Intermediate equipment of a grinding disc cooling system for a wafer grinding machine

Abstract

This invention discloses an intermediate device for a grinding disc cooling system of a wafer grinding apparatus, comprising a tubular bushing, several leak-proof rings, a pivot pipe, and a connecting structure. The bushing has a first flow channel and a second flow channel inside. The pivot pipe is fitted around the bushing, forming a first connecting channel and a second connecting channel. The first flow channel connects to the cooling water channel inside the grinding disc, and the second flow channel connects to the cooling water channel, thereby circulating the cooling water to cool the grinding disc. The connecting structure is configured at one end corresponding to the bushing and the pivot pipe, and is removably connected to the pivot pipe and a drive shaft, thereby driving the grinding disc to rotate via the connecting structure and the pivot pipe.

Description

Technical Field

[0001] This invention relates to a component of a wafer grinding equipment; in particular, it refers to an innovative structure of an intermediate device in the grinding disc cooling system of a wafer grinding equipment. Background Technology

[0002] A wafer grinding machine is a tool used for grinding wafers. It includes a wafer rack drive mechanism, an upper grinding disk, and a lower grinding disk. One or more wafers are placed on a wafer rack. A robotic arm transfers one or more wafer racks to the wafer rack drive mechanism. The wafer rack drive mechanism drives each wafer rack to run along a circular path. The upper and lower grinding disks grind the two surfaces of each wafer on each wafer rack. Each surface is located on two opposite sides of the wafer in the thickness direction.

[0003] During the grinding process, the lower grinding disk contacts the wafer and rubs against it. The heat generated by this friction easily causes the lower grinding disk to gradually heat up. This heating will affect the flatness of the wafer surface being ground by the lower grinding disk. Since the lower grinding disk is located on the side of the wafer rack facing inwards from the wafer grinding equipment, it is not easily cooled externally. The wafer grinding equipment is equipped with a grinding disk cooling system, which includes an inlet channel, an outlet channel, an intermediate device, and a cooling water channel. The water channel and the water outlet are respectively connected to the intermediate equipment, and the water inlet and the water outlet are respectively connected to a cooling water source. Several flow channels are formed inside the intermediate equipment. The cooling water channel is formed inside the lower grinding disc. Each flow channel is connected to the water inlet, the water outlet and the cooling water channel respectively. The cooling water source supplies cooling water to the water inlet. The cooling water enters the cooling water channel through the water inlet and the flow channel. The cooling water then flows back to the cooling water source through the cooling water channel, the flow channel and the water outlet, so that the cooling water circulates and absorbs the heat energy of the lower grinding disc, thereby cooling the lower grinding disc.

[0004] Upon investigation, the grinding disc cooling system still exhibits the following problems and shortcomings in practical applications: The intermediate device contains one to several check rings, each used to isolate different flow channels and prevent cooling water flowing in one channel from seeping into others. After a period of use, the effectiveness of these check rings gradually decreases due to temperature changes and elastic fatigue. However, because the intermediate device is located inside the wafer grinding equipment near the lower grinding disc, the check rings cannot be replaced without removing the intermediate device from the wafer grinding equipment. Replacing the intermediate device requires removing it from the wafer grinding equipment and then disassembling it to replace the check rings. However, this process involves disconnecting the inlet and outlet water channels from the intermediate device, as well as removing numerous components surrounding the intermediate device. This is a complex and time-consuming operation, requiring a long downtime for the wafer grinding equipment to await replacement and subsequent testing, thus impacting overall production efficiency. Summary of the Invention

[0005] The main objective of this invention is to provide an intermediate device for the cooling system of the grinding disc in a wafer grinding apparatus.

[0006] To achieve the above objectives, the present invention adopts the following technical solution.

[0007] An intermediate device of a grinding disc cooling system for a wafer grinding equipment, the wafer grinding equipment having a power unit, a lower grinding disc and a grinding disc cooling system, the power unit driving the lower grinding disc to rotate via a drive shaft to grind one side of the wafer, the grinding disc cooling system providing cooling water to the lower grinding disc to cool it down.

[0008] The intermediate device includes:

[0009] A tubular bushing is used to encircle the radial outer periphery of a drive shaft and is connected to a fixed structure of a wafer grinding equipment. The bushing has a first end and a second end, which are located at opposite ends of the bushing along its axial direction. The first end 11 is adjacent to the fixed structure. A first flow channel and a second flow channel are formed inside the bushing. A first annular channel, a second annular channel, and several grooves are recessed in the radial outer periphery of the bushing. The first annular channel, the second annular channel, and each groove surround the bushing along its circumference. One end of the first flow channel is connected to the first annular channel, and the other end extends to the first end to connect to a water inlet channel. One end of the second flow channel is connected to the second annular channel, and the other end extends to the first end to connect to a water outlet channel. Each groove is respectively disposed between the first end, the first annular channel, the second annular channel, and the second end.

[0010] Several anti-leakage rings are respectively embedded in each groove.

[0011] A pivot fitting is fitted around the radial outer circumference of the bushing, and each leak-proof ring tightly abuts against the radial inner circumference of the pivot fitting. The pivot fitting is used to connect to the lower grinding disc and rotates with the lower grinding disc. The interior of the pivot fitting forms a first connecting channel and a second connecting channel. One end of the first connecting channel extends to the radial inner edge of the pivot fitting and connects to the first annular channel. The other end of the first connecting channel extends to the outer edge of the pivot fitting and connects to the cooling water channel inside the lower grinding disc. One end of the second connecting channel extends to the radial inner edge of the pivot fitting and connects to the second annular channel. The other end of the second connecting channel extends to the outer edge of the pivot fitting and connects to the cooling water channel, thereby allowing cooling water to circulate through the cooling water channel; and

[0012] A ring-shaped connecting structure is configured at the second end of the bushing. The connecting structure is removably connected to the pivot tube and the drive shaft, thereby enabling the drive shaft to drive the lower grinding disc to rotate through the connecting structure and the pivot tube.

[0013] The main effects and advantages of this invention are that maintenance and replacement operations are easy and quick, which can effectively shorten the downtime of wafer grinding equipment for maintenance and replacement operations and improve overall production efficiency. Attached Figure Description

[0014] Figure 1 This is a three-dimensional schematic diagram of a preferred embodiment of the present invention.

[0015] Figure 2 This is a three-dimensional schematic diagram from another perspective of a preferred embodiment of the present invention.

[0016] Figure 3 This is an exploded perspective view of a preferred embodiment of the present invention.

[0017] Figure 4 This is a partial cross-sectional view of a preferred embodiment of the present invention, set in the operating state of a wafer polishing apparatus.

[0018] Figure 5 yes Figure 4 A magnified view of a portion of the image.

[0019] Figure 6 yes Figure 4 A magnified view of a portion of the image.

[0020] Figure 7 This is a partial cross-sectional view from another perspective of the preferred embodiment of the present invention, which is set in the operating state of a wafer grinding equipment.

[0021] Figure 8 This is a partial cross-sectional view from another perspective of the preferred embodiment of the present invention, showing the wafer polishing equipment in use.

[0022] Figure 9 This is a partial cross-sectional view of the disassembly and maintenance operation state of a preferred embodiment of the present invention.

[0023] Figure 10 This is a partial cross-sectional view of another disassembly and maintenance operation state according to a preferred embodiment of the present invention. Detailed Implementation

[0024] Please refer to the figures shown, which are a preferred embodiment of the intermediate device of the grinding disc cooling system of the wafer grinding apparatus of the present invention. However, these embodiments are for illustrative purposes only and are not limited to this structure in the patent application.

[0025] A wafer grinding machine is a grinding device specifically designed for grinding wafers. It includes a power unit, a lower grinding disc, and a grinding disc cooling system. The power unit drives the lower grinding disc to rotate via a drive shaft, thereby grinding one side of the wafer. The wafer grinding machine has a grinding disc cooling system that provides cooling water to the lower grinding disc to cool it down. The relative configuration of the power unit and the drive shaft is known technology familiar to those skilled in the art, and the relative configuration of the power unit and the drive shaft does not involve the technical features of this invention; therefore, its specific configuration will not be described in detail.

[0026] like Figures 1 to 10 As shown, the intermediate equipment of the grinding disc cooling system of the wafer grinding equipment includes a tubular bushing 10, several leak-proof rings 20, a pivot pipe 30, and an annular connecting structure 40. The bushing 10 is used to surround the radial outer periphery of the drive shaft 91, and the bushing 10 is connected to the fixing structure 92 of the wafer grinding equipment, thereby positioning the bushing 10. The fixing structure 92 can be a frame or platform or other structure with the same or similar function, providing positioning for various components of the wafer grinding equipment. The bushing 10 has a first end 11 and a second end 12, which are located at opposite ends of the bushing 10 along its axial direction. The first end 11 is adjacent to the fixing structure 92. The interior of the bushing 10 forms two first flow channels 13 and two second flow channels 14. The radial outer periphery of the bushing 10 is recessed with two first annular channels 15, two second annular channels 16 and several grooves 17. Each first annular channel 15, each second annular channel 16 and each groove 17 surrounds the bushing 10 along the circumference of the bushing 10. One end of each first flow channel 13 is connected to each first annular channel 15, and the other end extends to the first end 11 and is connected to a water inlet channel 93. One end of each second flow channel 14 is connected to each second annular channel 16, and the other end extends to the first end 11 and is connected to a water outlet channel 94. Each groove 17 is disposed between the first end 11, each first annular channel 15, each second annular channel 16 and the second end 12.

[0027] Specifically, in this example, several first bolts 18 are used to connect the bushing 10 and the fixing structure 92. Each first bolt 18 passes through the bushing 10 through the second end 12, and each first bolt 18 is screwed to the fixing structure 92 through the first end 11, so that the bushing 10 is connected to the fixing structure 92.

[0028] Each anti-leakage ring 20 is respectively embedded in each groove 17.

[0029] The pivot pipe 30 is fitted around the radial outer periphery of the bushing 10, and each leak-proof ring 20 is tightly abutted against the radial inner periphery of the pivot pipe 30. The pivot pipe 30 is used to connect to the lower grinding disc 95 and rotates with the lower grinding disc 95. The interior of the pivot pipe 30 forms two first connecting channels 31 and two second connecting channels 32. One end of each first connecting channel 31 extends to the radial inner edge of the pivot pipe 30 and is respectively connected to each first ring channel 15. The other end of each first connecting channel 31 extends to the outer edge of the pivot pipe 30 and is respectively connected to the cooling water channel 96 inside the lower grinding disc 95. One end of each second connecting channel 32 extends to the radial inner edge of the pivot pipe 30 and is respectively connected to each second ring channel 16. The other end of each second connecting channel 32 extends to the outer edge of the pivot pipe 30 and is respectively connected to the cooling water channel 96, thereby allowing cooling water to circulate through the cooling water channel 96.

[0030] In accordance with the specific configuration of the cooling water channel 96, the number of the first flow channel 13, the second flow channel 14, the first ring channel 15, the second ring channel 16, the first connecting channel 31, and the second connecting channel 32 can be increased or decreased accordingly. The number of the first flow channel 13, the second flow channel 14, the first ring channel 15, the second ring channel 16, the first connecting channel 31, and the second connecting channel 32 is limited to at least one. The number of the water inlet channel 93 and the water outlet channel 94 can be changed accordingly.

[0031] Cooling channel 96 is a known technology familiar to those skilled in the art to which this invention pertains, and cooling channel 96 does not involve the technical features of this invention, so its specific structure will not be described in detail.

[0032] The connecting structure 40 is configured to correspond to the second end 12 of the bushing 10. The connecting structure 40 is removably connected to the pivot tube 30 and the drive shaft 91, so that the drive shaft 91 drives the lower grinding disc 95 to rotate through the connecting structure 40 and the pivot tube 30. Accordingly, the intermediate device can serve as a coupling for transmitting power between the drive shaft 91 and the lower grinding disc 95, and the drive shaft 91 drives the lower grinding disc 95 to rotate through the intermediate device.

[0033] Cooling water (not shown in the figure) is supplied to enter the first flow channels 13 of the bushing 10 through each inlet channel 93, and then enters the first connecting channels 31 of the pivot pipe 30 through each first ring channel 15. Then, it enters the cooling water channel 96 inside the lower grinding disc 95 through each first connecting channel 31. The cooling water that absorbs heat in the cooling water channel 96 flows back to the pivot pipe 30 and enters the second connecting channels 32. Then, it enters the second ring channels 16 of the bushing 10 and flows through each second flow channel 14 into each outlet channel 94 and flows to the cooling water source. The cooling water forms a circulation flow, absorbs the heat energy of the lower grinding disc 95, and cools the lower grinding disc 95.

[0034] The bushing 10 faces the radial outer periphery of the pivot pipe 30. The recessed first annular channels 15 and second annular channels 16 surround the bushing 10 along the circumference of the bushing 10. When the drive shaft 91 drives the pivot pipe 30 and the lower grinding disc 95 to rotate through the connecting structure 40, the first connecting channel 31 and the second connecting channel 32 can maintain corresponding connection with the first annular channel 15 and the second annular channel 16 respectively. When the lower grinding disc 95 rotates, the cooling water can continuously enter and leave the cooling water channel 96 to form a circulation flow. The leak-proof rings 20 form a barrier in the axial direction of the first annular channel 15 and the second annular channel 16 respectively to prevent leakage or seepage problems when the cooling water flows between the bushing 10 and the pivot pipe 30.

[0035] like Figure 9 As shown, by removing each of the second bolts 43 and the third bolts 44, the connecting structure 40 can be removed axially upwards, exposing the top of the bushing 10 and the pivot pipe 30. Then, depending on the maintenance needs, the sealing ring 50 can be removed and the first bolts 18 can be removed. It is not necessary to remove the many components and pivot pipe 30 located around the intermediate equipment of the wafer grinding equipment. The bushing 10 can be moved axially upwards and removed from the wafer grinding equipment to replace each of the leak-proof rings 20. The bushing 10 can be repaired or replaced as needed.

[0036] like Figure 10 As shown, after removing the connecting structure 40, each of the fourth bolts 36 can be removed as needed for maintenance. It is not necessary to remove the many components and bushings 10 located around the intermediate equipment of the wafer polishing equipment. The pivot pipe 30 can then be moved upward along the axial direction to remove it from the wafer polishing equipment for maintenance or replacement.

[0037] The present invention can also remove the bushing 10 and the pivot tube 30 from the wafer polishing equipment without removing the many components of the wafer polishing equipment located around the intermediate equipment after removing the connection structure 40.

[0038] According to the maintenance needs, the degree of disassembly of each component constituting the intermediate equipment can be selected, and the maintenance and replacement operations are easy and fast. Compared with the prior art, it can effectively shorten the downtime of wafer grinding equipment for maintenance and replacement operations and improve the overall production efficiency.

[0039] Furthermore, the radial inner circumference of the pivot pipe 30 forms several annular protrusions 33, each protrusion 33 abutting against each leak-proof ring 20.

[0040] The formation of each protrusion 33 can improve the effectiveness of each leak-stopping ring 20 against the pivot pipe 30 to form a leak-stopping effect. The portion of the radial inner circumference of the pivot pipe 30 where each protrusion 33 is not formed forms a retracted portion 34 that retracts away from the bushing 10 relative to each protrusion 33. When the pivot pipe 30 is to be disassembled or assembled, and the pivot pipe 30 is axially displaced relative to the bushing 10, each retracted portion 34 and each leak-stopping ring 20 will not come into contact with each other and form friction when they are radially opposite each other, thus reducing the difficulty of disassembling or assembling the pivot pipe 30.

[0041] The connecting structure 40 includes a first annular member 41 and a second annular member 42. Several second bolts 43 are respectively threaded through the first annular member 41 to connect to the drive shaft 91, and several third bolts 44 are respectively threaded through the second annular member 42 to connect to the pivot pipe 30. The first annular member 41 has several protrusions 45, which are arranged in a ring-shaped interval. The second annular member 42 forms several grooves 46 corresponding to each protrusion 45, and each protrusion 45 is respectively embedded in each groove 46, thereby causing the first annular member 41 and the second annular member 42 to rotate synchronously.

[0042] The drive shaft 91 drives the first annular member 41 to rotate. The first annular member 41 drives the second annular member 42 to rotate through each protrusion 45. The second annular member 42 drives the pivot tube 30 connected to the lower grinding disc 95 to rotate. Accordingly, the drive shaft 91 drives the pivot tube 30 and the lower grinding disc 95 to rotate synchronously through the connecting structure 40. The connection relationship between each first connecting channel 31 and each second connecting channel 32 and the cooling water channel 96 is maintained.

[0043] A sealing ring 50 is connected to the bushing 10. The sealing ring 50 is made of an elastic material. The sealing ring 50 is embedded in the second end 12 and elastically abuts against the connecting structure 40. Furthermore, the sealing ring 50 abuts against the side of the first annular member 41 facing the bushing 10. The sealing ring 50 can improve the sealing between the bushing 10 and the connecting structure 40 and prevent cutting fluid or other foreign matter from seeping between the bushing 10 and the pivot pipe 30.

[0044] The radial expansion of the pivot tube 30 forms an annular abutment 35, which abuts the top of the lower grinding disc 95. Several fourth bolts 36 are threaded through the pivot abutment 35 and screwed onto the lower grinding disc 95, thereby connecting the pivot tube 30 to the lower grinding disc 95, and the pivot tube 30 rotates with the lower grinding disc 95.

[0045] Figure 1 and Figure 3 Based on the clear spatial relationship between the bushing 10, the pivot tube 30, and the connecting structure 40, the quantities of the first bolt 18, the second bolt 43, the third bolt 44, and the fourth bolt 36 are shown schematically and should not be construed as limiting the interpretation of the present invention.

Claims

1. An intermediate device of a grinding disc cooling system for a wafer grinding apparatus, the wafer grinding apparatus comprising a power unit, a lower grinding disc and a grinding disc cooling system, the power unit driving the lower grinding disc to rotate via a drive shaft, thereby grinding one side of the wafer, the grinding disc cooling system being used to provide cooling water to the lower grinding disc; The intermediate device is characterized in that include: A tubular bushing is fitted around the radial outer periphery of a drive shaft and is connected to a fixed structure of a wafer grinding equipment. The bushing has a first end and a second end, which are located at opposite ends of the bushing along its axial direction. The first end is adjacent to the fixed structure. A first flow channel and a second flow channel are formed inside the bushing. A first annular channel, a second annular channel, and several grooves are recessed in the radial outer periphery of the bushing. The first annular channel, the second annular channel, and each groove surround the bushing along its circumference. One end of the first flow channel is connected to the first annular channel, and the other end extends to the first end to connect to a water inlet channel. One end of the second flow channel is connected to the second annular channel, and the other end extends to the first end to connect to a water outlet channel. Each groove is disposed between the first end, the first annular channel, the second annular channel, and the second end. Several anti-leakage rings are respectively embedded in each groove; A pivot pipe is fitted around the radial outer circumference of the bushing, and each leak-proof ring is tightly abutted against the radial inner circumference of the pivot pipe. The pivot pipe is used to connect to the lower grinding disc and rotates with the lower grinding disc. The interior of the pivot pipe forms a first connecting channel and a second connecting channel. One end of the first connecting channel extends to the radial inner edge of the pivot pipe and connects to the first ring channel. The other end of the first connecting channel extends to the outer edge of the pivot pipe and connects to the cooling water channel inside the lower grinding disc. One end of the second connecting channel extends to the radial inner edge of the pivot pipe and connects to the second ring channel. The other end of the second connecting channel extends to the outer edge of the pivot pipe and connects to the cooling water channel. A ring-shaped connecting structure is configured at the second end of the bushing. The connecting structure is removably connected to the pivot tube and the drive shaft. The drive shaft drives the lower grinding disc to rotate through the connecting structure and the pivot tube.

2. The intermediate equipment of the grinding disc cooling system of the wafer grinding equipment according to claim 1, characterized in that, The radial inner circumference of the pivot pipe forms several annular protrusions, each of which abuts against a respective leak-proof ring.

3. The intermediate equipment of the grinding disc cooling system of the wafer grinding equipment according to claim 1, characterized in that, Several first bolts pass through the second end shaft sleeve, and each first bolt is fixed to the structure by being screwed to the first end.

4. The intermediate equipment of the grinding disc cooling system of the wafer grinding equipment according to claim 1, characterized in that, The connection structure includes a first annular component and a second annular component, wherein several second bolts are respectively threaded through the first annular component to connect the drive shaft, and several third bolts are respectively threaded through the second annular component to connect the pivot pipe. The first annular component has several protrusions, and the second annular component forms several grooves, with each protrusion being embedded in each groove.

5. The intermediate equipment of the grinding disc cooling system of the wafer grinding equipment according to claim 1, characterized in that, A bushing is connected to a sealing ring, which is embedded in the second end and elastically abuts against the connection structure.

6. The intermediate equipment of the grinding disc cooling system of the wafer grinding equipment according to claim 1, characterized in that, The bushing has two first flow channels and two second flow channels inside. The bushing has two first annular channels and two second annular channels recessed on its radial outer periphery. Each first flow channel is connected to each first annular channel and two water inlets, and each second flow channel is connected to each second annular channel and two water outlets. The internal structure of the pivot pipe forms two first connecting channels and two second connecting channels. Each first connecting channel is connected to each first ring channel and cooling water channel, and each second connecting channel is connected to each second ring channel and cooling water channel.

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