An ultrasonic water-assisted laser grooving system and method

Abstract

The application belongs to the field of laser micro-nano processing, and particularly relates to an ultrasonic water-assisted laser slotting system and method, which comprises the following: a laser, which is used for emitting a laser beam to a beam shaping mechanism; the beam shaping mechanism, which is used for converting the laser beam output by the laser into a flat-top beam with concentrated energy and uniform distribution, and outputting a collimated laser beam to a laser processing head; the laser processing head, which is used for focusing the collimated laser beam output by the beam shaping mechanism to form a laser energy beam for processing a workpiece, and acting on the workpiece to process the workpiece; a three-axis motion work platform, which completes a preset laser slotting motion track in a three-dimensional space through X / Y / Z three-axis linkage; an ultrasonic emitter, which is arranged on the three-axis motion work platform and is used for emitting ultrasonic waves to an ultrasonic reflecting disc; and a negative pressure dust collector, which is arranged between the three-axis motion work platform and the laser processing head, and collects and discharges the gathered plasma and processing products through vacuum negative pressure action.

Description

Technical Field

[0001] This invention belongs to the field of laser micro-nano processing, specifically an ultrasonic water-assisted laser grooving system and method. Background Technology

[0002] Ultrafast lasers are characterized by short pulse duration and high peak power. By injecting laser energy into the material processing area in an extremely short time, the surface temperature of the material is instantly raised, the surface material is converted into a plasma state and ejected from the surface, achieving the purpose of material removal. Because ultrafast pulsed lasers have a very small heat-affected zone during processing, they can almost achieve the effect of cold processing. Furthermore, they offer advantages such as high efficiency, precision, and environmental friendliness. In recent years, they have been widely used in the fabrication of micro-nano devices and structures, enabling the processing of micro-deep trench structures and other similar applications.

[0003] However, the ultrafast laser processing of microgrooves generates plasma that accumulates above the groove, shielding it from laser radiation and hindering further increases in groove depth. Furthermore, as the groove depth increases, molten spatter generated during processing struggles to escape from the groove, sometimes even re-condensing and falling back onto the groove wall. This reduces the energy of the laser propagating to the bottom of the groove, preventing further depth increases and ultimately affecting the processing quality. Therefore, a universal solution is urgently needed to achieve high-quality, high-efficiency processing of microgrooves in various materials. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide an ultrasonic water-assisted laser grooving system and method. This method utilizes acoustic radiation force to capture micro- and nano-particles in an ultrasonic field to assist laser grooving. Ultrasonic waves cause plasma and processing products generated during ultrafast laser processing to accumulate at fixed nodes in the standing wave acoustic field. Simultaneously, a powerful negative pressure vacuum cleaner removes the accumulated plasma and molten spatter, reducing their accumulation. The rapid removal of plasma eliminates the shielding effect of plasma clouds above the microgrooves on the laser, thereby improving the grooving efficiency of the ultrafast laser. The rapid removal of molten spatter prevents its re-deposition on the groove walls, thus improving the processing quality and grooving depth of the ultrafast laser.

[0005] The technical solution adopted by the present invention to achieve the above objectives is: an ultrasonic water-assisted laser grooving system, comprising: a laser, a beam shaping mechanism, a laser processing head, a three-axis motion worktable, an ultrasonic transmitter, an ultrasonic reflector, and a negative pressure vacuum cleaner;

[0006] The laser is positioned horizontally and is used to emit a laser beam to the beam shaping mechanism;

[0007] The beam shaping mechanism is located between the laser and the laser processing head. It is used to convert the laser beam output by the laser into a flat-top beam with concentrated energy and uniform distribution, and output the collimated laser beam to the laser processing head.

[0008] The laser processing head is positioned between the beam shaping mechanism and the three-axis motion stage, with the laser processing head located directly above the three-axis motion stage. It is used to focus the collimated laser beam output by the beam shaping mechanism to form a laser energy beam for processing the workpiece, and to act on the workpiece to process it.

[0009] The three-axis motion work platform is used to clamp the workpiece and complete the preset laser grooving motion trajectory in three-dimensional space through X / Y / Z three-axis linkage;

[0010] The ultrasonic transmitter is mounted on a three-axis motion worktable and is used to emit ultrasonic waves to the ultrasonic reflector.

[0011] The ultrasonic reflector is set on a three-axis motion worktable to reflect the ultrasonic waves emitted by the ultrasonic transmitter. The reflected ultrasonic waves are superimposed with the incident ultrasonic waves to form a standing wave sound field. The plasma and molten spatter generated by the workpiece placed in the standing wave sound field during the processing are captured by the sound radiation force, so that the plasma and molten spatter are gathered at the fixed nodes of the standing wave sound field. The gathered plasma and processing products are then collected, recovered and discharged by a negative pressure vacuum cleaner.

[0012] The negative pressure vacuum cleaner is located between the three-axis motion worktable and the laser processing head, and collects and discharges the accumulated plasma and processing products through the vacuum negative pressure.

[0013] The laser is an ultrafast laser;

[0014] The laser generated by the laser includes picosecond lasers or femtosecond lasers; the pulse width range of the laser generated by the laser is 300 fs to 5 ps.

[0015] The beam shaping mechanism includes: a variable aperture and a beam expander arranged in sequence;

[0016] The variable aperture is used to filter out stray light from the edge of the laser beam;

[0017] The beam expander is used to enlarge the diameter of the collimated input beam and to expand it to the collimated output beam with the required output diameter.

[0018] The laser processing head includes: a scanning galvanometer and a focusing lens;

[0019] The scanning galvanometer is composed of a pair of scanning galvanometers in the XY direction, used to achieve deflection scanning of the incident laser beam; the scanning galvanometer is located directly above the focusing lens, and after receiving the laser beam incident by the beam shaping mechanism, it reflects it to the focusing lens;

[0020] The focusing lens is used to focus the laser beam and apply it to the workpiece for laser processing.

[0021] The laser, the beam shaping mechanism, and the scanning galvanometer in the laser processing head are coaxially arranged and located on the same horizontal plane.

[0022] The ultrasonic transmitter includes: an ultrasonic power supply, a piezoelectric transducer, an amplitude transformer, and a radiating end;

[0023] The ultrasonic power supply is connected to the piezoelectric transducer and is used to provide the ultrasonic power necessary for the piezoelectric transducer to operate.

[0024] The piezoelectric transducer is used to convert the ultrasonic electrical oscillation signal emitted by the ultrasonic power supply into the form of mechanical vibration, and after amplifying the amplitude through the amplitude transformer, the emitted ultrasonic wave is focused into a set direction for emission through the radiating end.

[0025] The piezoelectric transducer includes a rear cover plate, a piezoelectric ceramic sheet, a copper electrode sheet, and a front cover plate that are attached to each other from back to front, and are fastened together by pre-tightening bolts to form a longitudinal vibration unit.

[0026] The ultrasonic transmitter is located on one side of the working plane of the three-axis motion stage, and the ultrasonic reflector is located on the other side of the working plane of the three-axis motion stage. The ultrasonic transmitter and the ultrasonic reflector are arranged opposite to each other, and a workpiece is installed on the working plane of the three-axis motion stage between them.

[0027] A grooving method using an ultrasonic water-assisted laser grooving system includes the following steps:

[0028] Step 1) Set the processing method and processing parameters; start the laser and emit laser light towards the horizontal beam shaping mechanism (2);

[0029] Step 2) Clamp the workpiece to be processed on the working plane of the three-axis motion table, and inject a certain amount of cooling water into the cooling water tank until the workpiece to be processed is submerged, leaving only the top surface exposed to the air;

[0030] Step 3) Control the three-axis motion table through PLC to move the workpiece in the XYZ three-axis directions and reach the position to be processed;

[0031] Step 4) The laser emitted by the laser passes through the beam shaping mechanism and the laser processing head to form a laser energy beam for processing the workpiece, and acts on the workpiece to perform the processing steps.

[0032] Step 5) Start the ultrasonic transmitter. The ultrasonic waves emitted by the ultrasonic transmitter and the ultrasonic waves reflected by the ultrasonic reflector form a standing wave sound field, which focuses the plasma and molten spatter generated during processing at fixed nodes in the standing wave sound field.

[0033] Step 6) Start the negative pressure vacuum cleaner to collect and discharge the plasma and molten splashes at the nodes of the standing wave sound field through the vacuum negative pressure, thus completing the processing flow of one workpiece.

[0034] The processing parameters are: the width of the processing groove ranges from 0.1mm to 3mm, and the maximum processing depth-to-width ratio is greater than 10:1.

[0035] In step 5), the ultrasonic transmitter is activated, and the ultrasonic waves emitted by the ultrasonic transmitter and the ultrasonic waves reflected by the ultrasonic reflector form a standing wave sound field, specifically as follows:

[0036] When the ultrasonic transmitter is activated, the voltage generated by the ultrasonic power supply is transmitted to the piezoelectric ceramic through the ultrasonic transmitter, causing the piezoelectric ceramic to vibrate. The vibration generated by the piezoelectric ceramic causes the surrounding medium to vibrate, thereby generating ultrasonic waves. The ultrasonic waves are reflected by the ultrasonic reflector, and the reflected ultrasonic waves are superimposed with the incident ultrasonic waves to form a standing wave sound field. The plasma and molten spatter generated by the workpiece placed in the standing wave sound field during the processing are captured by the sound radiation force, and the plasma and molten spatter are concentrated at fixed nodes in the standing wave sound field.

[0037] The present invention has the following beneficial effects and advantages:

[0038] 1. This invention utilizes acoustic radiation force to capture micro-nano particles in an ultrasonic field to assist in laser grooving. Ultrasonic waves are used to concentrate the plasma and processing products generated during ultrafast laser processing at fixed nodes in the standing wave acoustic field.

[0039] 2. This invention utilizes cooling water to assist in cooling the process, thereby reducing the heat-affected zone on the back of the workpiece and improving the processing quality of the workpiece;

[0040] 3. The rapid discharge of plasma in this invention can eliminate the shielding effect of the plasma gas cloud gathered above the microgroove on the laser, thereby improving the grooving efficiency of the ultrafast laser.

[0041] 4. The present invention enables rapid discharge of molten spatter, which can prevent molten spatter from redepositing on the tank wall, thereby improving the processing quality and groove depth of ultrafast laser.

[0042] 5. This invention can be applied to various grooving methods, and can guarantee grooving efficiency and processing quality in all cases.

[0043] 6. This invention combines an ultrasonic transmitter and a negative pressure vacuum cleaner to rapidly reduce the accumulation of plasma and molten splashes, ensuring stability throughout the grooving process. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the ultrasonic water-assisted laser grooving system in an embodiment of the present invention.

[0045] Figure 2 This is a flowchart of the ultrasonic water-assisted laser processing method in an embodiment of the present invention.

[0046] Figure 3a This is the effect of ordinary laser grooving;

[0047] Figure 3b The effect of the ultrasonic water-assisted laser grooving technology solution of the present invention;

[0048] In the diagram: 1 is an ultrafast laser, 2 is a beam shaping mechanism, 3 is a laser processing head, 4 is a three-axis motion stage, 5 is an ultrasonic transmitter, 6 is an ultrasonic reflector, 7 is a negative pressure dust collector, 8 is a workpiece, 9 is cooling water, 10 is an ultrafast laser beam, 11 is a focusing lens, 12 is a plasma cloud, 13 is molten spatter, and 14 is a fragmented plasma cloud. Detailed Implementation

[0049] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0050] like Figure 1 The diagram shown is a schematic representation of the ultrasonic water-assisted laser grooving system in an embodiment of the present invention. The ultrasonic water-assisted laser grooving system of the present invention includes: a laser 1, a beam shaping mechanism 2, a laser processing head 3, a three-axis motion stage 4, an ultrasonic transmitter 5, an ultrasonic reflector 6, and a negative pressure vacuum cleaner 7;

[0051] Laser 1 is horizontally positioned and is used to emit a laser beam to beam shaping mechanism 2; wherein, laser 1 is an ultrafast laser; the laser generated by laser 1 includes picosecond laser or femtosecond laser; the pulse width range of the laser generated by laser 1 is 300 fs to 5 ps.

[0052] The beam shaping mechanism 2 is located between the laser 1 and the laser processing head 3. It is used to convert the laser beam output by the laser 1 into a flat-top beam with concentrated energy and uniform distribution, and output the collimated laser beam to the laser processing head 3.

[0053] The beam shaping mechanism 2 includes: a variable aperture and a beam expander arranged in sequence; the variable aperture is used to filter out stray light at the edge of the laser beam; the beam expander is used to expand the diameter of the collimated input beam to the collimated output beam with the required output diameter.

[0054] The laser processing head 3 is positioned between the beam shaping mechanism 2 and the three-axis motion table 4, and is located directly above the three-axis motion table 4. It is used to focus the collimated laser beam output by the beam shaping mechanism 2 to form a laser energy beam for processing the workpiece 8, and to act on the workpiece to process the workpiece 8.

[0055] The laser processing head 3 includes: a scanning galvanometer and a focusing lens;

[0056] The scanning galvanometer consists of a pair of scanning galvanometers in the XY direction, used to deflect and scan the incident laser beam; the scanning galvanometer is positioned directly above the focusing lens, and after receiving the laser beam incident from the beam shaping mechanism 2, it reflects it back to the focusing lens;

[0057] The focusing lens is used to focus the laser beam onto the workpiece 8 for laser processing.

[0058] The laser 1, the beam shaping mechanism 2, and the scanning galvanometer in the laser processing head 3 are coaxially arranged and located on the same horizontal plane.

[0059] The three-axis motion work platform 4 is used to clamp the workpiece 8 and complete the preset laser grooving motion trajectory in three-dimensional space through the X / Y / Z three-axis linkage.

[0060] The three-axis motion worktable 4 includes a cooling water tank, a clamping device, a lifting platform, and a displacement platform; wherein, the cooling water tank is used to inject a certain amount of cooling water to assist cooling, the clamping device is used to clamp the workpiece to be processed; the lifting platform is used to drive the workpiece to move along the direction of the laser beam; and the displacement platform is used to drive the workpiece to move in a plane perpendicular to the direction of the laser beam.

[0061] The ultrasonic transmitter 5 is mounted on the three-axis motion stage 4 and is used to transmit ultrasonic waves to the ultrasonic reflector disk 6.

[0062] The ultrasonic transmitter 5 includes: an ultrasonic power supply, a piezoelectric transducer, an amplitude transformer, and a radiating end;

[0063] The ultrasonic power supply is connected to the piezoelectric transducer and is used to provide the ultrasonic power necessary for the piezoelectric transducer to operate.

[0064] A piezoelectric transducer is used to convert the ultrasonic electrical oscillation signal emitted by an ultrasonic power source into the form of mechanical vibration. After the amplitude is amplified by an amplitude transformer, the emitted ultrasonic wave is focused into a set direction by the radiating end for emission.

[0065] The piezoelectric transducer includes a rear cover plate, a piezoelectric ceramic sheet, a copper electrode sheet, and a front cover plate that are attached to each other from back to front, and are fastened together by pre-tightening bolts to form a longitudinal vibration unit.

[0066] The ultrasonic reflector 6 is set on the three-axis motion worktable 4 to reflect the ultrasonic waves emitted by the ultrasonic transmitter 5. The reflected ultrasonic waves are superimposed with the incident ultrasonic waves to form a standing wave sound field. The plasma and molten splashes generated by the workpiece placed in the standing wave sound field during the processing are captured by the sound radiation force, so that the plasma and molten splashes are gathered at the fixed nodes of the standing wave sound field. The gathered plasma and processing products are sucked up, recycled and discharged by the negative pressure vacuum cleaner 7.

[0067] An ultrasonic transmitter 5 is set on one side of the working plane of a three-axis motion stage 4, and an ultrasonic reflector 6 is set on the other side of the working plane of a three-axis motion stage 4. The ultrasonic transmitter 5 and the ultrasonic reflector 6 are arranged opposite to each other, and a workpiece 8 is installed on the working plane of the three-axis motion stage 4 between them.

[0068] The negative pressure vacuum cleaner 7 is located between the three-axis motion worktable 4 and the laser processing head 3. It collects and discharges the accumulated plasma and processing products through the vacuum negative pressure.

[0069] like Figure 2 The diagram shown is a flowchart of the ultrasonic water-assisted laser processing method in an embodiment of the present invention. The grooving method based on the ultrasonic water-assisted laser grooving system of the present invention is applicable to grooving of various processing materials, including heat-resistant alloys, cemented carbide, ceramics, gemstones, glass, composite materials and other metal and non-metal materials.

[0070] Specifically, the following steps are included:

[0071] Before starting laser 1, the processing parameters should be set;

[0072] The processing parameters are as follows: the width of the processing groove ranges from 0.1mm to 3mm, and the maximum processing depth-to-width ratio is greater than 10:1.

[0073] S1. Start laser 1 and emit laser;

[0074] S2. Correctly clamp the workpiece 8 to be processed on the three-axis motion worktable 4, and inject a certain amount of cooling water into the cooling water tank until the workpiece to be processed is submerged, leaving only the top surface in the air.

[0075] S3. Move the three-axis motion worktable 4 to bring the workpiece 8 to the position to be processed;

[0076] S4. The laser beam passes through the beam shaping mechanism 2 and the laser processing head 3 to form a laser energy beam that can be used for processing;

[0077] S5. A laser beam acts on the workpiece to process the workpiece 8;

[0078] S6. Start the ultrasonic power supply. The voltage generated by the ultrasonic power supply is transmitted to the piezoelectric ceramic through the ultrasonic transmitter 5, causing the piezoelectric ceramic to vibrate. The vibration generated by the piezoelectric ceramic causes the surrounding medium to vibrate, thereby generating ultrasonic waves. The ultrasonic waves are reflected by the ultrasonic reflector 6. The reflected ultrasonic waves and the incident ultrasonic waves are superimposed to form a standing wave sound field. The plasma and molten splashes generated by the workpiece placed in the standing wave sound field during the processing are captured by the sound radiation force, and the plasma and molten splashes are concentrated at the fixed nodes of the standing wave sound field.

[0079] S7. Start the negative pressure vacuum cleaner 7. The vacuum negative pressure action collects and discharges the plasma and molten splashes at the ultrasonic standing wave nodes, which can accelerate the discharge of processing products such as plasma and molten splashes in the micro-deep groove, and realize high-quality and high-efficiency processing of micro-deep grooves.

[0080] like Figures 3a-3b As shown, this invention adds ultrasonic assistance to the traditional ultrafast laser grooving method, such as... Figure 3a and Figure 3b The image shows a comparison between conventional ultrafast laser grooving and ultrasonic-assisted ultrafast laser grooving. During conventional ultrafast laser processing of microgrooves, some material within the laser ablation zone is converted into material vapor plasma clusters, which shield the laser radiation. Furthermore, some molten spatter re-deposits on the groove wall, hindering laser processing and affecting processing quality. With ultrasonic assistance, the workpiece placed in the standing wave sound field is effectively expelled from the microgrooves under the influence of acoustic radiation.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An ultrasonic water-assisted laser grooving system, characterized in that, include: Laser (1), beam shaping mechanism (2), laser processing head (3), three-axis motion table (4), ultrasonic transmitter (5), ultrasonic reflector (6), and negative pressure vacuum cleaner (7); The laser (1) is horizontally positioned and is used to emit a laser beam to the beam shaping mechanism (2); The beam shaping mechanism (2) is located between the laser (1) and the laser processing head (3) to convert the laser beam output by the laser (1) into a flat-top beam with concentrated energy and uniform distribution, and output the collimated laser beam to the laser processing head (3). The laser processing head (3) is located between the beam shaping mechanism (2) and the three-axis motion table (4), and the laser processing head (3) is located directly above the three-axis motion table (4). It is used to focus the collimated laser beam output by the beam shaping mechanism (2) to form a laser energy beam for processing the workpiece (8) and to act on the workpiece to process the workpiece (8). The three-axis motion table (4) is used to clamp the workpiece (8) and complete the preset laser grooving motion trajectory in three-dimensional space through X / Y / Z three-axis linkage; The ultrasonic transmitter (5) is mounted on a three-axis motion stage (4) and is used to transmit ultrasonic waves to the ultrasonic reflector (6). The ultrasonic reflector (6) is set on the three-axis motion table (4) to reflect the ultrasonic waves emitted by the ultrasonic transmitter (5). The reflected ultrasonic waves are superimposed with the incident ultrasonic waves to form a standing wave sound field. The plasma and molten splashes generated by the workpiece placed in the standing wave sound field during the processing are captured by the sound radiation force, so that the plasma and molten splashes are gathered at the fixed nodes of the standing wave sound field. The gathered plasma and processing products are collected, recovered and discharged by the negative pressure vacuum cleaner (7). The negative pressure vacuum cleaner (7) is located between the three-axis motion worktable (4) and the laser processing head (3), and collects and discharges the accumulated plasma and processing products through the vacuum negative pressure.

2. The ultrasonic water-assisted laser grooving system according to claim 1, characterized in that, The laser (1) is an ultrafast laser; The laser generated by the laser (1) includes picosecond laser or femtosecond laser; the pulse width range of the laser generated by the laser (1) is 300fs to 5ps.

3. The ultrasonic water-assisted laser grooving system according to claim 1, characterized in that, The beam shaping mechanism (2) includes: a variable aperture and a beam expander arranged in sequence; The variable aperture is used to filter out stray light from the edge of the laser beam; The beam expander is used to enlarge the diameter of the collimated input beam and to expand it to the collimated output beam with the required output diameter.

4. The ultrasonic water-assisted laser grooving system according to claim 1, characterized in that, The laser processing head (3) includes: a scanning galvanometer and a focusing lens; The scanning galvanometer is composed of a pair of scanning galvanometers in the XY direction, used to realize the deflection scanning of the incident laser beam; the scanning galvanometer is located directly above the focusing lens, and after receiving the laser beam incident by the beam shaping mechanism (2), it is reflected to the focusing lens; The focusing lens is used to focus the laser beam and apply it to the workpiece (8) for laser processing.

5. The ultrasonic water-assisted laser grooving system according to claim 1, characterized in that, The scanning galvanometer in the laser (1), beam shaping mechanism (2) and laser processing head (3) is coaxially arranged and located on the same horizontal plane.

6. The ultrasonic water-assisted laser grooving system according to claim 1, characterized in that, The ultrasonic transmitter (5) includes: an ultrasonic power supply, a piezoelectric transducer, an amplitude transformer, and a radiating end; The ultrasonic power supply is connected to the piezoelectric transducer and is used to provide the ultrasonic power necessary for the piezoelectric transducer to operate. The piezoelectric transducer is used to convert the ultrasonic electrical oscillation signal emitted by the ultrasonic power supply into the form of mechanical vibration, and after amplifying the amplitude through the amplitude transformer, the emitted ultrasonic wave is focused into a set direction for emission through the radiating end. The piezoelectric transducer includes a rear cover plate, a piezoelectric ceramic sheet, a copper electrode sheet, and a front cover plate that are attached to each other from back to front, and are fastened together by pre-tightening bolts to form a longitudinal vibration unit.

7. The ultrasonic water-assisted laser grooving system according to claim 1, characterized in that, The ultrasonic transmitter (5) is set on one side of the working plane of the three-axis motion table (4), and the ultrasonic reflector (6) is set on the other side of the working plane of the three-axis motion table (4). The ultrasonic transmitter (5) and the ultrasonic reflector (6) are arranged opposite to each other, and a workpiece (8) is installed on the working plane of the three-axis motion table (4) between them.

8. A grooving method for an ultrasonic water-assisted laser grooving system according to any one of claims 1 to 7, characterized in that, Includes the following steps: Step 1) Set the processing parameters; start the laser (1) and emit laser light into the horizontal beam shaping mechanism (2); Step 2) Clamp the workpiece (8) to be processed on the working plane of the three-axis motion table (4), and inject a certain amount of cooling water into the cooling water tank until the workpiece to be processed is submerged, leaving only the top surface in the air; Step 3) Control the three-axis motion table (4) through PLC to move the workpiece (8) in the XYZ three-axis direction and reach the position to be processed; Step 4) The laser emitted by the laser (1) passes through the beam shaping mechanism (2) and the laser processing head (3) to form a laser energy beam for processing the workpiece (8), and acts on the workpiece (8) to perform the processing procedure. Step 5) Start the ultrasonic transmitter (5). The ultrasonic waves emitted by the ultrasonic transmitter (5) and the ultrasonic waves reflected by the ultrasonic reflector (6) form a standing wave sound field to concentrate the plasma and molten spatter generated during processing at the fixed nodes of the standing wave sound field. Step 6) Start the negative pressure vacuum cleaner (7) to collect and discharge the plasma and molten splashes at the nodes of the standing wave sound field through the vacuum negative pressure, thus completing the processing flow of a workpiece.

9. The grooving method of the ultrasonic water-assisted laser grooving system according to claim 8, wherein the processing parameters are: the width of the grooving groove is in the range of 0.1mm to 3mm, and the maximum depth-to-width ratio is greater than 10:

1.

10. The grooving method of the ultrasonic water-assisted laser grooving system according to claim 8, in step 5), the ultrasonic transmitter (5) is activated, and the ultrasonic waves emitted by the ultrasonic transmitter (5) and the ultrasonic waves reflected by the ultrasonic reflector (6) form a standing wave sound field, specifically: When the ultrasonic transmitter (5) is activated, the voltage generated by the ultrasonic power supply is transmitted to the piezoelectric ceramic through the ultrasonic transmitter, causing the piezoelectric ceramic to vibrate. The vibration generated by the piezoelectric ceramic causes the surrounding medium to vibrate, thereby generating ultrasonic waves. The ultrasonic waves are reflected by the ultrasonic reflector (6), and the reflected ultrasonic waves are superimposed with the incident ultrasonic waves to form a standing wave sound field. The plasma and molten splashes generated by the workpiece placed in the standing wave sound field during the processing are captured by the sound radiation force, so that the plasma and molten splashes gather at the fixed nodes of the standing wave sound field.

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