Array substrate, display panel and method for manufacturing array substrate
By designing a microstrip slot antenna in the peripheral area of the array substrate, the integration challenge of 5G millimeter-wave antennas in mobile terminals is solved, achieving efficient and low-cost antenna design, improving display transmittance and radiation efficiency, and making it suitable for narrow bezel designs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2022-05-27
- Publication Date
- 2026-07-10
Smart Images

Figure CN117616330B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of display technology. More specifically, it relates to an array substrate, a display panel, and a method for manufacturing the array substrate. Background Technology
[0002] In mobile terminals such as mobile phones, laptops, and automotive windows, as well as wireless applications such as microsatellites, smart windows, and smart wearable devices, further optimization of various microwave communication devices, such as transmission lines, waveguides, and antennas, has become a trend, posing new technical challenges. Summary of the Invention
[0003] Embodiments of this disclosure provide an array substrate.
[0004] In some embodiments of this disclosure, the array substrate includes: a substrate having a display area and a peripheral area surrounding the display area;
[0005] A first electrode located on the substrate and in the peripheral region;
[0006] An opening located in the first electrode, wherein the opening passes through the surface of the first electrode away from the substrate and reaches the surface of the first electrode facing the substrate;
[0007] A dielectric layer located on the side of the first electrode away from the substrate;
[0008] A conductive portion is located on the side of the dielectric layer away from the substrate, and wherein the conductive portion, the dielectric layer, and the opening form an antenna.
[0009] In some embodiments, the conductive portion includes a first sub-conductive portion and a second sub-conductive portion connected to the first sub-conductive portion, wherein the width of the first sub-conductive portion is greater than the width of the second sub-conductive portion, and wherein the projection of the first sub-conductive portion on the substrate overlaps with the projection of the opening on the substrate.
[0010] In some embodiments, the first sub-conductive portion and the second sub-conductive portion are arranged along the extension direction of the first electrode.
[0011] In some embodiments, the opening has a first opening portion and a second opening portion, wherein the projection of the first opening portion on the substrate overlaps with the projection of the conductive portion on the substrate, and the projection of the second opening portion on the substrate does not overlap with the projection of the conductive portion on the substrate.
[0012] In some embodiments, the width of the opening is between about 40 micrometers and 100 micrometers, and the length of the opening is about twice the length of the first sub-conductive portion.
[0013] In some embodiments, the distance from the projection of the opening onto the substrate to the second sub-conductive portion onto the substrate is less than or equal to the width of the second sub-conductive portion.
[0014] In some embodiments, the ratio of the width of the first sub-conductive portion to the width of the second sub-conductive portion is between approximately 2 and 4.
[0015] In some embodiments, the width of the first sub-conductive portion is approximately 120 micrometers, and the width of the second sub-conductive portion is approximately 30 micrometers.
[0016] In some embodiments, the array substrate includes at least two openings and at least two conductive portions corresponding to the at least two openings, wherein the at least two conductive portions are electrically connected through corresponding second sub-conductive portions.
[0017] In some embodiments, the distance from the center of one of the at least two openings to the center of its adjacent opening is between approximately 4 and 10 mm.
[0018] In some embodiments, the array substrate further includes: a radio frequency control circuit located on a surface of the substrate opposite to the surface where the first electrode is disposed; and
[0019] A feed line connected to the conductive part, the feed line being used to electrically connect the conductive part and the radio frequency control circuit.
[0020] In some embodiments, the substrate further includes a bonding region located in the peripheral region, wherein the feed line extends to the bonding region.
[0021] In some embodiments, the opening and the bonding area are located on the same side of the array substrate.
[0022] In some embodiments, the feed line includes a coplanar waveguide.
[0023] In some embodiments, the at least two conductive portions are located on the same side of the feed line.
[0024] In some embodiments, the at least two conductive portions are located on different sides of the feed line.
[0025] In some embodiments, the distance from the opening to the side of the first electrode away from the display area is greater than 100 micrometers, and the distance from the opening to the side of the first electrode facing the display area is greater than 100 micrometers.
[0026] In some embodiments, the array substrate further includes:
[0027] At least one pixel unit located in the display area; and
[0028] A common electrode located on the at least one pixel unit, wherein the first electrode and the common electrode are electrically connected.
[0029] In some embodiments, the array substrate further includes a first conductive layer located on the first electrode, wherein the opening exposes the surface of the first conductive layer away from the substrate and the surface of the first conductive layer facing the substrate.
[0030] The common electrode has a first part and a second part, the projection of the first part onto the substrate overlaps with the projection of the first conductive layer onto the substrate, and the first part is in contact with the first conductive layer, wherein the thickness of the first part is greater than or equal to the thickness of the second part.
[0031] In some embodiments, the array substrate further includes: a first conductive layer located on the side of the first electrode away from the substrate, wherein the opening exposes the surface of the first conductive layer away from the substrate and the surface of the first conductive layer facing the substrate;
[0032] Furthermore, the thickness of the first conductive layer is greater than or equal to the thickness of the anode.
[0033] In some embodiments, at least two openings include two or more groups of openings, wherein conductive portions corresponding to openings in the same group of openings are connected to the same feeder, and conductive portions corresponding to different groups of openings are connected to different feeders.
[0034] In some embodiments, at least two openings include a first sub-opening set and a second sub-opening set, wherein the first sub-opening set is disposed on a first side of the array substrate, and the second sub-opening set is disposed on a second side of the array substrate adjacent to the first side, wherein the conductive portion corresponding to the first sub-opening set and the conductive portion corresponding to the second sub-opening set are electrically connected.
[0035] In some embodiments, the difference between the distance from the second sub-aperture set to the second sub-conductive portion corresponding to the first sub-aperture set and the distance from the first opening set to the second sub-conductive portion corresponding to the second sub-aperture set is an odd multiple of approximately λ / 4, where λ is the wavelength of the electromagnetic wave in the operating frequency band of the antenna in the equivalent medium of the array substrate.
[0036] In some embodiments, the array substrate further includes: a heat dissipation layer disposed on a surface of the substrate opposite to the surface on which the first electrode is disposed;
[0037] An additional substrate layer between the substrate and the heat dissipation layer, wherein the additional substrate layer satisfies at least one of the following:
[0038] The additional substrate layer has a greater absorption capacity for millimeter-wave electromagnetic waves than the substrate layer itself; and
[0039] The additional substrate has a higher refractive index for millimeter-wave electromagnetic waves than the substrate itself.
[0040] In some embodiments, the array substrate further includes: a heat dissipation layer located on the surface of the substrate opposite to the surface on which the first electrode is disposed;
[0041] An additional opening located in the heat dissipation layer, wherein the projection of the additional opening onto the substrate at least partially overlaps with the projection of the opening onto the substrate.
[0042] In some embodiments, the array substrate further includes a heat dissipation layer located on a surface of the substrate opposite to the surface on which the first electrode is disposed, wherein the surface of the heat dissipation layer facing the substrate is provided with an artificial magnetic conductor design, the artificial magnetic conductor being used to stabilize its electric field phase by changing the magnetic field phase of the electromagnetic wave reflected therefrom.
[0043] Embodiments of this disclosure also provide a display panel. The display panel includes the array substrate described above.
[0044] Embodiments of this disclosure also provide a method for manufacturing an array substrate. The method includes:
[0045] A substrate is provided, the substrate having a display area and a peripheral area surrounding the display area;
[0046] A first electrode is disposed on the peripheral region of the substrate;
[0047] An opening is provided in the first electrode, wherein the opening passes through the surface of the first electrode away from the substrate and the surface of the first electrode facing the substrate;
[0048] A dielectric layer is disposed on the side of the first electrode away from the substrate;
[0049] A conductive portion is provided on the side of the dielectric layer away from the substrate. Attached Figure Description
[0050] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below. It should be understood that the drawings described below only relate to some embodiments of the present invention and are not intended to limit the present invention, wherein:
[0051] Figure 1 This is a schematic diagram of an array substrate according to an embodiment of the present invention;
[0052] Figure 2 This is a top view schematic diagram of an array substrate according to an embodiment of this disclosure;
[0053] Figure 3 This is a partial top view of an array substrate according to an embodiment of this disclosure.
[0054] Figure 4 for Figure 3 The diagram shows a partial cross-sectional view of the array substrate along line aa'.
[0055] Figure 5 A schematic diagram illustrating the radiation efficiency of an antenna according to an embodiment of this disclosure;
[0056] Figure 6 for Figure 3 The diagram shows a partial cross-sectional view of the array substrate along the bb' line.
[0057] Figure 7 Gain diagram of an antenna on an array substrate according to some embodiments of this disclosure;
[0058] Figures 8-9 This is a schematic diagram of an array substrate according to some embodiments of this disclosure;
[0059] Figure 10 This is a partial cross-sectional schematic diagram of an array substrate according to an embodiment of this disclosure;
[0060] Figure 11 This is a partial top view of an array substrate according to an embodiment of this disclosure;
[0061] Figure 12 This is a partial cross-sectional schematic diagram of an array substrate according to an embodiment of this disclosure;
[0062] Figure 13 This is a schematic diagram of an array substrate according to an embodiment of the present disclosure;
[0063] Figure 14 This is a schematic diagram of an array substrate according to an embodiment of the present disclosure;
[0064] Figure 15 This is a schematic cross-sectional view of an array substrate according to an embodiment of this disclosure;
[0065] Figure 16 This is a schematic cross-sectional view of an array substrate according to an embodiment of this disclosure;
[0066] Figure 17 This is a schematic cross-sectional view of an array substrate according to an embodiment of this disclosure;
[0067] Figure 18 This is a schematic diagram of the heat dissipation layer of the array substrate according to this disclosure;
[0068] Figure 19 This is a schematic diagram of a display panel according to the text of this disclosure;
[0069] Figure 20 This is a flowchart illustrating a method for manufacturing an array substrate, as described in this disclosure. Detailed Implementation
[0070] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are also within the scope of protection of the present invention.
[0071] When describing the elements and embodiments of the present invention, the articles “a,” “an,” “the,” and “described” are intended to indicate the presence of one or more elements. The terms “comprising,” “including,” “containing,” and “having” are intended to be inclusive and indicate that additional elements besides those listed may be present.
[0072] For the purposes described below, as indicated by their orientation in the accompanying drawings, the terms “upper,” “lower,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” and their derivatives shall apply to the invention. The terms “overlapping,” “on top of,” “positioned on,” or “positioned on top of” mean that a first element, such as a first structure, exists on a second element, such as a second structure, wherein an intermediate element, such as an interface structure, may exist between the first and second elements. The term “contact” means connecting a first element, such as a first structure, and a second element, such as a second structure, where there may or may not be other elements at the interface between the two elements.
[0073] In recent years, multiple frequency bands of antennas used in mobile terminals, including 2G / 3G / 4G, Bluetooth, Wi-Fi (Wireless Fidelity), GPS (Global Positioning System), BDS (BeiDou Navigation Satellite System), NFC (Near Field Communication), and wireless charging, have occupied most of the antenna clearance area of mobile terminals. This has led to difficulties in deploying 5G millimeter-wave antennas on mobile terminals, and the existing antenna structures of terminals cannot meet the requirement of simultaneously covering multiple 5G millimeter-wave frequency bands. In addition, 5G millimeter-wave propagation loss is relatively large, and in order to ensure antenna gain, antenna arrays are required, which necessitates more space for antenna arrangement.
[0074] In one implementation, an antenna can be mounted on a flexible film, which is then attached to the screen. However, due to limitations in the alignment accuracy of the film-attaching process, this method can easily obstruct display pixels, resulting in undesirable dark lines and moiré patterns. Furthermore, to passivate the optical transmittance reduction effect caused by the antenna formation area, a similar grid pattern structure needs to be formed in non-antenna functional areas, which also leads to a 5%–20% decrease in planar transmittance.
[0075] If a method similar to integrating a touch panel onto an OLED encapsulation layer is directly adopted, although precise alignment using semiconductor processes can be achieved, the low distance between the encapsulation layer and the OLED cathode (typically 10-15 micrometers) results in an antenna with a radiation efficiency of only about 2.8%, according to microstrip patch radiation theory. Therefore, fabricating antennas, especially millimeter-wave antennas, using this method is essentially not feasible.
[0076] Figure 1 This is a schematic diagram of an array substrate according to an embodiment of this disclosure. Figure 1 As shown, the array substrate according to an embodiment of the present disclosure includes: a substrate 1 having a display area DA and a peripheral area PA surrounding the display area DA; a first electrode 2 located on the substrate 1 and in the peripheral area PA; an opening 3 in the first electrode 2, wherein the opening 3 passes through a surface S22 of the first electrode 2 away from the substrate 1 and reaches a surface S21 of the first electrode 2 facing the substrate 1; a dielectric layer 4 located on a side of the first electrode 2 away from the substrate; a conductive portion 5 located on a side of the dielectric layer 4 away from the substrate, and wherein the conductive portion 5, the dielectric layer 4 and the opening 3 form an antenna.
[0077] For conventional slot antennas, the thickness of the dielectric layer between the metal ground slot and the feed line is typically designed to be between 0.01λ0 and 0.1λ0, and the size of the metal ground is generally required to be greater than λ0 in both orthogonal directions. Here, λ0 is the wavelength of the electromagnetic wave in vacuum within the antenna's operating frequency band. Due to this limitation of dielectric layer thickness, it is generally considered difficult to apply slot antennas to displays. However, the inventors have overcome this traditional design limitation. They discovered that for slot antennas, reducing the dielectric layer thickness between the metal ground and the feed line to an order of magnitude that can be integrated into the array substrate, such as 0.001λ0, has little impact on the radiation efficiency of the slot antenna, and the width of the metal ground perpendicular to the slot length direction can be compressed to between 0.04λ0 and 0.1λ0.
[0078] Embodiments of this disclosure provide a microstrip slot antenna that has a smaller size compared to conventional antennas (e.g., patch antennas) attached to an array substrate. For example, the size of the slot antenna in the embodiments of this disclosure can be reduced by 50% to 90% compared to a conventional patch antenna.
[0079] In existing antenna designs for array substrates, the optical transmittance of the display area can only reach 80% to 90% due to the influence of alignment accuracy and the need to form a similar grid pattern structure to the antenna functional area in non-antenna functional areas. However, in the embodiments of this disclosure, since the antenna is formed in the peripheral area of the array substrate rather than in the display area, it has no effect on the light transmittance of the display area, thereby significantly improving the light transmittance of the display area of the array substrate.
[0080] Furthermore, in traditional antenna designs using array substrates, the antenna is first fabricated on a flexible thin film, which is then laminated to the screen, increasing the screen's thickness by over 100 micrometers. This hinders the screen's thinness and flexibility. Unlike traditional patch antenna designs, the embodiments in this disclosure integrate the antenna with the array substrate, essentially not increasing the substrate's thickness. This promotes a thinner and lighter screen and does not affect folding or bending capabilities.
[0081] Existing patch-type on-screen antennas are limited by the finite distance between the antenna and the pixel circuitry, resulting in a radiation efficiency typically below 40%. Furthermore, patch antennas are relatively large and need to be fabricated within the display area, or at least partially situated there. Therefore, to minimize obstruction of the display pixels, a mesh-based patch design is required, with the metal linewidth of the mesh minimized. This increases the antenna's manufacturing cost and reduces its radiation performance. The antenna of the embodiment described in this disclosure avoids these drawbacks, increases radiation efficiency, and also offers advantages in manufacturing cost.
[0082] Figure 2 This is a top view schematic diagram of an array substrate according to an embodiment of the present disclosure. Figure 3 This is a partial top view schematic diagram of an array substrate according to an embodiment of this disclosure. In some embodiments, for example, refer to... Figure 2 The first electrode 2 can be used as an ELVSS electrode line to power the pixel circuitry. Compared to the display area DA (which is also often referred to as the AA area), which has a large number of pixel driving circuits such as data lines, scan lines, and control lines, the area above the first electrode (e.g., the ELVSS electrode line) in the peripheral area PA is relatively "clean" and has no complex wiring. Therefore, it is easier to implement and has a cost advantage in placing the opening of the slot antenna in the first electrode, such as the ELVSS electrode line.
[0083] like Figure 3 As shown, the conductive portion 5 may include a first sub-conductive portion 51 and a second sub-conductive portion 52 connected to the first sub-conductive portion. The width of the first sub-conductive portion 51 is greater than the width of the second sub-conductive portion 52. Furthermore, the projection of the first sub-conductive portion 51 onto the substrate 1 overlaps with the projection of the opening 3 onto the substrate 1. This arrangement of the first conductive portion ensures the radiation efficiency of the antenna. The arrangement of the second conductive portion ensures a standard transmission line impedance (e.g., 50 ohms). Therefore, this conductive portion not only ensures the radiation efficiency of the antenna but also matches the standard transmission line impedance.
[0084] like Figure 3 As shown, the first sub-conductive portion 51 and the second sub-conductive portion 52 can be arranged "vertically," that is, along the extending direction of the first electrode 2. It should be noted that "vertically" here refers to the direction along which the first electrode extends, and "transversely" refers to the direction perpendicular to the extending direction of the first electrode. For example, as shown later... Figure 14 As shown, this is not only for those located in Figure 14 The portions of the electrodes on the left and right sides of the array substrate, for those located in Figure 14 The portion of the first electrode on the upper side of the array substrate, and the corresponding first sub-conductive portion and second sub-conductive portion are also referred to as "longitudinal arrangement".
[0085] This scheme, where the first and second sub-conductive parts are arranged longitudinally, can optimize the radiation efficiency of the slot antenna while meeting the requirements of narrow bezel design. For example, in the case where the first electrode is used as an ELVSS, although the width of the ELVSS itself is only between 100μm and 300μm, a narrow opening can be cut into the ELVSS, with the width of the opening between tens of micrometers and 100 micrometers, thus achieving high radiation efficiency. If the first and second sub-conductive parts are arranged laterally (i.e., along a direction perpendicular to the extension direction of the first electrode), a wider first electrode is required to ensure the radiation efficiency of the antenna, which would limit its application in narrow bezel designs.
[0086] It should be noted that although the first sub-conductive part 51 is shown in a rectangular shape in the figure as an example, it can be configured to have other shapes as needed. For example, in some embodiments, the first sub-conductive part can be configured to have a trapezoidal shape or an arc shape.
[0087] Figure 4 for Figure 3 The diagram shows a partial cross-sectional view of the array substrate along line aa'. Figure 4 As shown, in some embodiments, the opening 3 located in the first electrode 2 has a first opening portion 31 and a second opening portion 32. The projection of the first opening portion 31 onto the substrate 1 overlaps with the projection of the conductive portion 5 onto the substrate 1. The projection of the second opening portion 32 onto the substrate 1 does not overlap with the projection of the conductive portion 5 onto the substrate 1. With this arrangement, the radiation efficiency of the antenna can also be optimized.
[0088] like Figure 4 As shown, the width of the first opening 31 is denoted as w1a, and the width of the second opening 32 is denoted as w1b. The different ratios of the widths w1a and w1b of the first and second openings will cause a change in the peak frequency of the antenna radiation.
[0089] Figure 5 This is a schematic diagram illustrating the radiation efficiency of an antenna according to an embodiment of this disclosure. Assuming the width w1 of opening 3 is 100 micrometers, in... Figure 5 As we can see, as the width w1a of the first opening decreases from 80 micrometers to 60 micrometers and then to 40 micrometers (that is, as the width w1b of the second opening increases from 20 micrometers to 40 micrometers and then to 60 micrometers), a significant blue shift occurs in the antenna's radiation frequency band. However, their radiation efficiencies can all reach 40% to 50% or higher. Therefore, the array substrate of the embodiments of this disclosure has good antenna efficiency.
[0090] In some embodiments, the width w1 of the opening 3 can be between approximately 40 micrometers and 100 micrometers. In some embodiments, such as Figure 3 As shown, the length L1 of the opening can be approximately twice the length L2 of the first sub-conductive part. This configuration is particularly suitable for the millimeter-wave band around 25-30 GHz and can be applied to the 5G field.
[0091] In some embodiments, the dielectric layer 4 may completely fill the opening 3. In other embodiments, the dielectric layer 4 may partially fill the opening 3. In still other embodiments, the dielectric layer 4 may not fill the opening 3.
[0092] Figure 6 for Figure 3 The diagram shows a partial cross-sectional view of the array substrate along the bb' line. Figure 6 As shown, the width of the second sub-conductive portion 52 is denoted as w0, and the distance from the second sub-conductive portion to the opening 3, which includes the first opening portion 31 and the second opening portion 32 (i.e., the distance from the projection of the second sub-conductive portion onto the substrate to the projection of the opening onto the substrate) is denoted as g. Generally, the smaller g is, the stronger the coupling from the conductive portion to the opening, and the higher the radiation efficiency of the antenna. Therefore, if the manufacturing process allows, g can be made as close to zero as possible. The inventors have discovered that making the distance from the projection of the opening onto the substrate to the second sub-conductive portion onto the substrate less than or equal to the width of the second sub-conductive portion (i.e., taking g ≤ w0) can ensure strong coupled radiation.
[0093] The inventors discovered that setting the ratio of the width w2 of the first sub-conductive portion 51 to the width w0 of the second sub-conductive portion 52 to approximately 2-4 can achieve better S11 and peak radiation efficiency. For application frequencies of 25-30 GHz, the width w0 of the sub-conductive portion 52 can be set to 40 micrometers, and the width w2 of the first sub-conductive portion 51 can be set to 120 micrometers.
[0094] Figure 7 This is a gain diagram of an antenna on an array substrate according to some embodiments of this disclosure. Figure 7 Taking an opening width w1 of 100 micrometers and a first opening width of 70 micrometers as an example. From Figure 7 As can be seen, for a wave of 31.3 GHz, the radiation gain of a single antenna can be as high as 3 dBi.
[0095] Figures 8-9 This is a schematic diagram of an array substrate according to some embodiments of this disclosure. For example... Figures 8-9As shown, the array substrate may include at least two openings and at least two conductive portions corresponding to the two openings, wherein the at least two conductive portions are electrically connected through corresponding second sub-conductive portions. This enables the formation of a slot antenna array. The number of openings can be two, three, four, or more, and is not limited here.
[0096] To achieve good radiation gain for the antenna array, the distance L3 from the center of one of the at least two openings to the center of its adjacent opening can be optimized. L3 can be taken as λ / n, where λ is the wavelength of the electromagnetic wave in air and vacuum in the antenna's operating frequency band, and n is the effective refractive index of the antenna medium. Setting the distance from the center of one of the at least two openings to the center of its adjacent opening between approximately 4 and 10 mm will yield good radiation gain for the antenna array.
[0097] Figure 10 This is a partial cross-sectional schematic diagram of an array substrate according to an embodiment of this disclosure. Figure 10 As shown, the array substrate may further include a radio frequency control circuit 6 located on a surface of the substrate opposite to the surface where the first electrode 2 is disposed, and a feed line 53 connected to the conductive portion 5. The feed line 53 is used to electrically connect the conductive portion 2 and the radio frequency control circuit 6. The feed line 53 may include a coplanar waveguide.
[0098] In some embodiments, the array substrate may also have a cover layer 7 disposed on the conductive surface away from the substrate 1. The specific type of cover layer can be determined as needed. For example, the cover layer may include a polarizing layer, an OCA adhesive layer, or a cover glass layer.
[0099] refer to Figure 8 At least two conductive portions 5 can be located on the same side of the feed line 53. In other embodiments, such as Figure 9 As shown, at least two conductive parts 5 are located on different sides of the feed line 53.
[0100] For both schemes where the conductive parts are located on the same side of the feed line and on different sides of the feed line, the resulting antenna radiation efficiency and antenna gain are not significantly different. However, if the feed line is not located in the middle of multiple antennas to feed from the center, there will be a certain phase difference between the different antennas. This phase difference will not only cause beam deflection but also reduce antenna gain. Therefore, if there are two or more antennas, such as Figure 9 As shown, the feed line can also be fed from the middle of multiple antennas to ensure maximum radiation efficiency and gain.
[0101] In some embodiments, the distance w3a from the opening to the side of the first electrode furthest from the display area can be greater than 100 micrometers. In other embodiments, the distance w3b from the opening to the side of the first electrode facing the display area can be greater than 100 micrometers. This ensures that the antenna's radiation efficiency is not affected by the narrow linewidth of the second electrode (e.g., the ELVSS electrode).
[0102] Figure 11 This is a partial top view of an array substrate according to an embodiment of this disclosure. Reference Figure 2 and Figure 11 In some embodiments, the substrate of the array substrate may further include a data fanout area and a bonding area (BA) located in the peripheral area PA, wherein the feed line extends to the bonding area. Since the fanout area and bonding area of the array substrate already correspond to the bending area, no additional bending area is needed to electrically connect the antenna to the RF chip of the array substrate. Therefore, this arrangement does not increase the requirement for screen bezel width, which is advantageous for applications with narrow bezel or bezel-less designs. Furthermore, the opening 3 can be positioned on the same side of the array substrate as the bonding area. This achieves better performance of the array substrate.
[0103] Figure 12 This is a partial cross-sectional schematic diagram of an array substrate according to an embodiment of this disclosure. Figure 13 for Figure 12 A top view of the array substrate. (e.g.) Figure 12 As shown, the array substrate may further include a first conductive layer 9 located on the side of the first electrode 2 away from the substrate. The opening 3 also exposes the surface of the first conductive layer 9 away from the substrate 1 and the surface of the first conductive layer 9 facing the substrate 1. The common electrode 10 may have a first portion 101 and a second portion 102, wherein the projection of the first portion 101 onto the substrate 1 overlaps with the projection of the first conductive layer 9 onto the substrate, and the first portion 101 is in contact with the first conductive layer 9, and wherein the thickness of the first portion 101 is greater than or equal to the thickness of the second portion 102. For example, the thickness of the second portion 102 may be 10-15 nm, and the thickness of the first portion 101 may be 600 nm or more. With this arrangement, the radiation efficiency of the antenna can be further increased.
[0104] In some embodiments of this disclosure, the array substrate may further include at least one pixel unit PU located in the display area DA (e.g., see...). Figure 2 ) and the common electrode 10 located on the at least one pixel unit PU (see Figure 12 In this configuration, the first electrode 2 and the common electrode 10 are electrically connected. The common electrode can be the cathode of the pixel unit.
[0105] refer to Figure 12 The pixel unit PU may include an anode 12, a light-emitting pixel layer 13, and a cathode 10 as a common electrode. The cathode may include a MgAg alloy to ensure optical transmittance.
[0106] In some embodiments, the anode 12 can be disposed in the same layer as the first conductive layer 9, and the thickness of the first conductive layer 9 can be set to be greater than or equal to the thickness of the anode 12. Such a configuration can also increase the radiation efficiency of the antenna. The material of the first conductive layer 9 may include at least one of the following: high-conductivity metal materials such as Ag, Cu, and Al.
[0107] In some embodiments, the first conductive layer 9 may be disposed in the same layer as the anode 12 of the display unit. The opening 3 may satisfy one of the following: 1) partially filled by the dielectric layer 4, 2) completely filled by the dielectric layer 4, or 3) not filled by the dielectric layer 4. The dielectric layer 4 may be a planarization layer for covering the TFT region 15.
[0108] Figure 13 This is a schematic diagram of an array substrate according to an embodiment of this disclosure. Figure 13 As shown, the thickness of the first part 101 can also be greater than or equal to the thickness of the second part 102 (see...). Figure 13 While selecting the cathode thickening region AA', the thickness of the first conductive layer 9 is also set to be greater than or equal to the thickness of the anode 12 (see...). Figure 13 The winning bidder selected the anodic thickening area BB').
[0109] In some embodiments, the opening may include two or more groups of openings, wherein conductive portions corresponding to openings in the same group of openings are connected to the same feeder, and conductive portions corresponding to different groups of openings are connected to different feeders.
[0110] Figure 14 This is a schematic diagram of an array substrate according to an embodiment of this disclosure. Figure 14 As shown, the opening may include at least a first opening group G1 and a second opening group G2, wherein the conductive portion corresponding to the first opening group and the conductive portion corresponding to the second opening group are connected to different feed lines. Figure 14 As shown, the conductive portion corresponding to the first opening group is connected to feed line 53, while the conductive portion corresponding to the second opening group is connected to feed line 53'. Of course, the openings can be configured to include three or more opening groups as needed. In this way, multiple antennas operating in different frequency bands can be formed.
[0111] like Figure 14As shown, for any set of openings, the openings may include a first sub-opening set SS1 and a second sub-opening set SS2. The first sub-opening set is disposed on a first side S1 of the array substrate, and the second sub-opening set is disposed on a second side S2 of the array substrate adjacent to the first side S1. The conductive portion corresponding to the first sub-opening set and the conductive portion corresponding to the second sub-opening set are electrically connected. With this arrangement, a dual-polarization design can be achieved.
[0112] In some embodiments, the difference between the distance from the second sub-aperture set SS2 to the second sub-conductive portion 52 corresponding to the first sub-aperture set SS1 and the distance from the first aperture set SS1 to the second sub-conductive portion 52 corresponding to the second sub-aperture set SS2 is an odd multiple of approximately λ / 4, where λ is the wavelength of the electromagnetic wave in the operating frequency band of the antenna in the equivalent medium of the array substrate. For example, in the 5G application field, the operating frequency band of the antenna can be the millimeter-wave band. This arrangement enables circularly polarized radiation to be formed at the corner positions of the array substrate.
[0113] Figure 15 This is a schematic cross-sectional view of an array substrate according to an embodiment of this disclosure. Figure 15 As shown, the array substrate may include a heat dissipation layer 8 on a surface opposite to the surface of the substrate on which the first electrode is disposed, and an additional substrate layer 16 between the substrate 1 and the heat dissipation layer 8. The additional substrate layer 16 satisfies at least one of the following: the absorption of millimeter-wave electromagnetic waves by the additional substrate layer is greater than the absorption of electromagnetic waves by the substrate layer; and the refractive index of the additional substrate layer for millimeter-wave electromagnetic waves is greater than the refractive index of the substrate layer for electromagnetic waves. The scattering layer typically reflects the upward (i.e., along the direction away from the substrate) of the back lobe of the slot antenna, which creates a destructive physical process with the upward radiated energy of the forward lobe of the back lobe of the slot antenna, resulting in a decrease in the forward radiation efficiency of the array substrate. However, Figure 15 The proposed solution reduces the upward (i.e., along the direction away from the substrate) reflection of the back lobe of the slot antenna, thereby improving the antenna's radiation efficiency.
[0114] Figure 16 This is a schematic cross-sectional view of an array substrate according to an embodiment of this disclosure. Figure 6 As shown, the array substrate may further include an additional opening 17 disposed in the heat dissipation layer, wherein the projection of the additional opening on the substrate at least partially overlaps with the projection of the opening on the substrate. Such an additional opening can also reduce the upward (i.e., along the direction away from the substrate) reflection of the back lobe of the slot antenna, thereby improving the antenna's radiation efficiency.
[0115] Figure 17 This is a schematic cross-sectional view of an array substrate according to an embodiment of this disclosure. Figure 17As shown, while the array substrate is provided with an additional substrate 8, an additional opening 17 is also provided in the heat dissipation layer 8.
[0116] Figure 18 This is a schematic diagram of the heat dissipation layer of the array substrate according to this disclosure. Figure 18 As shown, an artificial magnetic conductor 18 can be disposed on the surface of the heat dissipation layer of the array substrate facing the substrate. This artificial magnetic conductor 18 is used to change the magnetic field phase of the electromagnetic wave leaving it without changing its electric field phase. The magnetic conductor can be an artificial magnetic surface, a patch resonant unit, etc. With this arrangement, the electromagnetic wave reflected from the heat dissipation layer 8 will not only not cancel out with the forward lobe of the antenna, but will instead form constructive interference, thereby further increasing the forward radiation efficiency of the antenna.
[0117] Figure 19 This is a schematic diagram of a display panel according to the text of this disclosure. Figure 19 As shown, the display panel 100 according to an embodiment of this disclosure may include an array substrate 200, wherein the array substrate 200 may be... Figure 1-18 Any one of the array substrates shown.
[0118] Figure 20 This is a flowchart illustrating a method for manufacturing an array substrate as described in this disclosure. Figure 20 As shown, a method for manufacturing an array substrate according to an embodiment of the disclosed text includes:
[0119] S1. A substrate is provided, the substrate having a display area and a peripheral area surrounding the display area;
[0120] S3. A first electrode is disposed on the peripheral region of the substrate;
[0121] S5. An opening is provided in the first electrode, wherein the opening passes through the surface of the first electrode away from the substrate and the surface of the first electrode facing the substrate;
[0122] S7. A dielectric layer is disposed on the side of the first electrode away from the substrate;
[0123] S9. A conductive portion is provided on the side of the dielectric layer away from the substrate.
[0124] A particular embodiment has been described, which is shown by way of example only and is not intended to limit the scope of this disclosure. In fact, the novel embodiments described herein can be implemented in various other forms; furthermore, various omissions, substitutions, and changes may be made to the form of the embodiments described herein without departing from the spirit of this disclosure. The appended claims and their equivalents are intended to cover such forms or modifications that fall within the scope and spirit of this disclosure.
Claims
1. An array substrate, comprising: A substrate having a display area and a peripheral area surrounding the display area; A first electrode located on the substrate and in the peripheral region; An opening located in the first electrode, wherein the opening passes through the surface of the first electrode away from the substrate and reaches the surface of the first electrode facing the substrate; A dielectric layer located on the side of the first electrode away from the substrate; A conductive portion is located on the side of the dielectric layer away from the substrate, and wherein the conductive portion, the dielectric layer, and the opening form an antenna. The conductive portion includes a first sub-conductive portion and a second sub-conductive portion connected to the first sub-conductive portion. The width of the first sub-conductive portion is greater than the width of the second sub-conductive portion. Furthermore, the projection of the first sub-conductive portion onto the substrate overlaps with the projection of the opening onto the substrate. The opening has a first opening portion and a second opening portion. The projection of the first opening portion on the substrate overlaps with the projection of the conductive portion on the substrate, while the projection of the second opening portion on the substrate does not overlap with the projection of the conductive portion on the substrate.
2. The array substrate according to claim 1, wherein, The first sub-conductive portion and the second sub-conductive portion are arranged along the extension direction of the first electrode.
3. The array substrate according to claim 1, wherein, The width of the opening is between 0 micrometers and 100 micrometers, and the length of the opening is twice the length of the first sub-conductive part.
4. The array substrate according to claim 1, wherein, The distance from the projection of the opening on the substrate to the second sub-conductive part on the substrate is less than or equal to the width of the second sub-conductive part.
5. The array substrate according to claim 1, wherein, The ratio of the width of the first sub-conductive part to the width of the second sub-conductive part is between 2 and 4.
6. The array substrate according to claim 5, wherein, The width of the first sub-conductive part is 120 micrometers, and the width of the second sub-conductive part is 30 micrometers.
7. The array substrate according to claim 1, wherein, The array substrate includes at least two openings and at least two conductive portions corresponding to the at least two openings, wherein the at least two conductive portions are electrically connected through corresponding second sub-conductive portions.
8. The array substrate according to claim 7, wherein, The distance from the center of one of the at least two openings to the center of its adjacent opening is between 4 and 10 mm.
9. The array substrate according to claim 7, further comprising: A radio frequency control circuit located on the surface of the substrate opposite to the surface on which the first electrode is disposed; as well as A feed line connected to the conductive part, the feed line being used to electrically connect the conductive part and the radio frequency control circuit.
10. The array substrate of claim 9, wherein the substrate further comprises a bonding region located in the peripheral region, wherein, The feed line extends to the bonding area.
11. The array substrate according to claim 10, wherein, The opening and the bonding area are located on the same side of the array substrate.
12. The array substrate according to claim 9, wherein, The feed line includes a coplanar waveguide.
13. The array substrate according to claim 9 or 10, wherein, The at least two conductive parts are located on the same side of the feed line.
14. The array substrate according to claim 9 or 10, wherein, The at least two conductive parts are located on different sides of the feed line.
15. The array substrate according to claim 1, wherein, The distance from the opening to the side of the first electrode away from the display area is greater than 100 micrometers, and the distance from the opening to the side of the first electrode facing the display area is greater than 100 micrometers.
16. The array substrate according to claim 1, further comprising: At least one pixel unit located in the display area; as well as A common electrode located on the at least one pixel unit, wherein the first electrode and the common electrode are electrically connected.
17. The array substrate according to claim 16, further comprising: A first conductive layer is located on the first electrode, wherein the opening exposes the surface of the first conductive layer away from the substrate and the surface of the first conductive layer facing the substrate. The common electrode has a first part and a second part, wherein the projection of the first part onto the substrate overlaps with the projection of the first conductive layer onto the substrate, and the first part is in contact with the first conductive layer, and wherein the thickness of the first part is greater than or equal to the thickness of the second part.
18. The array substrate according to claim 16, further comprising: A first conductive layer is located on the side of the first electrode away from the substrate, wherein the opening exposes the surface of the first conductive layer away from the substrate and the surface of the first conductive layer facing the substrate; The pixel unit further includes an anode located between the substrate and the common electrode, wherein the anode and the first conductive layer are disposed in the same layer, and wherein the thickness of the first conductive layer is greater than or equal to the thickness of the anode.
19. The array substrate according to claim 7, wherein, The at least two openings comprise two or more groups of openings, wherein conductive portions corresponding to openings in the same group of openings are connected to the same feeder, and conductive portions corresponding to different groups of openings are connected to different feeders.
20. The array substrate according to claim 7, wherein, The at least two openings include a first sub-opening set and a second sub-opening set, wherein the first sub-opening set is disposed on a first side of the array substrate, and the second sub-opening set is disposed on a second side of the array substrate adjacent to the first side, wherein the conductive portion corresponding to the first sub-opening set and the conductive portion corresponding to the second sub-opening set are electrically connected.
21. The array substrate according to claim 20, wherein, The difference between the distance from the second sub-aperture set to the second sub-conductive part corresponding to the first sub-aperture set and the distance from the first sub-aperture set to the second sub-conductive part corresponding to the second sub-aperture set is an odd multiple of λ / 4, where λ is the wavelength of the electromagnetic wave in the operating frequency band of the antenna in the equivalent medium of the array substrate.
22. The array substrate according to claim 21, further comprising: A heat dissipation layer located on the surface of the substrate opposite to the surface on which the first electrode is disposed; An additional substrate layer located between the substrate and the heat dissipation layer, wherein the additional substrate layer satisfies at least one of the following: The additional substrate layer has a greater absorption capacity for millimeter-wave electromagnetic waves than the substrate layer itself; and The additional substrate has a higher refractive index for millimeter-wave electromagnetic waves than the substrate itself.
23. The array substrate according to claim 21, further comprising: A heat dissipation layer located on the surface of the substrate opposite to the surface where the first electrode is disposed; An additional opening located in the heat dissipation layer, wherein the projection of the additional opening onto the substrate at least partially overlaps with the projection of the opening onto the substrate.
24. The array substrate according to claim 21, further comprising: A heat dissipation layer is located on the surface of the substrate opposite to the surface on which the first electrode is disposed. An artificial magnetic conductor is disposed on the surface of the heat dissipation layer facing the substrate. The artificial magnetic conductor is used to stabilize the electric field phase by changing the magnetic field phase of the electromagnetic wave leaving it.
25. A display panel comprising an array substrate according to any one of claims 1-24.
26. A method for manufacturing an array substrate, comprising: A substrate is provided, the substrate having a display area and a peripheral area surrounding the display area; A first electrode is disposed on the peripheral region of the substrate; An opening is provided in the first electrode, wherein the opening passes through the surface of the first electrode away from the substrate and the surface of the first electrode facing the substrate; A dielectric layer is disposed on the side of the first electrode away from the substrate; A conductive portion is provided on the side of the dielectric layer away from the substrate. The conductive portion includes a first sub-conductive portion and a second sub-conductive portion connected to the first sub-conductive portion. The width of the first sub-conductive portion is greater than the width of the second sub-conductive portion. Furthermore, the projection of the first sub-conductive portion onto the substrate overlaps with the projection of the opening onto the substrate. The opening has a first opening portion and a second opening portion. The projection of the first opening portion on the substrate overlaps with the projection of the conductive portion on the substrate, while the projection of the second opening portion on the substrate does not overlap with the projection of the conductive portion on the substrate.