Pixel defining layer preparation method

Abstract

This invention relates to a method for preparing a pixel defining layer, comprising: coating and layering a photosensitive composition; pre-baking; exposure; development; and a post-baking step. The oven temperature for the post-baking step is 210°C to 300°C, the duration of the post-baking step is 30 minutes to 120 minutes, the amount of smoke generated during the post-baking step is 86 ppm or more, and the amount of degassing occurring after the post-baking step is 15 ppm or less. This invention improves color clarity by presenting a colored pattern with low degassing on the electrode substrate, thereby enhancing the reliability and extending the lifespan of the display.

Description

Technical Field

[0001] This invention relates to a method for preparing a pixel defining layer for a light-emitting display device using a photosensitive composition. Background Technology

[0002] Flat panel displays widely use liquid crystal displays (LCDs) and organic light-emitting displays (OLEDs). Among them, organic light-emitting displays have advantages such as low power consumption, fast response speed, high color reproduction rate, high brightness, and wide viewing angle.

[0003] The purpose of using a polarizing film in the organic light-emitting display device is to block the light reflected from the panel after incident external light. Its drawback is that, due to its lack of bending characteristics, it is not suitable for use in flexible devices.

[0004] To address these issues, previous suggestions have included using color filters, a black matrix, and forming a light-shielding inorganic film on the upper substrate. However, these methods have limitations in achieving the desired level of anti-reflection effect and do not specifically provide alternatives to polarizing films.

[0005] In addition, the colored patterns, used as red, green, and blue color filters, are not only used in liquid crystal displays but also in organic light-emitting displays.

[0006] When manufacturing the colored pattern, a variety of organic pigments, as well as carbon black and inorganic pigments, are used as colorants, and their isodispersed pigment dispersions are mixed with other compositions to form the pattern.

[0007] When organic light-emitting diodes (OLEDs) form pixels using the methods described above, they can produce clearer colors. However, excessive degassing of the coloring pattern can lead to problems such as pixel shrinkage, dark spots, and electrode oxidation, which can shorten the lifespan and reduce the brightness of the OLED. Summary of the Invention

[0008] The problem to be solved

[0009] In order to overcome the above-mentioned drawbacks of traditional technology, the purpose of one embodiment of the present invention is to make the colors clearer by presenting a colored pattern with less degassing on the electrode substrate, thereby improving the reliability and extending the life of the display.

[0010] That is, when the degassing amount on the panel is above 15ppm after the post-baking process, it will cause pixel shrinkage, which will lead to a decrease in brightness and a shortened lifespan. In view of this, the purpose of the present invention is to generate enough fume in the post-baking process to minimize the occurrence of out-gas in the panel state, so as to minimize the degassing amount after the post-baking process is completed.

[0011] Another implementation aims to provide an organic light-emitting display device including a pixel-defining layer prepared by the method.

[0012] Another implementation aims to provide an electronic device that includes the aforementioned organic light-emitting display device.

[0013] Problem Solution

[0014] According to the present invention, the method for preparing a pixel defining layer includes: coating and layering a photosensitive composition; pre-baking; exposure; development; and a post-baking step. Preferably, the oven temperature of the post-baking step is 210°C to 300°C, the duration of the post-baking step is 30 minutes to 120 minutes, the amount of smoke generated in the post-baking step is 86 ppm or more, and the amount of degassing that occurs after the post-baking step is 15 ppm or less.

[0015] More preferably, the oven temperature for the post-baking step is 250°C to 270°C.

[0016] More preferably, the post-baking process takes 60 to 120 minutes.

[0017] Preferably, the photosensitive composition contains a colorant.

[0018] Preferably, the colorant comprises one or more of inorganic dyes, organic dyes, inorganic pigments, and organic pigments.

[0019] Preferably, the colorant content in the total amount of the photosensitive composition is 1 to 40% by weight.

[0020] Preferably, the colorant is pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0021] Preferably, the average particle size of the colorant is 20 nm to 110 nm.

[0022] Preferably, the photosensitive composition comprises a photolithography resin, which comprises an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0023] Preferably, the acrylic adhesive resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

[0024] Preferably, the cardo-based adhesive resin comprises a repeating structure represented by the following chemical formula 1:

[0025] <Chemical Formula 1>

[0026]

[0027] In the chemical formula 1,

[0028] 1) R1 and R2 are independently: hydrogen; deuterium; halogen; C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 Heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2-C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group,

[0029] 2) R1 and R2 can form a ring between adjacent bases.

[0030] 3) m or n are independent integers from 0 to 4.

[0031] 4) A1 and A2 are independently chemical formulas 2 or 3.

[0032] <Chemical Formula 2>

[0033]

[0034] <Chemical Formula 3>

[0035]

[0036] In chemical formulas 2 and 3,

[0037] 4-1) Indicates the connected parts.

[0038] 4-2) R3 to R6 are independently: hydrogen; deuterium; halogen; C6 to C6. 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 Heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2-C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group,

[0039] 4-3) R3 to R6 can form rings between adjacent bases.

[0040] 4-4) Y1 and Y2 are independently chemical formulas 6 or 7.

[0041] <Chemical Formula 6>

[0042]

[0043] <Chemical Formula 7>

[0044]

[0045] In the chemical formulas 6 and 7,

[0046] 4-4-1) Indicates the bonding location,

[0047] 4-4-2) R9 is hydrogen or methyl ester;

[0048] 4-4-3)R 10 ~R13 Independently defined: hydrogen; deuterium; halogen; C6–C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxycarbonyl group,

[0049] 4-4-4) L1 to L3 are independently: single bonds; fluorene group; C2 to C3. 30 Alkylene; C6~C 30 arylene; C2~C 30 Heterocyclic rings; C1~C 30 alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 Polyethyleneoxy group

[0050] 4-4-5) q and r are independent integers from 0 to 3; however, q + r = 3.

[0051] 5) The resin comprises repeating units represented by chemical formula 1, wherein the ratio of A1 to A2 within the polymer chain is 9:1 to 1:9.

[0052] 6) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formulas 4; or chemical formula 5,

[0053] 6-1) R' and R" are independently: hydrogen; deuterium; halogen; C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxycarbonyl group,

[0054] 6-2) R' and R" can form rings between adjacent bases.

[0055] <Chemical Formula 4>

[0056]

[0057] <Chemical Formula 5>

[0058]

[0059] In the chemical formulas 4 and 5 mentioned above

[0060] 6-3) Indicates the bonding location,

[0061] 6-4) R7 to R8 are independently: hydrogen; deuterium; halogen; C6 to C6. 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxycarbonyl group,

[0062] 6-5) o and p are independent integers from 0 to 4.

[0063] 7) X2 is C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenylene group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group,

[0064] 8) R', R", X2, L1~L3, R1~R8 and R 10 ~R 13 It can be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted C1 to C2. 30 Alkyl group or C6-C 30Aryl (aryl group); silane (silane group); siloxane (siloxane group); boron group; germanium group; cyano (cyano group); amino group; nitro (nitro group); C1-C 30 alkylthio group; C1~C 30 alkoxy group; C6~C 30 aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 alkenyl group; C2~C 30 alkinyl group; C6~C 30 Aryl group; C6-C6 substituted with deuterium 30 Aryl group; fluorenyl group; C2~C 30 The heterocyclyl group contains at least one heteroatom selected from the group consisting of O, N, S, Si, and P; C3~C 30 Aliphatic cyclic groups; C7~C 30 aryl alkyl group; C8~C 30 aryl alkenyl group; and combinations thereof, and adjacent substituents may form rings.

[0065] Preferably, the cardo-based resin has a weight average molecular weight of 1,000 to 100,000 g / mol.

[0066] Preferably, the content of the cardo resin in the total amount of the photosensitive composition is 1 to 30% by weight.

[0067] Preferably, the photosensitizing composition comprises: a reactive unsaturated compound in an amount of 1 to 40% by weight in its total amount.

[0068] Preferably, the photosensitive composition comprises a photoinitiator in an amount of 0.01 to 10% by weight in its total amount.

[0069] In another specific example, preferably, the present invention provides a pixel defining layer prepared by the preparation method described above.

[0070] In another specific example, preferably, the present invention provides an organic light-emitting display device including the pixel defining layer.

[0071] In another specific example, preferably, the present invention provides an electronic device that includes the display device and a control unit for driving the display device.

[0072] Invention Effects

[0073] The objective of this invention is to improve color clarity, thereby enhancing display reliability and extending its lifespan by presenting a colored pattern with minimal degassing on the electrode substrate. Specifically, when the degassing level on the panel exceeds 15 ppm after post-baking, pixel shrinkage occurs, leading to reduced brightness and shortened lifespan. Therefore, this invention incorporates a colorant that generates sufficient fume during the post-baking process to minimize out-gassing on the panel, resulting in minimal degassing after the post-baking process. Attached Figure Description

[0074] Figure 1 and Figure 2 This is a schematic diagram of the pixel boundary layer captured in comparisons 1 to 6.

[0075] Figures 3 to 6 These are schematic diagrams of the pixel-defining layers captured in Examples 1 to 12. Detailed Implementation

[0076] Hereinafter, some embodiments of the present invention will be described in detail with reference to the schematic diagrams. When using reference numerals to denote constituent elements of the various figures, the same constituent elements will be given the same numerals as much as possible, even when shown in other figures.

[0077] In describing this invention, detailed descriptions of related well-known structures or functions may be omitted if they are considered to obscure the essence of the invention. When the invention uses terms such as "comprising," "having," or "forming," other parts may be added unless "only" is used. When a constituent element is expressed in the singular, it includes cases expressed in the plural unless specifically stated otherwise.

[0078] Furthermore, in describing the constituent elements of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish its constituent elements from other constituent elements, and the nature, order, sequence, or number of the constituent elements are not limited by the terms.

[0079] When describing the positional relationship of constituent elements, and mentioning that two or more constituent elements achieve "connection," "combination," or "access," it should be understood that two or more constituent elements can be directly "connected," "combined," or "accessed," but they can also be further "included" by two or more constituent elements and other constituent elements to achieve "connection," "combination," or "access." Among these, other constituent elements can include one or more of the two or more constituent elements that are mutually "connected," "combined," or "accessed."

[0080] Furthermore, when a component such as a layer, membrane, region, or plate is located "on" or "above" another component, it should be understood that this includes not only being located "directly above" another component, but also having another component in between. Conversely, when a component is located "directly above" another part, it should be understood that there is no other part in between.

[0081] When describing time-flow relationships related to constituent elements, work methods, or manufacturing methods, such as describing time sequence relationships or process sequence relationships like "after," "next," "then," or "before," since "immediately" or "directly" is not used, discontinuous situations can be further included.

[0082] In addition, when referring to the numerical values ​​of constituent elements or their corresponding information, even if not explicitly stated separately, it should be interpreted that the numerical values ​​or their corresponding information include the range of errors caused by various factors (e.g., engineering factors, internal or external impacts, noise, etc.).

[0083] Unless otherwise stated, the terminology used in this specification and the appended claims is as follows without departing from the spirit of the invention.

[0084] Unless otherwise stated, the terms “halo” or “halogen” as used in this application include fluorine (F), chlorine (Cl), bromine (Br) and iodine (I).

[0085] Unless otherwise stated, the term "alkyl" or "alkyl group" as used herein refers to a radical containing 1 to 60 carbons linked by a single bond, representing a free radical of a saturated aliphatic functional group, such as a straight-chain alkyl group, a branched alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, or a cycloalkyl-substituted alkyl group.

[0086] Unless otherwise stated, the terms “haloalkyl group” or “halogenalkyl group” as used in this application refer to halogen-substituted alkyl groups.

[0087] Unless otherwise stated, the terms “alkenyl” or “alkynyl” as used herein have double or triple bonds, contain straight or side-chain groups, and have 2 to 60 carbons, but are not limited thereto.

[0088] Unless otherwise stated, the term "cycloalkyl" as used in this application refers to a cyclic alkane having 3 to 60 carbons, but is not limited thereto.

[0089] As used in this application, the term "alkoxy group" or "alkyloxy group" refers to an alkyl group that bonds to an oxygen radical and has 1 to 60 carbons unless otherwise described, but is not limited thereto.

[0090] As used in this application, the terms "alkenoxyl group", "alkenoxyl group", "alkenyloxyl group" or "alkenyloxyl group" refer to an alkenyl group that binds oxygen free radicals and, unless otherwise described, has 2 to 60 carbons, but are not limited thereto.

[0091] Unless otherwise stated, the terms "aryl group" and "arylenel group" as used in this application refer to compounds having 6 to 60 carbons, but are not limited thereto. In this application, aryl group or arylenel group includes monocyclic, cyclic polymeric, and fused polycyclic compounds. For example, the aryl group may include phenyl group, monovalent functional groups of biphenyl, monovalent functional groups of naphthalene, fluorenyl group, and substituted fluorenyl group. The arylenel group may include fluorenylene group and substituted fluorenylene group.

[0092] As used in this application, the term "ring assemblies" refers to two or more ring systems (monocyclic or fused ring systems) directly linked by single or double bonds, indicating that the number of directly linked rings is less than the total number of ring systems contained in the compound. Ring assemblies can consist of the same or different ring systems directly linked by single or double bonds.

[0093] In this application, the aryl group includes cyclic polymers; therefore, the aryl group includes biphenyl and terphenyl compounds, which are monocyclic aromatic compounds with benzene rings linked by single bonds. Furthermore, the aryl group also includes compounds with aromatic ring systems fused to aromatic monocyclic rings and linked by single bonds; therefore, for example, it also includes compounds with aromatic ring systems fused to benzene rings, i.e., fluorene, linked by single bonds.

[0094] As used in this application, the term "fused polycyclic system" refers to a ring structure that shares at least two atoms and is fused together, including: a morphology of fused two or more hydrocarbon ring systems and a morphology of fused at least one heterocyclic system containing at least one heteroatom. The fused polycyclic system can be an aromatic ring, an aromatic heterocycle, an aliphatic ring, or a combination thereof. For example, the aryl group can be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0095] The term "spiro compound" as used in this application has the connotation of "spiro union," which refers to a connection formed by two rings sharing only one atom. In this case, the atom shared by the two rings is called the "spiro union atom," and according to the number of spiro atoms contained in a compound, it is referred to as a "monospiro-", "dispiro-", or "trispiro-" compound.

[0096] Unless otherwise stated, the terms "fluorenyl group," "fluorenylene group," and "fluorene-triyl group" used in this application respectively indicate that R, R', R" and R'" are all monovalent, divalent, or trivalent functional groups of hydrogen. "Substituted fluorenyl group," "substituted fluorenylene group," or "substituted fluorene-triyl group" indicates that at least one of the substituents R, R', R" and R'" is a substituent other than hydrogen, including cases where R and R' are bonded to each other and together with the carbon atoms bonded thereto, form a spiro compound. In this specification, the terms fluorenyl group, fluorenylene group, and fluorene-triyl group are all referred to as fluorenyl group, regardless of monovalent, divalent, or trivalent valence.

[0097]

[0098] Furthermore, R, R', R" and R'" can each independently be: an alkyl group having 1 to 20 carbons, an alkenyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, or a heterocyclyl group having 2 to 30 carbons. For example, the aryl group can be phenyl, biphenyl, naphthalene, anthracene, or phenanthrene, and the heterocyclyl group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidone, pyridazine, pyrazine, triazine, indole, or benzofuran. furan, quinazoline, or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group can be monovalent or divalent functional groups of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi[9H-fluorene].

[0099] The term "heterocyclyl group" as used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylenel group," but also non-aromatic rings, which, unless otherwise described, refer to rings containing one or more heteroatoms and having 2 to 60 carbon atoms, but are not limited thereto. Unless otherwise described, the term "heteroatom" as used in this application means N, O, S, P, or Si, and "heterocyclyl group" refers to monocyclic, cyclic polymer, fused polycyclic, or spiro compounds containing heteroatoms.

[0100] For example, "heterocyclyl group" can also replace cyclic carbon, including compounds containing heteroatom end groups such as SO2 and P=O.

[0101]

[0102] The term "ring" as used in this application includes monocyclic and polycyclic rings. Of course, hydrocarbon rings include heterocyclic rings containing at least one hetero atom and containing aromatic and non-aromatic rings.

[0103] As used in this application, the term "polycyclic" includes ring assemblies such as biphenyl and terphenyl, as well as fused polycyclic systems and spiro compounds, including not only aromatic but also non-aromatic compounds. Of course, hydrocarbon rings include heterocycles containing at least one hetero atom.

[0104] As used in this application, the term "cyclo group" refers to cyclic hydrocarbons other than aromatic hydrocarbons, including monocyclic, cyclic polymers, fused polycyclic systems, spiro compounds, etc., and unless otherwise stated, it refers to a ring with 3 to 60 carbon atoms, but is not limited thereto. For example, when combined with aromatic cyclobenzenes and non-aromatic cyclohexanes, it is also equivalent to an aliphatic ring.

[0105] Furthermore, when using prefixes consecutively in naming, it indicates that the substituents are arranged in the order they are recorded. For example, aryl alkoxy group indicates an alkoxy group substituted with an aryl group, alkoxy carbonyl group indicates a carbonyl group substituted with an alkoxy group, and aryl carbonyl alkenyl group indicates an alkenyl group substituted with an aryl carbonyl group, where aryl carbonyl group is a carbonyl group substituted with an aryl group.

[0106] Furthermore, unless explicitly stated otherwise, in the term "substituted or unsubstituted" as used in this application, "substituted" means substituted with one or more substituents selected from the group consisting of: deuterium, halogen, amino group, nitrile group, nitro group, C1-C1 groups, etc. 30 Alkyl group, C1-C 30 alkoxy group, C1-C 30 alkylamine group, C1-C 30 alkyl thiophene group, C6~C 30 arylthiophene group, C2-C 30 alkenyl group, C2-C 30 alkinyl group, C3-C 30 Cycloalkyl group, C6-C 30 aryl group, C6-C substituted with deuterium 30 aryl group, C8-C 30 aryl alkenyl group, silane group, boron group, germanium group, and C2-C 30 The heterocyclic group, C2~C 20 The heterocyclic group includes at least one heteroatom selected from the group consisting of O, N, S, Si, and P. Furthermore, it is not limited by any of its substituents.

[0107] In this application, the 'functional group name' corresponding to the aryl group, arylenel group, heterocyclyl group, etc., as described in the examples of each label and its substituents can be recorded as 'functional group name reflecting valence' or as 'name of parent compound'. For example, 'phenanthrene' is an aryl group, and the name of the 'group' can be recorded according to valence, such as recording a monovalent 'group' as 'phenanthryl (group)' and a divalent 'group' as 'phenanthrylene (group)', etc. However, it is also possible to disregard valence and record it as the name of the parent compound 'phenanthrene'.

[0108] Similarly, pyrimidone can be written as 'pyrimidone' regardless of its valence, or, if monovalent, as pyrimidinyl (group), and if divalent, as the name of the group with the corresponding valence, such as pyrimidinylene (group). Therefore, in this application, when the type of substituent is written as the name of the parent compound, it can represent an n-valent 'group' formed by the desorption of hydrogen atoms bonded to carbon atoms and / or heteroatoms of the parent compound.

[0109] Furthermore, in this specification, when listing compound names or substituent names, numbers or letters indicating positions may be omitted. For example, pyrido[4,3-d]pyrimidone may be listed as pyrido pyrimidone, benzo furan[2,3-d]pyrimidone as benzo furan pyrimidone, and 9,9-dimethyl-9H-fluorene as dimethylfluorene, etc. Therefore, benzo[g]quinoxaline or benzo[f]quinoxaline may both be listed as benzo quinoxaline.

[0110] Furthermore, unless otherwise stated, the chemical formulas used in this application are also subject to the definitions of substituents based on the following definitions of chemical formulas.

[0111]

[0112] When a is an integer of 0, it represents the substituent R. 1 This does not exist; that is, when a is 0, all carbons forming the benzene ring are bonded to hydrogen. In this case, the labeling of the hydrogens bonded to the carbons can be omitted, and the chemical formula or compound can be written. Furthermore, when a is an integer of 1, one substituent R... 1 It bonds to any carbon atom in the benzene ring. When a is an integer of 2 or 3, the bonding can be as follows. When a is an integer from 4 to 6, a similar method can be used to bond to the carbon atom in the benzene ring. When a is an integer greater than 2, R... 1 They can be the same or different.

[0113]

[0114] In this application, unless otherwise described, forming a ring means that adjacent bases bond together to form a monocyclic ring or a fused polycyclic ring. The monocyclic ring and the fused polycyclic ring include not only hydrocarbon rings but also heterocycles containing at least one heteroatom and may include aromatic and non-aromatic rings.

[0115] Furthermore, in this specification, unless otherwise stated, when referring to condensed rings, the number in 'number-condensed ring' indicates the number of condensed rings. For example, the morphology of three rings condensed together can be represented as a 3-condensed ring, such as anthracene, phenanthrene, benzoquinozoline, etc.

[0116] Furthermore, unless otherwise stated, the term "bridged bicyclic compound" as used in this application refers to a compound in which two rings share three or more atoms to form a ring. In this case, the shared atoms may include carbon or heteroatoms.

[0117] In this application, organic electrical element means (a number of) components between an anode and a cathode, or means an organic light-emitting diode (OLED) including (a number of) components located between the anode and the cathode and therebetween.

[0118] Furthermore, depending on the context, the display device in this application refers to organic electronic components, organic light-emitting diodes (OLEDs), and panels including them, or electronic devices including panels and circuitry. For example, electronic devices include all lighting devices, solar cells, portable or mobile terminals (e.g., smartphones, tablets, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., but are not limited thereto; any device of any form can be used as long as it includes the aforementioned components(s).

[0119] Hereinafter, implementation examples of the present invention will be described in detail. However, these are merely illustrative examples, and the present invention is not limited thereto; it is defined only by the scope of the following claims.

[0120] According to one embodiment of the present invention, a composition containing a colorant can be used to prepare red patterns, green patterns, blue patterns or black matrices, or pixel delimiting layers (PDLs).

[0121] According to one embodiment of the present invention, the black pixel definition layer (PDL) may further include additional colorants besides those contained in the colorant, i.e., organic black pigments or black dyes. For example, organic pigments may be used alone or in combination with colorant pigments. The advantage in this case is that, due to the mixing of colorant pigments with insufficient opacity, even if the amount of colorant is relatively increased, the strength of the film (layer) or the adhesion to the substrate will not decrease. According to one embodiment of the present invention, the negative pixel definition layer (PDL) may include additional colorants, i.e., black pigments or black dyes, in place of the colorants contained in the colorant.

[0122] The following is a detailed description of each component.

[0123] 1. The fabrication process of the negative pixel boundary layer is as follows.

[0124] (1) Coating and coating steps

[0125] The photosensitive composition is a low-viscosity liquid reagent. To form a coating of a certain thickness after coating the substrate, a spin coater or a slot coater is used. The advantage of a spin coater is that the higher the rotation number, the thinner the coating, but the flatness deviation within the area is reduced. For forming a coating on a large area substrate, a slot coater is preferred over a spin coater; however, its disadvantage is that after coating formation, the surface exhibits fluidity due to residual solvent, leading to decreased flatness. To overcome this disadvantage, a vacuum chamber dryer (VCD) is used to locally remove the solvent, thereby reducing surface fluidity.

[0126] (2) Pre-baking steps

[0127] This process involves heating the substrate of the coating using a hot plate or oven at a specific temperature and time to locally remove the solvent contained in the coating film. If the surface or deeper parts of the coating film are not dry, it will cause photomask contamination during the next exposure process. When exposed to ultraviolet light, the exposed areas will not cure properly. If it is not cured, the development process will fail to form and will remove the pattern.

[0128] (3) Exposure steps

[0129] After the pre-baking process is completed, the process uses a patterned photomask to irradiate photochemical rays (ultraviolet light) to cure the formed film. The types of lamps that generate photochemical rays include LED lamps or mercury lamps, with wavelengths including g-line (436nm), h-line (405nm), i-line (365nm), and Deep UV (<260nm), which can be used individually or in combination.

[0130] (4) Development step

[0131] During the exposure step, when photochemical rays are irradiated, the photomask is divided into exposed and non-exposed areas. In the positive type, the exposed areas are dissolved by the developer, while the non-exposed areas resist the developer and leave a pattern. In the negative type, the exposed areas are cured and resistant to the developer, while the non-exposed areas are developed. The black pixel defining layer (Black PDL) prepared using a composition containing the colorant described in this invention is negative and can be divided into exposed (cured) and non-exposed (developed) areas to form a pattern.

[0132] (5) Post-drying process

[0133] This process involves heating the developed substrate at a high temperature above 210°C to remove residual solvents and fumes. If the process does not completely remove the solvents and fumes, degassing will occur during the post-baking process, affecting the components and thus impacting black spots or pixel shrinkage.

[0134] 2. The composition for forming a negative pixel delimiting layer containing a colorant is as follows.

[0135] (1) Photolithography resin

[0136] According to one embodiment of the present invention, the photolithography resin may comprise an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0137] The acrylic adhesive resin is a copolymer of a first vinyl unsaturated monomer and a second vinyl unsaturated monomer that can be copolymerized therewith, and is a resin comprising one or more repeating acrylic units.

[0138] The first vinyl unsaturated monomer is an vinyl unsaturated monomer containing one or more carboxyl groups, and specific examples include: acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or combinations thereof. The content of the first vinyl unsaturated monomer in the total amount of the acrylic adhesive resin can be from 5% to 50% by weight, for example, from 10% to 40% by weight.

[0139] The second vinyl unsaturated monomer can be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinyl benzyl methyl ether, etc.; unsaturated carboxylic acid esters such as methacrylate, ethylacrylate, butylacrylate, 2-hydroxyethylacrylate, 2-hydroxybutylacrylate, benzylacrylate, cyclohexylacrylate, phenylacrylate, etc.; unsaturated carboxylic acid aminoalkyl esters such as 2-aminoethylacrylate, 2-dimethylaminoethylacrylate; vinyl acetate and other carboxylic acid vinyl esters; glycidyl acrylate and other unsaturated carboxylic acid glycidyl esters; vinyl cyanide compounds such as (m)acrylonitrile; unsaturated amide compounds such as (m)acrylamide; etc., and can be used alone or in combination of two or more.

[0140] Specific examples of the acrylic adhesive resins include: (m)acrylic acid / benzyl methacrylate copolymer, (m)acrylic acid / benzyl methacrylate / styrene copolymer, (m)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (m)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., but are not limited thereto. They can also be used alone or in combination of two or more. The weight average molecular weight of the acrylic adhesive resin can be from 3,000 g / mol to 150,000 g / mol, for example, from 5,000 g / mol to 50,000 g / mol, for example, from 20,000 g / mol to 30,000 g / mol.

[0141] Cardo-based resins include repeating structures represented by the following chemical formula 1.

[0142] <Chemical Formula 1>

[0143]

[0144] In the chemical formula 1,

[0145] 1) R1 and R2 are independently: hydrogen; deuterium; halogen; C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 Heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2-C 20alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group,

[0146] 2) R1 and R2 can form a ring between adjacent bases.

[0147] 3) m or n are independent integers from 0 to 4.

[0148] 4) A1 and A2 are independently chemical formulas 2 or 3.

[0149] <Chemical Formula 2>

[0150]

[0151] <Chemical Formula 3>

[0152]

[0153] In chemical formulas 2 and 3,

[0154] 4-1) Indicates the connected parts.

[0155] 4-2) R3 to R6 are independently: hydrogen; deuterium; halogen; C6 to C6. 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 Heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2-C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group,

[0156] 4-3) R3 to R6 can form rings between adjacent bases.

[0157] 4-4) Y1 and Y2 are independently chemical formulas 6 or 7.

[0158] <Chemical Formula 6>

[0159]

[0160] <Chemical Formula 7>

[0161]

[0162] In the chemical formulas 6 and 7,

[0163] 4-4-1) Indicates the bonding location,

[0164] 4-4-2) R9 is hydrogen or methyl ester;

[0165] 4-4-3)R 10 ~R 13 Independently defined: hydrogen; deuterium; halogen; C6–C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20The alkoxycarbonyl group,

[0166] 4-4-4) L1 to L3 are independently: single bonds; fluorene group; C2 to C3. 30 Alkylene; C6~C 30 arylene; C2~C 30 Heterocyclic rings; C1~C 30 alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 Polyethyleneoxy group

[0167] 4-4-5) q and r are independent integers from 0 to 3; however, q + r = 3.

[0168] 5) The resin comprises repeating units represented by chemical formula 1, wherein the ratio of A1 to A2 within the polymer chain is 9:1 to 1:9.

[0169] 6) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formulas 4; or chemical formula 5,

[0170] 6-1) R' and R" are independently: hydrogen; deuterium; halogen; C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20The alkoxycarbonyl group,

[0171] 6-2) R' and R" can form rings between adjacent bases.

[0172] <Chemical Formula 4>

[0173]

[0174] <Chemical Formula 5>

[0175]

[0176] In the chemical formulas 4 and 5 mentioned above

[0177] 6-3) Indicates the bonding location,

[0178] 6-4) R7 to R8 are independently: hydrogen; deuterium; halogen; C6 to C6. 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 Heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2-C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group,

[0179] 6-5) o and p are independent integers from 0 to 4.

[0180] 7) X2 is C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenylene group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group,

[0181] 8) R', R", X2, L1~L3, R1~R8 and R 10 ~R 13 It can be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted C1 to C2. 30 Alkyl group or C6-C 30 Aryl (aryl group); silane (silane group); siloxane (siloxane group); boron group; germanium group; cyano (cyano group); amino group; nitro (nitro group); C1-C 30 alkylthio group; C1~C 30 alkoxy group; C6~C 30 aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 alkenyl group; C2~C 30 alkinyl group; C6~C 30 Aryl group; C6-C6 substituted with deuterium 30 Aryl group; fluorenyl group; C2~C 30The heterocyclyl group contains at least one heteroatom selected from the group consisting of O, N, S, Si, and P; C3~C 30 Aliphatic cyclic groups; C7~C 30 aryl alkyl group; C8~C 30 aryl alkenyl group; and combinations thereof, and adjacent substituents may form rings.

[0182] The terms R', R", X2, L1~L3, R1~R8 and R 10 ~R 13 When it is an aryl group, it is preferably C6 to C6. 30 The aryl group, more preferably, can be C6-C6. 18 The aryl group can be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0183] The terms R', R", X2, L1~L3, R1~R8 and R 10 ~R 13 When the group is a heterocyclyl group, it is preferably C2 to C3. 30 The heterocyclyl group, more preferably, can be C2 to C3. 18 The heterocyclyl group can be, for example, dibenzo furan, dibenzo thiophen, naphthobenzo thiophen, naphthobenzo furan, etc.

[0184] The R', R", R1 to R8 and R 10 ~R 13 When the fluorenyl group is used, it is preferably 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl, 9,9'-spirobi-fluorene, etc.

[0185] When L1 to L3 are arylene groups, preferably they can be C6 to C3. 30 The arylene group, more preferably, can be C6-C6. 18 The arylene group can be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0186] The R', R", X2, R1 to R8 and R 10 ~R 13 When the alkyl group is used, it is preferably C1 to C2. 10 Alkyl group, for example, can be methyl, t-butyl, etc.

[0187] The R', R", X2, R1 to R8 and R 10 ~R 13 When the group is alkoxy group, it is preferably C1 to C2. 20 The alkoxy group, more preferably, can be C1 to C2. 10 The alkoxy group can be, for example, methoxy, butoxy, etc.

[0188] The terms R', R", X2, L1~L3, R1~R8 and R 10 ~R 13 The ring formed by bonding adjacent bases can be C6 to C6. 60 Aromatic cyclic groups; fluorenyl group; C2-C2 groups containing at least one heteroatom from O, N, S, Si, and P. 60 heterocyclyl group; or C3~C 60 When aliphatic ring groups, for example, adjacent groups bond together to form an aromatic ring, preferably, C6 to C6 rings can be formed. 20 The aromatic ring, more preferably, can form C6-C6 rings. 14 Aromatic rings, for example, can form benzene, naphthalene, phenanthrene, etc.

[0189] For example, the Cardo-based resin can be prepared by mixing two or more of the following components: fluorene-containing compounds such as 9,9-bis(4-epoxyethylene methoxyphenyl)fluorene; anhydride compounds such as phenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, perylenetetracarboxylic dianhydride, tetrahydrofurantetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; ethanol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol monomethyl ether acetate and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and ammonium or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylammonium, triethylammonium, tributylammonium, and benzyltriethylammonium chloride.

[0190] The cardo-based resin has a weight-average molecular weight of 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. If the weight-average molecular weight of the resin falls within this range, no residue is generated during the fabrication of the patterned layer, resulting in excellent pattern formation. Furthermore, there is no loss of film thickness during development, leading to a good pattern. The resin content in the total amount of the photosensitive resin composition is 1 to 30% by weight, more preferably 3 to 20% by weight. When the resin content falls within this range, excellent sensitivity, developability, and adhesion (bearing capacity) can be obtained.

[0191] (2) Reactive unsaturated compounds

[0192] Reactive unsaturated compounds are essential components of negative patterns. They have ethylene-like unsaturated double bonds, so during the exposure process of pattern formation, sufficient polymerization can be initiated to form patterns with excellent heat resistance, light resistance and chemical resistance.

[0193] Specific examples of the reactive unsaturated compounds include: ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, and tripentaerythritol octaacrylate.

[0194] Commercially available products of the aforementioned reactive unsaturated compounds include, for example, the following.

[0195] For example, the difunctional esters of (meth)acrylic acid include: aronyx M-210, M-240, M-6200, etc. from Toa Synthetic Chemical Industries, Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nippon Chemical Industries, Ltd.; and V-260, V-312, V-335 HP, etc. from Osaka Organic Chemical Industries, Ltd.

[0196] For example, the trifunctional esters of (meth)acrylic acid include: aronyx M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toa Synthetic Chemical Industries, Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nippon Chemical Industries, Ltd.; and V-295, V-300, V-360, etc. from Osaka Organic Chemical Industries, Ltd.

[0197] The above products can be used alone or in combination of two or more.

[0198] To achieve superior developability, the reactive unsaturated compound can be used after treatment with acid anhydride. The content of the reactive unsaturated compound in the total amount of the photosensitive resin composition can be from 1 to 40% by weight, for example, from 1 to 20% by weight. When the content of the reactive unsaturated compound is within this range, sufficient curing is initiated during exposure in the patterning process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the pattern, as well as excellent clarity and adhesion.

[0199] (3) Photoinitiator

[0200] To create negative patterns using a photolithography machine, a photoinitiator is required. This photoinitiator has a molar absorption coefficient of 10,000 (L / log·nm) in the 330-380 nm region. The photoinitiator exhibits a 5% weight loss at a temperature below 200°C. The molar absorptivity can be calculated using the beer-Lambert Law. Furthermore, the weight loss was measured using a thermogravimetric analysis (TGA) at a nitrogen atmosphere, with the temperature increased to 300°C at a rate of 5°C per minute.

[0201] The photopolymerization initiator is typically used in photosensitive resin compositions, and for example, it may be an acetophenone-based compound, a benzophenone-based compound, a thioxanone-based compound, a benzoethanol-based compound, a triazine-based compound, etc.

[0202] For example, the acetophenone compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylacetophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinylprop-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butane-1-one, etc.

[0203] For example, the benzophenone compounds include: benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0204] For example, the thioxanthone compounds include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, etc.

[0205] For example, the diphenylethanol ketone compounds include: diphenylethanol ketone, diphenylethanol ketone methyl ether, diphenylethanol ketone ethyl ether, diphenylethanol ketone isopropyl ether, diphenylethanol ketone isobutyl ether, benzyl dimethyl ketone acetal, etc.

[0206] For example, the triazine compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, and bis(trichloromethyl)-6-styryl-s-triazine. 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperyl)-6-triazine, 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine, etc.

[0207] In addition to compounds, the photoinitiator may also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, etc.

[0208] The photoinitiator, as a free radical polymerization initiator, can be a peroxide-based compound, an azo-based compound, etc.

[0209] For example, the peroxide compounds include: ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydrogen peroxides such as 2,4,4-trimethylpentyl-2-hydrogen peroxide, dicumyl hydroperoxide, isocumyl hydroperoxide, and t-butyl hydroperoxide; and dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxide) Dialkyl peroxides, such as 1,3-bis(t-butoxyisopropyl)benzene and t-butyl peroxypentanoate; alkyl succinates, such as 2,4,4-trimethylpentyl peroxyphenoxyacetic acid, α-peroxynedecanoate, t-butyl peroxybenzoic acid, and di-t-butyl peroxytrimethyl adipic acid; percarbonates, such as di-3-methoxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-cyclohexyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetyl peroxycyclohexylsulfonyl, and t-terylperoxyaryl carbonate.

[0210] For example, the azobis compounds include: 1,1'-azobiscyclohexane-1-carboxylonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(methyl isobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutyronitrile), and 4,4'-azobis(4-cyanopentanoic acid), etc.

[0211] After the photoinitiator absorbs light and transitions to an excited state, it transfers its energy, thus enabling its use in conjunction with a photosensitizer that undergoes a chemical reaction. Examples of photosensitizers include: triethylene glycol bis-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, and dipentaerythritol tetra-3-mercaptopropionate.

[0212] The photoinitiator content in the total amount of the photosensitive composition can be from 0.01 to 10% by weight, for example, from 0.1 to 5% by weight. When the photoinitiator content is within this range, sufficient curing is initiated during exposure in the patterning process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the pattern, as well as excellent clarity and adhesion. Furthermore, it prevents a decrease in transmittance caused by unreacted initiator.

[0213] (4) Colorant

[0214] Organic pigments, as well as inorganic pigments and dyes, can all be used as the coloring agents.

[0215] The colorant can be red pigment, green pigment, blue pigment, yellow pigment, black pigment, etc.

[0216] For example, the red pigments mentioned include: CI red pigment 254, CI red pigment 255, CI red pigment 264, CI red pigment 270, CI red pigment 272, CI red pigment 177, CI red pigment 89, etc.

[0217] For example, the green pigments mentioned include copper phthalocyanine pigments that replace halogens, such as CI green pigment 36 and CI green pigment 7.

[0218] For example, the blue pigments include: CI blue pigment 15:6, CI blue pigment 15, CI blue pigment 15:1, CI blue pigment 15:2, CI blue pigment 15:3, CI blue pigment 15:4, CI blue pigment 15:5, CI blue pigment 16, etc., copper phthalocyanine pigments.

[0219] For example, the yellow pigments include: isoindoline pigments such as CI yellow pigment 139, quinophthalone pigments such as CI yellow pigment 138, nickel composite pigments such as CI yellow pigment 150, etc.

[0220] For example, the black pigments mentioned include: lactam black, aniline black, perylene black, titanium black, carbon black, etc.

[0221] Furthermore, according to an implementation example, the colorant in the photosensitive resin composition may comprise pigments, dyes, or combinations thereof. For example, the dye may comprise phthalocyanine compounds.

[0222] The above components may be used alone or in combination of two or more as the pigments and dyes described herein, and are not limited thereto.

[0223] The black pigment described in the above components can be used to effectively block light in the light-blocking layer. When using the black pigment, it can also be used in conjunction with color-matching and repairing agents such as anthraquinone pigments, perylene pigments, phthalocyanine pigments, and azo pigments.

[0224] To disperse the pigment on the photosensitive resin composition, a dispersant may be used concurrently. Specifically, the pigment may be used after surface pretreatment with a dispersant, or the dispersant may be added together with the pigment during the preparation of the photosensitive resin composition.

[0225] The dispersant can be a nonionic dispersant, anionic dispersant, or a cationic dispersant. Specific examples of the dispersant include: polyalkylene glycol and its esters, polyoxyalkylene, alkylene oxide polyol ester additives, alcohol alkylene oxide additives, sulfonates, sulfonates, carboxylic acid esters, carboxylates, alkylene oxide alkylamide additives, alkylamines, etc., which can be used alone or in combination of two or more.

[0226] Commercially available dispersants include, for example, BYK's DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, and DISPERBYK-2001; EFKA Chemicals' EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, and EFKA-450; and Zeneka's Solsperse. 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; or Ajinomoto's PB711, PB821, etc.

[0227] The content of the dispersant in the total amount of the photosensitive resin composition can be from 0.1% to 15% by weight. When the content of the dispersant is within the range described above, the composition exhibits excellent dispersibility, and consequently, excellent stability, developability, and patterning properties when preparing a light-shielding layer.

[0228] The pigment can also be used after pretreatment with water-soluble inorganic salts and wetting agents. When the pigment is used after such pretreatment, the average particle size of the pigment can be refined.

[0229] The pretreatment is achieved through the following steps: kneading the pigment together with a water-soluble inorganic salt and a wetting agent; then filtering and rinsing the pigment obtained in the kneading step.

[0230] The kneading can be carried out at a temperature of 40°C to 100°C, and the filtration and rinsing can be performed by rinsing the inorganic salts with water and filtering.

[0231] For example, the water-soluble inorganic salts mentioned include sodium chloride, potassium chloride, etc., but this is not the case here.

[0232] The wetting agent is uniformly mixed with the pigment and the water-soluble inorganic salt, thereby acting as a medium that makes the pigment easier to pulverize. For example, it includes alkylene glycol monoalkyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, and other alkylene glycol monoalkyl ethers; ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, polyethylene glycol glycerin, and other alcohols, which can be used alone or in combination of two or more.

[0233] The pigments produced by the kneading step can have an average particle size of 20 nm to 110 nm. When the average particle size of the pigment falls within this range, it not only exhibits excellent heat resistance and lightfastness but also effectively forms fine patterns.

[0234] In the total amount of the photosensitive resin composition, the content of the pigment can be from 1% to 40% by weight, more specifically, from 2% to 30% by weight. When the pigment is included within the range, the color reproduction rate is excellent, and the curing and adhesion of the pattern are also excellent.

[0235] (5) Solvent

[0236] The solvent is compatible with the cardo-based resin, the reactive unsaturated compound, the pigment, the cardo-based compound, and the initiator, and can be a non-reactive substance.

[0237] For example, the solvents include: alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisopentyl ether, anisole, and tetrahydrofuran; ethylene glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; ethylene glycol ethyl acetate such as methoxyethyl acetate, ethoxyethyl acetate, and ethyl acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; and propylene glycol. Propylene glycol alkyl ether acetates such as methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-di-n-pentanone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactate esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, methyl oxyacetate, and butyl oxyacetate; methoxy Alkoxyalkyl acetate esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; alkyl 3-oxopropionic acid esters such as methyl 3-oxopropionic acid and ethyl 3-oxopropionic acid; alkyl 3-alkoxypropionic acid esters such as methyl 3-methoxypropionic acid, ethyl 3-methoxypropionic acid, ethyl 3-ethoxypropionic acid, and methyl 3-ethoxypropionic acid; alkyl 2-oxopropionic acid esters such as methyl 2-oxopropionic acid, ethyl 2-oxopropionic acid, and propyl 2-oxopropionic acid; methyl 2-methoxypropionic acid, ethyl 2-methoxypropionic acid, and propyl 2-ethoxypropionic acid. Alkyl alkoxypropionic acid esters such as ethyl 2-ethoxypropionate and methyl 2-ethoxypropionate; alkyl 2-oxy-2-methylpropionates such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; alkyl monooxycarboxylic acid esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, and methyl 2-hydroxy-3-methylbutanoate; and ketoesters such as ethyl pyruvate.

[0238] Furthermore, high-boiling-point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformaniline, N-methylacetamide, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and ethylene glycol phenyl ether acetate can be used.

[0239] Considering the compatibility and reactivity of the solvents, ethylene glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkoxy ethers such as ethoxyethyl acetate; ethers such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate.

[0240] The solvent may be included in the balance of the total amount of the photosensitive resin composition, specifically, the content may be 40 to 90% by weight. When the content of the solvent is within the range described above, the photosensitive resin composition can have an appropriate viscosity, thereby achieving excellent processability when preparing patterned layers.

[0241] (6) Other additives

[0242] To prevent blemishes or spots, improve smoothness, and prevent residue formation due to undeveloped coating during the application of the photosensitive composition, the composition may further include: malonic acid; 3-amino-1,2-propanediol; silane coupling agents containing vinyl or (meth)acryloxy groups; smoothing agents; fluorinated surfactants; free radical polymerization initiators, and other additives.

[0243] For example, to improve adhesion to the substrate, the photosensitive resin composition may further include a silane coupling agent having reactive substituents such as vinyl, carboxyl, methacrylate, isocyanate, and epoxy groups.

[0244] For example, the silane-based coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanate propyltrimethoxysilane, γ-glycidyl ether propyltrimethoxysilane, β-epoxycyclohexylethyltrimethoxysilane, etc., which can be used alone or in combination of two or more.

[0245] Of 100 parts by weight of the photosensitive resin composition, the silane coupling agent may be from 0.01 parts by weight to 10 parts by weight. When the weight of the silane coupling agent is within the range described above, it exhibits excellent adhesion and storage properties.

[0246] Furthermore, the photosensitive resin composition may, as needed, further contain a surfactant, such as a fluorinated surfactant, which has the effect of improving coating properties and preventing defects.

[0247] The fluorinated surfactant may be one of the following commercially available fluorinated surfactants: BM-1000 from BM Chemie. ® BM-1100 ® etc.; Dai Nippon Ink & Chemical Industry Co., Ltd.'s Mecha Pack F 142D ® Same model F 172 ® Same model F 173 ® Same model F 183 ® etc.; Sumitomo 3M Corporation's lard FC-135 ® Same model FC-170C ® Same model FC-430 ® Same model FC-431 ® etc.; Asahi Glass Co., Ltd.'s Saffron S-112 ® Same model S-113 ® Same model S-131 ® Same model S-141 ® Same model S145 ® etc.; Toray Silicon Materials Co., Ltd.'s SH-28PA ® Same style - 190 ® Same style - 193 ® SZ-6032 ® SF-8428 ® wait.

[0248] In 100 parts by weight of the photosensitive resin composition, the surfactant may be from 0.001 parts by weight to 5 parts by weight. When the surfactant content falls within this range, coating uniformity is ensured, blemishes are prevented, and excellent wetting properties of the glass substrate are achieved. Furthermore, a certain amount of antioxidants, stabilizers, and other additives may be added to the photosensitive resin composition without impairing its physical properties.

[0249] Another implementation example is that the photosensitive resin composition can be used to perform photolithography on the pixel separation section of the organic light-emitting element electrode.

[0250] Hereinafter, specific examples of synthesis and embodiments of the present invention are described, but the examples of synthesis and embodiments of the present invention are not limited thereto.

[0251] (Preparation of the black photosensitive composition)

[0252] Synthesis Example 1: (Chemical Formula 8 represents the preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene)

[0253] 20 g of 9,9'-bisphenol fluorene (Sigma-Aldrich), 8.67 g of glycidyl chloride (Sigma-Aldrich), 30 g of anhydrous potassium carbonate, and 100 ml of dimethylformamide were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube. The mixture was heated to 80 °C and reacted for 4 hours. Then, the temperature was lowered to 25 °C, and the reaction solution was filtered. The filtrate was then stirred and added dropwise to 1000 ml of water. The precipitated powder was filtered out, washed with water, and dried under reduced pressure at 40 °C to obtain 25 g of 9,9-bis(4-epoxypropyloxyphenyl)fluorene (represented by compound 8). The purity of the powder was determined by HPLC, and the result showed a purity of 98%.

[0254] <Chemical Formula 8>

[0255]

[0256] Synthesis Example 2: Preparation of Cardo-based Adhesive Resins

[0257] 25 g (54 mmol) of compound 1 obtained in Synthesis Example 1, 8 g of acrylic acid (Ōi Kakin), 0.2 g of benzyl triethylammonium chloride (Ōi Kakin), 0.2 g of hydroquinone (Ōi Kakin), and 52 g of propylene glycol methyl ether acetate (Sigma-Aldrich) were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube and stirred at 110 °C for 6 hours. After the reaction was completed, 8 g of biphenyltetracarboxylic acid dianhydride (Mitsubishi Gas) and 1.8 g of tetrahydrophthalic acid (Sigma-Aldrich) were added, and the mixture was stirred at 110 °C for 6 hours. After the reaction was completed, the reaction solution was recovered and analyzed. The results showed that a cardo-based binder resin with a molecular weight of 4,580 and a solid powder content of 45% was obtained.

[0258] Preparation Example 1: Preparation of Black Pigment Dispersion

[0259] Using a paint shaker (Asada), 15g of Irgaphor Black S 100 CF (black pigment / BASF), 8.5g of Disperbyk 163 (BYK), 6.5g of SR-3613 (SMS), 70g of propylene glycol methyl ether acetate, and 100g of zirconia beads with a diameter of 0.5mm (Toray) were dispersed for 10 hours to obtain a dispersion.

[0260] The photosensitive combination solution was prepared using the components listed in Table 1 below.

[0261] Specifically, the initiator is dissolved in a solvent, and then stirred at room temperature. A binder resin and a polymerizable compound are added, and the mixture is stirred at room temperature. Next, a colorant and other additives are added to the obtained reactants, and the mixture is stirred at room temperature. The product is then filtered three times to remove impurities, thus preparing a photosensitive resin composition.

[0262] Table 1

[0263]

[0264] The method for preparing a negative pixel delimiting layer (PDL) using the photosensitive composition is as follows.

[0265] (1) Coating and coating steps

[0266] 10cm after cleaning and vapor-deposited metal A photosensitive composition is coated to a certain thickness on a 10cm substrate using a spin coater. Then, some of the solvent is removed using a vacuum chamber dryer (VCD) to form a coating film. The thickness of the film formed after the photosensitive composition coating is processed by the VCD is 2.0 micrometers to 1.7 micrometers.

[0267] (2) Pre-baking steps

[0268] On a hot plate, the coating is heated at 80°C to 120°C for 50 to 200 seconds to remove solvents contained within the coating. This process removes a certain amount of solvent to reduce mask contamination of pixel morphology during the next real-time process (exposure) step, resulting in a clean pattern.

[0269] (3) Exposure steps

[0270] A mask of a given morphology is intercalated onto the coating obtained above to facilitate the formation of the desired pattern and a certain thickness. Then, the coating is irradiated with photochemical rays at a wavelength of 190 nm to 600 nm using an exposure machine. Preferably, a metal or LED light source with a giga-line can be used to form the pattern. The exposure dose for pattern formation is 20 to 150 mJ / cm². 2 Furthermore, it is a negative-type photosensitive resist material.

[0271] (4) Development step

[0272] Following the exposure step, the coating is then developed using a 2.38 wt% TMAH (tetramethylhydroxylamine) developer at 23 ± 2 °C for a specified time via dipping. Afterward, it is rinsed with deionized water (DI water) to dissolve and remove the unexposed portions, leaving only the exposed areas to form the image pattern. The coating thickness is 1.70 to 1.90 µm.

[0273] (5) Post-drying process

[0274] To obtain the image pattern obtained after development, a post-baking process is performed in an oven at 210 to 300°C for 30 to 120 minutes to completely remove the solvent, solidify the pattern to form a film, and then test for degassing.

[0275] (6) Degassing detection

[0276] After forming a pattern on a substrate using a photosensitive composition through steps (1), (2), (3), (4), and (5) above, degassing was detected in a 10cm x 10cm area. Following a post-baking process, a film with a coating thickness of 1.45 to 1.55µm was formed. The film, after being coated on a 10cm x 10cm substrate using the photosensitive composition and followed by a post-baking process, weighed 11 to 12g. Degassing of the substrate was captured at 250°C using a JAI JTD-505² instrument for 30 minutes. Toluene (5, 10, 50ppm) in black samples was detected using a Shimadzu QP2020 GC / MS instrument. Calibration curves were then constructed, and the amount of degassing in the captured samples was epitaxially detected. The detected degassing amount was compared with that of the samples prepared by varying the development time and temperature in the development step, and the heating temperature and heat treatment time in the post-baking step.

[0277] (7) Component reliability evaluation

[0278] When comparing the detected amount of degassing, the minimum and maximum detected amounts of degassing under each process condition were confirmed. Patterned substrates with pixel define layers (PDL) were formed under different conditions. Then, organic materials were deposited by vapor deposition. Reliability testing factors, such as high temperature drive, pixel shrinkage, and dark spots, were confirmed to facilitate the evaluation of component reliability.

[0279] (8) Smoke generation detection method

[0280] This method pertains to the preparation of a negative pixel boundary layer (PDL) using the aforementioned photosensitive composition. It confirms the amount of degassing detected during the development step when forming a film with a thickness of 1.70 to 1.90 µm. Then, by subtracting the amount of degassing detected when forming a film with a thickness of 1.45 to 1.55 µm after post-baking, the amount of smoke generated during the post-baking process is confirmed.

[0281] (Preparation of component substrate)

[0282] like Figures 1 to 6 As shown, an OLED element substrate has electrodes formed on a glass surface with a thickness of ITO (80–120 Å)-Ag (900–1,100 Å)-ITO (80–120 Å). A composition containing a colorant is then applied to these electrodes to obtain a substrate for evaluation. This substrate includes a negative pixel delimiting layer formed through coating, exposure, development, and post-baking processes. Regarding the physical properties of this substrate for evaluation, when measured using a UV-Vis spectrometer, the reflectance at 550 nm reached over 95%, and when measured using an atomic force microscope (AFM), the ITO surface roughness was found to be below 2 nm.

[0283] Table 2

[0284]

[0285]

[0286] The substrates obtained using the post-baking process before and after the aforementioned process were tested and compared for fume and out-gas generation. Referring to Comparative Examples 1 to 3 in Table 2 above, it can be seen that even with a lower post-baking temperature leading to an increased post-baking time, the fume generation remained below 86 ppm. Therefore, it was confirmed that the out-gas generation after post-baking was above 15 ppm. It was confirmed that when the out-gas generation increases after post-baking, such as… Figure 1As shown, degassing occurs during component driving, leading to the appearance of black spots. Referring to Comparative Examples 4 to 6, it is known that post-baking temperatures exceeding 300°C reduce fum and out-gas content. However, as shown in the component reliability images below, the pixel boundary layer (PDL) cannot withstand high temperatures (320°C), and pixel shrinkage occurs due to further degassing during component driving. It was confirmed that the longer the duration at high temperatures (60 minutes, 120 minutes), the more severe this pixel shrinkage development becomes.

[0287] The foregoing has described the embodiments of the present invention in detail. However, the claims of the present invention are not limited thereto. Obviously, those skilled in the art can make various modifications and alterations without departing from the technical concept of the present invention as described in the claims.

Claims

1. A method for preparing a pixel defining layer, characterized in that: include: The coating and coating formation of the photosensitive composition; pre-baking; exposure; development; and post-baking steps. The photosensitive composition comprises: a cardo-based adhesive resin comprising the following chemical formula 1; a reactive unsaturated compound; a photoinitiator having a molar absorptivity of 10,000 L / mol·cm or higher in the 330 to 380 nm region and a 5% weight loss occurring at a temperature below 200°C; and a solvent. The oven temperature for the post-baking process is 250°C to 270°C, the baking time is 60 minutes to 120 minutes, the amount of smoke generated during the post-baking process is 86 ppm to 93.67 ppm, and a film with a coating thickness of 1.45 to 1.55 µm is formed after the post-baking process. The degassing amount on a 10 cm x 10 cm substrate is less than 15 ppm. The amount of smoke generated in the post-baking step is equal to the amount of degassing detected when a film with a coating thickness of 1.70 to 1.90 µm is formed in the developing step, minus the amount of degassing detected when a film with a coating thickness of 1.45 to 1.55 µm is formed after the post-baking step. <Chemical Formula 1> In the aforementioned chemical formula 1, 1) R1 and R2 are independently: hydrogen; deuterium; halogen; C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group, 2) R1 and R2 can form a ring between adjacent bases. 3) m or n are independent integers from 0 to 4. 4) A1 and A2 are independently chemical formulas 2 or 3. <Chemical Formula 2> <Chemical Formula 3> In chemical formulas 2 and 3, 4-1) Indicates the connected parts. 4-2) R3 to R6 are independently: hydrogen; deuterium; halogen; C6 to C6. 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group, 4-3) R3 to R6 can form rings between adjacent bases. 4-4) Y1 and Y2 are independently chemical formulas 6 or 7. <Chemical Formula 6> <Chemical Formula 7> In the chemical formulas 6 and 7, 4-4-1) Indicates the bonding location, 4-4-2) R9 is hydrogen or methyl ester; 4-4-3)R 10 ~R 13 Independently defined: hydrogen; deuterium; halogen; C6–C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 Heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2-C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group, 4-4-4) L1 to L3 are independently: single bonds; fluorene group; C2 to C3. 30 Alkylene; C6~C 30 arylene; C2~C 30 Heterocyclic rings; C1~C 30 alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; or C2~C 30 Polyethyleneoxy group 4-4-5) q and r are independent integers from 0 to 3; however, q + r = 3, and 5) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formulas 4 and 5; 5-1) R' and R" are independently: hydrogen; deuterium; halogen; C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 Heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2-C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group, 5-2) R' and R" can form rings between adjacent bases. <Chemical Formula 4> <Chemical Formula 5> In the chemical formulas 4 and 5 mentioned above 5-3) Indicates the bonding location, 5-4) R7 to R8 are independently: hydrogen; deuterium; halogen; C6 to C6. 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group, 5-5) o and p are independent integers from 0 to 4. 6) X2 is C6~C 30 aryl group; C2-C containing at least one heteroatom from O, N, S, Si, and P. 30 heterocyclyl group; C6~C 30 Cyclo group of aliphatic and aromatic rings; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 alkinyl group; C1-C 20 alkoxy group; C6~C 30 The aryloxy group; fluorenylene group; carbonyl group; ether group; or C1-C2. 20 The alkoxy carbonyl group, and 7) R', R", X2, L1~L3, R1~R8 and R 10 ~R 13 It can be further substituted by one or more substituents selected from the group consisting of the following components: deuterium; halogen; C1-C2 substituents. 30 Alkyl group or C6-C 30 Aryl (aryl group) substituted or unsubstituted silane (silane group); siloxane (siloxane group); boron group; germanium group; cyano group; amino group; nitro group; C1-C 30 alkylthio group; C1~C 30 alkoxy group; C6~C 30 arylalkoxy group; C1~C 30 Alkyl group; C2~C 30 alkenyl group; C2~C 30 alkinyl group; C6~C 30 aryl group; C6-C substituted with deuterium 30 Aryl group; fluorenyl group; C2~C 30 The heterocyclyl group contains at least one heteroatom selected from the group consisting of O, N, S, Si, and P; C3~C 30 Aliphatic cyclic groups; C7~C 30 aryl alkyl groups; and C8-C6 groups. 30 The aryl alkenyl group; or a ring can be formed between adjacent substituents.

2. The pixel defining layer preparation method according to claim 1, characterized in that: The photosensitive composition contains a colorant.

3. The pixel defining layer preparation method according to claim 2, characterized in that: The colorant comprises one or more of inorganic dyes, organic dyes, inorganic pigments, and organic pigments.

4. The pixel defining layer preparation method according to claim 2, characterized in that: The colorant content in the total amount of the photosensitive composition is 1 to 40% by weight.

5. The pixel defining layer preparation method according to claim 2, characterized in that: The colorant is pretreated with a dispersant; or pretreated with a water-soluble inorganic salt and a wetting agent.

6. The pixel defining layer preparation method according to claim 2, characterized in that: The average particle size of the colorant is 20 nm to 110 nm.

7. The pixel defining layer preparation method according to claim 1, characterized in that: The photosensitive composition also includes an acrylic adhesive resin.

8. The pixel defining layer preparation method according to claim 7, characterized in that: The acrylic adhesive resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

9. The pixel defining layer preparation method according to claim 1, characterized in that: The cardo-based adhesive resin has a weight average molecular weight of 1,000 to 100,000 g / mol.

10. The pixel defining layer preparation method according to claim 1, characterized in that: The amount of the cardo-based adhesive resin in the total amount of the photosensitive composition is 1 to 30% by weight.

11. The pixel defining layer preparation method according to claim 1, characterized in that: The photosensitive composition comprises, in an amount of 1 to 40% by weight of the reactive unsaturated compound in its total amount.

12. The pixel defining layer preparation method according to claim 1, characterized in that: The photosensitive composition comprises, in an amount of 0.01 to 10% by weight of the photoinitiator in its total amount.

13. A pixel defining layer prepared by the pixel defining layer preparation method according to claim 1.

14. An organic light-emitting display device comprising the pixel defining layer of claim 13.

15. An electronic device, characterized in that: It includes the organic light-emitting display device of claim 14 and a control unit for driving the organic light-emitting display device.

Images