A tool coating and a method for producing and using the same

Abstract

The application provides a cutter coating and a preparation method and application thereof, and belongs to the technical field of numerical control cutters. After the cutter is etched and cleaned by a gas ion source method, a metal primer layer, a diamond-like layer, a bonding layer and an oxide heat insulation layer are sequentially deposited on the surface of the cutter by a high-power pulsed magnetron sputtering technology. The high-pulse magnetron sputtering technology is used for preparing the cutter coating, and the high-pulse magnetron sputtering technology has the characteristics of high atomic ionization rate and less liquid droplet agglomeration, so that the coating formed by film forming has few defects, high compactness and high hardness; after the oxide layer on the surface of the cutter is removed by the gas ion source, the metal primer layer is used as a transition layer, and the adhesion between the cutter and the coating can be improved. The oxide heat insulation layer is used for protecting the diamond-like layer from graphitization and failure in the milling process, and the high-temperature resistance is excellent.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of numerical control tools, in particular to a tool coating, a preparation method and application thereof. BACKGROUND

[0002] A numerical control milling cutter is a rotary tool with one or more teeth for milling machining. During work, each tooth intermittently cuts off the excess of the workpiece in turn. The milling cutter is mainly used for machining processes such as steps, grooves, shaped surfaces and cutting off workpieces. The numerical control milling cutter is often used for milling cast iron, magnesium-aluminum alloy and stainless steel, etc. In the process of high-speed cutting of these substrates, the milling cutter will be greatly worn. Through surface coating treatment, the service life and milling accuracy of the tool can be improved. At present, the common tool coating includes ceramic coating and diamond coating.

[0003] At present, the common preparation method of tool coating mainly includes chemical vapor deposition method for preparing diamond coating. However, the preparation method needs to be carried out at high temperature, and has high cost, low yield and poor process stability. The ceramic coating is usually prepared by multi-arc ion plating technology on the surface of the tool to prepare TiN, TiAlN, CrAlN or TiAlSiN, etc. The coating has the characteristics of high temperature resistance and wear resistance, but is easy to stick to the tool, which leads to the failure to continue working. The diamond-like coating has good inertness, but its temperature resistance is poor and it is easy to graphitize at high temperature. In addition, there are defects such as large particle holes in the film plating process of the multi-arc ion plating technology in the common PVD (physical vapor deposition) technology, and the ionization rate of the magnetron sputtering technology is low, and the adhesion of the prepared coating is poor. SUMMARY

[0004] The purpose of the present application is to provide a tool coating, a preparation method and application thereof. The prepared coating has high adhesion to the tool, good toughness and excellent high temperature resistance.

[0005] In order to achieve the above-mentioned purpose of the application, the present application provides the following technical scheme:

[0006] The present application provides a preparation method of a tool coating, comprising the following steps:

[0007] After etching and cleaning the tool by gas ion source method, a first high-power pulse magnetron sputtering is carried out on the etched and cleaned tool by taking metal palladium as target material to form a metal primer layer on the surface of the tool. The metal palladium includes Ti target, Cr target or Ni target.

[0008] Under the condition of passing nitrogen, a second high-power pulse magnetron sputtering is carried out on the surface of the metal primer layer by taking carbon target as target material to form a diamond-like layer.

[0009] A third high-power pulse magnetron sputtering is performed on the surface of the diamond-like coating layer with MCrAlY alloy as the target material to form a MCrAlY bonding layer, wherein M=Ni, Co or Ni+Co.

[0010] A fourth high-power pulse magnetron sputtering is performed on the surface of the MCrAlY bonding layer with an aluminum target or a zirconium target as the target material to form an oxide thermal barrier layer.

[0011] Preferably, the first high-power pulse magnetron sputtering is performed at an argon flow rate of 50-150 sccm, a power of 1-10 kW, a frequency of 100-5000 Hz, a pulse width of 10-100 μs and a deposition thickness of 30-200 nm.

[0012] Preferably, the second high-power pulse magnetron sputtering is performed at an argon flow rate of 50-150 sccm, a nitrogen flow rate of 10-50 sccm, a power of 1-10 kW, a frequency of 100-5000 Hz, a pulse width of 10-100 μs and a deposition thickness of 100-3000 nm.

[0013] Preferably, the third high-power pulse magnetron sputtering is performed at an argon flow rate of 50-150 sccm, a power of 1-10 kW, a frequency of 100-5000 Hz, a pulse width of 10-100 μs and a deposition thickness of 30-200 nm.

[0014] Preferably, the fourth high-power pulse magnetron sputtering is performed at an argon flow rate of 50-150 sccm, an oxygen flow rate of 10-80 sccm, a power of 1-30 kW, a frequency of 100-5000 Hz, a pulse width of 10-100 μs and a deposition thickness of 20-500 nm.

[0015] Preferably, the etching and cleaning is performed at a voltage of 20-400 V, an argon flow rate of 50-120 sccm, a hydrogen flow rate of 5-20 sccm, a power of 1-5 kW and a time of 30-190 min.

[0016] Preferably, the cutting tool comprises a numerical control milling cutter.

[0017] Preferably, before the first high-power pulse magnetron sputtering, the etched and cleaned cutting tool is heated at a temperature of 300-500 ℃.

[0018] The application also provides a cutting tool coated by the above-mentioned preparation method, which comprises a cutting tool and a metal primer layer, a diamond-like layer, a MCrAlY bonding layer and an oxide thermal barrier layer which are sequentially stacked on the surface of the cutting tool, wherein the metal primer layer comprises a Ti layer, a Cr layer or a Ni layer, and M=Ni, Co or Ni+Co.

[0019] The application provides application of the tool coating in milling.

[0020] The application provides a tool coating preparation method, which comprises the following steps: etching and cleaning a tool by using a gas ion source method, taking metal palladium as a target material, performing first high-power pulse magnetron sputtering on the tool after etching and cleaning, and forming a metal primer layer on the surface of the tool; the metal palladium comprises a Ti target, a Cr target or a Ni target; taking a carbon target as a target material, performing second high-power pulse magnetron sputtering on the surface of the metal primer layer in a nitrogen atmosphere, and forming a diamond-like layer; taking an MCrAlY alloy as a target material, performing third high-power pulse magnetron sputtering on the surface of the diamond-like layer, and forming an MCrAlY adhesive layer; the M is Ni, Co or Ni+Co; taking an aluminum target or a zirconium target as a target material, performing fourth high-power pulse magnetron sputtering on the surface of the MCrAlY adhesive layer, and forming an oxide thermal barrier layer. After the tool is etched and cleaned by using the gas ion source method, the metal primer layer, the diamond-like layer, the adhesive layer and the oxide thermal barrier layer are sequentially deposited on the surface of the tool by using the high-power pulse magnetron sputtering technology. The high-power pulse magnetron sputtering technology is used for preparing the tool coating, the high-power pulse magnetron sputtering technology has the characteristics of high atomic ionization rate and less liquid droplet agglomeration, so that the coating formed by the film forming method has few defects, high compactness and high hardness; after the oxide layer on the surface of the tool is removed by using the gas ion source, the metal primer layer is used as a transition layer, so that the adhesion between the tool and the coating can be improved. The oxide thermal barrier layer is used for protecting the diamond-like layer from graphitization and failure in the milling process, and the diamond-like layer has excellent high-temperature resistance. The method solves various problems encountered in the preparation of the coating by using the existing chemical vapor deposition method, the multi-arc ion plating technology, the physical vapor deposition technology and the magnetron sputtering technology. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A flow chart of the tool coating preparation method of the application;

[0022] Figure 2 An SEM image of the tool coating prepared in Example 1;

[0023] Figure 3 A hardness value diagram of each layer of the coating prepared on the milling cutter surface in Example 1;

[0024] Figure 4 A bonding force value diagram of the coating and the substrate prepared in Examples 1-3 and Comparative Examples 1-2. DETAILED DESCRIPTION

[0025] The application provides a tool coating preparation method, which comprises the following steps:

[0026] The tool is etched and cleaned by a gas ion source method, and then a first high-power pulse magnetron sputtering is performed on the tool after etching and cleaning by taking metal palladium as a target material to form a metal primer layer on the surface of the tool; the metal palladium comprises a Ti target, a Cr target or a Ni target;

[0027] A second high-power pulse magnetron sputtering is performed on the surface of the metal primer layer by taking a carbon target as a target material under the condition of nitrogen to form a diamond-like layer;

[0028] A third high-power pulse magnetron sputtering is performed on the surface of the diamond-like layer by taking an MCrAlY alloy as a target material to form an MCrAlY adhesive layer; the M is Ni, Co or Ni+Co;

[0029] A fourth high-power pulse magnetron sputtering is performed on the surface of the MCrAlY adhesive layer by taking an aluminum target or a zirconium target as a target material to form an oxide thermal barrier layer.

[0030] In the present application, if no special description is given, the required preparation raw materials are all commercially available goods which are well known to those skilled in the art.

[0031] The tool is etched and cleaned by a gas ion source method, and then a first high-power pulse magnetron sputtering is performed on the tool after etching and cleaning by taking metal palladium as a target material to form a metal primer layer on the surface of the tool. In the present application, the tool preferably comprises a numerical control milling cutter, and the present application does not have special limitations on the specific specifications of the numerical control milling cutter, and all numerical control milling cutters well known in the art can be used; in the embodiments of the present application, the tool is specifically a 2-blade long-neck ball-end milling cutter, and the specifications are R0.3*0.48*4*50*d4*D0.57.

[0032] In the present application, before etching and cleaning, the tool is preferably cleaned by a sodium dodecyl sulfate detergent solution with a temperature of 50-95℃ for 15-40 min, and then ultrasonic cleaning is performed by using deionized water for 15-40 min, more preferably for 20-30 min, and the cleaned tool is dried at 80-150℃. The present application does not have special limitations on the source of the sodium dodecyl sulfate detergent solution, and commercially available goods well known in the art can be used. The present application does not have special limitations on the specific conditions of the ultrasonic cleaning and drying, and the process well known in the art can be used.

[0033] The present application does not have special limitation to the equipment used in the gas ion source method, and the corresponding equipment well known in the art can be used. In the present application, the voltage of the etching cleaning is preferably 20-400V, more preferably 100-300V; the argon gas flow is preferably 50-120sccm, more preferably 80-100scc; the hydrogen gas flow is preferably 5-20sccm, more preferably 10-15sccm; the power is preferably 1-5kW, more preferably 3kW; and the time is preferably 30-190min, more preferably 90-150min. The present application removes the oxide layer and impurities on the surface of the tool by etching cleaning, and activates the surface of the tool.

[0034] After the etching cleaning is completed, the present application uses metal palladium as the target material to perform first high-power pulse magnetron sputtering on the tool after the etching cleaning, and forms a metal primer layer on the surface of the tool. In the present application, the metal palladium includes Ti target, Cr target or Ni target, and the Cr target is more preferable. The present application does not have special limitation to the source and model of the metal palladium, and the metal target from the source well known in the art can be used.

[0035] In the present application, the tool after the etching cleaning is preferably placed in a physical vapor deposition composite furnace body to perform subsequent high-power pulse magnetron sputtering. The present application does not have special limitation to the physical vapor deposition composite furnace, and the corresponding equipment well known in the art can be used.

[0036] In the present application, before the first high-power pulse magnetron sputtering is performed, the tool after the etching cleaning is preferably heated, and the temperature of the heating is preferably 300-500℃, more preferably 400℃. The present application releases the internal stress generated in the coating preparation process by heating, and improves the toughness of the coating. In addition, the high temperature can remove the impurities in the chamber of the equipment, and can improve the quality of the coating.

[0037] The present application does not have special limitation to the equipment used in the high-power pulse magnetron sputtering, and the corresponding equipment well known in the art can be used.

[0038] In the present application, the argon gas flow of the first high-power pulse magnetron sputtering is preferably 50-150sccm, more preferably 80-120sccm; the power is preferably 1-10kW, more preferably 2-5kW; the frequency is preferably 100-5000Hz, more preferably 1000-3000Hz; the pulse width is preferably 10-100μs, more preferably 50μs; and the deposition thickness is preferably 30-200nm, more preferably 80-150nm. The present application uses the metal primer layer as a transition layer, and the Ti, Cr or Ni metal has better bonding force with the nitrogen-doped diamond layer, and has good bonding force with the tool substrate, so that the metal primer layer can improve the bonding force between the tool and the coating.

[0039] After the metal primer layer is formed on the tool surface, the present application carries out second high-power pulse magnetron sputtering on the surface of the metal primer layer under nitrogen atmosphere with a carbon target as the target material to form a diamond-like carbon layer. The carbon target is not particularly limited in the present application, and the carbon target well known in the art can be used. In the present application, the argon gas flow rate of the second high-power pulse magnetron sputtering is preferably 50-150 sccm, more preferably 60-120 sccm; the nitrogen gas flow rate is preferably 10-50 sccm, more preferably 20-30 sccm; the power is preferably 1-10 kW, more preferably 3-5 kV; the frequency is preferably 100-5000 Hz, more preferably 1000-3000 Hz; the pulse width is preferably 10-100 μs, more preferably 50-80 μs; and the deposition thickness is preferably 100-3000 nm, more preferably 300-2800 nm. In the present application, the nitrogen doping amount in the diamond-like carbon layer is preferably 6-15 wt%, more preferably 9-11 wt%. In the present application, the nitrogen-doped diamond-like carbon layer is formed under nitrogen atmosphere with a carbon target as the target material. Nitrogen doping into the DLC coating layer can increase sp2 carbon bonds, thereby causing the release of residual stress and enhancing the wear resistance, so as to improve the hardness and lubricity of the coating layer.

[0040] After the diamond-like carbon layer is formed, the present application carries out third high-power pulse magnetron sputtering on the surface of the diamond-like carbon coating layer with an MCrAlY alloy as the target material to form an MCrAlY bonding layer. In the present application, M=Ni, Co or Ni+Co; when M is Ni+Co, the molar ratio of Ni to Co is preferably 1:(1-2). In the present application, the mass percentage of each component in the MCrAlY alloy is preferably M 60%, Cr 25%, Al 14% and Y 1%. The source of the MCrAlY alloy target material is not particularly limited in the present application, and the commercially available product well known in the art can be used.

[0041] In the present application, the argon gas flow rate of the third high-power pulse magnetron sputtering is preferably 50-150 sccm, more preferably 80-120 sccm; the power is preferably 1-10 kW, more preferably 2-5 kV; the frequency is preferably 100-5000 Hz, more preferably 1000-3000 Hz; the pulse width is preferably 10-100 μs, more preferably 50-80 μs; and the deposition thickness is preferably 30-200 nm, more preferably 80-150 nm. In the present application, the MCrAlY bonding layer is used as the oxide heat insulation layer and the bonding layer between the base alloy tool and the ceramic layer, thereby improving the oxidation resistance and corrosion resistance of the base high-temperature alloy and the bonding strength of the ceramic layer.

[0042] After forming the MCrAlY bonding layer, the fourth high-power pulse magnetron sputtering is performed on the surface of the MCrAlY bonding layer by taking an aluminum target or a zirconium target as a target material to form an oxide thermal barrier layer (ceramic layer). The aluminum target or the zirconium target used in the present application is not particularly limited and can be a commercially available product known in the art.

[0043] In the present application, the argon gas flow rate of the fourth high-power pulse magnetron sputtering is preferably 50-150 sccm, more preferably 80-120 sccm; the oxygen gas flow rate is preferably 10-80 sccm, more preferably 30-50 sccm; the power is preferably 1-30 kW, more preferably 3-20 kW; the frequency is preferably 100-5000 Hz, more preferably 1000-3000 Hz; the pulse width is preferably 10-100 μs, more preferably 50-80 μs; and the deposition thickness is preferably 20-500 nm, more preferably 40-100 nm, and further preferably 70 nm.

[0044] In the present application, the oxide thermal barrier layer is preferably an aluminum oxide layer or a zirconium oxide layer. The oxide thermal barrier layer is used to improve the high-temperature resistance and oxidation resistance of the coating, thereby prolonging the service life of the coated cutting tool.

[0045] Figure 1 The preparation process of the coated cutting tool of the present application is shown in FIG. 1. Figure 1 As shown in FIG. 1, the cutting tool is cleaned, the surface is pretreated (etched and cleaned) by a gas ion source, the first high-power pulse magnetron sputtering is performed to form a metal primer layer, the second high-power pulse magnetron sputtering is performed to form a diamond-like carbon layer, the third high-power pulse magnetron sputtering is performed to form a thermal barrier bonding layer, and the fourth high-power pulse magnetron sputtering is performed to form an oxide thermal barrier layer.

[0046] The present application provides a coated cutting tool prepared by the preparation method described above, which comprises a cutting tool and a metal primer layer, a diamond-like carbon layer, an MCrAlY bonding layer and an oxide thermal barrier layer which are sequentially stacked on the surface of the cutting tool; the metal primer layer comprises a Ti layer, a Cr layer or a Ni layer; and M=Ni, Co or Ni+Co. In the present application, the thickness of the metal primer layer is preferably 50-200 nm, more preferably 80-150 nm; the thickness of the diamond-like carbon layer is preferably 200-3000 nm, more preferably 300-2000 nm; the thickness of the MCrAlY bonding layer is preferably 50-200 nm, more preferably 80-150 nm; and the thickness of the oxide thermal barrier layer is preferably 20-500 nm, more preferably 100-300 nm.

[0047] The application provides application of the tool coating in the above technical solution in milling processing. The application method is not specially limited in the application, and the application according to the method well known in the art can be used.

[0048] The technical solutions in the application will be clearly and completely described below in combination with the embodiments in the application. Apparently, the described embodiments are only some of the embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0049] Embodiment 1

[0050] The tool used in the embodiment is a 2-blade long-neck ball-end mill, with the specification of R0.3*0.48*4*50*d4*D0.57;

[0051] S1: The above milling cutter is cleaned for 30 minutes by using sodium dodecyl sulfate detergent (80 DEG C), and then ultrasonic cleaning is performed for 20 minutes by using deionized water, and drying is performed at 80 DEG C;

[0052] S2: The cleaned milling cutter is etched and cleaned by using a gas ion source, and the etching and cleaning conditions are as follows: preparation voltage 100 V, argon 80 sccm, hydrogen 10 sccm, power 3 kW, and time 90 min; after the etching and cleaning, the milling cutter is placed in a physical vapor deposition composite furnace body;

[0053] S3: The milling cutter in the furnace is heated, the heating temperature is 400 DEG C, a Cr target is used as a target material, high-power pulse magnetron sputtering is performed, the argon gas flow is 80 sccm, the power is 5 kW, the frequency is 1000 Hz, the pulse width is 50 mu s, the deposition thickness is 80 nm, and a metal primer layer Cr layer is deposited on the surface of the milling cutter;

[0054] S4: A carbon target is used as a target material, high-power pulse magnetron sputtering is performed, the argon gas flow is 60 sccm, the nitrogen gas flow is 20 sccm, the power is 5 kW, the frequency is 1000 Hz, the pulse width is 50 mu s, the deposition thickness is 300 nm, a diamond-like layer DLC layer is formed on the surface of the metal primer layer, and the nitrogen doping amount is 11 wt%;

[0055] S5: A NiCrAlY alloy (Ni 60%, Cr 25%, Al 14% and Y 1%) is used as a target material, high-power pulse magnetron sputtering is performed, the argon gas flow is 80 sccm, the power is 5 kW, the frequency is 1000 Hz, the pulse width is 50 mu s, the deposition thickness is 80 nm, and a NiCrAlY bonding layer is deposited on the surface of the DLC layer;

[0056] S6: Aluminum target as target material, high power pulsed magnetron sputtering, argon gas flow 50sccm, oxygen gas flow 30sccm, power 3kW, frequency 1000Hz, pulse width 50μs, deposition thickness 100nm, forming aluminum oxide layer on the surface of the adhesive layer.

[0057] Example 2

[0058] The tool used in this embodiment is a 2-blade long-neck ball-end mill, with specifications R0.3*0.48*4*50*d4*D0.57;

[0059] S1: The above-mentioned milling cutter is cleaned with sodium dodecyl sulfate detergent (80℃) for 30 minutes, then ultrasonic cleaned with deionized water for 20 minutes, and dried at 80℃;

[0060] S2: The cleaned milling cutter is etched and cleaned using a gas ion source, with the following conditions: preparation voltage 100V, argon 80sccm, hydrogen 10sccm, power 3kW, time 90min; After etching and cleaning, the milling cutter is placed in a physical vapor deposition composite furnace body;

[0061] S3: The milling cutter in the furnace is heated to 400℃, and a Cr target is used as the target material for high power pulsed magnetron sputtering, with argon gas flow 80sccm, power 2kW, frequency 1000Hz, pulse width 50μs, and deposition thickness 30nm, to deposit a metal primer layer Cr on the surface of the milling cutter;

[0062] S4: A carbon target is used as the target material for high power pulsed magnetron sputtering, with argon gas flow 60sccm, nitrogen gas flow 20sccm, power 3kW, frequency 1000Hz, pulse width 50μs, and deposition thickness 100nm, to form a diamond-like layer DLC on the surface of the metal primer layer, with a nitrogen content of 9wt%;

[0063] S5: A NiCrAlY alloy (Ni 60%, Cr 25%, Al 14% and Y1%) is used as the target material for high power pulsed magnetron sputtering, with argon gas flow 80sccm, power 2kW, frequency 1000Hz, pulse width 50μs, and deposition thickness 30nm, to deposit a NiCrAlY adhesive layer on the surface of the DLC layer;

[0064] S6: Aluminum target as target material, high power pulsed magnetron sputtering, argon gas flow 50sccm, oxygen gas flow 30sccm, power 2kW, frequency 1000Hz, pulse width 50μs, deposition thickness 70nm, forming aluminum oxide layer on the surface of the adhesive layer.

[0065] Example 3

[0066] The cutter used in the embodiment is a 2-blade long-neck ball head end mill with specifications of R0.3*0.48*4*50*d4*D0.57;

[0067] S1: The above-mentioned end mill was cleaned with sodium dodecyl sulfate detergent (80°C) for 30 minutes, then ultrasonic cleaned with deionized water for 20 minutes, and dried at 80°C;

[0068] S2: The cleaned end mill was etched and cleaned using a gas ion source, and the etching and cleaning conditions were as follows: preparation voltage 100V, argon 80sccm, hydrogen 10sccm, power 3kW, and time 90min; after etching and cleaning, the end mill was placed in a physical vapor deposition composite furnace;

[0069] S3: The end mill in the furnace was heated to a temperature of 400°C, a Cr target was used as the target material, high-power pulsed magnetron sputtering was performed, argon gas flow was 80sccm, power was 5kW, frequency was 1000Hz, pulse width was 50μs, and the deposition thickness was 80nm, thereby depositing a metal primer layer Cr layer on the surface of the end mill;

[0070] S4: A carbon target was used as the target material, high-power pulsed magnetron sputtering was performed, argon gas flow was 60sccm, nitrogen gas flow was 20sccm, power was 5kW, frequency was 1000Hz, pulse width was 100μs, and the deposition thickness was 200nm, thereby forming a diamond-like layer DLC layer on the surface of the metal primer layer, and the nitrogen doping amount was 11wt%;

[0071] S5: A NiCrAlY alloy (Ni 60%, Cr 25%, Al 14% and Y 1%) was used as the target material, high-power pulsed magnetron sputtering was performed, argon gas flow was 80sccm, power was 5kW, frequency was 1000Hz, pulse width was 50μs, and the deposition thickness was 80nm, thereby depositing a NiCrAlY bonding layer on the surface of the DLC layer;

[0072] S6: An aluminum target was used as the target material, high-power pulsed magnetron sputtering was performed, argon gas flow was 50sccm, oxygen gas flow was 30sccm, power was 1kW, frequency was 1000Hz, pulse width was 50μs, and the deposition thickness was 40nm, thereby forming an aluminum oxide layer on the surface of the bonding layer.

[0073] Comparative Example 1

[0074] The cutter used in the embodiment is a 2-blade long-neck ball head end mill with specifications of R0.3*0.48*4*50*d4*D0.57;

[0075] S1: The above-mentioned end mill was cleaned with sodium dodecyl sulfate detergent (80°C) for 30 minutes, then ultrasonic cleaned with deionized water for 20 minutes, and dried at 80°C;

[0076] S2: The milled cutter after cleaning is etched and cleaned by using a gas ion source, and the etching and cleaning conditions are: a preparation voltage of 100 V, argon of 80 sccm, hydrogen of 10 sccm, a power of 3 kW, and a time of 90 min; after etching and cleaning, the milled cutter is placed in a physical vapor deposition composite furnace body;

[0077] S3: The milled cutter in the furnace is heated to a temperature of 400 DEG C, a Cr target is used as the target material, high-power pulsed magnetron sputtering is performed, argon is ventilated at a flow rate of 80 sccm, the power is 5 kW, the frequency is 1000 Hz, the pulse width is 50 mu s, the deposition thickness is 80 nm, and a metal primer layer Cr layer is deposited on the surface of the milled cutter;

[0078] S4: A carbon target is used as the target material, high-power pulsed magnetron sputtering is performed, argon is ventilated at a flow rate of 60 sccm, nitrogen is ventilated at a flow rate of 20 sccm, the power is 5 kW, the frequency is 1000 Hz, the pulse width is 50 mu s, the deposition thickness is 300 nm, and a diamond-like layer DLC layer is formed on the surface of the metal primer layer, and the nitrogen doping amount is 11wt%.

[0079] Comparative Example 2

[0080] The cutter used in the present comparative example is a 2-blade long-neck ball-end mill, and the specifications are R0.3*0.48*4*50*d4*D0.57;

[0081] S1: The above milled cutter is cleaned for 30 minutes by using a sodium dodecyl sulfate detergent solution (80 DEG C), and then ultrasonic cleaning is performed for 20 minutes by using deionized water, and then it is dried at 80 DEG C;

[0082] S2: The milled cutter in the furnace is heated to a temperature of 400 DEG C, a Cr target is used as the target material, high-power pulsed magnetron sputtering is performed, argon is ventilated at a flow rate of 80 sccm, the power is 5 kW, the frequency is 1000 Hz, the pulse width is 50 mu s, the deposition thickness is 80 nm, and a metal primer layer Cr layer is deposited on the surface of the milled cutter;

[0083] S3: A carbon target is used as the target material, high-power pulsed magnetron sputtering is performed, argon is ventilated at a flow rate of 60 sccm, nitrogen is ventilated at a flow rate of 20 sccm, the power is 5 kW, the frequency is 1000 Hz, the pulse width is 50 mu s, the deposition thickness is 300 nm, and a diamond-like layer DLC layer is formed on the surface of the metal primer layer, and the nitrogen doping amount is 11wt%.

[0084] S4: A NiCrAlY alloy (Ni 60%, Cr 25%, Al 14%, and Y 1%) is used as the target material, high-power pulsed magnetron sputtering is performed, argon is ventilated at a flow rate of 80 sccm, the power is 5 kW, the frequency is 1000 Hz, the pulse width is 50 mu s, the deposition thickness is 80 nm, and a NiCrAlY bonding layer is deposited on the surface of the DLC layer;

[0085] S5: taking the aluminum target as the target material, high-power pulse magnetron sputtering is carried out, argon gas flow is 50sccm, oxygen gas flow is 30sccm, power is 3kW, frequency is 1000Hz, pulse width is 50us, and the deposition thickness is 100nm, so that the aluminum oxide heat insulation layer is formed on the surface of the adhesive layer.

[0086] Performance test

[0087] 1) The coating prepared on the surface of the milling cutter in Example 1 is subjected to SEM test, and the obtained result is shown in Table 1. Figure 2 It can be known from Table 1 that the multilayer structure coating prepared in the application has high compactness. Figure 2

[0088] 2) The hardness of each layer of the coating prepared on the surface of the milling cutter in Example 1 is tested by using the nanoindentation method, and the result is shown in Table 2. Figure 3 It can be known from Table 2 that the surface nano-hardness of the DLC layer is 43GPa, and the nano-hardness of the aluminum oxide layer is 25GPa. Figure 3

[0089] 3) The adhesion between the coating and the cutter substrate prepared in Examples 1-3 and Comparative Examples 1-2 is tested by using the scratch method, and the obtained result is shown in Table 3. Figure 4 It can be known from Table 3 that the milling cutter in Examples 1-3 is etched and cleaned by using the gas ion source, which can effectively improve the surface adhesion of the coating compared with Comparative Example 2 which is not etched and cleaned; compared with Comparative Example 1, the adhesion of Example 2 is relatively close, which indicates that the adhesion is related to the gas ion source, surface pretreatment and primer layer process, and is less related to the heat insulation layer. Figure 4

[0090] 4) The coating milling cutter prepared in Examples 1-3 and Comparative Examples 1-2 is used for machining copper-tungsten alloy, the cutting speed is 56m / min, the feed speed is 500mm / min, the service life is monitored, and the uncoated milling cutter is used as a comparison; the results show that the service life of the uncoated milling cutter is 800min, the service life of the coating milling cutter of Example 1 is 1000min, the service life of the coating milling cutter of Example 2 is 920min, the service life of the coating milling cutter of Example 3 is 970min, the service life of the coating milling cutter of Comparative Example 1 is 850min, and the service life of the coating milling cutter of Comparative Example 2 is 820min.

[0091] The above only describes the preferred embodiments of the application, and it should be pointed out that, for ordinary skilled in the art, without departing from the principles of the application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered as the protection scope of the application.​​​

Claims

1. A method of producing a tool coating, characterized in that It consists of the following steps: After etching and cleaning the cutter by gas ion source method, a metal target is used as target material to form a metal primer layer on the surface of the etched and cleaned cutter by first high power pulse magnetron sputtering; the metal target includes Ti target, Cr target or Ni target; the cutter is a 2-blade long neck ball head vertical numerical control milling cutter; Under the condition of nitrogen, a carbon target is used as target material to form a nitrogen-doped diamond-like carbon layer on the surface of the metal primer layer by second high power pulse magnetron sputtering; the argon gas flow rate of the second high power pulse magnetron sputtering is 50-150 sccm, and the nitrogen gas flow rate is 10-50 sccm; the nitrogen-doped amount in the nitrogen-doped diamond-like carbon layer is 6-15 wt%; An MCrAlY alloy is used as target material to form an MCrAlY adhesive layer on the surface of the diamond-like carbon layer by third high power pulse magnetron sputtering; M = Ni, Co or Ni+Co; the deposition thickness is 30-200 nm; An aluminum target or a zirconium target is used as target material to form an oxide thermal barrier layer on the surface of the MCrAlY adhesive layer by fourth high power pulse magnetron sputtering; the deposition thickness is 20-500 nm.

2. The production method according to claim 1, characterized by, The argon gas flow rate of the first high power pulse magnetron sputtering is 50-150 sccm, the power is 1-10 kW, the frequency is 100-5000 Hz, the pulse width is 10-100 μs, and the deposition thickness is 30-200 nm.

3. The preparation method according to claim 1, characterized in that, The power of the second high power pulse magnetron sputtering is 1-10 kW, the frequency is 100-5000 Hz, the pulse width is 10-100 μs, and the deposition thickness is 100-3000 nm.

4. The method of claim 1, wherein, The argon gas flow rate of the third high power pulse magnetron sputtering is 50-150 sccm, the power is 1-10 kW, the frequency is 100-5000 Hz, and the pulse width is 10-100 μs.

5. The preparation method according to claim 1, characterized in that, The argon gas flow rate of the fourth high power pulse magnetron sputtering is 50-150 sccm, the oxygen gas flow rate is 10-80 sccm, the power is 1-30 kW, the frequency is 100-5000 Hz, and the pulse width is 10-100 μs.

6. The method of claim 1, wherein, The voltage of the etching and cleaning is 20-400 V, the argon gas flow rate is 50-120 sccm, the hydrogen gas flow rate is 5-20 sccm, the power is 1-5 kW, and the time is 30-190 min.

7. The preparation method according to claim 1, characterized in that, Before the first high power pulse magnetron sputtering, the etched and cleaned cutter is heated, and the heating temperature is 300-500 ℃.

8. The cutter coating prepared by the preparation method of any one of claims 1-7, comprising a cutter and a metal primer layer, a diamond-like carbon layer, an MCrAlY adhesive layer and an oxide thermal barrier layer sequentially stacked on the surface of the cutter; the metal primer layer comprises a Ti layer, a Cr layer or a Ni layer; M = Ni, Co or Ni+Co.

9. The application of the cutter coating of claim 8 in milling machining.

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