side") and a second set of grooves on the other side of the folded-fin structure facing the cover (hereinafter referred to as the "cover side"). The base and the folded-fin structure are coupled together, defining a sealed vapor chamber therebetween. A working fluid and a wicking structure (also referred to herein as a "wick") are disposed within the vapor chamber, and the working fluid is configured to transfer heat from the base (which may be thermally coupled to a heat-generating component) to the folded fins via a phase change cycle as described above. Therefore, the base, the folded fin structure, the wicking element, and the working fluid form a vapor chamber assembly, which is part of the folded fin vapor chamber cooling plate. A cover is coupled to this vapor chamber assembly (e.g., coupled to the base and / or the folded fin structure) such that a liquid coolant chamber is defined between the cover and the folded fin structure (i.e., on the cover side of the folded fin structure). Liquid coolant can flow through this liquid coolant chamber, wherein the liquid coolant flows through a second set of grooves defined by the folded fins on the cover side of the folded fin structure. Thus, the liquid coolant can contact and remove heat from the folded fins.

[0015] In some embodiments, a turbulence generator may also be provided in the liquid coolant chamber to introduce turbulence into the liquid coolant flow. This turbulence allows for an increased rate of heat transfer between the folded fins and the liquid coolant (all other things being equal, turbulent flow of a liquid tends to remove more heat from the folded fins than laminar flow). In some embodiments, the turbulence generator may be protrusions (e.g., blades) that project downwards from the cover into recesses defined by the folded fins. In other embodiments, the turbulence generator may include surface features of the folded fins themselves on their cover side, these features being designed to introduce turbulence.

[0016] It is noteworthy that in the folded-fin vapor chamber cold plate, the vapor chamber extends into a first set of grooves defined by the folded fins on the base side of the folded-fin structure. In other words, the first set of grooves (i.e., the open spaces between adjacent portions of the folded fins on the base side of the folded-fin structure) is part of the vapor chamber, and these spaces are communicatively connected to each other and to other parts of the vapor chamber, allowing vapor in the vapor chamber to flow into each of these spaces. As a result, the surfaces of the folded fins on the base side are directly exposed to the vapor chamber, and the vapor in the vapor chamber can directly contact and condense on these surfaces. Because the vapor can condense directly on the surfaces of the folded fins on the base side of the folded-fin structure, the heat carried by the vapor can be directly transferred along the entire folded fin to the folded fin. This direct heat transfer from vapor to fin allows for a heat transfer rate far greater than that possible solely via conduction. More specifically, compared to other possible configurations of cold plates, folded-fin vapor chamber devices may have a higher overall heat transfer rate between the heat-generating component and the folded fins. This is at least because the folded-fin vapor chamber device omits some relatively slow conduction paths in the overall heat transfer pathway (e.g., conduction through a common base coupled to the fins and conduction through the fins themselves) and replaces these relatively slow conduction paths with faster heat transfer of the working fluid. Due to the increased heat transfer rate to the folded fins, cold plates incorporated into folded-fin vapor chamber devices can be able to cool high-power components relatively efficiently, even with relatively high liquid coolant temperatures or other limitations on the overall cooling system parameters. For example, some embodiments of the cold plate may have a thermal resistance of 0.01 °C / W or better, where thermal resistance is the difference between the temperature of the component to be cooled and the temperature of the liquid coolant (also known as temperature Δ) (in degrees Celsius) divided by the rate at which the cold plate can remove heat from the component to be cooled under the aforementioned temperature conditions (in watts). A lower thermal resistance allows a cold plate to remove more heat at a given coolant temperature, or to remove a given amount of heat (or some combination thereof) at a higher coolant temperature. For example, with a thermal resistance of 0.01 °C / W, a cold plate could theoretically remove 2000 W of heat at a temperature Δ of 20 °C, 1500 W at Δ of 15 °C, 1000 W at Δ of 10 °C, and so on. In contrast, a cold plate with twice the thermal resistance (e.g., 0.02 °C / W) would remove half the heat at the same temperature Δ, or would require twice the temperature Δ (i.e., a colder coolant) to remove the same amount of heat.

[0017] In addition to allowing for higher heat transfer rates, folded-fin vapor chamber cold plates also allow for a reduced pressure drop across the cold plate compared to other cold plates (e.g., the pressure drop between the inlet and outlet of the liquid coolant chamber entering the cold plate). This may be because, in folded-fin vapor chamber cold plates, the width of the groove defined by the folded fins and between the folded fins can be relatively wide compared to the width of the groove defined between successive fins in other cold plates. For example, some cold plates may utilize cut fins, where the width of the groove between these cut fins has progressed to a gradually decreasing size, for example, around 200 micrometers in some cases. In contrast, the folded fins of folded-fin vapor chamber cold plates can have relatively wide grooves, for example, around 2.5 mm in some examples. The wider grooves of the folded fins create less obstruction to the flow of liquid coolant through the liquid coolant chamber, thus reducing the pressure drop generated by the cold plate. For example, in some cases, the pressure drop across the cold plate can be approximately 1.5 to 5 times smaller than that generated by other types of similarly sized cold plates with cut fins. For example, in some implementations, the pressure drop across the cold plate may be less than or equal to 1 psi (6.9 kPa). In some implementations, this reduction in pressure drop can still be achieved despite the presence of turbulence diffusers protruding into the recesses. This reduced pressure drop across the cold plate allows the liquid cooling circuit supplying the liquid coolant to the cold plate to operate at a lower supply pressure, which allows for reduced power usage by the system's pumps and / or allows for the use of components with lower pressure ratings (e.g., pumps, fittings, etc.) (which may be less expensive) while still providing sufficient performance.

[0018] Turning now to the figures, various apparatuses, systems and methods according to aspects of this disclosure will be described.

[0019] Figure 1 This is a conceptual block diagram illustrating a heat dissipation device in the form of a folded finned vapor chamber cold plate 100 (also referred to as "cold plate 100"). It should be understood that... Figure 1 It is not intended to illustrate a specific shape, size or other structural detail accurately or to scale, and embodiments of the cold plate 100 may have different numbers and arrangements of illustrated components, and may also include other parts not shown.

[0020] like Figure 1As shown, the cold plate 100 includes a base 110, a cover 120, and a folded fin structure 130. The base 110 and the folded fin structure 130 are coupled together to enclose and define a vapor chamber 115, which houses a wicking element 150 and working fluid 117. The cover 120 is coupled to the base 110 and / or the folded fin structure 130 to enclose and define a liquid coolant chamber 125 through which liquid coolant 143 can flow. Liquid coolant 142 can be supplied by a liquid cooling circuit (not shown), through which the cold plate 100 can be fluidly coupled during use. Those skilled in the art will understand that, under certain conditions, such as before the cold plate 100 is coupled to the liquid cooling circuit, the liquid coolant 143 may not be present in the cold plate 100. (The cold plate coupled to the liquid cooling circuit may also be referred to herein as part of the liquid cooling circuit). The folded fin structure 130 forms part of the boundary of the vapor chamber 115 and part of the boundary of the liquid coolant chamber 125, wherein the folded fin structure 130 separates the vapor chamber 115 from the liquid coolant chamber 125.

[0021] The base 110, the folded fin structure 130, the wicking element 150, and the working fluid 117 together form a vapor chamber device 160. The vapor chamber device 160 transfers heat from the base 110 to the folded fin structure 130 by the working fluid 117 repeatedly undergoing a phase change cycle of vaporization, convection, condensation, and wicking. Specifically, the liquid working fluid 117 absorbs heat from the base 110 (which can be thermally coupled to a heat source) until vaporization occurs. The vaporized working fluid 117 then flows via convection to the folded fin structure 130, where it contacts and condenses (thus releasing heat into the folded fin structure 130). Now liquid, the working fluid 117 then flows back to the base 110 via wicking through the wicking element 150 to begin the cycle again.

[0022] The working fluid 117 can be any fluid capable of undergoing the aforementioned phase change cycle at the desired operating temperature of the component (i.e., a fluid capable of vaporizing at the desired operating temperature of the component to be cooled by the cold plate 100 and capable of condensing at the desired temperature of the liquid coolant 143). Examples of suitable working fluids include, but are not limited to, water, methanol, Dowtherm, and acetone. The wicking element 150 can include any structure or combination of structures that provide the working fluid 117 in liquid form, for example, via capillary action. For example, the wicking element 150 can be formed by a sintered powder coating on the surface of the base 110 facing the vapor chamber 115, by a groove formed in the surface of the base 110 facing the vapor chamber 115, by a rigid structure including the groove inserted into the vapor chamber 115, by a wire mesh, mesh, fiber, or other porous material inserted into the vapor chamber 115, or by a similar type of wicking mechanism known to those skilled in the art. In some cases, the wicking element 150 can be integrally coupled to the base 110, while in others, the wicking element 150 can be a separate part separate from the base 110.

[0023] The folded fin structure 130 includes multiple folded fins 131 (in Figure 1 (Only one is labeled in the text). These fins are coupled together to form a corrugated shape, with the first corrugated surface facing the vapor chamber 115 and the second corrugated surface facing the liquid coolant chamber 125. The folded fins 131 have a perpendicular to... Figure 1 The page extends with longitudinal dimension, height dimension 139, and lateral dimension 138. Each folded fin 131 includes a pair of sidewalls 133 and an end portion 134. The sidewalls 133 generally face the lateral direction, meaning that the face of the sidewall 133 is substantially perpendicular to the lateral dimension 138. In other words, the face of the sidewall 133 generally extends in a plane that includes the height dimension 139 and longitudinal dimension of the folded fin 131 (i.e., substantially parallel to that plane). However, the sidewalls 133 may be at an angle relative to the height dimension 139 (e.g., + / - 45°), and therefore are not necessarily exactly parallel to it. The sidewalls 133 are spaced apart from each other along the lateral dimension 138. The pair of sidewalls 133 of a given folded fin 131 are coupled together by a first end portion 134 of the folded fin 131, wherein the first end portion 134 is located at one end of the folded fin 131. Figure 1 As shown, a pair of adjacent folded fins 131 are coupled together by a second end portion 135 located at the respective ends of the two folded fins 131 opposite their corresponding first end portions 134. Although in Figure 1The portions 134 and 135 are schematically shown as flat, but may be arcuate, flat, angled, pointed, or a combination thereof. In some examples, the end portions 134 and 135 are integrally coupled to the sidewall 133 and include one or more curved, arcuate, and / or folded sections forming a transition between the sidewall 133 and the end portions 134 or 135.

[0024] Folded fin 131 defines a first set of grooves 141 on the first side (“base side”) of the folded fin structure 130 facing the base 110. Figure 1 (Only one is marked in the text). Each groove in the first set of grooves 141 is defined by and between the sidewall 133 and the first end portion 134 of one of the folded fins 131. The first set of grooves 141 is part of the vapor chamber 115, or in other words, the vapor chamber 115 extends into the first set of grooves 141. Therefore, the corrugated surface of the folded fin structure 130 facing the base 110 (which includes the surface of the sidewall 133 and the two end portions 133 and 134) is directly exposed to the vapor chamber 115. Therefore, the working fluid 117 in the form of vapor can directly contact and condense on these surfaces, and the aforementioned heat transfer of the working fluid 117 to the folded fin structure 130 thus includes the direct entry of vapor into the folded fin 131 (including direct entry into the sidewall 133 and its end portion 135) via the heat transfer through condensation thereon.

[0025] The folded fin 131 also defines a second set of grooves 142 on the second side (“cover side”) of the folded fin structure 130 facing the cover 120. Figure 1 (Only one is shown in the image). Each groove 142 in the second set of grooves 142 is defined by two sidewalls 133 of a pair of adjacent folded fins 131 and a second end portion 135 coupling the two sidewalls 133 together. The second set of grooves 142 is part of the liquid coolant chamber 125, or in other words, the liquid coolant chamber 125 extends into the second set of grooves 142, so that the liquid coolant flowing through the liquid coolant chamber 125 can contact the surface of the folded fins 131 on the cover side of the folded fin structure 130. Therefore, the second corrugated surface of the folded fin structure 130 facing the cover 120 (the surface including the sidewalls 133 and the end portion 135) is directly exposed to the liquid coolant chamber 125. Therefore, heat transferred to the folded fins 131 can be removed from the folded fins 131 by conduction to the liquid coolant 143 in contact with the cover side surface of the folded fins 131.

[0026] The folded fin structure 130 can be formed of one or more thermally conductive materials (including, in some cases, highly thermally conductive materials). For example, in some embodiments, the folded fin structure 130 is made of a metal (e.g., copper, copper alloys (e.g., copper-beryllium alloys, copper-zirconium alloys, etc.), stainless steel, or aluminum).

[0027] The folded fin structure 130 can be formed from a single sheet of material (e.g., metal) that has been formed (e.g., folded) to obtain a corrugated shape with multiple folded fins 131. Alternatively, the folded fin structure 130 can be formed from individual parts that are joined together (e.g., by welding, welding, mechanical fastening techniques, etc.); for example, discrete segments comprising a single folded fin 131 or a subgroup of integrally coupled folded fins 131 can be formed individually and then joined together to form a corrugated shape. The folded fin structure 130 can also be formed alternatively by a variety of other techniques, including but not limited to machining one or more pieces of material, such as by cutting (or other material removal processes) the grooves 141 and 142 into solid material blocks, by extrusion and / or additive manufacturing techniques (e.g., 3D printing).

[0028] The base 110 can also be formed of one or more thermally conductive materials (including, in some cases, highly thermally conductive materials). For example, the base 110 can be formed of metal (e.g., copper, copper alloy, stainless steel, nickel-plated brass, etc.).

[0029] The cover 120 can be formed of any desired material suitable for exposure to the liquid coolant 143. For example, the cover 120 can be made of a polymer or plastic, such as polyphenylene sulfide (PPS), glass-filled PPS, polyphenylsulfone (PPSU), modified polyphenylene ether, or other similar materials.

[0030] The folded finned vapor chamber cold plate 100 can be formed by forming a vapor chamber assembly 160 and then attaching a cover 120 to the vapor chamber assembly. The vapor chamber assembly 160 can be formed by combining a base 110 with a folded fin structure 130, wherein a wicking element 150 and working fluid 117 are present in the vapor chamber 115. For example, the base 110 can be provided (e.g., manufactured, purchased, etc.), and the wicking element 150 can be positioned on a portion of the base 110 that ultimately becomes part of the vapor chamber 115. In some cases, positioning the wicking element 150 on the base 110 can include forming the wicking element 150 on the base 110 (e.g., depositing powder on the base 110 and sintering the powder to form the wicking element 150). In other cases, positioning the wicking element 150 on the base 110 can include providing a separately formed wicking element 150 and placing it on the base 110. The working fluid 117 can also be disposed on the base 110, for example, on and / or in the wicking member 150. The folded fin structure 130 can then be positioned on and in contact with the base 110. In this state, the base 110 and the folded fin structure 130 can be attached together by, for example, brazing (e.g., welding), fusion welding, mechanical bonding (e.g., crimping), adhesive, or any other bonding process that can form a vapor and liquid-tight seal to prevent the working fluid 117 from flowing out of the vapor chamber 115. Alternatively, instead of placing the working fluid 117 on the base 110 before bonding the folded fin structure 130 to the base 110, the working fluid 117 can be injected into the vapor chamber 115 through an opening formed in the base 110 or the folded fin structure 130 after bonding the folded fin structure 130 to the base 110. This opening can then be sealed, for example by adding a material such as solder or adhesive into the opening, by melting the material around the opening to close the opening, or by mechanically sealing the opening, for example by crimping the material around the opening. Once the vapor chamber assembly 160 is formed, the cover 120 can be attached to the vapor chamber assembly 160 by adhesive, mechanical fasteners, or any other desired bonding process. A gasket (not shown) can be used between the cover 120 and the vapor chamber assembly 160 to help form a liquid-tight seal.

[0031] Turn now Figures 2 to 5This document describes a heat dissipation device in the form of a folded finned vapor chamber cold plate 200 (also referred to as "cold plate 200") according to various aspects of this disclosure. Cold plate 200 can be a configuration of the aforementioned cold plate 100. Therefore, various components of cold plate 200 can be similar to those of cold plate 100. The above description of the components of cold plate 100 applies to similar components of cold plate 200, therefore repeated descriptions are omitted below for clarity. Similar components of cold plates 100 and 200 are given the same reference numerals for the last two digits, such as 110 and 210. Although cold plate 200 can be a configuration of cold plate 100, cold plate 100 is not limited to the configuration of cold plate 200.

[0032] Various components or parts thereof of the cold plate 200 are illustrated in several figures. As the components are described below, note that one or more figures will be considered particularly relevant to the component being described; therefore, the following descriptions are not necessarily presented in a strict order. Figures 2 to 5 Instead, it involves switching back and forth between various diagrams. Furthermore, it should be understood that when referring to certain diagrams related to a specific element, other diagrams besides those that are designated may also depict the same part from different angles.

[0033] like Figure 2 As shown, the folded finned vapor chamber cooling plate 200 includes a base 210, a folded finned structure 230, and a cover 220. Figure 2 and Figure 3 As shown, base 210 is coupled to folded fin structure 230 to define a vapor chamber 215 between them, as described above with respect to cold plate 100. A wicking element 250 and working fluid (not shown) are disposed in the vapor chamber 215, wherein base 210, folded fin structure 230, wicking element 250, and working fluid form a vapor chamber arrangement. As described above, cover 220 is coupled to base 210, and cover 220 and folded fin structure 230 define a liquid coolant chamber 225 between them. A portion of base 210 may also form part of the boundary of liquid coolant chamber 225.

[0034] like Figure 2 As shown, the folded fin structure 230 includes a plurality of folded fins 231. Each folded fin includes a sidewall 233, wherein end portions 234 and 235 couple adjacent sidewalls 233 together. The folded fin 231 defines a first set of grooves 241 on its side facing the base 210 and a second set of grooves 242 on its side facing the cover 220. The folded fin structure 230 may be formed as described above with respect to the folded fin structure 130.

[0035] exist Figures 2 to 5In some examples, the wicking element 250 includes a rigid body, such as a body formed from sintered metal powder, a rigid metal mesh, or a solid in which grooves are formed. In some cases, the wicking element 250 can be integrally coupled to the base 210. For example, the wicking element 250 can be formed directly on the base 210 by sintering, in which case the wicking element 250 can be coupled to the base. In other cases, the wicking element 250 can be formed separately from the base 210, for example, by sintering, additive manufacturing, etc. In some embodiments, the wicking element 250 also includes a groove 251 extending perpendicular to the folded fin 231 (see...). Figure 3 These grooves allow vapor to pass through in a direction perpendicular to the folded fins 231, so that the vapor can be more evenly distributed in the grooves 241.

[0036] like Figure 2 As shown, the base 210 includes a planar portion 211 and engaging portions 212 and 213, which are coupled to and extend perpendicularly from the planar portion 211. The planar portion 211 can be thermally coupled to a heat-generating component, such as a computer processor, for example, by means of the outer surface of the planar portion 211 (…). Figure 3 The bottom surface (on the orientation) is thermally coupled to the heat-generating component in a manner similar to that described below. Figure 7 Further description is provided below. The joining portions 212 and 213 are configured to engage with the folded fin structure 230, and are described in more detail below. The base 210 can be formed as a single unit, for example, by machining a piece of metal, by casting, by additive manufacturing, and / or by other similar processes. Alternatively, the base 210 can be formed as separate parts, which are then coupled together. For example, the joining portion 213 can be formed by extrusion or machining, the planar portion 211 and the joining portion 212 can be formed from a sheet or metal plate, and these components can be coupled together by any suitable bonding technique (e.g., brazing, fusion welding, adhesives, and other similar bonding techniques).

[0037] like Figure 2 and Figure 3As shown, the engagement portion 212 includes two opposing walls that engage with the outermost two folded fins 231 of the folded fin structure 230. Each engagement portion 213 includes a row of plugs extending between the engagement portions 212, wherein the plugs are configured to intersect with the folded fins 231 of the folded fin structure 230 when the folded fin structure 230 is coupled to the base 210. The plugs have a profile that is substantially the same size and shape as the recess 241, but are much shorter in the longitudinal direction, so that when engaged with the folded fin structure 230, each plug fills and plugs (blocks) one end segment of the corresponding recess 241, leaving the middle segment of the recess 241 open. Therefore, when the joining portions 212 and 213 (e.g., by brazing or other joining methods as described above with respect to the cold plate 100) are attached to the folded fin 231, they form a seal around the periphery of the folded fin structure 230 (e.g., joining portion 212 seals the lateral sides of the folded fin structure 230, and joining portion 213 seals the ends of the folded fin 231), thereby completely sealing the vapor chamber 215 relative to the external environment and preventing the working fluid from flowing out of the vapor chamber.

[0038] like Figure 2 and Figure 3 As shown, the planar portion 211 of the base 210 may include an outer flange portion 216 extending beyond the engagement portions 212 and 213. The outer flange portion 216 may engage with the flange portion 224 of the cover 220, as shown. Figure 3 As shown. Gasket 226 can be disposed between outer flange portion 216 and flange portion 224 to provide a liquid-tight seal for liquid coolant chamber 225, such as... Figure 3 As shown.

[0039] like Figure 3As shown, the planar portion 211 of the base 210 may also include an intermediate portion 214, which may be thinner than the rest of the planar portion 211 in terms of thickness. The intermediate portion 214 may be positioned to contact the component to be cooled, and the intermediate portion 214 may be thinned to reduce the distance heat must travel from the surface of the base 210 facing the component to be cooled to the surface of the base 210 facing the vapor chamber 215. By reducing the distance heat travels through the base 210, the rate of heat transfer through the base 210 can be increased. Making the contact surface of the cold plate (e.g., the intermediate portion 214) relatively thin may not be feasible in many cold plates because such a thin contact surface may not have sufficient rigidity and strength to withstand the forces involved in mounting it on the component to be cooled. However, in the folded finned vapor chamber cold plate 200, the middle portion 214 can be relatively thin without making it structurally unreliable. This is because other elements of the cold plate 200 are configured to provide structural support to the middle portion 214 to help compensate for the reduction in rigidity and strength that occurs due to the thinning of the middle portion. In particular, as Figure 3 As shown, one side of the wicking member 250 is positioned to contact the intermediate portion 214. In this embodiment, the wicking member 250 includes a rigid body, and therefore, the contact between the wicking member 250 and the intermediate portion 214 provides some support to the intermediate portion. Furthermore, the wicking member 250 also contacts the end portion 234 of the folded fin structure 230 (i.e., at...). Figure 3 (The orientation shown is in contact with the bottom side of the folded fin structure 230). As a result, the folded fin structure 230 can provide further structural support to the thinner middle portion 214 of the base 210 through the mutual contact between the folded fin structure 230 and the intermediate portion 214 with the wicking member 250. Thus, the wicking member 250 and the folded fin structure 230 provide sufficient support for the middle portion 214 to allow it to withstand the forces associated with mounting the cold plate 200 onto the component, but the middle portion 214 may not be able to withstand such forces alone. Therefore, the folded fin structure 230 not only promotes a high heat transfer rate through the cold plate 200 by replacing certain slow conduction paths (e.g., omitting conduction along the height dimension of the fin, as seen in other cold plates) with faster vapor heat transfer, but also helps to promote a high heat transfer rate by allowing the middle portion 214 to be relatively thin, thus exhibiting improved heat conduction through the base 210 into the vapor chamber 215.

[0040] like Figure 2 and Figure 4As shown, cover 220 includes an inlet 221 and an outlet 222, which communicatively connect the liquid coolant chamber 225 to the external environment. Inlet 221 and outlet 222 can be coupled to the liquid coolant supply line and return line of the liquid cooling circuit, respectively, to provide a flow of liquid coolant through chamber 225.

[0041] like Figures 3 to 5 As shown, the cover 220 also includes a plurality of turbulence generators 223. Figures 3 to 5 In the example shown, the turbulence generator 223 includes blade-like protrusions extending downward from the cover into a second set of grooves 242 defined by folded fins 231 on the cover-facing side of the folded fin structure 230. Figure 4 As shown, the turbulence generators 223 are arranged in rows 227, with each row 227 protruding into a corresponding groove in the groove 242. Figure 5 The diagram shows a side view of row 227. (See diagram below.) Figure 4 and Figure 5 As shown, the turbulence generator 223 can have different heights to further increase turbulence. For example, as Figure 4 and Figure 5 As shown, the turbulence generator 223 may include a first subgroup of long turbulence generators 223a and a second subgroup of short turbulence generators 223b, which alternate with each other along a given row 227 (e.g., along the length of the groove 242 to which they extend). Figure 3 As shown, the width of the turbulence generator 223 gradually decreases from its widest portion at the end attached to the cover 220 to its narrowest portion at its free end. In some embodiments, the turbulence generator 223 may be integrally formed with the cover 220. For example, the cover 220 and the turbulence generator 223 may be formed by molding (e.g., injection molding), casting, or additive manufacturing.

[0042] Turn now Figure 6 This describes another embodiment of a heat dissipation device in the form of a folded finned vapor chamber cold plate 300 (also referred to as "cold plate 300"). Cold plate 300 can be a configuration of the cold plate 100 described above. Furthermore, except for some differences noted below, cold plate 300 can be similar to the cold plate 200 described above. Therefore, various components of cold plate 300 can be similar to those of cold plates 100 and 200 described above. The above description of the components of cold plates 100 and 200 applies to similar components of cold plate 300; therefore, repeated descriptions are omitted below for clarity. Although cold plate 300 can be a configuration of cold plate 100, cold plate 100 is not limited to cold plate 300.

[0043] like Figure 6As shown, the cold plate 300 includes a wicking element 350 and a folded fin structure 330. The cold plate also includes a base similar to the aforementioned base 210. For improved clarity, in... Figure 6 The base is omitted in the view. The cold plate 300 may also include a cover similar to cover 120 or 220; for better clarity, from... Figure 6 The cover is omitted in the view.

[0044] The folded fin structure 330 can be used as the folded fin structure 130. The folded fin structure 330 can also be similar to the folded fin structure 230 described above, and repeated descriptions of similar aspects are omitted below. The difference between the folded fin structure 230 and the folded fin structure 330 is that the folded fin structure 330 includes a raised section 336 on one side, which will be described in more detail below.

[0045] The wicking element 350 can be used as the wicking element 150. For example... Figure 6 As shown, the wicking member 350 includes a central region 352 arranged in a pattern, a plurality of first wicking segments 353, and a plurality of second wicking segments 354. Specifically, the first wicking segments 353 extend radially from the central region 352, while the second wicking segments 354 extend from the first wicking segments 353 along a direction parallel to the folded fins 331 of the folded fin structure 330. An open channel 358 is located between adjacent first wicking segments 353, and an open channel 355 is located between adjacent second wicking segments. Outside the raised section 336, the underside of the folded fins 331 can be positioned within the channel 355 defined between adjacent second wicking segments 354. Within the raised section 336, the underside of the folded fins 331 is raised above the first wicking segments 353 and above the adjusting plate 356 (described further below).

[0046] The central region 352 is located near the center of the base 310, which is typically positioned adjacent to the hottest part of the component to be cooled. Therefore, an uneven amount (e.g., in some cases, the majority) of vapor is expected to be generated in or near the central region 352. Consequently, the pattern of the first wicking section 353 and the second wicking section 354, as well as the channels 355 and 358, is designed to promote more uniform circulation of the vapor generated near the central region 352 within all the grooves 341 of the folded fins 331. Furthermore, the pattern of the first wicking section 353 and the second wicking section 354, as well as the channels 355 and 358, is also designed to provide efficient return wicking paths that guide condensed liquid back to the central region 352, ensuring a continuous supply of liquid to be vaporized, thereby increasing heat transfer.

[0047] Specifically, channels 358, defined between the first wicking sections 353, extend radially from the central region 352, and these channels 358 allow the vapor generated in the central region 352 to travel in a direction substantially perpendicular to the folded fins 331. This allows the vapor to reach the recesses 341 further away from the central region 352, rather than entering the recesses 341 directly above the central region 352. Furthermore, regulating plates 356 can be positioned on the channels 358 to limit the rate at which vapor enters the recesses 341 from the channels 358. The regulating plates 356 can be configured to promote more uniform vapor diffusion across all the recesses 341. For example, as... Figure 6 As shown, the regulating plate 356 includes slots 357 aligned with the recess 341, allowing vapor to enter the recess 341 through these slots, and the length of the slots 357 increases according to their distance from the central region 352 (the slots 357 further away are longer). This lengthening of the slots 357 farther from the central region 352 tends to promote a more uniform distribution of vapor in the recess 341, because the vapor pressure closer to the central region 352 may be higher, so the shorter slots 357 closer to the central region 352 may produce a similar vapor flow rate as the longer slots 357 farther away from the central region 352. Once the vapor enters the recess 341, the vapor can then expand along the longitudinal dimension of the recess 341 and contact and condense along most (if not all) of the surface of the folded fins 331. Therefore, heat can be distributed relatively uniformly on the folded fins 331. After the working fluid condenses, it falls along the side of the folded fins 331 until it reaches the wicking section 353 or 354 located below or inside the recess 341. The wicking section 353 moves the liquid longitudinally to the wicking section 354, while the wicking section 354 moves the liquid radially back to the central region 352. The returning liquid is then heated and vaporized, and the cycle begins again. Of course, it should be understood that the central region 352 is not the only place where vaporization occurs; some liquid moving through the wicking sections 353 and 354 may be vaporized before returning to the central region 352. However, the above description focuses on the vapor generated in the central region 352 because, as already noted above, the central region is where an uneven amount of vapor is expected to be generated.

[0048] Turn now Figure 7 This document describes a system 10 utilizing a folded finned vapor chamber cooling plate. System 10 includes an electronic device 490, which includes a heat-generating component 495. The electronic device 490 can be a computer (e.g., a node in a computing system), a network device, a power supply device, or any other type of electronic device. The heat-generating component 495 can be any electronic circuit that generates heat, such as a processor, hardware accelerator, controller, switching unit, or any other electronic component.

[0049] like Figure 7 As shown, system 10 further includes a liquid cooling circuit 480. The liquid cooling circuit 480 includes a folded finned vapor chamber cold plate 400, a liquid supply line 481, and a liquid return line 482. The folded finned vapor chamber cold plate 400 may include any of the cold plates 100, 200, or 300 described above, and includes a base 410 and a cover 420 coupled to the base. The cold plate 400 may further include a folded fin structure according to any of the above configurations (in... Figure 6 (Not visible in the text). For example... Figure 6 As shown, the base 410 is thermally coupled to the heat-generating component 495. The base 410 may contact the heat-generating component 495 directly or indirectly via one or more thermally conductive intermediates (e.g., the thermal interface material (TIM) or integrated heat spreader (IHS) of the heat-generating component 495). The cover 420 (along with the folded fin structure) defines a liquid coolant chamber (not visible) and has an inlet 421 and an outlet 422 to allow fluid communication with the liquid coolant chamber. A liquid supply line 481 and a liquid return line 482 are connected to the inlet 421 and outlet 422 in the cover 420, respectively, so that lines 481 and 482 can deliver liquid coolant flow to and through the liquid coolant chamber of the cold plate 400. Liquid supply line 481 and liquid return line 482 are also coupled to the remainder of liquid cooling circuit 480, which includes pump 483 to circulate liquid coolant through lines 481 and 482. Liquid cooling circuit 480 may also include one or more additional components (not shown), such as heat exchangers for cooling liquid coolant, additional cold plates for cooling other devices, valves, fittings, and / or other components common to liquid cooling circuits familiar to those skilled in the art.

[0050] In some embodiments, the pressure drop of the liquid flow between the supply line 481 and the return line 482 is less than or equal to 1 psi (6.9 kPa) as the liquid coolant flow is supplied through the liquid chamber. Furthermore, in some embodiments, the thermal resistance of the cold plate 400 does not exceed 0.01 °C / W, where thermal resistance refers to the difference between the temperature of the component to be cooled and the temperature of the liquid coolant at the inlet of the cold plate 400 (also known as temperature Δ) divided by the rate at which the cold plate 400 can remove heat from the component to be cooled under the aforementioned temperature conditions. Thermal resistance generally reflects the efficiency of the cold plate 400 in removing heat at a given temperature Δ, with lower values ​​generally being better than higher values. Thermal resistance can be interpreted as indicating how much heat the cold plate 400 can remove at a specified liquid coolant and component operating temperature (i.e., at a specified temperature Δ), or alternatively, as indicating the lowest temperature Δ that can be used while still allowing the cold plate 400 to achieve a specified heat removal rate (in some cases, a lower temperature Δ is required because it allows less energy to be spent cooling the liquid coolant).

[0051] The above description describes various types of electronic circuits. As used herein, “electronic” is intended to be understood broadly to include all types of circuits that utilize electricity, including digital and analog circuits, direct current (DC) and alternating current (AC) circuits, as well as circuits used to convert electricity into another form of energy and circuits used to perform other functions using electricity. In other words, as used herein, there is no distinction between “electronic” circuits and “electrical” circuits. In some cases, certain electronic circuits may include processing circuitry. Processing circuitry includes circuitry configured with logic for performing various operations. The logic of the processing circuitry may include dedicated hardware performing various operations, software (machine-readable and / or processor-executable instructions) performing various operations, or any combination thereof. In an example where the logic includes software, the processing circuitry may include a processor that executes software instructions and a memory device that stores the software. The processor may include one or more processing devices capable of executing machine-readable instructions, such as a processor, processor core, central processing unit (CPU), controller, microcontroller, system-on-a-chip (SoC), digital signal processor (DSP), graphics processing unit (GPU), etc. When the processing circuitry includes dedicated hardware, in addition to or in place of a processor, the dedicated hardware may include any electronic device configured to perform a specific operation, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a complex programmable logic device (CPLD), discrete logic circuits, hardware accelerators, hardware encoders, etc. The processing circuitry may also include any combination of dedicated hardware and a processor plus software.

[0052] It should be understood that both the general description and the detailed description provide illustrative examples of an inherent nature and are intended to provide an understanding of this disclosure, without limiting its scope. Various mechanical, compositional, structural, electronic, and operational changes may be made without departing from the scope of this specification and the claims. In some instances, well-known circuits, structures, and techniques have not been shown or described in detail to avoid obscuring these examples. Similar numbers in two or more figures represent the same or similar elements.

[0053] Furthermore, the spatial, positional, and relational terms used herein are selected to aid the reader in understanding examples of the invention, but are not intended to limit the invention to specific frames of reference, orientations, or positional relationships. For example, spatial, positional, and relational terms such as “up,” “down,” “lateral,” “below,” “under,” “lower,” “upper,” “near,” “far” can be used herein to describe directions or spatial relationships between one element or feature and another, as illustrated in the figures. These spatial terms are used relative to the frame of reference in the figures and are not limited to a specific frame of reference in the real world. Thus, for example, the direction “up” in the figures does not necessarily correspond to “up” in a world frame of reference (e.g., away from the Earth’s surface). Moreover, if a different frame of reference is considered, the spatial terms used herein may need to be interpreted differently in that different frame of reference. For example, a direction referred to as “up” relative to one of the figures may correspond to a direction referred to as “down” relative to a different frame of reference rotated 180 degrees from that frame of reference. As another example, if the device is flipped 180 degrees in the world frame of reference compared to the illustration, then the item described herein as being "above" or "on top of" the second item relative to the illustration will be "below" or "under" the second item relative to the world frame of reference. Furthermore, the orientation of the items illustrated in the figures is chosen for ease of explanation and description, but in actual implementations, the orientation of the items may be different.

[0054] Additionally, unless the context otherwise requires, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well. Furthermore, the terms “comprises,” “comprising,” “includes,” etc., specify the presence of features, steps, operations, elements, and / or components of a statement, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. Components described as coupled may be directly electrically or mechanically coupled, or they may be indirectly coupled via one or more intermediate components, unless otherwise specifically stated. Mathematical and geometric terms are not necessarily intended to be used according to their strict definitions unless otherwise stated in the context of the specification, as those skilled in the art will understand that, for example, substantially similar elements operating in substantially similar ways may readily fall within the scope of descriptive terms, even if such terms also have strict definitions.

[0055] Cold plate: As used herein, "cold plate" refers to a device that receives heat from a solid via conduction (contact) and dissipates that heat into a liquid coolant in a liquid cooling circuit.

[0056] Thermal coupling: As used herein, “thermally coupled” means that there is a thermally conductive path between two objects that allows heat to be conducted between them. Two objects are considered thermally coupled if any of the following are true: (1) the two objects are in contact with each other (either directly or via a TIM), (2) both objects are thermally coupled to a thermally conductive intermediate (e.g., heat pipes, heat spreaders, etc.) (or to a series of thermally coupled intermediates), or (3) the thermal transfer coefficient between the two objects is 10 W·m. -2 ·K -1 Or larger.

[0057] Thermal conduction: An object, device, or component (which may include multiple thermally coupled different bodies and may include a variety of different materials) “conducts heat” between two thermal interfaces if any of the following is true: (1) the heat transfer coefficient between the thermal interfaces is 10 W·m at any temperature between 0°C and 100°C. -2 ·K -1 Or greater, (2) the object is a continuous material with a thermal conductivity (usually expressed as k, λ or κ) of 1 W·m between the two interfaces at any temperature between 0°C and 100°C. -1 ·K -1 Or larger, (3) the object is a heat pipe, a vapor chamber, a continuous copper body, or a continuous aluminum body. Thermal conductivity greater than 1 W·m between 0°C and 100°C. -1 ·K -1Examples of materials include almost all metals and their alloys (e.g., copper, aluminum, gold, etc.), and some plastics (e.g., TC compounds, D-series thermally conductive plastics), as well as many other materials.

[0058] High thermal conductivity: An object, device, or component (which may include multiple thermally coupled different bodies and may include a variety of different materials) is “highly thermally conductive” between two thermal interfaces if any of the following are true: (1) The heat transfer coefficient between the thermal interfaces is 1000 W·m at any temperature between 0°C and 100°C. -2 ·K -1 Or larger, (2) the object is a continuous material with a thermal conductivity (usually expressed as k, λ or κ) of 100 W·m between the two interfaces at any temperature between 0°C and 100°C. -1 ·K -1 Or larger, (3) the object is a heat pipe, a vapor chamber, a continuous copper body, or a continuous aluminum body. The thermal conductivity is 100 W·m between 0°C and 100°C. -1 ·K -1 Examples of materials that are either copper, aluminum, silver, or gold include certain types of copper.

[0059] Longitudinal: As used herein, longitudinal refers to the direction parallel to the folded fin, that is, parallel to the maximum extent direction of each individual folded fin (and also parallel to the groove defined by the folded fin). Therefore, the longitudinal dimension of a folded fin structure is its dimension parallel to the extent direction of each individual folded fin, and it may be, but is not necessarily, the longest dimension of the entire folded fin structure.

[0060] Lateral: As used in this article, lateral refers to the direction perpendicular to the longitudinal and height dimensions of the folded fin, where the height dimension is the second largest dimension of the folded fin.

[0061] Provided: As used herein, “provided” means to own and / or control an item. This may include, for example, forming (or assembling) some or all of the items from their constituent materials and / or obtaining ownership and / or control over the items that have already been formed.

[0062] And / or: Occasionally, the phrase “and / or” is used in conjunction with a list of items in this article. This phrase means that any combination of items in the list can be included—from a single item to all items, and any permutation in between. Thus, for example, “A, B and / or C” means “one of {A}, {B}, {C}, {A, B}, {A, C}, {C, B}, and {A, C, B}.”

[0063] Components and related aspects described in detail with reference to an example may be included in other examples where they are not specifically shown or described, provided that it is practicable. For example, if a component is described in detail with reference to an example, but the component is not described with reference to a second example, the component may still be required to be included in the second example.

[0064] Unless otherwise stated herein or implied by the context, the use of approximate terms such as “substantially,” “approximately,” “about,” “around,” “probably,” etc., should be understood as meaning that mathematical precision is not required, but rather refers to a range of variation including, but not strictly limited to, the stated value, attribute, or relationship. In particular, apart from any range explicitly stated herein (if any), the range of variation implied by the use of such approximate terms includes at least any insignificant variations, as well as those variations that are typical of the type of article in the relevant art due to manufacturing or other tolerances. In any case, unless otherwise stated, the range of variation may include values ​​within ±1% of the stated value, attribute, or relationship.

[0065] Given the disclosure herein, further modifications and alternative examples will be apparent to those skilled in the art. For example, apparatus and methods may include additional components or steps that are omitted in the illustrations and description for clarity of operation. Accordingly, this specification should be construed as illustrative only and intended to teach those skilled in the art the general manner of performing this teaching. It should be understood that the various examples shown and described herein should be considered exemplary. Elements and materials, and arrangements of such elements and materials, may be substituted for those illustrated and described herein, and their arrangements may be reversed; parts and processes may be reversed; and certain features of this teaching may be used independently, all of which will be apparent to those skilled in the art upon receiving the benefits described herein. Changes may be made to the elements described herein without departing from the scope of this teaching and the appended claims.

[0066] It should be understood that the specific examples presented herein are non-limiting, and modifications can be made to the structure, dimensions, materials, and methods without departing from the scope of this teaching.

[0067] Considering the specification and practice of the invention disclosed herein, other examples based on this disclosure will be apparent to those skilled in the art. The specification and examples are intended to be illustrative only, and the appended claims enjoy their fullest extent, including equivalents, in accordance with applicable law.

Claims

1. A heat dissipation device, comprising: A steam chamber apparatus, the steam chamber apparatus comprising: Base, and A folded fin structure coupled to the base, the base and the folded fin structure defining a vapor chamber for receiving a wicking element and working fluid; A cover, coupled to the vapor chamber assembly, the cover and the vapor chamber assembly defining a liquid chamber configured to receive a liquid coolant; and Multiple turbulence generators are disposed in the liquid chamber, wherein the turbulence generators include a first subgroup of turbulence generators having a first length and a second subgroup of turbulence generators having a second length, the second length being different from the first length; The folded fin structure includes a plurality of folded fins, wherein the plurality of folded fins define a first plurality of grooves on a first side of the folded fin structure and a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves are portions of the steam chamber. Wherein, the second plurality of grooves are part of the liquid chamber, and In each of the plurality of second grooves, the turbulence generators of the first subgroup and the turbulence generators of the second subgroup alternate along the length of the corresponding groove.

2. The heat dissipation device as described in claim 1, in, Each of the plurality of folded fins includes a pair of sidewalls and a first end portion coupling the sidewalls together. Wherein, adjacent folded fins among the plurality of folded fins are coupled together via a second end portion, and The sidewalls, the first end portion, and the second end portion of the plurality of folded fins are exposed to the vapor chamber and the liquid chamber.

3. The heat dissipation device as described in claim 1, wherein, The plurality of turbulence generators include blades that are coupled to the cover and extend into the second plurality of recesses.

4. The heat dissipation device as described in claim 1, in, The base includes a planar portion and a joining portion coupled to and extending perpendicularly from the planar portion, the joining portion defining a lateral boundary of the vapor chamber. The planar portion includes a middle portion and an outer portion, wherein the middle portion is thinner than the outer portion. The wicking element includes a rigid body that contacts the intermediate portion and the plurality of folded fins.

5. The heat dissipation device as described in claim 1, in, The wicking member includes a central region, a plurality of first wicking segments extending radially from the central region, and a plurality of second wicking segments extending parallel to the plurality of folded fins from the plurality of first wicking segments.

6. The heat dissipation device as described in claim 1, in, The base includes a planar portion, the planar portion comprising a central portion forming the bottom boundary of the vapor chamber and an outer flange portion surrounding the central portion and located outside the vapor chamber. The cover includes a flange configured to oppose the outer flange portion of the base; and The heat dissipation device further includes a gasket disposed between the flange of the cover and the outer flange portion of the base.

7. A heat dissipation system, comprising: Electronic circuits; The heat dissipation device as described in claim 1, wherein the base is thermally coupled to the electronic circuit; as well as A liquid cooling circuit is fluidly coupled to the cover and configured to supply a liquid flow through the liquid chamber.

8. The heat dissipation system as described in claim 7, in, The cover includes an inlet opening and an outlet opening, which are communicatively connected to the liquid chamber. The liquid cooling circuit includes a supply line coupled to the inlet opening and a return line coupled to the outlet opening.

9. The heat dissipation system as described in claim 8, in, The liquid cooling circuit further includes a pump configured to cause the liquid flow from the supply line through the liquid chamber to the return line.

10. The heat dissipation system as described in claim 9, in, The liquid chamber is configured such that, when the liquid flow is supplied through the liquid chamber, the pressure drop of the liquid flow between the supply line and the return line is less than or equal to 1 psi.

11. The heat dissipation system as described in claim 7, in, The heat dissipation device has a thermal resistance of 0.01C / W or less.

12. A heat dissipation method, comprising: Provide the heat dissipation device as described in claim 1; The base of the steam chamber device is thermally coupled to the electronic circuit. as well as The liquid is allowed to flow through the liquid chamber.

13. A heat dissipation device, comprising: A steam chamber apparatus, the steam chamber apparatus comprising: Base A folded fin structure, coupled to the base, the base and the folded fin structure defining a vapor chamber, and A wicking structure, disposed within the vapor chamber, comprising a wicking material physically different from the base; and A cover, coupled to the vapor chamber device, the cover and the vapor chamber device defining a liquid chamber configured to contain liquid; The folded fin structure includes a first corrugated surface and a second corrugated surface opposite to the first corrugated surface. The first corrugated surface defines a first plurality of grooves, and the second corrugated surface defines a second plurality of grooves. The first corrugated surface and the second corrugated surface define a plurality of folded fins extending along a first direction. The first corrugated surface is exposed to the vapor chamber. The second corrugated surface is exposed to the liquid chamber, and The wicking structure includes: a central region; a plurality of first wicking segments formed of the wicking material and extending radially from the central region; a plurality of first channels defined between the first wicking segments; a plurality of second wicking segments formed of the wicking material and extending parallel to the first wicking segments from the plurality of first wicking segments; and a plurality of second channels defined between the second wicking segments. Wherein, at least some of the plurality of folded fins extend into at least some of the second channels, such that for at least some of the plurality of first wicking sections, the corresponding first wicking section is disposed within the corresponding first groove of the plurality of grooves.

14. The heat dissipation device as described in claim 13, in, The plurality of folded fins include raised sections in the region above the plurality of first wicking sections, wherein, within the raised sections, the bottom portion of each of the folded fins is raised relative to the outside of the raised section.

15. The heat dissipation device as described in claim 13, further comprising: An adjustment plate disposed above the plurality of first wicking sections, the adjustment plate including slits respectively aligned with the plurality of first grooves, the slits being configured to regulate the flow of vapor into the plurality of first grooves.

16. The heat dissipation device as described in claim 15, in, The length of each slit increases as the distance of each slit from the central region increases.

17. A heat dissipation device, comprising: A steam chamber apparatus, the steam chamber apparatus comprising: A base, the base including a planar portion and a joining portion coupled to and extending perpendicularly from the planar portion, wherein the planar portion includes a middle portion and an outer portion, and A folded fin structure, wherein the folded fin structure is coupled to the joint portion of the base. The base and the folded fin structure define a vapor chamber for receiving a wicking element and working fluid, wherein the intermediate portion defines the bottom boundary of the vapor chamber, the joining portion defines the lateral boundary of the vapor chamber, and the folded fin structure defines the top boundary of the vapor chamber; and A cover, coupled to the vapor chamber device, the cover and the vapor chamber device defining a liquid chamber configured to receive liquid coolant; The folded fin structure includes a plurality of folded fins, wherein the plurality of folded fins define a first plurality of grooves on a first side of the folded fin structure and a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves are portions of the steam chamber. Wherein, the second plurality of grooves are part of the liquid chamber, and The middle portion is thinner than the outer portion.

18. The heat dissipation device as described in claim 17, in, The wicking element includes a rigid body that contacts the intermediate portion and the plurality of folded fins.

19. The heat dissipation device as described in claim 17, in, The cover includes a flange configured to oppose the outer portion of the base; and The heat dissipation device further includes a gasket disposed between the flange of the cover and the outer flange portion of the base.

20. The heat dissipation device as described in claim 17, in, The joining portion is coupled to the planar portion at a position between the outer portion and the middle portion.

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