A special equipment for infrared material grinding, polishing and thinning polishing

Abstract

The application discloses a special device for infrared material grinding, polishing and thinning, which comprises a base plate, a material carrying grinding disc, a first vertical driving mechanism, a mounting bracket, a center hole grinding and polishing motor fixing block and a side surface grinding and polishing bracket. The material carrying grinding disc is rotatably arranged on the base plate. The mounting bracket is arranged above the material carrying grinding disc and is driven by the first vertical driving mechanism to move up and down. The mounting bracket is provided with a grinding and polishing through hole. The center hole grinding and polishing motor fixing block is connected with the mounting bracket and is located above the grinding and polishing through hole. The center hole grinding and polishing motor fixing block is used for fixing a center hole grinding and polishing motor. The output end of the center hole grinding and polishing motor is provided with a center hole grinding and polishing head and is vertically arranged downwards. The side surface grinding and polishing bracket is reversibly connected with the mounting bracket. The head end of the side surface grinding and polishing bracket is provided with a side surface grinding and polishing head. When the side surface grinding and polishing bracket is turned to a vertical state, the side surface grinding and polishing head is located on the side surface of the material and is used for side surface grinding and polishing. The application can complete the inner hole and the outer circle of the material in one process and reduces the dependence on manual work.

Description

Technical Field

[0001] This invention relates to a grinding and polishing equipment for semiconductor materials, belonging to the technical field of grinding and polishing equipment. Background Technology

[0002] In the process of thinning and polishing thermal infrared materials, it is usually necessary to grind and polish the inner hole and outer circle of the material. The commonly used processing method is to perform rough machining by machine, followed by manual thinning and polishing of the inner hole and outer circle, or to perform grinding, polishing and thinning polishing of the inner hole and outer circle multiple times using equipment.

[0003] In the grinding and polishing process, the material and base are typically bonded together with wax or adhesive first. The base is then fixed to the grinding and polishing disc. The operator uses a handheld sanding / polishing belt to thin and polish the outer contour of the material, while a handheld electric grinding head is used to thin and polish the center hole. Alternatively, the bonded material is placed horizontally on a horizontally mounted transmission mechanism, and the grinding and polishing head's up-and-down position is controlled by a lead screw. The grinding and polishing head moves horizontally back and forth relative to the mechanism. After the outer contour is processed, the inner hole is manually thinned and polished. After grinding and polishing, the material needs to be separated from the base, cleaned, and then proceed to the next process.

[0004] Materials that have been ground and polished typically require a roughness of around 100 micrometers or lower, and an outer diameter and concentricity of 0.001 mm. However, the two processing methods mentioned above rely on manual skills, have large fluctuations in mass production quality, large deviations in outer diameter and concentricity, uneven surface roughness, and are time-consuming, making it difficult to increase production output. Summary of the Invention

[0005] To address the shortcomings of the existing technology, this invention provides a specialized device for infrared material grinding, polishing, thinning, and polishing, solving the problem of reliance on manual skills, improving product quality, shortening production and processing time, and increasing efficiency.

[0006] The technical solution of this invention is as follows: A special equipment for grinding, polishing, thinning, and polishing infrared materials includes a substrate, a grinding disc, a first vertical drive mechanism, a mounting bracket, a central hole grinding motor fixing block, and a side grinding bracket. The grinding disc is rotatably mounted on the substrate and is driven to rotate by a motor. The mounting bracket is positioned above the grinding disc and is driven to move up and down by the first vertical drive mechanism. A grinding through hole is provided in the middle of the mounting bracket. The central hole grinding motor fixing block is connected to the mounting bracket and is located above the grinding through hole. The central hole grinding motor is fixedly mounted on the central hole grinding motor fixing block. A central hole grinding head is mounted on the output end of the central hole grinding motor and is vertically downward. The side grinding bracket is connected to the mounting bracket, and a side grinding head is provided at the head end of the side grinding bracket. The side grinding head is located on the side of the material for side grinding.

[0007] Furthermore, the bottom surface of the mounting bracket is provided with several protective blocks around the polishing through hole.

[0008] Furthermore, the protective block is fixed to the radial adjustment block, which is movably disposed on the bottom surface of the mounting bracket along the radial direction of the polishing through hole.

[0009] Furthermore, the bottom surface of the mounting bracket is provided with a three-jaw chuck around the polishing hole, the center of the bottom plate of the three-jaw chuck is in communication with the polishing hole, and the front end of the jaws of the three-jaw chuck is fixed to the protective block.

[0010] Furthermore, the side polishing bracket is rotatably connected to the mounting bracket. When the side polishing bracket is rotated to a vertical position, the side polishing head is located on the side of the material for side polishing. Rotating the side polishing bracket avoids the three-jaw chuck, facilitating adjustment.

[0011] Furthermore, the side polishing support includes a third vertical drive mechanism, which is used to drive the side polishing head to move up and down. The head end of the side polishing support is provided with a transverse drive mechanism, which is used to drive the side polishing head to move laterally.

[0012] Furthermore, the side polishing support includes a third vertical drive mechanism, which is used to drive the side polishing head to move up and down.

[0013] Furthermore, a polishing liquid tank is provided on the substrate surrounding the grinding disc, and a polishing liquid supply mechanism is provided on the substrate. The polishing liquid supply mechanism includes a storage tank and a supply pipe. The supply pipe is connected to the storage tank through a pump, and the outlet end of the supply pipe is positioned towards the center of the grinding disc.

[0014] Furthermore, the storage tank is rotatably placed on the base plate, and the base plate is provided with a rotation drive mechanism for driving the storage tank to rotate. The rotatable storage tank rotates continuously during operation, ensuring the uniformity of the grinding and polishing slurry.

[0015] Furthermore, the substrate is provided with supporting rollers, and the rotation drive mechanism is an electric roller. The supporting rollers and the electric roller are respectively located on both sides below the storage tank, and the supporting rollers and the electric roller together support the storage tank.

[0016] The advantages of the technical solution provided by this invention are as follows:

[0017] This invention enables the grinding and polishing of the inner hole and outer diameter of materials to be completed in one operation, shortening processing time and reducing reliance on manual labor. Automated control can be used to adjust the positions of the center hole grinding and polishing head and the side grinding and polishing heads, improving accuracy, ensuring stable product quality, and providing closed-loop control throughout the entire process, thus guaranteeing future technological innovations. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a specialized equipment for grinding, polishing, thinning, and polishing infrared materials.

[0019] Figure 2 This is a schematic diagram showing the connection between a three-phase asynchronous motor and a grinding disc.

[0020] Figure 3 This is a schematic diagram showing the lateral connection between the mounting plate and the center hole polishing mechanism and the side polishing mechanism.

[0021] Figure 4 This is a bottom-view diagram showing the connection between the mounting plate, the three-jaw chuck, and the side polishing mechanism.

[0022] Figure 5 This is a schematic diagram of the grinding and polishing fluid supply mechanism. Detailed Implementation

[0023] The present invention will be further described below with reference to embodiments. It should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention. After reading this description, any modifications of this description in various equivalent forms by those skilled in the art will fall within the scope defined by the appended claims.

[0024] Please combine Figure 1 and Figure 2As shown, the specialized equipment for infrared material grinding, polishing, thinning, and polishing involved in this embodiment includes a substrate 1, which serves as a mounting platform for all components. A polishing liquid tank 2 is provided on the substrate 1, and the tank 2 has an annular groove for collecting the polishing liquid after grinding. A horizontally positioned grinding disc 3 is arranged in the center of the polishing liquid tank 2, and the grinding disc 3 is driven to rotate by a three-phase asynchronous motor 4 through a transmission mechanism 5. The grinding disc 3 is used to fix the material after bonding to the base so as to drive the material to rotate.

[0025] A first vertical drive mechanism 6 is mounted on both sides of the polishing liquid tank 2 on the substrate 1. The first vertical drive mechanism 6 is a manual linear module. A horizontally arranged mounting bracket 7 is mounted on the first vertical drive mechanism 6. The two ends of the mounting bracket 7 are fixed to the drive slider of the first vertical drive mechanism 6 through slots. The slots can easily adjust the lateral position of the mounting bracket 7 to align it with the center of the grinding disc 3.

[0026] Please combine Figure 3 and Figure 4 As shown, the mounting bracket 7 has a polishing through hole 8 in the middle. A center hole polishing mechanism for center hole polishing and a side polishing mechanism for side polishing are respectively installed on the front and rear sides of the mounting bracket 7.

[0027] The center hole grinding and polishing mechanism mainly includes a front and rear position adjustment block 9, a second vertical drive mechanism 10, a center hole grinding and polishing motor fixing block 11, a center hole grinding and polishing motor, and a center hole grinding and polishing head. The center hole grinding and polishing motor is connected to the center hole grinding and polishing head, driving the center hole grinding and polishing head to rotate and perform center hole grinding and polishing of the material. The center hole grinding and polishing motor and the center hole grinding and polishing head are existing technologies and are not shown in the figure. The center hole grinding and polishing motor is fixedly installed by the center hole grinding and polishing motor fixing block 11. The front and rear position adjustment block 9 is fixedly installed on the mounting bracket 7, and its position is adjusted appropriately through the slot. The second vertical drive mechanism 10 is a vertical electric slide table, fixedly installed on the front and rear position adjustment block 9, and connected to the center hole grinding and polishing motor fixing block 11, used to drive the center hole grinding and polishing motor fixing block 11, the center hole grinding and polishing motor, and the center hole grinding and polishing head to move up and down. The center hole polishing head is vertically positioned above the polishing through hole 8. Driven by the second vertical drive mechanism 10, it moves downwards, extends into the polishing through hole 8, and enters the center of the material for polishing.

[0028] The side polishing mechanism mainly includes a side polishing bracket 12 and a side polishing head 13. The side polishing bracket 12 is connected to the mounting bracket 7 via a flip hinge 14 and is positioned opposite to the front and rear position adjustment block 9 on both sides of the polishing through hole 8. The side polishing bracket 12 can be flipped downwards from a horizontal position to a vertical position. In a preferred embodiment, a third vertical drive mechanism 15 is installed on the side polishing bracket 12. The third vertical drive mechanism 15 is a cylinder, and the cylinder is also in a vertical position when the side polishing bracket 12 is in a vertical position. A transverse drive mechanism 16 is fixedly installed at the telescopic end of the cylinder. The transverse drive mechanism 16 is a transverse electric slide, used to drive the side polishing head 13 to move laterally. The transverse electric slide can be a slide with a pressure sensor, so that the moving distance of the transverse electric slide can be adjusted according to the signal of the pressure sensor to facilitate control of the pressure during side polishing. When the side polishing bracket 12 is flipped to a vertical position, the side polishing head 13 is located on the side of the material 27 for side polishing.

[0029] In a preferred embodiment, a three-jaw chuck 17 is also mounted on the mounting bracket 7. The three-jaw chuck 17 is fixedly mounted on the bottom surface of the mounting bracket 7. The bottom plate of the three-jaw chuck 17 has a through hole 17b in the center, which communicates with the polishing through hole 8. That is, the polishing head with the center hole can extend into the center of the three-jaw chuck 17 when it moves downward. The jaws 17a of the three-jaw chuck 17 act as radial adjustment blocks, fixing soft protective blocks 18 at the front end. By adjusting the position of the jaws 17a of the three-jaw chuck 17, the area enclosed by each protective block 18 can be expanded or reduced to use materials 27 of different sizes.

[0030] Please combine Figure 5 As shown, a polishing slurry supply mechanism is installed on one side of the substrate 1. Specifically, a sheet metal platform 19 is set on one side of the substrate 1, and the polishing slurry supply mechanism is installed on the top of the sheet metal platform 19. The polishing slurry supply mechanism includes a rotary drive mechanism, a storage tank 21, and a supply pipe 22. The rotary drive mechanism is an electric roller 20, and two support rollers 23 are also provided on the side of the electric roller 20. The rotation axes of the electric roller 20 and the support rollers 23 are all horizontally arranged. The storage tank 21 is supported by the electric roller 20 and the support rollers 23, that is, the support rollers 23 and the electric roller 20 are located on both sides below the storage tank 21, so the storage tank 21 is installed in a horizontal position. One end of the storage tank 21 is connected to a peristaltic pump 25 via a rotary joint 24. The outlet of the peristaltic pump 25 is connected to a supply tank 26, which is inclinedly mounted on a sheet metal platform 19. The lower outlet end of the supply tank 26 is connected to a retractable and flexible supply pipe 22, with the outlet end of the supply pipe 22 facing the center of the grinding disc 3, located in the grinding and polishing operation area. The storage tank 21 stores the grinding and polishing liquid. An electric roller 20 drives the storage tank 21 to rotate, preventing the grinding and polishing liquid from settling. The peristaltic pump 25 draws out the supply, ensuring stable and slightly adjustable delivery of the grinding and polishing liquid to meet the needs of the grinding and polishing operation.

[0031] During the polishing operation, the material 27 is fixed on the grinding disc 3 and driven to rotate. The side polishing bracket 12 is flipped to a horizontal position, and the three-jaw chuck 17 is adjusted to position the jaws 17a so that the area enclosed by the protective block 18 is slightly larger than the material 27. Then, the side polishing bracket 12 is flipped to a vertical position, and the mounting bracket 7 is driven to a suitable position (the protective block 18 is located on the side of the material 27) by the first vertical drive mechanism 6. Then, the center hole polishing head is driven by the second vertical drive mechanism 10 to enter the inner hole of the material 27. The third vertical drive mechanism 15 adjusts the height of the side polishing head 13, and the side polishing head 13 is driven by the transverse drive mechanism 16 to feed radially along the material 27, thereby simultaneously performing thinning and polishing operations on the outer circle and inner hole of the material 27.

Claims

1. A specialized device for grinding, polishing, thinning, and polishing infrared materials, characterized in that, The system includes a substrate, a grinding disc, a first vertical drive mechanism, a mounting bracket, a center hole polishing motor fixing block, and a side polishing bracket. The grinding disc is rotatably mounted on the substrate and is driven to rotate by a motor. The mounting bracket is positioned above the grinding disc and is driven to move up and down by the first vertical drive mechanism. A polishing through hole is provided in the center of the mounting bracket. The center hole polishing motor fixing block is connected to the mounting bracket and located above the polishing through hole. The center hole polishing motor is fixedly mounted on the mounting bracket. A center hole polishing motor fixing block is provided. The output end of the center hole polishing motor is equipped with a center hole polishing head and is set vertically downward. The bottom surface of the mounting bracket is provided with a three-jaw chuck around the polishing through hole. The center of the bottom plate of the three-jaw chuck is connected to the polishing through hole. The front end of the jaws of the three-jaw chuck is fixed with a protective block. The side polishing bracket is rotatably connected to the mounting bracket. The head end of the side polishing bracket is provided with a side polishing head. When the side polishing bracket is rotated to a vertical state, the side polishing head is located on the side of the material for side polishing.

2. The specialized equipment for infrared material grinding, polishing, thinning, and polishing according to claim 1, characterized in that, The mounting bracket is equipped with a second vertical drive mechanism, and the center hole grinding and polishing motor fixing block is driven to move up and down by the second vertical drive mechanism.

3. The specialized equipment for infrared material grinding, polishing, thinning, and polishing according to claim 1, characterized in that, The side polishing support includes a third vertical drive mechanism, which drives the side polishing head to move up and down. The head end of the side polishing support is provided with a horizontal drive mechanism, which drives the side polishing head to move laterally.

4. A special equipment for grinding, polishing, thinning, and polishing infrared materials according to claim 1, characterized in that, A polishing liquid tank is provided on the substrate surrounding the grinding disc. A polishing liquid supply mechanism is provided on the substrate, which includes a storage tank and a supply pipe. The supply pipe is connected to the storage tank via a pump. The outlet end of the supply pipe is positioned towards the center of the grinding disc. The storage tank is rotatably placed on the substrate. The substrate is provided with a rotation drive mechanism for driving the storage tank to rotate. The substrate is provided with support rollers. The rotation drive mechanism is an electric roller. The support rollers and the electric roller are located on opposite sides below the storage tank, and the support rollers and the electric roller together support the storage tank.

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