An optical module

Abstract

The application discloses an optical module, comprising: a laser box for emitting emission light without carrying signals, comprising: an open box body with an emission opening and a first cover plate. The inner wall of the open box body is provided with a first cover plate groove and a second cover plate groove. The first cover plate is embedded in the first cover plate groove and sealed with the open box body to form a first sealed cavity. A first light window is located inside the first sealed cavity and vertically arranged at the bottom of the open box body. A second cover plate is located below the first cover plate and embedded in the second cover plate groove, sealed with the open box body and the first light window to form a second sealed cavity. A light emitting chip is arranged in the second sealed cavity, and the first light window and a second light window are located on the light path of the light emitting chip. By arranging two layers of cover plates, the light emitting chip is sealed in the double-layer shell, the air-tight packaging of the light emitting chip in the optical module of the silicon light structure is realized, and the service life of the light emitting chip is improved.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting photoelectric signals to and from each other, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing.

[0003] Optical modules are primarily used for photoelectric and electro-optical conversion. Their transmitters convert electrical signals into optical signals, which are then transmitted through optical fibers. Changes in the environment within an optical module significantly impact the stability and lifespan of its internal optoelectronic components. Hermetic encapsulation is typically used to seal the optical emitting chip to improve the module's lifespan. Summary of the Invention

[0004] This application provides an optical module to improve the sealing performance of the optical module.

[0005] To address the aforementioned technical problems, the embodiments of this application disclose the following technical solutions:

[0006] This application discloses an optical module, including: a circuit board;

[0007] The laser box, electrically connected to the circuit board, is used to emit light without carrying a signal;

[0008] The laser box includes: an open box body having an emission opening and a first cover plate; the first cover plate is located at the emission opening;

[0009] The inner wall of the open box is provided with a first cover plate groove and a second cover plate groove.

[0010] The first cover plate is embedded in the first cover plate groove, and seals with the open box body to form a first sealed cavity;

[0011] The first light window is located inside the first sealed cavity and is vertically disposed at the bottom of the open box body;

[0012] The second cover plate is located below the first cover plate and is embedded in the groove of the second cover plate, with one side abutting against the side wall of the first light window;

[0013] The second cover plate, together with the open box and the light window, forms a second sealed cavity;

[0014] The width of the second cover plate is smaller than the width of the first cover plate;

[0015] A light-emitting chip is disposed in the second sealed cavity, and the first light window and the second light window are located on the light emission path of the light-emitting chip.

[0016] Beneficial effects:

[0017] This application discloses an optical module, including: a laser box for emitting light without carrying a signal, comprising: an open box body with an emission opening and a first cover plate. The inner wall of the open box body is provided with a first cover plate groove and a second cover plate groove. The first cover plate is embedded in the first cover plate groove, sealing with the open box body to form a first sealed cavity. A first light window is located inside the first sealed cavity and is vertically disposed at the bottom of the open box body; a second cover plate is located below the first cover plate and is embedded in the second cover plate groove, sealing with the open box body and the first light window to form a second sealed cavity; a light emitting chip is disposed in the second sealed cavity, and the first light window and the second light window are located on the light path of the light emitting chip. By setting up two cover plates, the light emitting chip is sealed in a double-layer shell, realizing the hermetically sealed packaging of the light emitting chip in the silicon photonics structure optical module, and improving the service life of the light emitting chip. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0019] Figure 1 This is a connection diagram of an optical communication system according to some embodiments;

[0020] Figure 2 This is a structural diagram of an optical network terminal according to some embodiments;

[0021] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0022] Figure 4 An exploded view of an optical module according to some embodiments;

[0023] Figure 5 This is a schematic diagram illustrating the connection between a light emitting device and a circuit board, as exemplified in this application.

[0024] Figure 6 A schematic diagram of the structure of a laser box as an example of this application. Figure 1 ;

[0025] Figure 7 A schematic diagram of the structure of a laser box as an example of this application. Figure 2 ;

[0026] Figure 8 This is an example of an exploded structure diagram of a laser box as described in this application. Figure 1 ;

[0027] Figure 9 This is an example of an exploded structure diagram of a laser box as described in this application. Figure 2 ;

[0028] Figure 10 A schematic diagram of an open box structure as an example of this application. Figure 1 ;

[0029] Figure 11 This application provides a schematic diagram of a first-angle cross-section of a laser box;

[0030] Figure 12 A first-angle cross-sectional view of an open box body provided in this application;

[0031] Figure 13 This application provides a second-angle cross-sectional view of an open box body;

[0032] Figure 14 This application provides a schematic diagram of a second-angle cross-section of a laser box;

[0033] Figure 15 This is a third-angle cross-sectional view of an example open box body of this application;

[0034] Figure 16 This is a third-angle cross-sectional view of a laser box as an example of this application;

[0035] Figure 17 This is a schematic diagram of the optical path of a transmitting component as an example of this application. Detailed Implementation

[0036] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0037] In optical communication systems, optical signals carry the information to be transmitted and are transmitted through information transmission equipment such as optical fibers or waveguides to information processing equipment such as computers to complete the information transmission. Because light has passive transmission characteristics when transmitted through optical fibers or waveguides, low-cost, low-loss information transmission can be achieved. However, the signals transmitted by information transmission equipment such as optical fibers or waveguides are optical signals, while the signals that information processing equipment such as computers can recognize and process are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or waveguides and information processing equipment such as computers, it is necessary to achieve mutual conversion between electrical and optical signals.

[0038] In the field of optical communication technology, optical modules realize the mutual conversion function between optical signals and electrical signals. An optical module includes an optical port and an electrical port. The optical port enables optical communication with information transmission devices such as optical fibers or optical waveguides, while the electrical port enables electrical connection with optical network terminals (e.g., optical modems). The electrical connection is mainly used for power supply, I2C signal transmission, data transmission, and grounding. The optical network terminal transmits electrical signals to information processing devices such as computers via network cables or Wi-Fi.

[0039] Figure 1 This is a diagram showing the connection relationships within an optical communication system. (Example:) Figure 1 As shown, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0040] One end of optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 via optical module 200. Optical fiber itself can support long-distance signal transmission, such as signal transmission over several kilometers (6 to 8 kilometers). Theoretically, unlimited distance transmission can be achieved by using repeaters. Therefore, in typical optical communication systems, the distance between the remote server 1000 and the optical network terminal 100 can typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

[0041] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.

[0042] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by optical fiber 101 and network cable 103; while the connection between optical fiber 101 and network cable 103 is completed by optical module 200 and optical network terminal 100.

[0043] The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101. The electrical port is configured to connect to the optical network terminal 100, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. The optical module 200 performs mutual conversion between optical and electrical signals, thereby establishing an information connection between the optical fiber 101 and the optical network terminal 100. For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and then input to the optical fiber 101. Since the optical module 200 is a tool for mutual conversion between optical and electrical signals and does not have the function of data processing, the information does not change during the above photoelectric conversion process.

[0044] The optical network terminal 100 includes a generally cuboid housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing. The optical module interface 102 is configured to connect to an optical module 200, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the optical module 200; the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the network cable 103. The optical module 200 and the network cable 103 are connected through the optical network terminal 100. For example, the optical network terminal 100 transmits electrical signals from the optical module 200 to the network cable 103, and vice versa, thus the optical network terminal 100 acts as a host computer for the optical module 200, monitoring its operation. Besides the optical network terminal 100, the host computer for the optical module 200 may also include an optical line terminal (OLT), etc.

[0045] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing equipment 2000 through optical fiber 101, optical module 200, optical network terminal 100 and network cable 103.

[0046] Figure 2 This is a structural diagram of an optical network terminal. To clearly show the connection relationship between the optical module 200 and the optical network terminal 100... Figure 2Only the structure of the optical network terminal 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the optical network terminal 100 also includes a circuit board 105 disposed within a housing, a cage 106 disposed on the surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0047] The optical module 200 is inserted into the cage 106 of the optical network terminal 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to an electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0048] Figure 3 This is a structural diagram of an optical module according to some embodiments. For example... Figure 3 As shown, the optical module 200 includes a shell, a circuit board 300 disposed inside the shell, and an optical transceiver assembly.

[0049] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing with two openings; the outer contour of the housing is generally square.

[0050] In some embodiments of this disclosure, the lower housing 202 includes a base plate 2021 and two lower side plates located on both sides of the base plate and disposed perpendicular to the base plate; the upper housing 201 includes a cover plate, which covers the two lower side plates of the lower housing to form the aforementioned housing.

[0051] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate and two upper side plates located on both sides of the cover plate and perpendicular to the cover plate 2011, wherein the two upper side plates are combined with the two lower side plates to achieve the upper housing 201 covering the lower housing 202.

[0052] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3(Left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold fingers of circuit board 300 extend and are inserted into a host computer (e.g., optical network terminal 100); opening 205 is an optical port, configured to connect to external optical fiber 101 so that external optical fiber 101 can connect to the optical transceiver assembly inside optical module 200.

[0053] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of components such as the circuit board 300 and optical transceiver assemblies into the housing, with the upper housing 201 and lower housing 202 providing encapsulation and protection for these components. Furthermore, the assembly of the circuit board 300 and optical transceiver assemblies facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, which is beneficial for automated production.

[0054] In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0055] In some embodiments, the optical module 200 further includes an unlocking component located outside its housing, the unlocking component being configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0056] For example, the unlocking component is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a locking component that matches the host computer cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the host computer cage, the locking component of the unlocking component fixes the optical module 200 in the host computer cage; when the unlocking component is pulled, the locking component of the unlocking component moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the host computer cage.

[0057] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers, clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0058] Circuit board 300 is generally a rigid circuit board. Due to its relatively rigid material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. When the optical transceiver assembly is located on the circuit board, the rigid circuit board can also provide stable support. The rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0059] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The gold fingers (shown on the upper surface) can also be placed on the upper and lower surfaces of the circuit board 300 to accommodate applications with a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer to enable power supply, grounding, I2C signal transmission, and data signal transmission.

[0060] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards. For example, flexible circuit boards can be used to connect rigid circuit boards to optical transceiver components.

[0061] An optical transceiver assembly includes an optical transmitter and an optical receiver. The optical transmitter is configured to transmit optical signals, and the optical receiver is configured to receive optical signals. For example, the optical transmitter and optical receiver are combined to form an integrated optical transceiver assembly.

[0062] The silicon photonic chip 400 is mounted on the circuit board 300 and electrically connected to the circuit board 300, specifically by wire bonding. The periphery of the silicon photonic chip is connected to the circuit board 300 through multiple conductive lines, so the silicon photonic chip 400 is generally mounted on the surface of the circuit board 300.

[0063] The silicon photonics chip 400 receives light from the laser box 500 and modulates the light, specifically by loading a signal onto the light. The light input port of the silicon photonics chip 400 is matched with the light output port of the laser box 500 to receive light from the laser box 500 and modulate the light.

[0064] The laser box 500 is electrically connected to the circuit board 300, specifically via a flexible board. The main electrical component in the laser box 500 is a light-emitting chip; this chip emits relatively stable light that is unmodulated, carries no information, and does not involve high-speed signal circuitry. The circuit structure of the laser box 500 is relatively simple, and it can be electrically connected to the circuit board 300 via a flexible board. The light-emitting chip receives electrical drive from outside the laser box 500 through the flexible board. The laser box 500 can be mounted on the surface of the circuit board 300 or outside of it.

[0065] The laser box 500 may be equipped with temperature regulating electrical devices such as semiconductor coolers to provide temperature control for the light emitting chip. The temperature regulating electrical devices are powered and driven from outside the laser box 500 through a flexible plate.

[0066] The laser box 500 provides relatively stable optical power to the silicon photonic chip 400. The laser box 500 and the silicon photonic chip 400 are connected by optical fiber / fiber ribbon.

[0067] Figure 5 This is a schematic diagram of the structure of a light emitting device and a circuit board, which is an example of this application. Figure 6 A schematic diagram of the structure of a laser box as an example of this application. Figure 1 . Figure 7 A schematic diagram of the structure of a laser box as an example of this application. Figure 2 . Figure 6 and Figure 7 This is a schematic diagram of laser boxes in different directions.

[0068] The light emitting device includes a laser box 500 and a main emitting base plate 5400. The lower surfaces of the laser box 500 and the main emitting base plate 5400 are flush. The main emitting base plate 5400 is located on one side of the laser box 500, and a silicon photonic chip 400 and a silicon photonic driver chip 5300 are disposed on it.

[0069] On the other side of the laser box 500, there is also a fiber optic coupler, whose input port corresponds to the output port of the silicon photonic chip 400, coupling the modulated signal light into a single-mode fiber. One end of the single-mode fiber is connected to the fiber optic coupler, and the other end is connected to the first fiber optic adapter to emit the signal light.

[0070] The fiber optic coupler is located below a fiber optic support plate, which is connected to the main base plate 5400 and is used to support the fiber optic coupler.

[0071] The fiber optic support plate and the main base plate 5400 are integrated into one structure, which facilitates the positioning and installation of optoelectronic devices during the period.

[0072] To secure the fiber optic coupler, the laser box 500 also includes a mounting support located adjacent to the main transmitting base plate 5400. To ensure the upper surfaces of the silicon photonic chip 400 and the silicon photonic driver chip 5300 are flush with the upper surface of the circuit board, facilitating circuit wiring connections on the circuit board, the main transmitting base plate 5400 includes a first support platform and a second support platform. The first support platform supports the silicon photonic driver chip 5300, and the second support platform supports the silicon photonic chip 400. The upper surfaces of both the first and second support platforms protrude from the transmitting base plate, and the upper surface of the main transmitting base plate 5400 is connected to the lower surface of the circuit board 300.

[0073] For ease of installation, the laser box 500 and the main base plate 5400 can be integrally formed, with the mounting support being integrally formed with the laser box 500 and the main base plate 5400.

[0074] To facilitate the connection between the light emitting device and the circuit board, the circuit board is provided with a housing clearance part. The upper surfaces of the first support platform and the second support platform are higher than the lower surface of the circuit board. The first support platform, the second support platform and the laser box 500 are embedded in the housing clearance part, so that the part of the light emitting device is flush with the space of the circuit board, reducing the space above the circuit board occupied by the light emitting device.

[0075] The laser box 500 has an open box body 510, which is a rectangular tube structure with an open end. Optoelectronic devices are installed inside to receive electrical signals from the circuit board and convert them into signal-free light. The laser box is located on the circuit board and connected to it via a flexible circuit board. A second light window 520 is provided on one side for fiber optic projection, and a first opening 540 is provided on the other side. One end of the flexible circuit board 5100 is connected to the circuit board 300, and the other end extends into the rectangular tube through the first opening 540 to supply power to the laser, semiconductor cooler, and other electrical components. A first cover plate 530 closes to the open side of the open box body to seal the opening.

[0076] The first cover plate 530 covers the opening side of the open box body, forming the first sealed cavity 531.

[0077] Figure 8 This is an example of an exploded structure diagram of a laser box as described in this application. Figure 1 , Figure 9 This is an example of an exploded structure diagram of a laser box as described in this application. Figure 2 . Figure 10 A schematic diagram of an open box structure as an example of this application. Figure 1 Combining Figure 8 , Figure 9 and Figure 10 As shown, the open box includes: a launch base plate 570 and a first side plate 512, a third side plate 514, a second side plate 513, and a fourth side plate 515, which are vertically arranged on the launch base plate and connected end to end. A first cover plate 530 is provided on the opposite side of the launch base plate, which is sealed to the open box.

[0078] A first opening 540 is provided on the adjacent side of the open end. One end of the flexible circuit board is connected to the circuit board 300, and the other end extends into the rectangular tube through the first opening 540 to supply power to electrical components such as lasers and semiconductor coolers. For ease of description, the following discussion will use... Figure 3 The orientation shown is as follows: the upper housing of the optical module is positioned upwards, the lower housing is positioned downwards, the optical port is positioned to the left, and the electrical port is positioned to the right. The end face with the first opening 540 is called the first side plate 512, the opposite side of the first side plate is the second side plate 513, and the opposite side of the opening end is the transmitting base plate 570.

[0079] A first sealed cavity can be formed by covering the opening end of the open box with a first cover plate. To further extend the path length for moisture to enter the laser box and increase the connection strength between the first cover plate and the open box, this application uses an insertion method between the first cover plate and the open box. Compared to the cover-and-close connection method, the contact surface between the first cover plate and the open box is changed from the bottom edge of the first cover plate connecting to the upper surface of the open box to the upper surface edge, lower surface edge, and side surface of the first cover plate contacting the open box, increasing the contact area between the first cover plate and the open box and extending the path length for moisture to enter the laser box. The opening where the first cover plate is located is called the emission opening.

[0080] The second side plate 513 has a second opening 511 for the passage of the first cover plate 530. The second side plate 513 also has a third opening below the second opening 511 for mounting the second light window 520, facilitating the emission of light from inside the laser box. For ease of installation, the second opening 511 and the third opening 5131 are connected, allowing the second light window 520 to be connected to the side wall of the third opening. The upper surface of the second light window 520 is flush with the lower surface of the second opening 511, and the lower surface of the second cover plate is in contact with the upper surface of the second light window 520. To improve light coupling efficiency, the solid adhesive between the second cover plate and the second light window 520 is optical adhesive.

[0081] The width of the second opening 511 is greater than the width of the third opening 5131. The width of the third opening 5131 is set according to the actual width of the optical path inside the laser box.

[0082] Figure 11 This is a schematic cross-sectional view of a laser box provided in this application from a first angle. (Combined with...) Figure 11 As shown, the inner wall of the laser box 500 is provided with a first cover plate groove 5132 and a second cover plate groove 5133, wherein the first cover plate groove 5132 is located above the second cover plate groove 5133. A second opening 511 is provided on the opposite side of the first opening 540, and the inner wall of the rectangular tube is recessed to form the first cover plate groove 5132. The second opening 511 communicates with the first cover plate groove 5132, and the first cover plate 530 extends into the first cover plate groove 5132 through the second opening 511. To increase the sealing between the first cover plate 530 and the box body, solid adhesive is used to fill the space between the first cover plate groove 5132 and the first cover plate 530.

[0083] To enhance the sealing of the laser box, the first cover plate groove includes a first sliding groove 51321, a second sliding groove 51322, and a third sliding groove 51323 connected in sequence. The first sliding groove 51321 is located on the inner surface of the fourth side plate 515, the second sliding groove 51322 is located on the inner surface of the first side plate 512, and the third sliding groove 51323 is located on the inner surface of the third side plate 514. One end of the first cover plate 530 passes through the second opening 511 and is embedded in the second sliding groove 51322 along the first sliding groove 51321 and the third sliding groove 51323. The width of the first cover plate 530 is greater than the distance between the inner wall of the third side plate 514 and the inner wall of the fourth side plate 515, and the width of the first cover plate 530 is greater than the distance between the inner wall of the first side plate and the inner wall of the second side plate 513, allowing the first cover plate 530 to be embedded within the first cover plate groove 5132 for easy installation.

[0084] To reduce space occupation and prevent one end of the first cover plate 530 from extending beyond the outer wall of the second side plate 513, the length of the first cover plate 530 is less than the distance between the outer wall of the first side plate 512 and the outer wall of the second side plate 513.

[0085] To reduce the amount of change of the first cover plate 530 due to environmental changes, and to prevent cracks from forming between the first cover plate 530 and the first cover plate groove 5132 due to temperature changes, the first cover plate 530 can be made of glass or a diaphragm alloy.

[0086] The inner wall of the rectangular tube protrudes to form a first cover plate support 5134 and a second cover plate support 5135. The first cover plate support 5134 is located above the support of the second cover plate. Between the first cover plate support 5134 and the second cover plate support 5135 is a second cover plate groove 5133. The second cover plate is embedded in the second cover plate groove 5133 and is fixedly connected to the periphery of the second cover plate groove 5133 by solid glue.

[0087] For ease of installation, the first cover plate bracket 5134 and the second cover plate bracket 5135 protrude from the inner wall of the housing. The width of the second cover plate 550 is less than the distance between the inner walls of the third side plate 514 and the fourth side plate 515, allowing the second cover plate 550 to extend between the third and fourth side plates. The first light window 560 is perpendicular to the upper surface of the emitting base plate and contacts the side wall of the second cover plate 550, forming a second sealed cavity 551 together with the second cover plate 550, the first side plate, the third side plate, the fourth side plate, and the emitting base plate. The second sealed cavity 551 contains a light emitting chip and a first lens located on the light emission path of the light emitting chip.

[0088] A first cover plate bracket 5134 is disposed above a second cover plate bracket 5135. The first cover plate bracket 5134 includes a first arm, a second arm, and a third arm connected in sequence. The first arm protrudes from the inner wall of the third side plate. The second arm protrudes from the inner wall of the first side plate, and the third arm protrudes from the inner wall of the fourth side plate. One end of the second arm is connected to the first arm, and the other end of the second arm is connected to the third arm. To facilitate the installation of the second cover plate 550, the lower surfaces of the first, second, and third arms are flush.

[0089] The second cover plate bracket 5135 includes a fourth arm, a fifth arm, and a sixth arm connected in sequence. The fourth arm protrudes from the inner wall of the third side plate. The fifth arm protrudes from the inner wall of the first side plate, and the sixth arm also protrudes from the inner wall of the fourth side plate. One end of the fifth arm is connected to the fourth arm, and the other end of the fifth arm is connected to the sixth arm. To facilitate the installation of the second cover plate 550, the upper surfaces of the fourth, fifth, and sixth arms are flush.

[0090] A second cover plate groove 5133 is formed between the first cover plate bracket 5134 and the second cover plate bracket 5135. The second cover plate 550 is embedded in the second cover plate groove 5133 and is fixedly connected to the perimeter of the second cover plate groove 5133 with solid adhesive. To facilitate the installation of the second cover plate 550, the width of the second cover plate groove 5133 is greater than the thickness of the second cover plate 550, that is, the distance between the lower surface of the first cover plate bracket 5134 and the upper surface of the second cover plate bracket 5135 is greater than or equal to the thickness of the second cover plate 550.

[0091] Figure 12 This application provides a first-angle cross-sectional view of an open box. Figure 13 This is a schematic diagram of a second-angle cross-section of an open box body provided in this application. Figure 14 This is a schematic diagram of a second-angle cross-section of a laser box provided in this application. (Combined with...) Figure 12 , Figure 13 and Figure 14 As shown, to increase the sealing performance of the second cover plate 550, the distance between the lower surface of the first cover plate bracket 5134 and the upper surface of the second cover plate bracket 5135 is equal to the thickness of the second cover plate 550. The width of the second cover plate 550 is equal to the distance between the inner walls of the third side plate and the inner walls of the fourth side plate.

[0092] The first opening 540 is located below the second cover plate groove 5133. One end of the flexible circuit board or a ceramic substrate extends into the second sealed cavity through the first opening 540 and is electrically connected to the light emitting chip.

[0093] The third side plate is provided with a first limiting plate 518 and a second limiting plate 519, wherein an opening is provided between the first limiting plate 518 and the second limiting plate 519. The first limiting plate 518 is set perpendicular to the third side plate 514, and the second limiting plate 519 is located below the first limiting plate 518, with one side of the second limiting plate 519 connected to the third side plate 514 and its adjacent side connected to the launching base plate 570. A second cover plate 550 is disposed between the first limiting plate 518 and the second limiting plate 519, increasing the connection area between the second cover plate 550 and the side plate, and increasing the stability of the second sealing cavity.

[0094] Specifically, the first limiting plate 518 is disposed perpendicular to the inner wall of the third side plate, and is perpendicularly connected to the first support arm. The second limiting plate is located below the first limiting plate 518, with one side of the second limiting plate connected to the third side plate and its adjacent side connected to the launch base plate. The second cover plate 550 is disposed between the first limiting plate 518 and the second limiting plate, increasing the connection area between the second cover plate 550 and the side plate, and increasing the stability of the second sealing cavity.

[0095] The fourth side plate is provided with a third limiting plate 516 and a fourth limiting plate 517, with an opening between them. The third limiting plate 516 is perpendicular to the fourth side plate, and the fourth limiting plate 517 is located below it, with one side of the fourth limiting plate 517 connected to the fourth side plate and the adjacent side connected to the launch base plate. A second cover plate 550 is disposed between the third limiting plate 516 and the fourth limiting plate 517, increasing the connection area between the second cover plate 550 and the side plate, and increasing the stability of the second sealing cavity.

[0096] Specifically, the first limiting plate 518 is disposed perpendicular to the inner wall of the third side plate, and is perpendicularly connected to the first support arm. The second limiting plate is located below the first limiting plate 518, with one side of the second limiting plate connected to the third side plate and its adjacent side connected to the launch base plate. The second cover plate 550 is disposed between the first limiting plate 518 and the second limiting plate, increasing the connection area between the second cover plate 550 and the side plate, and increasing the stability of the second sealing cavity.

[0097] The upper surface of the first light window is not lower than the lower surface of the first limiting plate 518, and the upper surface of the first light window is not lower than the lower surface of the third limiting plate 516, such that the first light window abuts against one side of the first limiting plate 518 and the third limiting plate 516. The minimum distance between the second limiting plate and the fourth limiting plate 517 is greater than the maximum width of the optical path of the light emitting component.

[0098] The second sealed cavity contains a first substrate 631, above which a semiconductor cooler 610 is disposed. Above the semiconductor cooler, a second substrate 620 is disposed. Above the second substrate 620, one or more COC structural components 600 are disposed, and above the second substrate 620, one or more first lenses 700 are also disposed. The number of first lenses 700 corresponds one-to-one with the number of light-emitting chips. The first lenses 700 are disposed on the light emission path of the light-emitting chips and are used to convert the light emitted by the light-emitting chips into parallel light.

[0099] The first substrate also includes conductive posts 640, one end of which is connected to the first substrate and the other end to the flexible circuit board, for supplying power to the semiconductor cooler 610. The conductive posts can be made of conductive metal or a ceramic plate with a conductive layer applied to its surface. The conductive posts include positive and negative conductive posts. The upper surface of the conductive post is connected to the lower surface of the flexible circuit board. To facilitate the installation of the flexible circuit board, the upper surface of the conductive post is flush with the upper surface of the COC structure. The flexible circuit board is electrically connected to the conductive posts and the COC structure.

[0100] Typically, because the focal length of the light-emitting chip is between 100μm and 200μm, the first light window cannot be placed between the light-emitting chip and the first lens.

[0101] The open box and the first cover plate 530 enclose a first sealed cavity. The second cover plate 550 is embedded in the second cover plate groove 5133, and together with the first side plate, the third side plate, the fourth side plate, and the first light window, forms a second sealed cavity. The light emitting chip is disposed inside the second sealed cavity, which extends the path length for moisture to enter the light emitting chip from the outside, thereby improving the service life of the optical module. In this application, conventional metal shell material is used to achieve hermetic encapsulation, reducing the consumption of raw materials.

[0102] The COC structural components include: a first sub-substrate, made of alumina ceramic, aluminum nitride ceramic, etc. The surface of the first sub-substrate is engraved with the functional circuitry of a laser chip for signal transmission, such as a transmission line. A light-emitting chip is located on the upper surface of the first substrate and connects to the transmission line. The other end of the transmission line is soldered to a flexible circuit board.

[0103] An optical isolator and a second lens are also disposed above the transmitting base plate. The optical isolator is positioned between the first optical window and the second lens. The optical isolator allows the light emitted by the light-emitting chip to propagate along its path while blocking reverse propagation. The second lens is used to convert parallel light into converged light.

[0104] Figure 15 This is a third-angle cross-sectional view of an example open box body of this application. Figure 16 This is a third-angle cross-sectional view of a laser box as an example of this application. To achieve light transmission and ensure that the optical axes of each optical device inside the laser box are on the same horizontal line as the optical axis of the laser chip, the upper surface of the emitting base plate is provided with platform planes of different heights.

[0105] The upper surface of the launch base plate has platform planes of different heights, wherein the height of the first platform 5161 is lower than the height of the second platform 5162, and a semiconductor cooler 610 is disposed above the first platform 5161. The sidewall of the second limiting plate abuts against the junction of the first platform and the second platform, and the sidewall of the fourth limiting plate 517 abuts against the junction of the first platform and the second platform. The first platform and the second platform form a first stepped surface due to their different heights, and the second limiting plate and the fourth limiting plate 517 abut against the first stepped surface.

[0106] The second support platform 5162 is located between the first support platform 5161 and the third support platform 5163, with the upper surface of the third support platform 5163 being higher than the upper surface of the second support platform 5162. The difference in height between the third support platform 5163 and the second support platform 5162 forms a second stepped surface. The first light window 560 is vertically positioned above the second support platform, with one side connected to the second limiting plate and the fourth limiting plate 517, and the other side connected to the second stepped surface, facilitating the positioning and restriction of the first light window 560. An optical isolator is disposed on the upper surface of the third support platform.

[0107] The upper surface of the transmitting base plate is also provided with a fourth support platform 5164, on which a second lens 900 is installed. To ensure that the optical axes of the second lens, the isolator, and the first lens are on the same horizontal line, the upper surface of the fourth support platform 5164 is higher than the upper surface of the third support platform.

[0108] The adhesive is filled between the flexible circuit board and the inner wall of the first opening 540 to form a seal, which isolates the light emitting chip from the external environment and prevents moisture from the outside of the laser box from entering the laser box through the first opening 540, thereby improving the service life of the light emitting chip.

[0109] The base plate and side plates of the laser box can be made of metal structural components, such as die-cast or milled metal parts. By setting up two layers of cover plates, the light-emitting chip is sealed in the double-layer shell, realizing the hermetic packaging of the light-emitting chip in the silicon photonics structure optical module, and improving the service life of the light-emitting chip.

[0110] To facilitate light coupling, the lower surface of the third opening 5131 is set lower than the upper surface of the fourth support platform 5164, so that the lower surface of the second light window 520 is lower than the lower surface of the second lens 900, thus preventing the second side plate 513 from blocking the light transmitted through the second lens.

[0111] To minimize the size of the laser box opening and reduce the path for external moisture to enter, the second optical window 520 should be as small as possible. The width of the second optical window 520 is smaller than the width of the first cover plate 530, and the width of the second optical window 520 is smaller than the width of the first optical window.

[0112] Figure 17 This is a schematic diagram of the optical path of a transmitting component according to an example of this application. The electrical signal received by the optical emitting chip is converted into emitted light without carrying a signal; this emitted light is a divergent beam. A first lens is disposed in the initial optical path of the optical emitting chip to convert the divergent beam into a parallel beam. This parallel beam is projected through a first optical window, then through an optical isolator, and finally to a second lens, where it converges to form a converged beam. The incident port of the silicon photonics chip is abutted against the outside of the second optical window 520, transmitting the light converged at the spot to the silicon photonics chip. The silicon photonics chip modulates the received light to form signal light.

[0113] Since the above embodiments are all described in conjunction with other methods, and different embodiments have the same parts, the same or similar parts between the various embodiments in this specification can be referred to mutually. They will not be described in detail here.

[0114] It should be noted that in this specification, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a circuit structure, article, or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a circuit structure, article, or device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the circuit structure, article, or device that includes said element.

[0115] Other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the content of the claims.

[0116] The embodiments described above do not constitute a limitation on the scope of protection of this application.

Claims

1. An optical module, characterized in that, include: Circuit board; The laser box, electrically connected to the circuit board, is used to emit light without carrying a signal; The laser box includes: an open box body having an emission opening and a first cover plate; the first cover plate is located at the emission opening; A second optical window is provided on one side of the laser box; The inner wall of the open box body forms a first cover groove and a second cover groove; The first cover plate bracket protrudes from the inner wall of the opening box body; The second cover plate bracket is located below the first cover plate bracket and protrudes from the inner wall of the open box body; The second cover plate groove is located between the first cover plate bracket and the second cover plate bracket; The first cover plate is embedded in the first cover plate groove, and seals with the open box body to form a first sealed cavity; The first light window is located inside the first sealed cavity and is vertically disposed at the bottom of the open box body; The second cover plate is located below the first cover plate and is embedded in the groove of the second cover plate, with one side abutting against the side wall of the first light window; The second cover plate, together with the open box and the first light window, forms a second sealed cavity; The width of the second cover plate is smaller than the width of the first cover plate; A light-emitting chip is disposed in the second sealed cavity, and the first light window and the second light window are located on the light emission path of the light-emitting chip; The optical isolator and the second lens are located between the first optical window and the second optical window.

2. The optical module according to claim 1, characterized in that, Also includes: The main base plate for transmitting is located on one side of the laser box and is used to support the silicon photonics chip and the silicon photonics driver chip. The main base plate for launching and the opening box are an integral structure.

3. The optical module according to claim 1, characterized in that, The open box body includes: a base plate for launching and a first side plate, a third side plate, a second side plate and a fourth side plate that are perpendicular to the base plate and connected end to end in sequence; The first opening is provided on the first side plate, and the first opening is located below the second cover plate groove; The flexible circuit board extends into the second sealed cavity through the first opening; The second light window is located on the second side panel; The second side plate is also provided with a second opening, which is connected to the first cover plate groove, and the first cover plate is embedded in the second opening.

4. The optical module according to claim 3, characterized in that, The launch base plate includes a first support platform, a second support platform, a third support platform, and a fourth support platform whose upper surfaces are raised sequentially. The first support platform is used to support the semiconductor cooler, the light emitting chip, and the first lens; The first light window is disposed on the second support platform, and the end of the second cover plate abuts against one side of the first light window; An optical isolator is mounted on the third support platform; The second lens is mounted on the fourth support platform. The light emitted by the light-emitting chip passes sequentially through the first lens, the first optical window, the optical isolator, the second lens, and the second optical window; The upper surface of the second light window is higher than the upper surface of the second cover plate.

5. The optical module according to claim 4, characterized in that, The lower surface of the second light window is set lower than the upper surface of the fourth support platform.

6. The optical module according to claim 4, characterized in that, Also includes: The first limiting plate is perpendicular to the third side plate and is connected to the first cover plate bracket; The second limiting plate is connected to the second cover plate bracket and is perpendicular to the launching base plate; The second cover plate is embedded between the first limiting plate and the second limiting plate; The third limiting plate is perpendicular to the fourth side plate and is connected to the first cover plate bracket; The fourth limiting plate is connected to the second cover plate bracket and is perpendicular to the launching base plate; The second cover plate is embedded between the third limiting plate and the fourth limiting plate.

7. The optical module according to claim 6, characterized in that, The first light window abuts against one side of the third limiting plate and the fourth limiting plate; The width of the first light window is greater than the distance between the third limiting plate and the fourth limiting plate.

8. The optical module according to claim 4, characterized in that, The width of the second cover plate is less than the distance between the inner wall of the third side plate and the inner wall of the fourth side plate.

9. The optical module according to claim 1, characterized in that, It also includes a silicon photonics chip that receives the emitted light from the laser box and modulates it to generate signal light.

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