A silicon wafer transfer device

Abstract

The present invention discloses a silicon wafer transfer device for transferring silicon wafer units. The silicon wafer unit includes a crystal carrier and a silicon wafer. The silicon wafer is divided into multiple silicon wafer groups. The transfer device includes a material frame and a transfer trolley. The material frame includes a clamping assembly and an unlocking trigger part. The clamping assembly includes a movable plate, and a plurality of clamping parts arranged at intervals are provided on the movable plate. The plurality of clamping parts correspond to the plurality of silicon wafer groups one by one to clamp the corresponding silicon wafer groups. Each clamping part moves away from the silicon wafer to release the clamping of the corresponding silicon wafer group. An unlocking part is provided on the transfer trolley. Under the action of the unlocking trigger part, the movable plate moves away from the containing space, and the movable plate drives the plurality of clamping parts arranged thereon to move synchronously. The unlocking device applies an external force to the clamping part to make the clamping part away from the corresponding silicon wafer group after the material frame is separated from the transfer trolley. This device can improve the placement reliability of the silicon wafer during the transfer process, realize the independent release of clamping for each silicon wafer group, and avoid damage to the silicon wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic technology, and particularly to a silicon wafer transfer device. Background Art

[0002] In the production process of silicon wafers, first, a silicon rod is cut into silicon wafers by a wire cutting machine. At this time, the silicon wafers are pasted on a crystal carrier by a resin plate. To realize the automatic degumming of the silicon wafers after wire cutting, it is necessary to transport the crystal carrier and the silicon wafers on the crystal carrier to a degumming machine for degumming so that the silicon wafers are separated from the crystal carrier. Subsequently, the separated silicon wafers are transported into a wafer inserter for slicing and inserting.

[0003] In the process of transferring silicon wafers, a material box is used, and the material box carries the crystal carrier and silicon wafers to transfer between different workstations. In the prior art, the material box clamps and limits the silicon wafers as a whole. When inserting wafers, it is necessary to release the limit of the silicon wafers as a whole, and it is impossible to realize the individual unlocking and loading of each unit silicon wafer. Since all the silicon wafers are released from the limit when inserting wafers, the uninserted silicon wafers are prone to tilt and squeeze, resulting in fragmentation or hidden cracks of the silicon wafers, seriously damaging the quality of the silicon wafers.

[0004] The above information disclosed in this background art is only used to increase the understanding of the background art of the present application. Therefore, it may include prior art that is not known to those of ordinary skill in the art. Summary of the Invention

[0005] In view of the problems pointed out in the background art, the present invention proposes a silicon wafer transfer device. Through the cooperation structure between the transfer trolley and the material box, the clamping mechanism of the material box is triggered. On the one hand, when the material box cooperates with the transfer trolley, the clamping mechanism is in an unlocked state to facilitate the placement of the silicon wafers into the material box. On the other hand, when the material box is separated from the transfer trolley, the clamping mechanism automatically clamps the silicon wafers as a whole, improving the placement reliability of the silicon wafers during the transfer process. When loading, through the unlocking device, the material box can also independently release the clamping of each unit silicon wafer, thereby avoiding damage to the silicon wafers, reducing manual intervention, and improving the operation efficiency.

[0006] To achieve the above invention purpose, the present invention is implemented by adopting the following technical solutions:

[0007] The present invention provides a silicon wafer transfer device for transferring silicon wafer units. The silicon wafer units include a crystal carrier and multiple silicon wafers to be separated and pasted on the crystal carrier. The multiple silicon wafers are divided into multiple silicon wafer groups. The transfer device includes:

[0008] A material box, which forms a loading space for containing the silicon wafer units. The top of the loading space is open for the silicon wafer units to be loaded into the loading space from top to bottom. One end of the material box is provided with a discharge port communicating with the loading space. The material box is provided with:

[0009] A clamping assembly having two parts located on opposite sides of the loading space. The clamping assembly includes a movable plate extending along the length direction of the loading space. A plurality of clamping parts are arranged in sequence along the length direction of the movable plate, and the plurality of clamping parts correspond to the plurality of silicon wafer groups one by one to clamp the corresponding silicon wafer groups. Each clamping part moves away from the silicon wafers to release the clamping of the corresponding silicon wafer group.

[0010] An unlocking trigger part, and each movable plate is configured with a corresponding unlocking trigger part.

[0011] A transfer cart for carrying the material frame. An unlocking part is provided on the transfer cart. After the material frame is placed on the transfer cart, the unlocking part triggers the unlocking trigger part to act. Under the action of the unlocking trigger part, the movable plate moves away from the loading space, and the movable plate drives a plurality of clamping parts provided thereon to synchronously move away from the loading space.

[0012] An unlocking device is provided beside the clamping part. The unlocking device is used to apply an external force to the clamping part to make the clamping part away from the corresponding silicon wafer group after the material frame is detached from the transfer cart.

[0013] In some embodiments, when transporting the cut silicon wafer units, first place the material frame on the transfer cart. The unlocking part triggers the unlocking trigger part to act. All the clamping parts synchronously move away from the loading space under the drive of the movable plate, facilitating the silicon wafer units to be loaded into the loading space from top to bottom.

[0014] When the transfer cart transports the material frame to the next working station, take the material frame off the transfer cart. The unlocking part is separated from the unlocking trigger part, and the clamping part moves towards the silicon wafers under the action of the resetting part to clamp the silicon wafer units.

[0015] In some embodiments, when it is necessary to slice the silicon wafers in the material frame in units of the silicon wafer groups, relative movement occurs between the material frame and the unlocking device. A plurality of clamping parts sequentially contact the unlocking device along with the relative movement between the material frame and the unlocking device, and the unlocking device applies an external force to the clamping part to make the clamping part away from the corresponding silicon wafer group.

[0016] In some embodiments, the material frame includes two relatively arranged transverse frames extending along the length direction of the loading space. The movable plate is located outside the transverse frames, and the clamping part passes through the transverse frames and the movable plate.

[0017] The unlocking trigger part includes a first pin shaft, the first pin shaft passes through the transverse frame, a first end of the first pin shaft is fixedly connected to the movable plate, and a second end of the first pin shaft is used to contact the unlocking part, so that the first pin shaft moves along its penetrating direction in the transverse frame to drive the movable plate to move synchronously in a direction away from the containing space.

[0018] In some embodiments, a roller is provided at the second end of the first pin shaft, the unlocking part is a column provided on the transfer trolley, a guiding contact surface is provided at an upper end of the column on a side facing the roller, and when the material box is placed on the transfer trolley from top to bottom, the roller moves from top to bottom along the guiding contact surface to drive the first pin shaft to move in a direction away from the containing space.

[0019] In some embodiments, the guiding contact surface includes a first contact surface section, a second contact surface section, and a third contact surface section from top to bottom, the second contact surface section extends in the vertical direction, the first contact surface section extends obliquely away from the roller from the top of the second contact surface section, and the third contact surface section extends obliquely towards the roller from the bottom of the second contact surface section.

[0020] In some embodiments, the clamping part includes a second pin shaft, the second pin shaft passes through the transverse frame and the movable plate, an unlocking block is provided at a first end of the second pin shaft, a clamping block is provided at a second end of the second pin shaft, and a spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the transverse frame;

[0021] When the movable plate moves in a direction away from the containing space, the movable plate pushes all the unlocking blocks to move synchronously in a direction away from the containing space, so that all the clamping blocks move away from the containing space;

[0022] The clamping block moves towards the silicon wafer in the restoring force of the spring to clamp the corresponding silicon wafer group.

[0023] In some embodiments, the unlocking block includes a transverse part and a vertical part, the transverse part is used to abut against the movable plate, and the vertical part is used to act with the unlocking device;

[0024] There is a certain distance between the vertical part and the movable plate, and an inclined surface is provided on a side of the vertical part facing the movable plate. Along the discharging direction of the silicon wafer, the distance between the inclined surface and the movable plate first decreases and then increases;

[0025] The unlocking device includes a first roller. When a relative movement occurs between the material frame and the unlocking device, the first roller moves between the inclined surface and the movable plate and contacts the inclined surface, and the second pin shaft moves away from the silicon wafer through the relative displacement between the first roller and the inclined surface.

[0026] In some embodiments, the material frame further includes an anti-tipping component for abutting and supporting the silicon wafer.

[0027] The anti-tipping component includes a mounting frame and a second roller provided on the mounting frame. The mounting frame is provided on the material frame, and the second roller is used to abut against the silicon wafer.

[0028] In some embodiments, a limiting portion is provided on the transfer trolley. The limiting portion is a limiting protrusion arranged on the periphery of the material frame, and the limiting portion is used to limit the material frame.

[0029] Compared with the prior art, the advantages and positive effects of the present invention are:

[0030] The transfer device disclosed in the present application triggers the clamping mechanism on the material frame through the cooperation structure between the transfer trolley and the material frame. On the one hand, when the material frame cooperates with the transfer trolley, the clamping mechanism is in an unlocked state to facilitate the placement of the silicon wafer into the material frame. On the other hand, when the material frame is separated from the transfer trolley, the clamping mechanism automatically clamps the whole silicon wafer, improving the placement reliability of the silicon wafer during the transfer process and also facilitating the subsequent debonding and separation of the crystal carrier and the silicon wafer. When the silicon wafers are loaded piece by piece, through the unlocking device, the material frame can independently release the clamping of each silicon wafer group, thereby avoiding damage to the silicon wafers, reducing manual intervention, and improving the operation efficiency.

[0031] After reading the specific embodiments of the present invention in conjunction with the drawings, other features and advantages of the present invention will become clearer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0033] Figure 1 FIG. 1 is a schematic structural diagram of a material frame and a transfer trolley according to an embodiment;

[0034] Figure 2 FIG. 2 is a schematic structural diagram of a material frame and a transfer trolley according to an embodiment;

[0035] Figure 3 is Figure 2 the enlarged view of part A in

[0036] Figure 4 the structural schematic diagram of the material frame and the silicon wafer unit according to the embodiment;

[0037] Figure 5 the structural schematic diagram of the upper frame according to the embodiment;

[0038] Figure 6 the structural schematic diagram of the lower frame according to the embodiment;

[0039] Figure 7 the structural schematic diagram of the clamping assembly and the lower frame according to the embodiment;

[0040] Figure 8 the structural schematic diagram of the clamping assembly according to the embodiment;

[0041] Figure 9 is Figure 8 the sectional view taken along the A-A direction in

[0042] Figure 10 is Figure 8 the sectional view taken along the B-B direction in

[0043] Figure 11 the structural schematic diagram of the clamping part according to the embodiment;

[0044] Figure 12 is Figure 4 the enlarged view of part B in

[0045] Figure 13 the structural schematic diagram of the unlocking device according to the embodiment;

[0046] Figure 14 the structural schematic diagram of the anti-tipping assembly according to the embodiment;

[0047] Figure 15 the structural schematic diagram of the transfer trolley according to the embodiment;

[0048] Figure 16 the sectional view of the transfer trolley according to the embodiment;

[0049] Figure 17 the structural schematic diagram of the silicon wafer unit according to the embodiment;

[0050] Reference numerals:

[0051] 100, silicon wafer unit; 110, crystal carrier; 111, extension part; 120, silicon wafer; 121, silicon wafer group;

[0052] 200, material frame;

[0053] 210. Frame; 211. Upper frame; 2111. First support of the upper frame; 2112. Second support of the upper frame; 2113. Opening; 2114. Support frame; 2115. Protrusion; 2116. Upper limit block; 2117. Upper grasping part; 212. Lower frame; 2121. First support of the lower frame; 2122. Second support of the lower frame; 2123. Transverse frame of the lower frame; 2124. Vertical frame of the lower frame; 2125. Transverse frame; 2126. Lower limit block; 2127. Lower grasping part; 213. Loading space; 214. Discharge port; 215. Support roller;

[0054] 220. Clamping assembly; 221. Movable plate; 222. Clamping part; 2221. Second pin shaft; 2222. Clamping block; 2223. Unlocking block; 2224. Second long through hole; 2225. Transverse part; 2226. Vertical part; 2227. Inclined surface; 2228. Step part; 2229. Spring; 223. Second limit shaft;

[0055] 230. Unlocking trigger part; 231. First pin shaft; 232. Third roller; 233. First limit shaft; 234. First long through hole;

[0056] 240. Anti-tipping assembly; 241. Second mounting bracket; 2411. Fixed bracket; 2412. Movable bracket; 2413. Torsion spring; 242. Second roller;

[0057] 300. Unlocking device; 310. First mounting bracket; 320. First roller;

[0058] 400. Transfer cart; 410. Unlocking part; 411. Guiding contact surface; 4111. First section of the contact surface; 4112. Second section of the contact surface; 4113. Third section of the contact surface; 420. Limiting part; 430. Liquid collecting tank; 440. Drain port; 450. Drain valve; 460. Positioning part;

[0059] L. Length direction of the material frame;

[0060] W. Width direction of the material frame. Detailed implementation manners

[0061] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0062] This embodiment discloses a silicon wafer transfer device for transferring the silicon wafer unit 100 and transferring the silicon wafer unit 100 between different working stations.

[0063] The silicon wafer unit 100 is as Figure 17 shown, including a crystal carrier 110 and multiple silicon wafers 120 to be separated and pasted on the crystal carrier 110. The multiple silicon wafers 120 are divided into multiple silicon wafer groups 121. Figure 17 In the figure, adjacent two silicon wafer groups 121 are separated by a dashed line.

[0064] During the production and processing of silicon wafers, first, a silicon rod is cut into silicon wafers 120 by a cutting device. At this time, the silicon wafers 120 are pasted on the crystal carrier 110 through a resin plate. After cutting is completed, the crystal carrier 110 together with the silicon wafers 120 is loaded into a transfer device, and the transfer device transports the silicon wafer unit 100 to a degumming station to separate the crystal carrier 110 from the silicon wafers 120. Then, the separated silicon wafers 120 are transported to an inserting station by the transfer device for inserting, and after inserting, the silicon wafers 120 are cleaned.

[0065] Referring to Figure 1 and Figure 2 , the silicon wafer transfer device in this embodiment includes a material frame 200 and a transfer trolley 400. First, the material frame 200 is placed on the transfer trolley 400, and then the cut silicon wafer unit 100 is placed into the material frame 200, and the transfer trolley 400 transports the material frame 200 to the next station.

[0066] The structure of the transfer trolley 400 refers to Figure 15 and Figure 16 , and the transfer trolley 400 has functions such as storing, limiting, and transporting the material frame 200.

[0067] The structure of the material frame 200 refers to Figures 4 to 8 . The material frame 200 has functions such as storing, clamping, unlocking clamping, and protecting the silicon wafers 120 for the silicon wafer unit 100.

[0068] A containing space 213 for containing the silicon wafer unit 100 is formed inside the material frame 200. The top of the containing space 213 is open to allow the silicon wafer unit 100 to be loaded into the containing space 213 from top to bottom. One end of the material frame 200 is provided with a discharge port 214 communicating with the containing space 213. In subsequent operation processes, the degummed silicon wafers 120 go out from the discharge port 214.

[0069] The material frame 200 includes a frame 210, a clamping assembly 220, an unlocking trigger part 230, etc. The frame 210 serves as the installation carrier for components such as the clamping assembly 220 and the unlocking trigger part 230, and at the same time, the frame 210 encloses the containing space 213 for holding the silicon wafer unit 100.

[0070] The clamping assembly 220 is used to clamp the wafer unit 100. On the one hand, the clamping assembly 220 can clamp the entire wafer unit 100 simultaneously; on the other hand, the clamping assembly 220 can independently unlock each wafer group 121.

[0071] There are two clamping assemblies 220, located on opposite sides of the storage space 213 to clamp opposite sides of the wafer unit 100.

[0072] The clamping assembly 220 includes a movable plate 221. The movable plate 221 extends along the length direction of the storage space 213 (i.e., the length direction L of the cassette 200). A plurality of clamping portions 222 are arranged in sequence along the length direction of the movable plate 221. The plurality of clamping portions 222 correspond one-to-one to the plurality of wafer groups 121 to clamp the corresponding wafer groups 121. Each clamping portion 222 moves away from the wafer 120 to release the clamping of the corresponding wafer group 121.

[0073] That is to say, each wafer group 121 is clamped by the corresponding clamping portion 222. When all the clamping portions 222 clamp the corresponding wafer groups 121, the entire wafer unit 100 is clamped. When it is necessary to load the wafer unit 100 in pieces with the wafer groups 121 as units, the clamping portions 222 release the clamping of the corresponding wafer groups 121. When the unlocked wafer groups 121 are loaded in pieces, the remaining wafer groups 121 are still clamped by the corresponding clamping portions 222. In this way, the placement stability of the remaining unloaded wafer groups 121 in the cassette 200 can be ensured, preventing the wafers 120 from toppling or squeezing against each other, avoiding breakage of the wafers 120, and ensuring the quality of the wafers 120.

[0074] The transfer cart 400 is provided with an unlocking portion 410, and the unlocking portion 410 is used to interact with the unlocking trigger portion 230 on the cassette 200. Specifically, after the cassette 200 is placed on the transfer cart 400, the unlocking portion 410 contacts the unlocking trigger portion 230, and the unlocking portion 410 triggers the unlocking trigger portion 230 to act. The movable plate 221 moves away from the storage space 213 under the action of the unlocking trigger portion 230, and the movable plate 221 drives the plurality of clamping portions 222 provided thereon to move away from the storage space 213 synchronously.

[0075] In application, before placing the wafer unit 100 into the cassette 200, the cassette 200 is first placed on the transfer cart 400. At this time, the unlocking portion 410 contacts the unlocking trigger portion 230, and the effect is that the movable plate 221 moves away from the storage space 213 under the action of the unlocking trigger portion 230. The movable plate 221 drives the plurality of clamping portions 222 provided thereon to move away from the storage space 213 synchronously, that is, the distance between the two opposite clamping assemblies 220 increases. In this way, it is convenient for the wafer unit 100 to be loaded into the storage space 213 from top to bottom.

[0076] The material frame 200 is provided with a limiting structure for limiting the crystal carrier 110. By limiting the crystal carrier 110 with the material frame 200, the placement stability of the silicon wafer unit 100 in the material frame 200 is ensured, and the silicon wafer 120 is prevented from tipping or shifting.

[0077] After the silicon wafer unit 100 is placed in the material frame 200, the transfer cart 400 transfers the material frame 200 to the next working station, specifically the debonding station. After arriving at the debonding station, the material frame 200 is removed from the transfer cart 400 by a manipulator or other equipment. At this time, the unlocking part 410 is separated from the unlocking trigger part 230, and the clamping assembly 220 automatically moves towards the direction close to the silicon wafer unit 100 under the restoring force of the restoring part, and clamps the silicon wafer unit 100. After the silicon wafer unit 100 is clamped, it is convenient for the silicon wafer unit 100 to be debonded at the debonding station. At this time, the silicon wafer 120 is clamped by the clamping assembly 220, which is convenient for the crystal carrier 110 to be smoothly separated from the silicon wafer 120.

[0078] After the silicon wafer unit 100 is debonded, it is transferred to the next working station by the material frame 200, specifically the dicing and loading station, that is, the silicon wafer 120 is diced in units of the silicon wafer group 121. The diced silicon wafers 120 are convenient for subsequent inserting operations. When dicing the silicon wafers 120 in units of the silicon wafer group 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is diced and loaded, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. In this process, through the interaction between the unlocking device 300 and the clamping part 222, the unlocking of the clamping part 222 to the silicon wafer group 121 is realized.

[0079] The unlocking device 300 is arranged beside the clamping part 222. The unlocking device 300 is used to apply an external force to the clamping part 222 after the material frame 200 is separated from the transfer cart 400, so that the clamping part 222 moves away from the corresponding silicon wafer group 121, that is, releases the clamping of the silicon wafer group 121.

[0080] According to the silicon wafer production process, the usage method of the silicon wafer transfer device in this embodiment is as follows:

[0081] When transferring the cut silicon wafer unit 100, first place the material frame 200 on the transfer cart 400. The unlocking part 410 contacts the unlocking trigger part 230, and the unlocking part 410 triggers the unlocking trigger part 230 to act. All the clamping parts 222 synchronously move away from the receiving space 213 under the drive of the movable plate 221, which is convenient for the silicon wafer unit 100 to be loaded into the receiving space 213 from top to bottom. At this time, the clamping assembly 220 does not clamp the silicon wafer 120;

[0082] The material frame 200 is provided with a limiting structure for limiting the crystal carrier 110, ensuring the stable placement of the silicon wafer unit 100 in the material frame 200;

[0083] After the transfer trolley 400 transfers the material frame 200 to the next working station, the material frame 200 is removed from the transfer trolley 400, the unlocking part 410 is separated from the unlocking trigger part 230, and all the clamping parts 222 move towards the direction close to the silicon wafer unit 100 under the action of the reset part to clamp the silicon wafer 120, facilitating the debonding separation of the crystal carrier 110 and the silicon wafer 120;

[0084] The material frame 200 transfers the silicon wafer 120 to the next working station, and the silicon wafers 120 in the material frame 200 are sliced in units of the silicon wafer group 121. At this time, a relative movement is generated between the material frame 200 and the unlocking device 300, and the multiple clamping parts 222 sequentially contact the unlocking device 300 along with the relative movement between the material frame 200 and the unlocking device 300. The unlocking device 300 applies an external force to the clamping parts 222 to make the clamping parts 222 move away from the corresponding silicon wafer group 121 and release the clamping of the silicon wafer group 121.

[0085] In this embodiment of the transfer device, through the cooperation structure between the transfer trolley 400 and the material frame 200, the clamping mechanism on the material frame 200 is triggered. On the one hand, when the material frame 200 cooperates with the transfer trolley 400, the clamping mechanism is in the unlocked state to facilitate the placement of the silicon wafer 120 into the material frame 200. On the other hand, when the material frame 200 is separated from the transfer trolley 400, the clamping mechanism automatically clamps the whole silicon wafer 120, improving the placement reliability of the silicon wafer 120 during the transfer process and also facilitating the subsequent debonding separation of the crystal carrier 110 and the silicon wafer 120. When the silicon wafers 120 are sliced and loaded, through the unlocking device 300, the material frame 200 can also independently release the clamping of each silicon wafer group 121, thereby avoiding damage to the silicon wafers 120, reducing manual intervention, and improving the operation efficiency.

[0086] In some embodiments, referring to Figure 6 and Figure 9 the material frame 200 includes two relatively arranged transverse frames 2125, the transverse frames 2125 extend along the length direction of the containing space 213, the movable plate 221 is located outside the transverse frames 2125, and the clamping parts 222 pass through the transverse frames 2125 and the movable plate 221.

[0087] The unlocking trigger part 230 includes a first pin shaft 231. The first pin shaft 231 passes through the transverse frame 2125. The first end of the first pin shaft 231 is fixedly connected to the movable plate 221. The second end of the first pin shaft 231 is used to contact the unlocking part 410, so that the first pin shaft 231 moves along its penetrating direction in the transverse frame 2125, driving the movable plate 221 to move synchronously away from the containing space 213. The movable plate 221 then drives all the clamping parts 222 to move synchronously away from the containing space 213. In this way, the distance between the two relatively arranged clamping assemblies 220 increases, facilitating the wafer unit 100 to be placed into the material frame 200 from top to bottom.

[0088] Further, a roller (denoted as the third roller 232) is provided at the second end of the first pin shaft 231. Referring to Figure 3 , Figure 15 and Figure 16 , the unlocking part 410 is a column provided on the transfer trolley 400. A guiding contact surface 411 is provided at the upper end of the column on the side facing the third roller 232. When the material frame 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 moves from top to bottom along the guiding contact surface 411, driving the first pin shaft 231 to move away from the containing space 213. Since the first pin shaft 231 is fixedly connected to the movable plate 221, it also drives the movable plate 221 to move synchronously away from the containing space 213.

[0089] Further, referring to Figure 16 , the guiding contact surface 411 includes a contact surface section 4111, a contact surface section 4112, and a contact surface section 4113 from top to bottom. The contact surface section 4112 extends in the vertical direction. The contact surface section 4111 extends obliquely away from the third roller 232 from the top of the contact surface section 4112. The contact surface section 4113 extends obliquely towards the third roller 232 from the bottom of the contact surface section 4112.

[0090] When the material frame 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 first contacts the contact surface section 4111. The inclined contact surface section 4111 plays a preliminary positioning role for the placement of the material frame 200. As the material frame 200 continues to be lowered, during the movement of the third roller 232 along the inclined contact surface section 4111, the first pin shaft 231 is gradually pushed away from the containing space 213. After the third roller 232 moves onto the contact surface section 4112, the outward movement of the first pin shaft 231 stops. As the material frame 200 continues to be lowered, when the third roller 232 moves to the lower end of the contact surface section 4112, the contact surface section 4113 stops the movement of the third roller 232, and the material frame 200 is placed in place.

[0091] Further, each movable plate 221 is configured with two unlocking trigger portions 230, and the two unlocking trigger portions 230 are provided at opposite ends of the movable plate 221. That is, each material frame 200 is configured with four unlocking trigger portions 230. Correspondingly, four unlocking portions 410 are provided on the transfer trolley 400, as Figure 15 shown. The four unlocking portions 410, on the one hand, are used to contact the corresponding unlocking trigger portions 230, and on the other hand, play a role of guiding and pre-positioning the placement of the material frame 200.

[0092] Further, a first limiting shaft 233 is provided on the transverse frame 2125, a first long through hole 234 is provided on the first pin shaft 231, and the first limiting shaft 233 is inserted into the first long through hole 234 to prevent the first pin shaft 231 from rotating.

[0093] In some embodiments, referring to Figure 9 , the clamping portion 222 includes a second pin shaft 2221. The second pin shaft 2221 passes through the transverse frame 2125 and the movable plate 221. An unlocking block 2223 is provided at the first end of the second pin shaft 2221, a clamping block 2222 is provided at the second end of the second pin shaft 2221, and a spring 2229 is sleeved on the second pin shaft 2221. The spring 2229 is located between the clamping block 2222 and the transverse frame 2125.

[0094] When the movable plate 221 moves in a direction away from the containing space 213, the movable plate 221 pushes all the unlocking blocks 2223 to move synchronously in a direction away from the containing space 213, so that all the clamping blocks 2222 move away from the containing space 213. Specifically, a stepped portion 2228 is formed between the unlocking block 2223 and the second pin shaft 2221. When the movable plate 221 moves in a direction away from the containing space 213, the movable plate 221 abuts against the stepped portion 2228 to push the unlocking block 2223 to move synchronously. The unlocking block 2223 drives the second pin shaft 2221 and the clamping block 2222 to move synchronously in a direction away from the containing space 213, and the spring 2229 is compressed.

[0095] When the material frame 200 is removed from the transfer trolley 400, the unlocking portion 410 is separated from the unlocking trigger portion 230, and the abutting effect of the unlocking portion 410 on the third roller 232 disappears. At this time, the clamping block 2222 moves in a direction close to the silicon wafer 120 under the reset force of the spring 2229 to clamp the corresponding silicon wafer group 121.

[0096] Further, a second limiting shaft 223 is provided on the transverse frame 2125, a second long through hole 2224 is provided on the second pin shaft 2221, and the second limiting shaft 223 is inserted into the second long through hole 2224 to prevent the second pin shaft 2221 from rotating.

[0097] In some embodiments, the mating structure between the unlocking device 300 and the clamping part 222 is as follows. Refer to Figures 10 to 13 :

[0098] The unlocking block 2223 includes a transverse part 2225 and a vertical part 2226 which are of an integral structure. The transverse part 2225 is used to abut against the movable plate 221, and the vertical part 2226 is used to act with the unlocking device 300. Specifically, one end of the transverse part 2225 is connected to the second pin shaft 2221, a step part 2228 is formed between the transverse part 2225 and the second pin shaft 2221, and the other end of the transverse part 2225 is connected to the vertical part 2226.

[0099] There is a certain distance between the vertical part 2226 and the movable plate 221. An inclined surface 2227 is provided on the side of the vertical part 2226 facing the movable plate 221. Along the discharging direction of the silicon wafer 120, the distance between the inclined surface 2227 and the movable plate 221 first decreases and then increases.

[0100] The unlocking device 300 includes a first roller 320. When a relative movement occurs between the material frame 200 and the unlocking device 300, the first roller 320 moves between the inclined surface 2227 and the movable plate 221 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120.

[0101] Specifically, the unlocking device 300 is fixedly installed beside the material frame 200, and there is no connection relationship between the unlocking device 300 and the material frame 200. The unlocking device 300 can be fixedly installed on other installation carriers outside the material frame 200. Corresponding to two clamping assemblies 220 provided on the material frame 200, two unlocking devices 300 are also provided. Each unlocking device 300 is used to act with the clamping assembly 220 on the corresponding side. When the silicon wafers 120 in the material frame 200 need to be sliced in units of the silicon wafer group 121, the material frame 200 moves horizontally under an external force, and a relative movement occurs between the material frame 200 and the unlocking device 300. Along the movement direction of the material frame 200, each clamping part 222 contacts the unlocking device 300 one by one in sequence. The first roller 320 moves between the inclined surface 2227 and the movable plate 221 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120, driving the clamping block 2222 away from the silicon wafer 120, that is, releasing the clamping of the corresponding silicon wafer group 121, thereby facilitating the slicing operation of the unlocked silicon wafer group 121 by the device at the subsequent station.

[0102] Further, two inclined surfaces 2227 are provided on the vertical portion 2226, one of the inclined surfaces 2227 is located above the horizontal portion 2225, and the other inclined surface 2227 is located below the horizontal portion 2225. The unlocking device 300 further includes a first mounting bracket 310 having a U-shaped structure. First rollers 320 are respectively provided on the upper and lower walls of the first mounting bracket 310, and the first rollers 320 are in contact with the corresponding inclined surfaces 2227. In this way, the unlocking effect of the unlocking device 300 on the clamping portion 222 is improved, and the unlocking reliability is improved.

[0103] In some embodiments, referring to Figure 4 and Figure 14 , the material frame 200 further includes an anti-tipping assembly 240 for abutting and supporting the silicon wafers 120. The anti-tipping assembly 240 is provided at one end away from the discharge port 214. When the transfer cart 400 pushes the material frame 200 forward, the silicon wafers 120 tend to tip backward (i.e., in the direction opposite to the moving direction of the transfer cart 400). By the abutment of the anti-tipping assembly 240 and the silicon wafers 120, the silicon wafers 120 are prevented from tipping.

[0104] The anti-tipping assembly 240 includes a second mounting bracket 241 and second rollers 242 provided on the second mounting bracket 241. The second mounting bracket 241 is provided on the material frame 200, and the second rollers 242 are used to abut against the silicon wafers 120. A plurality of second rollers 242 are arranged at intervals in the vertical direction, for example, two, and have multiple contacts with the silicon wafers 120 in the vertical height direction, improving the anti-tipping reliability.

[0105] Further, the second mounting bracket 241 includes a fixed bracket 2411 and a movable bracket 2412. The fixed bracket 2411 is fixedly provided on the lower frame 212, the movable bracket 2412 is rotatably connected to the fixed bracket 2411, a torsion spring 2413 is provided between the movable bracket 2412 and the fixed bracket 2411, and the second rollers 242 are provided on the movable bracket 2412. By the rotation of the movable bracket 2412 relative to the fixed bracket 2411, the bumps generated during the transportation of the material frame 200 are adapted, and the second rollers 242 are prevented from hard squeezing the silicon wafers 120.

[0106] In some embodiments, referring to Figures 4 to 7 , the frame 210 of the material frame 200 includes an upper frame 211 and a lower frame 212, and the upper frame 211 and the lower frame 212 are detachably connected. Figure 5 As shown in Figure 6 is the upper frame 211, Figure 7 is the lower frame 212,

[0107] A receiving space 213 for receiving the silicon wafer 120 is formed within the lower frame 212. The top of the receiving space 213 is open, and a discharge port 214 communicating with the receiving space 213 is provided at one end of the lower frame 212.

[0108] The upper frame 211 is detachably disposed on the top of the lower frame 212. An opening 2113 vertically aligned and communicating with the receiving space 213 is provided on the upper frame 211. The silicon wafer unit 100 is loaded into the lower receiving space 213 through the opening 2113. A limiting structure for limiting the crystal carrier 110 is provided on the upper frame 211 to ensure the stable placement of the silicon wafer unit 100 within the material frame 200.

[0109] The upper frame 211 is moved away from the lower frame 212 to separate the crystal carrier 110 from the silicon wafer 120, and the silicon wafer 120 remains within the lower frame 212. Specifically, after removing the material frame 200 from the transfer cart 400, when debonding the silicon wafer unit 100 at the debonding station, the upper frame 211 is moved away from the lower frame 212 by means of a manipulator or other equipment. Since there is a limiting connection relationship between the upper frame 211 and the crystal carrier 110, and the lower silicon wafer 120 is clamped by the clamping assembly 220, when the upper frame 211 is moved away from the lower frame 212, the upper frame 211 drives the crystal carrier 110 to disengage from the silicon wafer 120 together, realizing the debonding separation of the crystal carrier 110 and the silicon wafer 120.

[0110] In this embodiment, through the upper and lower split structure of the material frame 200, combined with the clamping of the silicon wafer 120 by the clamping assembly 220 within the lower frame 212 and the limiting fixation of the crystal carrier 110 by the upper frame 211, by separating the upper frame 211 from the lower frame 212, the separation of the crystal carrier 110 and the silicon wafer 120 can be achieved, eliminating the need for a dedicated debonding device.

[0111] Therefore, the material frame 200 in this embodiment integrates the functions of storing, clamping and positioning, transporting, and debonding the silicon wafers.

[0112] Further, referring to Figure 4 、 Figure 5 and Figure 17 , extension portions 111 are respectively provided at the front and rear ends of the crystal carrier 110 unit. Two spaced-apart protruding portions 2115 are provided on the upper frame 211 at the corresponding sides. The extension portions 111 are clamped between the two protruding portions 2115 to realize the limiting fixation of the crystal carrier 110.

[0113] Further, the upper frame 211 includes two oppositely arranged first upper frame brackets 2111 and two oppositely arranged second upper frame brackets 2112. The first upper frame brackets 2111 extend along the length direction L of the material frame 200, and the second upper frame brackets 2112 extend along the width direction W of the material frame 200. Two support frames 2114 are arranged at intervals between the two first upper frame brackets 2111, and there is a certain distance between the support frames 2114 and the corresponding second upper frame brackets 2112 on the same side. A convex portion 2115 is provided on the support frame 2114.

[0114] Further, the lower frame 212 includes two oppositely arranged first lower frame brackets 2121 and two oppositely arranged second lower frame brackets 2122. The second lower frame brackets 2122 include lower frame transverse frames 2123. Opposite ends of the lower frame transverse frames 2123 are respectively provided with lower frame vertical frames 2124. The first lower frame brackets 2121 extend along the length direction K of the material frame 200, the lower frame transverse frames 2123 extend along the width direction W of the material frame 200, and the lower frame vertical frames 2124 extend along the height direction of the material frame 200.

[0115] The bottom of the upper frame 211 is detachably connected to the top of the lower frame vertical frame 2124 to achieve the detachable connection between the upper frame 211 and the lower frame 212.

[0116] Further, referring to Figures 4 to 6 , a upper limit block 2116 is provided at the bottom of the upper frame 211, and a lower limit block 2126 is provided at the top of the lower frame vertical frame 2124. The upper limit block 2116 and the lower limit block 2126 are adapted through a concave-convex structure to achieve the cooperation between the upper frame 211 and the lower frame 212. For example, a concave shape is provided on the upper limit block 2116, and a convex shape is provided on the lower limit block 2126, and the concave shape and the convex shape are adapted.

[0117] In some other embodiments, the upper frame 211 and the lower frame 212 can be detachably connected by means of bolts, pins, etc.

[0118] Further, referring to Figure 5 , a upper grasping portion 2117 is provided on the outer side of the upper frame 211, and the upper grasping portion 2117 is for external force to grasp to separate the upper frame 211 from the lower frame 212.

[0119] Referring to Figure 6 , a lower grasping portion 2127 is provided on the outer side of the lower frame 212, and the lower grasping portion 2127 is for external force to grasp to transport the material frame 200.

[0120] Further, support rollers 215 are provided at the bottom of the lower frame 212. The support rollers 215 are arranged at intervals along the width direction W of the material frame 200, and the support rollers 215 are in abutting contact with the bottom of the silicon wafer 120.

[0121] The gap between two adjacent support rollers 215 facilitates the water on the silicon wafer 120 to fall into the transfer cart 400 below.

[0122] In some embodiments, referring to Figure 15 and Figure 16 , a limiting portion 420 is provided on the vehicle body of the transfer cart 400. The limiting portion 420 is a limiting protrusion arranged on the peripheral side of the material frame 200. The limiting portion 420 is used to limit the material frame 200 to ensure the stability of the placement of the material frame 200 on the transfer cart 400.

[0123] Furthermore, a liquid collecting tank 430 is provided on the transfer cart 400. The liquid collecting tank 430 is located below the material frame 200. The liquid collecting tank 430 is used to collect the liquid dripping from the silicon wafer 120. A liquid discharge port 440 and a liquid discharge valve 450 are provided at the low position of the liquid collecting tank 430 to facilitate liquid discharge.

[0124] Furthermore, a positioning portion 460 is provided at the moving front end of the transfer cart 400. The positioning portion 460 is used for positioning when the transfer cart 400 moves to a designated position.

[0125] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

Claims

1. A silicon wafer transfer device for transferring silicon wafer units, where the silicon wafer units include a crystal carrier and multiple silicon wafers to be separated and pasted on the crystal carrier. The multiple silicon wafers are divided into multiple silicon wafer groups, and it is characterized in that, The transfer device includes: A material frame, which forms a loading space for loading the silicon wafer units. The top of the loading space is open for the silicon wafer units to be loaded into the loading space from top to bottom. One end of the material frame is provided with a discharge port communicating with the loading space. The material frame is provided with: A clamping assembly, which has two and is located on opposite sides of the loading space. The clamping assembly includes a movable plate, which extends along the length direction of the loading space. A plurality of clamping parts are arranged in sequence along the length direction of the movable plate. The plurality of clamping parts correspond to the plurality of silicon wafer groups one by one to clamp the corresponding silicon wafer groups. Each clamping part moves away from the silicon wafer to release the clamping of the corresponding silicon wafer group. An unlocking trigger part, and each movable plate is configured with a corresponding unlocking trigger part. A transfer trolley, which is used to carry the material frame. An unlocking part is provided on the transfer trolley. After the material frame is placed on the transfer trolley, the unlocking part triggers the unlocking trigger part to act. Under the action of the unlocking trigger part, the movable plate moves away from the loading space, and the plurality of clamping parts arranged on the movable plate are driven to move away from the loading space synchronously. An unlocking device, which is arranged beside the clamping part. The unlocking device is used to apply an external force to the clamping part to make the clamping part away from the corresponding silicon wafer group after the material frame is separated from the transfer trolley.

2. The silicon wafer transfer device according to claim 1, wherein When transferring the cut silicon wafer units, first place the material frame on the transfer trolley. The unlocking part triggers the unlocking trigger part to act. All the clamping parts are driven by the movable plate to move away from the loading space synchronously, which is convenient for the silicon wafer units to be loaded into the loading space from top to bottom. When the transfer trolley transfers the material frame to the next working station, take the material frame off the transfer trolley. The unlocking part is separated from the unlocking trigger part. The clamping part moves towards the silicon wafer under the action of the reset part to clamp the silicon wafer units.

3. The silicon wafer transfer device according to claim 2, wherein When it is necessary to slice the silicon wafers in the material frame in units of the silicon wafer groups, a relative movement is generated between the material frame and the unlocking device. The plurality of clamping parts are in contact with the unlocking device in sequence as the material frame and the unlocking device move relatively. The unlocking device applies an external force to the clamping part to make the clamping part away from the corresponding silicon wafer group.

4. The silicon wafer transfer device according to claim 1, wherein The material frame includes two relatively arranged transverse frames, which extend along the length direction of the loading space. The movable plate is located outside the transverse frame. The clamping part passes through the transverse frame and the movable plate. The unlocking trigger part includes a first pin shaft. The first pin shaft passes through the transverse frame. The first end of the first pin shaft is fixedly connected to the movable plate. The second end of the first pin shaft is used to contact the unlocking part, so that the first pin shaft moves along its penetrating direction in the transverse frame, and drives the movable plate to move synchronously away from the containing space.

5. The wafer transfer device according to claim 4, characterized in that A roller is provided at the second end of the first pin shaft. The unlocking part is a column provided on the transfer cart. A guiding contact surface is provided at the upper end of the column on the side facing the roller. When the material frame is placed on the transfer cart from top to bottom, the roller moves from top to bottom along the guiding contact surface to drive the first pin shaft to move away from the containing space.

6. The wafer transfer device according to claim 5, characterized in that The guiding contact surface includes a first contact surface section, a second contact surface section, and a third contact surface section from top to bottom. The second contact surface section extends in the vertical direction. The first contact surface section extends obliquely away from the roller from the top of the second contact surface section. The third contact surface section extends obliquely towards the roller from the bottom of the second contact surface section.

7. The wafer transfer device according to claim 4, characterized in that The clamping part includes a second pin shaft. The second pin shaft passes through the transverse frame and the movable plate. An unlocking block is provided at the first end of the second pin shaft. A clamping block is provided at the second end of the second pin shaft. A spring is sleeved on the second pin shaft. The spring is located between the clamping block and the transverse frame; When the movable plate moves away from the containing space, the movable plate pushes all the unlocking blocks to move synchronously away from the containing space, so that all the clamping blocks move away from the containing space; The clamping block moves towards the wafer in the restoring force of the spring to clamp the corresponding wafer group.

8. The wafer transfer device according to claim 7, characterized in that The unlocking block includes a transverse portion and a vertical portion. The transverse portion is used to abut against the movable plate. The vertical portion is used to act on the unlocking device; There is a certain distance between the vertical portion and the movable plate. An inclined surface is provided on the side of the vertical portion facing the movable plate. Along the wafer discharging direction, the distance between the inclined surface and the movable plate first decreases and then increases; The unlocking device includes a first roller. When a relative movement occurs between the material frame and the unlocking device, the first roller moves between the inclined surface and the movable plate and contacts the inclined surface, so that the second pin shaft moves away from the wafer through the relative displacement between the first roller and the inclined surface.

9. The wafer transfer device according to any one of claims 1 to 8, characterized in that The material frame further includes an anti-tipping component, which is used to abut and support the wafer. The anti-tipping component includes a mounting frame and a second roller provided on the mounting frame. The mounting frame is provided on the material box, and the second roller is used to abut against the silicon wafer.

10. The silicon wafer transfer device according to any one of claims 1 to 8, wherein a limiting portion is provided on the transfer trolley, the limiting portion is a limiting protrusion arranged on the periphery of the material box, and the limiting portion is used to limit the material box.

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