A soft and hard combined plate bending and shaping structure and method

Abstract

The application belongs to the technical field of soft plate bending, and provides a soft and hard combination plate bending and shaping structure and method. The structure comprises a soft plate body, the surface of the soft plate body is attached with a TPI material layer, the bending line of the soft plate body is provided with a convex and a groove matched with each other on both sides, the convex and the groove are arranged on the TPI material layer, a TPI adhesive layer is formed on the TPI material layer corresponding to the convex and the groove through 3D printing, and after the soft plate body is bent and shaped along the bending line, the convex is embedded into the groove. The application uses TPI material instead of conventional CVL material, has viscosity and softens at high temperature, and the convex and the groove form a sawtooth structure, increase the bonding area, and are more closely bonded.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of soft plate bending, and particularly relates to a soft and hard combination plate bending and shaping structure and method. BACKGROUND

[0002] The soft plate needs to be bent and shaped (such as shown in Figure 1 The existing bending and shaping technology generally adopts double-sided pressure-sensitive adhesive fixing, and double-sided adhesive tape needs to be attached in a downstream assembly factory (such as shown in Figure 2 The existing bending and shaping technology generally adopts double-sided pressure-sensitive adhesive fixing, and double-sided adhesive tape needs to be attached in a downstream assembly factory (such as shown in

[0003] Therefore, in view of the above status, it is urgent to develop a soft and hard combination plate bending and shaping structure and method to overcome the deficiencies in the prior art. SUMMARY

[0004] The embodiment of the application aims to provide a soft and hard combination plate bending and shaping structure and method, and aims to solve the problems mentioned in the background.

[0005] The embodiment of the application is implemented as follows: a soft and hard combination plate bending and shaping structure, comprising a soft plate body, a TPI material layer attached to the surface of the soft plate body, protrusions and grooves matched with each other arranged on both sides of a bending line of the soft plate body, the protrusions and grooves arranged on the TPI material layer, a TPI adhesive layer formed on the TPI material layer corresponding to the protrusions and grooves by 3D printing, and the protrusions embedded into the grooves after the soft plate body is bent and shaped along the bending line.

[0006] Further technical solutions are that the protrusions and grooves are located on the same surface of the soft plate body.

[0007] Further technical solutions are that the protrusions and grooves are evenly and uniformly arranged in multiple numbers.

[0008] Another object of the embodiment of the application is a processing method of a soft and hard combination plate bending and shaping structure, comprising the following steps:

[0009] Step 1: performing cleaning treatment on the surface of a soft plate body that needs to be bent and shaped;

[0010] Step 2: attaching a TPI material layer to the surface of the soft plate body;

[0011] Step 3: arranging protrusions and grooves matched with each other on the TPI material layer along a bending line, and forming a TPI adhesive layer on the TPI material layer by 3D printing;

[0012] Step 4: pressing and shaping the soft plate body after being bent along the bending line, and embedding the protrusions into the grooves.

[0013] The soft and hard combination board bending and shaping structure and method provided by the embodiment of the application adopts TPI material instead of conventional CVL material, the TPI is a thermoplastic material, has viscosity and softens at high temperature, and thus can replace the role of double-sided adhesive tape in the prior art at high temperature, saves double-sided adhesive tape material, the protrusions and grooves form a sawtooth structure, increase the bonding area, and the adhesion is more compact, the overall process flow is reduced, the production difficulty is reduced, and the product quality is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 The existing bending and shaping technology from the initial structure to the structure after bending is shown in the schematic view.

[0015] Figure 2 The existing bending and shaping technology is shown in the schematic view of the cross-sectional structure.

[0016] Figure 3 The structure of the soft and hard combination board bending and shaping structure provided by the embodiment of the application is shown in the schematic view.

[0017] Figure 4 The structure of the soft and hard combination board bending and shaping structure provided by the embodiment of the application before the soft plate body is processed is shown in the schematic view.

[0018] Figure 5 The structure after TPI is attached is shown in the schematic view. Figure 4

[0019] Figure 6 The structure after 3D printing of the TPI adhesive layer is shown in the schematic view. Figure 5

[0020] The structure after bending and pressing is shown in the schematic view. Figure 7 Figure 6

[0021] In the drawing, 1 is a soft plate body, 2 is a TPI material layer, 3 is a bending line, 4 is a protrusion, and 5 is a groove. EMBODIMENT

[0022] In order to make the purpose, technical scheme and advantages of the application more clear and understandable, the application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the application and do not limit the application.

[0023] The specific implementation of the application is described in detail below in combination with specific embodiments. EMBODIMENT

[0024] As Figures 3-7 ​​​As shown, the soft and hard combined plate bending and shaping structure provided by one embodiment of the present application comprises a soft plate body 1, the surface of the soft plate body 1 is attached with a TPI material layer 2, the bending line 3 of the soft plate body 1 is provided with a protrusion 4 and a groove 5 which are matched with each other on both sides of the bending line 3, and after the soft plate body 1 is bent and shaped along the bending line 3, the protrusion 4 is embedded into the groove 5.

[0025] As a preferred embodiment of the present application, the protrusion 4 and the groove 5 are located on the same surface of the soft plate body 1, the protrusion 4 and the groove 5 are arranged on the TPI material layer 2, and a TPI adhesive layer is formed on the TPI material layer 2 corresponding to the protrusion 4 and the groove 5 by 3D printing; the protrusion 4 and the groove 5 are evenly arranged in multiple, i.e. a sawtooth structure is formed, the bonding area is increased, and the adhesion is more compact. Embodiment

[0026] As shown, one embodiment of the present application further provides a processing method of the soft and hard combined plate bending and shaping structure, comprising the following steps: Figures 3-7 Step 1, cleaning treatment is performed on the surface of the soft plate body 1 which needs to be bent and shaped;

[0027] Step 2, the TPI material layer 2 is attached on the surface of the soft plate body 1;

[0028] Step 3, the protrusion 4 and the groove 5 which are matched with each other are arranged on the TPI material layer 2 along the bending line 3, and a TPI adhesive layer is formed on the TPI material layer 2 by 3D printing;

[0029] Step 4, after the soft plate body 1 is bent along the bending line 3, the protrusion 4 is embedded into the groove 5.

[0030] The soft and hard combined plate bending and shaping structure and method provided in the above embodiments of the present application use TPI (thermoplastic polyimide) material instead of conventional CVL (crystal violet lactone) material, TPI is a thermoplastic material which has viscosity and softens at high temperature, so it can replace the role of double-sided adhesive in the prior art at high temperature, saves double-sided adhesive material, and the protrusion 4 and the groove 5 form a sawtooth structure, increase the bonding area, and the adhesion is more compact, which reduces the process flow as a whole, reduces the production difficulty, and improves the product quality.

[0031] In addition, the control, model and circuit connection of each component are not specifically limited, and can be flexibly set in actual application.

[0032] The circuits, electronic components and modules involved are all prior art, and those skilled in the art can realize them without further description, and the content protected by the present application does not involve improvement of software and methods.

[0033] ​

[0034] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, as long as there is no conflict, any combination of the technical features should be considered within the scope of the present disclosure.

[0035] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A flexible-rigid composite board bending and shaping structure, comprising a flexible board body, characterized in that, The surface of the flexible circuit board body is coated with a TPI material layer; The flexible board body has protrusions and grooves that cooperate with each other on both sides of the bending line. The protrusions and grooves are provided on the TPI material layer, and a TPI adhesive layer is formed on the TPI material layer corresponding to the protrusions and grooves by 3D printing. Furthermore, after the flexible board body is bent and shaped along the bending line, the protrusion is embedded into the groove; The protrusions and grooves are located on the same side of the flexible board body.

2. The flexible-rigid bonded plate bending and shaping structure according to claim 1, characterized in that, The protrusions and grooves are evenly distributed in multiples.

3. A processing method for a flexible-rigid bonded plate bending and shaping structure as described in any one of claims 1-2, characterized in that, Includes the following steps: Step 1: Clean the surface of the flexible board body that needs to be bent and shaped; Step 2: Lay a TPI material layer onto the surface of the flexible circuit board body; Step 3: Set mutually cooperating protrusions and grooves on the TPI material layer along the bending line, and form a TPI adhesive layer on the TPI material layer by 3D printing; Step 4: After bending the flexible board body along the bending line, press and shape it, and embed the protrusion into the groove.

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