A manufacturing process for a flip chip film with improved flexural resistance

Abstract

The present invention discloses a manufacturing process for a flip-chip thin film with improved flexural resistance, which relates to the technical field of flip-chip thin film manufacturing. The process includes S1, substrate fixation; S2, circuit arrangement; S3, circuit merging and widening; S4, substrate flipping; and S5, coating thickening. In this manufacturing process for the flip-chip thin film with improved flexural resistance, the end portions of the circuits are clamped and fixed by a wire arranging component. After every three circuits are grouped and neatly arranged on the top of the substrate, they are encapsulated. Compared with the traditional single-circuit encapsulation, the grouped encapsulation of the circuits widens the circuits, thereby improving the flexural resistance of the flip-chip thin film product. The spraying component forms a uniform protective film on the side without installed circuits, which not only plays a role in abrasion resistance and substrate protection, but also increases the overall thickness of the substrate, further improving the flexural resistance of the flip-chip thin film product. In addition, the waste generated by spraying can fall into the aggregate drawer along the funnel, and the waste paint is collected for its treatment and recycling.

Description

Technical Field

[0001] The present invention relates to the technical field of flip chip film preparation, and specifically provides a flip chip film preparation process for improving the flexural resistance. Background Art

[0002] With the increasingly widespread application of flexible OLEDs in the mobile phone market, its preparation technology has become increasingly stable. The flexible OLED screen encapsulation process can choose methods such as COF and COP for chip encapsulation. COF, that is, flip chip film, the full English name is: Chip On Film. This screen encapsulation process integrates the IC chips of the screen on the flexible PCB circuit board, and then bends it under the screen, which can further reduce the border and increase the screen-to-body ratio. Compared with other encapsulation methods, COF encapsulation is more cost-effective, and this feature makes COF gradually become the mainstream encapsulation method for mobile phone display driver chips. Nowadays, the vast majority of mid-to-high-end full-screen and notch-screen mobile phones use screens with COF encapsulation.

[0003] In actual industrial production, with the increasing demand for flip chip films, its preparation process has gradually attracted attention. However, the current preparation process still has the following deficiencies:

[0004] At present, the flip chip films prepared by the preparation process have poor flexural resistance and are easily damaged due to external forces such as bending and flexing. Once damaged, it is difficult to repair, which seriously affects the service life of the flip chip film products. This limitation also greatly restricts the use scenarios of flip chip films and is not conducive to the popularization and use of flip chip films.

[0005] Therefore, it is urgent to improve this shortcoming. The present invention studies and improves the existing structure and deficiencies, and provides a flip chip film preparation process for improving the flexural resistance. Summary of the Invention

[0006] The purpose of the present invention is to provide a flip chip film preparation process for improving the flexural resistance to solve the problems raised in the above background art.

[0007] To achieve the above purpose, the present invention provides the following technical solution: A flip chip film preparation process for improving the flexural resistance, including the following steps:

[0008] S1. Substrate fixation: Place the substrate on the top of the suction cup, and adsorb and fix the substrate through the fixing component. Then start the electric control slider to slide along the ceiling track, driving the telescopic suspension rod and the wire arrangement component to move to an appropriate position;

[0009] S2. Line arrangement: Place the ends of the lines to be encapsulated into the lower limit seat in sequence, and fix the ends of the lines through the wire arrangement component, so that the lines are neatly arranged on the top of the substrate;

[0010] S3. Line merging and widening: The encapsulation head is controlled by a control device to encapsulate the lines on the top of the substrate. Every three lines are merged into a group to achieve line widening.

[0011] S4. Substrate flipping: The fixing effect of the cable assembly on the end of the line is released, then the cable assembly returns to the initial position, and then the control motor drives the fixing assembly to flip, and the substrate is flipped into the box shell.

[0012] S5. Coating thickening: The SR solder resist ink in the storage barrel is evenly sprayed onto the side of the substrate without installed lines through the spraying assembly to form a uniform protective film and increase the overall thickness of the substrate.

[0013] Furthermore, a waste cavity is fixedly connected to the bottom of the box shell, and a collecting drawer is movably connected to the inside of the waste cavity. And a funnel is fixedly installed inside the box shell, and the bottom of the funnel is connected to the bottom of the box shell through.

[0014] Furthermore, a partition plate is fixed inside the box shell, and a storage barrel is arranged inside the box shell. And the storage barrel is restricted between the box shell and the partition plate. The top of the storage barrel is fixedly connected with a feeding hopper, and the outer wall of the storage barrel is fixedly connected with the spraying assembly.

[0015] Furthermore, the spraying assembly includes a guiding sliding groove and an electric control sliding frame. The guiding sliding groove is opened on the inner wall of the box shell, and the electric control sliding frame is movably installed inside the box shell through the guiding sliding groove.

[0016] Furthermore, the spraying assembly further includes a nozzle, a pump body and a telescopic pipe. The nozzle is fixed on the top of the electric control sliding frame, and the pump body is fixedly connected to the bottom of the electric control sliding frame. The bottom of the nozzle penetrates through the top of the electric control sliding frame and extends to the bottom of the electric control sliding frame, and the bottom of the nozzle is connected to the outlet side of the pump body. And the inlet side of the pump body is fixedly connected with a telescopic pipe, and the telescopic pipe is fixedly connected with the outer wall of the storage barrel.

[0017] Furthermore, the output shaft of the control motor is fixedly connected with a central rotating column through a coupling. The central rotating column is movably connected to the inner wall of the box shell through a bearing, and one end of the central rotating column is fixedly connected to the outer wall of the fixing assembly.

[0018] Furthermore, the fixing assembly includes an air chamber, a vacuum pump, a metal pipe and a suction cup. The vacuum pump is fixedly installed on the outside of the air chamber, and the outer wall of the air chamber is connected with a metal pipe through. And the end of the metal pipe is fixedly connected with a suction cup.

[0019] Further, the wire arrangement assembly includes a wire placement base, hanging ears, a lower limit seat, and a limit rail rod. Hanging ears are fixedly connected to both sides of the wire placement base, and the top of the hanging ear is fixedly connected to the bottom end of the telescopic hanging rod. A lower limit seat is fixedly installed inside the wire placement base, and a limit rail rod is welded to the top of the wire placement base.

[0020] Further, the wire arrangement assembly further includes a metal lead screw, a lifting frame, and an upper limit seat. The bottom end of the metal lead screw is movably connected to the top of the wire placement base through a bearing, and a lifting frame is threadedly connected to the outer wall of the metal lead screw. The bottom of the lifting frame is fixedly connected to the upper limit seat, and the upper limit seat is arranged in one-to-one correspondence with the lower limit seat and is located directly above the lower limit seat.

[0021] Further, the wire arrangement assembly further includes a guiding slide rail, a sliding frame, and a servo motor. The guiding slide rail is fixed to the top of the lifting frame, a sliding frame is arranged inside the guiding slide rail, and a servo motor is fixedly connected to the inside of the sliding frame. Moreover, the servo motor and the guiding slide rail form a sliding structure through the sliding frame.

[0022] The present invention provides a manufacturing process for a flip chip thin film with improved flex resistance, having the following beneficial effects:

[0023] 1. The present invention is provided with a wire arrangement assembly, which is jointly composed of a wire placement base, hanging ears, a lower limit seat, a limit rail rod, a metal lead screw, a lifting frame, an upper limit seat, a guiding slide rail, a sliding frame, and a servo motor. By driving the metal lead screw to rotate through the servo motor, cooperating with the restriction of the movement trajectory of the servo motor by the guiding slide rail and the sliding frame, and the restriction of the movement trajectory of the lifting frame by the limit rail rod, the lifting frame can gradually move downward under the rotational drive of the metal lead screw. The lower limit seat and the upper limit seat are used to clamp and fix the end of the circuit. After forming a group of every three circuits and neatly arranging them on the top of the substrate, encapsulation is carried out. Compared with the traditional single-circuit encapsulation, the grouped encapsulation of the circuits widens the circuits, thereby improving the flex resistance of the flip chip thin film finished product.

[0024] 2. The present invention is provided with a spraying assembly, which is jointly composed of a guiding chute, an electric control sliding frame, a nozzle, a pump body, and a telescopic pipe. The electric control sliding frame drives the nozzle to reciprocally move along the trajectory of the guiding chute. At the same time, the pump body extracts the SR solder resist ink in the storage barrel through the telescopic pipe and supplies it to the nozzle. The nozzle evenly sprays the SR solder resist ink onto the side of the substrate where no circuit is installed. By forming a uniform protective film on the side where no circuit is installed, using the excellent properties of the SR solder resist ink, it not only plays a role in abrasion resistance and protecting the substrate, but also increases the overall thickness of the substrate, further improving the flex resistance of the flip chip thin film finished product.

[0025] 3. The present invention is provided with a control motor, which drives the fixed component to flip through the control motor, thereby driving the substrate to flip into the casing, directly flipping the substrate, and enabling the spraying process to be carried out inside the casing, avoiding the SR solder resist ink from splashing everywhere during spraying. In addition, a collecting drawer and a funnel are provided, and the waste generated by spraying can fall into the collecting drawer along the funnel, collecting the waste paint for its treatment and recycling. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of a method for a method for preparing a flip chip thin film with improved flexural resistance according to the present invention;

[0027] Figure 2 It is a schematic structural diagram of a method for preparing a flip chip thin film with improved flexural resistance according to the present invention;

[0028] Figure 3 It is a schematic front sectional structural diagram of a casing of a method for preparing a flip chip thin film with improved flexural resistance according to the present invention;

[0029] Figure 4 It is a method for preparing a flip chip thin film with improved flexural resistance according to the present invention Figure 3 The enlarged schematic diagram of the structure at A in;

[0030] Figure 5 It is an operation schematic diagram of a spraying component of a method for preparing a flip chip thin film with improved flexural resistance according to the present invention;

[0031] Figure 6 It is a schematic side structural diagram of a wire arrangement component of a method for preparing a flip chip thin film with improved flexural resistance according to the present invention.

[0032] In the figure: 1, casing; 2, waste chamber; 3, collecting drawer; 4, funnel; 5, partition board; 6, storage barrel; 7, feeding hopper; 8, spraying component; 81, guiding sliding groove; 82, electric control sliding frame; 83, nozzle; 84, pump body; 85, telescopic pipe; 9, control motor; 10, central rotating column; 11, fixed component; 111, air chamber; 112, vacuum pump; 113, metal pipe; 114, suction cup; 12, control device; 13, encapsulation head; 14, ceiling track; 15, electric control slider; 16, telescopic suspension rod; 17, wire arrangement component; 171, wire placement seat; 172, hanging ear; 173, lower limit seat; 174, limit rail rod; 175, metal lead screw; 176, lifting frame; 177, upper limit seat; 178, guiding sliding rail; 179, sliding frame; 1710, servo motor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The following further describes in detail the embodiments of the present invention in conjunction with the drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0034] Example, such as Figures 1-6 shown: A flip-chip thin film preparation process for improving flexural resistance, including the following steps:

[0035] S1. Substrate fixation: Place the substrate on the top of the suction cup 114, and adsorb and fix the substrate through the fixing component 11. Then start the electric control slider 15 to slide along the ceiling track 14, driving the telescopic suspension rod 16 and the wire arrangement component 17 to move to a suitable position;

[0036] S2. Line arrangement: Place the ends of the lines to be encapsulated into the lower limit seat 173 in sequence, and fix the ends of the lines through the wire arrangement component 17, so that the lines are neatly arranged on the top of the substrate;

[0037] S3. Line merging and width increasing: Control the encapsulation head 13 through the control device 12 to encapsulate the lines on the top of the substrate, merge every three lines into a group, and achieve line width increasing;

[0038] S4. Substrate flipping: Release the fixing effect of the wire arrangement component 17 on the ends of the lines, then the wire arrangement component 17 returns to the initial position, and then drive the fixing component 11 to flip through the control motor 9 to flip the substrate into the box shell 1;

[0039] S5. Coating thickening: Uniformly spray the SR solder resist ink in the storage bucket 6 onto the side of the substrate without installed lines through the spraying component 8 to form a uniform protective film and increase the overall thickness of the substrate.

[0040] A waste cavity 2 is fixedly connected to the bottom of the box shell 1, and a collecting drawer 3 is movably connected to the inside of the waste cavity 2. And a funnel 4 is fixedly installed inside the box shell 1, and the bottom of the funnel 4 is in through connection with the bottom of the box shell 1.

[0041] A partition plate 5 is fixed inside the box shell 1, and a storage bucket 6 is arranged inside the box shell 1. And the storage bucket 6 is restricted between the box shell 1 and the partition plate 5. A feeding hopper 7 is fixedly connected to the top of the storage bucket 6, and the outer wall of the storage bucket 6 is fixedly connected to the spraying component 8.

[0042] The spraying component 8 includes a guiding chute 81 and an electric control carriage 82. The guiding chute 81 is opened on the inner wall of the box shell 1, and the electric control carriage 82 is movably installed inside the box shell 1 through the guiding chute 81.

[0043] The spraying assembly 8 further includes a nozzle 83, a pump body 84, and a telescopic tube 85. The nozzle 83 is fixed to the top of the electric control carriage 82, and the bottom of the electric control carriage 82 is fixedly connected to the pump body 84. The bottom of the nozzle 83 penetrates through the top of the electric control carriage 82 and extends to the bottom of the electric control carriage 82, and the bottom of the nozzle 83 is connected to the outlet side of the pump body 84. The inlet side of the pump body 84 is fixedly connected to the telescopic tube 85, and the telescopic tube 85 is fixedly connected to the outer wall of the storage barrel 6.

[0044] The output shaft of the control motor 9 is fixedly connected to a central rotating column 10 through a coupling. The central rotating column 10 is movably connected to the inner wall of the box shell 1 through a bearing, and one end of the central rotating column 10 is fixedly connected to the outer wall of the fixing assembly 11.

[0045] The fixing assembly 11 includes an air chamber 111, a vacuum pump 112, a metal tube 113, and a suction cup 114. The vacuum pump 112 is fixedly installed on the outside of the air chamber 111, the outer wall of the air chamber 111 is connected through a metal tube 113, and the end of the metal tube 113 is fixedly connected to the suction cup 114.

[0046] The wire arranging assembly 17 includes a wire placing seat 171, hanging ears 172, a lower limit seat 173, and a limit rail rod 174. The hanging ears 172 are fixedly connected to both sides of the wire placing seat 171, and the top of the hanging ears 172 is fixedly connected to the bottom end of the telescopic suspension rod 16. The lower limit seat 173 is fixedly installed inside the wire placing seat 171, and the limit rail rod 174 is welded to the top of the wire placing seat 171.

[0047] The wire arranging assembly 17 further includes a metal screw rod 175, a lifting frame 176, and an upper limit seat 177. The bottom end of the metal screw rod 175 is movably connected to the top of the wire placing seat 171 through a bearing, and the outer wall of the metal screw rod 175 is threadedly connected to the lifting frame 176. The bottom of the lifting frame 176 is fixedly connected to the upper limit seat 177, and the upper limit seat 177 is arranged corresponding to the lower limit seat 173 one by one, and the upper limit seat 177 is directly above the lower limit seat 173.

[0048] The wire arranging assembly 17 further includes a guiding slide rail 178, a sliding frame 179, and a servo motor 1710. The guiding slide rail 178 is fixed to the top of the lifting frame 176. A sliding frame 179 is arranged inside the guiding slide rail 178, and the servo motor 1710 is fixedly connected to the inside of the sliding frame 179. The servo motor 1710 and the guiding slide rail 178 form a sliding structure through the sliding frame 179.

[0049] In summary, as shown in combination with Figures 1-6 The working principle of the flip-chip film preparation process for improving the flexural resistance is as follows:

[0050] S1. Fixing the substrate: placing the substrate on the top of the suction cup 114 and starting the vacuum pump 112. The air in the air chamber 111 is extracted by the vacuum pump 112. The air in the metal tube 113 connected to the air chamber 111 is then evacuated. The substrate is fixed on the top of the suction cup 114 by vacuum adsorption. Then, the electric control slider 15 is started to slide along the ceiling track 14, driving the telescopic suspension rod 16 and the cable assembly 17 to move to a suitable position.

[0051] S2. Arrange the lines: place the ends of the lines to be packaged into the lower limit seat 173 in sequence, start the servo motor 1710, and drive the metal wire rod 175 to rotate through the servo motor 1710. With the help of the guide rail 178 and the slide frame 179 to limit the motion trajectory of the servo motor 1710, and the limit rail rod 174 to limit the motion trajectory of the lifting frame 176, the lifting frame 176 can be gradually moved downward under the rotation drive of the metal wire rod 175 until the bottom of the upper limit seat 177 is connected to the top of the lower limit seat 173. The lower limit seat 173 and the upper limit seat 177 are used to clamp and fix the ends of the lines, and the lines are neatly arranged on the top of the substrate.

[0052] S3, line merging and widening: the control device 12 controls the packaging head 13 to package the lines on the top of the substrate, and every three lines are combined to form a group to achieve line widening;

[0053] S4, substrate flipping: The servo motor 1710 drives the metal wire rod 175 to rotate in the opposite direction, thereby driving the lifting frame 176 and the upper limit seat 177 to move upward, releasing the fixing effect of the upper limit seat 177 and the lower limit seat 173 on the line end, and then the electric control slider 15 drives the telescopic suspension rod 16 and the cable assembly 17 to return to the initial position along the trajectory of the ceiling track 14, and then drives the fixing assembly 11 to flip through the control motor 9, and flips the substrate into the box shell 1;

[0054] S5. Coating thickening: The nozzle 83 is driven by the electrically controlled slide 82 to reciprocate along the track of the guide slide 81. At the same time, the pump body 84 extracts the SR solder mask ink in the storage barrel 6 through the telescopic tube 85 and supplies it to the nozzle 83. The SR solder mask ink is evenly sprayed onto the side of the substrate where the circuit is not installed through the nozzle 83 to form a uniform protective film and increase the overall thickness of the substrate. The waste generated by the spraying falls into the collecting bin 3 along the funnel 4 to be collected so that it can be put into use again after processing.

[0055] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A manufacturing process for a flip-chip film with improved flexural resistance, characterized in that, It includes the following steps: S1. Substrate fixation: Place the substrate on the top of the suction cup (114), adsorb and fix the substrate through the fixing component (11), and then start the electric control slider (15) to slide along the ceiling track (14), driving the telescopic suspension rod (16) and the wire arrangement component (17) to move to a suitable position; S2. Wire arrangement: Sequentially place the ends of the wires to be encapsulated into the lower limit seat (173), and fix the ends of the wires through the wire arrangement component (17) so that the wires are neatly arranged on the top of the substrate; S3. Wire merging and widening: Control the encapsulation head (13) through the control device (12) to encapsulate the wires on the top of the substrate, combine every three wires into a group to achieve wire widening; S4. Substrate flipping: Release the fixing effect of the wire arrangement component (17) on the ends of the wires, then the wire arrangement component (17) returns to the initial position, and then drive the fixing component (11) to flip through the control motor (9) to flip the substrate into the box shell (1); S5. Coating thickening: Uniformly spray the SR solder resist ink in the storage barrel (6) onto the side of the substrate without installed wires through the spraying component (8) to form a uniform protective film and increase the overall thickness of the substrate; The spraying component (8) includes a guiding chute (81) and an electric control carriage (82), and the guiding chute (81) is opened on the inner wall of the box shell (1), and the electric control carriage (82) is movably installed inside the box shell (1) through the guiding chute (81); The spraying component (8) further includes a nozzle (83), a pump body (84) and a telescopic tube (85), and the nozzle (83) is fixed on the top of the electric control carriage (82), and the bottom of the electric control carriage (82) is fixedly connected with the pump body (84). The bottom of the nozzle (83) penetrates through the top of the electric control carriage (82) and extends to the bottom of the electric control carriage (82), and the bottom of the nozzle (83) is connected to the outlet side of the pump body (84), and the inlet side of the pump body (84) is fixedly connected with the telescopic tube (85), and the telescopic tube (85) is fixedly connected with the outer wall of the storage barrel (6).

2. The manufacturing process of a flip chip film for improving the flexural resistance according to claim 1, wherein, The bottom of the box shell (1) is fixedly connected with a waste cavity (2), and an aggregate drawer (3) is movably connected inside the waste cavity (2), and a funnel (4) is fixedly installed inside the box shell (1), and the bottom of the funnel (4) is communicated with the bottom of the box shell (1); 3. The preparation process of a flip chip film for improving flexural resistance according to claim 1, characterized in that, A partition plate (5) is fixed inside the box shell (1), and a storage barrel (6) is arranged inside the box shell (1), and the storage barrel (6) is restricted between the box shell (1) and the partition plate (5). The top of the storage barrel (6) is fixedly connected with a feeding hopper (7), and the outer wall of the storage barrel (6) is fixedly connected with the spraying component (8); 4. A flip-chip film preparation process for improving flexural resistance according to claim 1, characterized in that, The output shaft of the control motor (9) is fixedly connected with a central rotating column (10) through a coupling, and the central rotating column (10) is movably connected with the inner wall of the box shell (1) through a bearing, and one end of the central rotating column (10) is fixedly connected with the outer wall of the fixing component (11).

5. A manufacturing process for a flip chip film with improved flexural resistance according to claim 1, characterized in that, The fixed component (11) includes an air chamber (111), a vacuum pump (112), a metal pipe (113) and a suction cup (114). The vacuum pump (112) is fixedly installed on the outer side of the air chamber (111). The outer wall of the air chamber (111) is connected through the metal pipe (113). The end of the metal pipe (113) is fixedly connected with the suction cup (114).

6. The manufacturing process of a flip chip film for improving the flexural resistance according to claim 1, characterized in that, The wire arranging component (17) includes a wire placing seat (171), hanging ears (172), a lower limit seat (173) and a limit rail rod (174). The hanging ears (172) are fixedly connected to both sides of the wire placing seat (171). The top of the hanging ears (172) is fixedly connected to the bottom end of the telescopic suspension rod (16). The lower limit seat (173) is fixedly installed inside the wire placing seat (171). The limit rail rod (174) is welded to the top of the wire placing seat (171).

7. A flip-chip film preparation process for improving flexural resistance according to claim 6, characterized in that, The wire arranging component (17) further includes a metal lead screw (175), a lifting frame (176) and an upper limit seat (177). The bottom end of the metal lead screw (175) is movably connected to the top of the wire placing seat (171) through a bearing. The outer wall of the metal lead screw (175) is threadedly connected to the lifting frame (176). The bottom of the lifting frame (176) is fixedly connected with the upper limit seat (177). The upper limit seat (177) and the lower limit seat (173) are arranged in one-to-one correspondence. The upper limit seat (177) is located directly above the lower limit seat (173).

8. The manufacturing process of a flip chip film for improving the flexural resistance according to claim 7, characterized in that, The wire arranging component (17) further includes a guiding slide rail (178), a sliding frame (179) and a servo motor (1710). The guiding slide rail (178) is fixed to the top of the lifting frame (176). The inner wall of the guiding slide rail (178) is provided with the sliding frame (179). The servo motor (1710) is fixedly connected to the inner side of the sliding frame (179). The servo motor (1710) and the guiding slide rail (178) form a sliding structure through the sliding frame (179).

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